CN116806367A - 脱模膜 - Google Patents

脱模膜 Download PDF

Info

Publication number
CN116806367A
CN116806367A CN202180090710.6A CN202180090710A CN116806367A CN 116806367 A CN116806367 A CN 116806367A CN 202180090710 A CN202180090710 A CN 202180090710A CN 116806367 A CN116806367 A CN 116806367A
Authority
CN
China
Prior art keywords
release film
release
layer
resin
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180090710.6A
Other languages
English (en)
Chinese (zh)
Inventor
前岨晋一
冈田润
佐藤基
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority claimed from PCT/JP2021/045778 external-priority patent/WO2022153756A1/ja
Publication of CN116806367A publication Critical patent/CN116806367A/zh
Pending legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
CN202180090710.6A 2021-01-14 2021-12-13 脱模膜 Pending CN116806367A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2021-004017 2021-01-14
JP2021-004041 2021-01-14
JP2021090120A JP2022182520A (ja) 2021-05-28 2021-05-28 離型フィルム
JP2021-090120 2021-05-28
PCT/JP2021/045778 WO2022153756A1 (ja) 2021-01-14 2021-12-13 離型フィルム

Publications (1)

Publication Number Publication Date
CN116806367A true CN116806367A (zh) 2023-09-26

Family

ID=84328525

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180090710.6A Pending CN116806367A (zh) 2021-01-14 2021-12-13 脱模膜

Country Status (2)

Country Link
JP (1) JP2022182520A (ja)
CN (1) CN116806367A (ja)

Also Published As

Publication number Publication date
JP2022182520A (ja) 2022-12-08

Similar Documents

Publication Publication Date Title
TWI685495B (zh) 含有縮水甘油基乙炔脲類的組成物
CN106104776B (zh) 脱模膜、其制造方法以及半导体封装体的制造方法
CN106062947B (zh) 半导体元件安装用封装体的制造方法以及脱模膜
TWI656972B (zh) 脫模膜及密封體之製造方法
JP6493628B2 (ja) モールド成形用離型フィルム及びモールド成形方法
TW201920488A (zh) 具有自由基反應性之聚矽氧彈性體硬化物及其用途
TWI618200B (zh) 半導體元件用密封片材、半導體裝置及半導體裝置之製造方法
US10177059B2 (en) Method for manufacturing semiconductor apparatus using a base-attached encapsulant
US20150235872A1 (en) Curable Silicone Composition, Method For Producing Semiconductor Device, And Semiconductor Device
JP6891427B2 (ja) 樹脂シート
JP6966888B2 (ja) 剥離フィルム
CN116806367A (zh) 脱模膜
WO2022153756A1 (ja) 離型フィルム
JP2022037482A (ja) 離型フィルム
JP2022108844A (ja) 離型フィルム
JP2022108853A (ja) 離型フィルム
JP2022108856A (ja) 離型フィルム
JP2024075414A (ja) 離型フィルム
WO2023132312A1 (ja) 離型フィルム
TWI733014B (zh) 密封薄膜、電子零件裝置的製造方法及電子零件裝置
TW201309115A (zh) 基板、金屬膜、基板之製造方法及金屬膜之製造方法
JP2023101143A (ja) 離型フィルム
TW202302791A (zh) 切割晶粒接合一體型膜及半導體裝置的製造方法
JP2024000759A (ja) 離型フィルム
JP2023101380A (ja) 離型フィルム

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination