CN116889112A

CN116889112A - Mounting system and mounting method

Info

Publication number: CN116889112A
Application number: CN202280017054.1A
Authority: CN
Inventors: 杉野晋平; 藤原弘之
Original assignee: Panasonic Intellectual Property Management Co Ltd
Current assignee: Panasonic Intellectual Property Management Co Ltd
Priority date: 2021-03-01
Filing date: 2022-02-24
Publication date: 2023-10-13
Also published as: DE112022001309T5; WO2022186022A1; JPWO2022186022A1

Abstract

The subject of the present disclosure is to provide an installation system and an installation method capable of shortening the time required for installation and improving productivity. The mounting system (1) is provided with a mounting head (2), an imaging unit (3), a driving unit (4), and a control unit (5). The mounting head (2) has a catching section (21) so as to be movable toward the substrate (T20), and mounts the component (T10) at a predetermined mounting position (P1) on the mounting surface (T21) of the substrate (T20). The imaging unit (3) is provided on the mounting head (2) and images an imaging region including at least one of a lower end of the capturing unit (21) and a region facing the capturing unit (21) in the moving direction of the capturing unit (21). A control unit (5) determines the intrusion state of the mounted component into a predetermined mounting area including a predetermined mounting position (P1) based on the imaging result of the imaging unit (3), and corrects the predetermined mounting position (P1) in accordance with the intrusion state.

Description

Mounting system and mounting method

Technical Field

The present disclosure relates to a mounting system and a mounting method.

Background

The electronic component mounting apparatus of patent document 1 includes a component holding device and a control device.

The component holding device includes an imaging device that images a predetermined mounting area including a predetermined mounting position of the electronic component on the circuit board from above. The control device determines whether or not the adjacent electronic component enters the predetermined mounting area based on the imaging result of the imaging device. When the control device judges that the adjacent electronic component enters the preset mounting area, the control device corrects the preset mounting position and mounts the electronic component held by the component holding device at the corrected preset mounting position.

An electronic component mounting apparatus (mounting system) as disclosed in patent document 1 moves an imaging device (imaging unit) provided in a component holding device (capturing unit) above a predetermined mounting area to capture an image of the predetermined mounting area. Then, the electronic component mounting apparatus moves the electronic component (1 st object) held by the component holding apparatus upward and lowers the electronic component to perform a mounting operation for mounting the electronic component at a predetermined mounting position.

However, the electronic component mounting apparatus cannot move the electronic component held by the component holding apparatus above the predetermined mounting position until the imaging of the predetermined mounting area is completed. As a result, there is a problem that the time required for installation is lost and productivity is lowered.

Prior art literature

Patent literature

Patent document 1: JP 2002-076693A

Disclosure of Invention

An object of the present disclosure is to provide an installation system and an installation method capable of shortening the time required for installation and thereby improving productivity.

The mounting system according to one aspect of the present disclosure includes a mounting head, an imaging unit, a driving unit, and a control unit. The mounting head has a capturing section capable of capturing the 1 st object so as to be movable toward the 2 nd object, and mounts the 1 st object at a predetermined mounting position on the mounting surface of the 2 nd object. The imaging unit is provided in the mounting head and images an imaging area including at least one of a front end of the capturing unit and an area facing the capturing unit in a moving direction of the capturing unit. The driving section moves the mounting head by driving the mounting head. The control section controls the driving section and the mounting head so that the capturing section can mount the 1 st object at the predetermined mounting position. The control unit determines an intrusion state of at least 1 mounted component mounted on the 2 nd object into a predetermined mounting area including the predetermined mounting position based on an imaging result of the imaging unit, and corrects the predetermined mounting position in accordance with the intrusion state.

The mounting method according to one aspect of the present disclosure is performed by a mounting system including a mounting head, an imaging unit, a driving unit, and a control unit. The mounting head has a capturing section capable of capturing the 1 st object so as to be movable toward the 2 nd object, and mounts the 1 st object at a predetermined mounting position on the mounting surface of the 2 nd object. The camera shooting part is arranged on the mounting head. The driving section moves the mounting head by driving the mounting head. The control section controls the driving section and the mounting head so that the capturing section can mount the 1 st object at the predetermined mounting position. The mounting method includes an imaging process and a correction process. In the image capturing step, the image capturing section captures an image of an image capturing region including at least one of a tip of the capturing section and a region facing the capturing section in a moving direction of the capturing section. In the correction step, the control unit determines an intrusion state of at least 1 mounted component mounted on the 2 nd object into a predetermined mounting area including the predetermined mounting position based on an imaging result of the imaging unit, and corrects the predetermined mounting position in accordance with the intrusion state.

Drawings

Fig. 1 is a block diagram showing an installation system according to an embodiment.

Fig. 2 is a perspective view showing a main part of the above-described mounting system.

Fig. 3 is a block diagram showing the above-described mounting system.

Fig. 4 is a perspective view showing components mounted in the same mounting system.

Fig. 5 is a side view for explaining the installation of the above-described components.

Fig. 6 is a side view for explaining the installation of the above-described components.

Fig. 7 is a perspective view showing the periphery of the image pickup section of the above-described mounting system.

Fig. 8 a and 8B are schematic diagrams for explaining the mounting process of the mounting system described above.

Fig. 9 is a flowchart showing an installation method performed by the installation system as above.

Fig. 10 is a side view for explaining correction of a predetermined mounting position of the mounting system as above.

Fig. 11 is a side view for explaining correction of a predetermined mounting position of the mounting system as above.

Fig. 12 is a side view for explaining correction of a predetermined mounting position of the mounting system as above.

Fig. 13 is a side view for explaining correction of a predetermined mounting position of the mounting system as above.

Fig. 14 is a side view for explaining the suspension process of the mounting system as above.

Fig. 15 is a perspective view showing a modification of the imaging unit of the mounting system.

Fig. 16 is a side view showing another modification of the imaging unit of the mounting system.

Detailed Description

The following embodiments relate generally to an installation system and an installation method. More specifically, the present invention relates to an attachment system and an attachment method that include a capturing section capable of capturing a 1 st object so as to be movable toward a 2 nd object, and attach the 1 st object to the 2 nd object.

The mounting system and the mounting method according to the embodiment will be described in detail below with reference to fig. 1 to 14. However, each of the drawings described in the following embodiments is a schematic drawing, and the respective ratios of the sizes and thicknesses of the constituent elements do not necessarily reflect actual dimensional ratios. The configuration described in the following embodiment is merely an example of the present disclosure. The present disclosure is not limited to the following embodiments, and various modifications can be made in accordance with the design and the like as long as the effects of the present disclosure can be achieved.

(1) Summary of installation System

The outline of the mounting system 1 according to the present embodiment will be described below.

As shown in fig. 1, the mounting system 1 is a mounting device (mounter) for mounting the 1 st object T1 on the 2 nd object T2. The mounting system 1 is used for manufacturing various products such as electronic devices, automobiles, clothing, foods, medicines, and artwork in facilities such as factories, institutions, business matters, and educational facilities.

In this embodiment, a case where the mounting system 1 is used in manufacturing of electronic devices in a factory will be described. A general electronic device includes various circuit blocks such as a power supply circuit and a control circuit. In the production of these circuit blocks, for example, a solder application step, a mounting step, and a soldering step are performed in this order. In the solder coating step, paste solder is coated (or printed) on a substrate (including a printed wiring board). In the mounting step, components (including electronic components) are mounted (mounted) on the substrate. In the soldering step, for example, a substrate with components mounted thereon is heated in a reflow furnace to melt paste solder for soldering. In the mounting step, the mounting system 1 performs a work of mounting the 1 st object T1, i.e., the component T10, on the 2 nd object T2, i.e., the substrate T20. That is, in the mounting system 1 according to the present embodiment, the 1 st object T1 is the component T10, and the 2 nd object T2 is the substrate T20 on which the component T10 is mounted.

As described above, as shown in fig. 1, the mounting system 1 used for mounting the 1 st object T1 (component T10) on the 2 nd object T2 (substrate T20) includes the mounting head 2, the imaging unit 3, the driving unit 4, the control unit 5, the base 61, the conveyor 62, the plurality of component supply devices 63, and the fixed camera 7. The conveyor 62 has a pair of conveyor mechanisms 62a extending in the X-axis direction on the base 61, and conveys and positions the 2 nd object T2, i.e., the substrate T20, in the X-axis direction in a predetermined mounting space. The plurality of component supply devices 63 have tape feeders mounted in an aligned manner in the X-axis direction on a feeder base 65 of a carriage 64 coupled to the base 61. Each component supply device 63 feeds the carrier tape 67 supplied from the reel 66 in a pitch feed manner, and supplies the component T10, which is the 1 st object T1 held by the carrier tape 67, to the component supply port 63a. The reel 66 is held by the carriage 64. The fixed camera 7 is mounted on the base 61, and picks up an image of the upper side.

The mounting head 2 further includes a catching portion 21 for catching the 1 st object T1. The capturing unit 21 is constituted by an adsorption nozzle, for example, and captures (holds) the 1 st object T1, i.e., the component T10 in a releasable (i.e., released) state. The mounting system 1 lowers the capturing unit 21 so as to approach the board T20 in a state where the capturing unit 21 captures the component T10, thereby mounting the component T10 on the mounting surface T21 of the board T20.

In the field of mounting components, particularly in the field of clamping electronic components, using the mounting system 1, miniaturization and densification of electronic components have been advanced in recent years, and it has been demanded to shorten the time required for mounting and to improve productivity. Specific examples of the component T10 include electronic components having dimensions of 0.1mm in width by 0.2mm in length in plan view.

Therefore, in the mounting system 1, the mounting head 2 has a catching portion 21 that can catch the 1 st object T1 so as to be movable toward the 2 nd object T2, and the 1 st object T1 is mounted at a predetermined mounting position P1 (refer to fig. 2) on the mounting surface T21 of the 2 nd object T2. The imaging unit 3 is provided in the mounting head 2, and images an imaging region R1 (see fig. 7) including at least one of a lower end (front end) of the capturing unit 21 and a region facing the capturing unit 21 in a moving direction (downward direction in the present embodiment) of the capturing unit 21. The driving unit 4 drives the mounting head 2 to move the mounting head 2. The control unit 5 controls the driving unit 4 and the mounting head 2 so that the capturing unit 21 can mount the 1 st object T1 at the predetermined mounting position P1. Then, the control unit 5 determines, based on the imaging result of the imaging unit 3, an intrusion state of at least 1 mounted component T3 (see fig. 4) that has been mounted on the 2 nd object T2 into a predetermined mounting area Q1 (see fig. 2) including the predetermined mounting position P1, and corrects the predetermined mounting position P1 in accordance with the intrusion state. The predetermined mounting region Q1 is a region in which a dimensional tolerance of the component T10 and a deviation (mounting accuracy) of the mounting position of the component T10 are added to the reference dimension of the component T10, and is set around the predetermined mounting position P1. That is, the predetermined mounting area Q1 is an entire area that the component T10 mounted at the predetermined mounting position P1 may occupy on the mounting surface T21. In other words, the component T10 mounted at the predetermined mounting position P1 is accommodated in the predetermined mounting region Q1 even in consideration of the dimensional tolerance and mounting accuracy of the component T10.

In such a mounting system 1, the imaging unit 3 is provided in the mounting head 2, and images an imaging region R1 (see fig. 7) including at least one of a lower end of the capturing unit 21 and a region facing the capturing unit 21 in a moving direction of the capturing unit 21. That is, in the mounting system 1, the imaging section 3 moves together with the mounting head 2. In other words, the mounting system 1 moves the mounting head 2 and the imaging unit 3 at the same time, and can image the mounting state around the predetermined mounting position P1. Therefore, the mounting system 1 can shorten the time required for mounting, thereby improving productivity, compared with a configuration in which the mounting head 2 and the image pickup section 3 are moved separately.

In recent years, adjacent mounting to a narrower pitch has been attempted. For example, as shown in fig. 4, the component T10 may be mounted on the mounting surface T21 on which at least 1 mounted component T3 (4 mounted components T3 aligned in the Y-axis direction in fig. 4) has been mounted. At this time, the component T10 is intended to be mounted on the mounting surface T21 without interfering with the mounted component T3. Therefore, conventionally, the predetermined mounting position of the component T10 has been corrected in response to the dimensional deviation of the respective substrates T20 (precision in manufacturing the substrates T20, expansion and contraction due to heat and moisture, and the like) and the deviation of the capturing position of the component T10 due to the capturing portion 21. However, in the conventional method for correcting the accuracy of the equipment and the predetermined mounting position, it is difficult to cope with the narrow adjacent mounting which satisfies the conditions required in the market in the future.

In fig. 4, as mounted members T3, mounted members T31 and T32 have been arranged in the Y-axis direction on the mounting surface T21, and the member T10 is mounted between the mounted members T31 and T32 in the Y-axis direction. The component T10 and the mounted components T31 and T32 are mounted on the mounting surface T21 by the solder 8 applied to the pads T22 formed at equal intervals along the Y axis direction. The solder 8 corresponds to a joining member for joining the component T10 and the mounted component T3 to the board T20.

Fig. 5 and 6 are side views of the mounted component T31 and the component T10 as viewed from the X-axis direction. In the present embodiment, the adjacent pitch Yp in the Y-axis direction, which is preset for the component T10 and the mounted component T3, is set to 40 μm. The dimensional tolerance in the Y axis direction of the component T10 and the mounted component T3 was set to +5 μm for the one-side tolerance Yt and to ±10 μm for the two-side tolerance. The dimension (gap dimension) of the gap G1 in the Y-axis direction formed between the component T10 and the mounted component T31 is set to Yg1.

Preferably, each of the mounting members such as the member T10 and the mounted member T3 is mounted at a reference position where the center of the pad T22 in the Y-axis direction coincides with the center of the mounting member in the Y-axis direction. However, there are cases where the mounting position of the mounting member deviates from the reference position due to the precision of the machine, the precision of the software process, and the like, and so-called mounting deviation occurs. The maximum value (absolute value) of the installation deviation due to the precision of such a machine, the precision of the software process, and the like is referred to as an installation deviation value Ym (refer to fig. 6). If the actual mounting position of the mounting member is not more than a predetermined value from the reference position, it is considered that no mounting deviation occurs. In the present embodiment, the mounting deviation value Ym is set to 20 μm.

In fig. 5, the Y-axis dimension of the component T10 includes the one-sided tolerance Yt, and the Y-axis dimension of the mounted component T31 also includes the one-sided tolerance Yt. The component T10 and the mounted component T31 are not offset from each other. In this case, the gap size Yg1 is "yg1=yp-2·yt=30μm", and the component T10 does not interfere with the mounted component T31.

In fig. 6, the component T10 and the mounted component T31 are each offset in mounting direction by a mounting offset value Ym (=20 μm) in the direction of approaching each other in the Y-axis direction. In this case, the gap dimension Yg1 corresponds to a dimension in which the component T10 and the mounted component T31 overlap each other, and is "yg1=yp-2·yt-2·ym= -10 μm", and the component T10 does not interfere with the mounted component T31.

Therefore, the mounting system 1 grasps the position of the mounted member T3 adjacent to the 1 st object T1 at the time of narrow adjacent mounting, and corrects the predetermined mounting position P1 so as to suppress interference between the 1 st object T1 and the mounted member T3.

The state in which the component T10 interferes with the mounted component T31 is not limited to the state in which the component T10 and the mounted component T31 overlap with each other as shown in fig. 6. The state in which the component T10 interferes with the mounted component T31 includes, for example, a state in which the gap size Yg1 is smaller than a predetermined size even when the component T10 and the mounted component T31 do not overlap with each other. If the gap size Yg1 is smaller than the predetermined size, the mounting system 1 is highly likely to interfere with the mounting system, and the predetermined mounting position P1 is corrected so as to suppress interference between the 1 st object T1 and the mounted component T3.

In correcting the predetermined mounting position P1, the mounting system 1 preferably corrects the predetermined mounting position P1 in consideration of the respective tolerances of the component T10 and the mounted component T3, the mounting position of the mounted component T3, and the like, in addition to the dimensional deviation of the respective substrates T20 and the deviation of the capturing positions of the components T10. Further, the mounting system 1 preferably stops the mounting process of the 1 st object T1 when interference between the 1 st object T1 and the mounted member T3 or interference between the capturing unit 21 and the mounted member T3 cannot be avoided. Further, the mounting system 1 preferably corrects the predetermined mounting position P1 so as to suppress interference of the capturing portion 21 with the mounted component T3.

(2) Detailed description of the preferred embodiments

(2.1) precondition

In this embodiment, a case will be described in which the mounting system 1 is used for mounting a component (object T1 of item 1) by a surface mount technology (SMT: surface Mount Technology), as an example. That is, the component T10 as the 1 st object T1 is a component (SMD: surface Mount Device) for surface mounting, and is mounted by being disposed on the surface (mounting surface T21) of the substrate T20 as the 2 nd object T2. However, the present invention is not limited to this example, and the mounting system 1 may be used for mounting a component (object T1 of item 1) by the insertion mounting technique (IMT: insertion Mount Technology). In this case, the member T10 as the 1 st object T1 is a member for insertion and attachment having a lead terminal, and is attached to the surface (attachment surface T21) of the substrate (2 nd object T2) by inserting the lead terminal into the hole of the substrate T20 as the 2 nd object T2.

In the present disclosure, the "imaging optical axis" is an optical axis of an image (an image captured by the imaging unit 3) captured by the imaging unit 3, and is an optical axis determined based on both the imaging element 31 (see fig. 3) and the optical system 32 (see fig. 3) of the imaging unit 3. That is, a straight line connecting the center of the light receiving surface of the image pickup element 31 and a portion passing through the optical system 32 in the image pickup region R1 (see fig. 7) formed at the center of the light receiving surface of the image pickup element 31 becomes the image pickup optical axis of the image pickup unit 3.

In the present disclosure, the "imaging result" is an imaging image of the imaging unit 3, and includes a still image (still image) and a moving image (moving image). Further, the "moving image" includes an image pickup image composed of a plurality of still images obtained by freeze shooting (coma photo), or the like. The captured image of the image capturing unit 3 may not be the data itself output from the image capturing unit 3. For example, the image captured by the image capturing unit 3 may be subjected to processing such as data compression, conversion into another data format, and cutting out a part from the image captured by the image capturing unit 3, focus adjustment, brightness adjustment, and contrast adjustment, as necessary. In the present embodiment, the image captured by the image capturing unit 3 is a full-color moving image, as an example.

Hereinafter, as an example, 3 axes of an X axis, a Y axis, and a Z axis orthogonal to each other are set, an axis parallel to the surface (mounting surface T21) of the substrate T20 which is the 2 nd object T2 is set as an "X axis" and a "Y axis", and an axis parallel to the thickness direction of the substrate T20 is set as a "Z axis". Further, one of the two directions along the Z axis is set as an upward direction, and the other direction is set as a downward direction. For example, when the catching portion 21 is opposed to the mounting surface T21 of the substrate T20, the substrate T20 is positioned below the catching portion 21. The X-axis, the Y-axis, and the Z-axis are virtual axes, and the arrows indicating "X", "Y", and "Z" in the drawings are merely given for the purpose of explanation, and are not accompanied by an entity. Furthermore, these directions are not intended to limit the directions in which the mounting system 1 is used.

In addition, pipes for circulation of cooling water, cables for power supply, pipes for supply of air pressure (including positive pressure and vacuum), and the like are connected to the mounting system 1, and these are appropriately omitted from illustration in the present embodiment.

(2.2) integral Structure

Next, the main parts of the mounting system 1 according to the present embodiment will be described with reference to fig. 1 to 3 and fig. 7.

The mounting system 1 according to the present embodiment includes a mounting head 2, an imaging unit 3, a driving unit 4, and a control unit 5. In the present embodiment, as shown in fig. 3, the mounting system 1 includes a conveyor 62, a component supply device 63, and a fixed camera 7 in addition to the mounting head 2, the imaging unit 3, the driving unit 4, and the control unit 5. The transport device 62, the component supply device 63, and the fixed camera 7 are not necessarily required for the system 1. That is, all or part of the conveyor 62, the component supply device 63, and the fixed camera 7 may not be included in the components of the mounting system 1. In fig. 2, only the mounting head 2, the imaging unit 3, and the driving unit 4 are illustrated, and the configuration of the other mounting system 1 is appropriately omitted.

The mounting head 2 has at least 1 catching portion 21. In the present embodiment, the mounting head 2 has 1 capturing portion 21. The mounting head 2 moves the catching portion 21 closer to the board T20 in a state in which the component T10 is caught by the catching portion 21, and mounts the component T10 on the mounting surface T21 of the board T20. That is, the mounting head 2 holds the catching portion 21 so as to be movable toward the substrate T20.

The imaging unit 3 is fixed to the mounting head 2. The image pickup section 3 includes an image pickup element 31 and an optical system 32. The imaging unit 3 is, for example, a video camera that captures a moving image. In the present embodiment, as shown in fig. 7, the imaging unit 3 images the imaging region R1 including the limit position at which the capture unit 21 facing the predetermined mounting position P1 above the predetermined mounting position P1 can be closest to the substrate T20. In fig. 7, the bottom dead center U1, which is the lower limit position in the Z-axis direction of the capturing portion 21, is the limit position. In other words, the imaging unit 3 images the lower part of the capturing unit 21 located above the predetermined mounting position P1 so as to face the predetermined mounting position P1, including the bottom dead center U1.

The imaging unit 3 may take an image of an area including a region from the lower end of the capturing unit 21 to the predetermined mounting position P1 as the imaging area R1. The imaging unit 3 may take an image of an area including a region from the lower end of the capturing unit 21 to the predetermined mounting area Q1 as the imaging area R1.

That is, the imaging unit 3 may be capable of imaging the imaging region R1 including at least one of the lower end of the capturing unit 21 and the region facing the capturing unit 21 in the moving direction of the capturing unit 2I.

The control section 5 controls each section of the mounting system 1. The control unit 5 has a microcontroller having 1 or more processors and 1 or more memories as a main configuration. That is, the functions of the control unit 5 are realized by executing a program recorded in the memory of the microcontroller by the processor of the microcontroller. The program may be recorded in advance in a memory, may be provided via an electric communication line such as the internet, or may be provided by recording on a non-transitory recording medium such as a memory card.

The control unit 5 is electrically connected to each of the mounting head 2, the imaging unit 3, the driving unit 4, the conveyor 62, the component supply device 63, and the fixed camera 7, for example. The control unit 5 outputs control signals to the mounting head 2 and the driving unit 4, and controls the mounting head 2 and the driving unit 4 so that the component T10 captured by the capturing unit 21 is mounted on the mounting surface T21 of the board T20. The control unit 5 outputs control signals to the imaging unit 3 and the fixed camera 7 to control the imaging unit 3 and the fixed camera 7, or obtains the imaging images of the imaging unit 3 and the fixed camera 7 from the imaging unit 3 and the fixed camera 7, respectively.

The driving unit 4 is a device for moving the mounting head 2. In the present embodiment, the driving section 4 moves the mounting head 2 in the X-Y plane. The "X-Y plane" as used herein refers to a plane including the X axis and the Y axis, and is a plane orthogonal to the Z axis. In other words, the driving unit 4 moves the mounting head 2 in the X-axis direction and the Y-axis direction. In the present embodiment, since the image pickup section 3 is fixed to the mounting head 2, the driving section 4 also moves the image pickup section 3 together with the mounting head 2. In other words, the driving unit 4 moves the mounting head 2 and the imaging unit 3 in the X-Y plane. In fig. 1, the mounting head 2 and the imaging unit 3 are moved by the driving unit 4 between above the substrate T20 positioned in the mounting space of the conveyor 62 and above the component supply port 63a of the component supply device 63.

Specifically, as shown in fig. 2, the driving section 4 has an X-axis driving section 41 and a Y-axis driving section 42. The X-axis driving unit 41 linearly advances the mounting head 2 in the X-axis direction. The Y-axis driving unit 42 linearly advances the mounting head 2 in the Y-axis direction. The Y-axis driving section 42 moves the mounting head 2 along the Y-axis together with the X-axis driving section 41 to linearly advance the mounting head 2 in the Y-axis direction. In the present embodiment, the X-axis driving unit 41 and the Y-axis driving unit 42 each include a linear motor, and the mounting head 2 is moved by a driving force generated by the linear motor upon receiving power supply, as an example.

The component supply device 63 supplies the component T10 captured by the capturing section 21 of the mounting head 2. As an example, the component supply device 63 includes a tape feeder that supplies the component T10 accommodated in the carrier tape. Alternatively, the component supply device 63 may have a tray on which a plurality of components T10 are placed. The mounting head 2 captures the component T10 from such a component supply device 63 by the capturing section 21.

The conveyor 62 is a device for conveying the substrate T20. The conveyor 62 is realized by, for example, a belt conveyor or the like. The transport device 62 transports the substrate T20 along the X axis, for example. The transport device 62 transports the substrate T20 to at least a mounting space facing the capturing section 21 in the Z-axis direction, which is below the mounting head 2. Then, the transport device 62 stops the substrate T20 in the mounting space until the mounting of the component T10 on the substrate T20 by the mounting head 2 is completed.

The mounting system 1 may further include a support device, a lighting device, a communication unit, and the like, in addition to the above-described configuration.

The supporting device supports the substrate T20 transported to the mounting space by the transporting device 62. That is, the substrate T20 conveyed to the installation space by the conveyor 62 is held in the installation space by the supporting means.

The illumination device illuminates an imaging region R1 of the imaging unit 3. The illumination device may be turned on at least at the timing of imaging by the imaging unit 3, and for example, may emit light in accordance with the imaging timing of the imaging unit 3. In the present embodiment, since the picked-up image of the image pickup section 3 is a full-color moving image, the illumination device outputs light in a wavelength band of a visible light region such as white light. In the present embodiment, as an example, the lighting device includes a plurality of light sources such as LEDs (Light Emitting Diode, light emitting diodes). The illumination device illuminates the imaging region R1 of the imaging unit 3 by causing these plurality of light sources to emit light. The illumination device is realized by a suitable illumination means such as annular illumination or coaxial drop illumination. The illumination device is fixed to the mounting head 2, for example, together with the image pickup section 3.

The communication unit is configured to communicate with a host system directly or indirectly via a network, a repeater, or the like. Thus, the mounting system 1 can transfer data to and from the host system.

(2.3) mounting head

A more detailed structure of the mounting head 2 is described with reference to fig. 2, 3, 7, 8 a, and 8B.

In the present embodiment, the mounting head 2 includes, in addition to the catching portion 21: an actuator 22 (refer to fig. 3) for moving the catching part 21; and a head main body 23 holding the catch portion 21 and the actuator 22. In the mounting system 1 according to the present embodiment, 1 head main body 23 holds 1 capturing section 21 and actuator 22, respectively. Thus, 1 component T10 can be captured by the mounting head 2.

The catching part 21 is, for example, a suction nozzle. The catching unit 21 is controlled by the control unit 5, and can switch between a catching state in which the component T10 is caught (held) and a release state in which the component T10 is released (the catching is released). However, the capturing section 21 is not limited to the suction nozzle, and may be configured to capture (hold) the component T10 by pinching (pinching) the component, for example, by a robot.

The component T10 is captured by the capturing unit 21, and the mounting head 2 is operated by receiving supply of air pressure (vacuum) as power. That is, the mounting head 2 switches between the catch state and the release state of the catch portion 21 by opening and closing a valve on a pneumatic (vacuum) supply path connected to the catch portion 21.

The actuator 22 linearly advances the catching part 21 in the Z-axis direction. Further, the actuator 22 rotationally moves the catching portion 21 in a rotational direction (hereinafter referred to as "θ direction") about an axis along the Z-axis direction. In the present embodiment, as an example, the actuator 22 is driven by a driving force generated by a linear motor with respect to movement of the catching section 21 in the Z-axis direction. Regarding the movement of the catching part 21 in the θ direction, the actuator 22 is driven by the driving force generated by the rotary motor. On the other hand, as described above, the mounting head 2 is linearly advanced in the X-axis direction and the Y-axis direction by the driving section 4. As a result, the catching part 21 included in the mounting head 2 can be moved in the X-axis direction, the Y-axis direction, the Z-axis direction, and the θ -direction by the driving part 4 and the actuator 22.

For example, the head main body 23 is made of metal and formed in a rectangular parallelepiped shape. The catch 21 and the actuator 22 are assembled to the head main body 23, whereby the catch 21 and the actuator 22 are held by the head main body 23. In the present embodiment, the capturing section 21 is indirectly held by the head main body 23 via the actuator 22 in a state of being movable in the Z-axis direction and the θ -axis direction. The head main body 23 is moved in the X-Y plane by the driving section 4, whereby the mounting head 2 is moved in the X-Y plane.

According to the above configuration, as shown in fig. 8 a and 8B, the mounting head 2 can mount the component T10 on the mounting surface T21 of the board T20 by moving the capturing portion 21 closer to the board T20 in a state where the component T10 is captured by the capturing portion 21. That is, the mounting head 2 moves the capturing section 21 in the up-down direction along the Z axis between at least a bottom dead center U1 (see B of fig. 8) which is a lower limit position in the Z axis direction of the capturing section 21 and a top dead center U2 (see a of fig. 8) which is an upper limit position in the Z axis direction of the capturing section 21. In this case, the mounting head 2 lowers the capturing portion 21 capturing the state of the component T10 from the top dead center U2 to the bottom dead center U1, thereby mounting the component T10 on the mounting surface T21 of the board T20. In the present disclosure, the term "bottom dead center" refers not to the lower limit position in the movable range of the catching part 21 but to the lower limit position of the catching part 21 when the component T10 is mounted on the mounting surface T21 of the board T20. In the present disclosure, the term "top dead center" is not an upper limit position in the movable domain of the catching part 21, but an upper limit position of the catching part 21 when the component T10 is mounted on the mounting surface T21 of the board T20.

(2.4) image pickup portion

A more detailed configuration of the imaging unit 3 will be described with reference to fig. 2, 7, 8 a, and 8B.

In the present embodiment, as shown in fig. 7, the imaging unit 3 is configured by 1 moving camera 3a that moves together with the mounting head 2, and includes an imaging element 31 and an optical system 32 as shown in fig. 3. The optical system 32 forms an image of the image pickup region R1 by imaging the image pickup element 31.

The image pickup element 31 is an image sensor such as a CCD (Charge Coupled Devices, charge coupled device) or CMOS (Complementary Metal-Oxide Semiconductor, complementary metal oxide semiconductor). The image pickup device 31 converts an image formed on the light receiving surface into an electrical signal and outputs the electrical signal.

The optical system 32 includes 1 or more lenses, mirrors, and the like. In the present embodiment, the optical system 32 is realized by a combination of a plurality of lenses (lens group), as an example. The optical system 32 forms light from the image pickup region R1 shown in fig. 7 on the light receiving surface of the image pickup element 31. In the present embodiment, the optical system 32 of the image pickup unit 3 is a telecentric optical system. That is, the principal ray is parallel to the optical axis (image pickup optical axis Ax 1) in the entire optical system. The optical system 32 is not limited to the above configuration.

However, as shown in fig. 7, the imaging unit 3 includes, in the imaging region R1, a region facing the capturing unit 21 in a direction perpendicular to the mounting surface T21 (Z-axis direction) among the mounting surface T21 of the substrate T20. In other words, in the imaging unit 3, in a state in which the capturing unit 21 is located on the mounting surface T21 of the board T20, the imaging region R1 includes a region immediately below the capturing unit 21 in the mounting surface T21. In other words, in a state in which the capturing section 21 is located on the mounting surface T21 of the substrate T20, the imaging region R1 is a region including the bottom dead center U1 located directly below the capturing section 21. Therefore, the imaging unit 3 can generate an imaging image of the region immediately below the capturing unit 21.

When the capturing unit 21 is positioned on the mounting surface T21 of the board T20, the imaging region R1 includes not only the predetermined mounting region Q1 of the component T10 but also at least a part of the mounted component T3 mounted adjacent to the predetermined mounting region Q1. Therefore, the predetermined mounting region Q1 of the component T10 and at least a part of the mounted component T3 mounted adjacent to the predetermined mounting region Q1 are photographed in the photographed image of the photographing part 3.

Specifically, as shown in fig. 7, the imaging unit 3 is attached to the lower end of the bracket 24. The upper end of the bracket 24 is mounted to the head main body 23. That is, the imaging unit 3 is disposed below the head main body 23, in a plan view from the Z-axis direction, on the side of the capturing unit 21. In this way, the imaging unit 3 is mounted on the mounting head 2, and the mounting head 2 and the imaging unit 3 move simultaneously. Therefore, the mounting system 1 can shorten the time required for mounting and improve productivity as compared with a configuration in which the mounting head 2 and the imaging section 3 are moved separately.

As shown in fig. 7, 8 a, and 8B, the imaging unit 3 has an imaging optical axis Axl inclined with respect to a perpendicular line (a line along the Z axis) to the mounting surface T21 of the substrate T20. That is, the imaging unit 3 is fixed to the bracket 24 in such a posture that the imaging optical axis Ax1 is inclined with respect to the perpendicular line of the mounting surface T21. In other words, the imaging optical axis Ax1 of the imaging unit 3 is inclined with respect to the Z axis. In this way, the imaging unit 3 is disposed laterally to the capturing unit 21 and is inclined with respect to the Z axis with respect to the imaging optical axis Ax1, thereby imaging the imaging region R1 directly below the capturing unit 21. That is, in a state where the capturing section 21 is located above the predetermined mounting position P1, the imaging section 3 can image the imaging region R1 including the bottom dead center U1 located directly below the capturing section 21. In this case, the intrusion state of the mounted component T3 into the predetermined mounting area Q1 is determined using the image of the image capturing area R1, and the predetermined mounting position P1 corresponding to the intrusion state can be corrected. The image captured by the image capturing unit 3 for capturing the image of the image capturing region R1 preferably includes both the component T10 captured by the capturing unit 21 located at a position opposed to the predetermined mounting position P1 and the mounted component T3.

The imaging unit 3 preferably images the entire substrate T20 separately from the imaging region R1 when positioned above the substrate T20. In this case, the control unit 5 can correct the predetermined mounting position P1 based on the dimensional deviation of the substrate T20 by using the entire image of the entire substrate T20. The entire image of the substrate T20 may be captured by a camera other than the imaging unit 3.

(2.5) fixed video camera

A more detailed structure of the fixed camera 7 is described with reference to fig. 1.

The fixed camera 7 captures an image of the mounting head 2 moving between the upper side of the substrate T20 positioned in the mounting space and the upper side of the component supply port 63a of the component supply device 63 from below. Therefore, the component T10 captured by the capturing section 21 is captured in the captured image of the fixed camera 7. That is, the captured image of the fixed camera 7 includes information on the positional relationship between the capturing section 21 and the component T10, in other words, information on the deviation of the component T10 from the capturing section 21.

The fixed camera 7 preferably captures an image of the mounting head 2 moving from the component supply port 63a to the substrate T20 from below. In this case, the fixed camera 7 does not always perform imaging, but performs imaging at a timing when the capturing section 21 having the component T10 captured passes above the fixed camera 7.

The fixed camera 7 may be provided below the component supply port 63 a.

The mounting system 1 preferably further includes an illumination device for illuminating the imaging area of the fixed camera 7.

(2.6) control portion

A more detailed configuration of the control unit 5 will be described with reference to fig. 1 to 3, 7, 8 a, and 8B.

As described above, the control unit 5 outputs a control signal to the mounting head 2 to control the mounting head 2. Specifically, the control unit 5 controls the mounting head 2 to linearly advance the capturing unit 21 in the Z-axis direction until the capturing unit 21 located at the top dead center U2 reaches the bottom dead center U1. In other words, the control unit 5 lowers the capturing unit 21 in the Z-axis direction until the capturing unit 21 located at the top dead center U2 reaches the bottom dead center U1. Further, the control unit 5 controls the mounting head 2 to move the capturing unit 21 to the bottom dead center U1, and then releases the capturing of the component T10 by the capturing unit 21, or captures the component T10 by the capturing unit 21. In the present embodiment, the mounting process of the component T10 captured by the capturing unit 21 on the mounting surface T21 of the board T20 is exemplified, and the control unit 5 releases the capturing of the component T10 by the capturing unit 21 by controlling the mounting head 2.

Then, when the component T10 captured by the capturing unit 21 is mounted on the mounting surface T21 of the board T20, the control unit 5 disposes the component T10 at a predetermined mounting position P1 on the mounting surface T21. The predetermined mounting position P1 is characterized by XY coordinates including coordinates in the X-axis direction and coordinates in the Y-axis direction. The control unit 5 stores or acquires data of XY coordinates (initial values) of the predetermined mounting position P1 set for the component T10 captured by the capturing unit 21 in advance or from an external system. The control section 5 controls the mounting head 2 so that the XY coordinates of the component T10 captured by the capturing section 21 coincide with the XY coordinates of the predetermined mounting position P1.

However, depending on the dimensional deviation of the substrates T20, the deviation of the capturing positions of the components T10, the tolerances of the components T10 and the mounted components T3, and the deviation of the mounting positions of the mounted components T3, the components T10 mounted at the predetermined mounting positions P1 may interfere with the mounted components T3.

Therefore, the control unit 5 acquires data of each image (image capturing result) from the image capturing unit 3 and the fixed camera 7. The control unit 5 determines an intrusion state of at least 1 mounted component T3 mounted on the substrate T20 into the predetermined mounting area Q1 including the predetermined mounting position P1 based on the image captured by the image capturing unit 3, and corrects the predetermined mounting position P1 in accordance with the intrusion state. Details of the correction process of the predetermined mounting position P1 based on the image captured by the image capturing unit 3 will be described later.

Further, the control unit 5 preferably corrects the predetermined mounting position P1 based on the captured image of the fixed camera 7. In this case, the control unit 5 can measure the amount of deviation of the component T10 from the center of the capturing unit 21 based on the captured image of the fixed camera 7. Then, the control section 5 corrects the predetermined mounting position P1 so as to cancel the amount of deviation of the component T10.

Further, the control unit 5 preferably corrects the predetermined mounting position P1 based on the entire image of the substrate T20. In this case, the control unit 5 can measure the dimensional deviation of the substrate T20 based on the entire image of the substrate T20. Then, the control section 5 corrects the predetermined mounting position P1 so as to cancel out the dimensional deviation of the substrate T20.

The control unit 5 can control the actuator 22 to control the movement speed of the capturing unit 21 in the Z-axis direction. That is, the control unit 5 can control the falling speed and the rising speed of the capturing unit 21.

(3) Mounting method

Next, an installation method according to the present embodiment will be described.

The mounting method according to the present embodiment is a mounting method performed by the mounting system 1 including the mounting head 2, the imaging unit 3, the driving unit 4, and the control unit 5. The mounting head 2 has a catching portion 21 capable of catching the 1 st object T1 so as to be movable toward the 2 nd object T2, and mounts the 1 st object T1 at a predetermined mounting position P1 on the mounting surface T21 of the 2 nd object T2. The imaging unit 3 is provided on the mounting head 2. The driving unit 4 drives the mounting head 2 to move the mounting head 2. The control unit 5 controls the driving unit 4 and the mounting head 2 so that the capturing unit 21 can mount the 1 st object T1 at the predetermined mounting position P1. The mounting method includes an imaging step and a correction step. In the imaging step, the imaging unit 3 images an imaging region R1 including at least one of a lower end (front end) of the capturing unit 21 and a region facing the capturing unit 21 in the moving direction of the capturing unit 21. In the correction step, the control unit 5 determines an intrusion state of at least 1 mounted component T3 mounted on the 2 nd object T2 into the predetermined mounting area Q1 including the predetermined mounting position P1 based on the imaging result of the imaging unit 3, and corrects the predetermined mounting position P1 in accordance with the intrusion state.

That is, the mounting method according to the present embodiment is a mounting method performed by the mounting system 1 according to the present embodiment. In this mounting method, the mounting head 2 and the imaging unit 3 can be moved simultaneously to capture an image of the mounting state around the predetermined mounting position P1. Therefore, the mounting system 1 can shorten the time required for mounting and improve productivity as compared with a configuration in which the mounting head 2 and the imaging section 3 are moved separately.

Fig. 9 is a flowchart showing the overall operation of the mounting system 1 including the mounting method according to the present embodiment. The mounting method includes steps S1 to S9 shown in fig. 9.

First, the control unit 5 controls the mounting head 2 and the driving unit 4 to cause the capturing unit 21 to capture the component T10 of the component supply port 63a (capturing step S1).

Next, the control unit 5 controls the driving unit 4 to move the mounting head 2 in the X-axis direction and the Y-axis direction, thereby moving the capturing unit 21 to a position above the predetermined mounting position P1 (moving step S2). Specifically, the control section 5 linearly advances the mounting head 2 in the X-axis direction by the X-axis driving section 41, and linearly advances the mounting head 2 in the Y-axis direction by the Y-axis driving section 42. At this time, the control section 5 moves the mounting head 2 in the X-axis direction and the Y-axis direction so that the XY coordinates of the component T10 captured by the capturing section 21 coincide with the XY coordinates of the predetermined mounting position P1. The XY coordinates of the member T10 correspond to the XY coordinates of the center of the member T10 in a plan view as viewed from the Z-axis direction.

As shown in a of fig. 8, when the mounting head 2 reaches a position where the XY coordinates of the member T10 coincide with the XY coordinates of the predetermined mounting position P1, the capturing section 21 descends from the top dead center U2 to the bottom dead center U1. Then, the control unit 5 activates the imaging unit 3, and the imaging unit 3 performs imaging of the imaging region R1 in the middle of the capturing unit 21 going from the top dead center U2 to the bottom dead center U1 (imaging step S3). In the present embodiment, the lower end of the capturing section 21 located at a position opposed to the predetermined mounting position P1, a part of the component T10 captured by the capturing section 21, and a part of the mounted component T3 adjacent to the predetermined mounting position P1 are included in the captured image of the image capturing section 3.

The imaging timing of the imaging unit 3 in the imaging step S3 may be when the capturing unit 21 is located at the top dead center U2. In this case, the image captured by the image capturing unit 3 includes at least a part of the mounted component T3 adjacent to the predetermined mounting position P1.

The imaging timing of the imaging unit 3 in the imaging step S3 may be before the mounting head 2 reaches a position where the XY coordinates of the component T10 match the XY coordinates of the predetermined mounting position P1. In this case, the image captured by the image capturing unit 3 includes at least a part of the mounted component T3 adjacent to the predetermined mounting position P1.

Next, the control unit 5 performs correction processing of XY coordinates of the predetermined mounting position P1 based on the captured image of the imaging region R1 of the imaging unit 3, the entire image of the substrate T20, and the captured image of the fixed camera 7 (correction step S4). The control unit 5 measures the dimensional deviation of the substrate T20 from the entire image of the substrate T20, and corrects the XY coordinates of the predetermined mounting position P1 based on the dimensional deviation of the substrate T20. The control unit 5 corrects the XY coordinates of the predetermined mounting position P1 based on the amount of deviation from the amount of deviation of the captured image measuring member T10 of the fixed camera 7 from the center of the capturing unit 21. Further, the control unit 5 determines an intrusion state of the mounted component T3 into the predetermined mounting region Q1 based on the image captured by the image capturing unit 3, and corrects the XY coordinates of the predetermined mounting position P1 in accordance with the intrusion state. The intrusion state of the mounted member T3 corresponds to a state in which the Y-axis direction end of the mounted member T3 is offset toward the predetermined mounting position P1 from the Y-axis direction end of the mounted member T3 disposed at the reference position.

When the correction step S4 is completed, the control unit 5 predicts the gap size Yg between the component T10 and the mounted component T3 adjacent to the component T10 when the component T10 is mounted on the mounting surface T21 using the corrected predetermined mounting position P1. The control unit 5 determines whether or not the predicted value of the gap size Yg is equal to or greater than a predetermined control threshold (determination step S5 of 1). The control threshold is, for example, the sum of the dimensional tolerance of the component T10 and the installation deviation value (installation accuracy). When the control unit 5 determines that the predicted value of the gap size Yg is equal to or greater than the control threshold, the falling speed of the capturing unit 21 is set to the normal speed. Then, the control unit 5 controls the movement of the capturing unit 21 so that the capturing unit 21 descends at a normal speed to the corrected predetermined mounting position P1, and the component T10 captured by the capturing unit 21 is mounted at the corrected predetermined mounting position P1 (normal mounting step S6). This normal speed is faster than a safety speed described later, and the time required for mounting the component T10 can be shortened. After the component T10 is mounted at the corrected predetermined mounting position P1, the control unit 5 sets the capturing unit 21 to the released state, lifts the capturing unit 21, and carries out the process of the capturing step S1 again for the next component T10.

In the 1 st determination step S5, if the control unit 5 determines that the predicted value of the gap size Yg is smaller than the control threshold, it determines whether or not the component T10 can be mounted at the corrected predetermined mounting position P1 by changing the driving parameters of the capturing unit 21 (the 2 nd determination step S7). Here, the driving parameter to be changed is, for example, the lowering speed of the capturing section 21, and the control section 5 determines whether or not the component T10 can be mounted at the corrected predetermined mounting position P1 by making the lowering speed of the capturing section 21 slower than the normal speed.

When the control unit 5 determines that the component T10 can be mounted at the corrected predetermined mounting position P1 by making the descent speed of the capturing unit 21 slower than the normal speed, the descent speed of the capturing unit 21 is set to a safe speed slower than the normal speed. That is, if the control unit 5 predicts that the gap dimension Yg, which is the dimension of the gap between the component T10 mounted at the corrected predetermined mounting position P1 and the mounted component T3, is less than the control threshold value and equal to or greater than the suspension threshold value, the lowering speed of the capturing unit 21 is reduced as compared with the case where the gap dimension Yg is equal to or greater than the control threshold value. Then, the control unit 5 controls the movement of the capturing unit 21 so that the capturing unit 21 descends at a safe speed to the corrected predetermined mounting position P1, and the component T10 captured by the capturing unit 21 is mounted at the corrected predetermined mounting position P1 (safe mounting step S8). The safety speed is a speed slower than the normal speed, and can suppress the vibration of the descending member T10. Therefore, even if the predicted value of the gap dimension Yg is less than the control threshold, the control unit 5 can reduce the possibility that the component T10 interferes with the adjacent mounted component T3, and can mount the component T10 at the corrected predetermined mounting position P1. After the component T10 is mounted at the corrected predetermined mounting position P1, the control unit 5 sets the capturing unit 21 to the released state, lifts the capturing unit 21, and carries out the process of the capturing step S1 again for the next component T10.

In the 2 nd determination step S7, if the control unit 5 determines that the component T10 cannot be mounted at the corrected predetermined mounting position P1 even if the falling speed of the capturing unit 21 is slower than the normal speed, the mounting of the component T10 is stopped (suspension step S9). That is, if the control unit 5 predicts that the gap dimension Yg, which is the dimension of the gap between the component T10 mounted at the corrected predetermined mounting position P1 and the mounted component T3, is smaller than the suspension threshold value, the mounting of the component T10 on the board T20 is suspended. Therefore, the component T10 can be prevented from interfering with the adjacent mounted component T3. In the suspension step S9, the control unit 5 skips the current mounting of the component T10, and performs the process of the capturing step S1 again for the next component T10. Alternatively, the control unit 5 may use at least one of the sound and the display to report an error. Alternatively, the control unit 5 may control the transport device 62 to discharge the substrate T20 from the mounting space and transport the next substrate T20 into the mounting space.

In the 2 nd determination step S7, the control unit 5 may control the standby time, which is the length of time that the capturing unit 21 stops at a position facing the predetermined mounting position P1. In this case, if the control unit 5 predicts that the gap size Yg between the component T10 mounted at the corrected predetermined mounting position P1 and the mounted component T3 is smaller than the control threshold value, the standby time is prolonged more than when the gap size Yg is equal to or larger than the control threshold value.

Specifically, in the 2 nd determination step S7, the driving parameter of the capturing unit 21 to be changed is a standby time at the top dead center U2, which is a time when the capturing unit 21 reaches above the predetermined mounting position P1 and stands by at the top dead center U2, in addition to the lowering speed of the capturing unit 21. By extending the standby time, the vibration of the component T10 can be further attenuated. When the control unit 5 determines that the predicted value of the gap size Yg is less than the control threshold, it further attenuates the vibration of the component T10 by further extending the standby time, and compares the predicted value of the gap size Yg with the control threshold again after the vibration of the component T10 is sufficiently attenuated. Therefore, the control unit 5 can suppress the contact or interference of the component T10 with the mounted component T3 due to the vibration of the component T10.

(4) Correction of

In the correction step S4, the control unit 5 determines an intrusion state of the mounted component T3 into the predetermined mounting area Q1 based on the image captured by the image capturing unit 3, and corrects the predetermined mounting position P1 in accordance with the intrusion state. The image of the image pickup unit 3 used for correcting the predetermined mounting position P1 includes both the component T10 and the mounted component T3 captured by the capturing unit 21 located at a position opposed to the predetermined mounting position P1.

The correction of the predetermined mounting position P1 will be described below with reference to fig. 10 to 13. In addition, "correction scheduled mounting position P1" refers to XY coordinates of the correction scheduled mounting position P1. Further, the predetermined mounting position (initial value of the predetermined mounting position) P1 before correction is sometimes characterized as P1 (1), and the predetermined mounting position P1 after correction is sometimes characterized as P1 (2).

(4.1) 1 st correction example

Preferably, if at least 1 mounted component T3 is mounted in one region but not the other region among 2 regions adjacent to the predetermined mounting position P1 in the substrate T20, the control section 5 corrects the predetermined mounting position P1 to form a gap between the component T10 and the at least 1 mounted component T3.

In fig. 10, 3 pads T22 are formed on the mounting surface T21 in an aligned manner along the Y-axis direction. A mounted component T34 is mounted as a mounted component T3 on the pad T22 located at one end side in the Y axis direction. The mounted component T3 is not mounted on the pad T22 located in the middle in the Y-axis direction and the pad T22 located on the other end side in the Y-axis direction. The component T10 is mounted on the pad T22 in the middle of the mounting system 1.

In this case, the control unit 5 predicts the gap size Yg3 of the gap G3 generated between the component T10 and the mounted component T33 when the component T10 is mounted at the current predetermined mounting position P1 (1) based on the image captured by the image capturing unit 3. The predetermined mounting position P1 (1) is an initial value of the predetermined mounting position P1, and is the predetermined mounting position P1 before correction. Then, the control unit 5 compares the predicted value of the gap size Yg3 with the correction threshold Ya. The correction threshold Ya is the sum of the dimensional tolerance of the component T10 and the mounting deviation value. For example, if the one-side tolerance Yt of the component T10 is +5 μm and the mounting deviation value Ym is 20 μm, the correction threshold Ya is 25 μm.

If the predicted value of the gap size Yg3 is equal to or greater than the correction threshold Ya, the control unit 5 sets the possibility of disturbance to be low, and does not correct the scheduled installation position P1 (1) as shown in fig. 10.

If the predicted value of the gap dimension Yg3 is smaller than the correction threshold Ya, the control unit 5 sets the possibility of interference to correct the predetermined mounting position P1 so that the gap dimension Yg3 becomes equal to or larger than the correction threshold Ya. For example, as shown in fig. 11, the mounted component T33 is set to be close to the predetermined mounting position P1 (1) of the component T10 so as to deviate from the mounting deviation value Ym in the Y-axis direction. In fig. 11, the gap dimension Yg3 when the component T10 is mounted at the predetermined mounting position P1 (1) is set to Yg3 (1). In this case, the control section 5 corrects the predetermined mounting position P1 from P1 (1) to P1 (2) so that the gap size Yg3 coincides with the correction threshold Ya. The predetermined mounting position P1 (2) is the corrected predetermined mounting position P1, and is farther from the mounted component T33 than the predetermined mounting position P1 (1) in the Y-axis direction. In fig. 11, the gap size Yg3 when the component T10 is mounted at the predetermined mounting position P1 (2) is set to Yg3 (2), and Yg3 (2) =ya. In addition, the predetermined mounting position P1 (2) is the corrected predetermined mounting position P1. By correcting the predetermined mounting position P1 from P1 (1) to P1 (2), the gap dimension Yg3 generated between the mounted component T10 and the mounted component T33 can be set to be equal to or greater than the correction threshold Ya. Therefore, interference between the component T10 and the mounted component T33 can be suppressed.

(4.2) 2 nd correction example

Preferably, when the plurality of mounted components T3 are mounted adjacent to the predetermined mounting position P1 on the board T20, the control unit 5 corrects the predetermined mounting position P1 so that a gap is formed between the component T10 and each of the plurality of mounted components T3.

In particular, it is preferable that, when the plurality of mounted components T3 are mounted adjacent to the predetermined mounting position P1 on the board T20, the control unit 5 corrects the predetermined mounting position P1 so that the dimensions of the respective gaps between the component T10 and the plurality of mounted components T3 are the same. If the dimensions of the respective gaps are within an error based on the mounting accuracy of the mounting system 1, it can be regarded as "the dimensions of the respective gaps are the same".

In fig. 12, 3 pads T22 are formed on the mounting surface T21 in an aligned manner along the Y-axis direction. A mounted component T34 is mounted as a mounted component T3 on the pad T22 located at one end side in the Y axis direction. A mounted component T35 is mounted as a mounted component T3 on the pad T22 located on the other end side in the Y axis direction. The mounted component T3 is not mounted on the pad T22 located at the center in the Y-axis direction. The component T10 is mounted on the pad T22 in the middle of the mounting system 1.

In this case, the control unit 5 corrects the predetermined mounting position P1 to the same value as the gap dimension Yg4 of the gap G4 between the component T10 and the mounted component T34 and the gap dimension Yg5 of the gap G5 between the component T10 and the mounted component T35 based on the image captured by the image capturing unit 3.

For example, as shown in fig. 13, when the mounted members T34, T35 are each deviated from the mounting deviation value Ym at one end side in the Y axis direction, the mounted member T34 is away from the current predetermined mounting position P1 (1), and the mounted member T35 is close to the current predetermined mounting position P1 (1). At this time, when the component T10 is mounted at the current predetermined mounting position P1 (1), the component T10 is closer to the mounted component T35 than the mounted component T34.

Therefore, the control unit 5 corrects the predetermined mounting position P1 so that the gap size Yg4 of the gap G4 generated between the component T10 and the mounted component T34 is identical to the gap size Yg5 of the gap G5 generated between the component T10 and the mounted component T35. In fig. 13, the predetermined mounting position P1 is corrected from P1 (1) to P1 (2). The predetermined mounting position P1 (1) is an initial value of the predetermined mounting position P1, and is the predetermined mounting position P1 before correction. The predetermined mounting position P1 (2) is the corrected predetermined mounting position P1, and is farther from the mounted component T35 than the predetermined mounting position P1 (1) in the Y-axis direction. By correcting the predetermined mounting position P1 from P1 (1) to P1 (2), the gap sizes Yg4 and Yg5 generated between the mounted component T10 and the mounted components T34 and T35 can be made the same. Therefore, interference between the component T10 and the mounted components T34 and T35 can be suppressed.

For example, in fig. 13, when the component T10 is mounted at the predetermined mounting position P1 (1) before correction, the gap size Yg50 generated between the component T10 and the mounted component T35 becomes larger than the gap size Yg40 generated between the component T10 and the mounted component T34. Specifically, if the adjacent pitch Yp is set to 40 μm, the one-side tolerance Yt is set to +5 μm, and the mounting deviation value Ym is set to 20 μm, the gap dimension Yg40 becomes 50 μm, and the gap dimension Yg50 becomes 10 μm.

On the other hand, when the component T1 is mounted at the corrected predetermined mounting position P1 (2), the gap size Yg5 generated between the component T10 and the mounted component T35 is the same as the gap size Yg4 generated between the component T10 and the mounted component T34. Specifically, if the adjacent pitch Yp is set to 40 μm, the one-side tolerance Yt is set to +5 μm, and the mounting deviation value Ym is set to 20 μm, the gap dimension Yg4 becomes 30 μm, and the gap dimension Yg50 becomes 30 μm.

(4.3) 3 rd correction example

In the above-described correction example 2, if the plurality of mounted components T3 are mounted adjacent to the predetermined mounting position P1 on the board T20, the control unit 5 may correct the predetermined mounting position P1 so that the dimensions of the gaps between the component T10 and the plurality of mounted components T3 are different from each other. That is, in fig. 13, the control unit 5 corrects the predetermined mounting position P1 so that the gap size Yg5 generated between the component T10 and the mounted component T35 and the gap size Yg4 generated between the component T10 and the mounted component T34 are different from each other.

(5) Installation suspension

The suspension step S9 described above will be described with reference to fig. 14.

In fig. 14, 3 pads T22 are formed on the mounting surface T21 in an aligned manner along the Y-axis direction. A mounted component T34 is mounted as a mounted component T3 on the pad T22 located at one end side in the Y axis direction. A mounted component T35 is mounted as a mounted component T3 on the pad T22 located on the other end side in the Y axis direction. The mounted component T3 is not mounted on the pad T22 located at the center in the Y-axis direction. The component T10 is mounted on the pad T22 in the middle of the mounting system 1.

In fig. 14, the mounted member T34 and the mounted member T35 are each offset from each other by the mounting offset value Ym in the direction approaching each other in the Y-axis direction. Therefore, the interval between the mounted member T34 and the mounted member T35 becomes narrower in the Y-axis direction. In this case, the control unit 5 corrects the predetermined mounting position P1 so that the gap dimension Yg4 of the gap G4 between the component T10 and the mounted component T34 and the gap dimension Yg5 of the gap G5 between the component T10 and the mounted component T35 become equal to each other based on the image captured by the image capturing unit 3.

However, since the distance between the mounted member T34 and the mounted member T35 is narrow, the gap sizes Yg4 and Yg5 are not smaller than the predetermined stop threshold value even when the corrected predetermined mounting position P1 is used. Specifically, if the adjacent pitch Yp is set to 40 μm, the one-side tolerance Yt is set to +5 μm, and the mounting deviation value Ym is set to 20 μm, the gap sizes Yg4 and Yg5 are set to 10 μm, respectively. Here, if the pause threshold is set to 11 μm, the gap sizes Yg4 and Yg5 are smaller than the pause threshold, respectively. Therefore, the control unit 5 determines that the component T10 cannot be mounted at the corrected predetermined mounting position P1 even if the lowering speed of the capturing unit 21 is slower than the normal speed, and stops the mounting of the component T10.

(6) Modification examples

(6.1) example 1 of image pickup section

Fig. 15 shows a modification 1 of the imaging unit 3. The imaging unit 3 is mounted on the lower end of the bracket 240. The upper end of the bracket 240 is mounted to the head main body 23. In this way, the imaging unit 3 is mounted on the mounting head 2, and the mounting head 2 and the imaging unit 3 move simultaneously.

The imaging unit 3 in fig. 15 includes 2 moving cameras 3a and 3b that move together with the mounting head 2. The moving camera 3a is mounted to the mounting piece 240a of the bracket 240, and the moving camera 3b is mounted to the mounting piece 240b of the bracket 240. The mounting piece 240a extends in the X-axis direction, and the mounting piece 240b extends in the Y-axis direction.

The moving camera 3a has an imaging optical axis Ax1 extending in the Y-axis direction in a plan view as viewed from the Z-axis direction. The imaging optical axis Ax1 is inclined with respect to a perpendicular line (a straight line along the Z axis) to the mounting surface T21 of the substrate T20. That is, the camera 3a is moved to be fixed to the mount piece 240a in such a posture that the imaging optical axis Ax1 is inclined with respect to the perpendicular line of the mount surface T21.

The moving camera 3b has an imaging optical axis Ax2 extending in the X-axis direction in a plan view as viewed from the Z-axis direction. The imaging optical axis Ax2 is inclined with respect to a perpendicular line (a straight line along the Z axis) to the mounting surface T21 of the substrate T20. That is, the camera 3b is moved to be fixed to the mounting piece 240b in such a posture that the imaging optical axis Ax2 is inclined with respect to the perpendicular line of the mounting surface T21.

The imaging optical axis Axl of the moving camera 3a and the imaging optical axis Ax2 of the moving camera 3b are orthogonal to each other in a plan view as viewed from the Z-axis direction, and intersect at a point on the mounting surface T21. The imaging region R1 of the moving camera 3a and the imaging region R2 of the moving camera 3b are each a region including the bottom dead center U1 located immediately below the capturing section 21 in a state where the capturing section 21 is located on the mounting surface T21. When the capturing unit 21 is located on the mounting surface T21, the imaging regions R1 and R2 include not only the predetermined mounting region Q1 of the component T10 but also at least a part of the mounted component T3 mounted adjacent to the predetermined mounting region Q1.

Then, the control unit 5 determines an intrusion state of the mounted component T3 into the predetermined mounting area Q1 based on the image captured by the moving camera 3a and the image captured by the moving camera 3b, and corrects the predetermined mounting position P1 in accordance with the intrusion state.

(6.2) example 2 of image pickup section

Fig. 16 shows a modification 2 of the imaging unit 3. The imaging unit 3 is mounted on the lower surface of the head main body 23. That is, the imaging unit 3 is mounted on the mounting head 2, and the mounting head 2 and the imaging unit 3 move simultaneously.

The imaging unit 3 in fig. 16 includes 2 moving cameras 3c and 3d. The moving cameras 3c and 3d are so-called stereo cameras arranged in the Y-axis direction. The imaging area of the moving camera 3c and the imaging area of the moving camera 3d are each an area including the bottom dead center U1 located immediately below the capturing section 21 in a state where the capturing section 21 is located on the mounting surface T21. When the capturing unit 21 is located on the mounting surface T21, each imaging region includes not only the predetermined mounting region Q1 of the component T10 but also at least a part of the mounted component T3 mounted adjacent to the predetermined mounting region Q1.

Then, the control unit 5 determines an intrusion state of the mounted component T3 into the predetermined mounting area Q1 based on the image captured by the moving camera 3c and the image captured by the moving camera 3d, and corrects the predetermined mounting position P1 in accordance with the intrusion state.

(7) Other modifications

The image captured by the image capturing unit 3 may include at least one of the component T10 captured by the capturing unit 21 and the mounted component T3 at the front end (lower end) of the capturing unit 21.

For example, the lower end (front end) of the capturing section 21 may be photographed in the photographed image of the photographing section 3 without photographing the component T10 captured by the capturing section 21. In this case, the control unit 5 obtains the deviation of the component T10 from the capturing unit 21 based on the captured image of the fixed camera 7. Then, the control unit 5 can calculate the position of the component T10 by reflecting the deviation of the component T10 in the position of the capturing unit 21. As a result, the control unit 5 can predict the gap size Yg between the component T10 and the mounted component T3 adjacent to the component T10.

The configurations described in the above embodiments and modifications can be combined and used as appropriate.

The position of the catch portion 21 facing the 2 nd object T2 such as the substrate T20 is not limited to the configuration facing in the vertical direction along the Z axis. That is, the position of the capturing section 21 facing the 2 nd object T2 such as the substrate T20 may be other structure such as a structure facing in the horizontal direction.

(8) Summary

The mounting system (1) according to embodiment 1 includes a mounting head (2), an imaging unit (3), a driving unit (4), and a control unit (5). The mounting head (2) has a capturing section (21) capable of capturing the 1 st object (T1) so as to be movable toward the 2 nd object (T2), and mounts the 1 st object (T1) at a predetermined mounting position (P1) on the mounting surface (T21) of the 2 nd object (T2). The imaging unit (3) is provided in the mounting head (2) and images the imaging areas (R1, R2) including at least one of the front end (lower end) of the capturing unit (21) and the area facing the capturing unit (21) in the moving direction (downward direction) of the capturing unit (21), and the driving unit (4) moves the mounting head (2) by driving the mounting head (2), the control unit (5) controls the driving unit (4) and the mounting head (2) so that the capturing unit (21) can mount the 1 st object (T1) at the predetermined mounting position (P1), and the control unit (5) determines the intrusion state of at least 1 mounted component (T3) that has been mounted on the 2 nd object (T2) to the predetermined mounting area (Q1) including the predetermined mounting position (P1) based on the imaging result of the imaging unit (3), and corrects the predetermined mounting position (P1) in correspondence with the intrusion state.

The above-described mounting system (1) can shorten the time required for mounting to thereby improve productivity.

In the mounting system (1) according to claim 2 of the present embodiment, in the 2 nd object (T2), preferably, if at least 1 mounted component (T3) is mounted in one region but not in another region among 2 regions adjacent to the predetermined mounting position (P1), the control unit (5) corrects the predetermined mounting position (P1) so that gaps (G3 to G5) are formed between the 1 st object (T1) and the at least 1 mounted component (T3).

The above-described mounting system (1) can reduce the possibility that the 1 st object (T1) interferes with the adjacent mounted component (T3).

In the mounting system (1) according to claim 3, a plurality of mounted components (T3) are provided in addition to claim 1. Preferably, if the plurality of mounted members (T3) are mounted adjacent to the predetermined mounting position (P1) in the object (T2) of the 2 nd, the control unit (5) corrects the predetermined mounting position (P1) so that gaps (G4, G5) are formed between the object (T1) of the 1 st and each of the plurality of mounted members (T3).

In the mounting system (1) according to the 4 th aspect of the embodiment, in the 3 rd aspect, if the plurality of mounted members (T3) are mounted adjacent to the predetermined mounting position (P1) in the 2 nd object (T2), the control unit (5) corrects the predetermined mounting position (P1) so that the dimensions (Yg 4, yg 5) of the respective gaps (G4, yg 5) between the 1 st object (T1) and the plurality of mounted members (T3) become the same.

In the above-described mounting system (1), the dimensions (Yg 4, yg 5) of the gaps (G4, G5) between the 1 st object (T1) and each of the plurality of mounted components (T3) are made identical, so that the possibility that the 1 st object (T1) interferes with the adjacent mounted components (T3) can be reduced.

In the mounting system (1) according to claim 5 of the embodiment, in claim 3, if the plurality of mounted members (T3) are mounted adjacent to the predetermined mounting position (P1) in the object (T2) of claim 2, the control unit (5) corrects the predetermined mounting position (P1) so that the dimensions (Yg 4, yg 5) of the gaps (G4, yg 5) between the object (T1) of claim 1 and the plurality of mounted members (T3) are different from each other.

In the above-described mounting system (1), even if the dimensions (Yg 4, yg 5) of the gaps (G4, G5) between the 1 st object (T1) and each of the plurality of mounted components (T3) are made different from each other, the possibility that the 1 st object (T1) interferes with the adjacent mounted components (T3) can be reduced.

In the mounting system (1) according to claim 6 of the present embodiment, in any one of claims 1 to 5, it is preferable that the imaging result of the imaging unit (3) includes at least one of the capturing unit (21) and the 1 st object (T1) captured by the capturing unit (21) and at least 1 mounted component (T3). The control unit (5) determines the intrusion state based on the dimensions of the gaps (G3-G5) between the 1 st object (T1) and at least 1 mounted component (T3) obtained from the imaging result. When the dimensions (Yg 3-Yg 5) of the gaps (G3-G5) are less than the correction threshold, the control unit (5) corrects the predetermined mounting position (P1) to the dimensions (Yg 3-Yg 5) of the gaps (G3-G5) to be greater than the correction threshold.

In the above-described mounting system (1), the possibility that the 1 st object (T1) interferes with the adjacent mounted component (T3) can be reduced by setting the dimensions (Yg 3 to Yg 5) of the gaps (G3 to G5) to be equal to or greater than the correction threshold value.

In the mounting system (1) according to claim 7 of the present embodiment, in any one of claims 1 to 6, preferably, the control unit (5) controls the movement speed of the capturing unit (21), and if the size (Yg 3 to Yg 5) of the gap (G3 to G5) between the 1 st object (T1) and at least 1 mounted component (T3) predicted to be mounted at the corrected predetermined mounting position (P1) is less than the control threshold, the movement speed of the capturing unit (21) is reduced as compared with the size (Yg 3 to Yg 5) of the gap (G3 to G5) being equal to or greater than the control threshold.

In the mounting system (1) according to claim 8 of the present embodiment, in any one of claims 1 to 7, preferably, the control unit (5) controls the standby time, which is the length of time that the capturing unit (21) stops at a position opposed to the predetermined mounting position (P1), and when the size (Yg 3 to Yg 5) of the gap (G3 to G5) predicted to be mounted between the 1 st object (T1) and at least 1 mounted member (T3) is less than the control threshold, the standby time is longer than the size (Yg 3 to Yg 5) of (G3 to G5) by the control threshold or more.

In the mounting system (1) according to claim 9 of the present embodiment, in any one of claims 1 to 8, the control unit (5) preferably stops the mounting of the 1 st object (T1) to the 2 nd object (T2) if it is predicted that the 1 st object (T1) mounted at the corrected predetermined mounting position (P1 (2)) interferes with at least 1 mounted component (T3).

The mounting system (1) can prevent the situation that the 1 st object (T1) interferes with the adjacent mounted component (T3).

In the mounting system (1) according to claim 10 of the present embodiment, in any one of claims 1 to 9, the imaging region preferably includes a bottom dead center (U1) that is a lower limit position of the capturing section (21).

The above-described mounting system (1) can reduce the possibility that the lowered 1 st object (T1) will interfere with the mounted component (T3).

The mounting method according to embodiment 11 is a mounting method performed by a mounting system (1) including a mounting head (2), an imaging unit (3), a driving unit (4), and a control unit (5). The mounting head (2) has a capturing section (21) capable of capturing the 1 st object (T1) so as to be movable toward the 2 nd object (T2), and mounts the 1 st object (T1) at a predetermined mounting position (P1) on the mounting surface (T21) of the 2 nd object (T2). The imaging unit (3) is provided to the mounting head (2). The driving unit (4) drives the mounting head (2) to move the mounting head (2). The control unit (5) controls the drive unit (4) and the mounting head (2) so that the capture unit (21) can mount the 1 st object (T1) at a predetermined mounting position (P1). The mounting method includes an imaging step (S3) and a correction step (S4). In the imaging step (S3), the imaging unit (3) images the imaging regions (R1, R2) including at least one of the front end (lower end) of the capturing unit (21) and the region facing the capturing unit (21) in the moving direction (downward direction) of the capturing unit (21). In the correction step (S4), the control unit (5) determines, based on the imaging result of the imaging unit (3), the intrusion state of at least 1 mounted component (T3) that has been mounted on the 2 nd object (T2) into a predetermined mounting area (Q1) containing a predetermined mounting position (P1), and corrects the predetermined mounting position (P1) in accordance with the intrusion state.

The above-described mounting method can shorten the time required for mounting and thus improve productivity.

Description of the reference numerals

1 mounting System

2 mounting head

21 capturing part

3 image pickup unit

4 drive part

5 control part

G3-G5 gap

P1 predetermined mounting position

Q1 predetermined mounting area

R1, R2 imaging region

T1 st object

T2 object 2

T21 mounting surface

T3 mounted component

U1 bottom dead center (limit position)

Yg3 to Yg5 gap size

S3 image pickup step

S4, correcting.

Claims

1. A mounting system is provided with:

a mounting head having a capturing section capable of capturing a 1 st object so as to be movable toward a 2 nd object, the 1 st object being mounted at a predetermined mounting position on a mounting surface of the 2 nd object;

an imaging unit provided in the mounting head and imaging an imaging area including at least one of a front end of the capturing unit and an area facing the capturing unit in a moving direction of the capturing unit;

a driving unit that drives the mounting head to move the mounting head; and

a control unit that controls the driving unit and the mounting head so that the capturing unit can mount the 1 st object at the predetermined mounting position,

the control unit determines an intrusion state of at least 1 mounted component mounted on the 2 nd object into a predetermined mounting area including the predetermined mounting position based on an imaging result of the imaging unit, and corrects the predetermined mounting position in accordance with the intrusion state.

2. The mounting system of claim 1, wherein,

if the at least 1 mounted component is mounted in one region but not the other region among the 2 regions adjacent to the predetermined mounting position in the 2 nd object, the control section corrects the predetermined mounting position so that a gap is formed between the 1 st object and the at least 1 mounted component.

3. The mounting system of claim 1, wherein,

the number of the installed parts is plural,

when the plurality of mounted members are mounted adjacent to the predetermined mounting position in the 2 nd object, the control unit corrects the predetermined mounting position so that a gap is formed between the 1 st object and each of the plurality of mounted members.

4. The mounting system of claim 3, wherein,

when the plurality of mounted members are mounted adjacent to the predetermined mounting position in the 2 nd object, the control unit corrects the predetermined mounting position so that the dimensions of the gaps between the 1 st object and the plurality of mounted members are the same.

5. The mounting system of claim 3, wherein,

When the plurality of mounted members are mounted adjacent to the predetermined mounting position in the 2 nd object, the control unit corrects the predetermined mounting position so that the dimensions of the gaps between the 1 st object and the plurality of mounted members are different from each other.

6. The mounting system of any one of claims 1-5, wherein,

the imaging result of the imaging unit includes at least one of the capturing unit and the 1 st object captured by the capturing unit and the at least 1 mounted component,

the control unit determines the intrusion state based on the size of the gap between the 1 st object and the at least 1 mounted component obtained from the imaging result, and corrects the predetermined mounting position so that the size of the gap becomes equal to or larger than the correction threshold if the size of the gap is smaller than the correction threshold.

7. The mounting system of any one of claims 1-6, wherein,

the control unit controls the movement speed of the capturing unit, and if it is predicted that the size of the gap between the 1 st object mounted at the corrected predetermined mounting position and the at least 1 mounted component is less than a control threshold, the movement speed of the capturing unit is reduced as compared with the case where the size of the gap is equal to or greater than the control threshold.

8. The mounting system of any one of claims 1-7, wherein,

the control unit controls a standby time, which is a length of time that the capturing unit stops at a position facing the predetermined mounting position, and extends the standby time when a gap between the 1 st object mounted at the corrected predetermined mounting position and the at least 1 mounted component is predicted to be smaller than a control threshold value than when the gap is equal to or larger than the control threshold value.

9. The mounting system of any one of claims 1-8, wherein,

the control unit is configured to stop the mounting of the 1 st object to the 2 nd object if it is predicted that the 1 st object mounted at the corrected predetermined mounting position interferes with the at least 1 mounted component.

10. The mounting system according to any one of claims 1-9, wherein,

the image pickup region includes a bottom dead center that is a lower limit position of the capturing section.

11. An installation method is an installation method executed by an installation system including:

An imaging unit provided on the mounting head;

a driving unit that drives the mounting head to move the mounting head; and

the installation method comprises the following steps:

an imaging step of imaging an imaging region including at least one of a tip of the capturing section and a region facing the capturing section in a moving direction of the capturing section; and

and a correction step of determining an intrusion state of at least 1 mounted component mounted on the 2 nd object into a predetermined mounting area including the predetermined mounting position based on an imaging result of the imaging unit, and correcting the predetermined mounting position in accordance with the intrusion state.