CN115895269B - Heat-conducting gel and preparation method and application thereof - Google Patents
Heat-conducting gel and preparation method and application thereof Download PDFInfo
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Abstract
The invention discloses a heat-conducting gel, a preparation method and application thereof, wherein the preparation raw materials comprise heat-conducting filler, a silicone oil matrix and a polyvinyl alcohol aqueous solution; the heat conducting filler comprises modified diamond and modified metal oxide; the surface of the modified diamond is modified with amino groups; the surface of the modified metal oxide is modified with epoxy groups. According to the heat-conducting gel disclosed by the invention, the contact thermal resistance is reduced, and the heat-conducting property of the heat-conducting gel is obviously improved.
Description
Technical Field
The invention relates to the technical field of new materials and application thereof, in particular to a heat-conducting gel and a preparation method and application thereof.
Background
With the development of high power consumption, miniaturization and integration of electronic devices, the energy density of the electronic devices is greatly improved, and then the electronic devices have serious heat dissipation problems. The thermal management of failure will lead to equipment jamming, circuit destruction, and serious potential safety hazards. Thermal interface materials are the best choice to help solve the heat dissipation problem. The heat conducting gel is a heat conducting interface material prepared from materials such as silicone oil, heat conducting filler and the like. The heat-dissipating device can be fully attached to the surface of the component, so that various gaps are filled, contact thermal resistance between the component and the radiator is reduced, a heat-dissipating channel is formed, and meanwhile, the effects of insulation, shock absorption, sealing and the like can be achieved.
The thermally conductive gel is a thermal interface material with ultra-high suitability, is softer and has better surface affinity than the thermally conductive gasket, and can be compressed to very low thickness. The heat-conducting gel generally exists in a colloid form at normal temperature, has excellent plasticity, can adapt to various irregular, changeable shapes and rugged heat dissipation interfaces, and has more flexible and changeable application scenes. The heat conducting gel on the market at present is mainly prepared by doping heat conducting filler in a silicone oil system. In order to obtain higher heat conductivity, more heat conducting filler is generally added into the resin system, and better heat conducting performance is obtained by improving the filling proportion of the heat conducting filler. However, the inorganic heat-conducting filler has poor compatibility with silicone oil, so that the filling rate of the inorganic heat-conducting filler is low, and the heat conductivity coefficient of the prepared heat-conducting gel is low due to the existence of a large amount of silicone oil among the heat-conducting fillers.
Therefore, it is urgent to develop a thermally conductive gel having high thermal conductivity.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the invention provides the heat-conducting gel, which can improve the heat-conducting property of the heat-conducting gel.
According to the heat-conducting gel disclosed by the embodiment of the first aspect of the invention, the preparation raw materials comprise a heat-conducting filler, a silicone oil matrix and polyvinyl alcohol;
the heat conducting filler comprises modified diamond and modified metal oxide;
the surface of the modified diamond is modified with amino groups;
the surface of the modified metal oxide is modified with epoxy groups.
According to the embodiment of the invention, the heat-conducting gel has at least the following beneficial effects:
the invention modifies amino groups on the surface of diamond; the surface of the metal oxide is modified with epoxy groups, and the composite filler is formed by utilizing the chemical bond action of amino groups and the epoxy groups. The composite heat conducting filler is easier to form a heat conducting channel when being dispersed in a system, and phonon scattering can be effectively reduced when the composite filler assembled by chemical bonds is filled in a matrix, so that the heat conducting property of the composite material is effectively improved. On the other hand, the oxygen-containing functional groups on the surface of the metal oxide and the amino groups modified on the surface of the diamond are utilized to react, and the directional distribution of the modified metal oxide and the modified diamond is realized through the interaction of hydrogen bonds, so that the thermal resistance of the system is reduced and the thermal conductivity is improved when the thermal conductive gel is formed later.
According to some embodiments of the present invention, the preparation raw materials of the heat conductive gel include 30 to 50 parts by weight of the modified diamond, 20 to 25 parts by weight of the modified metal oxide, 20 to 40 parts by weight of the silicone oil matrix, and 10 to 20 parts by weight of the polyvinyl alcohol aqueous solution.
According to some embodiments of the invention, the silicone oil matrix comprises at least one of a vinyl-containing silicone oil and a hydrogen-containing silicone oil.
According to some embodiments of the invention, the modified diamond is prepared from raw materials including an aminosilane coupling agent, an aqueous alcohol solution, and diamond.
According to some embodiments of the invention, the aminosilane coupling agent includes at least one of KH-550 and KH-792.
According to some embodiments of the invention, the diamond has a particle size in the range of 4 μm to 10 μm.
According to some embodiments of the invention, the method of preparing the modified diamond comprises: an aqueous alcohol solution of an aminosilane coupling agent was mixed with diamond.
According to some embodiments of the invention, the method of preparing the aqueous alcohol solution of the aminosilane coupling agent includes mixing the aminosilane coupling agent and water.
According to some embodiments of the invention, the temperature of the mixing in the preparation of the aqueous alcohol solution of the aminosilane coupling agent is between 30 and 40 ℃.
According to some embodiments of the invention, the mixing time in the preparation of the aqueous alcohol solution of the aminosilane coupling agent is 30 to 60 minutes.
According to some embodiments of the invention, the mixing time is 2-8 hours.
According to some embodiments of the invention, the temperature of the mixing is 60-80 ℃.
According to some embodiments of the invention, the modified metal oxide is prepared from a raw material comprising an epoxy silane coupling agent, an aqueous alcohol solution, and a metal oxide.
According to some embodiments of the invention, the epoxy silane coupling agent comprises KH-560.
According to some embodiments of the invention, the method of preparing the modified metal oxide comprises: an aqueous alcohol solution of an epoxy silane coupling agent and a metal oxide are mixed.
According to some embodiments of the invention, the method of preparing the aqueous alcohol solution of the epoxy silane coupling agent includes mixing the epoxy silane coupling agent and water.
According to some embodiments of the invention, the temperature of the mixing is 30-40 ℃ in the preparation of the aqueous alcohol solution of the epoxy silane coupling agent.
According to some embodiments of the invention, the mixing time is 30-60 min in the preparation of the aqueous alcohol solution of the epoxy silane coupling agent.
According to some embodiments of the invention, the time of the mixing is 20 to 80 minutes.
According to some embodiments of the invention, the temperature of the mixing is 80-130 ℃.
According to some embodiments of the invention, the metal oxide comprises at least one of aluminum oxide, magnesium oxide, and zinc oxide.
According to some embodiments of the invention, the metal oxide has a particle size of 0.5-20 μm.
According to some preferred embodiments of the invention, the metal oxide has a particle size of 0.5-2 μm.
According to a second aspect of the present invention, a method for preparing a thermally conductive gel includes the steps of:
s1, dispersing the heat-conducting filler and mixing with the polyvinyl alcohol;
s2, mixing the mixture obtained in the step S1 with the silicone oil matrix after cold treatment;
the temperature of the cold treatment is-20 to-10 ℃.
The preparation method of the invention has at least the following beneficial effects:
in the cold treatment process, the polyvinyl alcohol aqueous solution is cooled and frozen, the formed ice crystals can generate specific orientation, the orientation force of the ice crystals can enable the heat conducting filler to be separated from the polyvinyl alcohol, the heat conducting filler is extruded on an ice crystal interface, the orientation arrangement is completed, and after the reaction is continued to obtain the heat conducting gel, the orientation heat conducting gel has ultrahigh heat conducting performance in the axial arrangement direction. The directional heat-conducting gel can realize higher heat-conducting performance through less heat-conducting filler consumption when applied to electronic products, and the directional arranged fillers are more beneficial to the overall heat re-balance of the composite material, so that the heat dissipation balance of the whole material is improved.
According to some embodiments of the invention, in the method for preparing a thermally conductive gel, in step S1, the temperature of the mixing is 60-75 ℃.
According to some embodiments of the invention, in the preparation method of the heat-conducting gel, in step S1, the mixing time is 30-80 min.
According to some embodiments of the invention, in the method for preparing a thermally conductive gel, in step S1, the mixing includes stirring and mixing.
According to some embodiments of the invention, in the preparation method of the heat-conducting gel, in step S1, the stirring and mixing speed is 200-500 r/min.
According to some embodiments of the invention, the temperature of the cold treatment is-20 to-10 ℃.
According to some embodiments of the invention, in the method for preparing the heat-conducting gel, the cooling time is 10-14 h.
According to some embodiments of the invention, in the preparation method of the heat-conducting gel, in step S2, the mixing time is 1-5 h.
According to some embodiments of the invention, in the method for preparing a thermally conductive gel, in step S2, the mixing includes stirring and mixing.
According to some embodiments of the invention, in the preparation method of the heat-conducting gel, in step S2, the stirring and mixing speed is 200-500 r/min.
According to the application of the heat-conducting gel in the field of heat dissipation of electronic equipment, the embodiment of the third aspect of the invention is provided.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are shown below, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The following examples are given by way of illustration only and are not to be construed as limiting the invention. The specific conditions are not noted in the examples and are carried out according to conventional conditions or conditions recommended by the manufacturer. The reagents or apparatus used were conventional products commercially available without the manufacturer's attention.
Example 1
The embodiment discloses a heat-conducting gel and a preparation method thereof, and the heat-conducting gel comprises the following specific components:
the preparation method of the modified diamond in the embodiment comprises the following steps:
a1: uniformly mixing 0.5 part of silane coupling agent (KH-550), 0.5 part of absolute ethyl alcohol and 0.1 part of distilled water according to parts by weight, and hydrolyzing in a constant-temperature water bath at 30 ℃ for 30min to obtain silane coupling agent hydrolysate; adding 100 parts of diamond into a high-speed mixer, heating to 74 ℃, adding the silane coupling agent hydrolysate, continuously stirring for 4 hours, washing with acetone for 3 times after the reaction is finished, and drying after vacuum suction filtration to obtain the modified diamond.
The preparation method of the modified metal oxide in the embodiment comprises the following steps:
b1: uniformly mixing 0.5 part of silane coupling agent (KH-560), 0.5 part of absolute ethyl alcohol and 0.1 part of distilled water according to parts by weight, and hydrolyzing in a constant-temperature water bath at 30 ℃ for 30min to obtain silane coupling agent hydrolysate; 100 parts by mass of alumina powder is added into a high-speed mixer, the mixture is heated to 110 ℃, the hydrolysate of the silane coupling agent is added, and the mixture is continuously stirred for 30 minutes, so that the alumina with the surface modified by epoxy groups is obtained.
The preparation method of the heat conducting gel of the embodiment specifically comprises the following steps:
c1, according to parts by weight, 40 parts of modified diamond, 20 parts of modified alumina and 20 parts of polyvinyl alcohol aqueous solution are reacted for 30min at 75 ℃ at 200r/min to obtain mixed slurry;
and C2, cooling the mixed slurry obtained in the step C1 at the temperature of minus 25 ℃ for 12 hours, and placing 40 parts of thawed and vinyl-containing silicone oil into a planetary stirrer, wherein the stirring speed is 200r/min, and the stirring time is 1 hour. And after the stirring is completed, taking out the mixture to obtain the heat-conducting gel.
Example 2
This example discloses a method for preparing a thermally conductive gel, and the difference between this example and example 1 is that the amount of modified diamond added is 45 parts, and the other conditions are the same.
Example 3
This example discloses a method for preparing a thermally conductive gel, and the difference between this example and example 1 is that the amount of modified diamond added is 50 parts, and the other conditions are the same.
Example 4
This example discloses a method for preparing a thermally conductive gel, and the difference between this example and example 1 is that the amount of modified diamond added is 30g, and the other conditions are the same.
Comparative example 1
This comparative example discloses a method for preparing a thermally conductive gel, which differs from example 1 in that unmodified diamond is added, and the remaining conditions are the same.
Comparative example 2
This comparative example discloses a method for preparing a thermally conductive gel, which differs from example 1 in that an unmodified metal oxide is added, and the remaining conditions are the same.
Comparative example 3
This comparative example discloses a method for preparing a heat conductive gel, which is different from example 1 in that no aqueous polyvinyl alcohol solution is added, and the other conditions are the same.
Comparative example 4
This comparative example discloses a method for preparing a heat conductive gel, which is different from example 1 in that no cold treatment is performed, and the remaining conditions are the same.
Test example 1
The heat conductive gel prepared in the above examples and comparative examples was subjected to performance test,
and (3) testing heat conduction performance: the standard test method for measuring the heat conduction in the vertical direction by a steady state method comprises the following specific steps of: at the temperature of 80 ℃ and the pressure of 10psi, respectively testing the relation between the thermal resistance RTotal and the thickness BLT of three thermal interface composite materials with different thicknesses, and then linearly fitting the obtained data, wherein the slope is the thermal conductivity coefficient kappa TIM of the thermal interface material and the intercept of the y axis is the contact thermal resistance RContact as shown in a formula (1):
R Total ＝R Contact +BLT/κ TIM (1)；
the test results are shown in Table 1.
Table 1 thermal conductive gel Performance test
The difference between comparative example 1 and example 1 is that: the unmodified diamond is added, and under the condition, the composite heat-conducting filler cannot form an effective heat-conducting channel in the system, and meanwhile, the modified metal oxide and the modified diamond cannot interact through hydrogen bonds, so that the directional distribution of the modified metal oxide and the modified diamond cannot be realized, and the heat-conducting property is reduced.
The difference between comparative example 2 and example 1 is that: the modified metal oxide is added, and under the condition, the composite heat conducting filler cannot form an effective heat conducting channel in the system, and meanwhile, the modified metal oxide and the modified diamond cannot interact through hydrogen bonds, so that the directional distribution of the modified metal oxide and the modified diamond cannot be realized, and the heat conducting performance is reduced.
The difference between comparative example 3 and example 1 is that: without adding the aqueous solution of polyvinyl alcohol, an effective heat conduction path cannot be formed under the condition, so that the heat conduction performance is reduced.
Comparative example 4 differs from example 1 in that: the polyvinyl alcohol aqueous solution is not subjected to cold treatment, and an effective heat conduction path cannot be formed under the condition, so that the heat conduction performance is reduced.
The invention modifies amino groups on the surface of diamond; the surface of the metal oxide is modified with epoxy groups, and the composite filler is formed by utilizing the chemical bond action of amino groups and the epoxy groups. The composite heat conducting filler is easier to form a heat conducting channel when being dispersed in the system, so that the heat conducting performance of the composite material is effectively improved. On the other hand, the oxygen-containing functional groups on the surface of the metal oxide and the amino groups modified on the surface of the diamond are utilized to react, and the directional distribution of the modified metal oxide and the modified diamond is realized through the interaction of hydrogen bonds, so that the thermal resistance of the system is reduced and the thermal conductivity is improved when the thermal conductive gel is formed later.
Claims (10)
1. A thermally conductive gel, characterized in that: the preparation raw materials comprise a heat conducting filler, a silicone oil matrix and a polyvinyl alcohol aqueous solution; the heat conducting filler comprises modified diamond and modified metal oxide; the surface of the modified diamond is modified with amino groups; the surface of the modified metal oxide is modified with epoxy groups,
the preparation method of the heat-conducting gel comprises the following steps:
s1, mixing the heat-conducting filler and the polyvinyl alcohol aqueous solution;
s2, mixing the mixture obtained in the step S1 with the silicone oil matrix after cold treatment;
the temperature of the cold treatment is-20 to-10 ℃.
2. The heat conducting gel according to claim 1, wherein the preparation raw materials of the heat conducting gel comprise, by weight, 30-50 parts of the modified diamond, 20-25 parts of the modified metal oxide, 20-40 parts of the silicone oil matrix and 10-20 parts of the polyvinyl alcohol aqueous solution.
3. The thermally conductive gel of claim 1, wherein the silicone oil matrix comprises at least one of vinyl silicone oil and hydrogen-containing silicone oil.
4. The thermally conductive gel of claim 1, wherein the method of preparing the modified diamond comprises: an aqueous alcohol solution of an aminosilane coupling agent was mixed with diamond.
5. The thermally conductive gel of claim 1, wherein the method of preparing the modified metal oxide comprises: an aqueous alcohol solution of an epoxy silane coupling agent and a metal oxide are mixed.
6. The thermally conductive gel of claim 5, wherein the metal oxide comprises at least one of aluminum oxide, magnesium oxide, and zinc oxide.
7. The thermally conductive gel of claim 5 or 6, wherein the metal oxide has a particle size of 0.5-20 μm.
8. A method of preparing a thermally conductive gel as claimed in any one of claims 1 to 7, comprising the steps of:
s1, mixing the heat-conducting filler and the polyvinyl alcohol aqueous solution;
s2, mixing the mixture obtained in the step S1 with the silicone oil matrix after cold treatment;
the temperature of the cold treatment is-20 to-10 ℃.
9. The method according to claim 8, wherein in the step S1, the mixing temperature is 60 to 75 ℃.
10. Use of the thermally conductive gel of any one of claims 1-7 in the field of heat dissipation of electronic devices.
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Citations (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2222112A1 (en) * | 1996-11-28 | 1998-05-28 | Kuraray Co., Ltd. | Polyvinyl alcohol hydrogel and process for producing the same |
| JP2007281048A (en) * | 2006-04-04 | 2007-10-25 | Kaneka Corp | Gelatinous compound for heat dissipation, and its manufacturing method |
| CN101096273A (en) * | 2007-06-05 | 2008-01-02 | 南京工业大学 | Nubby low-density gel heat-insulation composite material |
| CN101693125A (en) * | 2009-10-12 | 2010-04-14 | 北京科技大学 | Process for preparing biocompatible directional carbon nanotube array reinforced composite hydrogel |
| WO2012166832A2 (en) * | 2011-06-02 | 2012-12-06 | Milliken & Company | Porous, low density nanoclay composite |
| CN103896561A (en) * | 2014-03-06 | 2014-07-02 | 大连理工大学 | Preparation method of silicon dioxide thermal insulation material with regular layered structure |
| CN108358544A (en) * | 2018-02-06 | 2018-08-03 | 合肥广民建材有限公司 | A kind of preparation method of thermal insulation material for building |
| CN109265729A (en) * | 2018-09-17 | 2019-01-25 | 燕山大学 | A kind of degradable multiporous conducting gel layer of selfreparing and its preparation method and application |
| WO2020174929A1 (en) * | 2019-02-28 | 2020-09-03 | 富士フイルム株式会社 | Heat storage member, electronic device, heat storage member manufacturing method, and protective layer-forming composition |
| CN112625423A (en) * | 2020-12-16 | 2021-04-09 | 苏州阿德旺斯新材料有限公司 | Composite phase change material, application and product thereof |
| CN112812570A (en) * | 2020-12-29 | 2021-05-18 | 深圳德邦界面材料有限公司 | Low-volatility double-crosslinking heat-conducting phase-change gel and preparation method thereof |
| CN113024164A (en) * | 2021-04-14 | 2021-06-25 | 福建臻璟新材料科技有限公司 | Preparation method of single-component high-fluidity high-thermal-conductivity gel |
| CN113150544A (en) * | 2021-02-08 | 2021-07-23 | 华南理工大学 | Oriented boron nitride @ polydopamine @ silver hybrid nanosheet flexible thermal interface material and preparation method thereof |
| CN113308121A (en) * | 2021-07-14 | 2021-08-27 | 合肥工业大学 | Insulating high-thermal-conductivity gel filled with composite thermal-conductive filler based on chemical bond assembly |
| CN113337128A (en) * | 2021-05-31 | 2021-09-03 | 福建臻璟新材料科技有限公司 | High-weather-resistance heat-conducting gel composition and preparation method thereof |
| CN113831897A (en) * | 2021-08-18 | 2021-12-24 | 长春工业大学 | Preparation method and application of high-thermal-conductivity graphene-based hydrogel |
| CN114075340A (en) * | 2020-08-21 | 2022-02-22 | 天津理工大学 | Preparation method of composite hydrogel with three-dimensional heat conduction network |
| CN114133616A (en) * | 2021-11-10 | 2022-03-04 | 华南理工大学 | Recyclable cellulose-based conductive self-repairing eutectic gel and preparation method and application thereof |
| CN115124352A (en) * | 2021-03-29 | 2022-09-30 | 中国科学院深圳先进技术研究院 | Aerogel with double-orientation network and preparation method and application thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113166447A (en) * | 2018-11-26 | 2021-07-23 | 富士胶片株式会社 | Heat storage sheet, heat storage member, electronic device, and method for manufacturing heat storage sheet |
-
2022
- 2022-10-31 CN CN202211347346.XA patent/CN115895269B/en active Active
Patent Citations (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2222112A1 (en) * | 1996-11-28 | 1998-05-28 | Kuraray Co., Ltd. | Polyvinyl alcohol hydrogel and process for producing the same |
| JP2007281048A (en) * | 2006-04-04 | 2007-10-25 | Kaneka Corp | Gelatinous compound for heat dissipation, and its manufacturing method |
| CN101096273A (en) * | 2007-06-05 | 2008-01-02 | 南京工业大学 | Nubby low-density gel heat-insulation composite material |
| CN101693125A (en) * | 2009-10-12 | 2010-04-14 | 北京科技大学 | Process for preparing biocompatible directional carbon nanotube array reinforced composite hydrogel |
| WO2012166832A2 (en) * | 2011-06-02 | 2012-12-06 | Milliken & Company | Porous, low density nanoclay composite |
| CN103896561A (en) * | 2014-03-06 | 2014-07-02 | 大连理工大学 | Preparation method of silicon dioxide thermal insulation material with regular layered structure |
| CN108358544A (en) * | 2018-02-06 | 2018-08-03 | 合肥广民建材有限公司 | A kind of preparation method of thermal insulation material for building |
| CN109265729A (en) * | 2018-09-17 | 2019-01-25 | 燕山大学 | A kind of degradable multiporous conducting gel layer of selfreparing and its preparation method and application |
| WO2020174929A1 (en) * | 2019-02-28 | 2020-09-03 | 富士フイルム株式会社 | Heat storage member, electronic device, heat storage member manufacturing method, and protective layer-forming composition |
| CN114075340A (en) * | 2020-08-21 | 2022-02-22 | 天津理工大学 | Preparation method of composite hydrogel with three-dimensional heat conduction network |
| CN112625423A (en) * | 2020-12-16 | 2021-04-09 | 苏州阿德旺斯新材料有限公司 | Composite phase change material, application and product thereof |
| CN112812570A (en) * | 2020-12-29 | 2021-05-18 | 深圳德邦界面材料有限公司 | Low-volatility double-crosslinking heat-conducting phase-change gel and preparation method thereof |
| CN113150544A (en) * | 2021-02-08 | 2021-07-23 | 华南理工大学 | Oriented boron nitride @ polydopamine @ silver hybrid nanosheet flexible thermal interface material and preparation method thereof |
| CN115124352A (en) * | 2021-03-29 | 2022-09-30 | 中国科学院深圳先进技术研究院 | Aerogel with double-orientation network and preparation method and application thereof |
| CN113024164A (en) * | 2021-04-14 | 2021-06-25 | 福建臻璟新材料科技有限公司 | Preparation method of single-component high-fluidity high-thermal-conductivity gel |
| CN113337128A (en) * | 2021-05-31 | 2021-09-03 | 福建臻璟新材料科技有限公司 | High-weather-resistance heat-conducting gel composition and preparation method thereof |
| CN113308121A (en) * | 2021-07-14 | 2021-08-27 | 合肥工业大学 | Insulating high-thermal-conductivity gel filled with composite thermal-conductive filler based on chemical bond assembly |
| CN113831897A (en) * | 2021-08-18 | 2021-12-24 | 长春工业大学 | Preparation method and application of high-thermal-conductivity graphene-based hydrogel |
| CN114133616A (en) * | 2021-11-10 | 2022-03-04 | 华南理工大学 | Recyclable cellulose-based conductive self-repairing eutectic gel and preparation method and application thereof |
Non-Patent Citations (1)
| Title |
|---|
| 导热界面材料的制备与性能研究;孟凡成;《中国优秀硕士学位论文全文数据库 工程科技Ⅰ辑》(第06期);第B020-265页 * |
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