CN116705670A - Grabbing method and device for height Wen Zhou - Google Patents

Grabbing method and device for height Wen Zhou Download PDF

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Publication number
CN116705670A
CN116705670A CN202310982163.3A CN202310982163A CN116705670A CN 116705670 A CN116705670 A CN 116705670A CN 202310982163 A CN202310982163 A CN 202310982163A CN 116705670 A CN116705670 A CN 116705670A
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China
Prior art keywords
wenzhou
gao
zhou
station
switch
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CN202310982163.3A
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CN116705670B (en
Inventor
肖伟兵
张武
林佳继
刘群
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Laplace New Energy Technology Co ltd
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Laplace New Energy Technology Co ltd
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Priority to CN202310982163.3A priority Critical patent/CN116705670B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Manipulator (AREA)

Abstract

The embodiment of the invention discloses a grabbing method and device for a height Wen Zhou. The capturing method of Wen Zhou of the capturing method of Gao Wenzhou comprises the following steps: controlling the detection device to move towards Gao Wenzhou to be handled, wherein the detection device comprises a plurality of resilient switches configured to trigger a plurality of first switch signals upon contact with the Gao Wenzhou; acquiring a plurality of first switch signals, and confirming the position offset information of Gao Wenzhou according to the plurality of first switch signals and a preset reference switch signal; moving the Gao Wenzhou to a gripping station according to the positional offset information; and controlling the mechanical arm to grab the Gao Wenzhou of the grabbing station. The grabbing method of Gao Wenzhou of the embodiment achieves the effects that the position deviation detection of the quartz boat is accurate, and the quartz boat is grabbed stably.

Description

Grabbing method and device for height Wen Zhou
Technical Field
The embodiment of the invention relates to the field of semiconductor equipment, in particular to a high Wen Zhou grabbing method and device.
Background
In the prior art, after the quartz boat of the tubular thermal processing equipment finishes the corresponding process on the carried wafer, the wafer which is required to be carried to finish the process is moved out of the thermal processing equipment, the surface temperature can reach more than 850 ℃ when the wafer is usually discharged, the wafer is required to be transferred by grabbing the quartz boat by a manipulator, the quartz boat is usually positioned by a laser sensor before the manipulator grabs the quartz boat in the prior art so as to avoid bumping the boat, but the situation that the positioning of the laser sensor is inaccurate is often caused due to the influence of the quartz boat and the high-temperature radiation of the environment, the event of bumping the boat is often caused when the manipulator grabs, and the safety and the efficiency of production are seriously influenced.
Disclosure of Invention
The embodiment of the invention provides a high Wen Zhou grabbing method and device, which achieve the effects of accurate detection of quartz boat position deviation information and stable and reliable grabbing of quartz boats.
According to an aspect of the present invention, there is provided a gripping method of height Wen Zhou, comprising:
the control height Wen Zhou is moved to the detection station;
controlling the detection device to move towards Gao Wenzhou to be handled, wherein the detection device comprises a plurality of resilient switches configured to trigger a plurality of first switch signals upon contact with the Gao Wenzhou;
acquiring a plurality of first switch signals, and confirming the position offset information of Gao Wenzhou according to the plurality of first switch signals and a preset reference switch signal;
moving the Gao Wenzhou to a gripping station according to the positional offset information;
and controlling the mechanical arm to grab the Gao Wenzhou of the grabbing station.
Further, the preset reference switch signals are a plurality of second switch signals triggered when the detection device contacts Gao Wenzhou last time; or (b)
The preset reference switch signals are a plurality of third switch signals triggered when the detection device contacts Gao Wenzhou located at an initial reference position.
Further, the acquiring the plurality of first switch signals includes:
acquiring the grounding voltage or the conducting current generated by the extruded elastic switch;
and taking the grounding voltage or the conducting current as the first switching signal.
Further, the determining the position offset information of Gao Wenzhou according to the plurality of first switch signals and the preset reference switch signal includes:
confirming a target sequence number of the extruded elastic switch according to the first switch signal;
confirming a reference sequence number of the extruded elastic switch according to the preset reference switch signal;
and confirming Gao Wenzhou position offset information according to the difference value between the target sequence number and the reference sequence number and the interval distance of the elastic switch.
Further, the determining Gao Wenzhou the position offset information according to the difference between the target sequence number and the reference sequence number and the preset interval distance of the elastic switch includes:
confirming the minimum sequence number/maximum sequence number in the target sequence numbers according to the sequence of the target sequence numbers;
confirming the minimum sequence number/maximum sequence number in the reference sequence numbers according to the sequence of the reference sequence numbers;
and confirming Gao Wenzhou the position offset information according to the difference value of the minimum serial number/the maximum serial number in the target serial number and the minimum serial number/the maximum serial number in the reference serial number and the preset interval distance of the elastic switch.
Further, the moving the Gao Wenzhou to the grabbing station according to the position offset information includes:
determining a moving direction of Gao Wenzhou to a grabbing station according to the positive and negative of the position offset information, or determining a moving direction of Gao Wenzhou to the grabbing station according to the positive and negative of the position offset information and the positioning distance;
and controlling the height Wen Zhou to be moved to the grabbing station according to the moving direction and the size of the position offset information.
Further, the moving the Gao Wenzhou to the grabbing station according to the position offset information includes:
determining a moving distance and a moving direction for moving Gao Wenzhou to a grabbing station according to the size of the position offset information and a preset positioning distance;
and controlling the high Wen Zhou to move to the grabbing station according to the moving direction and the moving distance.
Further, the controlling the mechanical arm to grasp the Gao Wenzhou of the grasping station includes:
determining if the Gao Wenzhou has reached the gripping station;
if the grabbing station is reached, the mechanical arm is controlled to move to the position below the lugs on the two sides of the height Wen Zhou along the second direction;
and controlling the mechanical arm to move along the third direction so as to grasp the Gao Wenzhou in a manner of lifting lugs of the mechanical arm.
According to an aspect of the present invention, there is provided a tall Wen Zhou gripping device comprising:
gao Wenzhou for removably loading wafers;
the manipulator is used for picking and placing Gao Wenzhou positioned at the grabbing station;
the detection device comprises a plurality of elastic switches, wherein the compressed positions of the elastic switches are used for determining position deviation information of the height Wen Zhou at the grabbing station;
and the control module is used for controlling the Gao Wenzhou to move to the detection station and controlling the detection device to move to Gao Wenzhou of the detection station before the height Wen Zhou is grabbed, confirming Gao Wenzhou position deviation information according to the compressed position of the elastic switch and moving the height Wen Zhou to the target grabbing station according to the position deviation information.
Further, the plurality of elastic switches comprise a first group of switches and a second group of switches, the first group of switches comprise a plurality of elastic switches which are equally spaced and are arranged along a first straight line, the second group of switches comprise a plurality of elastic switches which are equally spaced and are arranged along a second straight line, and the second group of switches are arranged at the interval positions of the first group of switches.
Compared with the prior art, the grabbing method and device of Gao Wenzhou of the embodiment adopt the elastic switch as the detection device to detect the position before grabbing Gao Wenzhou, so that the position detection by using the photoelectric sensor is avoided, the position detection error caused by a high-temperature environment is eliminated, the boat collision event of the manipulator during grabbing is avoided, and the safety and the efficiency of production are improved. Further, in this embodiment, the position offset information of Gao Wenzhou is detected by adopting a multi-point detection manner, so that detection errors or calculation errors caused by single-point touch false touch are reduced, and meanwhile, the upper and lower rows of probes are arranged in a staggered manner, so that the detection precision is increased, the contact area in the detection process is also increased, and the precision of the position offset information detection is further ensured.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a high Wen Zhou gripping device according to a first embodiment of the present invention;
fig. 2 is a schematic structural view of another state of the high Wen Zhou gripping device according to the first embodiment of the present invention;
fig. 3 is a schematic view of another view of the tall Wen Zhou gripping device provided in the first embodiment;
FIG. 4 is an enlarged schematic view of a probe device in a tall Wen Zhou gripping device provided in one embodiment;
fig. 5 is a schematic perspective view of a detecting device in the high Wen Zhou grabbing device according to an embodiment;
fig. 6 is a flow chart of a grabbing method of height Wen Zhou according to an embodiment.
Detailed Description
In order that those skilled in the art will better understand the present invention, a technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present invention and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the invention described herein may be implemented in other sequences than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Example 1
Fig. 1 is a schematic structural diagram of a high Wen Zhou gripping device according to an embodiment of the invention. Fig. 2 is a schematic structural diagram of another state of the high Wen Zhou gripping device according to the first embodiment of the present invention. Fig. 3 is a schematic view of another view of the tall Wen Zhou gripping device provided in the first embodiment. Fig. 4 is an enlarged schematic view of a probe device in a tall Wen Zhou gripping device provided in an embodiment. Fig. 5 is a schematic perspective view of a detecting device in the high Wen Zhou grabbing device according to an embodiment. In one embodiment, as shown in fig. 1-5, the tall Wen Zhou grasping device 100 comprises:
gao Wenzhou 110 for removably loading wafers;
a manipulator 120 for picking and placing Gao Wenzhou 110 located at the grabbing station;
the detecting device 130 comprises a plurality of elastic switches 131, wherein the compressed positions of the elastic switches 131 are used for determining the position deviation information of the height Wen Zhou at the grabbing station;
a control module (not shown) for controlling the Gao Wenzhou to move to the detection station and controlling the detecting device 130 to move to Gao Wenzhou of the detection station before the height Wen Zhou 110 is grabbed, confirming Gao Wenzhou the position shift information of the 110 according to the compressed position of the elastic switch 131 and moving the height Wen Zhou to the target grabbing station according to the position shift information.
In this embodiment, the movement of the Gao Wenzhou is performed along a first direction X, and the movement of the mechanical arm 120 is performed along a second direction Y or a third direction Z, where the first direction X is perpendicular to the second direction Y and the third direction Z. Gao Wenzhou 110 are typically disposed on a moving rail in the first direction X, which may be a screw driven by a motor or a platform driven by a belt, and preferably, the accuracy of the movement of the quartz boat in the first direction X may be more precisely controlled by driving the moving rail by a stepping motor. The mechanical arm 120 in this embodiment can be driven by a motor to move along the second direction Y and the third direction Z.
In this embodiment, the upper parts of two sides of the height Wen Zhou 110 are provided with the gripping lugs 112 (only one is shown in the figure), the lower part of the mechanical arm 120 is provided with the lifting claw 122 in a protruding manner, the detecting device 130 of this embodiment is fixedly arranged at the bottom of the lifting claw 122, and the end part of the elastic switch protrudes from the end surface of the lifting claw 122 towards Gao Wenzhou 110. In other embodiments, the detecting device 130 may be a separate telescopic mechanism that is not fixed to the movement of the mechanical arm 120 along the second direction Y.
When Gao Wenzhou moves to the detecting station along the first direction X, the end of the elastic switch 131 is aligned with the side wall of Gao Wenzhou, and when the lifting claw 122 of the mechanical arm 120 moves along the second direction Y to drive the end of the elastic switch 131 to contact the side wall of Gao Wenzhou, at least one elastic switch 131 is compressed to generate a first switch signal. As shown in fig. 1 or 3, when Gao Wenzhou 110 is moved in a first direction X to the gripping station, the ends of the resilient switch 131 are offset from the side walls of Gao Wenzhou. Referring to fig. 3, the lifting claw 122 of the mechanical arm 120 may move below the gripping ear 112 along the second direction Y, and then the lifting claw 122 of the mechanical arm 120 moves along the Z direction to lift the height Wen Zhou 110 by a preset distance and separate from the moving rail to complete the gripping action.
As shown in fig. 3, a plurality of the elastic switches 131 are arranged at equal intervals in the first direction X. The spacing distance of the elastic switch 131 in this embodiment is used to ensure the detection accuracy of the detection device 130.
Referring to fig. 4 together, the plurality of elastic switches 131 includes a first group of switches 131A and a second group of switches 131B, the first group of switches 131A includes a plurality of elastic switches equally spaced and arranged along a first line X1, and the second group of switches 131B are disposed at spaced positions of the first group of switches 131A and arranged along a second line X2. The spacing distance between any two elastic switches in this embodiment is W, preferably W may be 0.5-2 mm. In this embodiment, two rows of parallel staggered first switches 131A and second switches 131B are provided, so as to improve the detection accuracy of the detection device 130 and increase the detection contact area.
Further, the Gao Wenzhou switch is provided with positioning protrusions (not shown) corresponding to the elastic switches, for pressing a predetermined number of the elastic switches, for example, 3-5, preferably 3. In a preferred embodiment, the positioning bump can press at least two elastic switches of the first set of switches 131A and one elastic switch of the second set of switches 131B. Alternatively, the positioning tab may press at least one of the first set of switches 131A and two of the second set of switches 131B.
In one embodiment, the compressed position of the spring switch for determining the offset of the height Wen Zhou at the grasping station comprises: numbering the elastic switch according to the position of the elastic switch; acquiring a plurality of first switch signals triggered by compression of the elastic switch when the detection device contacts Gao Wenzhou; confirming a target sequence number of the extruded elastic switch according to the first switch signal; and confirming Gao Wenzhou position offset information according to the difference value between the target sequence number and the preset reference sequence number and the interval distance of the elastic switch. Referring to fig. 4, in one embodiment, the total number of the elastic switches 131 is 10, and the elastic switches arranged along the first direction X are sequentially numbered 1-10. Gao Wenzhou 110 the first switch signals of the elastic switch 131, which are triggered by compression when the detecting device 130 contacts Gao Wenzhou when moving to the reference detecting station, are three elastic switches numbered 5-7. The positioning distance between the reference detection station and the reference grabbing station in this embodiment may be preset at the time of initialization, for example, the reference detection station is 10 mm away from the reference grabbing station in the first direction X. As long as Gao Wenzhou 110 can be accurately moved to the reference probe station (the position where the three elastic switches numbered 5-7 are compressed) before the boat is dropped, wen Zhou can be accurately moved to the reference gripping station according to the positioning distance. The reference gripping station in this embodiment is the optimal position for the robot to grip Gao Wenzhou. In practice, the detection station and the reference detection station, where Gao Wenzhou 110 is stopped before the boat is dropped, do not completely coincide because of mechanical errors or accumulated errors.
In one embodiment, the height Wen Zhou 110 is moved to the detecting station before the boat is dropped and the detecting device 130 contacts Gao Wenzhou, the elastic switch 131 is compressed to trigger a plurality of first switch signals, and if the target serial number of the pressed elastic switch 131 is confirmed to be 5-7 according to the first switch signals, the current detecting station is indicated to be the reference detecting station, that is, the position offset information of Gao Wenzhou is confirmed to be 0 according to the difference between the target serial number and the preset reference serial number and the interval distance of the elastic switch. Only the height Wen Zhou 110 needs to be moved 10 mm back in the X direction to move the height Wen Zhou 110 to the optimal gripping station.
In another embodiment, the height Wen Zhou 110 is moved to the detecting station before the boat is dropped and the detecting device 130 contacts Gao Wenzhou, the elastic switch 131 is compressed to trigger a plurality of first switch signals, and if the target serial number of the pressed elastic switch 131 is confirmed to be 6-8 according to the first switch signals, it indicates that the current detecting station is a non-reference detecting station, that is, the position offset information of the elastic switch is confirmed Gao Wenzhou according to the difference between the target serial number and the preset reference serial number and the interval distance of the elastic switch to be (6-5) ×1 mm=1 mm. Then only the height Wen Zhou 110 needs to be moved in the X direction back (10+1) mm=11 mm to move the height Wen Zhou 110 to the optimal gripping station. In this embodiment, the position offset information calculation uses the minimum sequence numbers of the reference sequence numbers 5 to 7 and the target sequence numbers 6 to 8 as calculation references. In an alternative embodiment, the calculation of the position offset information may also use the maximum sequence number of each of the reference sequence number and the target sequence number as the calculation reference. It is convenient to understand that the calculation references of the embodiments described later are expressed by the minimum sequence numbers of the reference sequence number and the target sequence number.
In yet another embodiment, the height Wen Zhou 110 is moved to the detecting station before the boat is dropped and the detecting device 130 contacts Gao Wenzhou, the elastic switch 131 is compressed to trigger a plurality of first switch signals, and if the target serial number of the pressed elastic switch 131 is confirmed to be 2-4 according to the first switch signals, it indicates that the current detecting station is a non-reference detecting station, that is, the positional deviation information of Gao Wenzhou is confirmed to be (2-5) ×1 mm= -3 mm according to the difference between the target serial number and the preset reference serial number and the interval distance of the elastic switch. Then the height Wen Zhou 110 need only be moved in the X direction back (10-3) mm=7 mm to move the height Wen Zhou 110 to the optimal gripping station.
Compared with the prior art, the elastic switch is adopted as the detection device in the high Wen Zhou grabbing device to detect the position of Gao Wenzhou before grabbing, so that the photoelectric sensor is avoided, the position detection error caused by a high-temperature environment is eliminated, the boat collision event of the manipulator during grabbing is avoided, and the safety and the efficiency of production are improved. Further, the embodiment adopts the mode of multipoint detection to detect the position offset information of Gao Wenzhou, so that calculation errors caused by single-point touch false touch are reduced, and meanwhile, the upper and lower rows of probes are arranged in a staggered manner, so that the detection precision is increased, the contact area in the detection process is also increased, and the detection precision of the position offset information is further ensured.
Example two
Fig. 6 is a flow chart of a capturing method of height Wen Zhou according to the second embodiment of the present invention, and in an embodiment, the capturing method of height Wen Zhou may be performed by any of the capturing devices of height Wen Zhou.
Referring to fig. 1-5 together, the capturing method 600 of Gao Wenzhou of the present embodiment includes:
s610 controlling the detection device to move towards Gao Wenzhou to be handled, wherein the detection device comprises a plurality of resilient switches configured to trigger a plurality of first switch signals upon contact with the Gao Wenzhou;
specifically, the control module of this embodiment controls the movement of the upper portion Wen Zhou before gripping by the completion signal of the previous process of the upper portion Wen Zhou. The movement of Gao Wenzhou is performed along a first direction X, and the height Wen Zhou 110 is generally disposed on a moving rail along the first direction X, where the moving rail may be a screw driven by a motor or a platform driven by a belt, so as to drive the height Wen Zhou to move along the moving rail.
In this embodiment, the mechanical arm and the detection device may be driven by a motor to move along the second direction Y and the third direction Z, and the detection device is disposed at a side portion of the mechanical arm. In this embodiment, the upper parts of two sides of the height Wen Zhou 110 are provided with the gripping lugs 112 (only one is shown in the figure), the lower part of the mechanical arm 120 is provided with the lifting claw 122 in a protruding manner, the detecting device 130 of this embodiment is arranged at the bottom of the lifting claw 122, and the end part of the elastic switch protrudes out of the lifting claw 122.
In an alternative embodiment, the method may further include: the control height Wen Zhou is moved to the detection station, specifically, when the detection device is arranged at the grabbing station and independent of the mechanical arm, the detection station can be adjacent to or coincide with the grabbing station, and when the detection device is arranged at the mechanical arm and moves together with the mechanical arm, the detection station can be staggered from the grabbing station by a preset distance along the first direction X. In this embodiment, the preset positioning distance between the detection station and the grabbing station may be 0-20 mm, for example 10 mm.
S620, acquiring a plurality of first switch signals, and confirming the position offset information of the Gao Wenzhou according to the plurality of first switch signals and a preset reference switch signal;
in an embodiment, the acquiring the plurality of first switch signals includes:
acquiring the grounding voltage or the conducting current generated by the extruded elastic switch;
and taking the grounding voltage or the conducting current as the first switching signal.
Specifically, in an embodiment, each elastic switch may be pre-numbered according to the position of the elastic switch during the initialization of the detecting device 130. As shown in fig. 4, the number of the elastic switches is 10, the arrangement sequence of the elastic switches along the first direction X is numbered from 1 to 10 in sequence, and when the height Wen Zhou 110 moves to the reference detection station, the detection device 130 contacts Gao Wenzhou with a plurality of first switch signals triggered by compression of the elastic switches. In this embodiment, each elastic switch 131 includes two ends that can be electrically connected elastically, a top end and a bottom end, when the elastic switch is in a non-compressed state, the top end is in a suspended state, when the elastic switch is in a compressed state, the top end and the bottom end are electrically connected and transmit a ground voltage to the bottom end, then the ground voltage is transmitted to the control module through a cable connected to the bottom end, the control module uses the ground voltage as the first switch signal, and the number of the elastic switch can be confirmed according to the number of the cable corresponding to the ground voltage. In an alternative embodiment, when the elastic switch is in a compressed state, the top end and the bottom end are electrically connected and generate a conducting current, then the conducting current is transmitted to the control module through a cable connected with the bottom end, the control module takes the conducting current as the first switch signal, and the number of the elastic switch can be confirmed according to the number of the cable corresponding to the conducting current.
As shown in fig. 2, when Gao Wenzhou is moved to the detection position in the first direction X, the ends of the resilient switches are aligned with the sidewalls of Gao Wenzhou, and when the lifting claw 122 of the mechanical arm 120 is moved in the second direction Y to bring the ends of the resilient switches into contact with the sidewalls of Gao Wenzhou, at least one resilient switch 131 is compressed to generate a first switch signal. As shown in fig. 3, when Gao Wenzhou is moved to the gripping position in the first direction X, the end of the resilient switch 131 is offset from the side wall of Gao Wenzhou 110, and as shown in fig. 2, when the lifting claw 122 of the arm 120 is moved in the second direction Y below the gripping tab 112 and aligns with the tab 112, the lifting claw 122 of the arm 120 is moved in the Z direction to lift the height Wen Zhou 110 a predetermined distance and disengage from the moving rail to complete the gripping action.
In this embodiment, the preset reference switching signals are a plurality of third switching signals triggered when the detecting device contacts Gao Wenzhou located at the initial reference position. In one embodiment, the number of the elastic switches is 10, the number of the elastic switches is 1-10 in sequence along the first direction, and the number of the plurality of second switch signals triggered by compression of the elastic switches when the detecting device 130 contacts Gao Wenzhou when the height Wen Zhou moves to the reference detecting station is 5-7. The positioning distance between the reference detection station and the reference gripping station in this embodiment may be preset at the time of initialization, for example, a preset positioning distance of 10 mm offset from the gripping station in the first direction X. As long as Gao Wenzhou 110 can be accurately moved to the reference probe station before being launched, wen Zhou can be accurately moved to the reference gripping station according to the positioning distance.
In an alternative embodiment, the preset reference switching signals are a plurality of second switching signals triggered when the detecting device contacts Gao Wenzhou last time. Specifically, as long as no error occurs in the last time of grabbing quartz, the serial numbers of the elastic switches corresponding to the plurality of second switch signals triggered when the detection device contacts Gao Wenzhou last time can be used as reference serial numbers, so that accumulated errors caused by long-term wear of the machine are avoided.
In an embodiment, the determining the position offset information of the Gao Wenzhou according to the plurality of first switch signals and the preset reference switch signal includes:
confirming a target sequence number of the extruded elastic switch according to the first switch signal;
confirming a reference sequence number of the extruded elastic switch according to the preset reference switch signal;
and confirming Gao Wenzhou position offset information according to the difference value between the target sequence number and the reference sequence number and the interval distance of the elastic switch.
Further, the position offset information for confirming Gao Wenzhou according to the difference between the target sequence number and the reference sequence number and the preset interval distance of the elastic switch includes:
confirming the minimum sequence number/maximum sequence number in the target sequence numbers according to the sequence of the target sequence numbers;
confirming the minimum sequence number/maximum sequence number in the reference sequence numbers according to the sequence of the reference sequence numbers;
and confirming Gao Wenzhou the position offset information according to the difference value of the minimum serial number/the maximum serial number in the target serial number and the minimum serial number/the maximum serial number in the reference serial number and the preset interval distance of the elastic switch.
Specifically, in one embodiment, the height Wen Zhou 110 is moved to the detecting station before the boat is dropped and the detecting device contacts Gao Wenzhou, the elastic switch 131 is compressed to trigger a plurality of first switch signals, and if the target number of the pressed elastic switch is determined to be 5-7 according to the first switch signals, the current detecting station is indicated to be the reference detecting station. That is, the position offset information of Gao Wenzhou is confirmed to be 0 according to the difference between the target sequence number and the preset reference sequence number and the interval distance of the elastic switch.
In another embodiment, the height Wen Zhou 110 moves to the detecting station before the boat is dropped and the detecting device 130 contacts Gao Wenzhou, the elastic switch 131 is compressed to trigger a plurality of first switch signals, if the target serial number of the pressed elastic switch 131 is confirmed to be 6-8 according to the first switch signals, the current detecting station is indicated to be a non-reference detecting station (reference detecting station serial number is 5-7), and the position offset information of the elastic switch is confirmed Gao Wenzhou according to the difference between the minimum serial number in the target serial number and the minimum serial number in the reference serial number and the preset interval distance of the elastic switch to be (6-5) ×1 mm=1 mm.
In an alternative embodiment, the position offset information of the elastic switch can be confirmed Gao Wenzhou according to the difference between the maximum number in the target number and the maximum number in the reference number and the preset interval distance of the elastic switch, which is also (8-7) ×1 mm=1 mm.
In yet another embodiment, the height Wen Zhou 110 is moved to the detecting station before the boat is dropped and the detecting device 130 contacts Gao Wenzhou, the elastic switch is compressed to trigger a plurality of first switch signals, and if the target serial number of the pressed elastic switch 131 is confirmed to be 2-4 according to the first switch signals, it indicates that the current detecting station is a non-reference detecting station, that is, the positional deviation information of Gao Wenzhou is confirmed to be (2-5) ×1 mm= -3 mm according to the difference between the minimum serial number in the target serial number and the minimum serial number in the reference serial number and the preset interval distance of the elastic switch. Alternatively, the positional deviation information of the elastic switch is confirmed Gao Wenzhou from the difference between the maximum number of the target numbers and the maximum number of the reference numbers and the preset interval distance of the elastic switch to be (4-7) ×1 mm= -3 mm.
S630, moving the Gao Wenzhou to a grabbing station according to the position offset information;
in an embodiment, the moving the Gao Wenzhou to the grabbing station according to the position offset information includes:
determining a moving direction of Gao Wenzhou to a grabbing station according to the positive and negative of the position offset information, or determining a moving direction of Gao Wenzhou to the grabbing station according to the positive and negative of the position offset information and the positioning distance;
and controlling the height Wen Zhou to be moved to the grabbing station according to the moving direction and the size of the position offset information.
Further, moving the Gao Wenzhou to a gripping station according to the positional offset information includes:
determining a moving distance and a moving direction for moving Gao Wenzhou to a grabbing station according to the size of the position offset information and a preset positioning distance;
and controlling the high Wen Zhou to move to the grabbing station according to the moving direction and the moving distance.
Specifically, when the initialized detecting station and the grabbing station are substantially coincident (the preset positioning distance is 0), the Gao Wenzhou may be moved to the moving direction of the grabbing station according to the positive and negative determination of the position offset information, for example, the position offset information is regular that the moving direction is along the first direction, and the position offset information is negative that the moving direction is along the opposite direction of the first direction. At this time, the height Wen Zhou may be moved to the gripping station according to the absolute value of the positional deviation information and the movement direction control.
In a specific embodiment, the initialized detecting station and the grabbing station are set to be basically coincident, and when the position deviation information of Gao Wenzhou is 0, the grabbing station can directly grab.
When Gao Wenzhou the positional deviation information is 1 mm. Only the height Wen Zhou needs to be moved back in the X direction by 1 mm to move the height Wen Zhou to the optimal gripping station.
When Gao Wenzhou is 3 mm, the height Wen Zhou is only required to be moved 3 mm along the X direction, so that the height Wen Zhou can be moved to the optimal grabbing station.
Alternatively, when the initialized detecting station is far away from the grabbing station along the opposite direction of the first direction X by a preset positioning distance, a moving direction of moving Gao Wenzhou to the grabbing station may be determined according to the positive and negative of the position offset information and the positioning distance, for example, if the position offset information is positive and greater than the preset positioning distance, the moving direction is along the opposite direction of the first direction X. The position offset information is positive and smaller than the preset positioning distance, and the moving direction is along a first direction X; the positional shift information is negative, the moving direction is along the first direction X. At this time, the moving distance and the moving direction of the Gao Wenzhou to the gripping station may be determined according to the magnitude of the positional deviation information and a preset positioning distance.
In one embodiment, the initialized probe station is set to be 5 mm away from the grabbing station in the opposite direction of the first direction X, and when the position offset information of Gao Wenzhou is 0, the height Wen Zhou is only required to be moved 5 mm along the X direction, so that the height Wen Zhou can be moved to the optimal grabbing station.
When the position offset information of Gao Wenzhou is-3 mm, the height Wen Zhou is only required to be moved 5+3=8 mm along the X direction, so that the height Wen Zhou can be moved to the optimal gripping station.
When the position offset information of Gao Wenzhou is 1 mm, the height Wen Zhou is only required to be moved 5-1=4 mm along the X direction, so that the height Wen Zhou can be moved to the optimal gripping station.
When Gao Wenzhou the positional deviation information is 6 mm. Then the height Wen Zhou need only be moved 6-5 = 1 mm in the opposite direction of X to move the height Wen Zhou to the optimal gripping station.
Alternatively, when the initialized detecting station is far away from the grabbing station along the first direction X by a preset positioning distance, a moving direction of moving the Gao Wenzhou to the grabbing station may be determined according to the positive and negative of the position deviation information and the positioning distance, for example, if the position deviation information is negative, the moving direction is reversed along the first direction X. And if the position offset information is positive and the absolute value is smaller than the preset positioning distance, reversing the moving direction along the first direction X. And if the position offset information is positive and the absolute value is larger than the preset positioning distance, the moving direction is along the first direction X. At this time, the moving distance and the moving direction of the Gao Wenzhou to the gripping station may be determined according to the magnitude of the positional deviation information and a preset positioning distance.
In one embodiment, the initialized probe station is set to be 5 mm away from the grabbing station along the first direction X, and when the position deviation information of Gao Wenzhou is 0, the height Wen Zhou is only required to be reversely moved by 5 mm along the X direction, so that the height Wen Zhou can be moved to the optimal grabbing station.
When Gao Wenzhou the positional deviation information is 1 mm. Then it is only necessary to move the height Wen Zhou in the X direction by 5-1=4 mm in the reverse direction to move the height Wen Zhou to the optimal gripping station.
When the position deviation information of Gao Wenzhou is 6 mm, the height Wen Zhou is only required to be moved by 6-5=1 mm along the X direction, so that the height Wen Zhou can be moved to the optimal gripping station.
When the position offset information of Gao Wenzhou is-3 mm, the height Wen Zhou is only required to be moved by 5+3=8 mm in the X direction, so that the height Wen Zhou can be moved to the optimal gripping station.
In yet another alternative embodiment, the initialized probe station is set to be 10 mm away from the gripping station in the first direction X, and when the position offset information of Gao Wenzhou is 0, the height Wen Zhou is moved to the optimal gripping station only by moving the height Wen Zhou by 10 mm in the opposite direction of the X direction.
When Gao Wenzhou the positional deviation information is 1 mm. Then it is only necessary to move the height Wen Zhou in the X direction back 10-1=9 mm to move the height Wen Zhou to the optimal gripping station.
When the position offset information of Gao Wenzhou is-3 mm, the height Wen Zhou is only required to be moved by 10+3=13 mm in the X direction, so that the height Wen Zhou can be moved to the optimal gripping station.
And S640, controlling the mechanical arm to grab the Gao Wenzhou of the grabbing station.
In an embodiment, the controlling the mechanical arm to grasp the Gao Wenzhou of the grasping station includes:
determining if the Gao Wenzhou has reached the gripping station;
if the grabbing station is reached, the mechanical arm is controlled to move to the position below the lugs on the two sides of the height Wen Zhou along the second direction;
and controlling the mechanical arm to move along the third direction so as to grasp the Gao Wenzhou in a manner of lifting lugs of the mechanical arm.
Specifically, after adjusting the distance of the height Wen Zhou from the detection position to the grabbing position according to the position offset information of Gao Wenzhou, gao Wenzhou may be moved to the optimal grabbing position, as shown in fig. 2, at this time, the lifting claw 122 of the mechanical arm 120 is controlled to move below the grabbing ear 112 along the second direction Y, and then the lifting claw 122 of the mechanical arm 120 moves along the Z direction to lift the height Wen Zhou 110 by a preset distance and separate from the moving rail to complete the grabbing action.
Compared with the prior art, the capturing method of Gao Wenzhou of the embodiment achieves the effects that the quartz boat position deviation information is accurately detected, and the quartz boat is captured stably.
The above embodiments do not limit the scope of the present invention. It will be apparent to those skilled in the art that various modifications, combinations, sub-combinations and alternatives are possible, depending on design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of the present invention.

Claims (10)

1. A method of gripping a tall Wen Zhou, comprising:
controlling the detection device to move towards Gao Wenzhou to be handled, wherein the detection device comprises a plurality of resilient switches configured to trigger a plurality of first switch signals upon contact with the Gao Wenzhou;
acquiring a plurality of first switch signals, and confirming the position offset information of Gao Wenzhou according to the plurality of first switch signals and a preset reference switch signal;
moving the Gao Wenzhou to a gripping station according to the positional offset information;
and controlling the mechanical arm to grab the Gao Wenzhou of the grabbing station.
2. A gripping method of Gao Wenzhou according to claim 1, wherein:
the preset reference switch signals are a plurality of second switch signals triggered when the detection device contacts Gao Wenzhou last time; or (b)
The preset reference switch signals are a plurality of third switch signals triggered when the detection device contacts Gao Wenzhou located at an initial reference position.
3. A gripping method of Gao Wenzhou according to claim 1, wherein:
the acquiring the plurality of first switch signals includes:
acquiring the grounding voltage or the conducting current generated by the extruded elastic switch;
and taking the grounding voltage or the conducting current as the first switching signal.
4. A gripping method according to claim 3, gao Wenzhou, characterised in that:
the confirming the position offset information of the Gao Wenzhou according to the plurality of first switch signals and the preset reference switch signal includes:
confirming a target sequence number of the extruded elastic switch according to the first switch signal;
confirming a reference sequence number of the extruded elastic switch according to the preset reference switch signal;
and confirming Gao Wenzhou position offset information according to the difference value between the target sequence number and the reference sequence number and the interval distance of the elastic switch.
5. The method of gripping Gao Wenzhou of claim 4, further comprising:
the position offset information for confirming Gao Wenzhou according to the difference between the target sequence number and the reference sequence number and the preset interval distance of the elastic switch includes:
confirming the minimum sequence number/maximum sequence number in the target sequence numbers according to the sequence of the target sequence numbers;
confirming the minimum sequence number/maximum sequence number in the reference sequence numbers according to the sequence of the reference sequence numbers;
and confirming Gao Wenzhou the position offset information according to the difference value of the minimum serial number/the maximum serial number in the target serial number and the minimum serial number/the maximum serial number in the reference serial number and the preset interval distance of the elastic switch.
6. The method of gripping Gao Wenzhou of claim 4, further comprising:
the moving Gao Wenzhou to a gripping station according to the positional offset information includes:
determining a moving direction of Gao Wenzhou to a grabbing station according to the positive and negative of the position offset information, or determining a moving direction of Gao Wenzhou to the grabbing station according to the positive and negative of the position offset information and the positioning distance;
and controlling the height Wen Zhou to be moved to the grabbing station according to the moving direction and the size of the position offset information.
7. The method of gripping Gao Wenzhou of claim 4, further comprising:
the moving Gao Wenzhou to a gripping station according to the positional offset information includes:
determining a moving distance and a moving direction for moving Gao Wenzhou to a grabbing station according to the size of the position offset information and a preset positioning distance;
and controlling the high Wen Zhou to move to the grabbing station according to the moving direction and the moving distance.
8. A gripping method of Gao Wenzhou according to any one of claims 1 to 7, characterised in that:
the control mechanical arm grabs Gao Wenzhou of the grabbing station, including:
determining if the Gao Wenzhou has reached the gripping station;
if the grabbing station is reached, the mechanical arm is controlled to move to the position below the lugs on the two sides of the height Wen Zhou along the second direction;
and controlling the mechanical arm to move along a third direction so as to grasp the Gao Wenzhou in a mode of lifting lugs by the mechanical arm.
9. A tall Wen Zhou gripping device, comprising:
gao Wenzhou for removably loading wafers;
the manipulator is used for picking and placing Gao Wenzhou positioned at the grabbing station;
the detection device comprises a plurality of elastic switches, wherein the compressed positions of the elastic switches are used for determining position deviation information of the height Wen Zhou at the grabbing station;
and the control module is used for controlling the Gao Wenzhou to move to the detection station and controlling the detection device to move to Gao Wenzhou of the detection station before the height Wen Zhou is grabbed, confirming Gao Wenzhou position deviation information according to the compressed position of the elastic switch and moving the height Wen Zhou to the target grabbing station according to the position deviation information.
10. The Gao Wenzhou gripping device of claim 9, wherein the plurality of resilient switches comprises a first set of switches comprising a plurality of equally spaced resilient switches arranged along a first line and a second set of switches comprising a plurality of equally spaced resilient switches arranged along a second line and the second set of switches being disposed at spaced locations of the first set of switches.
CN202310982163.3A 2023-08-07 2023-08-07 Grabbing method and device for height Wen Zhou Active CN116705670B (en)

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Citations (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0926427A (en) * 1995-07-07 1997-01-28 Hewlett Packard Co <Hp> Positioning device and media moving type memory device usingpositioning device
JPH1142579A (en) * 1997-07-30 1999-02-16 Nippon Telegr & Teleph Corp <Ntt> Positioning position offset correcting method and device thereof
KR20020002866A (en) * 2000-06-30 2002-01-10 윤종용 Equpiment for fabricating semiconductor device
JP3248136B1 (en) * 2000-08-07 2002-01-21 株式会社プラムファイブ Probe method and probe device
JP2004156984A (en) * 2002-11-06 2004-06-03 Tokyo Electron Ltd Acquiring method of contact position of probe pin, correcting method of contact position of probe pin, and resolving method of contact error between probe devices
JP2004327491A (en) * 2003-04-21 2004-11-18 Toshiba Corp Semiconductor manufacturing apparatus
CN101770970A (en) * 2010-01-26 2010-07-07 沈阳富森科技有限公司 Automatic transmission device for reshipping quartz boat
WO2010140814A2 (en) * 2009-06-03 2010-12-09 주식회사 쎄믹스 Wafer probe station capable of actively controlling tilt of chuck and controlling method thereof
JP2013053968A (en) * 2011-09-06 2013-03-21 Hioki Ee Corp Substrate inspection device and correction information acquisition method
JP2014159978A (en) * 2013-02-19 2014-09-04 Hioki Ee Corp Substrate inspection device and correction information acquisition method
CN106783712A (en) * 2015-11-24 2017-05-31 沈阳新松机器人自动化股份有限公司 The method that dynamic wafer centre deviation position is verified in AWC systems
CN109545719A (en) * 2018-11-29 2019-03-29 德淮半导体有限公司 The working method of probe tester and probe tester
CN109781165A (en) * 2018-12-29 2019-05-21 南京协辰电子科技有限公司 The detection and its householder method, apparatus and system of probe deviations
WO2019102890A1 (en) * 2017-11-24 2019-05-31 日本電産リード株式会社 Substrate inspection device, inspection position correction method, position correction information generation method, and position correction information generation system
CN209071280U (en) * 2018-11-06 2019-07-05 长鑫存储技术有限公司 The detection device of wafer
CN110103231A (en) * 2019-06-18 2019-08-09 王保山 A kind of accurate grasping means and system for mechanical arm
CN110164789A (en) * 2019-06-05 2019-08-23 德淮半导体有限公司 Crystal round test approach and wafer tester
CN110802599A (en) * 2019-11-28 2020-02-18 爱孚迪(上海)制造***工程有限公司 System for grabbing parts from material frame under robot vision guidance and control method
CN111146103A (en) * 2018-11-06 2020-05-12 长鑫存储技术有限公司 Wafer detection method and detection equipment
CN211220728U (en) * 2019-06-26 2020-08-11 无锡松煜科技有限公司 Swing detection square box in LPCVD (low pressure chemical vapor deposition)
CN112173519A (en) * 2019-07-01 2021-01-05 上海快仓智能科技有限公司 Control method and automatic guided vehicle
US20210285762A1 (en) * 2018-08-14 2021-09-16 Renishaw Plc Method and apparatus for measurement cycle generation
CN113725136A (en) * 2021-08-30 2021-11-30 长江存储科技有限责任公司 Wafer alignment method, system, computer readable storage medium and processor
CN114800622A (en) * 2022-06-28 2022-07-29 江苏邑文微电子科技有限公司 Semiconductor equipment mechanical arm deviation detection method and device
CN218241795U (en) * 2022-08-24 2023-01-06 无锡江松科技股份有限公司 Primary and secondary quartz boat carrying mechanism
CN115763317A (en) * 2022-11-30 2023-03-07 沈阳芯源微电子设备股份有限公司 Wafer offset detection method
CN115763337A (en) * 2023-01-10 2023-03-07 拉普拉斯(无锡)半导体科技有限公司 Method for placing boat on purification table and purification table
CN116330643A (en) * 2023-02-28 2023-06-27 深圳市纵维立方科技有限公司 Detection device, detection method and lamination manufacturing equipment

Patent Citations (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0926427A (en) * 1995-07-07 1997-01-28 Hewlett Packard Co <Hp> Positioning device and media moving type memory device usingpositioning device
JPH1142579A (en) * 1997-07-30 1999-02-16 Nippon Telegr & Teleph Corp <Ntt> Positioning position offset correcting method and device thereof
KR20020002866A (en) * 2000-06-30 2002-01-10 윤종용 Equpiment for fabricating semiconductor device
JP3248136B1 (en) * 2000-08-07 2002-01-21 株式会社プラムファイブ Probe method and probe device
JP2004156984A (en) * 2002-11-06 2004-06-03 Tokyo Electron Ltd Acquiring method of contact position of probe pin, correcting method of contact position of probe pin, and resolving method of contact error between probe devices
JP2004327491A (en) * 2003-04-21 2004-11-18 Toshiba Corp Semiconductor manufacturing apparatus
WO2010140814A2 (en) * 2009-06-03 2010-12-09 주식회사 쎄믹스 Wafer probe station capable of actively controlling tilt of chuck and controlling method thereof
CN101770970A (en) * 2010-01-26 2010-07-07 沈阳富森科技有限公司 Automatic transmission device for reshipping quartz boat
JP2013053968A (en) * 2011-09-06 2013-03-21 Hioki Ee Corp Substrate inspection device and correction information acquisition method
JP2014159978A (en) * 2013-02-19 2014-09-04 Hioki Ee Corp Substrate inspection device and correction information acquisition method
CN106783712A (en) * 2015-11-24 2017-05-31 沈阳新松机器人自动化股份有限公司 The method that dynamic wafer centre deviation position is verified in AWC systems
WO2019102890A1 (en) * 2017-11-24 2019-05-31 日本電産リード株式会社 Substrate inspection device, inspection position correction method, position correction information generation method, and position correction information generation system
US20210285762A1 (en) * 2018-08-14 2021-09-16 Renishaw Plc Method and apparatus for measurement cycle generation
CN209071280U (en) * 2018-11-06 2019-07-05 长鑫存储技术有限公司 The detection device of wafer
CN111146103A (en) * 2018-11-06 2020-05-12 长鑫存储技术有限公司 Wafer detection method and detection equipment
CN109545719A (en) * 2018-11-29 2019-03-29 德淮半导体有限公司 The working method of probe tester and probe tester
CN109781165A (en) * 2018-12-29 2019-05-21 南京协辰电子科技有限公司 The detection and its householder method, apparatus and system of probe deviations
CN110164789A (en) * 2019-06-05 2019-08-23 德淮半导体有限公司 Crystal round test approach and wafer tester
CN110103231A (en) * 2019-06-18 2019-08-09 王保山 A kind of accurate grasping means and system for mechanical arm
CN211220728U (en) * 2019-06-26 2020-08-11 无锡松煜科技有限公司 Swing detection square box in LPCVD (low pressure chemical vapor deposition)
CN112173519A (en) * 2019-07-01 2021-01-05 上海快仓智能科技有限公司 Control method and automatic guided vehicle
CN110802599A (en) * 2019-11-28 2020-02-18 爱孚迪(上海)制造***工程有限公司 System for grabbing parts from material frame under robot vision guidance and control method
CN113725136A (en) * 2021-08-30 2021-11-30 长江存储科技有限责任公司 Wafer alignment method, system, computer readable storage medium and processor
CN114800622A (en) * 2022-06-28 2022-07-29 江苏邑文微电子科技有限公司 Semiconductor equipment mechanical arm deviation detection method and device
CN218241795U (en) * 2022-08-24 2023-01-06 无锡江松科技股份有限公司 Primary and secondary quartz boat carrying mechanism
CN115763317A (en) * 2022-11-30 2023-03-07 沈阳芯源微电子设备股份有限公司 Wafer offset detection method
CN115763337A (en) * 2023-01-10 2023-03-07 拉普拉斯(无锡)半导体科技有限公司 Method for placing boat on purification table and purification table
CN116330643A (en) * 2023-02-28 2023-06-27 深圳市纵维立方科技有限公司 Detection device, detection method and lamination manufacturing equipment

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