CN116851478A - Preparation method of high-purity oxygen-free copper rotary target, preparation device thereof, target and application - Google Patents
Preparation method of high-purity oxygen-free copper rotary target, preparation device thereof, target and application Download PDFInfo
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- CN116851478A CN116851478A CN202310792971.3A CN202310792971A CN116851478A CN 116851478 A CN116851478 A CN 116851478A CN 202310792971 A CN202310792971 A CN 202310792971A CN 116851478 A CN116851478 A CN 116851478A
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- free copper
- purity oxygen
- extrusion die
- rotary target
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 86
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 86
- 239000010949 copper Substances 0.000 title claims abstract description 86
- 238000002360 preparation method Methods 0.000 title claims abstract description 20
- 238000001125 extrusion Methods 0.000 claims abstract description 49
- 239000000463 material Substances 0.000 claims abstract description 47
- 238000000034 method Methods 0.000 claims abstract description 23
- 238000001816 cooling Methods 0.000 claims abstract description 13
- 230000009471 action Effects 0.000 claims abstract description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 21
- 239000001301 oxygen Substances 0.000 claims description 21
- 229910052760 oxygen Inorganic materials 0.000 claims description 21
- 230000007246 mechanism Effects 0.000 claims description 20
- 230000005540 biological transmission Effects 0.000 claims description 17
- 239000013077 target material Substances 0.000 claims description 15
- 230000000903 blocking effect Effects 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 abstract description 4
- 238000007254 oxidation reaction Methods 0.000 abstract description 4
- 230000009467 reduction Effects 0.000 abstract description 3
- 239000000203 mixture Substances 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 16
- 230000008569 process Effects 0.000 description 12
- 230000004048 modification Effects 0.000 description 8
- 238000012986 modification Methods 0.000 description 8
- 238000001514 detection method Methods 0.000 description 5
- 239000013078 crystal Substances 0.000 description 3
- 238000005266 casting Methods 0.000 description 2
- 238000001036 glow-discharge mass spectrometry Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000006798 recombination Effects 0.000 description 2
- 238000005215 recombination Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000009489 vacuum treatment Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 238000003723 Smelting Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000921 elemental analysis Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
- 239000002912 waste gas Substances 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C23/00—Extruding metal; Impact extrusion
- B21C23/02—Making uncoated products
- B21C23/04—Making uncoated products by direct extrusion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C25/00—Profiling tools for metal extruding
- B21C25/02—Dies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C29/00—Cooling or heating work or parts of the extrusion press; Gas treatment of work
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention relates to the technical field of high-purity oxygen-free copper, in particular to a preparation method of a high-purity oxygen-free copper rotary target, a preparation device, a target and application thereof, and the method comprises the following steps: placing high-purity oxygen-free copper material into an extrusion die, performing multi-rotation angle extrusion on the high-purity oxygen-free copper material in the extrusion die, then entering a shape die, and finally cooling; the high-purity oxygen-free copper material is in a semi-molten state under the action of the extrusion die, and enters the shape die in the semi-molten state. Through cold processing mode, the material composition is not changed, so that the product quality reduction caused by high-temperature oxidation is avoided.
Description
Technical Field
The invention relates to the technical field of high-purity oxygen-free copper, in particular to a preparation method of a high-purity oxygen-free copper rotary target, a preparation device, a target and application thereof.
Background
The high-purity copper anaerobic sputtering target is a key material for preparing a surface electronic film, and the high-purity copper target is mainly manufactured by adopting a hot working (casting) method at present, firstly smelting a high-purity copper raw material into a molten liquid, vertically placing a lining pipe in the center of a mould, casting the molten liquid into the mould, cooling to form an ingot, and then machining to prepare the target. The manufacturing method has the advantages that the obtained target material has low impurity content and high density, and can be produced in a large scale; the disadvantages are coarse grains, inconsistent grain orientation, and inability to effectively control oxygen content.
At present, a target material processing mode generally adopts a thermal processing mode, oxidation is unavoidable in the manufacturing process, so that the oxygen content of a product is increased, the sputtering effect is adversely affected, even destructively affected, the crystal grain of the product is increased due to thermal processing, and the sputtering quality cannot be effectively ensured. The oxygen content of the current high-purity target material is generally 10-20 ppm, and the grain size is generally more than 100 mu m.
Disclosure of Invention
The invention aims to provide a preparation method and a preparation device of a high-purity oxygen-free copper rotary target, a target and application thereof, and solves the technical problems brought by a target hot processing form in the prior art.
The invention discloses a preparation method of a high-purity oxygen-free copper rotary target, which comprises the following steps:
placing high-purity oxygen-free copper material into an extrusion die, performing multi-rotation angle extrusion on the high-purity oxygen-free copper material in the extrusion die, then entering a shape die, and finally cooling;
the high-purity oxygen-free copper material is in a semi-molten state under the action of the extrusion die, and enters the shape die in the semi-molten state.
Working principle: when the high-purity oxygen-free copper material passes through the corners of the die cavity, coarse grains of the material are crushed, so that the grains are refined, meanwhile, the high-purity oxygen-free copper material and the die cavity generate friction, the high-purity oxygen-free copper material is in a semi-molten state by using heat generated by friction, the refined grains are subjected to grain recombination in the semi-molten state of the high-purity oxygen-free copper material, the recombined grains are consistent in orientation, and the required shape is obtained through a shape die. Through cold processing mode, the material composition is not changed, so that the product quality reduction caused by high-temperature oxidation is avoided.
Furthermore, the high-purity oxygen-free copper material is a copper rod, a copper ingot or a copper plate.
High purity copper means copper with a purity of 99.99% or more, and oxygen-free means that the content of oxygen elements in the material or the product is not more than 30ppm.
Further, the extrusion die has at least two corners.
Further, the angle of rotation is 80-100 °.
The resistance is increased due to the fact that the angle is too small, and materials are not easy to pass through; the angle is too large, and the crystal grains cannot be broken (broken), so that the grain refinement is ensured by setting the corner angle.
Furthermore, the high-purity oxygen-free copper material is driven by a driving mechanism.
Further, the high-purity oxygen-free copper material stays in the extrusion die for 3-12 min.
Further, the rotating speed of the transmission mechanism is 2.5-6.0 revolutions/min.
Further, the pressure in the extrusion die is 12-30 MPa.
Further, the temperature of the high-purity oxygen-free copper material in a semi-molten state is 600-900 ℃.
Further, the shape die is plate-shaped or tubular.
Further, a horizontal resistance is applied to the high purity oxygen free copper material exiting the shape die against its direction of movement.
The compactness of the target material is ensured by applying a horizontal resistance opposite to the movement direction of the high-purity oxygen-free copper material from the shape die.
Further, the horizontal resistance is 20-24MPa.
Further, the horizontal resistance is applied by a blocking device.
Further, the cooling is achieved by a cooling device.
Further, sawing the cooled high-purity oxygen-free copper material according to the requirement to obtain a required pipe blank.
Further, the tube blank is vacuum-treated.
The hardness of the tube blank can be increased by vacuum treatment, so that the tube blank can reach the required hardness of the target material.
Further, straightening the tube blank after the vacuum treatment.
By performing a straightening process for subsequent machining.
And further, placing the straightened pipe blank into a machine tool for treatment.
The utility model provides a high-purity oxygen-free copper rotary target preparation device, includes extrusion die, extrusion die has a plurality of corners.
Further, one side of the extrusion die is connected with a transmission mechanism, the other side of the extrusion die is connected with a shape die, an outlet of the shape die is connected with one side of a cooling device, and the other side of the cooling device is provided with a blocking device.
The high-purity oxygen-free copper rotary target is prepared by the method.
The application of the high-purity oxygen-free copper rotary target material is used in the fields of electronics, electric power, aerospace or new energy.
Compared with the prior art, the invention has the following beneficial effects:
1. the high-purity oxygen-free copper material is crushed by coarse grains when passing through corners of the die cavity, so that the grains are refined, meanwhile, friction is generated between the high-purity oxygen-free copper material and the die cavity, the high-purity oxygen-free copper material is in a semi-melting state by using heat generated by friction, the refined grains are subjected to grain recombination in the semi-melting state of the high-purity oxygen-free copper material, and the recombined grains are consistent in orientation;
2. the material components are not changed by a cold processing mode, so that the product quality reduction caused by high-temperature oxidation is avoided, the processing process is mechanical processing, no waste water and waste gas are discharged, and the environment is not influenced;
3. the grain size of the target material produced by the technology is controlled to be about 20 mu m, the oxygen content is controlled to be within 5ppm, microscopic detection is carried out, and the grains are closely arranged and are consistent in orientation.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a high purity oxygen free copper rotary target preparation apparatus according to the present invention.
In the above figures, the meaning of each symbol is: 1-extrusion die, 2-shape die, 3-transmission mechanism, 4-cooling device and 5-blocking device.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments.
In an embodiment, the purity detection method comprises: GDMS (glow discharge mass spectrometry);
the oxygen content detection method comprises the following steps: EGA (gas elemental analysis);
grain size and grain arrangement detection criteria were not: YS/T347-2020 copper and copper alloy average grain size determination method.
The utility model provides a high-purity oxygen-free copper rotary target preparation facilities, is shown as fig. 1, includes extrusion die 1, extrusion die 1 has a plurality of corners, extrusion die 1 one side is connected with drive mechanism 3, extrusion die 1 opposite side is connected with shape mould 2, shape mould 2 exit linkage has cooling device 4 one side, cooling device 4 opposite side is provided with blocking device 5.
Example 1
The preparation method of the high-purity oxygen-free copper rotary target material by adopting the device in the embodiment comprises the following steps:
the method comprises the steps of placing high-purity oxygen-free copper into an extrusion die through transmission of a transmission mechanism, wherein the high-purity oxygen-free copper is a copper rod, the cross section area of a product pipe target is set to 5000 square millimeters, the rotating speed of the transmission mechanism is 3 revolutions per minute, the high-purity oxygen-free copper is extruded at multiple angles in the extrusion die, the residence time of the high-purity oxygen-free copper in the extrusion die is about 8.0min, the extrusion die is provided with two corners, the angle of the corners is 90 degrees, the pressure in the extrusion die is 12-30 MPa, the temperature of the high-purity oxygen-free copper is 600-900 ℃ when the high-purity oxygen-free copper is in a semi-molten state, the high-purity oxygen-free copper is in the semi-molten state under the action of the extrusion die, a blocking device is arranged at the outlet of the tubular die, the blocking device is used for providing a reverse horizontal resistance to extruded pipe blanks, the size of the horizontal resistance is 22MPa, the pipe blanks are guaranteed to be compact, finally cooled, the high-purity oxygen-free copper blanks are subjected to direct sawing treatment according to requirements, the required pipe blanks are obtained after the high-purity oxygen-free copper blanks are subjected to the direct sawing treatment, and the required pipe blanks are subjected to the direct sawing treatment, and the pipe blank is subjected to the direct sawing treatment, and the vacuum straightening treatment is finished, and the pipe blank is subjected to the machine tool, and the pipe processing is subjected to the direct sawing treatment.
Detecting the tube target after the tube target processing process, and the purity: cu= 99.9981%, oxygen content of 2.2ppm, grain size of about 33 μm, microscopic examination, compact grain arrangement and consistent orientation.
Example 2
In this embodiment, as a preferred example of the present invention, the rotation speed of the transmission mechanism is 2.5 rpm, the residence time of the high-purity oxygen-free copper material in the extrusion die is about 9.0min, the pressure in the extrusion die is 22-25 MPa, and the temperature is 650-700 ℃ when the high-purity oxygen-free copper material is in a semi-molten state, and other conditions are the same as those in example 1.
Detecting the tube target after the tube target processing process, and the purity: cu= 99.9965%, oxygen content of 2.2ppm, grain size of about 32 μm, microscopic examination, compact grain arrangement and consistent orientation.
Example 3
In this embodiment, as a preferred example of the present invention, the rotation speed of the transmission mechanism is 2.5 rpm, the residence time of the high-purity oxygen-free copper material in the extrusion die is about 9.0min, the pressure in the extrusion die is 24-26 MPa, and the temperature is 680-720 ℃ when the high-purity oxygen-free copper material is in a semi-molten state, and other conditions are the same as those in example 1.
Detecting the tube target after the tube target processing process, and the purity: cu= 99.9977%, oxygen content of 2.3ppm, grain size of 28 microns, microscopic examination, compact grain arrangement and consistent orientation.
Example 4
In this embodiment, as a preferred example of the present invention, the rotation speed of the transmission mechanism is 3.0 rpm, the residence time of the high-purity oxygen-free copper material in the extrusion die is about 8.0min, the pressure in the extrusion die is 24-25 MPa, and the temperature is 650-700 ℃ when the high-purity oxygen-free copper material is in a semi-molten state, and other conditions are the same as those in example 1.
Detecting the tube target after the tube target processing process, and the purity: cu= 99.9968%, oxygen content of 2.0ppm, grain size of about 32 μm, microscopic examination, compact grain arrangement and consistent orientation.
Example 5
In this embodiment, as a preferred example of the present invention, the rotation speed of the transmission mechanism is 3.0 rpm, the residence time of the high-purity oxygen-free copper material in the extrusion die is about 8.0min, the pressure in the extrusion die is 24-26 MPa, and the temperature is 680-720 ℃ when the high-purity oxygen-free copper material is in a semi-molten state, and other conditions are the same as those in example 1.
Detecting the tube target after the tube target processing process, and the purity: cu= 99.9979%, oxygen content of 2.2ppm, grain size of about 32 μm, microscopic examination, compact grain arrangement and consistent orientation.
Example 6
In this embodiment, as a preferred example of the present invention, the difference is that the rotation speed of the transmission mechanism is 4.0 rpm, the residence time of the high purity oxygen-free copper material in the extrusion die is about 6.0min, the pressure in the extrusion die is 24-26 MPa, and the other conditions are the same as in example 1.
Detecting the tube target after the tube target processing process, and the purity: cu= 99.9972%, oxygen content of 2.2ppm, grain size of about 32 μm, microscopic examination, compact grain arrangement and consistent orientation.
Comparative example 1
In this embodiment, as a comparative example of the present invention, the modification of example 1 is only: the rotating speed of the transmission mechanism is 2.0 revolutions per minute, and the residence time of the high-purity oxygen-free copper material in the extrusion die is about 11.0 minutes.
Detecting the tube target after the tube target processing process, and the purity: cu=99.9990%, oxygen content 3.2ppm, grain size over 40 microns, microscopic examination, homogeneous grain size, less compact arrangement and homogeneous orientation.
Comparative example 2
In this embodiment, as a comparative example of the present invention, the modification of example 1 is only: the rotating speed of the transmission mechanism is 5.0 revolutions per minute, and the residence time of the high-purity oxygen-free copper material in the extrusion die is about 5.0 minutes.
Detecting the tube target after the tube target processing process, and the purity: cu= 99.9976%, oxygen content of 2.8ppm, grain size of 60 microns or more, microscopic examination, homogeneous grain size, insufficiently compact arrangement and basically consistent orientation.
Comparative example 3
In this embodiment, as a comparative example of the present invention, the modification of example 1 is only: the rotating speed of the transmission mechanism is 6.0 revolutions per minute, and the residence time of the high-purity oxygen-free copper material in the extrusion die is about 4.0 minutes.
Detecting the tube target after the tube target processing process, and the purity: cu= 99.9975%, oxygen content of 3.2ppm, grain size of over 80 microns, microscopic detection, uneven grain size, insufficiently compact grain arrangement and inconsistent orientation.
Comparative example 4
In this embodiment, as a comparative example of the present invention, the modification of example 1 is only: the rotating speed of the transmission mechanism is 8.0 revolutions per minute, and the residence time of the high-purity oxygen-free copper material in the extrusion die is about 3.0 minutes.
Detecting the tube target after the tube target processing process, and the purity: cu= 99.9973%, oxygen content of 4.8ppm, grain size of 120 microns or more, microscopic examination, occasionally layering, and non-compact grain arrangement and inconsistent orientation.
Comparative example 5
In this embodiment, as a comparative example of the present invention, the modification of example 1 is only: the number of corners is reduced to 1.
Microscopic examination of the product revealed that the grain size was inconsistent and coarse grains were included in the fine grains.
Comparative example 6
In this embodiment, as a comparative example of the present invention, the modification of example 1 is only: the number of the corners is increased to 4, the resistance of the transmission mechanism is increased, and the feeding shortage condition occurs.
Comparative example 7
In this embodiment, as a comparative example of the present invention, the modification of example 1 is only: the rotation angle is adjusted to 70 degrees, the resistance of the transmission mechanism is increased, and the feeding shortage condition occurs.
Comparative example 8
In this embodiment, as a comparative example of the present invention, the modification of example 1 is only: the rotation angle is adjusted to 110 degrees.
Microscopic examination of the product shows that the crystal grain size is generally 80-100 μm.
The above is an embodiment exemplified in this example, but this example is not limited to the above-described alternative embodiments, and a person skilled in the art may obtain various other embodiments by any combination of the above-described embodiments, and any person may obtain various other embodiments in the light of this example. The above detailed description should not be construed as limiting the scope of the present embodiments, which is defined in the claims and the description may be used to interpret the claims.
Claims (10)
1. A preparation method of a high-purity oxygen-free copper rotary target material is characterized by comprising the following steps: the method comprises the following steps:
placing high-purity oxygen-free copper material into an extrusion die, performing multi-rotation angle extrusion on the high-purity oxygen-free copper material in the extrusion die, then entering a shape die, and finally cooling;
the high-purity oxygen-free copper material is in a semi-molten state under the action of the extrusion die, and enters the shape die in the semi-molten state.
2. The method for preparing the high-purity oxygen-free copper rotary target material according to claim 1, which is characterized by comprising the following steps: the extrusion die has at least two corners.
3. The method for preparing the high-purity oxygen-free copper rotary target material according to claim 1, which is characterized by comprising the following steps: the angle of rotation is 80-100 degrees.
4. The method for preparing the high-purity oxygen-free copper rotary target material according to claim 1, which is characterized by comprising the following steps: the high-purity oxygen-free copper material is driven by a driving mechanism.
5. The method for preparing the high-purity oxygen-free copper rotary target material according to claim 1, which is characterized by comprising the following steps: the temperature of the high-purity oxygen-free copper material is 600-900 ℃ when the high-purity oxygen-free copper material is in a semi-molten state.
6. The method for preparing the high-purity oxygen-free copper rotary target material according to claim 1, which is characterized by comprising the following steps: the shape die is plate-shaped or tubular.
7. The utility model provides a high-purity oxygen-free copper rotary target preparation facilities which characterized in that: the preparation device used in the preparation method of the high-purity oxygen-free copper rotary target material according to any one of claims 1 to 6, comprising an extrusion die (1), wherein the extrusion die (1) has a plurality of corners.
8. The high-purity oxygen-free copper rotary target preparation device according to claim 7, wherein: one side of the extrusion die (1) is connected with a transmission mechanism (3), the other side of the extrusion die (1) is connected with a shape die (2), an outlet of the shape die (2) is connected with one side of a cooling device (4), and a blocking device (5) is arranged on the other side of the cooling device (4).
9. The utility model provides a high-purity oxygen-free copper rotary target which characterized in that: a method for producing a high purity oxygen free copper rotary target according to any one of claims 1 to 6 or a device for producing a high purity oxygen free copper rotary target according to any one of claims 7 to 8.
10. The use of a high purity oxygen free copper rotating target according to claim 9, wherein: it is used in the fields of electronics, electric power, aerospace or new energy.
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|---|---|---|---|
| CN202310792971.3A CN116851478B (en) | 2023-06-30 | 2023-06-30 | Preparation method of high-purity oxygen-free copper rotary target, preparation device thereof, target and application |
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| CN202310792971.3A CN116851478B (en) | 2023-06-30 | 2023-06-30 | Preparation method of high-purity oxygen-free copper rotary target, preparation device thereof, target and application |
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| CN116851478A true CN116851478A (en) | 2023-10-10 |
| CN116851478B CN116851478B (en) | 2024-03-15 |
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| CN116851478B (en) | 2024-03-15 |
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