CN1169235A - Printed circuit board and heat sink arrangement - Google Patents
Printed circuit board and heat sink arrangement Download PDFInfo
- Publication number
- CN1169235A CN1169235A CN96191600A CN96191600A CN1169235A CN 1169235 A CN1169235 A CN 1169235A CN 96191600 A CN96191600 A CN 96191600A CN 96191600 A CN96191600 A CN 96191600A CN 1169235 A CN1169235 A CN 1169235A
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- Prior art keywords
- circuit board
- printed circuit
- heat sink
- heat
- pcb
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4068—Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/0949—Pad close to a hole, not surrounding the hole
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0969—Apertured conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Making a heat sink and printed circuit board assembly by providing a heat exchange element on the heat sink which lies in heat exchange contact with the heat sink and passes therethrough. After locating the board and heat sink in relative positions apart and with the heat exchange element aligned with an electronic component on the board, a settable thermally conductive compound is injected through a hole in the heat exchange element to bond it to the electrical component. The heat sink is detachable from the heat exchange element to expose the side of the board carrying the components so that maintenance or repair may be performed. Subsequently the heat sink is returned into its position in the assembly.
Description
The present invention relates to printed circuit board (PCB) and heat sink device.
In the printed circuit board arrangement of electronic component was housed, used element can generate heat, for preventing the overheated heat radiation that needs, because overheated meeting causes one or more component wear.Generally dispel the heat with heat sink.In order to carry out effective heat exchange, often think and directly tightly to be fixed on the printed circuit board (PCB) heat sink.But this can produce a problem: in order to check, to improve or safeguarding, may need to take apart printed circuit board (PCB) and heat sink assembly, circuit board and heat sink separately and the one or more parts in the assembly do not damage thereupon and are practically impossible.
In the structure of other proposals, heat sink being contained on the printed circuit board (PCB) one side identical with the electronic component place, like this these elements circuit board and heat sink between.By heat transfer medium compound, heat from electronic component be delivered to heat sink on.Here have the problem of disassembling parts once more, and this needs all owing to a variety of causes.In addition, put in place if compound added before component-assembled, this may not can form satisfied hot link to improve thermal conductivity between adjacently situated surfaces.A kind of assemble method in back also is that effort is time-consuming.The example of this structure is found in U.S. Patent number 4,849, and 856 and 4,914,551.
Be filed in the U. S. application sequence number 08/133 on October 9th, 1993 in name with R.Katchmar, a kind of structure has been described in 396, wherein heat is diffused on the whole printed circuit board (PCB) from the electronic component that is contained in circuit board, and then by extend to the cross-over connection parts heat radiation on heat sink from circuit board.In this device, electronic component is bonded on the printed circuit board (PCB) by the heat conduction compound, make the heat conduction compound flow to element and heat sink between the gap in, thermal compound solidifies and to put in place then.
The present invention attempts to provide a kind of method that forms printed circuit board (PCB) and heat sink assembly, can make the problems referred to above be reduced to minimum degree.
The invention provides a kind of method of making the assembly of printed circuit board (PCB) and heat sink structure, comprising: form the structure include printed circuit board (PCB) and to be installed in the electronic component on first of this printed circuit board (PCB); Form heat sink structure, have the hole of passing heat sink structure on it; Lay printed circuit board arrangement and heat sink structure relatively, make first of heat sink structure with printed circuit board arrangement mutually in the face of and separate with it, and the axis in hole is roughly extended towards the direction of electronic component; The heat conduction approach of generation from the heat sink structure to the printed circuit board arrangement, its method is to make flowable Heat Conduction Material or compound flow through the hole, filling up in the gap area that is retained between heat sink structure and the printed circuit board arrangement, and contact with its maintenance thermal conductivity and and electronic component aim at.
The method of the application of the invention, before the heat conduction compound was cast to the position, printed circuit board (PCB) and heat sink structure were assembled into together by its relative position.Because Heat Conduction Material or compound are just to flow in the middle of them after two kinds of structural group are fitted together, so fluent material tightly contacts the surface of two kinds of structures, heat conducts betwixt, thereby makes the heat conduction efficiency of assembly reach maximum.In addition, it is also very convenient to make assembly in order to the top legal system, because Heat Conduction Material is not to place on a kind of structure before another kind of structure fix in position, can avoid any slow and blowzy number of assembling steps like this.On the other hand, because flowable materials is caught to flow through the hole in the heat sink structure,, that is, coupler is placed in the hole with injection material between two kinds of structures so this method is particularly suitable for using injection device.Therefore, making Heat Conduction Material be fixed to the processing step of tram can be simple and easy, rapid, effectively, finish cleanly.The assembly of formed printed circuit board (PCB) and heat sink structure is known to be made from being contained in the heat radiation optimization of the element on the printed circuit board (PCB), be particularly suitable for like this dispelling the heat from printed circuit board arrangement, if the heat that is produced in these structures does not conduct away with suitable efficient, just may cause electronic component to break down and lost efficacy.
In the method according to the invention, heat sink structure can also can face toward its second facing to first of printed circuit board (PCB) after processing step.If heat sink structure facing to first of printed circuit board (PCB), just makes Heat Conduction Material flow through the hole to fill the gap area between heat sink structure and the electronic component itself.Like this Heat Conduction Material with directly contact with heat conduction apart from the nearest electronic component of heat sink structure.Otherwise, just fill up gap area between heat sink structure and the printed circuit board (PCB) itself if heat sink structure, flows through the Heat Conduction Material in hole so facing to second of printed circuit board (PCB).Reach at utmost in order to make from the heat conduction of electronic component, the Heat Conduction Material from gap area passes circuit board must have some heat conduction approach to electronic component.This can following easily generation: Heat Conduction Material is flow on the electronic component through at least one aperture the printed circuit board (PCB) from gap area, and preferably contact with heat conduction with electronic component.In implementation method, first Heat Conduction Material flowed between first of printed circuit board (PCB) and the electronic component, second Heat Conduction Material flowed between second of printed circuit board (PCB) and the heat sink structure.This can followingly easily carry out: the hole that injection device is passed in the heat sink structure is inserted in the aperture of printed circuit board (PCB), between first of circuit board and element, inject first material, injection device is withdrawed from from aperture make in its hole of only inserting heat sink structure, thereby second material flowed between second of circuit board and the heat sink structure.In another approach, first material flowed between first of circuit board and the electronic component, after structural group is fitted together, make second material flow through the hole then and fill up gap between circuit board and the heat sink structure.
Method of the present invention can help being used for making heat sink itself taking off from printed circuit board arrangement, thereby can make circuit board or electronic component be got at immediately and keep in repair, replace or detect.This can comprise that a heat-exchanging part heat sink and that be contained in heat conduction on heat sink realizes by heat sink structure.Heat-exchanging part is separately also relative with it with printed circuit board arrangement, simultaneously in the face of electronic component.The Heat Conduction Material of curable (settable) is distributed between printed circuit board arrangement and the heat-exchanging part and with its maintenance thermal conductivity and contacts.In this method for optimizing, Heat Conduction Material has adhesiveness, can between printed circuit board arrangement and heat-exchanging part, provide adhesive force, and heat sink relieving attachment is housed can makes and heat sinkly take off from heat-exchanging part, and the adhesiveness of heat-exchanging part by Heat Conduction Material still is retained in and is contained on the printed circuit board arrangement.Heat sink relieving attachment can comprise the heat exchange bearing in the screw device easily.This screw device comprises screw thread and the nut on the heat-exchanging part, and it can be screwed into the end of heat sink one side away from printed circuit board (PCB).So taking off nut can make and heat sinkly pull down from printed circuit board (PCB) with by the assembly of Heat Conduction Material dress heat-exchanging part thereon.Therefore as above relevant as described in electronic component can be got at immediately.On the other hand, when not using nut, screw device can make heat-exchanging part rotate in heat sink.In this function, heat-exchanging part has easy split plot, and perhaps Heat Conduction Material itself is frangible.Therefore because the part of heat exchange elements is rotated in the aperture, and the easy split plot of heat-exchanging part or frangible Heat Conduction Material break, heat sinkly pull down from printed circuit board (PCB) so make.
The present invention is particularly useful in this case, promptly have many electronic components be distributed in printed circuit board (PCB) and heat sink between, this also is normal conditions.Because printed circuit board (PCB) is not absolute smooth, add that electronic component has different shapes and height, this can produce a problem usually.Promptly be difficult to make each element with Heat Conduction Material with heat-conducting mode directly link heat sink on, and make stress minimum on printed circuit board (PCB), electronic component or the element end pin simultaneously.This problem becomes more serious in by the temperature fluctuation process of using facility environment to cause.This method electronic component place circuit board and heat sink between, it is minimum that these problems are dropped to, gap between the wherein heat sink and electronic component can be different with element, at this moment the Heat Conduction Material that injects by a plurality of holes that link to each other with each element can be packed into each gap area, and forms necessarily from this element to heat sink heat conduction along separate routes.
In addition, when element is contained in first of circuit board and when heat sink, the heat conduction compound virtually completely flows through circuit board and contacts with electronic component, this device makes the thermal stress minimum on the circuit board, also make by the end pin of electronic component to the amount of stress minimum that the solder joint of circuit board produces, heat sink low thermal resistance approach is provided simultaneously.Use this device, also make owing to circuit board distortion or spacing change to cause the sensitiveness of structural failure to drop to minimum.Especially, making electronic component be contained in circuit board is particularly useful for making its end pin be connected to the heat radiation of the electronic component of printed circuit board (PCB) with the soldered ball array away from the device heat sink there.
According to a further aspect in the invention, provide the assembly of a kind of printed circuit board (PCB) and heat sink structure, having comprised: printed circuit board (PCB) and be contained in a kind of structure of the electronic component on first of the printed circuit board (PCB); Have wear and the heat sink structure in the hole crossed; These two kinds of structural plane opposites are laid and separately, the hole are roughly extended towards the direction of electronic component; And a kind of Heat Conduction Material, this material flows through the hole and is distributed between two kinds of structures, fills up horizontal perforation and the gap area that extends, and contacts with heat conduction with two kinds of structures, and and electronic component aim at.
To describe embodiment of the present invention with reference to accompanying drawing with example now, in the accompanying drawings:
Fig. 1,2 and 3 is sectional views, has shown according to first embodiment, three different stages in the establishment of component of printed circuit board (PCB) and heat sink structure;
Fig. 4 is the similar view of assembly with Fig. 1 to 3 first embodiment.Shown and taken off heat sink so that printed circuit board (PCB) and electronic component can be got at from assembly;
Fig. 5 be similar with Fig. 3 according to second embodiment printed circuit board (PCB) and the view of the assembly of heat exchange structure;
Fig. 6 is the view similar with Fig. 5, has shown two assemblies according to second embodiment, has the complete assemblies of housing thereby these two assemblies are fitted together formation;
Fig. 7 is the view similar with Fig. 6, has shown that the structure of Fig. 6 has heat sink being removed;
Fig. 8 and 9 is similar with 4 with Fig. 3, the view that first embodiment is changed;
Figure 10 is similar with Fig. 4, and first embodiment is had the another kind of view that changes;
Figure 11 and 12 has shown according to the 3rd embodiment two different phases in the establishment of component of printed circuit board (PCB) and heat sink structure;
Figure 13 has shown the assembly of completed the 3rd embodiment;
Figure 14 relates to the another kind of method shown in Figure 11 and 12, has shown the first step of two different phases in the establishment of component of the 3rd embodiment;
Figure 15 is similar with Figure 13, the view of the 4th embodiment;
Figure 16 is the sectional view according to the assembly of the 5th embodiment;
Figure 17 is according to the part of the assembly of the 5th embodiment, the sectional view of vast scale more;
Figure 18 is the sectional view of the components that sections along the line XVIII-XVIII among Figure 17;
Figure 19 is similar with Figure 18, to the vicissitudinous view of the 5th embodiment; And
Figure 20 is the sectional view that cut the 6th embodiment.
As shown in Figure 1, in the first embodiment, heat sink structure comprises and contains the heat sink 10 of straight planar section 12, on one side planar section 12 has the fin 14 that becomes one with it at it.Heat sink structure also comprises many heat-exchanging parts 16 (only demonstrating), and each heat-exchanging part comprises wide 18 that becomes one with narrow portion, and narrow portion is shaped as cylindrical rods 20, on outside dead end screw thread is arranged.Each parts 16 pass in heat sink each emptying aperture 22 and with jockey fix and be assembled into heat sink on, this jockey form is for there being fin nut 24 over there at planar section 12, nut 24 is screwed in the screw thread of bar 20 along screw thread.Wide like this portion is fixed and has closely with heat sink that heat conduction contacts.If desired, can wide 18 and heat sink between be coated with the oil film of one deck heat conduction, generally just enough by the dry method contact.
Also has printed circuit board (PCB) (Fig. 2) in the first embodiment.Printed circuit board (PCB) is equipped with many electronic components 28 on one side at it, is connected on the circuit of circuit board by end pin 30.
Plan will the printed circuit board arrangement that comprises element 28 be assembled into heat sink on, make heat directly from element 28 through heat-exchanging parts pass to heat sink.For this reason, circuit board and heat sinkly lay by its relative position as shown in Figure 2, wherein heat sink 6 are fixed as apart from printed circuit board (PCB) by keeper 32 the certain intervals distance are arranged.And with it face-to-face relatively, keeper 32 is fixed on the printed circuit board (PCB) by set bolt 34.Heat-exchanging part 16 be pre-installed in heat sink on, in the time of like this on being assembled into printed circuit board (PCB), each parts 16 be fixed as its wide 18 with corresponding each electronic component 28 separately and directly relative.This is clearly shown that in Fig. 2.
For finishing assembling, can have the gap area of adhering and curable heat conduction distribution of viscous material between each electronic component 28 and corresponding with it heat-exchanging part 16 wide 18.This material can be to have low elastic modulus, preferably is lower than the heat conduction elasticity viscous material of 500psi.For heat-conducting medium being put into each gap, the hole 36 from parts one end break-through to the other end is arranged on the parts 16, promptly along bar 20 axially and pass wide 18, as shown in Figure 2.When as shown in Figure 2 stage of being assembled in of heat sink and printed circuit board (PCB), Heat Conduction Material injects from heat sink outside by each hole, to fill up and to charge into the gap area between wide and the electronic component 28, shown among Fig. 3 38, the surface on both sides, gap is closely connected, to form from element 28 to parts the available heat exchange media 16.By arriving gap area at printed circuit board (PCB) and heat sink structure assembling back injection material 38, Heat Conduction Material can be effectively after the curing be fixed on wide 18 of parts 16 on the electronic component 28 so, as shown in Figure 3, material little by little flows through facing surfaces so that these surfaces closely connect, thereby guarantees best to heat sink thermal conductivity from each element.Also have, this injection process is cleaning, effective and timesaving.
In the use of the completed assembly 40 of Fig. 3, any heat that electronic component produces directly passes to by heat-conductive bonding agent 38 with the highest efficient among wide 18 of parts 16, and contacts with the thermal conductivity of heat sink inner surface by wide and to pass in heat sink 10.When needing the contact print circuit board that the one side of electronic component is housed, following thing is just simple, by taking off nut 24 heat sink and printed circuit board arrangement is unclamped, heat sinkly take away, expose circuit on element 28 and the circuit board thus to be used for required purpose from circuit board thereby can make.These concrete steps can find out that therefrom the Heat Conduction Material 38 of each parts 16 by therebetween still remains fixed on each self-corresponding electronic component 28 as shown in Figure 4.Therefore, if this structure is made of two components at first basically, one of them component is formed by being fixed with the heat sink of heat-exchanging part 16, after complete assembly 40 forms, heat sinkly just need pull down heat exchanger assembly by taking off from each parts 16 so.After printed circuit board (PCB) or any electronic component were taked adequate measures, following thing was just simple.Load onto once more heat sink to finish assembling, can make emptying aperture 22 simply and corresponding bar 20 aim at, make the heat sink assembling position that is moved back into it, as shown in Figure 3, load onto hold-doun nut 24 then.
From above embodiment as can be seen, in printed circuit board (PCB) and heat sink assembly form, the Heat Conduction Material of flow regime by injection process can be easily, rapidly, add cleanly.Also have, pull down heat sink, can finish rapidly and any part of assembly is not produced any damage so that printed circuit board (PCB) or electronic component can get at also is extremely simple thing.Then replacing printed circuit board (PCB) also is very simple thing to change assembly.In addition, although between each electronic component 28 and heat sink 40, formed heat conduction completely contact by Heat Conduction Material 38, and electronic component and heat sink between spacing exist differently, in assembly, still only produced minimum stress.For example, the stress that between heat sink and printed circuit board (PCB), produce by the temperature expansion difference.As can be seen, the spacing between parts 16 and the element 28 can have very wide variation, but this variation is inessential, because the gap area that forms between parts 16 and respective element 28 can be inserted material 38 easily, can guarantee the thermal conductivity contact simultaneously.Minimum stress is created in the assembly, also produces between heat sink and printed circuit board (PCB) thus, and this may produce some problems after assembly forms.
A kind of heat sink by adopting, it contains temperature expansion coefficient and printed circuit board (PCB) suitably mates, preferably ± 3 * 10
-6/ ℃ among material, can make lateral stress (can cause) drop to minimum by variations in temperature.For example, copper alloy, the perhaps synthetic of aluminium and silicon or alloy, these are all inexpensive, but functional.
In ensuing other embodiments with in changing, identical reference number is arranged with similar those parts in first embodiment.
As shown in Figure 5, in second embodiment, printed circuit board (PCB) 26 and many electronic components 28 form printed circuit board arrangement together, as described in first embodiment.Heat sink 52 have the planar section similar with first embodiment 54, also have the parallel separation fin 56 that becomes one that extends from planar section 54 on one side.In addition, this is heat sink also be equipped with first embodiment in identical parts 16, these parts are positioned, with in complete assemblies 50, make wide 18 of parts with electronic component 28 separately and relative.Heat Conduction Material 38 is used in the method described in first embodiment and is distributed between electronic component and the parts 16.The assembly difference of the assembly 50 and first embodiment is that heat sink 52 have sidewall 58, one side this sidewall 58 is at four edge stretching out from part plane, 54 place of planar section 54.These sidewalls have outside cooperation plane 60, but the fringe region of this plane fit printed circuit board 26, and so that before material 38 is injected between element 28 and the parts 16, fixed printed circuit board makes it apart from heat sink planar section 54 a fixing distance is arranged.
As shown in Figure 6, when with the assembly 50 that forms in a similar manner in conjunction with the time, assembly 50 is particularly useful, at this moment two module positions are combined on the contrary, sidewall 50 is linked another assembly from an assembly like this, makes printed circuit board arrangement be included in interior housing thereby form.As shown in Figure 6, being furnished with device on two sidewalls 58 fits together sidewall, this device form in this example is the ring flange 62 that outwards protrudes, and this ring flange abuts against together in order to assemble, can be by anchor clamps (not shown) or helicitic texture fix in position to push down elongated sealing gasket 64.As can be seen from Figure 6, when each assembly 50 had the printed circuit board (PCB) top loading, the printed circuit board (PCB) in completed assembly was separated from each other, and electronic component 28 is fixed on the parts 16 by Heat Conduction Material 38.
As shown in Figure 7, take off if desired that any one is heat sink 52, relevant nut 24 takes off from parts 16, heat sinkly so just can remove.In this case, as shown in Figure 7, the corresponding printed circuit board (PCB) 12 that electronic component 28 is housed on it just exposes to be used for any required purpose.In this concrete example, printed circuit board (PCB) continues to be retained in the position of its " in the use ", is fixed on the there by any electric conductor to its extension.In order to load onto be removed heat sink, emptying aperture 22 and bar 20 are aimed at, and the walking circuit plate is to bar, and makes it to install on the circuit board 12.The nut 24 of screwing on is then finished assembling, then makes two heat sink 52 and aims at again, they are re-assemblied and forms housing.
Not by the described method of above embodiment heat sink and printed circuit board (PCB) to be separated.For example, in first of first embodiment shown in Fig. 8 and 9 changed, heat-exchanging part 70 was similar with above-mentioned heat-exchanging part 16, except having the thin neck 76 of narrow portion so that its easy fracture narrow 72 of parts and wide 74 joint.Fig. 8 has shown that the difference of the complete assemblies of this variation and above embodiment is narrow 72 along being threaded in heat sink planar section 12 among the threaded hole 78.In order to make heat sink 10 to take off, screwdriver is inserted in the stern notch on narrow 72 of the heat-exchanging part, in screwed hole, rotate narrow portion.One has and rotates thin neck 76 and rupture immediately, and wide 74 of parts still is retained in original position by adhesive 38, separates so make narrow 72, as shown in Figure 9, and can take off heat sink.Significantly, pull down the assembly of printed circuit board (PCB), when playbacking once more, must have wide of electronic component 28 and heat-exchanging part to re-assembly, and heat-exchanging part 70 and heat sink 10 is resetted together with such device.
In the another kind of first embodiment changes, as shown in figure 10, it itself can be frangible solidifying Heat Conduction Material 38, in the time of like this in the stern notch 80 of screwdriver insertion heat-exchanging part 70, thermal compound 38 fractures can make heat sink and whole heat-exchanging part be removed together.
As indicated in the embodiment that will illustrate now, one or more electronic components are contained in printed circuit board (PCB) away from the situation on the heat sink one side, also among scope of the present invention.
For example, as Figure 11, in the 3rd embodiment shown in 12 and 13, heat sink 10 have with the described method dress of first embodiment one or more heat-exchanging parts thereon.In the 3rd embodiment, have only such parts to illustrate.But the position of printed circuit board arrangement conversely, electronic component 28 and heat sinkly be printed circuit board 26 separately like this.
Figure 11 demonstrates heat sink structure situation of separating with printed circuit board (PCB) in the phase I of using curable Heat Conduction Material 38.As can be seen from Figure 11, have many apertures 82 pass printed circuit board (PCB) to each electronic component 28 below.Substantially be positioned at the aperture 84 at center and pass hole 36 rough alignment that each has connection heat-exchanging part 16.Heat Conduction Material 38 is divided into two 38a and 38b adds (seeing Figure 12).In all cases, first 38a is added into by injection device being inserted through hole 36, and this injection device form is for injecting ozzle 86, and ozzle answers long enough to extend in the corresponding aperture 84, as shown in figure 11.Globs of material 38a is injected in the gap area between printed circuit board (PCB) 26 and the electronic component 28 then.This material moves below element 28 gradually, and tight Connection Element surface and printed circuit board surface.As shown in figure 12, ozzle 86 returns to the position that its port of export is arranged in hole 36 then.Second 38b of Heat Conduction Material 38 then is injected into the gap area between printed circuit board (PCB) and heat-exchanging part 6 wide 18, thereby closely connects the reverse side of printed circuit board (PCB) and wide 18 end face.In this course, aperture 84 should fill up material 38 basically.In addition, Figure 13 has shown the completed structure of assembly, and wherein shown in the right of aperture 84, aperture 82 should be inserted compound 38 at least in part from the both sides of circuit board, preferably, compound should pass each aperture 82 continuously so that two material 38a and 38b interconnect.On the other hand, shown in Figure 13 left side, aperture 82 can be inserted scolder 88 or some other Heat Conduction Materials in advance, such as copper, to help that heat is passed to a 38b from a 38a, then by heat-exchanging part 6 pass to heat sink in.
In the another kind of method that forms Figure 13 structure, as shown in figure 14, before printed circuit board arrangement installed on the heat sink structure, each globs of material 38a was fixed between electronic component relevant with it 28 and the printed circuit board (PCB) 26.In this method, inject ozzle 86 through aperture 84, globs of material 38 is injected in the gap area under the element 28.After the 38a of all material group put in place, the printed circuit board arrangement that has globs of material 38a had just been finished, and refills on the printed circuit board arrangement.Globs of material 38b uses the said method with reference to Figure 12 to be formed between printed circuit board (PCB) and heat sink 12 then.Structure after finishing once more as shown in figure 13.
In the 4th embodiment as shown in figure 15, bigger basically aperture 90 is arranged below each element 28 on being contained in printed circuit board (PCB) 26.This aperture can be elongated shape or other shape, so that it extends under the profile of relevant elements 28 basically.After heat sink structure and printed circuit board arrangement fit together, ozzle 86 is inserted in each hole 36, by an implant operation, complete Heat Conduction Material 38 is injected into the gap area between the reverse side of the end face that extends in wide 18 of heat-exchanging part and relevant electronic component 28.Globs of material 38 is passed aperture 90 and wide 18 the direct thermal conductivity contact of formation from the element to the heat-exchanging part.
In above all embodiments, wherein electronic component is positioned at printed circuit board (PCB) away from heat sink one side, finds printed circuit board (PCB) in fact subsequently because variations in temperature or local heat effect and crooked possibility has dropped to minimum.In addition, on the element solder joint of printed circuit board lead end, receive minimum stress.
When electronic component was contained in printed circuit board (PCB) with heat sink opposite one side, this special device can advantageously be applied to heat is shed from electronic component, and for example to the electronic component of planar structure, its end pin is connected on the printed circuit board (PCB) by the net array.For example, the 5th embodiment as shown in figure 16, plane electronics element 92 is installed in printed circuit board (PCB) 26 away from heat sink 10 the one side, and keeper 32 is as fix in position as described in the above embodiment.To each element 92, heat-exchanging part is adopted once more, makes its wide 18 in the face of corresponding electronic component 92, and makes printed circuit board (PCB) 26 therebetween.As shown in figure 16, Heat Conduction Material 38 fills up the gap area between the wide portion of circuit board and each heat-exchanging part, and enters into the aperture 94 of printed circuit board (PCB).Shown in Figure 17 and 18, aperture 94 is the path form, and has conductive traces 96 in the outer end of circuit board.Track 96 is connected to by the soldered ball 98 that adds with known method on the end pin of electronic component and connects to form the end pin.Electric conducting material internal layer 100 is arranged in the aperture 94, and copper for example is to be connected to each end pin of electronic component on the circuit in the circuit board.Viscosity Heat Conduction Material 38 is extended in each aperture 94, thereby directly contacts with heat conduction with internal layer 100, so that from electronic element radiating.Heat Conduction Material also can make it to flow in 92,96 gaps that limit.
In variation as shown in figure 19, other aperture 102 passes printed circuit board (PCB) between track 96, and these apertures 102 itself are filled Heat Conduction Material 38, and Heat Conduction Material also is extended into and fills up the gap between each electronic component 92 and the printed circuit board (PCB).
The 6th embodiment as shown in figure 20 demonstrates the heat-exchanging part that is contained on heat sink, no matter be in the indicated order or opposite, to be formed into the hot link of printed circuit board (PCB), this is all optional to the present invention, although these parts can be preferred, so that dismantle completed assembly easily.
The 6th embodiment provides previous embodiments all best thermal conduction characteristics, wherein heat sink structure comprise form porose 112 heat sink 110, hole 112 and the electronic component 28 that is contained on the printed circuit board (PCB) 26 are aimed at.Heat Conduction Material 38 passes hole 112 and injects filling up the gap area between each element 28 and the relative heat sink surface, so as heat from element directly pass to heat sink on.
Claims (25)
1. method of making the assembly of printed circuit board (PCB) and heat sink structure comprises:
Form a kind of structure, include printed circuit board (PCB) and be contained in electronic component on first of this printed circuit board (PCB);
Form a kind of heat sink structure, have on the heat sink structure wear and the hole crossed;
Lay printed circuit board arrangement and heat sink structure relatively, make first of heat sink structure with printed circuit board arrangement mutually in the face of and separate with it, and the axis in hole is roughly extended towards the direction of electronic component, and the heat conduction approach of generation from the heat sink structure to the printed circuit board arrangement, its method be make can flow, the Heat Conduction Material of curable (settable) flows through the hole to fill up and to be retained in the gap area between heat sink structure and the printed circuit board arrangement, and contact with its maintenance thermal conductivity, and and electronic component aim at.
2. according to the method for claim 1, comprising:
Lay printed circuit board arrangement and heat sink structure relatively, first of heat sink structure with printed circuit board (PCB) first faced mutually;
And make curable Heat Conduction Material flow through the hole inserting the gap between heat sink structure and the electronic component, and contact with heat conduction with electronic component.
3. according to the method for claim 1, comprising:
Lay printed circuit board arrangement and heat sink structure relatively, make first of heat sink structure with second of printed circuit board (PCB) mutually in the face of and from a distance;
And make Heat Conduction Material flow through the hole inserting the gap area between heat sink structure and the printed circuit board arrangement, and pass that at least one aperture flows to electronic component from gap area in the printed circuit board (PCB).
4. according to the method for claim 3, comprise making Heat Conduction Material flow through aperture in the printed circuit board (PCB), and keep thermal conductivity to contact with electronic component.
5. according to the method for claim 1, comprising:
Lay printed circuit board arrangement and heat sink structure relatively, make first of heat sink structure with second of printed circuit board (PCB) mutually in the face of and separate with it;
First Heat Conduction Material flow between first of printed circuit board (PCB) and the electronic component, and keep thermal conductivity to contact with electronic component;
And make second Heat Conduction Material through orifice flow between second of printed circuit board (PCB) and the heat sink structure, and and heat sink structure keep thermal conductivity to contact, and contact with first material maintenance thermal conductivity.
6. according to the method for claim 5, comprise through the hole in the heat sink structure injection device is inserted in the aperture on the printed circuit board (PCB), and between first of printed circuit board (PCB) and electronic component, inject first Heat Conduction Material;
And then make second material flow through the hole to fill up the gap area between heat sink structure and printed circuit board (PCB) second.
7. according to the method for claim 1, comprising:
When printed circuit board arrangement and heat sink structure separate, first Heat Conduction Material flow between first of printed circuit board (PCB) and the electronic component, and keep thermal conductivity to contact with electronic component;
And then printed circuit board (PCB) and heat sink structure are assembled into together, then make second Heat Conduction Material through orifice flow between second of printed circuit board (PCB) and the heat sink structure, and keep thermal conductivity contact, and contact with first material maintenance thermal conductivity with heat sink structure.
8. according to the method for claim 1, comprising:
Formation is contained in the many electronic components on first of printed circuit board (PCB);
Formation have many wear and the heat sink structure in the hole crossed;
Lay board structure of circuit and heat sink structure relatively, make above-mentioned hole roughly vertically towards a relevant electronic component;
And make Heat Conduction Material flow through hole in the heat sink structure, filling up the gap area between heat sink structure and the printed circuit board arrangement, and and electronic component aim at.
9. according to the method for claim 1, wherein heat sink structure comprise one heat sink and be contained in heat-exchanging part on heat sink with heat conduction, heat-exchanging part is separately also relative with it with printed circuit board arrangement, and in the face of direction towards electronic component, this method comprises makes curable Heat Conduction Material flow to gap area between printed circuit board arrangement and the heat-exchanging part, and keep thermal conductivity to contact with heat-exchanging part, Heat Conduction Material has adhesiveness, can between printed circuit board arrangement and heat-exchanging part, produce adhesion, provide heat sink relieving attachment to make heat sink can taking off, and heat-exchanging part is bonded on the printed circuit board arrangement by Heat Conduction Material from heat-exchanging part.
10. according to the method for claim 7, wherein on heat sink structure, be formed with sidewall, this method comprises that the fringe region that makes printed circuit board (PCB) abuts against on the mating surface of sidewall, making Heat Conduction Material determine the position of printed circuit board arrangement before flowing through the hole, and determine the distance between two kinds of structures with respect to heat sink structure.
11. the assembly of printed circuit board (PCB) and heat sink structure comprises:
Printed circuit board (PCB) and be contained in a kind of structure of the electronic component on first of the printed circuit board (PCB);
Have wear and a kind of heat sink structure in the hole crossed;
These two kinds of structural plane opposites are laid and separately, the hole are roughly extended towards the direction of electronic component;
And Heat Conduction Material, this Heat Conduction Material flows through the hole and is distributed between two kinds of structures, fills up the gap area that passes the hole and extend, and contacts with heat conduction with two kinds of structures, goes back and the electronic component aligning.
12. according to the assembly of claim 11, wherein heat sink structure is facing to first of printed circuit board (PCB), Heat Conduction Material is distributed between electronic component and the heat sink structure, and contacts with its maintenance thermal conductivity.
13. according to the assembly of claim 11, wherein heat sink structure is facing to second of printed circuit board (PCB), Heat Conduction Material extends through the aperture in the printed circuit board (PCB), keeps thermal conductivity to contact with electronic component.
14. assembly according to claim 11, wherein heat sink structure is facing to second of printed circuit board (PCB), Heat Conduction Material extends between second of printed circuit board (PCB) and heat sink structure, and contact with its maintenance thermal conductivity, also between electronic component and printed circuit board (PCB) first, extend, and contact with its maintenance thermal conductivity, circuit board on one side heat exchange material and at the heat exchange material of circuit board another side the heat conduction relation is arranged.
15. according to the assembly of claim 14, wherein Heat Conduction Material interconnects through at least one aperture extension on the printed circuit board (PCB) and the Heat Conduction Material on circuit board both sides.
16. according to the assembly of claim 14, wherein another kind of Heat Conduction Material is arranged at least one aperture on the printed circuit board (PCB), and contacts with heat conduction with the Heat Conduction Material on circuit board both sides.
17. assembly according to claim 11, wherein heat sink structure is facing to second of printed circuit board (PCB), the end pin of electronic component is connected on the lead end of printed circuit board (PCB) by soldered ball net array, Heat Conduction Material extends between heat sink structure and printed circuit board (PCB) second, and contact with its maintenance thermal conductivity, and Heat Conduction Material extends in the aperture on the printed circuit board (PCB) into, and and soldered ball net array the heat conduction relation is arranged.
18. assembly according to claim 11, wherein heat sink structure comprise one heat sink and pass heat sink and in the face of the heat-exchanging part of electronic component, Heat Conduction Material has adhesiveness, be distributed between printed circuit board arrangement and the heat-exchanging part, and contact with its maintenance thermal conductivity, form porose on the heat-exchanging part, Heat Conduction Material flows through this hole, heat-exchanging part is bonded on the printed circuit board arrangement by Heat Conduction Material, and be contained in heat sink on, so that heat sink can pulling down from heat-exchanging part, and heat-exchanging part is still kept being contained on the printed circuit board arrangement by Heat Conduction Material simultaneously.
19. assembly according to claim 18, wherein heat-exchanging part comprises wide and narrow portion, wide and narrow portion are passed in the hole, heat-exchanging part be contained in heat sink on, it is heat sink that narrow portion is extended through, and wide portion in heat sink one side facing to printed circuit board arrangement, Heat Conduction Material is distributed between wide and the printed circuit board arrangement.
20. according to the assembly of claim 19, wherein be furnished with screw device heat-exchanging part be contained in heat sink on, and make heat sink can pulling down from structure.
21. according to the assembly of claim 20, wherein there is an end away from wide portion in the narrow portion of heat-exchanging part, and screw device is included in screw thread and a nut that can be screwed into the end on heat sink second on the end.
22. according to the assembly of claim 21, wherein heat-exchanging part has an easily broken district in narrow portion, heat-exchanging part can rotate in heat sink aperture, and narrow portion still stays in the aperture to cause the heat-exchanging part fracture, thereby can make heat sink pulling down.
23. assembly according to claim 18, wherein Heat Conduction Material is easily cracked, heat-exchanging part can rotate in heat sink aperture, with the bonding fracture between the wide portion that causes structure and heat-exchanging part, thereby heat sink and heat-exchanging part is pulled down together from structure.
24., wherein on heat sink, be formed with sidewall, mating surface is arranged, on the sidewall when the heat sink fringe region that is used for when being in place near printed circuit board (PCB) according to narrow portion according to the assembly of claim 19.
25. according to the assembly of claim 10, wherein heat sink formation surrounds the part of the housing of printed circuit board arrangement fully.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA2,141,091 | 1995-01-25 | ||
| CA2141091 | 1995-01-25 | ||
| US51627195A | 1995-08-17 | 1995-08-17 | |
| US08/516,271 | 1995-08-17 |
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| CN1169235A true CN1169235A (en) | 1997-12-31 |
| CN1114338C CN1114338C (en) | 2003-07-09 |
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| CN96191600A Expired - Fee Related CN1114338C (en) | 1995-01-25 | 1996-01-19 | Printed circuit board and heat sink arrangement |
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| Country | Link |
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| EP (1) | EP0807372A1 (en) |
| JP (1) | JP2908881B2 (en) |
| KR (1) | KR19980701642A (en) |
| CN (1) | CN1114338C (en) |
| AU (1) | AU697409B2 (en) |
| WO (1) | WO1996023397A1 (en) |
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| GB8601746D0 (en) * | 1986-01-24 | 1986-02-26 | British Telecomm | Heat sink |
| US4914551A (en) * | 1988-07-13 | 1990-04-03 | International Business Machines Corporation | Electronic package with heat spreader member |
| US4849856A (en) * | 1988-07-13 | 1989-07-18 | International Business Machines Corp. | Electronic package with improved heat sink |
| DE4106185A1 (en) * | 1991-02-27 | 1992-09-03 | Standard Elektrik Lorenz Ag | Electronic component or circuit cooler - has thermal container which is formed by thin-wall, enclosed, rubber-like sleeve |
| US5467251A (en) * | 1993-10-08 | 1995-11-14 | Northern Telecom Limited | Printed circuit boards and heat sink structures |
-
1996
- 1996-01-19 EP EP96900483A patent/EP0807372A1/en not_active Withdrawn
- 1996-01-19 JP JP8522512A patent/JP2908881B2/en not_active Expired - Fee Related
- 1996-01-19 AU AU44283/96A patent/AU697409B2/en not_active Ceased
- 1996-01-19 WO PCT/CA1996/000028 patent/WO1996023397A1/en not_active Application Discontinuation
- 1996-01-19 KR KR1019970705036A patent/KR19980701642A/en not_active Application Discontinuation
- 1996-01-19 CN CN96191600A patent/CN1114338C/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1960619B (en) * | 2005-11-04 | 2012-09-05 | 先进能源科技公司 | Heat management system and assembling method thereof |
| CN101505579B (en) * | 2008-02-05 | 2012-01-11 | 台达电子工业股份有限公司 | Heat radiation module and support member thereof |
| CN101965121A (en) * | 2010-10-09 | 2011-02-02 | 肖方一 | Method for preparing heat conduction structure of heating element, and heat conduction structure |
| CN103379776A (en) * | 2012-04-26 | 2013-10-30 | 罗伯特·博世有限公司 | Circuit positioning apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0807372A1 (en) | 1997-11-19 |
| WO1996023397A1 (en) | 1996-08-01 |
| AU697409B2 (en) | 1998-10-08 |
| JP2908881B2 (en) | 1999-06-21 |
| JPH10502773A (en) | 1998-03-10 |
| CN1114338C (en) | 2003-07-09 |
| AU4428396A (en) | 1996-08-14 |
| KR19980701642A (en) | 1998-06-25 |
| MX9705577A (en) | 1997-11-29 |
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