AU4428396A - Printed circuit board and heat sink arrangement - Google Patents

Printed circuit board and heat sink arrangement

Info

Publication number
AU4428396A
AU4428396A AU44283/96A AU4428396A AU4428396A AU 4428396 A AU4428396 A AU 4428396A AU 44283/96 A AU44283/96 A AU 44283/96A AU 4428396 A AU4428396 A AU 4428396A AU 4428396 A AU4428396 A AU 4428396A
Authority
AU
Australia
Prior art keywords
circuit board
printed circuit
heat sink
sink arrangement
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
AU44283/96A
Other versions
AU697409B2 (en
Inventor
Roman Katchmar
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nortel Networks Corp
Original Assignee
Nortel Networks Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nortel Networks Corp filed Critical Nortel Networks Corp
Publication of AU4428396A publication Critical patent/AU4428396A/en
Application granted granted Critical
Publication of AU697409B2 publication Critical patent/AU697409B2/en
Assigned to NORTEL NETWORKS CORPORATION reassignment NORTEL NETWORKS CORPORATION Request to Amend Deed and Register Assignors: NORTHERN TELECOM LIMITED
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4068—Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/0949—Pad close to a hole, not surrounding the hole
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AU44283/96A 1995-01-25 1996-01-19 Printed circuit board and heat sink arrangement Ceased AU697409B2 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
CA2141091 1995-01-25
CA2141091 1995-01-25
US51627195A 1995-08-17 1995-08-17
US08/516271 1995-08-17
PCT/CA1996/000028 WO1996023397A1 (en) 1995-01-25 1996-01-19 Printed circuit board and heat sink arrangement

Publications (2)

Publication Number Publication Date
AU4428396A true AU4428396A (en) 1996-08-14
AU697409B2 AU697409B2 (en) 1998-10-08

Family

ID=25677755

Family Applications (1)

Application Number Title Priority Date Filing Date
AU44283/96A Ceased AU697409B2 (en) 1995-01-25 1996-01-19 Printed circuit board and heat sink arrangement

Country Status (6)

Country Link
EP (1) EP0807372A1 (en)
JP (1) JP2908881B2 (en)
KR (1) KR19980701642A (en)
CN (1) CN1114338C (en)
AU (1) AU697409B2 (en)
WO (1) WO1996023397A1 (en)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19701731A1 (en) * 1997-01-20 1998-07-23 Bosch Gmbh Robert Control unit consisting of at least two housing parts
US5847452A (en) * 1997-06-30 1998-12-08 Sun Microsystems, Inc. Post mounted heat sink method and apparatus
US6452113B2 (en) 1999-07-15 2002-09-17 Incep Technologies, Inc. Apparatus for providing power to a microprocessor with integrated thermal and EMI management
US6304450B1 (en) 1999-07-15 2001-10-16 Incep Technologies, Inc. Inter-circuit encapsulated packaging
US20030214800A1 (en) 1999-07-15 2003-11-20 Dibene Joseph Ted System and method for processor power delivery and thermal management
US6618268B2 (en) 1999-07-15 2003-09-09 Incep Technologies, Inc. Apparatus for delivering power to high performance electronic assemblies
US6741480B2 (en) 1999-07-15 2004-05-25 Incep Technologies, Inc. Integrated power delivery with flex circuit interconnection for high density power circuits for integrated circuits and systems
US6356448B1 (en) 1999-11-02 2002-03-12 Inceptechnologies, Inc. Inter-circuit encapsulated packaging for power delivery
US6801431B2 (en) 1999-07-15 2004-10-05 Incep Technologies, Inc. Integrated power delivery and cooling system for high power microprocessors
GB9929800D0 (en) * 1999-12-17 2000-02-09 Pace Micro Tech Plc Heat dissipation in electrical apparatus
DE10210041B4 (en) * 2002-03-07 2009-04-16 Continental Automotive Gmbh A heat dissipation device for dissipating heat generated by an electrical component and methods of manufacturing such a heat dissipation device
JP4078400B2 (en) * 2003-03-19 2008-04-23 テクトロニクス・インターナショナル・セールス・ゲーエムベーハー Heat dissipation system for electronic devices
SE529673C2 (en) * 2004-09-20 2007-10-16 Danaher Motion Stockholm Ab Circuit arrangement for cooling surface-mounted semiconductors
US7365988B2 (en) 2005-11-04 2008-04-29 Graftech International Holdings Inc. Cycling LED heat spreader
US7889502B1 (en) * 2005-11-04 2011-02-15 Graftech International Holdings Inc. Heat spreading circuit assembly
US7303005B2 (en) * 2005-11-04 2007-12-04 Graftech International Holdings Inc. Heat spreaders with vias
EP1916884B1 (en) 2006-10-27 2011-04-06 Agie Charmilles SA Circuit board unit and method for production thereof
US20090165302A1 (en) * 2007-12-31 2009-07-02 Slaton David S Method of forming a heatsink
CN101505579B (en) * 2008-02-05 2012-01-11 台达电子工业股份有限公司 Heat radiation module and support member thereof
DE102008033193A1 (en) * 2008-07-15 2010-02-04 Continental Automotive Gmbh Motor control device of a vehicle
DE102008039921B4 (en) * 2008-08-27 2021-06-10 Vitesco Technologies GmbH Method of manufacturing an electronic device with a discrete component
CN101873784B (en) * 2009-04-27 2012-08-08 台达电子工业股份有限公司 Heat dispersion module of electronic element and assembling method thereof
CN101965121A (en) * 2010-10-09 2011-02-02 肖方一 Method for preparing heat conduction structure of heating element, and heat conduction structure
DE102012206980A1 (en) * 2012-04-26 2013-10-31 Robert Bosch Gmbh Device for positioning a printed circuit board
US9036352B2 (en) * 2012-11-30 2015-05-19 Ge Aviation Systems, Llc Phase change heat sink for transient thermal management
DE102014015586B3 (en) 2014-10-21 2016-03-31 Webasto SE heater
JP2017199819A (en) * 2016-04-28 2017-11-02 日立オートモティブシステムズ株式会社 Electronic control apparatus
KR102580830B1 (en) * 2016-07-13 2023-09-20 삼성전기주식회사 Printed circuit board
KR102573804B1 (en) * 2018-12-18 2023-09-01 현대자동차주식회사 Integrated control unit vehicle and method for controlling the same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3477101D1 (en) * 1983-03-25 1989-04-13 Mitsubishi Electric Corp Heat radiator assembly for cooling electronic parts
GB8601746D0 (en) * 1986-01-24 1986-02-26 British Telecomm Heat sink
US4914551A (en) * 1988-07-13 1990-04-03 International Business Machines Corporation Electronic package with heat spreader member
US4849856A (en) * 1988-07-13 1989-07-18 International Business Machines Corp. Electronic package with improved heat sink
DE4106185A1 (en) * 1991-02-27 1992-09-03 Standard Elektrik Lorenz Ag Electronic component or circuit cooler - has thermal container which is formed by thin-wall, enclosed, rubber-like sleeve
US5467251A (en) * 1993-10-08 1995-11-14 Northern Telecom Limited Printed circuit boards and heat sink structures

Also Published As

Publication number Publication date
EP0807372A1 (en) 1997-11-19
CN1114338C (en) 2003-07-09
KR19980701642A (en) 1998-06-25
AU697409B2 (en) 1998-10-08
CN1169235A (en) 1997-12-31
MX9705577A (en) 1997-11-29
JPH10502773A (en) 1998-03-10
WO1996023397A1 (en) 1996-08-01
JP2908881B2 (en) 1999-06-21

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Legal Events

Date Code Title Description
HB Alteration of name in register

Free format text: NORTEL NETWORKS CORPORATION

MK14 Patent ceased section 143(a) (annual fees not paid) or expired