CN116722004A - LED display module, manufacturing method of LED display module and LED display screen - Google Patents
LED display module, manufacturing method of LED display module and LED display screen Download PDFInfo
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- CN116722004A CN116722004A CN202310884427.1A CN202310884427A CN116722004A CN 116722004 A CN116722004 A CN 116722004A CN 202310884427 A CN202310884427 A CN 202310884427A CN 116722004 A CN116722004 A CN 116722004A
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The application provides an LED display module, a manufacturing method of the LED display module and an LED display screen, wherein the LED display module comprises a substrate, a plurality of LED light emitting units, a black bottom filling layer, a packaging layer, a base film layer, an anti-dazzle layer and an anti-reflection layer; the LED light-emitting units are arranged on the substrate at intervals; the packaging layer covers the LED light-emitting units and the black underfill layer, and the base film layer, the anti-glare layer and the anti-reflection layer are sequentially stacked on the packaging layer. According to the LED display module substrate, the black bottom filling layer is arranged in the gap between the LED light emitting units, so that the surface chromatic aberration of the substrate can be covered, the blackness of the module black screen can be improved, the surface glare of the module during display can be avoided by the anti-glare layer, the surface whitening of the module caused by the anti-glare layer during display can be avoided by the anti-reflection layer, and the visible light transmittance of the LED display module whole packaging structure can be higher and the contrast ratio is higher due to the anti-glare layer and the anti-reflection layer.
Description
Technical Field
The application relates to the technical field of LED display, in particular to an LED display module, a manufacturing method of the LED display module and an LED display screen.
Background
Contrast is one of the key performance indicators of the display, and is related to the highest brightness and the lowest brightness of the display. In general, to improve the contrast of a display screen, the display screen is either brighter when it is lit or darker when it is black. For example, when the mobile phone is used outdoors, the brightness of the screen is usually automatically adjusted to ensure the contrast of the display picture, or when the mobile phone is used in a movie theatre, all lights are turned off to make the whole environment darker, so as to ensure the display effect. For traditional outdoor LED displays, because the larger light emitting chips and structural designs themselves have very high brightness, there is a high contrast even in outdoor high-light environments. With the development of COB packaging technology and the rise of Micro-LED probability, LED display screens have been applied to consumer-level markets indoors, such as home theatres, ultra-clear televisions, conference integrated machines, and the like. The LED display screen is smaller and smaller in size, the light emitting chip is smaller and smaller in size, and the brightness is far lower than that of an outdoor LED display screen. In addition, when the LED display screen is used indoors, too high brightness can seriously stimulate eyes to cause visual fatigue, so that in order to improve the contrast of the display screen, a method for blackening the LED display screen is needed.
Low transmittance black encapsulation layers are commonly used in the industry. The lower the transmissivity of the black packaging layer is, the darker the display screen is, and the color difference of the bottom PCB can be better covered. However, the lower the transmittance of the encapsulation layer is, the lower the highest brightness that can be achieved by the display screen is, and the improvement effect of the contrast ratio is not obvious. The low packaging transmittance can also improve the power consumption under the same brightness, and the surface heating of the display screen is serious, so that the requirements of green energy conservation, surface touch control and the like of the consumer market are not met.
Accordingly, the prior art is still in need of improvement and development.
Disclosure of Invention
The application provides an LED display module, a manufacturing method of the LED display module and an LED display screen, and aims to solve the technical problems in the prior art.
The technical scheme of the application is as follows:
the first aspect of the application provides an LED display module, which comprises a substrate, a plurality of LED light-emitting units, a black underfill layer, a packaging layer, a base film layer, an anti-dazzle layer and an anti-reflection layer; the LED light-emitting units are arranged on the substrate at intervals; the black bottom filling layer is arranged in gaps among the LED light-emitting units, and the height of the black bottom filling layer is lower than the height of the lower surface of the LED light-emitting chip in the LED light-emitting unit; the packaging layer covers a plurality of LED light-emitting units and the black bottom filling layer, the base film layer, the anti-dazzle layer and the anti-reflection layer are sequentially stacked and arranged on the packaging layer, and the overall visible light transmittance of the packaging layer, the base film layer, the anti-dazzle layer and the anti-reflection layer is more than 85%.
In an alternative embodiment of the first aspect of the present application, the thickness of the base film layer is 200 μm or less; the thickness of the anti-dazzle layer is 0-15 mu m, and the haze of the anti-dazzle layer is 0-90; the anti-reflection layer is provided with 1 layer or multiple layers, the thickness of the whole anti-reflection layer is 100-500nm, and the visible light reflectivity of the whole anti-reflection layer is less than 2%.
In an optional embodiment of the first aspect of the present application, the base film layer is a PET base film layer or a TAC base film layer, and the base film layer is adhered to the packaging layer by an optical adhesive.
In an alternative embodiment of the first aspect of the present application, the material of the black matrix layer is a black light absorbing material, and the black light absorbing material includes ink.
In an alternative embodiment of the first aspect of the present application, the material of the antiglare layer is one or more of a hardened epoxy resin, an acrylic resin and an amino resin, or the material of the antiglare layer is a mixed material of a resin material and metal oxide particles and/or metal nitride particles.
In an alternative embodiment of the first aspect of the present application, the material of the anti-reflection layer is one or more of magnesium fluoride, titanium dioxide, silicon dioxide, aluminum oxide, zirconium dioxide, zinc sulfide, silicon carbide or silicon nitride.
In an alternative embodiment of the first aspect of the present application, the substrate is a PCB substrate, a BT resin substrate, a glass substrate, a silicon substrate or a ceramic substrate; the packaging layer is made of transparent polymer materials, and the transparent polymer materials comprise organic silica gel, epoxy resin, acrylic gel or hot melt adhesive.
The second aspect of the application provides a method for manufacturing an LED display module, which comprises the following steps:
providing a substrate and a plurality of LED light-emitting units;
attaching a plurality of LED light-emitting units on the substrate at intervals, and completing the electrical connection between the plurality of LED light-emitting units and a power supply circuit;
manufacturing a black bottom filling layer in gaps among a plurality of LED light-emitting units, and controlling the height of the black bottom filling layer to be lower than the height of the lower surface of an LED light-emitting chip in the LED light-emitting units;
manufacturing a packaging layer on the black bottom filling layer and the LED light-emitting units;
a prefabricated optical film is arranged on the packaging layer, and comprises a base film layer, an anti-glare layer and an anti-reflection layer which are sequentially stacked to obtain an LED display module;
in the LED module, the light transmittance of the whole visible light of the packaging layer, the base film layer, the anti-dazzle layer and the anti-reflection layer is more than 85%.
In an alternative embodiment of the second aspect of the present application, the manner of fabricating the anti-glare layer on the base film layer includes: etching or rolling is carried out on the base film layer to manufacture the anti-dazzle layer, or spraying, coating or phase separation anti-dazzle material is sprayed on the base film layer to manufacture the anti-dazzle layer;
the method for manufacturing the anti-reflection layer on the anti-glare layer comprises the following steps: and manufacturing the anti-glare layer by magnetron sputtering, sol-gel or vapor deposition of an anti-reflection material.
The third aspect of the application provides an LED display screen, which comprises the LED display module set described in any one of the above.
The beneficial effects are as follows: the application provides an LED display module, a manufacturing method of the LED display module and an LED display screen, wherein the LED display module comprises a substrate, a plurality of LED light emitting units, a black bottom filling layer, a packaging layer, a base film layer, an anti-dazzle layer and an anti-reflection layer; the LED light-emitting units are arranged on the substrate at intervals; the packaging layer covers the LED light-emitting units and the black underfill layer, and the base film layer, the anti-glare layer and the anti-reflection layer are sequentially stacked on the packaging layer. According to the LED display module substrate, the black bottom filling layer is arranged in the gap between the LED light emitting units, so that the surface chromatic aberration of the substrate can be covered, the blackness of the module black screen can be improved, the surface glare of the module during display can be avoided by the anti-glare layer, the surface whitening of the module caused by the anti-glare layer during display can be avoided by the anti-reflection layer, and the visible light transmittance of the LED display module whole packaging structure can be higher and the contrast ratio is higher due to the anti-glare layer and the anti-reflection layer.
Drawings
Fig. 1 is a schematic cross-sectional view of an LED display module according to the present application.
Fig. 2 is a schematic cross-sectional view of another LED display module according to the present application.
Fig. 3 is a schematic cross-sectional structure of a pre-packaged LED lamp bead according to the present application.
FIG. 4 is a graph showing the comparison of the display effect of a test sample according to the present application.
Fig. 5 is a flowchart of a method for manufacturing an LED display module according to the present application.
Reference numerals in the drawings are as follows:
10-a substrate; a 20-LED light emitting unit; 30-black under-fill; 40-packaging layer; 50-an anti-glare layer; 60-an anti-reflection layer; 70-a base film layer; 80-a lamp bead substrate; 90-LED lamp beads; 100-a lamp bead packaging layer; 110-fillets.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application.
In the description of the present application, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, the appearances of the phrase "in one embodiment" or "in some embodiments" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
Referring to fig. 1, a first aspect of the present application provides an LED display module, including a substrate 10, a plurality of LED light emitting units 20, a black underfill layer 30, an encapsulation layer 40, a base film layer 70, an anti-glare layer 50, and an anti-reflection layer 60; wherein a plurality of the LED light emitting units 20 are arranged on the substrate 10 at intervals, more specifically, a plurality of the LED light emitting units 20 are arranged on the substrate 10 in an array shape, and the array shape of the plurality of the LED light emitting units 20 on the substrate 10 is a rectangular array, a circular array or an array with other shapes.
The black underfill layer 30 is disposed in the gaps between the LED light emitting units 20, more specifically, the black underfill layer 30 is disposed in the gaps between the LED light emitting units 20 and is attached to the substrate 10, and the height (upper surface) of the black underfill layer 30 is lower than the height of the lower surface of the LED light emitting chip in the LED light emitting unit 20, so as to avoid the absorption of the light emitted from the LED light emitting unit 20 by the black underfill layer 30, and further, on the substrate 10, the black underfill layer 30 extends into the gaps between the LED light emitting units 20 and the substrate 10, and the vertical cross-sectional shape of the black underfill layer 30 may be rectangular or trapezoidal (for example, isosceles trapezoid).
The packaging layer 40 covers the plurality of LED light emitting units 20 and the black underfill layer 30, the top of the plurality of LED light emitting units 20 is completely covered by the upper surface of the packaging layer 40, the packaging layer 40 is used for isolating the plurality of LED light emitting units 20 from the outside air, and the basic display unit of the LED display module is in a quadrangular shape.
The base film layer 70, the anti-glare layer 50 and the anti-reflection layer 60 are sequentially laminated on the encapsulation layer 40, and when specifically manufactured, the anti-glare layer 50 and the anti-reflection layer 60 may be manufactured on the base film layer 70 in advance to obtain a prefabricated optical film, and then the prefabricated optical film is bonded to the encapsulation layer 40 through one surface of the base film layer 70, and the base film layer 70 may be bonded to the encapsulation layer 40 by using the adhesion of the encapsulation layer 40 itself, or may be bonded to the encapsulation layer 40 by an optical adhesive, and the base film layer 70 may be a PET base film layer or a TAC base film layer, and the thickness of the base film may be 200 μm or less, and exemplary, the thickness of the base film may be 100 μm, and in an embodiment employing optical adhesive auxiliary bonding, the thickness of the optical adhesive may be 50 μm or less, and exemplary, for example, the thickness of the optical adhesive may be 25 μm. In the above example, the anti-glare layer 50 and the anti-reflection layer 60 are indirectly disposed on the encapsulation layer 40 through the base film layer 70.
Referring to fig. 2, in another alternative embodiment of the present application, the LED display module of the present application may also not include the base film layer 70, the anti-glare layer 50 is directly fabricated on the encapsulation layer 40, and the anti-reflection layer 60 is fabricated on the anti-glare layer 50, so that the LED display module is more compact and has smaller volume.
In the present application, the visible light transmittance of the encapsulation layer 40 is designed to be greater than 85%, the overall visible light transmittance of the encapsulation layer 40, the base film layer 70, the anti-glare layer 50, and the anti-reflection layer 60 is designed to be greater than 85% (in the embodiment without the base film layer 70, the overall visible light transmittance of the encapsulation layer 40, the anti-glare layer 50, and the anti-reflection layer 60 is designed to be greater than 85%), and the adjustment of the visible light transmittance of the encapsulation layer 40, the base film layer 70, the anti-glare layer 50, and the anti-reflection layer 60 may be adjusted by a surface structure transmittance, a base film transmittance, an optical glue transmittance, or a polarizing structure. In the present application, the material of the black underfill layer 30 may be a black light absorbing material, the material of the black underfill layer 30 may be ink, paint, dry film, etc., the black underfill layer 30 may be manufactured by processes such as inkjet, sputtering, vapor deposition, rubbing, printing, coating, dispensing, etc., and the black underfill layer 30 may be manufactured on the substrate 10 before the die bonding of the plurality of LED light emitting units 20, or may be manufactured on the substrate 10 after the die bonding. Specifically, the prior art generally uses a low-transmittance black encapsulation layer 40 plus a surface matte treatment to improve the contrast and anti-glare of the LED module, and the transmittance of the LED module with this structure is generally 30-50%. The black packaging layer 40 realizes that a black agent can be added into the packaging layer 40, or a black semitransparent PET substrate is adopted, or a black semitransparent surface matte layer is adopted; it may also be implemented by a multi-layer package structure in which one or more layers of the package structure are black translucent. In general, in the prior art, the transmittance of the whole packaging structure is reduced to make the display screen look darker, and meanwhile, the color difference of a part of the bottom PCB board can be covered, so that the consistency of the black screen is improved, the power consumption under the same brightness is also improved due to the low packaging transmittance, and the surface heating of the display screen is serious, which does not meet the requirements of green energy saving in the consumer market, etc., in the application, the black underfill layer 30 is arranged in the gap between the LED light-emitting units 20 on the surface of the substrate 10, and the height of the black underfill layer 30 is not higher than the lower surface of the LED light-emitting chips in the LED light-emitting units 20, so that the consistency of the ink color on the surface of the substrate 10 is well improved, and the blackness of the display screen is improved.
In the present application, the substrate 10 may be a substrate such as a PCB substrate, a BT resin substrate, a glass substrate, a silicon substrate or a ceramic substrate, the LED light emitting unit 20 is an LED light emitting chip or a pre-packaged LED light emitting chip, more specifically, the LED light emitting chip is a flip-chip LED light emitting chip, referring to fig. 3, the pre-packaged LED light emitting chip includes a light emitting bead substrate 80, an LED light bead 90 welded on an upper surface of the light emitting bead substrate 80, a light bead packaging layer 100 covering the LED light bead 90 and the light bead substrate 80, and a solder bump 110 disposed on a lower surface of the light bead substrate 80, the light bead packaging layer 100 and the packaging layers 40 of the LED light emitting units 20 are all made of transparent polymer materials, such as silicone, epoxy resin, epoxy dry film, acryl glue or hot melt glue, and the visible light transmittance of the packaging layer 40 is not lower than 85%.
In an exemplary embodiment of the present application, the substrate 10 is a PCB substrate, the PCB substrate is in a rectangular array and is distributed with a plurality of bonding pads and a printed circuit electrically connected with the plurality of bonding pads, the LED light emitting units 20 are flip-chip LED light emitting chips, the plurality of LED light emitting units 20 are fixed on the plurality of bonding pads of the substrate 10 by using solder paste and through a die bonding process, and are electrically connected with the printed circuit on the substrate 10, the plurality of LED light emitting units 20 are packaged on the substrate 10 by epoxy resin, and the visible light transmittance of the packaging layer 40 is 90%.
In an alternative embodiment of the first aspect of the present application, the material of the anti-glare layer 50 may be one or more resin materials such as hardened epoxy resin, acrylic resin, amino resin, etc., or a mixed material of the resin material and metal oxide particles and/or metal nitride particles. If the material for making the anti-glare layer 50 is a mixture of resin and metal oxide and/or metal nitride particles, the particle size of the metal oxide and metal nitride particles is smaller than 10 μm, the anti-glare layer 50 may be made by etching, spraying, rolling, coating or phase separation, for example, a phase separation process is selected, the surface of the anti-glare layer 50 made on the encapsulation layer 40 or the base film layer 70 by the phase separation process is finer, the particles are more uniform, the color separation of R/G/B three colors due to refraction can be effectively reduced, the thickness of the anti-glare layer 50 is 0-15 μm, and the haze of the anti-glare layer 50 is 0-90.
In an alternative embodiment of the first aspect of the present application, the material of the anti-reflection layer 60 may be one or more of magnesium fluoride, titanium dioxide, silicon dioxide, aluminum oxide, zirconium dioxide, zinc sulfide, silicon carbide or silicon nitride. The anti-reflection layer 60 is attached to the surface of the anti-glare layer 50 through magnetron sputtering, sol-gel method or vapor deposition, and the anti-reflection layer 60 reduces reflected light through interference of reflected light rays at upper and lower interfaces, in the present application, the anti-reflection layer 60 may be provided with only 1 layer or with multiple layers, the thickness of the whole anti-reflection layer 60 (i.e. 1 layer or multiple layers) is 100-500nm, the visible light reflectivity of the whole anti-reflection layer 60 is less than 2%, and, illustratively, the thickness of the anti-reflection layer 60 is 100-200nm under the condition that the anti-reflection layer 60 is provided with only 1 layer, and the visible light reflectivity of the anti-reflection layer 60 is less than 2%; in the case where the antireflection layer 60 is provided with a plurality of layers, the number of layers of the antireflection layer 60 is 1 to 6, for example, 4 layers, and the thickness of the plurality of layers of the antireflection layer 60 is 100 to 500nm, and the visible light reflectance of the plurality of layers of the antireflection layer 60 is less than 1%.
In an alternative embodiment of the first aspect of the present application, when the anti-reflection layer 60 of the present application is provided with a plurality of layers, the plurality of anti-reflection layers 60 are different material layers, and the overall thickness of the plurality of anti-reflection layers 60 is determined based on the material used for each of the anti-reflection layers 60 and the visible light reflectivity that the plurality of anti-reflection layers 60 are ultimately required to achieve.
In the present application, the selection of the haze of the antiglare layer 50 and the selection of the visible light reflectance of the antireflection layer 60 are based on the principle that the higher the haze of the antiglare layer 50, the lower the visible light reflectance of the antireflection layer 60 is, the better the effect, and in an alternative embodiment of the first aspect of the present application, the haze of the antiglare layer 50 is 60 to 90, and the visible light reflectance of the plurality of antireflection layers 60 is less than 0.2%.
However, in actual production, the anti-reflection layer 60 needs to be formed on a surface that is as smooth as possible, and when the haze of the anti-glare layer 50 is higher, the surface flatness is worse, and it is more difficult to obtain a lower reflectance of the anti-reflection layer 60. In consideration of practical application and cost factors, the conditions of the haze of the anti-glare layer 50 and the visible light reflectivity of the anti-reflection layer 60 may be not limited, for example, when the haze of the anti-glare layer 50 is 40-70, the anti-reflection layer 60 is only 1 layer, and the visible light reflectivity of the anti-reflection layer 60 is less than 1.5%; or the haze of the anti-glare layer 50 is 0 to 20, the anti-reflection layer 60 is formed in a plurality of layers, and the visible light reflectivity of the anti-reflection layer 60 is less than 0.2%.
In order to better illustrate the performance of the LED display module with the structure, a plurality of test samples are constructed according to the following packaging combination parameters for performance test, and the performance test results are shown in the following table 1:
TABLE 1 optical Property parameter Table for different packaged samples
The brightness of the base lamp panel (i.e. the substrate+a plurality of LED light emitting units) of the above sample is the same, SC I (total emissivity) and SCE (non-specular reflectivity) are both compared by using the value at 550nm wavelength to which the human eye is most sensitive, and the lower the SC I, the smaller the surface reflection, the darker the appearance, and the higher the contrast at the same brightness. The smaller the difference between SCE and SC I, the less specular reflection and the stronger the antiglare capability.
In table 1 above, sample No. 1 was a conventional process: the bottom is ink-jet, and is added with a packaging layer with certain transmittance and anti-dazzle treatment on the surface.
Sample nos. 2, 3 and 4 are preferred embodiments of the present application, and the brightness is much higher than sample No. 1 due to the high transmittance of the encapsulation layer, and both the surface reflectivity and the anti-glare ability are superior to sample No. 1. The LED display screen has the characteristics of high brightness, high contrast and anti-dazzle, and has good ink consistency. And the material cost is acceptable, the technology is mass-producible.
Compared with the samples No. 2 and No. 3, the samples No. 5 and No. 9 have lower visible light transmittance, have high contrast and anti-dazzle effect, but the power consumption can be increased when the transmittance is low and the same brightness is achieved, so that the requirement of highlighting cannot be met.
Sample No. 6 had no bottom treatment compared to sample No. 2, and although the surface reflection was as good as that of the conventional sample, the black screen was poor in consistency, and the base color of the substrate could not be covered.
The haze of the antiglare layer of sample No. 7 and the visible light reflectance of the antireflection layer were not well matched, and although the brightness and reflectance were not good, the surface glare was serious.
The sample No. 10 has very high haze of the anti-dazzle layer, and the visible light reflectivity of the anti-reflection layer is very low, so that the sample is a theoretical preferred sample, and the sample has very good brightness, reflectivity and anti-dazzle property, but the high haze and low reflectivity are difficult in technical process, have very high cost and are not suitable for practical application.
No. 11 and No. 12 samples have no anti-reflection layer on the surface, the overall reflectivity is very high, the contrast ratio of the display screen is low, and the glare is serious. The display effect graphs of the sample No. 1, the sample No. 2 and the sample No. 6 of the present application are shown in fig. 4 (sample No. 1, sample No. 2 and sample No. 6 in this order from left to right).
Referring to fig. 5, a second aspect of the present application provides a method for manufacturing an LED display module, including:
s100, providing a substrate 10 and a plurality of LED light emitting units 20;
s200, attaching a plurality of LED light emitting units 20 on the substrate 10 at intervals, and completing electrical connection between the LED light emitting units 20 and a power supply circuit; the device utilized in step S200 may be a die bonder or a chip mounter;
s300, manufacturing a black bottom filling layer 30 in gaps among a plurality of LED light-emitting units 20, and controlling the height of the black bottom filling layer 30 to be lower than the height of the lower surface of an LED light-emitting chip in the LED light-emitting units 20; the device utilized in step S300 may be a dispenser; in another embodiment of the second aspect of the present application, the step of fabricating the black underfill layer 30 may also be performed before the step S200, and the positioning of the black underfill layer 30 may be determined according to the positions of the bonding pads on the substrate 10 for mounting the LED lighting units 20;
s400, manufacturing a packaging layer 40 on the black bottom filling layer 30 and a plurality of LED light-emitting units 20; the equipment utilized in step S400 may be a dispenser and/or a coater;
s500, arranging a prefabricated optical film on the packaging layer 40, wherein the prefabricated optical film comprises a base film layer 70, an anti-glare layer 50 and an anti-reflection layer 60 which are sequentially stacked to obtain an LED display module;
in the LED module, the visible light transmittance of the encapsulation layer 40 is greater than 85%, and the overall visible light transmittance of the encapsulation layer 40, the base film layer 70, the anti-glare layer 50, and the anti-reflection layer 60 is greater than 85%.
In another embodiment of the present application, the step S500 may be replaced by the following sub-steps.
S501, arranging a base film layer 70 on the packaging layer 40, wherein the base film layer 70 can be adhered to the packaging layer 40 by optical adhesive assistance or adhered to the packaging layer 40 by the self-adhesion of the packaging layer 40;
s502, manufacturing an anti-glare layer 50 on the base film layer 70; wherein, the manner of manufacturing the anti-glare layer 50 on the base film layer 70 includes: etching or rolling is performed on the base film layer 70 to manufacture the anti-dazzle layer 50, or spraying, coating or phase separation anti-dazzle material is performed on the base film layer 70 to manufacture the anti-dazzle layer 50; the equipment utilized in S500 may be an etcher, roller press, coater, or phase separation equipment;
s503, manufacturing an anti-reflection layer 60 on the anti-glare layer 50 to obtain an LED display module, wherein the visible light transmittance of the packaging layer 40 is more than 85%, and the visible light transmittance of the packaging layer 40, the base film layer 70, the anti-glare layer 50 and the anti-reflection layer 60 is more than 85%. Wherein, the way of manufacturing the anti-reflection layer 60 on the anti-glare layer 50 includes: the anti-glare layer 50 is provided with an anti-reflection layer 60 formed by magnetron sputtering, sol-gel or vapor deposition of an anti-reflection material. The device utilized in step S600 may be a magnetron sputtering device, a sol gel device, or a vapor deposition device.
In addition, the third aspect of the application also provides an LED display screen, which comprises the LED display module set of any one of the above. In the third aspect of the present application, an LED display module includes a substrate 10, a plurality of LED light emitting units 20, a black underfill layer 30, an encapsulation layer 40, a base film layer 70, an anti-glare layer 50, and an anti-reflection layer 60; the plurality of LED light emitting units 20 are arranged on the substrate 10 at intervals; the black underfill layer 30 is disposed in the gaps between the plurality of LED light emitting units 20, and the height of the black underfill layer 30 is lower than the height of the lower surface of the LED light emitting chip in the LED light emitting unit 20; the encapsulation layer 40 covers the plurality of LED light emitting units 20 and the black underfill layer 30, and the base film layer 70, the anti-glare layer 50 and the anti-reflection layer 60 are sequentially stacked on the encapsulation layer 40.
The black underfill layer 30 is an ink layer, the anti-glare layer 50 is a frosted structure etched on the base film layer 70, and the anti-reflection layer 60 is a magnesium fluoride layer, a titanium dioxide layer, a silicon dioxide layer, an aluminum oxide layer, a zirconium dioxide layer, a zinc sulfide layer, a silicon carbide layer or a silicon nitride layer sprayed on the frosted structure. The thickness of the anti-glare layer 50 is 0-15 μm, the haze of the anti-glare layer 50 is 0-90, the thickness of the anti-reflection layer 60 is 100-200nm, and the visible light reflectance of the anti-reflection layer 60 is less than 2%.
In general, the LED display module and the LED display screen based on the LED display module have the following main effects:
1. the surface of the packaging layer is subjected to antireflection treatment, so that the transmittance of the packaging layer is increased, the reflection of ambient light on the surface of the packaging layer is reduced, the influence of the ambient light on the contrast is reduced, and the surface glare is avoided.
2. The packaging layer has high transmittance, reduces energy loss and increases maximum brightness.
3. The substrate adopts a bottom ink-jet process, so that the consistency of ink colors on the surface of the substrate is improved, and the blackness of the display screen during black screen is improved.
4. The black underfill, high-transmittance encapsulation, surface anti-glare and anti-reflection encapsulation structure makes the display screen not be influenced by ambient light, and has the characteristics of high brightness, high contrast and anti-glare.
Although the present application has been described with reference to the preferred embodiments, it should be understood that the application is not limited to the particular embodiments described, but can be modified and altered by persons skilled in the art without departing from the spirit and scope of the application.
Claims (10)
1. The LED display module is characterized by comprising a substrate, a plurality of LED light-emitting units, a black bottom filling layer, a packaging layer, a base film layer, an anti-dazzle layer and an anti-reflection layer; the LED light-emitting units are arranged on the substrate at intervals; the black bottom filling layer is arranged in gaps among the LED light-emitting units, and the height of the black bottom filling layer is lower than the height of the lower surface of the LED light-emitting chip in the LED light-emitting unit; the packaging layer covers a plurality of LED light-emitting units and the black bottom filling layer, the base film layer, the anti-dazzle layer and the anti-reflection layer are sequentially stacked and arranged on the packaging layer, and the overall visible light transmittance of the packaging layer, the base film layer, the anti-dazzle layer and the anti-reflection layer is more than 85%.
2. The LED display module of claim 1, wherein the base film layer has a thickness of 200 μm or less; the thickness of the anti-dazzle layer is 0-15 mu m, and the haze of the anti-dazzle layer is 0-90; the anti-reflection layer is provided with 1 layer or multiple layers, the thickness of the whole anti-reflection layer is 100-500nm, and the visible light reflectivity of the whole anti-reflection layer is less than 2%.
3. The LED display module according to claim 1 or 2, wherein the base film layer is a PET base film layer or a TAC base film layer, and the base film layer is adhered to the encapsulation layer through optical cement.
4. The LED display module of claim 1 or 2, wherein the material of the black underfill layer is a black light absorbing material, the black light absorbing material comprising ink.
5. The LED display module according to claim 1 or 2, wherein the material of the antiglare layer is one or more of a cured epoxy resin, an acrylic resin, and an amino resin, or a mixed material of a resin material and metal oxide particles and/or metal nitride particles.
6. The LED display module of claim 1 or 2, wherein the material of the anti-reflective layer is one or more of magnesium fluoride, titanium dioxide, silicon dioxide, aluminum oxide, zirconium dioxide, zinc sulfide, silicon carbide, or silicon nitride.
7. The LED display module of claim 1 or 2, wherein the substrate is a PCB substrate, a BT resin substrate, a glass substrate, a silicon substrate, or a ceramic substrate; the packaging layer is made of transparent polymer materials, and the transparent polymer materials comprise organic silica gel, epoxy resin, acrylic gel or hot melt adhesive.
8. The manufacturing method of the LED display module is characterized by comprising the following steps of:
providing a substrate and a plurality of LED light-emitting units;
attaching a plurality of LED light-emitting units on the substrate at intervals, and completing the electrical connection between the plurality of LED light-emitting units and a power supply circuit;
manufacturing a black bottom filling layer in gaps among a plurality of LED light-emitting units, and controlling the height of the black bottom filling layer to be lower than the height of the lower surface of an LED light-emitting chip in the LED light-emitting units;
manufacturing a packaging layer on the black bottom filling layer and the LED light-emitting units;
a prefabricated optical film is arranged on the packaging layer, and comprises a base film layer, an anti-glare layer and an anti-reflection layer which are sequentially stacked to obtain an LED display module;
in the LED module, the light transmittance of the whole visible light of the packaging layer, the base film layer, the anti-dazzle layer and the anti-reflection layer is more than 85%.
9. The method of manufacturing an LED display module according to claim 8, wherein the manner of manufacturing the anti-glare layer on the base film layer includes: etching or rolling is carried out on the base film layer to manufacture the anti-dazzle layer, or spraying, coating or phase separation anti-dazzle material is sprayed on the base film layer to manufacture the anti-dazzle layer;
the method for manufacturing the anti-reflection layer on the anti-glare layer comprises the following steps: and manufacturing the anti-glare layer by magnetron sputtering, sol-gel or vapor deposition of an anti-reflection material.
10. An LED display screen comprising the LED display module of any one of claims 1-7.
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