CN116669240B - Resistor and heating system based on subregion that graphite alkene generates heat - Google Patents
Resistor and heating system based on subregion that graphite alkene generates heat Download PDFInfo
- Publication number
- CN116669240B CN116669240B CN202310936629.6A CN202310936629A CN116669240B CN 116669240 B CN116669240 B CN 116669240B CN 202310936629 A CN202310936629 A CN 202310936629A CN 116669240 B CN116669240 B CN 116669240B
- Authority
- CN
- China
- Prior art keywords
- graphene
- resistor
- heating
- concentric
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 73
- 229910002804 graphite Inorganic materials 0.000 title abstract description 8
- 239000010439 graphite Substances 0.000 title abstract description 8
- -1 graphite alkene Chemical class 0.000 title abstract description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 248
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 238
- 230000005855 radiation Effects 0.000 claims abstract description 75
- 238000012546 transfer Methods 0.000 claims abstract description 65
- 239000000463 material Substances 0.000 claims description 34
- 239000012212 insulator Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 12
- 230000008569 process Effects 0.000 claims description 11
- 230000005611 electricity Effects 0.000 claims description 8
- 238000010521 absorption reaction Methods 0.000 description 15
- 230000008859 change Effects 0.000 description 15
- 230000000694 effects Effects 0.000 description 8
- 238000013139 quantization Methods 0.000 description 8
- 238000005070 sampling Methods 0.000 description 8
- 238000000638 solvent extraction Methods 0.000 description 8
- 238000012545 processing Methods 0.000 description 6
- 238000009827 uniform distribution Methods 0.000 description 6
- 125000004432 carbon atom Chemical group C* 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000005192 partition Methods 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 125000004429 atom Chemical group 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 238000001914 filtration Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 230000033001 locomotion Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 230000002035 prolonged effect Effects 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000007731 hot pressing Methods 0.000 description 3
- 230000003993 interaction Effects 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000009826 distribution Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 238000002329 infrared spectrum Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 206010053615 Thermal burn Diseases 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000017531 blood circulation Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 230000002124 endocrine Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000000554 physical therapy Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/145—Carbon only, e.g. carbon black, graphite
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
Landscapes
- Carbon And Carbon Compounds (AREA)
- Resistance Heating (AREA)
Abstract
The utility model provides a resistor and heating system that subregion generates heat based on graphite alkene, relates to resistor technical field, a resistor that subregion generates heat based on graphite alkene, the positive heat seal of unit resistance piece is a plurality of graphite alkene concentric conducting rings and draws independent positive pin, heat transfer resistance layer in the positive and the concentric conducting ring surface heat seal of a plurality of graphite alkene of unit resistance piece, heat transfer resistance layer covers the positive of unit resistance piece completely, heat transfer resistance layer's surface heat seal graphite alkene thermal radiation layer, graphite alkene thermal radiation layer's surface adopts the wave surface of spike, improve the yield of infrared ray. A heating system of a resistor based on partitioned heating of graphene, a patch thermistor and a temperature measuring circuit measure the temperature of a unit resistor sheet, temperature information is transmitted to a digital signal processor through an analog-to-digital converter, the digital signal processor controls the conduction and conduction time of the MOS tube through the digital-to-analog converter, controls the resistor for heating in the subarea to uniformly heat and temperature, and improves the uniformity of heating in the subarea.
Description
Technical Field
The invention relates to the technical field of resistors, in particular to a resistor for partitioned heating based on graphene and a heating system.
Background
The existing resistor can not effectively generate infrared rays suitable for human body absorption, and has the following specific problems: the existing resistor cannot effectively generate infrared rays suitable for human body absorption, the generated infrared energy is low, and the infrared rays cannot reach the standard of human body absorption, so that the physiotherapy effect of the infrared rays cannot be exerted; the energy consumption is high: the existing resistor has high energy consumption, and a large amount of electric energy is consumed to generate enough infrared energy, so that the use cost is increased; stability is poor: the existing resistor has poor stability and is easily influenced by factors such as ambient temperature, humidity and the like, so that the stability and consistency of infrared energy generated by the resistor are influenced.
The frequency spectrum of human body absorption infrared rays is mainly concentrated in a wave band of 6 to 14 microns, the wave band with small absorption capacity or non-absorption capacity is invalid heat energy, and a great deal of invalid heat energy is accumulated to cause heat stress reactions such as scalds, electrolytes, endocrine disturbance and the like, so that along with the development of technology, the requirements of people on life quality are higher and higher, the existing wearing products cannot generate infrared rays which are easy to be absorbed by human bodies, the temperature of a heating element cannot be uniformly controlled, and the infrared rays which are easy to be absorbed by human bodies cannot be well generated.
Disclosure of Invention
The invention aims to solve at least one of the problems, control the heating area and temperature in a partitioned heating mode, radiate infrared rays through peak wavy surfaces on the surface of a graphene layer, and provide a resistor and a heating system based on partitioned heating of graphene.
The technical solution for realizing the purpose of the invention is as follows:
a graphene-based zoned heating resistor, comprising: the graphene heat radiation device comprises a unit resistor disc, graphene concentric conducting rings, a graphene heat radiation layer, an insulator and a reflecting film, wherein the graphene concentric conducting rings comprise graphene concentric conducting rings or graphene regular polygon concentric conducting rings, the unit resistor disc is made of a first resistance material, the unit resistor disc comprises a round or regular polygon sheet structure, the front surface of the unit resistor disc is thermally sealed with a plurality of graphene concentric conducting rings and is led out of independent front pins, the front surface of the unit resistor disc and the surfaces of the graphene concentric conducting rings are thermally sealed with heat transfer resistor layers, the heat transfer resistor layers completely cover the front surface of the unit resistor disc, the heat transfer resistor layers are made of a second resistance material, the resistivity of the second resistance material is larger than that of the first resistance material, at least two layers of the heat transfer resistor layers are led out from layers inside the heat transfer resistor layer, the independent front pins are thermally sealed with the graphene heat radiation layer on the surface of the heat transfer resistor layer, and the surface of the graphene heat radiation layer adopts peak wavy surfaces; the back of the unit resistor disc is thermally sealed with a plurality of graphene concentric conducting rings and independent back pins are led out, and the back pins are wrapped by insulators; insulator layers are arranged on the side surfaces and the back surface of the unit resistor disc, and a reflecting film is plated on the surfaces of the insulator layers; switching on positions of the front pins and the back pins, converting electricity into heat energy by the unit resistor sheet, heating the unit resistor sheet in a region, converging the heat energy on the side surface and the back surface of the unit resistor sheet to the front surface by the reflecting film, transferring the heat energy by the heat transfer resistor layer, absorbing the heat energy by the graphene heat radiation layer, and radiating the heat energy outwards by peak wave surfaces of the graphene heat radiation layer; it should be noted that, the concentric conductive rings of graphene include concentric conductive rings of graphene or concentric conductive rings of regular polygon of graphene, the concentric conductive rings of graphene are multi-layer annular structures formed by graphene, each layer of graphene rings are connected together, form a concentric ring or regular polygon, these multi-layer graphene rings have very high conductivity, can realize the efficient electronic conduction; benefits of graphene concentric conductive rings or regular polygonal conductive rings in terms of uniform conductivity include: extremely high conductivity: graphene has a very high conductivity, about 6 times higher than copper; the graphene is used in the conductive ring, so that the overall conductivity can be improved, the current can be ensured to be uniformly distributed at each part of the conductive ring, and the resistance and the energy loss are reduced; no internal and external directionality: the conductive property of the graphene is not limited by an annular or polygonal structure, and the graphene has no internal and external directionality, which means that the conductive ring can uniformly conduct electricity in any direction and is not limited by the transmission path of current in the ring; excellent thermal conductivity: besides high electrical conductivity, the graphene has excellent thermal conductivity, and the graphene used in the conductive ring can promote uniform heat transfer, prevent heat concentration and improve the overall thermal conductivity; high stability: the graphene has extremely high chemical stability and good resistance to oxidation, corrosion and high temperature; the conductivity of the concentric conductive rings of graphene comes from the special structure and material property of graphene, the graphene is a two-dimensional material composed of carbon atoms, the graphene has excellent conductivity and conductivity, multiple layers of graphene rings are stacked together, and the rapid conduction of electrons in the concentric conductive rings can be realized by utilizing the interaction between the graphene layers; the graphene concentric conductive ring can regulate and control the conductive performance of the graphene concentric conductive ring by controlling parameters such as the number of layers, the size, the shape and the like of the graphene ring, so that the accurate control of electronic conduction is realized; the shape of the unit resistor sheet comprises a sheet-like structure of a circular or regular polygon shape, which can be more easily assembled and connected while also contributing to obtaining a uniform distribution of resistance values; the front surface of the unit resistor disc is thermally sealed with a plurality of graphene concentric conducting rings and independent front surface pins are led out, the graphene concentric conducting rings are formed by cutting graphene sheets into concentric ring shapes and combining the graphene sheets onto the front surface of the unit resistor disc in a hot pressing manner, so that a plurality of graphene conducting rings can be formed on the unit resistor disc, and the uniform distribution of current on the resistor disc can be improved; the graphene concentric conducting rings and the metal pins can be connected through welding or conducting wires, so that a unit resistor disc with independent pins is formed; the heat transfer resistance layer completely covers the front surface of the unit resistance sheet, ensures the partitioned conductive function of the plurality of graphene concentric conductive rings on the front surface of the unit resistance sheet, and simultaneously can improve the heat dissipation effect of the resistance sheet so as to avoid faults caused by overheating, and the resistivity of the second resistance material is higher than that of the first resistance material, so that the function of separating the plurality of graphene concentric conductive rings is achieved, for example, the heat transfer resistance layer adopts a conductor with good conductive performance, and the plurality of graphene concentric conductive rings are connected into a whole, so that the partitioned conductive function is lost; the heat transfer resistor layer is usually made of a heat conducting material, and can effectively radiate heat from the resistor sheet to keep the temperature of the resistor sheet low, so that the service life of the resistor sheet can be prolonged, and the working stability is improved; in addition, the heat transfer resistor layer can also protect the resistor from the external environment, such as dust, moisture and the like, so that the reliability of the resistor is improved; in general, the heat dissipation performance and stability of the resistor disc can be improved by the heat transfer resistor layer, so that the normal operation of the resistor disc is ensured; at least two layers of heat transfer resistance layers, wherein independent front pins are led out from the layers inside the heat transfer resistance layers; the heat transfer resistance layer at least comprises two layers, and can be two films made of different materials or two thick blocks made of different materials; the two layers may be bonded together by thermal glue or a thermal glue to ensure heat transfer from one layer to the other; the graphene heat radiation layer is thermally sealed on the surface of the heat transfer resistance layer, so that the graphene heat radiation layer has excellent heat conduction and electric conduction properties; therefore, the graphene heat radiation layer is thermally sealed on the surface of the heat transfer resistance layer, so that the heat transfer efficiency can be improved; the graphene heat radiation layer has the following characteristics of high thermal conductivity: the graphene has high thermal conductivity and can conduct heat rapidly; broadband absorption: graphene is capable of absorbing thermal energy over a wide range of wavelength bands; high-efficiency radiation: the graphene can generate strong heat radiation after being heated, so that heat is transferred to the surrounding environment; by thermally sealing the graphene heat radiation layer on the surface of the heat transfer resistance layer, the following effects can be achieved: improving the heat transfer efficiency: the high thermal conductivity of the graphene can rapidly conduct heat to the heat radiation layer and radiate the heat in a radiation manner, so that the heat transfer efficiency is improved; the surface area of the graphene thermal radiation layer can be increased by adopting a peak wave surface, so that the radiation absorption and emission capacity is enhanced; graphene is used as a two-dimensional material and has the characteristics of single-atom thickness and high conductivity; the unique electronic energy band structure ensures that the infrared light source has good thermoelectric property in the infrared band; the surface of the graphene heat radiation layer adopts a peak wave surface, so that the surface area of the graphene can be further increased; this is because the peak wave surface has more curved features, making the surface more undulating, thereby increasing the effective radiation absorption and emission area; by increasing the surface area, the graphene heat radiation layer can more effectively absorb and emit heat radiation energy; meanwhile, the contact area between the graphene and the surrounding environment can be increased by the wave surface of the peak, so that the heat conduction efficiency is further increased; in a word, the surface of the graphene heat radiation layer adopts a peak wave surface, and the radiation absorption and emission capacity can be enhanced by increasing the surface area, so that the application performance of graphene in thermoelectric conversion and heat radiation heat transfer is improved; the back of the unit resistor sheet is thermally sealed with a plurality of graphene concentric conducting rings and independent back pins are led out, and the back pins are wrapped by insulators so as to prevent the graphene conducting rings from being short-circuited and influence the regional heating of the unit resistor sheet; the back pins are wrapped by the insulator, so that the problem of short circuit caused by contact between the back pins and other metal structures can be avoided, and foreign matters can be prevented from entering gaps between the back pins and the graphene conductive rings to influence the performance of the resistor; the conductive ring and the pins of the unit resistor disc are effectively protected, the service life and the stability of the unit resistor disc are prolonged, and the manufacture and the maintenance of the resistor disc are facilitated; the side surfaces and the back surfaces of the unit resistor pieces are provided with insulator layers, the surfaces of the insulator layers are plated with reflecting films, the insulator layers play a role in thermal insulation, the reflecting films on the side surfaces and the back surfaces of the unit resistor pieces prevent heat energy from being dissipated from the side surfaces and the back surfaces in a reflecting mode, the total quantity of heat transported by the unit resistor pieces from the front surfaces is improved, and the unit resistor pieces convert electric energy into heat energy to transport the heat from the front surfaces to the heat transfer resistor layers and the graphene heat radiation layers; the heating speed of the unit resistor sheet is improved, and the heat energy is prevented from being dissipated from the side face and the back face by the reflecting film, so that the time required for the unit resistor sheet to reach the set temperature can be shortened, and the response speed of heating is improved; the infrared acquisition rate is improved, and as the side surfaces and the back surfaces of the unit resistor plates are provided with no graphene heat radiation layer, only the front surfaces of the unit resistor plates are provided with the graphene heat radiation layer, and an ideal infrared band is obtained through the graphene heat radiation layer; the graphene concentric conducting rings divide the unit resistor into different areas, the partition heating of the unit resistor utilizes the Joule heating effect to switch the conducting positions of the front pin and the back pin, the unit resistor converts electricity into heat energy, the unit resistor generates heat in the partition areas, the conducting positions of the front pin and the back pin are switched to change the current direction, and the principle that the unit resistor converts electric energy into heat energy is that resistance heat is generated when current passes through the resistor; when current passes through the cell resistor, electrons collide with atoms in the resistor, and kinetic energy of the electrons is converted into thermal motion of the atoms, so that the resistor heats; the graphene layer absorbs the heat energy of the unit resistor disc, the peak wavy surface on the surface of the graphene layer radiates infrared rays, the main wavelength range of the excited infrared rays is in the 6-14 micron wave band, and the obtaining rate of the 6-14 micron wave band is improved; when the movement state of carbon atoms in the graphene is changed, infrared rays with the main wavelength range of 6 to 14 microns are excited, the change of the infrared rays with the wavelength range of 6 to 14 microns along with the temperature change of the graphene is very small, and the infrared spectrum of human body absorption and emission is the infrared rays with the wavelength range of 6 to 14 microns.
A heating system of a resistor for zoned heating based on graphene, comprising: the device comprises a partitioned heating resistor, MOS tubes, a patch thermistor, a temperature measuring circuit, a digital signal processor DSP, a digital-to-analog converter DAC, an analog-to-digital converter ADC and a direct current power supply, wherein the MOS tubes comprise N-type MOS tubes and P-type MOS tubes, a plurality of pins of the partitioned heating resistor are respectively connected to one side of the partitioned heating resistor through a plurality of MOS tubes, the partitioned heating resistor is in a working state, one side of the current input is in a conducting state, one side of the current output is in a conducting state, and the other side of the current output is in a conducting state; the temperature information of the chip thermistors and the temperature measuring circuit are transmitted to the digital signal processor DSP through the analog-to-digital converter ADC, and the digital signal processor DSP controls the conduction and conduction time of the MOS tube through the digital-to-analog converter DAC to control the uniform heating and temperature of the resistors for heating in the subareas; the power supply system adopts a direct current power supply; it should be noted that, the back of the unit resistor sheet is stuck with a plurality of patch thermistors, for example, 3 or 5 patch thermistors are arranged in a concentric circle manner, so that the temperature of each area of the unit resistor sheet can be uniformly detected; the patch thermistor is used for measuring the temperature of the temperature unit resistor according to the change of the resistance value along with the temperature change; the temperature measuring circuit converts the change of the thermistor into an electric signal, and the electric signal is converted into a temperature value through measuring the temperature of the resistance card of the unit; specifically, the step of measuring the temperature of the cell resistor sheet is as follows: the patch thermistor is connected to a temperature measuring circuit, one end of the thermistor is usually connected to a power supply end of a power supply, the other end of the thermistor is connected to a signal acquisition end, and voltage or current is input to the thermistor through the temperature measuring circuit to generate a signal, wherein the magnitude of the signal is related to the resistance value and the temperature of the thermistor; converting a signal of the thermistor into a voltage or current signal by using an amplifying circuit and a filtering circuit, converting an analog signal of temperature into a digital signal by using an analog-to-digital converter ADC, transmitting the digital signal to a digital signal processor DSP, processing temperature information by the digital signal processor DSP, generating control information, and controlling a grid electrode of the MOS tube by using a digital-to-analog converter DAC; analog-to-Digital Converter (ADC) is used to convert an Analog signal into a digital signal, the Analog signal being a continuous signal and the digital signal being a discrete signal; the analog-to-digital converter inputs the analog signal and converts it into a digital signal for digital processing and storage, the process involves two steps of sampling and quantization, in the sampling process, the analog signal is measured and recorded in a fixed time interval, the time interval is a sampling period, the shorter the sampling period, the higher the resolution of the converter; the quantization process converts the sampled analog signal into discrete digital values. The purpose of quantization is to convert a continuous range of analog signals into a finite number of discrete values, the quantization level determining the resolution of the digital signal, i.e. the minimum amount of variation that the digital signal can represent; the digital signal processor DSP processes the temperature information, generates control information, controls the voltage of the grid electrode of the MOS tube through the digital-to-analog converter DAC, realizes conduction and non-conduction, and the length of conduction time, so as to realize the control of temperature, the digital signal processor DSP (Digital Signal Processor) is a microprocessor for processing digital signals, and when the temperature information is processed, the digital signal processor DSP algorithm and the filter process and analyze the temperature data, and perform operations such as filtering, denoising, precision adjustment and the like on the temperature information so as to obtain more accurate and stable temperature data; the processed temperature data is directly used for generating control information, and the digital signal processor DSP generates control signals according to the change condition of the temperature data, such as current, frequency, time and other parameters, so as to realize temperature control; the generated control signal is converted into an analog signal through a Digital-to-analog converter (DAC), and the DAC converts a Digital signal generated by a Digital Signal Processor (DSP) into an analog voltage so as to control the gate current of the MOS tube; the output of the DAC can be directly connected to the gate current input end of the MOS tube, or is amplified and filtered by other circuits and then connected to the gate current input end of the MOS tube; the on state of the MOS tube can be adjusted by controlling the grid voltage of the MOS tube, so that the temperature is controlled.
Compared with the prior art, the invention has the beneficial effects that:
(1) The concentric rings or regular polygons have very high conductivity, and can realize efficient electronic conduction; benefits of graphene concentric conductive rings or regular polygonal conductive rings in terms of uniform conductivity include: extremely high conductivity: graphene has a very high conductivity, about 6 times higher than copper; the graphene is used in the conductive ring, so that the overall conductivity can be improved, the current can be ensured to be uniformly distributed at each part of the conductive ring, and the resistance and the energy loss are reduced; no internal and external directionality: the conductive property of the graphene is not limited by an annular or polygonal structure, and the graphene has no internal and external directionality, which means that the conductive ring can uniformly conduct electricity in any direction and is not limited by the transmission path of current in the ring; excellent thermal conductivity: besides high electrical conductivity, the graphene has excellent thermal conductivity, and the graphene used in the conductive ring can promote uniform heat transfer, prevent heat concentration and improve the overall thermal conductivity; high stability: the graphene has extremely high chemical stability and good resistance to oxidation, corrosion and high temperature; the conductivity of the concentric conductive rings of graphene comes from the special structure and material property of graphene, the graphene is a two-dimensional material composed of carbon atoms, the graphene has excellent conductivity and conductivity, multiple layers of graphene rings are stacked together, and the rapid conduction of electrons in the concentric conductive rings can be realized by utilizing the interaction between the graphene layers; the graphene concentric conductive ring can regulate and control the conductive performance of the graphene concentric conductive ring by controlling parameters such as the number of layers, the size, the shape and the like of the graphene ring, so that the accurate control of electronic conduction is realized; the shape of the unit resistor sheet comprises a sheet-like structure of a circular or regular polygon shape, which can be more easily assembled and connected while also contributing to obtaining a uniform distribution of resistance values; the front surface of the unit resistor disc is thermally sealed with a plurality of graphene concentric conducting rings and independent front surface pins are led out, the graphene concentric conducting rings are formed by cutting graphene sheets into concentric ring shapes and combining the graphene sheets onto the front surface of the unit resistor disc in a hot pressing manner, so that a plurality of graphene conducting rings can be formed on the unit resistor disc, and the uniform distribution of current on the resistor disc can be improved;
(2) The side surfaces and the back surfaces of the unit resistor pieces are provided with insulator layers, the surfaces of the insulator layers are plated with reflecting films, the insulator layers play a role in thermal insulation, the reflecting films on the side surfaces and the back surfaces of the unit resistor pieces prevent heat energy from being dissipated from the side surfaces and the back surfaces in a reflecting mode, the total amount of heat transmitted by the unit resistor pieces from the front surfaces is improved, and the unit resistor pieces convert electric energy into heat energy to transmit the heat from the front surfaces to the heat transmission resistor layers and the graphene heat radiation layers; the heating speed of the unit resistor sheet is improved, and the heat energy is prevented from being dissipated from the side face and the back face by the reflecting film, so that the time required for the unit resistor sheet to reach the set temperature can be shortened, and the response speed of heating is improved; the infrared acquisition rate is improved, and as the side surfaces and the back surfaces of the unit resistor plates are provided with no graphene heat radiation layer, only the front surfaces of the unit resistor plates are provided with the graphene heat radiation layer, and an ideal infrared band is obtained through the graphene heat radiation layer.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural view of a unit resistance sheet of a graphene-based partitioned heating resistor;
FIG. 2 is a schematic structural view of graphene concentric rings of a resistor based on partitioned heating of graphene;
fig. 3 is a cross-sectional view of a unit resistive sheet of a graphene-based partitioned heat generating resistor.
In the drawings, the reference numerals and corresponding part names:
101-unit resistor disc, 201-third graphene concentric ring, 202-second graphene concentric ring, 203-first graphene concentric ring, 301-heat transfer resistor layer, 302-insulator layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. It will be apparent that the described embodiments are some, but not all, embodiments of the invention.
Thus, the following detailed description of the embodiments of the invention is not intended to limit the scope of the invention, as claimed, but is merely representative of some embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that, under the condition of no conflict, the embodiments of the present invention and the features and technical solutions in the embodiments may be combined with each other.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
The present invention will be described in further detail with reference to examples.
Embodiment 1, as shown in fig. 1 to 3, a resistor based on partitioned heating of graphene, includes: the graphene heat radiation device comprises a unit resistor disc, graphene concentric conducting rings, a graphene heat radiation layer, an insulator and a reflecting film, wherein the graphene concentric conducting rings comprise graphene concentric conducting rings or graphene regular polygon concentric conducting rings, the unit resistor disc is made of a first resistance material, the unit resistor disc comprises a round or regular polygon sheet structure, the front surface of the unit resistor disc is thermally sealed with a plurality of graphene concentric conducting rings and is led out of independent front pins, the front surface of the unit resistor disc and the surfaces of the graphene concentric conducting rings are thermally sealed with heat transfer resistor layers, the heat transfer resistor layers completely cover the front surface of the unit resistor disc, the heat transfer resistor layers are made of a second resistance material, the resistivity of the second resistance material is larger than that of the first resistance material, at least two layers of the heat transfer resistor layers are led out from layers inside the heat transfer resistor layer, the independent front pins are thermally sealed with the graphene heat radiation layer on the surface of the heat transfer resistor layer, and the surface of the graphene heat radiation layer adopts peak wavy surfaces; the back of the unit resistor disc is thermally sealed with a plurality of graphene concentric conducting rings and independent back pins are led out, and the back pins are wrapped by insulators; insulator layers are arranged on the side surfaces and the back surface of the unit resistor disc, and a reflecting film is plated on the surfaces of the insulator layers; switching on positions of the front pins and the back pins, converting electricity into heat energy by the unit resistor sheet, heating the unit resistor sheet in a region, converging the heat energy on the side surface and the back surface of the unit resistor sheet to the front surface by the reflecting film, transferring the heat energy by the heat transfer resistor layer, absorbing the heat energy by the graphene heat radiation layer, and radiating the heat energy outwards by peak wave surfaces of the graphene heat radiation layer; it should be noted that, the concentric conductive rings of graphene include concentric conductive rings of graphene or concentric conductive rings of regular polygon of graphene, the concentric conductive rings of graphene are multi-layer annular structures formed by graphene, each layer of graphene rings are connected together, form a concentric ring or regular polygon, these multi-layer graphene rings have very high conductivity, can realize the efficient electronic conduction; benefits of graphene concentric conductive rings or regular polygonal conductive rings in terms of uniform conductivity include: extremely high conductivity: graphene has a very high conductivity, about 6 times higher than copper; the graphene is used in the conductive ring, so that the overall conductivity can be improved, the current can be ensured to be uniformly distributed at each part of the conductive ring, and the resistance and the energy loss are reduced; no internal and external directionality: the conductive property of the graphene is not limited by an annular or polygonal structure, and the graphene has no internal and external directionality, which means that the conductive ring can uniformly conduct electricity in any direction and is not limited by the transmission path of current in the ring; excellent thermal conductivity: besides high electrical conductivity, the graphene has excellent thermal conductivity, and the graphene used in the conductive ring can promote uniform heat transfer, prevent heat concentration and improve the overall thermal conductivity; high stability: the graphene has extremely high chemical stability and good resistance to oxidation, corrosion and high temperature; the conductivity of the concentric conductive rings of graphene comes from the special structure and material property of graphene, the graphene is a two-dimensional material composed of carbon atoms, the graphene has excellent conductivity and conductivity, multiple layers of graphene rings are stacked together, and the rapid conduction of electrons in the concentric conductive rings can be realized by utilizing the interaction between the graphene layers; the graphene concentric conductive ring can regulate and control the conductive performance of the graphene concentric conductive ring by controlling parameters such as the number of layers, the size, the shape and the like of the graphene ring, so that the accurate control of electronic conduction is realized; the shape of the unit resistor sheet comprises a sheet-like structure of a circular or regular polygon shape, which can be more easily assembled and connected while also contributing to obtaining a uniform distribution of resistance values; the front surface of the unit resistor disc is thermally sealed with a plurality of graphene concentric conducting rings and independent front surface pins are led out, the graphene concentric conducting rings are formed by cutting graphene sheets into concentric ring shapes and combining the graphene sheets onto the front surface of the unit resistor disc in a hot pressing manner, so that a plurality of graphene conducting rings can be formed on the unit resistor disc, and the uniform distribution of current on the resistor disc can be improved; the graphene concentric conducting rings and the metal pins can be connected through welding or conducting wires, so that a unit resistor disc with independent pins is formed; the heat transfer resistance layer completely covers the front surface of the unit resistance sheet, ensures the partitioned conductive function of the plurality of graphene concentric conductive rings on the front surface of the unit resistance sheet, and simultaneously can improve the heat dissipation effect of the resistance sheet so as to avoid faults caused by overheating, and the resistivity of the second resistance material is higher than that of the first resistance material, so that the function of separating the plurality of graphene concentric conductive rings is achieved, for example, the heat transfer resistance layer adopts a conductor with good conductive performance, and the plurality of graphene concentric conductive rings are connected into a whole, so that the partitioned conductive function is lost; the heat transfer resistor layer is usually made of a heat conducting material, and can effectively radiate heat from the resistor sheet to keep the temperature of the resistor sheet low, so that the service life of the resistor sheet can be prolonged, and the working stability is improved; in addition, the heat transfer resistor layer can also protect the resistor from the external environment, such as dust, moisture and the like, so that the reliability of the resistor is improved; in general, the heat dissipation performance and stability of the resistor disc can be improved by the heat transfer resistor layer, so that the normal operation of the resistor disc is ensured; at least two layers of heat transfer resistance layers, wherein independent front pins are led out from the layers inside the heat transfer resistance layers; the heat transfer resistance layer at least comprises two layers, and can be two films made of different materials or two thick blocks made of different materials; the two layers may be bonded together by thermal glue or a thermal glue to ensure heat transfer from one layer to the other; the graphene heat radiation layer is thermally sealed on the surface of the heat transfer resistance layer, so that the graphene heat radiation layer has excellent heat conduction and electric conduction properties; therefore, the graphene heat radiation layer is thermally sealed on the surface of the heat transfer resistance layer, so that the heat transfer efficiency can be improved; the graphene heat radiation layer has the following characteristics of high thermal conductivity: the graphene has high thermal conductivity and can conduct heat rapidly; broadband absorption: graphene is capable of absorbing thermal energy over a wide range of wavelength bands; high-efficiency radiation: the graphene can generate strong heat radiation after being heated, so that heat is transferred to the surrounding environment; by thermally sealing the graphene heat radiation layer on the surface of the heat transfer resistance layer, the following effects can be achieved: improving the heat transfer efficiency: the high thermal conductivity of the graphene can rapidly conduct heat to the heat radiation layer and radiate the heat in a radiation manner, so that the heat transfer efficiency is improved; the surface area of the graphene thermal radiation layer can be increased by adopting a peak wave surface, so that the radiation absorption and emission capacity is enhanced; graphene is used as a two-dimensional material and has the characteristics of single-atom thickness and high conductivity; the unique electronic energy band structure ensures that the infrared light source has good thermoelectric property in the infrared band; the surface of the graphene heat radiation layer adopts a peak wave surface, so that the surface area of the graphene can be further increased; this is because the peak wave surface has more curved features, making the surface more undulating, thereby increasing the effective radiation absorption and emission area; by increasing the surface area, the graphene heat radiation layer can more effectively absorb and emit heat radiation energy; meanwhile, the contact area between the graphene and the surrounding environment can be increased by the wave surface of the peak, so that the heat conduction efficiency is further increased; in a word, the surface of the graphene heat radiation layer adopts a peak wave surface, and the radiation absorption and emission capacity can be enhanced by increasing the surface area, so that the application performance of graphene in thermoelectric conversion and heat radiation heat transfer is improved; the back of the unit resistor sheet is thermally sealed with a plurality of graphene concentric conducting rings and independent back pins are led out, and the back pins are wrapped by insulators so as to prevent the graphene conducting rings from being short-circuited and influence the regional heating of the unit resistor sheet; the back pins are wrapped by the insulator, so that the problem of short circuit caused by contact between the back pins and other metal structures can be avoided, and foreign matters can be prevented from entering gaps between the back pins and the graphene conductive rings to influence the performance of the resistor; the conductive ring and the pins of the unit resistor disc are effectively protected, the service life and the stability of the unit resistor disc are prolonged, and the manufacture and the maintenance of the resistor disc are facilitated; the side surfaces and the back surfaces of the unit resistor pieces are provided with insulator layers, the surfaces of the insulator layers are plated with reflecting films, the insulator layers play a role in thermal insulation, the reflecting films on the side surfaces and the back surfaces of the unit resistor pieces prevent heat energy from being dissipated from the side surfaces and the back surfaces in a reflecting mode, the total quantity of heat transported by the unit resistor pieces from the front surfaces is improved, and the unit resistor pieces convert electric energy into heat energy to transport the heat from the front surfaces to the heat transfer resistor layers and the graphene heat radiation layers; the heating speed of the unit resistor sheet is improved, and the heat energy is prevented from being dissipated from the side face and the back face by the reflecting film, so that the time required for the unit resistor sheet to reach the set temperature can be shortened, and the response speed of heating is improved; the infrared acquisition rate is improved, and as the side surfaces and the back surfaces of the unit resistor plates are provided with no graphene heat radiation layer, only the front surfaces of the unit resistor plates are provided with the graphene heat radiation layer, and an ideal infrared band is obtained through the graphene heat radiation layer; the graphene concentric conducting rings divide the unit resistor into different areas, the partition heating of the unit resistor utilizes the Joule heating effect to switch the conducting positions of the front pin and the back pin, the unit resistor converts electricity into heat energy, the unit resistor generates heat in the partition areas, the conducting positions of the front pin and the back pin are switched to change the current direction, and the principle that the unit resistor converts electric energy into heat energy is that resistance heat is generated when current passes through the resistor; when current passes through the cell resistor, electrons collide with atoms in the resistor, and kinetic energy of the electrons is converted into thermal motion of the atoms, so that the resistor heats; the graphene layer absorbs heat energy of the unit resistor disc, the peak wavy surface on the surface of the graphene layer radiates infrared rays, and the main wavelength range of the excited infrared rays is in a wave band of 6 to 14 microns; the graphene absorbs heat energy, when the movement state of carbon atoms in the graphene is changed, infrared rays with the main wavelength range of 6 to 14 microns are excited, the change of the infrared rays with the wavelength range of 6 to 14 microns along with the temperature change of the graphene is very small, and the infrared spectrum absorbed and emitted by a human body is the infrared rays with the wavelength range of 6 to 14 microns;
Further, the unit resistor disc adopts a sheet structure with uniform thickness, and it should be noted that the sheet structure with uniform thickness of the unit resistor disc 101 obtains uniformly distributed resistors to generate accurate resistance values, and in addition, the sheet structure with uniform thickness of the unit resistor disc 101 improves the heat dissipation performance of the resistor disc, prevents overheat damage, and the unit resistor disc 101 uniformly heats and dissipates heat without heat energy aggregation points so as to ensure the accuracy and stability of the resistance values; the front surface of the unit resistor 101 is thermally sealed with the heat transfer resistor layer 301, and the back surface of the unit resistor 101 is an insulator layer 302;
further, the unit resistor disc, the graphene concentric conducting ring and the graphene heat radiation layer are integrated by adopting a laser mode, and the control precision laser heat sealing is a technical method for heating two materials by adopting a laser beam and then fusing the two materials together; the working principle of laser heat sealing is that the high energy density of laser beam is utilized to heat the materials to the melting temperature, and then the two materials are pressed together to make the melted interfaces contact and combine together; the laser heat sealing unit resistor disc, the graphene concentric conductive ring and the graphene heat radiation layer are integrated, so that high-speed, high-precision, non-contact and pollution-free welding can be realized, the welding area is small, and no additional material is needed;
Further, the plurality of graphene concentric conductive rings are uniformly distributed on the front surface of the unit resistor disc in a concentric manner, and it is to be noted that the graphene concentric conductive rings are concentric circular rings or concentric regular polygons, for example, 3 or 5 graphene concentric conductive rings are taken as an example, and in combination with fig. 2, the graphene concentric conductive rings include: the first graphene concentric ring 203, the second graphene concentric ring 202 and the third graphene concentric ring 201 adopt a distribution mode of graphene concentric conductive rings, so that a continuous conductive path can be formed, the conductive performance is more uniform, and in addition, the diameters and the number of the graphene concentric conductive rings are adjusted according to actual requirements so as to meet different circuit requirements; the heating area of the front surface of the unit resistor disc is controlled through the graphene concentric conducting ring;
further, the plurality of graphene concentric conductive rings are uniformly distributed on the back surface of the unit resistor disc in a concentric manner, and it is to be noted that the graphene concentric conductive rings are concentric circular rings or concentric regular polygons, for example, 5 or 7 graphene concentric conductive rings, and taking 3 graphene concentric conductive rings as an example, in combination with fig. 2, the graphene concentric conductive rings include: the first graphene concentric ring 203, the second graphene concentric ring 202 and the third graphene concentric ring 201 adopt a distribution mode of graphene concentric conductive rings, so that a continuous conductive path can be formed, the conductive performance is more uniform, and in addition, the diameters and the number of the graphene concentric conductive rings are adjusted according to actual requirements so as to meet different circuit requirements; the heating area of the back surface of the unit resistor disc is controlled through the graphene concentric conducting ring;
Further, the front pins are not contacted with the unit resistor disc and the graphene heat radiation layer, the plurality of front pins penetrate through the inside of the heat transfer resistor layer and are not crossed and are independently led out from the side face, and it is required to be stated that the front pins are not contacted with the unit resistor disc and the graphene heat radiation layer, so that the conduction independence of the front pins is guaranteed, the partition heating can be guaranteed, the plurality of front pins penetrate through the inside of the heat transfer resistor layer, are not crossed and are independently led out from the side face, so that the conduction independence of the front pins is guaranteed, the short circuit phenomenon is not generated, and meanwhile, a complete space is provided for the graphene heat radiation layer.
Embodiment 2, a heating system of a resistor for zoned heating based on graphene, comprising: the device comprises a partitioned heating resistor, MOS tubes, a patch thermistor, a temperature measuring circuit, a digital signal processor DSP, a digital-to-analog converter DAC, an analog-to-digital converter ADC and a direct current power supply, wherein the MOS tubes comprise N-type MOS tubes and P-type MOS tubes, a plurality of pins of the partitioned heating resistor are respectively connected to one side of the partitioned heating resistor through a plurality of MOS tubes, the partitioned heating resistor is in a working state, one side of the current input is in a conducting state, one side of the current output is in a conducting state, and the other side of the current output is in a conducting state; the temperature information of the chip thermistors and the temperature measuring circuit are transmitted to the digital signal processor DSP through the analog-to-digital converter ADC, and the digital signal processor DSP controls the conduction and conduction time of the MOS tube through the digital-to-analog converter DAC to control the uniform heating and temperature of the resistors for heating in the subareas; the power supply system adopts a direct current power supply; it should be noted that, the back of the unit resistor sheet is stuck with a plurality of patch thermistors, for example, 3 or 5 patch thermistors are arranged in a concentric circle manner, so that the temperature of each area of the unit resistor sheet can be uniformly detected; the patch thermistor changes along with the temperature change according to the resistance value, and the change value of the resistance value corresponds to the temperature change value of the temperature unit resistor sheet one by one; the temperature measuring circuit converts the change of the thermistor into an electric signal, and the electric signal is converted into a temperature value through measuring the temperature of the resistance card of the unit; specifically, the step of measuring the temperature of the cell resistor sheet is as follows: the patch thermistor is connected to a temperature measuring circuit, one end of the thermistor is usually connected to a power supply end of a power supply, the other end of the thermistor is connected to a signal acquisition end, and voltage or current is input to the thermistor through the temperature measuring circuit to generate a signal, wherein the magnitude of the signal is related to the resistance value and the temperature of the thermistor; converting a signal of the thermistor into a voltage or current signal by using an amplifying circuit and a filtering circuit, converting an analog signal of temperature into a digital signal by using an analog-to-digital converter ADC, transmitting the digital signal to a digital signal processor DSP, processing temperature information by the digital signal processor DSP, generating control information, and controlling a grid electrode of the MOS tube by using a digital-to-analog converter DAC; analog-to-Digital Converter (ADC) is used to convert an Analog signal into a digital signal, the Analog signal being a continuous signal and the digital signal being a discrete signal; the analog-to-digital converter inputs the analog signal and converts it into a digital signal for digital processing and storage, the process involves two steps of sampling and quantization, in the sampling process, the analog signal is measured and recorded in a fixed time interval, the time interval is a sampling period, the shorter the sampling period, the higher the resolution of the converter; the quantization process converts the sampled analog signal into discrete digital values; the purpose of quantization is to convert a continuous range of analog signals into a finite number of discrete values, the quantization level determining the resolution of the digital signal, i.e. the minimum amount of variation that the digital signal can represent; the digital signal processor DSP processes the temperature information, generates control information, controls the voltage of the grid electrode of the MOS tube through the digital-to-analog converter DAC, realizes conduction and non-conduction, and the length of conduction time, so as to realize the control of temperature, the digital signal processor DSP (Digital Signal Processor) is a microprocessor for processing digital signals, and when the temperature information is processed, the digital signal processor DSP algorithm and the filter process and analyze the temperature data, and perform operations such as filtering, denoising, precision adjustment and the like on the temperature information so as to obtain more accurate and stable temperature data; the processed temperature data is directly used for generating control information, and the digital signal processor DSP generates control signals according to the change condition of the temperature data, such as current, frequency, time and other parameters, so as to realize temperature control; the generated control signal is converted into an Analog signal through a digital-to-Analog converter (DAC), and the DAC converts a digital signal generated by a Digital Signal Processor (DSP) into an Analog voltage so as to control the gate current of the MOS tube; the output of the DAC can be directly connected to the gate current input end of the MOS tube, or is amplified and filtered by other circuits and then connected to the gate current input end of the MOS tube; the on state of the MOS tube can be adjusted by controlling the grid voltage of the MOS tube, so that the temperature is controlled;
Further, when the MOS tube is connected with the pins of the resistor which generates heat in the subarea, the following principle is followed, the front pin is selected on the current input side, the back pin is selected on the current output side, otherwise, the back pin is selected on the current input side, and the front pin is selected on the current output side; the sources of a plurality of input side N-type MOS tubes on one side of the current input are respectively connected with a plurality of front pins or a plurality of back pins of the resistor which generates heat in a partitioning way, the drains of a plurality of input side N-type MOS tubes are connected to the positive electrode of the power supply, the drains of a plurality of output side N-type MOS tubes on one side of the current output are respectively connected with a plurality of back pins or a plurality of front pins of the resistor which generates heat in a partitioning way, and the sources of a plurality of output side N-type MOS tubes are connected to the negative electrode of the power supply; or the drains of the P-type MOS tubes at the input side of the current are respectively connected with the front pins or the back pins of the resistor which generates heat in a partitioning way, the sources of the P-type MOS tubes at the input side are connected to the positive electrode of the power supply, the sources of the P-type MOS tubes at the output side of the current are respectively connected with the back pins or the front pins of the resistor which generates heat in a partitioning way, and the drains of the P-type MOS tubes at the output side are connected to the negative electrode of the power supply; or the sources of the N-type MOS tubes on the input side of the current are respectively connected with the front pins or the back pins of the resistor which generates heat in a partitioning way, the drains of the N-type MOS tubes on the input side are connected to the positive electrode of the power supply, the sources of the P-type MOS tubes on the output side of the current are respectively connected with the back pins or the front pins of the resistor which generates heat in a partitioning way, and the drains of the P-type MOS tubes on the output side are connected to the negative electrode of the power supply; or the drains of the P-type MOS tubes on the input side of the current are respectively connected with the front pins or the back pins of the resistor which generates heat in a partitioning way, the sources of the P-type MOS tubes on the input side are connected to the positive electrode of the power supply, the drains of the N-type MOS tubes on the output side of the current are respectively connected with the back pins or the front pins of the resistor which generates heat in a partitioning way, and the sources of the N-type MOS tubes on the output side are connected to the negative electrode of the power supply.
The heating system of the resistor for zone heating based on the graphene is arranged in the glove, the outer layer of the glove is made of a thermal insulation and moisture-proof material, such as wool or polyester fiber, so as to keep the hands warm and prevent moisture from penetrating into the glove, the glove is provided with a small power supply and a control system, and the heating degree of the resistor for zone heating can be controlled through a button or a regulator, so that a user can adjust the temperature of the glove according to the requirement; by using the infrared heating glove, a user can keep hands warm in a cold environment and improve hand blood circulation through infrared rays, and the glove can be used for occasions such as outdoor work, winter sports, outdoor activities and rehabilitation.
The above embodiments are only for illustrating the present invention and not for limiting the technical solutions described in the present invention, and although the present invention has been described in detail in the present specification with reference to the above embodiments, the present invention is not limited to the above specific embodiments, and thus any modifications or equivalent substitutions are made to the present invention; all technical solutions and modifications thereof that do not depart from the spirit and scope of the invention are intended to be included in the scope of the appended claims.
Claims (8)
1. A graphene-based zoned heating resistor, comprising: the graphene heat radiation device comprises a unit resistor disc, graphene concentric conducting rings, a graphene heat radiation layer, an insulator and a reflecting film, wherein the graphene concentric conducting rings comprise graphene concentric conducting rings or graphene regular polygon concentric conducting rings, and the graphene heat radiation device is characterized in that the unit resistor disc adopts a first resistance material, the unit resistor disc comprises a round or regular polygon sheet structure, the front surface of the unit resistor disc is thermally connected with a plurality of graphene concentric conducting rings and leads out independent front pins, the front surface of the unit resistor disc and the surfaces of the plurality of graphene concentric conducting rings are thermally connected with a heat transfer resistance layer, the heat transfer resistance layer completely covers the front surface of the unit resistor disc, the heat transfer resistance layer adopts a second resistance material, the resistivity of the second resistance material is larger than that of the first resistance material, at least two layers of the heat transfer resistance layer are led out from layers inside the heat transfer resistance layer, the independent front pins are thermally connected with the graphene heat radiation layer on the surface of the heat transfer resistance layer, and the surface of the graphene heat radiation layer adopts peak wavy surfaces; the back of the unit resistor disc is thermally sealed with a plurality of graphene concentric conducting rings and independent back pins are led out, and the back pins are wrapped by insulators; insulator layers are arranged on the side surfaces and the back surface of the unit resistor disc, and a reflecting film is plated on the surfaces of the insulator layers; and switching on positions of the front pin and the back pin, converting electricity into heat energy by the unit resistor sheet, heating the unit resistor sheet in a region, converging the heat energy on the side surface and the back surface of the unit resistor sheet to the front surface by the reflecting film, transferring the heat energy by the heat transfer resistor layer, absorbing the heat energy by the graphene heat radiation layer, and radiating the heat energy outwards by peak wave surfaces of the graphene heat radiation layer.
2. The resistor based on the partitioned heating of the graphene according to claim 1, wherein the unit resistor disc, the concentric graphene conducting ring and the graphene heat radiation layer are thermally sealed and integrated in a laser mode.
3. The resistor for zoned heating based on graphene according to claim 1, wherein the unit resistive sheet adopts a sheet structure having a uniform thickness.
4. The resistor for zoned heating based on graphene according to claim 1, wherein a plurality of graphene concentric conductive rings are uniformly distributed on the front surface of the unit resistor sheet in a concentric manner.
5. A partitioned heating resistor based on graphene according to claim 1, wherein several concentric conductive rings of graphene are distributed uniformly in a concentric manner on the back of the cell resistor sheet.
6. A heating system of a resistor based on partitioned heating of graphene, which is a resistor based on partitioned heating of graphene according to any one of claims 1 to 5, comprising: the device comprises a partitioned heating resistor, MOS tubes, a patch thermistor, a temperature measuring circuit, a digital signal processor DSP, a digital-to-analog converter DAC, an analog-to-digital converter ADC and a direct current power supply, wherein the MOS tubes comprise N-type MOS tubes and P-type MOS tubes; the temperature information of the chip thermistors and the temperature measuring circuit are transmitted to the digital signal processor DSP through the analog-to-digital converter ADC, and the digital signal processor DSP controls the conduction and conduction time of the MOS tube through the digital-to-analog converter DAC to control the uniform heating and temperature of the resistors for heating in the subareas; the power supply system adopts a direct current power supply.
7. The heating system of the resistor for partitioned heating based on graphene according to claim 6, wherein the analog-to-digital converter ADC converts an analog signal of the temperature into a digital signal and then transmits the digital signal to the digital signal processor DSP.
8. The heating system of the resistor based on the partitioned heating of the graphene according to any one of claims 6 to 7, wherein the digital signal processor DSP processes the temperature information, generates control information and controls the gate of the MOS transistor through the digital-to-analog converter DAC.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310936629.6A CN116669240B (en) | 2023-07-28 | 2023-07-28 | Resistor and heating system based on subregion that graphite alkene generates heat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310936629.6A CN116669240B (en) | 2023-07-28 | 2023-07-28 | Resistor and heating system based on subregion that graphite alkene generates heat |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116669240A CN116669240A (en) | 2023-08-29 |
| CN116669240B true CN116669240B (en) | 2023-10-17 |
Family
ID=87722724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310936629.6A Active CN116669240B (en) | 2023-07-28 | 2023-07-28 | Resistor and heating system based on subregion that graphite alkene generates heat |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116669240B (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106793198A (en) * | 2017-01-05 | 2017-05-31 | 梁宇 | A kind of electric heating tape based on Graphene technology |
| CN212034379U (en) * | 2020-03-24 | 2020-11-27 | 重庆文理学院 | Graphite alkene film hand warmer |
| CN113154171A (en) * | 2021-05-26 | 2021-07-23 | 北京绿能嘉业新能源有限公司 | Graphene electric heat tracing structure for heat tracing of conveying pipeline |
| CN113242618A (en) * | 2021-05-21 | 2021-08-10 | 北京化工大学 | Heat conduction and heat preservation integrated graphene heating film |
| CN215716849U (en) * | 2021-07-21 | 2022-02-01 | 湖南亿润新材料科技有限公司 | Energy-saving type temperature-adjustable floor heating floor |
| CN216057529U (en) * | 2021-08-30 | 2022-03-15 | 深圳市千代电子材料有限公司 | Can prevent graphite alkene heating film of tripping operation |
| CN216330536U (en) * | 2021-08-27 | 2022-04-19 | 常州贝安生物科技有限公司 | Graphene composite human body infrared bionic material |
| CN114745820A (en) * | 2022-03-28 | 2022-07-12 | 绵阳中物烯科技有限公司 | Stackable graphene safety heating chip and manufacturing method thereof |
| CN114768104A (en) * | 2022-03-24 | 2022-07-22 | 安徽格兰科新材料技术有限公司 | Preparation method of graphene heating body with adjustable broadband thermal radiation emissivity |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102550303B1 (en) * | 2017-02-28 | 2023-07-03 | 서울대학교산학협력단 | Heating system and heatinng element |
-
2023
- 2023-07-28 CN CN202310936629.6A patent/CN116669240B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106793198A (en) * | 2017-01-05 | 2017-05-31 | 梁宇 | A kind of electric heating tape based on Graphene technology |
| CN212034379U (en) * | 2020-03-24 | 2020-11-27 | 重庆文理学院 | Graphite alkene film hand warmer |
| CN113242618A (en) * | 2021-05-21 | 2021-08-10 | 北京化工大学 | Heat conduction and heat preservation integrated graphene heating film |
| CN113154171A (en) * | 2021-05-26 | 2021-07-23 | 北京绿能嘉业新能源有限公司 | Graphene electric heat tracing structure for heat tracing of conveying pipeline |
| CN215716849U (en) * | 2021-07-21 | 2022-02-01 | 湖南亿润新材料科技有限公司 | Energy-saving type temperature-adjustable floor heating floor |
| CN216330536U (en) * | 2021-08-27 | 2022-04-19 | 常州贝安生物科技有限公司 | Graphene composite human body infrared bionic material |
| CN216057529U (en) * | 2021-08-30 | 2022-03-15 | 深圳市千代电子材料有限公司 | Can prevent graphite alkene heating film of tripping operation |
| CN114768104A (en) * | 2022-03-24 | 2022-07-22 | 安徽格兰科新材料技术有限公司 | Preparation method of graphene heating body with adjustable broadband thermal radiation emissivity |
| CN114745820A (en) * | 2022-03-28 | 2022-07-12 | 绵阳中物烯科技有限公司 | Stackable graphene safety heating chip and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116669240A (en) | 2023-08-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Ren et al. | High-performance wearable thermoelectric generator with self-healing, recycling, and Lego-like reconfiguring capabilities | |
| US5171733A (en) | Antenna-coupled high Tc superconducting microbolometer | |
| CN104183691B (en) | Planar flexible thermoelectric power generation structure | |
| CN105606236B (en) | A kind of passive and wireless temperature transducer and temp measuring method | |
| CN110138277A (en) | A kind of temperature difference electricity generation device based on radiation refrigeration and efficient absorption solar energy | |
| CN104868045B (en) | Electrooptical device and its application | |
| CN108552913A (en) | A kind of graphene heating carpet | |
| Briones et al. | Seebeck nanoantennas for solar energy harvesting | |
| JP2670366B2 (en) | Thermoelectric generator | |
| Zhang et al. | Wearable thermoelectric cooler based on a two-layer hydrogel/nickel foam heatsink with two-axis flexibility | |
| CN116669240B (en) | Resistor and heating system based on subregion that graphite alkene generates heat | |
| Liang et al. | Structural design for wearable self-powered thermoelectric modules with efficient temperature difference utilization and high normalized maximum power density | |
| CN207690829U (en) | Thermoelectric unit and its device | |
| US10811585B2 (en) | Thermoelectric device | |
| KR20180022906A (en) | Radiation heat sensor | |
| JP2001007412A (en) | Solar thermal electric power generator | |
| CN108365794B (en) | Light thermoelectric conversion component and its manufacturing method | |
| CN116634618B (en) | Stacked heating resistor based on graphene and electric heating system | |
| JP2010160954A (en) | Surface heater | |
| JP2004301818A (en) | Radiation detector | |
| CN105611810A (en) | Artificial/local thermal insulation composite heat sink | |
| KR200415926Y1 (en) | With generator for heater | |
| JP2015055524A (en) | Temperature sensor | |
| CN219096560U (en) | Graphene heating vehicle-mounted cup | |
| CN214843625U (en) | Optical power meter based on semiconductor thermoelectric generation piece |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |