CN116568966A - Light source unit - Google Patents

Abstract

The device is provided with: a socket housing having an engaging portion engaged with a predetermined member; a substrate having a base plate formed of a resin material and a wiring pattern formed on at least one surface in a thickness direction of the base plate; a light emitting element connected to the wiring pattern and functioning as a light source; an annular frame formed on the substrate and covering the light emitting element from the periphery; a sealing resin filled in the inner side of the frame body for sealing the light emitting element; and an electronic component bonded to the insertion pad formed on the outer peripheral side of the frame as a part of the wiring pattern, wherein the frame is formed by curing a resin material having fluidity applied on the substrate, and the smaller one of the interval between the frame and the insertion pad and the interval between the frame and the electronic component is set to 0.1mm or more.

Description

Light source unit

Technical Field

The present invention relates to a light source unit having a socket housing and a substrate disposed on the socket housing, and to a vehicle lamp.

Background

Examples of the vehicle lamp include the following: a light source unit is provided which is attachable to and detachable from a lamp housing comprising a lamp body and a cover, and a light emitting element such as a light emitting diode is used as a light source of the light source unit.

Such a light source unit is provided with a light emitting element functioning as a light source and a substrate on which at least a wiring pattern for supplying current to the light emitting element is formed, and the substrate is mounted on a socket housing and arranged (for example, refer to patent document 1).

Prior art literature

Patent literature

Patent document 1: japanese patent laid-open publication 2016-195099

Disclosure of Invention

Problems to be solved by the invention

As described in patent document 1, the above-described light source unit includes the following: in some cases, an annular frame is disposed around the light emitting element, and the light emitting element, a conductive wire (wire) connected to the light emitting element, and the like are sealed with a sealing resin made of a resin material filled inside the frame, and the frame is formed by curing a resin material having fluidity applied on a substrate. In such a configuration, the light emitting element, the conductive lead, and the like are protected by being sealed with the sealing resin, and a stable driving state of the light emitting element can be ensured.

However, since the resin material having fluidity is applied on the substrate when the frame is formed, the resin material may be in contact with the surrounding electronic components or the land (land) where the electronic components are bonded due to the fluidity of the resin material.

When such contact of the resin material with the electronic component or the like occurs, the resin material may adhere to the electronic component or the like due to surface tension, and the shape of the frame formed after the resin material is cured may be an inappropriate shape.

If the frame is formed in an improper shape, the sealing resin filled inside the frame may leak out from the frame to the outside, and the height of the sealing resin may be insufficient, so that the entire electronic component and the conductive lead may not be sealed with the sealing resin, and the light emitting element, the conductive lead, and the like may not be sufficiently protected by the sealing resin, and the driving state of the light emitting element may become unstable, and an appropriate light distribution state may not be ensured.

In addition, the case may also function as a light reflecting portion, and in this case, if the shape of the case is deformed, there is a possibility that the light cannot be properly reflected and the light cannot be properly emitted due to the surface deformation of the sealing resin. Further, in some cases, a lens is disposed on the sealing resin, and in this case, the shape of the lens may be deformed or inclined, and the light emission state may be inappropriate.

Still further, the following possibilities exist: the height of the frame is lower in the portion attached to the electronic component or the like due to the surface tension than in other portions, and the height of the resin filled inside the frame is locally lowered, and in some portions, the protection state of the light emitting element, the conductive lead or the like by the sealing resin becomes an inappropriate state.

Accordingly, an object of the light source unit of the present invention is to prevent contact between the housing and the electronic component or the connection portion and to ensure an appropriate light distribution state of light emitted from the light emitting element.

Means for solving the problems

In claim 1, a light source unit according to the present invention includes: a socket housing having an engaging portion engaged with a predetermined member; a substrate having a base plate formed of a resin material and a wiring pattern formed on at least one surface in a thickness direction of the base plate; a light emitting element connected to the wiring pattern and functioning as a light source; an annular frame formed on the substrate and covering the light emitting element from the periphery; a sealing resin filled inside the frame to seal the light emitting element; and an electronic component bonded to a land formed on an outer peripheral side of the frame as a part of the wiring pattern, wherein the frame is formed by curing a resin material having fluidity applied on the substrate, and a smaller one of a space between the frame and the land and a space between the frame and the electronic component is set to be 0.1mm or more.

Thus, even if the resin material for forming the frame body flows, the resin material does not reach any of the land and the electronic component, and the resin material does not adhere to the land and the electronic component due to surface tension.

In claim 2, another light source unit according to the present invention includes: a socket housing having an engagement portion engaged with a predetermined member and a heat radiation plate for radiating heat to the outside; a substrate having a base plate made of a resin material, a wiring pattern formed on at least one surface of the base plate in a thickness direction, and a heat dissipation pattern formed on the other surface of the base plate in the thickness direction, the heat dissipation pattern being connected to the heat dissipation plate; and a light emitting element connected to the wiring pattern and functioning as a light source, wherein an element thermal via having one end and the other end connected to the wiring pattern and the heat dissipation pattern, respectively, is formed on the substrate, and heat is transferred to the heat dissipation plate, and when an axis extending in a thickness direction of the substrate through the light emitting element is used as a reference axis, at least a part of the element thermal via is present on any one of the reference axes.

This allows the substrate to be formed at low cost, and the light emitting element and the element heat via hole are disposed close to each other, so that a transmission path of heat generated when the light emitting element is driven to the element heat via hole becomes short.

In the above-described another light source unit according to the present invention, in the 3 rd aspect, it is preferable that, when an axis passing through the center of the light emitting element among the reference axes is a central axis, at least a part of the element thermal via is present on the central axis.

Thus, the element thermal via is present near the center of the light emitting element.

In the fourth aspect of the present invention, in the above-described another light source unit according to the present invention, it is preferable that the entirety of the element thermal via is located in a projection space obtained by projecting the light emitting element in an axial direction of the reference axis.

Thus, the element thermal via does not exist outside the projection space.

In the aforementioned another light source unit according to the present invention, in claim 5, it is preferable that a package-type light emitting body is provided, in which a plurality of the light emitting elements are bonded to die attach pads (pads), respectively, and at least a plurality of the light emitting elements are sealed by sealing portions, a plurality of the element thermal vias are formed in the substrate, and at least a part of the element thermal vias are present on the reference axes of the plurality of the light emitting elements.

Thus, by mounting the package-type light-emitting body on the substrate without mounting the plurality of light-emitting elements on the substrate, the appropriate distance between the plurality of light-emitting elements is ensured, and the mounting work of the light-emitting elements on the substrate is facilitated.

In the above-described another light source unit according to the present invention, in the 6 th aspect, it is preferable that the plurality of electronic components are connected to the wiring pattern by solder, and the plurality of die pad are connected to the wiring pattern by solder.

Thus, the plurality of electronic components and the plurality of light emitting elements are connected to the wiring pattern by soldering, respectively.

In the above-described another light source unit according to the present invention, in claim 7, it is preferable that a resist is applied to the heat dissipation pattern, and the heat dissipation pattern is bonded to the heat dissipation plate through an adhesive having thermal conductivity with the resist interposed therebetween.

Thereby, the heat dissipation pattern is connected to the heat dissipation plate via the resist and the heat dissipation pattern is adhered to the heat dissipation plate by the adhesive having thermal conductivity.

In an 8 th aspect, a light source unit according to the present invention includes: a socket housing having an engagement portion engaged with a predetermined member and a heat radiation plate for radiating heat to the outside; a substrate having a base plate made of a resin material, a wiring pattern formed on at least one surface of the base plate in a thickness direction, and a heat dissipation pattern formed on the other surface of the base plate in the thickness direction, the heat dissipation pattern being connected to the heat dissipation plate; a light emitting element connected to the wiring pattern and functioning as a light source; a plurality of electronic components connected to the wiring pattern, including an integrated circuit; and a plurality of connection terminals connected to a power supply, including a ground terminal, wherein a circuit thermal via is formed in the substrate, one end and the other end of the circuit thermal via are connected to the wiring pattern and the heat dissipation pattern, respectively, and heat generated in the integrated circuit is transferred to the heat dissipation plate, the substrate is composed of a plurality of layers stacked in a thickness direction, the plurality of layers including a ground layer, the ground layer is formed with a ground pattern in an area of half or more, the circuit thermal via is connected to the ground pattern, and the ground pattern is connected to the ground terminal.

Accordingly, the circuit thermal vias that transfer heat generated in the integrated circuit to the heat sink are connected to the ground pattern formed in the area of half or more of the ground layer, and the ground pattern is connected to the ground terminal, so that the performance against electromagnetic noise is improved.

In the light source unit according to the 9 th aspect of the present invention, it is preferable that a heat dissipation pad is provided on a bottom surface of the integrated circuit, a plurality of the circuit thermal vias are formed, a circuit connection portion for connecting the heat dissipation pad is formed on the wiring pattern, and the plurality of the circuit thermal vias are connected to the circuit connection portion.

Thus, the plurality of circuit thermal vias are connected to the heat dissipation pad of the integrated circuit via the circuit connection portion.

In the light source unit according to the present invention, preferably, a package-type light emitting body is provided, wherein the package-type light emitting body is formed by bonding a plurality of the light emitting elements to die bonding pads, respectively, and at least a plurality of the light emitting elements are sealed by sealing portions, a plurality of element heat vias are formed in the substrate, one end portions and the other end portions of the plurality of element heat vias are connected to the wiring pattern and the heat dissipation pattern, respectively, and heat generated in the light emitting elements is transferred to the heat dissipation plate, the element heat vias are connected to the ground pattern, and the ground pattern is connected to the ground terminal.

Thus, by mounting the package-type light-emitting body on the substrate without mounting the plurality of light-emitting elements on the substrate, an appropriate distance between the plurality of light-emitting elements can be ensured, and the mounting operation of the light-emitting element 61 on the substrate becomes easy.

In the above-described light source unit according to the invention, in the 11 th aspect, it is preferable that a plurality of element connecting portions, each of which connects a plurality of the die pad pads, are formed in the wiring pattern, and the plurality of elements are connected to the element connecting portions by thermal vias.

Thus, the plurality of element thermal vias are connected to the die pad to which the light emitting element is bonded via the element connection portion.

In the aforementioned light source unit according to the invention, in claim 12, it is preferable that a resist is applied to the heat dissipation pattern, and the heat dissipation pattern is bonded to the heat dissipation plate through an adhesive having thermal conductivity with the resist interposed therebetween.

Thus, the heat dissipation pattern is connected to the heat dissipation plate through the resist, and the heat dissipation pattern is bonded to the heat dissipation plate through the adhesive having thermal conductivity.

In claim 13, a further light source unit according to the present invention includes: a socket housing having an engagement portion engaged with a predetermined member and a heat radiation plate for radiating heat to the outside; a substrate having a wiring pattern formed on at least one surface in a thickness direction and a heat dissipation pattern formed on the other surface in the thickness direction, the heat dissipation pattern being connected to the heat dissipation plate; a power supply body having a terminal holding portion formed of an insulating resin material and a connection terminal held by the terminal holding portion, both end portions of the connection terminal protruding from the terminal holding portion; and a light emitting element connected to the wiring pattern and functioning as a light source, wherein a 1 st connection portion and a 2 nd connection portion are formed on the substrate so as to be spaced apart in a thickness direction, a 1 st terminal insertion pad is formed on the 1 st connection portion, a 2 nd terminal insertion pad is formed on the 2 nd connection portion, a terminal through hole is formed between the 1 st connection portion and the 2 nd connection portion of the substrate, a part of the connection terminal is inserted through the terminal through hole from the 2 nd connection portion side, a size of the 2 nd terminal insertion pad is smaller than that of the 1 st terminal insertion pad, and a part of the connection terminal is bonded to the terminal through hole, the 1 st terminal insertion pad, and the 2 nd terminal insertion pad by brazing material.

Thus, the amount of solder adhering to the 2 nd terminal pad is smaller than the amount of solder adhering to the 1 st terminal pad, and the amount of solder flowing from the terminal through hole to the terminal holding portion side is reduced.

In the aforementioned light source unit according to the present invention, in the 14 th aspect, the power supply body is preferably held in a state where the terminal holding portion is embedded in the socket housing.

Thus, a part of the connection terminal is connected to the substrate in a state where the terminal holding portion is held by the receptacle housing.

In the above-described light source unit according to the 15 th aspect of the present invention, it is preferable that a resin molded portion made of a resin material having thermal conductivity is provided in the socket housing, and the terminal holding portion is embedded in the resin molded portion.

Thus, the resin molded portion in which the terminal holding portion is embedded releases heat generated in the light emitting element and the substrate to the outside.

In the 16 th aspect, in the above-described still another light source unit according to the present invention, it is preferable that a package-type light emitting body is provided, the package-type light emitting body is formed by bonding a plurality of the light emitting elements to die bonding pads, respectively, and at least a plurality of the heat dissipation plates and a plurality of the light emitting elements are sealed with a sealing resin, and the light emitting elements of the light emitting body are connected to the wiring pattern.

Thus, since the package-type light emitting body is mounted on the substrate, it is not necessary to mount the plurality of light emitting elements on the substrate, and it is possible to ensure an appropriate distance between the plurality of light emitting elements and to facilitate the mounting work of the light emitting elements on the substrate.

In claim 17, a further light source unit according to the present invention includes: a socket housing having an engagement portion engaged with a predetermined member and a heat radiation plate for radiating heat to the outside; a substrate having a base plate made of a resin material, a wiring pattern formed on at least one surface of the base plate in a thickness direction, and a heat dissipation pattern formed on the other surface of the base plate in the thickness direction, the heat dissipation pattern being connected to the heat dissipation plate; a light emitting element connected to the wiring pattern and functioning as a light source; and a plurality of electronic components connected to the wiring pattern, including an integrated circuit, and a ground portion formed between the outer periphery of the substrate and the integrated circuit as a part of the wiring pattern.

Thus, static electricity applied from the outer periphery of the substrate easily enters a grounding portion formed between the outer periphery of the substrate and the integrated circuit.

In the 18 th aspect, in the above-described still another light source unit according to the present invention, the ground portion is preferably formed on an outer peripheral portion of the substrate.

Thus, the ground portion can be formed in a shape along the outer periphery of the substrate, the formation area of the ground portion can be increased, and the ground portion can be formed at a position covering the integrated circuit from the outside.

In the 19 th aspect, in the above-described still another light source unit according to the present invention, it is preferable that a resist non-formation region to which no resist is applied is formed in the ground portion.

Thus, static electricity applied from the outer peripheral side of the substrate easily enters the ground portion from the resist non-formation region, and a portion of the ground portion other than the resist non-formation region can be protected by the resist.

In the above-described light source unit according to the 20 th aspect of the present invention, the substrate is preferably composed of a plurality of layers stacked in the thickness direction, and the substrate includes a ground layer having a ground pattern formed in an area of half or more of the ground layer, and a ground via connected to the ground portion is formed in the substrate, and the ground portion is preferably connected to the ground pattern through the ground via.

Thus, static electricity from the outer peripheral side of the substrate to the ground portion flows into the ground pattern having a large area from the ground through hole.

Effects of the invention

According to the present invention, even if the resin material for forming the frame body flows, the resin material does not reach any of the land and the electronic component, and the resin material does not adhere to the land and the electronic component due to surface tension, so that contact between the frame body and the electronic component or the connection portion can be prevented, and an appropriate light distribution state of light emitted from the light emitting element can be ensured.

Drawings

Fig. 1 is a view showing an embodiment of the present invention together with fig. 2 to 25, and fig. 1 is a cross-sectional view of a vehicle lamp.

Fig. 2 is a diagram showing a light source unit according to embodiment 1 together with fig. 3 to 14, and fig. 2 is an exploded perspective view of the light source unit.

Fig. 3 is a perspective view of the light source unit.

Fig. 4 is a sectional view of the light source unit.

Fig. 5 is a rear view of the light source unit.

Fig. 6 is a schematic plan view showing a mounted state of an electronic component or the like on a substrate.

Fig. 7 is an enlarged sectional view showing a state in which a lens is disposed on a sealing resin in which a light emitting element is sealed.

Fig. 8 is a plan view showing a part of the 1 st wiring layer and the like in the substrate.

Fig. 9 is a plan view showing a part of the ground layer in the substrate.

Fig. 10 is a plan view schematically showing a part of the heat dissipation layer in the substrate.

Fig. 11 is a cross-sectional view showing a light-emitting element, a substrate, and the like.

Fig. 12 is a cross-sectional view of a light-emitting element, a substrate, and the like, showing a state in which the central axis is displaced from the central axis.

Fig. 13 is a sectional view showing a connection state with a ground pattern or the like of the ground part.

Fig. 14 is a cross-sectional view showing a connection state of the connection terminal to the substrate, and the like.

Fig. 15 is a view showing a light source unit according to embodiment 2 together with fig. 16 to 25, and fig. 15 is an exploded perspective view of the light source unit.

Fig. 16 is a perspective view of the light source unit.

Fig. 17 is a schematic plan view showing a mounted state of an electronic component or the like on a substrate.

Fig. 18 is an enlarged cross-sectional view showing the substrate and the light emitter.

Fig. 19 is a plan view showing a part of the 1 st wiring layer and the like in the substrate.

Fig. 20 is a plan view showing a part of the ground layer in the substrate.

Fig. 21 is a plan view schematically showing a part of the heat dissipation layer in the substrate.

Fig. 22 is a cross-sectional view showing a light-emitting element, a substrate, and the like.

Fig. 23 is a cross-sectional view showing a light-emitting element, a substrate, and the like in a state where the central axis coincides with the central axis.

Fig. 24 is a sectional view showing a connection state with a ground pattern or the like of the ground part.

Fig. 25 is a cross-sectional view showing a connection state of the connection terminal to the substrate, and the like.

Detailed Description

Hereinafter, modes for carrying out the present invention will be described with reference to the drawings.

In the following description, the optical axis direction is defined as the front-rear direction, and the light emission direction is defined as the front direction, to indicate the front-rear, up-down, left-right directions. The directions of the front, rear, up, down, left, and right shown below are merely for convenience of description, and the practice of the present invention is not limited to these directions.

< schematic Structure of vehicle Lamp >

First, a schematic configuration of the vehicle lamp will be described (see fig. 1).

The vehicle lamp 1 includes: a lamp body 2 having a recess opening forward; and a cover 3 closing the opening 2a on the rear side of the lamp body 2. The lamp housing 4 is constituted by the lamp body 2 and the cover 3, and an inner space of the lamp housing 4 is formed as a lamp chamber 5.

The rear end portion of the lamp body 2 is provided with a substantially cylindrical unit mounting portion 6 penetrating forward and backward, and a space inside the unit mounting portion 6 is formed as a mounting hole 6a. The engagement projections 7, 7 protruding inward are provided on the inner peripheral surface of the unit mounting portion 6 so as to be spaced apart in the circumferential direction. The inner surface of the lamp body 2 is formed as a reflecting surface 2b by, for example, metal vapor deposition.

The vehicle lamp 1 includes a lamp housing 4 composed of a lamp body 2 and a cover 3, and a light source unit 8 that is detachable from a unit mounting portion 6 of the lamp body 2. The vehicle lamp 1 may be configured to include a light source unit 8A that is detachable from the unit mounting portion 6 in addition to the lamp housing 4.

The light source unit 8 is used, for example, in a combination lamp having the functions of a stop lamp and a tail lamp, and the light source unit 8A is used, for example, in a lamp having the function of a fog lamp. However, the application range of the present invention is not limited to a light source unit used in a combination lamp having a function of a stop lamp and a tail lamp or a lamp having a function of a fog lamp, and a vehicle lamp including the light source unit.

The light source unit of the present invention is not limited to a combination lamp or a single-function lamp, and can be widely applied to a light source unit used for various vehicle lamps other than a stop lamp, a tail lamp, and a fog lamp. The vehicle lamp according to the present invention can be widely applied to vehicle lamps including these various light source units.

< Structure of light Source Unit according to embodiment 1 >

Hereinafter, the structure of the light source unit 8 according to embodiment 1 will be described (see fig. 2 to 14).

The light source unit 8 includes a socket housing 9, a power supply 10, and a light emitting module 11 (see fig. 2 to 4).

The socket housing 9 is formed by integrally molding the resin molded portion 12 and the heat dissipation plate 13, for example. As the integral molding, for example, so-called insert molding is used in which a molded article is integrally formed from a metal material and a resin material by filling a molten resin (resin material) in a state in which the metal material is held in a cavity of a mold. In the socket housing 9, the metal material corresponds to the heat radiation plate 13, and the resin material corresponds to the resin molded portion 12.

The resin molded part 12 is excellent in heat conductivity, and is formed of a resin material containing carbon or the like, for example, and also has electrical conductivity. The resin molding part 12 includes: a disk-shaped base surface portion 14 facing in the front-rear direction, a projecting portion 15 projecting forward from a central portion of the base surface portion 14, 1 st heat radiation fins 16, 16 projecting rearward from the base surface portion 14, 2 nd heat radiation fins 17, 17 projecting rearward from the base surface portion 14, and a connector coupling portion 18 projecting rearward from the base surface portion 14.

The protruding portion 15 has a substrate arrangement portion 19 formed in a circular shape in outer shape and engaging portions 20, 20 protruding from an outer peripheral surface of the substrate arrangement portion 19.

The substrate arrangement portion 19 has an arrangement recess 19a that opens forward. The arrangement recess 19a is formed in a substantially rectangular shape and is larger than the outer shape of the light emitting module 11 by one turn. The engaging portions 20, 20 are provided at intervals in the circumferential direction. The engaging portions 20, 20 are located at the front end portion of the substrate disposing portion 19.

The 1 st heat radiation fins 16, 16 are arranged at equal intervals in the right-left direction, for example, and protrude from, for example, the upper half of the portions other than the right and left end portions of the base surface portion 14 (see fig. 4 and 5).

The 2 nd fins 17, 17 are located on both sides of the 1 st fins 16, 16 in the right-left direction, respectively, and protrude from both right and left end portions of the base surface portion 14. The thickness of the 2 nd fins 17, 17 in the left-right direction is thicker than the thickness of the 1 st fins 16, 16.

The connector coupling portion 18 is formed in a cylindrical shape in the front-rear direction in the axial direction, and is located below the 1 st heat radiating fins 16, 16.

The heat sink 13 functions as a heat sink, and is formed into a predetermined shape from a plate-like metal material such as aluminum having high heat conductivity (see fig. 2 and 4). The resin molded portion 12 is also formed of a resin material having excellent heat conductivity, and therefore also functions as a heat sink together with the heat sink 13.

The heat sink 13 is constituted by a 1 st heat sink portion 13a, 2 nd heat sink portions 13b, 3 rd heat sink portions 13c, and 4 th heat sink portions 13d, 13 d.

The 1 st heat dissipation portion 13a and the 3 rd heat dissipation portions 13c, 13c are formed in a substantially rectangular shape in the front-rear direction, and the 2 nd heat dissipation portions 13b, 13b and the 4 th heat dissipation portions 13d, 13d are formed in a substantially rectangular shape in the left-right direction. The distal ends of the 2 nd heat dissipation portions 13b, 13b are continuous with the left and right ends of the 1 st heat dissipation portion 13a, the inner ends of the 3 rd heat dissipation portions 13c, 13c are continuous with the rear ends of the 2 nd heat dissipation portions 13b, and the outer ends are continuous with the distal ends of the 4 th heat dissipation portions 13d, 13 d. Therefore, the 2 nd heat dissipation portions 13b and 13b are formed by bending in the direction orthogonal to the 1 st heat dissipation portion 13a, the 3 rd heat dissipation portions 13c and 13c are formed by bending in the direction orthogonal to the 2 nd heat dissipation portions 13b and 13b, and the 4 th heat dissipation portions 13d and 13d are formed by bending in the direction orthogonal to the 3 rd heat dissipation portions 13c and 13c, respectively.

The 1 st heat radiation portion 13a of the heat radiation plate 13 is located in the arrangement recess 19a of the substrate arrangement portion 19 in the resin molding portion 12, and is exposed to the resin molding portion 12 (see fig. 4). The 4 th heat dissipation portions 13d and 13d of the heat dissipation plate 13 are located inside the 2 nd heat dissipation fins 17 and 17, respectively, the 2 nd heat dissipation portions 13b and 13b are located inside the substrate arrangement portion 19, and the 3 rd heat dissipation portions 13c and 13c are located inside the base surface portion 14.

In the resin molded portion 12, an insertion hole 12a is formed at a position from the substrate placement portion 19 to the base surface portion 14, and the insertion hole 12a communicates with the placement recess 19a and the inside of the connector coupling portion 18 (see fig. 2).

The power supply body 10 includes: a terminal holding portion 21 formed of an insulating resin material, and connection terminals 22, and 22, the connection terminals 22, and 22 being held by the terminal holding portion 21 and connected to a power supply circuit (external power) (see fig. 2 and 3).

The terminal holding portion 21 is formed in a flat shape with a thin upper and lower thickness, extending in the front-rear direction.

The connection terminals 22, 22 are formed of a metal material, and the inside of the terminal holding portion 21 is located at a position aligned in the left-right direction except for a part thereof. The connection terminal 22 includes a terminal portion 23 extending in the front-rear direction and release preventing protrusions 24, 24 protruding in opposite directions from a position near the front end of the terminal portion 23. The rear end portion of the terminal portion 23 is provided as a connector connecting portion 23a, and the front end portion is provided as a pattern connecting portion 23b.

The connector connecting portion 23a of the connection terminal 22 protrudes rearward from the terminal holding portion 21, and the pattern connecting portion 23b protrudes forward from the terminal holding portion 21. The connection terminal 22 is prevented from coming off from the terminal holding portion 21 in the front-rear direction by the retaining projections 24, 24 being located inside the terminal holding portion 21.

One of the connection terminals 22, 22 is provided as a ground terminal 22G for grounding, and the other two are provided as power supplies. One of the connection terminals 22, 22 for power supply is used as a stop lamp, and the other is used as a tail lamp.

The terminal holding portion 21 and the connection terminals 22, 22 of the power supply body 10 are integrally formed by insert molding, for example. The portions of the power supply body 10 other than the connector connection portions 23a, 23a and the pattern connection portions 23b, 23b are inserted into the insertion arrangement holes 12a formed in the resin molding portion 12, the connector connection portions 23a, 23a are located inside the connector coupling portion 18 (see fig. 5), and the pattern connection portions 23b, 23b are located in the arrangement recess 19a (see fig. 3).

The power supply body 10 is disposed in a cavity of a mold in a state of being formed by insert molding, for example, and is filled with a molten resin for forming the resin molded portion 12, and is formed integrally with the socket housing 9 by insert molding, for example.

The light emitting module 11 includes: a substrate 25 formed in a substantially rectangular shape and oriented in the front-rear direction, light emitting elements 26, 26 mounted on the substrate 25, and various electronic components 27, 27 mounted on the substrate 25 (see fig. 2, 3, and 6).

For the light emitting elements 26, five Light Emitting Diodes (LEDs) are mounted in the central portion of the substrate 25, for example, as the light emitting elements 26, 26. The light emitting elements 26, 26 are mounted in a state where the four light emitting elements 26, 26 are equally spaced apart in the circumferential direction around one light emitting element 26, the central light emitting element 26 functioning as a light source for a tail light, for example, and the four light emitting elements 26, 26 around functioning as a light source for a stop light, for example.

The number and the functions of the light emitting elements 26 mounted on the substrate 25 can be arbitrarily set according to the type of the vehicle lamp 1, the required luminance, and the like.

As the electronic components 27, the positions of the outside of the light emitting elements 26, and the third light emitting element mounted in the substrate 25, for example, diodes, capacitors, resistors, and the like can be used in addition to the integrated circuit (IC: integrated Circuit) 27X. The electronic component 27 may be a field effect transistor (MOSFET) or the like in addition to the integrated circuit 27X or the like.

The substrate 25 is formed by forming a wiring pattern, a heat dissipation pattern, and the like, which will be described later, on a base plate 28 made of a resin material such as glass epoxy, and terminal insertion holes 25a, 25a are formed in the lower end portion of the substrate 25 so as to be spaced apart from each other in the left-right direction.

The substrate 25 is formed of, for example, four layers of a 1 st wiring layer 29, a ground layer 30, a 2 nd wiring layer 31, and a heat dissipation layer 32, which are laminated in order from the front side in the thickness direction (see fig. 7).

A wiring pattern 33 (see fig. 8) is formed on the front surface of the 1 st wiring layer 29. The power supply members 27, the pads 34, 34 bonded by solder, etc. are formed at predetermined positions on the wiring pattern 33 (refer to fig. 6). Further, on the front surface of the 1 st wiring layer 29, a resist, not shown, having insulation properties for protecting the wiring pattern 33 is applied to a portion where the pads 34, 34 are not formed.

The wiring pattern 33 has: the light emitting elements 26, the element connection portions 33a, and the 1 st connection portions 33b, and 33b to which the connection terminals 22, and 22 are connected, respectively, and the circuit connection portion 33c to which the integrated circuit 27X is connected (see fig. 8). The element connection portions 33a, and the first and second connection portions 33b, and 33c are formed in the central portion of the substrate 25, and the first and second connection portions 33b, and 33c are formed on substantially opposite sides with the element connection portions 33a, and the second and third connection portions interposed therebetween.

The wiring pattern 33 has a ground portion 33d formed at a portion continuous with the circuit connection portion 33 c. The ground portion 33d is formed on the outer periphery of the substrate 25, and is located between the outer periphery 25b of the substrate 25 and the integrated circuit 27X mounted on the circuit connection portion 33 c. The grounding portion 33d is formed in a shape extending in the circumferential direction along the outer periphery 25b of the substrate 25. The ground portion 33d may be located between the outer periphery 25b of the substrate 25 and the integrated circuit 27X, or may not be formed continuously with the circuit connection portion 33 c.

On the front surface of the 1 st wiring layer 29, a resist for protecting the wiring pattern 33 is applied at a predetermined portion, but a resist non-formation region 33x to which no resist is applied is formed at a portion of the ground portion 33 d. The resist non-formation region 33x is formed in a substantially circular arc shape so as to follow the outer periphery 25b of the substrate 25, for example, according to the shape of the ground portion 33 d.

A ground pattern 35 (see fig. 9) is formed on the front surface or the rear surface of the ground layer 30. The ground layer 30 has a ground pattern 35 formed on a half or more of the front surface or the rear surface, and the ground pattern 35 is a portion called full (entire) ground.

A wiring pattern (not shown) is formed on the front surface or the rear surface of the 2 nd wiring layer 31, and a heat dissipation pattern 36 (see fig. 10) is formed on the rear surface of the heat dissipation layer 32. In fig. 10, the heat dissipation pattern 36 and the like are illustrated in a perspective view from the front. The second connection portions 36a, which are connected to the connection terminals 22, respectively, are formed on the rear surface of the heat dissipation layer 32.

The ground portion 33d of the wiring pattern 33 is connected to the ground pattern 35 of the ground layer 30 through the ground through holes 37, 37 (see fig. 8 and 9).

As described below, the light source unit 8 is attached to the lamp body 2 by the engaging portions 20, 20 of the socket housing 9. In addition, the light source unit 8 may be mounted on a reflector, not shown.

The light source unit described above is used by being attached to a lamp body having a reflecting surface, a reflector, or the like, for example. The light source unit is mounted on a lamp body, a reflector, or the like to constitute a vehicle lamp. In the vehicle lamp, light emitted from the light emitting element of the light source unit is reflected by a reflector formed in the lamp body, the reflector, or the like, and is transmitted through a cover attached to the lamp body to be irradiated to the outside.

As described above, the light source unit is used by being attached to a lamp body, a reflector, or the like having a reflecting surface formed by metal vapor deposition. In addition, in the lamp body, the reflector, and the like, there is a portion formed of metal in some cases other than the reflecting surface.

Therefore, in these lamp bodies, reflectors, and the like, static electricity may be applied to portions formed of metal.

In this way, since static electricity may be applied to the lamp body, the reflector, or the like, static electricity applied to the lamp body, the reflector, or the like, which is present on the outer peripheral side of the light source unit may enter the light source unit when the light source unit is mounted to the lamp body, the reflector, or the like.

Since the light source unit is provided with a substrate on which various electronic components such as light emitting elements and integrated circuits are mounted, when static electricity enters the electronic components, particularly the integrated circuits, the driving state of a circuit (lighting circuit) formed on the substrate becomes unstable, and deterioration and destruction of the electronic components and the light emitting elements occur, which may cause abnormal lighting or non-lighting states.

In order to prevent static electricity from entering such a substrate, a structure in which members such as a lamp body and a reflector are grounded is also considered, but such a structure leads to an increase in cost.

As described above, the light source unit 8 is mounted on the lamp body 2 and the reflector, and a portion, for example, the reflecting surface 2b, on which metal vapor deposition is performed is formed in the lamp body 2 and the reflector, and static electricity may enter the integrated circuit 27X from the lamp body 2 and the reflector existing on the outer peripheral side of the light source unit 8, thereby preventing an appropriate driving state of a circuit (lighting circuit) formed on the substrate 25. In this case, in order to prevent the entry of static electricity, a structure in which the lamp body 2 and the reflector are grounded is also considered, but such a structure leads to an increase in cost.

Then, as described above, in the light source unit 8, the ground portion 33d is formed as a part of the wiring pattern 33 between the outer periphery 25b of the substrate 25 and the integrated circuit 27X. Since the ground portion 33d is formed, static electricity applied from the outer peripheral side of the substrate 25 is likely to enter the ground portion 33d formed between the outer periphery 25b of the substrate 25 and the integrated circuit 27X, and thus an appropriate driving state of the circuit formed on the substrate 25 can be ensured without increasing manufacturing cost.

Further, since the ground portion 33d is formed on the outer peripheral portion of the substrate 25, the ground portion 33d can be formed in a shape along the outer peripheral portion 25b of the substrate 25, the formation area of the ground portion 33d can be increased, and the ground portion 33d can be formed at a position covering the integrated circuit 27X from the outside, so that static electricity can be effectively prevented from entering the integrated circuit 27X.

Further, a resist non-formation region 33x to which no resist is applied is formed in the ground portion 33 d.

Accordingly, static electricity applied from the outer peripheral side of the substrate 25 is likely to enter the ground portion 33d from the resist non-formation region 33X, and the portion other than the resist non-formation region 33X of the ground portion 33d is protected by the resist, so that the static electricity can be prevented from entering the integrated circuit 27X while the protection of the ground portion 33d is achieved.

Further, a ground via 37 connected to the ground portion 33d is formed in the substrate 25, and the ground portion 33d is connected to the ground pattern 35 via the ground via 37.

Accordingly, the static electricity having entered the ground portion 33d from the outer peripheral side of the substrate 25 flows into the large-area ground pattern 35 from the ground through hole 37, and thus the static electricity can be prevented from entering the integrated circuit 27X more reliably.

Although the above example of preventing static electricity from entering the integrated circuit 27X has been described, the object of preventing static electricity from entering is not limited to the integrated circuit 27X, and may be other electronic components 27 such as a field effect transistor, a diode, a capacitor, and a resistor, or may be a light emitting element electrically connected to the pattern around the electronic components.

A device thermal via 38 (see fig. 8) connected to the device connection portion 33a is formed in the substrate 25. One end of the element thermal via 38 is connected to the element connection portion 33a, and the other end is connected to the heat dissipation pattern 36 (see fig. 11). The element thermal via 38 is formed singly or in plural with respect to one element connecting portion 33a, and one element thermal via 38 is located directly behind the light emitting element 26. That is, the central axis M passing through the center of the light emitting element 26 and extending in the thickness direction of the substrate 25 coincides with the central axis S of the element thermal via 38.

In the light source unit 8, heat generated when the light emitting element 26 is driven is transferred from the heat dissipation pattern 36 to the heat dissipation plate 13 via the wiring pattern 33 and the element heat via 38, and the element heat via 38 is located immediately behind the light emitting element 26. Therefore, the heat generated in the light emitting element 26 has a short transfer path to the heat dissipation pattern 36, and the resistance to heat conduction is small, so that the heat generated in the light emitting element 26 can be ensured to have high heat conductivity to the heat dissipation plate 13.

In the light source unit 8, at least a part of the element thermal via 38 may be present on any one of the reference axes J, J and J passing through the light emitting element 26 and extending in the thickness direction of the substrate 25, which are axes parallel to the central axis M of the light emitting element 26, or the central axis S of the element thermal via 38 may be shifted from the central axis M of the light emitting element 26 in a direction orthogonal to the thickness direction of the substrate 25 (see fig. 12).

Therefore, in the light source unit 8, at least a part of the range of the element thermal via 38 indicated by G in fig. 11 may be present in the range of the light emitting element 26 indicated by F in fig. 11.

In the light source unit 8, at least a part of the element thermal via 38 may be present on the central axis M of the light emitting element 26.

However, in the light source unit 8, it is preferable that the entire or substantially the entire element thermal via 38 is located in a projection space P (see fig. 11 and 12) in which the light emitting element 26 is projected in the axial direction of the reference axis J.

The element thermal via 38 may be filled with a resin (resin ink) 39. The metal particles may be dispersed in the resin 39, in which case the resin 39 has high thermal conductivity. When the resin 39 is filled into the element thermal via 38, a metal film (cap coat) 40 is applied to the element connection portion 33a, and a metal film (cap coat) 41 is also applied to the heat dissipation pattern 36. The metal film 40 may be formed as the insertion pad 34, and the metal film 41 may be formed as a thermal insertion pad (thermal land).

The light-emitting element 26 is mounted on the 1 st wiring layer 29 of the substrate 25 by, for example, an adhesive 42 having thermal conductivity, but the light-emitting element 26 is bonded to the metal film 40 in the element connecting portion 33a due to the presence of the metal film 40. Therefore, since the light-emitting element 26 is bonded to the metal film 40 by the adhesive 42, but not to the resin 39, the light-emitting element 26 is bonded to the metal (metal film 40) by the adhesive 42, and high bondability of the light-emitting element 26 to the substrate 25 can be ensured.

Further, although the light emitting element 26 is mounted on the wiring pattern 33 of the substrate 25, and the heat dissipation pattern 36 is bonded to the 1 st heat dissipation portion 13a of the heat dissipation plate 13 by an adhesive having thermal conductivity, which will be described later, the resin 39 can be prevented from leaking out of the element thermal via 38 by applying the metal film 40 and the metal film 41, and high connectivity of the light emitting element 26 to the wiring pattern 33 and high connectivity of the substrate 25 to the heat dissipation plate 13 can be ensured.

Further, a resist, not shown, is applied to the portions of the heat dissipation pattern 36 at the other end portions of the connection element thermal vias 38, and. Specifically, a resist is applied to the metal film 41.

Therefore, since the heat dissipation pattern 36 is connected to the heat dissipation plate 13 via the resist and the heat dissipation pattern 36 is bonded to the heat dissipation plate 13 by the adhesive having thermal conductivity, good insulation between the heat dissipation pattern 36 and the heat dissipation plate 13 can be ensured and good thermal conductivity from the light emitting elements 26, 26.

As described above, in the case of the light source unit 8, the element thermal via 38 is formed in the substrate 25 formed of the resin material of the base plate 28, and one end and the other end of the element thermal via 38 are connected to the wiring pattern 33 and the heat dissipation pattern 36, respectively, and heat is transferred to the heat dissipation plate 13, and at least a part of the element thermal via 38 exists on any one of the reference axes J.

Therefore, since the base plate 28 is made of a resin material, the substrate 25 can be formed at low cost, and the positions of the light-emitting element 26 and the element heat via 38 are close to each other, so that the transmission path of heat generated when the light-emitting element 26 is driven to the element heat via 38 is shortened, high heat dissipation performance can be ensured while manufacturing cost is reduced.

Thus, the driving state of the light emitting element 26 is not unstable by heat generated when the light emitting element 26 is driven, and a good light emitting state of the light emitting element 26 can be ensured.

In the case of the light source unit 8, at least a part of the element thermal via 38 may be provided on the central axis M.

In this case, since the element thermal via 38 is present near the center of the light emitting element 26, the transmission path of heat generated when the light emitting element 26 is driven to the element thermal via 38 is further shortened, and further improvement of heat dissipation can be achieved.

In particular, since the center axis M of the light emitting element 26 is aligned with the center axis S of the element heat via 38, and the center of the element heat via 38 is located near the center of the light emitting element 26, the transmission path of heat generated when the light emitting element 26 is driven to the element heat via 38 is further shortened, and further improvement of heat radiation performance can be achieved.

Further, since the entire element thermal via 38 is located in the projection space P in which the light emitting element 26 is projected in the axial direction of the reference axis J, and the element thermal via 38 is not present outside the projection space P, the transmission path of heat generated when the light emitting element 26 is driven to the element thermal via 38 is short, and further improvement of heat dissipation can be achieved.

Terminal through holes 43, 43 (see fig. 8, 13, and 14) connected to the 1 st connection portions 33b, and 33b are formed in the substrate 25. One end of the terminal through hole 43 is connected to the 1 st connecting portion 33b, and the other end is connected to the 2 nd connecting portion 36a.

On the 1 st wiring layer 29 of the substrate 25, for example, annular 1 st terminal pads 44, 44 are formed on the 1 st connection portions 33b, 33b (see fig. 6, 13, and 14). For example, annular 2 nd terminal pads 45, 45 are formed on the 2 nd connection portions 36a, 36a of the heat dissipation layer 32 of the substrate 25 (see fig. 10 and 14). The outer shape of the 2 nd terminal pad 45 is smaller than the outer shape of the 1 st terminal pad 44.

The connection terminals 22, 22 of the power supply body 10 are inserted into the terminal through holes 43, 43 from the 2 nd connection portions 36a, 36a side, the connection terminals 22, 22 are bonded to the 1 st terminal insertion pads 44, the terminal through hole 43 43, 43 and the 2 nd terminal pads 45, 45 are connected to the substrate 25. In a state where the connection terminals 22 are connected to the substrate 25, the terminal holding portion 21 is held by the receptacle housing 9 in a state of being inserted into the insertion arrangement holes 12a, and the substrate 25 and the terminal holding portion 21 are separated from each other in the front-rear direction, with a space 46 (see fig. 14) formed therebetween. The 2 nd terminal pads 45, 45 are located in the space 46.

Further, the through hole through which the ground terminal 22G is inserted is formed as a ground terminal through hole 43G among the terminal through holes 43, and the ground pattern 35 formed in the ground layer 30 is connected to the ground terminal through hole 43G (see fig. 13).

The connection of the connection terminal 22 to the board 25 is performed by inserting the connection terminal 22 into the terminal through hole 43 and soldering a part of the pattern connection portion 23b to the 1 st terminal insertion pad 44 while projecting forward from the terminal through hole 43.

At this time, the solder 47 is in close contact with the 1 st terminal pad 44 and fills the terminal through hole 43 due to fluidity, and a part of the solder flows from the terminal through hole 43 to the terminal holding portion 21 side and is also in close contact with the 2 nd terminal pad 45 due to surface tension. Therefore, the solder 47 flows around the connection terminal 22 from the 1 st terminal land 44 to the 2 nd terminal land 45 through the terminal through hole 43, and the connection terminal 22 is connected to the substrate 25 by the solder 47.

In this way, the solder 47 flows from the 1 st terminal land 44 to the 2 nd terminal land 45, but as described above, since the outer shape of the 2 nd terminal land 45 is smaller than the outer shape of the 1 st terminal land 44, the amount of the solder 47 for the 2 nd terminal land 45 is smaller than the amount of the solder 47 for the 1 st terminal land 44. Therefore, the solder 47 is difficult to flow to the terminal holding portion 21 of the power supply body 10 and also difficult to flow to the 2 nd terminal land 45 side joining the adjacent connection terminals 22.

As described above, in the case of the light source unit 8, the terminal through hole 43 through which a part of the connection terminal 22 is inserted from the 2 nd connection portion 36a side is formed between the 1 st connection portion 33b and the 2 nd connection portion 36a of the substrate 25, the size of the 2 nd terminal insertion pad 45 is smaller than the size of the 1 st terminal insertion pad 44, and a part of the connection terminal 22 is bonded to the terminal through hole 43, the 1 st terminal insertion pad 44, and the 2 nd terminal insertion pad 45 by the solder 47.

Therefore, since the amount of the solder 47 applied to the 2 nd terminal pad 45 is smaller than the amount of the solder 47 applied to the 1 st terminal pad 44, the amount of the solder 47 flowing from the terminal through hole 43 to the terminal holding portion 21 side is reduced, and thus the solder 47 can be prevented from reaching the terminal holding portion 21, and good functionality of the power supply 10 can be ensured.

In particular, the terminal holding portion 21 made of an insulating resin material can be prevented from melting due to the solder 47, and the strength of the power supply 10 can be prevented from being lowered and the connection terminal 22 can be prevented from falling off from the terminal holding portion 21.

Further, since the flow amount of the solder 47 from the terminal through hole 43 to the terminal holding portion 21 side is reduced, the solder 47 is also less likely to flow to the 2 nd terminal insertion pad 45 side of the adjacent connection terminal 22, and insulation between the connection terminals 22, 22 can be ensured, preventing occurrence of short circuit.

Further, the power supply body 10 is held in a state where the terminal holding portion 21 is buried in the receptacle housing 9.

Accordingly, since a part of the connection terminal 22 is connected to the substrate 25 in a state where the terminal holding portion 21 is held by the socket housing 9, a stable connection state of the power supply 10 to the substrate 25 can be ensured, and a good current-carrying state to the light emitting element 26 via the connection terminal 22 and the wiring pattern 33 can be ensured.

Further, the socket housing 9 is provided with a resin molded portion 12 formed of a resin material having thermal conductivity, and the terminal holding portion 21 is embedded in the resin molded portion 12.

Therefore, the heat generated in the light emitting element 26 and the substrate 25 is released to the outside through the resin molded portion 12 in which the terminal holding portion 21 is embedded, and thus high functionality of the socket housing 9 can be ensured.

The circuit thermal vias 48, 48 and the third order, which are connected to the circuit connection portion 33c, are formed on the substrate 25 in a vertically and laterally aligned manner, for example (see fig. 8). One end of the circuit thermal via 48 is connected to the circuit connection portion 33c, and the other end is connected to the heat dissipation pattern 36 (see fig. 13).

The integrated circuit 27X is connected to the circuit connection portion 33c at circuit thermal vias 48, 48. A heat dissipation pad 27a is provided on the bottom surface of the integrated circuit 27X (see fig. 13). The heat dissipation pad 27a of the integrated circuit 27X is connected to the circuit connection portion 33c by the solder 49.

In the light source unit 8, heat generated when the integrated circuit 27X is driven is transferred from the heat dissipation pattern 36 to the heat dissipation plate 13 via the wiring pattern 33 and the circuit heat via hole 48, and since the circuit heat via hole 48 is located directly behind the integrated circuit 27X, a transfer path of heat generated in the integrated circuit 27X to the heat dissipation pattern 36 is short, resistance to heat conduction becomes small, and high heat conductivity of heat generated in the integrated circuit 27X to the heat dissipation plate 13 can be ensured.

In the circuit thermal via 48, as in the case of the element thermal via 38, resin (resin ink) may be filled therein, or metal particles may be dispersed in the resin. In addition, a metal film (cap plating layer) may be applied to the circuit connection portion 33c and the heat dissipation pattern 36, respectively.

The circuit thermal vias 48, 48 are connected to the ground pattern 35 formed in at least half of the area of the ground layer 30. As described above, the ground pattern 35 is connected to the ground terminal through hole 43G through which the ground terminal 22G is inserted, among the terminal through holes 43, and 43. Accordingly, the circuit thermal vias 48, &.&..the ground terminal 22G is connected via the ground pattern 35 and the ground terminal through hole 43G.

Further, a resist, not shown, is applied to the portions of the heat dissipation pattern 36 at the other end portions of the connection circuit thermal vias 48, and.

Therefore, since the heat dissipation pattern 36 is connected to the heat dissipation plate 13 via the resist and the heat dissipation pattern 36 is bonded to the heat dissipation plate 13 by the adhesive having thermal conductivity, good insulation between the heat dissipation pattern 36 and the heat dissipation plate 13 can be ensured and good thermal conductivity of conduction from the integrated circuit 27X to the heat dissipation plate 13 via the heat dissipation pattern 36 can be ensured.

As described above, in the case of the light source unit 8, the base plate 28 is composed of the substrate 25 formed of the resin material, and is composed of the plurality of layers laminated in the thickness direction and including the ground layer 30, the ground pattern 35 is formed in an area of half or more of the ground layer 30, the circuit thermal via 48 is connected to the ground pattern 35, and the ground pattern 35 is connected to the ground terminal 22G.

Therefore, the circuit heat via 48 for transferring heat generated in the integrated circuit 27X to the heat sink 13 is connected to the ground pattern 35 formed in an area of half or more of the ground layer 30, and the ground pattern 35 is connected to the ground terminal 22G. In this way, the base plate 28 is formed of a resin material, so that the substrate 25 can be formed at low cost, high heat dissipation of heat generated in the integrated circuit 27X can be ensured, and the ground potential of the substrate 25 can be reduced to prevent the influence of static electricity on the integrated circuit 27X, thereby ensuring an appropriate driving state of the circuit formed on the substrate 25.

In particular, in the lighting circuit for the light emitting element 26 of the vehicle lamp 1, the linear regulator constant current circuit is assembled in consideration of cost reduction and the like, and the amount of electric power consumed by the linear regulator constituted in the integrated circuit 27X is increased, so that the amount of heat generated from the integrated circuit 27X is easily increased.

The heat dissipation pad 27a is provided on the bottom surface of the integrated circuit 27X, a plurality of circuit thermal vias 48 are formed, a circuit connection portion 33c for connecting the heat dissipation pad 27a is formed on the wiring pattern 33, and the plurality of circuit thermal vias 48 are connected to the circuit connection portion 33 c.

Therefore, since the plurality of circuit thermal vias 48 are connected to the heat dissipation pad 27a of the integrated circuit 27X via the circuit connection portion 33c, further improvement in heat dissipation of heat generated in the integrated circuit 27X can be achieved.

Although the above-described example has been described in which the heat dissipation performance of the heat generated in the integrated circuit 27X is improved, the object of improving the heat dissipation performance is not limited to the integrated circuit 27X, and other electronic components 27 such as a field effect transistor, a diode, a capacitor, and a resistor may be used.

Light emitting elements 26, & gt. The light emitting elements 26, and the element connection portions 33a, and the connection may be performed by conductive leads 50, or conductive portions other than the conductive portions, for example, flip chip type solder mounting using solder as the conductive portions.

The back surface of the substrate 25 is bonded to the surface of the 1 st heat dissipating portion 13a of the heat dissipating plate 13 by an adhesive 51 having high heat conductivity (see fig. 4).

A frame 52 is formed between the light emitting elements 26, 26 and the electronic components 27, 27 and the substrate 25 (see fig. 3, 4, and 7). The frame 52 is formed of a resin material, for example, in a substantially annular shape, and is disposed at a position surrounding the light emitting elements 26, 26.

The frame 52 is formed by applying a resin material having fluidity to the substrate 25 in a circular ring shape and curing the resin material having fluidity. As the resin material having fluidity, for example, a silicone material is used.

The inside of the frame 52 is filled with a sealing resin 53, and the light emitting elements 26, and the conductive leads 50, 50 are sealed with the sealing resin 53 (see fig. 7). The sealing resin 53 is formed by injecting a liquid resin material into the interior of the frame 52 and curing the resin material, and seals the light emitting elements 26, 26 and the electrically conductive leads 50, 50. Therefore, the frame 52 prevents unnecessary flow of the liquid resin material to the electronic components 27, and the side of the.

The refractive index of the sealing resin 53 is set to be intermediate between the refractive index of the light-emitting elements 26, and the refractive index of air, and the light-emitting elements 26, and the refractive index of air are sealed by the sealing resin 53, whereby the difference between the refractive index of the light-emitting elements 26, and the refractive index of air can be alleviated, and the efficiency of light emission from the light-emitting elements 26, and the light-emitting elements to the outside can be improved.

The height of the frame 52 is equal to or greater than the height of the conductive leads 50 connected to the light emitting element 26. By setting the height of the frame 52 to be equal to or greater than the height of the conductive leads 50, the sealing resin 53 can be filled in the frame 52 to a position equal to or greater than the height of the conductive leads 50, and the light emitting element 26 and the conductive leads 50 disposed in the frame 52 can be reliably sealed by the sealing resin 53.

Further, since the frame 52 is formed by curing a resin material having fluidity, the frame 52 is formed on the substrate 25, and thus, an operation of attaching the frame to the substrate 25 with an adhesive, such as in the case of using a frame formed in advance as a molded product, is not required, the operation of forming the frame 52 is easy, and an adhesive is not required, and a reduction in manufacturing cost can be achieved.

The lens 54 is disposed on the sealing resin 53 in a bonded state. The lens 54 is formed into a hemispherical shape convex forward by a predetermined molding resin. The lens 54 is formed by, for example, filling a liquid predetermined molding resin on the inside of the frame 52 with a sealing resin 53 before or after curing, and curing the resin.

The light source unit 8 may be configured without the lens 54. In this case, for example, the shape of the tip side of the sealing resin 53 may be formed in a concave shape or a convex shape, and a part of the sealing resin 53 may function as a lens.

As described above, in the light source unit 8, since the lens 54 covering the light emitting elements 26, and the like is bonded to the sealing resin 53, the light emitted from the light emitting elements 26, and the like is controlled by the lens 54 to be externally irradiated, so that more efficient light emission efficiency can be obtained, a desired light distribution pattern can be formed, and the degree of freedom in light distribution can be improved.

As described above, the light source unit 8 is provided with the frame 52 surrounding the light emitting elements 26, and the conductive leads 50, and the light source unit is formed on the substrate 25, the sealing resin 53 is filled inside the frame 52, and the molding resin is applied on the sealing resin 53 and cured to form the lens 54.

Accordingly, since the light emitting elements 26, and the conductive leads 50, and the light emitting elements 26, 26 are covered with the lens 54 having high molding accuracy, the good mounting state of the light emitting elements 26, and the substrate 25 can be ensured, and the good emission state of the light emitted from the light emitting elements 26, and the light emitted from the light emitting elements can be ensured.

Hereinafter, a schematic process for manufacturing the light-emitting module 11 will be described.

First, in the soldering process, the solder paste is applied by printing to the pads 34, 34 formed on the substrate 25, and the electronic components 27, 27 are mounted on the solder, respectively.

Next, in the component mounting process, adhesives are applied to the respective positions of the component connection portions 33a, 33a in the wiring pattern 33, respectively, and the light emitting elements 26, respectively, the adhesive is cured to form the light emitting elements 26, and the element connection portions 33a, and the conductive leads 50, and the element connection portions 33a, respectively.

Next, in the element sealing step, as described above, the frame 52 is formed, the sealing resin 53 is filled inside the frame 52, and the lens 54 is arranged on the sealing resin 53 in a bonded manner.

In this way, the light emitting module 11 is manufactured by sequentially performing the soldering process, the component mounting process, and the component sealing process. However, the light-emitting module 11 may be manufactured by reversing the order of the soldering process and the component mounting process, and in this case, it is necessary to apply the solder by dispensing (dispersion) in the soldering process, and when the number of electronic components 27, 27 is large, the dispensing takes time, and the manufacturing time is prolonged, and there is a possibility that the manufacturing cost of the light-emitting module 11 increases.

Therefore, as described above, the light emitting module 11 is manufactured by sequentially performing the soldering process, the component mounting process, and the component sealing process, whereby the manufacturing cost of the light emitting module 11 can be reduced.

The elastic modulus of the sealing resin 53 is 15MPa or less within the practical range, that is, at a temperature of minus 40 degrees to plus 150 degrees. By setting the elastic modulus of the sealing resin 53 to 15MPa or less, the load on the conductive leads 50, 50 and the..once placed inside the frame 52 is small, and the thermal stress can be relaxed, and occurrence of breakage or the like of the conductive leads 50, 50 and the..once can be suppressed.

The viscosity of the sealing resin 53 is set to be equal to or less than a predetermined value, for example, 15pa·s or less. By setting the viscosity of the sealing resin 53 to be equal to or less than a certain value, the generation of bubbles (voids) when the sealing resin 53 seals the light-emitting elements 26, and the conductive leads 50, which are disposed inside the housing 52, can be suppressed, and a stable light-emitting state of light emitted from the light-emitting elements 26, and the light-emitting elements can be obtained. Accordingly, the light emitting elements 26, and the conductive leads 50, and sealing can be performed in a stable state while reducing the amount of material forming the sealing resin 53 and reducing the cost.

On the other hand, the viscosity of the molding resin for forming the lens 54 is higher than that of the sealing resin 53, and the fluidity is lower than that of the sealing resin 53. By setting the viscosity of the molding resin to be higher than that of the sealing resin 53, the molding resin does not excessively flow when injected into the sealing resin 53, and the lens 54 is easily formed into a desired shape.

Further, by making the viscosity of the molding resin higher than that of the sealing resin 53, the light emitting elements 26, and the conductive leads 50, 50 can be sealed with the sealing resin 53 having a low viscosity, and the light emitting elements 26, and the light emitting elements can be covered with the lens 54 having high molding accuracy. Therefore, a good mounting state of the light emitting elements 26, 26 and the substrate 25 and a good emission state of light emitted from the light emitting elements 26, 26 and the substrate 25 can be ensured.

In the light source unit 8, the insertion pads 34, 34 are present near the periphery of the frame 52, the electronic components 27, 27 are bonded to the insertion pads 34, and the interval H1 between the frame 52 and the insertion pads 34, 34 located near the frame 52, and the interval H2 between the frame 52 and the electronic components 27, 27 located near the frame 52 is set to 0.1mm or more (see fig. 6).

As described above, in the light source unit 8, the frame 52 is formed by curing the resin material having fluidity in order to realize reduction in manufacturing cost and the like, but there is a possibility that the resin material approaches the peripherally located pads 34, the electronic components 27, the.

However, in the light source unit 8, as described above, the smaller one of the interval H1 between the frame 52 and the pad 34 and the interval H2 between the frame 52 and the electronic component 27 is set to 0.1mm or more. Dimensional tolerances regarding the formation position of the insertion pads 34, 34 when the light emitting module 11 is formed with respect to the substrate 25, and dimensional tolerances regarding the mounting position of the electronic components 27, 27 with respect to the insertion pads 34, 34 are generally 0.1mm.

Therefore, even if the resin material for forming the frame 52 flows, the resin material does not reach either the land 34 or the electronic component 27, and the resin material for forming the frame 52 does not adhere to the land 34 and the electronic component 27 due to surface tension, and thus the shape of the frame 52 formed after the resin material is cured does not become an improper shape.

Accordingly, the sealing resin 53 filled inside the frame 52 does not leak out from the frame 52, the height of the sealing resin 53 is not insufficient, and the whole of the electronic components 27, and the conductive leads 50, and the sealing resin 53 is sealed, so that an appropriate light distribution state of light emitted from the light emitting elements 26, 26 can be ensured.

In addition, since the shape of the frame 52 is formed in an appropriate stable shape, the productivity of the light source unit 8 can be improved.

In the light source unit 8, the smaller one of the interval H1 between the frame 52 and the pad 34 and the interval H2 between the frame 52 and the electronic component 27 is set to 0.1mm or more, more preferably to 0.2mm or more, still more preferably to 0.3mm or more.

The height T of the frame 52 from the substrate 25 is set to be not less than 0.5 times and not more than 2.5 times the width W in the radial direction (see fig. 7).

Therefore, the occupied area of the frame 52 with respect to the substrate 25 when the frame 52 is formed on the substrate 25 can be minimized, and the light source unit 8 can be miniaturized and the manufacturing cost can be reduced. In addition, a stable balance between the width W for maintaining the strength of the frame 52 and the height H for determining the filling amount of the sealing resin 53 filled to the inside of the frame 52 can be ensured, a stable filling state of the sealing resin 53 to the inside of the frame 52 can be ensured, and an improvement in the reliability of the sealing state can be achieved by ensuring a sufficient filling amount of the sealing resin 53 for sealing the electronic components 27, 27.

The housing 52 may be formed of white resin, and may be subjected to a treatment such as metal vapor deposition on the surface thereof. By configuring the housing 52 in this manner, the housing 52 can be made to function as a reflector that reflects a part of light emitted from the light emitting elements 26, 26.

Therefore, the housing 52 has both the function of specifying the shape of the sealing resin 53 and the lens 54 and the function of reflecting light, and thus the functionality of the light source unit 8 can be improved without increasing the number of components.

In the light source unit 8 configured as described above, the annular gasket 55 is fitted to the protruding portion 15 of the receptacle housing 9 (see fig. 4). The gasket 55 is formed of a resin material or a rubber material. The light source unit 8 is inserted into the unit mounting portion 6 of the lamp body 2 from the front side with the gasket 55 mounted thereon, and the engaging portions 20, 20 are engaged with the engaging protrusions 7, 7 from the rear side (see fig. 1). At this time, the engaging protrusions 7, 7 are held by the engaging portions 20, and the gasket 55, and the light source unit 8 is mounted to the lamp body 2. In a state where the light source unit 8 is mounted on the lamp body 2, the unit mounting portion 6 is closed by the gasket 55, and it is possible to prevent foreign substances such as moisture from entering the lamp chamber 5 from the outside through the unit mounting portion 6.

Conversely, when the light source unit 8 rotates in the opposite direction from the above-described circumferential direction, the engagement portions 20, 20 are released from the engagement of the engagement protrusions 7, the light source unit 8 can be detached from the lamp body 2 by pulling out the protruding portion 15 from the unit mounting portion 6.

When a current is supplied from the power supply circuit to the wiring pattern 33 via the connection terminal 22 in a state where the light source unit 8 is mounted to the lamp body 2, light is emitted from the at least one light emitting element 26. At this time, when the vehicle lamp 1 functions as a tail lamp, light is emitted from the one light emitting element 26 located at the center, and when the vehicle lamp 1 functions as a stop lamp, light is emitted from four light emitting elements 26, 26 located outside the center. Further, when the vehicle lamp 1 functions as a stop lamp, light may be emitted from the five light emitting elements 26, 26.

The light emitted from the light-emitting element 26 is transmitted through the sealing resin 53 and the lens 54, and is irradiated to the outside through the cover 3. At this time, the irradiation direction of the light is controlled by the lens 54, and the light is irradiated toward the outside in a predetermined direction.

When light is emitted from the light emitting element 26, heat is generated in the light emitting module 11, and the generated heat is transferred to the 1 st heat dissipating portion 13a via the adhesive 51 having excellent heat conductivity, and is transferred to the heat dissipating plate 13 and the resin molded portion 12. The heat transferred to the heat radiating plate 13 and the resin molded portion 12 is mainly released to the outside from the 1 st heat radiating fins 16, 16.

Therefore, a good driving state of the lighting circuit and a good light emitting state of the light emitting elements 26, 26 can be ensured.

< Structure of light source unit according to embodiment 2 >

Next, the structure of the light source unit 8A according to embodiment 2 will be described (see fig. 15 to 25).

The light source unit 8A shown below is different from the light source unit 8 described above only in the configuration of the light source module and the number of connection terminals, and therefore only the portions different from the light source unit 8 will be described in detail, and the other portions are denoted by the same reference numerals as those of the same portions in the light source unit 8, and the description thereof will be omitted.

The light source unit 8A includes a socket housing 9, a power supply 10A, and a light emitting module 11A (see fig. 15 and 16).

The power supply body 10A has a terminal holding portion 21 and connection terminals 22, 22. One of the connection terminals 22 and 22 is provided as a ground terminal 22G for grounding, and the other is provided as a power supply. The power supply connection terminal 22 is used for a fog lamp.

The light emitting module 11A includes a substrate 25A which is formed in a substantially rectangular shape and faces in the front-rear direction, a light emitter 60 mounted on the substrate 25A, and various electronic components 27, … … mounted on the substrate 25A (see fig. 15 to 17).

The light emitting body 60 is provided as a package in which a plurality of, for example, three light emitting elements 61, phosphors 62, and die attach pads 63, 63 are sealed by a sealing portion 64 (see fig. 18).

The light emitting elements 61, 61 are arranged at positions, for example, at equal intervals in the left-right direction, and Light Emitting Diodes (LEDs) are used as the light emitting elements 61, 61. The light emitting elements 61, 61 function as a light source for a fog lamp.

The intervals between the light emitting elements 61, 61 are, for example, as small as 0.5mm or less. Therefore, in a state where light is emitted from the light emitting elements 61, brightness unevenness is less likely to occur in the formed light distribution, and a desired light distribution can be easily formed. Further, since the intervals between the light emitting elements 61, 61 are small, the light emitting body 60 can be miniaturized accordingly, and the light source unit 8A can be miniaturized.

The light emitting element 61 is formed in a square shape, for example, and has a width P of 1.4mm or less (see fig. 17). The width Q of the entire light emitting elements 61, 61 in the arrangement direction in which the three light emitting elements 61, 61 are arranged is set to 4.0mm or less.

In this way, in the light-emitting body 60, since the width P and the width Q of the light-emitting elements 61, 61 functioning as light sources are both small, light can be recognized as being emitted from the point light source as a whole, and the cut lines in the light distribution pattern become clear, so that an appropriate and clear light distribution pattern can be formed.

The number and arrangement direction of the light emitting elements 61 mounted on the substrate 25A and the functions thereof can be arbitrarily set according to the type of the vehicle lamp 1, the required luminance, and the like.

The phosphor 62 is disposed in a state of covering the light emitting element 61 from the front, and has a function of converting the color of the light emitted from the light emitting element 61.

The die pad 63 is disposed on the opposite side of the phosphor 62 with the light emitting element 61 interposed therebetween, and the light emitting element 61 is bonded to the die pad 63 by a solder or an adhesive (bonding agent) 65 (see fig. 18). The outline shape of the die pad 63 is one turn larger than the outline shape of the light emitting element 61. The die pad 63 is soldered to a wiring pattern described later.

The sealing portion 64 is formed of, for example, an opaque resin material.

The light emitter 60 is formed in a flat rectangular parallelepiped shape, for example, the front surfaces of the phosphors 62, 62 are exposed to the front, and the rear surfaces of the die attach pads 63, 63 are exposed to the rear. By exposing the rear surface of the die pad 63 rearward, soldering of the die pad 63 to the wiring pattern is facilitated, and the light emitter 60 can be easily and accurately mounted on the substrate 25A.

In the light emitting body 60, if the lines passing through the centers of the light emitting elements 61, 61 and extending in the arrangement direction of the light emitting elements 61, 61 are respectively defined as the central line V, the central line V of the light emitting body 60 is inclined at an angle of up to and down to 5 degrees with respect to the horizontal line in the state where the light source unit 8A is attached to the lamp body 2.

In this way, by setting the inclination angle of the central line V to be within 5 degrees with respect to the horizontal line, the light distribution pattern formed by the light emitted from the light emitting elements 61, in particular, the light distribution pattern in the fog lamp becomes clear, and an appropriate and clear light distribution pattern can be formed.

Further, in the light source unit 8A, the light emitting element 61 is preferably lighted by constant current driving. By lighting the light-emitting element 61 by constant current driving, the amount of current flowing to the light-emitting element 61 is constant, and the amount of heat generated from the light-emitting element 61 is less likely to vary. Therefore, in the light source unit 8A, it is not necessary to secure heat radiation performance according to the fluctuation of the amount of heat generation, and even in the case where the base plate 28 of the substrate 25A is formed of a resin material, a stable driving state of the light emitting element 61 can be secured.

The substrate 25A is formed by forming a wiring pattern, a heat dissipation pattern, and the like on a base plate 28A made of a resin material such as glass epoxy, and terminal insertion holes 25A, 25A are formed at a left-right interval in a lower end portion of the substrate 25A.

The substrate 25A is formed of, for example, four layers of a 1 st wiring layer 29A, a ground layer 30A, a 2 nd wiring layer 31A, and a heat dissipation layer 32A, which are stacked in order from the front side in the thickness direction.

A wiring pattern 33A (see fig. 19) is formed on the front surface of the 1 st wiring layer 29A. Solder 49, and a. Joining electronic component 27 are formed at predetermined positions on wiring pattern 33A. 27..the pads 34A, 34A of the third and fourth etc., and the third and fourth third boards are provided with reference to fig. 17. Further, on the front surface of the 1 st wiring layer 29A, a resist, not shown, having insulation properties for protecting the wiring pattern 33A is applied to the portions where the pads 34A, 34A are not formed.

The wiring pattern 33A includes element connection portions 33e, respectively to which the light emitting elements 61, 61 are connected, a 1 st connection portion 33f, respectively to which the connection terminals 22, 22 are connected, and a circuit connection portion 33g (see fig. 19) to which the integrated circuit 27X is connected. The element connection portions 33e, 33e and the first and second connection portions 33f, 33g are formed in the central portion of the substrate 25A, and the first and second connection portions 33f, 33g are formed on substantially opposite sides.

In the wiring pattern 33A, a ground portion 33h is formed at a portion continuous with the circuit connection portion 33 g. The ground portion 33h is formed on the outer periphery of the substrate 25A, and is located between the outer periphery 25b of the substrate 25A and the integrated circuit 27X mounted on the circuit connection portion 33 g. The ground portion 33h is formed in a shape extending in the circumferential direction along the outer periphery 25b of the substrate 25A. The ground portion 33h may be located between the outer periphery 25b of the substrate 25A and the integrated circuit 27X, or may not be formed continuously with the circuit connection portion 33 g.

On the front surface of the 1 st wiring layer 29A, a resist for protecting the wiring pattern 33A is applied to a predetermined portion, but a resist non-formation region 33y to which no resist is applied is formed in a portion of the ground portion 33h. The resist non-formation region 33y is formed in a substantially circular arc shape so as to follow the outer periphery 25b of the substrate 25A, for example, according to the shape of the ground portion 33h.

A ground pattern 35A is formed on the front surface or the rear surface of the ground layer 30A (see fig. 20). The ground pattern 35A is formed in an area of half or more of the front surface or the rear surface of the ground layer 30A, and the ground pattern 35A is a portion called a so-called full ground.

A wiring pattern (not shown) is formed on the front surface or the rear surface of the 2 nd wiring layer 31A, and a heat dissipation pattern 36A (see fig. 21) is formed on the rear surface of the heat dissipation layer 32A. Fig. 21 is a perspective view showing the heat dissipation pattern 36A and the like as viewed from the front. The 2 nd connection portions 36b and 36b to which the connection terminals 22 and 22 are connected are formed on the rear surface of the heat dissipation layer 32A.

The ground portion 33h of the wiring pattern 33A is connected to the ground pattern 35A of the ground layer 30A through the ground through holes 37, 37 (see fig. 19 and 20).

The light source unit 8A is attached to the lamp body 2 by engaging the engaging portions 20, 20 of the socket housing 9 with the engaging protrusions 7, 7 of the lamp housing 4 as described below. In addition, the light source unit 8A may be mounted on a reflector, not shown.

In this way, the light source unit 8A is mounted on the lamp body 2 and the reflector, and a portion, for example, the reflecting surface 2b, to which metal vapor deposition is applied is formed on the lamp body 2 and the reflector, and static electricity may enter the integrated circuit 27X from the lamp body 2 and the reflector existing on the outer peripheral side of the light source unit 8A, thereby preventing an appropriate driving state of a circuit (lighting circuit) formed on the substrate 25A. In this case, in order to prevent the entry of static electricity, a structure in which the lamp body 2 and the reflector are grounded is also considered, but such a structure leads to an increase in cost.

Then, as described above, in the light source unit 8A, the ground portion 33h is formed as a part of the wiring pattern 33A between the outer periphery 25b of the substrate 25A and the integrated circuit 27X. By forming the ground portion 33h, static electricity applied from the outer peripheral side of the substrate 25A easily enters the ground portion 33h formed between the outer periphery 25b of the substrate 25A and the integrated circuit 27X, and thus an appropriate driving state of the circuit formed on the substrate 25A can be ensured without increasing manufacturing cost.

Further, since the ground portion 33h is formed on the outer peripheral portion of the substrate 25A, the ground portion 33h can be formed in a shape along the outer periphery 25b of the substrate 25A, the formation area of the ground portion 33h can be increased, and the ground portion 33h can be formed at a position covering the integrated circuit 27X from the outside, so that entry of static electricity into the integrated circuit 27X can be effectively prevented.

Further, a resist non-formation region 33y to which no resist is applied is formed in the ground portion 33 h.

Therefore, since static electricity applied from the outer peripheral side of the substrate 25A easily enters the ground portion 33h from the resist non-formation region 33y, and a portion other than the resist non-formation region 33y of the ground portion 33h is protected by the resist, it is possible to prevent static electricity from entering the integrated circuit 27X while the protection of the ground portion 33h is achieved.

Further, a ground via 37 connected to the ground portion 33h is formed in the substrate 25A, and the ground portion 33h is connected to the ground pattern 35A through the ground via 37.

Accordingly, static electricity entering the ground portion 33h from the outer peripheral side of the substrate 25A flows from the ground through hole 37 to the large-area ground pattern 35A, and thus static electricity can be prevented from entering the integrated circuit 27X more reliably.

Although the above example of preventing static electricity from entering the integrated circuit 27X has been described, the object of preventing static electricity from entering is not limited to the integrated circuit 27X, and other electronic components 27 such as a field effect transistor, a diode, a capacitor, and a resistor may be used as the object.

A thermal via 38 for a device connected to the device connection portion 33e is formed in the substrate 25A (see fig. 19). One end of the element thermal via 38 is connected to the element connection portion 33e, and the other end is connected to the heat dissipation pattern 36A (see fig. 22). A single or a plurality of element thermal vias 38 are formed for one element connection portion 33e, for example, two element thermal vias 38, 38 are located directly behind the light emitting element 61.

In the light source unit 8A, heat generated when the light emitting element 61 is driven is transferred from the heat dissipation pattern 36A to the heat dissipation plate 13 via the wiring pattern 33A and the element heat vias 38, and the element heat vias 38, 38 are located immediately behind the light emitting element 61. Therefore, the heat generated in the light-emitting element 61 has a short transfer path to the heat dissipation pattern 36A, and the resistance to heat conduction is small, so that the heat generated in the light-emitting element 61 can be ensured to have high heat conductivity to the heat dissipation plate 13.

In the light source unit 8A, at least a part of the thermal via 38 is present on any one of the reference axes J of the reference axes J, J and the reference axes J extending in the thickness direction of the substrate 25A through the light emitting element 61, which are axes parallel to the central axis M of the light emitting element 61 (see fig. 22 and 23).

Therefore, in the light source unit 8A, at least a part of the range of the element thermal via 38 indicated by G in fig. 22 may be present in the range of the light emitting element 61 indicated by F in fig. 22.

In addition, in the light source unit 8A, one thermal via 38 may be present immediately behind the light emitting element 61, in which case a central axis M passing through the center of the light emitting element 61 and extending in the thickness direction of the substrate 25A may coincide with the central axis S of the thermal via 38 (refer to fig. 23). However, it may be set as follows: at least a part of the thermal via 38 is located on the central axis M of the light emitting element 61, and the central axis S of the thermal via 38 is offset from the central axis M of the light emitting element 61 in a direction perpendicular to the thickness direction of the substrate 25A.

In addition, in a state where a single or a plurality of thermal vias 38 exist directly behind the light emitting element 61, at least a part of the element thermal vias 38 may exist on the central axis M.

However, in the light source unit 8A, it is preferable that the entirety or substantially the entirety of the single or a plurality of thermal vias 38 be located in a projection space P (see fig. 22 and 23) in which the light emitting element 61 is projected in the axial direction of the central axis M.

The inside of the element thermal via 38 may be filled with a resin (resin ink) 39. The metal particles may be dispersed in the resin 39, in which case the resin 39 has high thermal conductivity. When the resin 39 is filled into the element thermal via 38, a metal film (cap coat) 40 is applied to the element connection portion 33e, and a metal film (cap coat) 41 is also applied to the heat dissipation pattern 36A. The metal film 40 may be formed as the pad 34A, and the metal film 41 may be formed as the thermal pad.

The light-emitting element 61 is mounted on the 1 st wiring layer 29A of the substrate 25A through the die pad 63 by the solder 66, and the light-emitting element 61 is bonded to the metal film 40 in the element connection portion 33e due to the presence of the metal film 40. Therefore, since the light-emitting element 61 is bonded to the metal film 40 by the solder 66, but is not bonded to the resin 39, the light-emitting element 61 is bonded to the metal (metal film 40) by the solder 66, and high bondability of the light-emitting element 61 to the substrate 25A can be ensured.

Further, the light emitting element 61 is mounted on the wiring pattern 33A of the substrate 25A, the heat dissipation pattern 36A is bonded to the 1 st heat dissipation portion 13A of the heat dissipation plate 13 by the adhesive 51 having thermal conductivity, and the metal film 40 and the metal film 41 are applied, whereby the resin 39 can be prevented from leaking out of the element thermal via 38, and high connectivity of the light emitting element 61 to the wiring pattern 33A and high connectivity of the substrate 25A to the heat dissipation plate 13 can be ensured.

Further, a resist, not shown, is applied to the portions of the heat dissipation pattern 36A at the other end portions of the connection element thermal vias 38, and the heat dissipation pattern 36A is bonded to the heat dissipation plate 13 through the resist. Specifically, a resist is applied to the metal film 41.

Therefore, since the heat dissipation pattern 36A is connected to the heat dissipation plate 13 via the resist and the heat dissipation pattern 36A is bonded to the heat dissipation plate 13 by the adhesive having thermal conductivity, good insulation between the heat dissipation pattern 36A and the heat dissipation plate 13 can be ensured, and good thermal conductivity from the light emitting elements 61, 61 to the heat dissipation plate 13 via the heat dissipation pattern 36A can be ensured.

In the case of the light source unit as described above, the light emitting element, the electronic component, and the like are mounted on the substrate, and heat is generated in the light emitting element, the electronic component, and the like when the light emitting element is driven, and the driving state of the light emitting element and the like may become unstable due to the generated heat, so that improvement of heat radiation to the outside (external space) is desired.

In particular, in a lighting circuit of a light emitting element formed on a substrate, a linear regulator type constant current circuit is often assembled in consideration of cost reduction or the like, but in the linear regulator type constant current circuit, power consumed by a linear regulator configured in an Integrated Circuit (IC) becomes large, and a heat generation amount from the integrated circuit tends to increase.

On the other hand, there are light source units in which a ceramic substrate having high heat dissipation is used as a substrate in order to improve heat dissipation, and since the ceramic substrate is costly, good heat dissipation can be ensured when the ceramic substrate is used as a substrate, but on the other hand, the manufacturing cost of the light source unit is increased.

In addition, in the case of the light source unit, it is also necessary to suppress the influence of electromagnetic noise to ensure an appropriate driving state of a circuit (lighting circuit) formed on the substrate. In particular, it is desirable to reduce the influence of electromagnetic noise on an integrated circuit even in a linear regulator type constant current circuit, prevent malfunction of the circuit, and ensure an appropriate driving state.

Then, as described above, in the case of the light source unit 8A, the element thermal via 38 is formed in the substrate 25A formed of the resin material of the base plate 28A, and one end portion and the other end portion of the element thermal via 38 are connected to the wiring pattern 33A and the heat dissipation pattern 36A, respectively, and transfer heat to the heat dissipation plate 13, and at least a part of the element thermal via 38 is present on any one of the reference axes J.

Therefore, since the base plate 28A is formed of a resin material, the substrate 25A can be formed at low cost, and the transmission path of heat generated when the light emitting element 61 and the element heat via 38 are located close to each other to drive the light emitting element 61 is shortened, high heat dissipation can be ensured while manufacturing cost is reduced.

Thus, the driving state of the light emitting element 61 is not unstable by heat generated when the light emitting element 61 is driven, and a good light emitting state of the light emitting element 61 can be ensured.

In the case of the light source unit 8A, at least a part of the element thermal via 38 may be provided on the central axis M.

In this case, since the element thermal via 38 is present near the center of the light emitting element 61, the transmission path of heat generated when the light emitting element 61 is driven to the element thermal via 38 becomes shorter, and further improvement of heat dissipation performance can be achieved.

In particular, since the center axis M of the light emitting element 61 is aligned with the center axis S of the element heat via 38, and the center of the element heat via 38 is located near the center of the light emitting element 61, the transmission path of heat generated when the light emitting element 61 is driven to the element heat via 38 is further shortened, and further improvement of heat radiation performance can be achieved.

Further, since the entire element thermal via 38 is located in the projection space P in which the light emitting element 61 is projected in the axial direction of the central axis M, and the element thermal via 38 is not present outside the projection space P, the transmission path of heat generated when the light emitting element 61 is driven to the element thermal via 38 is short, and further improvement of heat dissipation can be achieved.

Further, by positioning the entirety of the two element thermal vias 38, 38 in the projection space P, extremely high heat dissipation can be ensured.

Further, in the light source unit 8A, at least a part of the element thermal via 38 is present on any one reference axis J of each of the plurality of light emitting elements 61 in the package-type light emitting body 60 in which the plurality of light emitting elements 61 are bonded to the die pad 63 and the plurality of light emitting elements 61 are sealed by the sealing portion 64.

Therefore, by mounting the package-type light emitter 60 on the substrate 25A without mounting the plurality of light emitting elements 61 on the substrate 25A, the appropriate distance between the plurality of light emitting elements 61 can be ensured, and the mounting work of the light emitting elements 61 on the substrate 25A becomes easy, and the heat radiation properties related to the plurality of light emitting elements 61 can be improved, and the appropriate light distribution pattern can be ensured, and the workability can be improved.

In addition, the plurality of electronic components 27 are connected to the wiring pattern 33A by the solder 49, and the plurality of die pads 63 in the light emitting body 60 are connected to the wiring pattern 33A by the solder 66.

Therefore, since the plurality of electronic components 27 and the plurality of light emitting elements 61 are connected to the wiring pattern 33A by soldering, the plurality of electronic components 27 and the plurality of light emitting elements 61 can be mounted together by soldering, and the productivity of the light source unit 8A can be improved.

Terminal through holes 43 and 43 (see fig. 19, 24, and 25) connected to the 1 st connection portions 33f and 33f are formed in the substrate 25A. One end of the terminal through hole 43 is connected to the 1 st connecting portion 33f, and the other end is connected to the 2 nd connecting portion 36b.

For example, annular 1 st terminal pads 44 and 44 are formed on the 1 st wiring layer 29A of the substrate 25A at the 1 st connection portions 33f and 33f (see fig. 17, 24, and 25). For example, annular 2 nd terminal pads 45, 45 are formed on the heat dissipation layer 32A of the substrate 25A at the 2 nd connection portions 36b, 36b (see fig. 21 and 25). The outer shape of the 2 nd terminal pad 45 is smaller than the outer shape of the 1 st terminal pad 44.

The connection terminals 22 and 22 of the power supply body 10A are inserted into the terminal through holes 43 and 43 from the 2 nd connection portions 36b and 36b side, and the connection terminals 22 and 22 are joined to the 1 st terminal insertion pads 44 and 44, the terminal through holes 43 and 43, and the 2 nd terminal insertion pads 45 and 45, respectively, and connected to the substrate 25A. In a state where the connection terminal 22 is connected to the substrate 25A, the terminal holding portion 21 is held by the receptacle housing 9 in a state of being inserted into the insertion arrangement hole 12a, and the substrate 25A and the terminal holding portion 21 are separated from each other in the front-rear direction, with a space 46 (see fig. 25) formed therebetween. The 2 nd terminal pads 45, 45 are located in the space 46.

The ground pattern 35A formed on the ground layer 30A is connected to the ground terminal through hole 43G (see fig. 24).

In the light source unit 8A as well, since the outer shape of the 2 nd terminal land 45 is smaller than the outer shape of the 1 st terminal land 44, the amount of solder 47 for the 2 nd terminal land 45 is smaller than the amount of solder 47 for the 1 st terminal land 44, similarly to the light source unit 8. Therefore, the solder 47 is difficult to flow to the terminal holding portion 21 of the power supply body 10A and also difficult to flow to the 2 nd terminal land 45 side joining the adjacent connection terminals 22.

In the case of the light source unit as described above, a power supply member for energizing the light emitting element is provided, and the power supply member has a terminal holding portion formed of an insulating resin material and a connection terminal held by the terminal holding portion.

The power supply body is joined to a terminal land formed on the wiring pattern by solder in a state where the connection terminal is inserted into a terminal through hole formed in the substrate.

Accordingly, electric power is supplied from the power supply circuit to the light emitting element via the connection terminal of the power supply body and the wiring pattern.

However, since the connection terminals are joined by the solder material flowing from the terminal insertion pad through the terminal through hole in a state of being inserted into the terminal through hole, the solder material flows from the terminal through hole to the terminal holding portion before solidification, and when the flow amount is large, the solder material may reach the terminal holding portion.

In this way, when the solder reaches the terminal holding portion, the terminal holding portion made of the insulating resin material may be melted by the solder, and there is a possibility that the strength of the power supply is lowered and the connection terminal is detached from the terminal holding portion.

In addition, when a plurality of connection terminals, for example, a connection terminal for power supply and a connection terminal for ground are arranged in an array on a power supply body, if the flow amount of solder from the terminal through hole to the terminal holding portion is large, there is a possibility that solder flows from one connection terminal side to the other connection terminal side, and in this case, there is a possibility that insulation between the connection terminals is hindered and a short circuit occurs.

As described above, in the case of the light source unit 8A, the terminal through hole 43 through which a part of the connection terminal 22 is inserted from the 2 nd connection portion 36b side is formed between the 1 st connection portion 33f and the 2 nd connection portion 36b in the substrate 25A, the size of the 2 nd terminal insertion pad 45 is smaller than the size of the 1 st terminal insertion pad 44, and a part of the connection terminal 22 is bonded to the terminal through hole 43, the 1 st terminal insertion pad 44, and the 2 nd terminal insertion pad 45 by the solder 47.

Therefore, since the amount of the solder 47 applied to the 2 nd terminal pad 45 is smaller than the amount of the solder applied to the 1 st terminal pad 44, the amount of the solder 47 flowing from the terminal through hole 43 to the terminal holding portion 21 side is reduced, and thus the solder 47 can be prevented from reaching the terminal holding portion 21 and good functionality of the power supply 10A can be ensured.

In particular, the terminal holding portion 21 made of an insulating resin material can be prevented from melting due to the solder 47, and the strength of the power supply 10A can be prevented from being lowered and the connection terminal 22 can be prevented from falling off from the terminal holding portion 21.

Further, since the flow amount of the solder 47 from the terminal through hole 43 to the terminal holding portion 21 side is reduced, the solder 47 is also less likely to flow to the 2 nd terminal insertion pad 45 side of the adjacent connection terminal 22, and insulation between the connection terminals 22, 22 can be ensured, preventing occurrence of short circuit.

Further, the power supply body 10A is held in a state where the terminal holding portion 21 is buried in the receptacle housing 9.

Accordingly, since a part of the connection terminal 22 is connected to the substrate 25A in a state where the terminal holding portion 21 is held by the socket housing 9, a stable connection state of the power supply 10A to the substrate 25A can be ensured, and a good conduction state to the light emitting element 61 via the connection terminal 22 and the wiring pattern 33A can be ensured.

Further, the socket housing 9 is provided with a resin molded portion 12 formed of a resin material having thermal conductivity, and the terminal holding portion 21 is embedded in the resin molded portion 12.

Therefore, the heat generated in the light emitting element 61 and the substrate 25A is released to the outside through the resin molded portion 12 embedded in the terminal holding portion 21, so that high functionality of the socket housing 9 can be ensured.

Further, in the light source unit 8A, in the package-type light emitting body 60 in which the plurality of light emitting elements 61 are bonded to the die pad 63, respectively, and the plurality of light emitting elements 61 are sealed by the sealing portion 64, the plurality of light emitting elements 61 are connected to the wiring pattern 33A.

Therefore, by mounting the package-type light emitter 60 on the substrate 25A without mounting the plurality of light emitting elements 61 on the substrate 25A, the appropriate distance between the plurality of light emitting elements 61 can be ensured, and the mounting work of the light emitting elements 61 on the substrate 25A becomes easy, and the strength of the power supply 10A can be improved and the connection terminal 22 can be prevented from coming off the terminal holding portion 21 while ensuring an appropriate light distribution pattern and improving workability.

The circuit thermal vias 48, 48 connected to the circuit connection portion 33g are formed on the substrate 25A so as to be aligned vertically and laterally (see fig. 19). One end of the circuit thermal via 48 is connected to the circuit connection portion 33g, and the other end is connected to the heat dissipation pattern 36A (see fig. 24).

The circuit connection portion 33g is connected to the circuit thermal vias 48, and the integrated circuit 27X. The heat dissipation pad 27a of the integrated circuit 27X is connected to the circuit connection portion 33g by the solder 49.

In the light source unit 8A, heat generated when the integrated circuit 27X is driven is transferred from the heat dissipation pattern 36A to the heat dissipation plate 13 via the wiring pattern 33A and the circuit heat via 48, and since the circuit heat via 48 is located directly behind the integrated circuit 27X, a transfer path of heat generated in the integrated circuit 27X to the heat dissipation pattern 36A is short, resistance to heat conduction is small, and high heat conductivity of heat generated in the integrated circuit 27X to the heat dissipation plate 13 can be ensured.

In the circuit thermal via 48, as in the case of the element thermal via 38, a resin (resin ink) may be filled therein, and metal particles may be dispersed in the resin. In addition, a metal film (cap plating layer) may be applied to the circuit connection portion 33g and the heat dissipation pattern 36A, respectively.

The circuit thermal vias 48, 48 are connected to the ground pattern 35A formed on one half or more of the ground layer 30A. As described above, the ground pattern 35A is connected to the ground terminal through hole 43G through which the ground terminal 22G is inserted, of the terminal through holes 43, 43. Accordingly, the circuit thermal vias 48, & gt.

Further, a resist, not shown, is applied to the portions of the heat dissipation pattern 36A at the other end portions of the connection circuit thermal vias 48, and.

Therefore, since the heat dissipation pattern 36A is connected to the heat dissipation plate 13 via the resist and the heat dissipation pattern 36A is bonded to the heat dissipation plate 13 by the adhesive having thermal conductivity, good insulation between the heat dissipation pattern 36A and the heat dissipation plate 13 can be ensured and good thermal conductivity from the integrated circuit 27X to the heat dissipation plate 13 via the heat dissipation pattern 36A can be ensured.

The light emitting elements 61, 61 are connected to the element connection portions 33e, and the element thermal vias 38, 38 of the substrate 25A. The die attach pads 63, 63 of the light emitting elements 61, 61 are connected to the element connection portion 33e by solder 66, 66.

In the light source unit 8A, heat generated when the light emitting element 61 is driven is transferred from the heat dissipation pattern 36A to the heat dissipation plate 13 via the wiring pattern 33A and the element heat via hole 38, and since the element heat via hole 38 is located directly behind the light emitting element 61, a transfer path of heat generated in the light emitting element 61 to the heat dissipation pattern 36A is short, resistance to heat conduction is small, and high heat conductivity of heat generated in the light emitting element 61 to the heat dissipation plate 13 can be ensured.

The element thermal vias 38, 38 are connected to the ground pattern 35A formed on one half or more of the ground layer 30A. As described above, the ground pattern 35A is connected to the ground terminal through hole 43G through which the ground terminal 22G is inserted, of the terminal through holes 43, 43. Accordingly, the element thermal vias 38, & gt.

Further, a resist, not shown, is applied to the portions of the heat dissipation pattern 36A at the other end portions of the connection element thermal vias 38, and.

Therefore, since the heat dissipation pattern 36A is connected to the heat dissipation plate 13 via the resist and the heat dissipation pattern 36A is bonded to the heat dissipation plate 13 by the adhesive having thermal conductivity, good insulation between the heat dissipation pattern 36A and the heat dissipation plate 13 can be ensured and good thermal conductivity from the light emitting element 61 to the heat dissipation plate 13 via the heat dissipation pattern 36A can be ensured.

As described above, in the case of the light source unit 8A, the base plate 28A is composed of the substrate 25A formed of the resin material, and is composed of the plurality of layers including the ground layer 30A stacked in the thickness direction, the ground pattern 35A is formed in an area of half or more of the ground layer 30A, the circuit thermal via 48 is connected to the ground pattern 35A, and the ground pattern 35A is connected to the ground terminal 22G.

Therefore, the circuit heat via 48 for transferring heat generated in the integrated circuit 27X to the heat sink 13 is connected to the ground pattern 35A formed in an area of half or more of the ground layer 30A, and the ground pattern 35A is connected to the ground terminal 22G. In this way, the base plate 28A is formed of a resin material, so that the substrate 25A can be formed at low cost, high heat dissipation of heat generated in the integrated circuit 27X can be ensured, and the ground potential of the substrate 25A is low-impedance, so that the influence of static electricity on the integrated circuit 27X can be prevented, and an appropriate driving state of the circuit formed on the substrate 25A can be ensured.

In particular, even when the linear regulator type constant current circuit is assembled, effective heat radiation and an appropriate driving state of the lighting circuit can be ensured.

The heat dissipation pad 27a is provided on the bottom surface of the integrated circuit 27X, a plurality of circuit thermal vias 48 are formed, a circuit connection portion 33g for connecting the heat dissipation pad 27a is formed on the wiring pattern 33A, and the plurality of circuit thermal vias 48 are connected to the circuit connection portion 33g.

Therefore, the plurality of circuit thermal vias 48 are connected to the heat dissipation pad 27a of the integrated circuit 27X via the circuit connection portion 33g, and therefore, further improvement in heat dissipation of heat generated in the integrated circuit 27X can be achieved.

Further, in the light source unit 8A, in the package-type light emitting body 60 in which the plurality of light emitting elements 61 are bonded to the die pad 63, respectively, and the plurality of light emitting elements 61 are sealed by the sealing portion 64, a plurality of element heat vias 38 are formed in the substrate 25A, one end portion and the other end portion of which are connected to the wiring pattern 33A and the heat dissipation pattern 36A, respectively, and transfer heat generated in the light emitting elements 61 to the heat dissipation plate 13, the element heat vias 38 are connected to the ground pattern 35A, and the ground pattern 35A is connected to the ground terminal 22G.

Therefore, since the package-type light emitter 60 is mounted on the substrate 25A without mounting the plurality of light emitting elements 61 on the substrate 25A, the appropriate distance between the plurality of light emitting elements 61 can be ensured, the mounting work of the light emitting elements 61 on the substrate 25A becomes easy, the appropriate light distribution pattern can be ensured, the workability can be improved, and the influence of electromagnetic noise and heat can be reduced, thereby ensuring the appropriate driving state of the light emitting elements 61.

Further, a plurality of element connection portions 33e for connecting the plurality of die pads 63 are formed in the wiring pattern 33A, and the plurality of element thermal vias 38 are connected to the element connection portions 33e.

Therefore, since the plurality of element heat vias 38 are connected to the die pad 63 to which the light emitting element 61 is bonded via the element connection portion 33e, further improvement in heat dissipation of heat generated in the light emitting element 61 can be achieved.

The back surface of the substrate 25A is bonded to the surface of the 1 st heat dissipating portion 13a of the heat dissipating plate 13 by an adhesive 51 having high heat conductivity.

Hereinafter, a schematic process of manufacturing the light emitting module 11A will be described.

In the manufacturing of the light emitting module 11A, the soldering lands 34A, and the first and second solder pastes formed on the substrate 25A are applied by printing, and the electronic components 27, and the light emitting body 60 are mounted on the solder, respectively, and the die bonding lands 63, and 63 of the electronic components 27, and the light emitting body 60 are bonded to the soldering lands 34A, and the first and second solder pastes by reflow soldering.

In this way, the light emitting module 11A can be mounted together with the electronic components 27, 27 and the light emitting body 60 on the substrate 25 by the soldering process, and therefore, the manufacturing time and the manufacturing cost can be reduced.

In the light source unit 8A configured as described above, the annular gasket 55 is fitted to the protruding portion 15 of the socket housing 9, and can be attached to and detached from the lamp body 2 in the same manner as the light source unit 8.

When a current is supplied from the power supply circuit to the wiring pattern 33A via the connection terminal 22 in a state where the light source unit 8A is attached to the lamp body 2, light is emitted from the light emitting elements 61, 61.

The light emitted from the light emitting element 61 is color-converted by the phosphor 62, and is emitted to the outside through the cover 3.

When light is emitted from the light emitting element 61, heat is generated in the light emitting module 11A, but the generated heat is transferred to the 1 st heat dissipating portion 13a via the adhesive 51 having excellent heat conductivity, and is transferred to the heat dissipating plate 13 and the resin molding portion 12. The heat transferred to the heat radiating plate 13 and the resin molded portion 12 is mainly released to the outside from the 1 st heat radiating fins 16, 16.

Therefore, a good driving state of the lighting circuit can be ensured and a good light emitting state of the light emitting elements 61, 61 can be ensured.

Description of the reference numerals

1A vehicle lamp, 8A light source unit, 9 a socket housing, 10A power supply, 11A light emitting module, 12 a resin molded part, 13A heat dissipation plate, 20A locking part, 21A terminal holding part, 22 a connection terminal, 22G ground, 25A substrate, 26A light emitting element, 27 an electronic component, 27X an integrated circuit, 27a heat dissipation pad, 28A base board, 30 ground layer, 33 wiring pattern, 33A element connection portion, 33b 1 st connection portion, 33c circuit connection portion, 33d ground portion, 33X resist non-formation region, 34 pad, 35 ground pattern, 36 heat dissipation pattern, 36A 2 nd connection portion, 37 ground via hole, 38 element thermal via hole, 43 terminal via hole, through-hole for 43G ground terminal, plug pad for 44 1 st terminal, plug pad for 45 2 nd terminal, thermal via for 48 circuit, 51 adhesive, 52 frame, 53 sealing resin, 54 lens, 8A light source unit, 10A power supply, 11A light emitting module, 25A substrate, 28A base board, 30A ground layer, 33A wiring pattern, 33e element connection portion, 33f 1 st connection portion, 33G circuit connection portion, 33h ground portion, 33y resist non-formation region, 34A plug pad, 35A ground pattern, 36A heat dissipation pattern, 36b 2 nd connection portion, 60 light emitting body, 61 light emitting element, 62 phosphor, 63 die pad, 64 sealing portion, 66 solder

Claims (20)

1. A light source unit is provided with:

a socket housing having an engaging portion engaged with a predetermined member;

a substrate having a base plate formed of a resin material and a wiring pattern formed on at least one surface in a thickness direction of the base plate;

a light emitting element connected to the wiring pattern and functioning as a light source;

an annular frame formed on the substrate and covering the light emitting element from the periphery;

a sealing resin filled inside the frame to seal the light emitting element; and

an electronic component bonded to a pad formed on the outer peripheral side of the frame as a part of the wiring pattern,

the frame is formed by curing a resin material having fluidity applied on the substrate,

the smaller one of the interval between the frame and the insertion pad and the interval between the frame and the electronic component is set to be 0.1mm or more.

2. A light source unit is provided with:

a socket housing having an engagement portion engaged with a predetermined member and a heat radiation plate for radiating heat to the outside;

a substrate having a base plate made of a resin material, a wiring pattern formed on at least one surface of the base plate in a thickness direction, and a heat dissipation pattern formed on the other surface of the base plate in the thickness direction, the heat dissipation pattern being connected to the heat dissipation plate; and

A light emitting element connected to the wiring pattern and functioning as a light source,

a thermal via hole for an element having one end and the other end connected to the wiring pattern and the heat dissipation pattern, respectively, is formed in the substrate, and heat is transferred to the heat dissipation plate,

when an axis passing through the light emitting element and extending in the thickness direction of the substrate is used as a reference axis, at least a part of the element thermal via is present on any one of the reference axes.

3. The light source unit according to claim 2,

when the axis passing through the center of the light emitting element among the reference axes is taken as a central axis,

at least a portion of the component thermal vias are present on the central shaft.

4. A light source unit according to claim 2 or 3,

the entirety of the element thermal via is located in a projection space obtained by projecting the light emitting element in the axial direction of the reference axis.

5. The light source unit according to claim 2, 3 or 4,

a package-type light emitting body is provided, which is formed by bonding a plurality of the light emitting elements respectively with die bonding pads and sealing at least the plurality of the light emitting elements by a sealing portion,

A plurality of the element thermal vias are formed in the substrate,

at least a part of the element thermal via is present on the reference axis of each of the plurality of light emitting elements.

6. The light source unit according to claim 5,

the plurality of electronic components are connected to the wiring patterns by solder, respectively,

the plurality of die pads are connected to the wiring patterns by solder, respectively.

7. The light source unit according to claim 2, 3, 4, 5 or 6,

a resist is applied to the heat dissipation pattern,

the heat dissipation pattern is bonded to the heat dissipation plate through the resist by an adhesive having thermal conductivity.

8. A light source unit is provided with:

a socket housing having an engagement portion engaged with a predetermined member and a heat radiation plate for radiating heat to the outside;

a substrate having a base plate made of a resin material, a wiring pattern formed on at least one surface of the base plate in a thickness direction, and a heat dissipation pattern formed on the other surface of the base plate in the thickness direction, the heat dissipation pattern being connected to the heat dissipation plate;

a light emitting element connected to the wiring pattern and functioning as a light source;

A plurality of electronic components connected to the wiring pattern, including an integrated circuit; and

a plurality of connection terminals connected to the power supply and including a ground terminal,

a circuit thermal via hole having one end and the other end connected to the wiring pattern and the heat dissipation pattern, respectively, is formed in the substrate, and transfers heat generated in the integrated circuit to the heat dissipation plate,

the substrate is composed of a plurality of layers stacked in a thickness direction, including a ground layer,

the ground layer is formed with a ground pattern in more than half of the area,

the circuit is connected to the ground pattern with a thermal via and the ground pattern is connected to the ground terminal.

9. The light source unit according to claim 8,

a heat dissipation bonding pad is arranged on the bottom surface of the integrated circuit,

a plurality of the circuit thermal vias are formed,

a circuit connection portion for connecting the heat dissipation pad is formed on the wiring pattern,

the plurality of circuits are connected to the circuit connection portion with thermal vias.

10. The light source unit according to claim 8 or 9,

a package-type light emitting body is provided, which is formed by bonding a plurality of the light emitting elements respectively with die bonding pads and sealing at least the plurality of the light emitting elements by a sealing portion,

A plurality of element thermal vias having one end and the other end connected to the wiring pattern and the heat dissipation pattern, respectively, are formed in the substrate, and heat generated in the light emitting element is transferred to the heat dissipation plate,

the element is connected to the ground pattern with a thermal via and the ground pattern is connected to the ground terminal.

11. The light source unit according to claim 10,

a plurality of element connection portions respectively connecting a plurality of the die pad are formed on the wiring pattern,

the plurality of components are connected to the component connection portion with thermal vias.

12. The light source unit according to claim 8, 9, 10 or 11,

a resist is applied to the heat dissipation pattern,

the heat dissipation pattern is bonded to the heat dissipation plate through the resist by an adhesive having thermal conductivity.

13. A light source unit is provided with:

a socket housing having an engagement portion engaged with a predetermined member and a heat radiation plate for radiating heat to the outside;

a substrate having a wiring pattern formed on at least one surface in a thickness direction and a heat dissipation pattern formed on the other surface in the thickness direction, the heat dissipation pattern being connected to the heat dissipation plate;

A power supply body having a terminal holding portion formed of an insulating resin material and a connection terminal held by the terminal holding portion, both end portions of the connection terminal protruding from the terminal holding portion; and

a light emitting element connected to the wiring pattern and functioning as a light source,

a 1 st connection portion and a 2 nd connection portion are formed on the substrate to be spaced apart in a thickness direction,

a 1 st terminal pad is formed on the 1 st connection portion, a 2 nd terminal pad is formed on the 2 nd connection portion,

a terminal through hole is formed between the 1 st connecting portion and the 2 nd connecting portion on the substrate, a part of the connecting terminal is inserted through the terminal through hole from the 2 nd connecting portion side,

the size of the 2 nd terminal pad is smaller than that of the 1 st terminal pad,

and a part of the connection terminal is bonded to the terminal through hole, the 1 st terminal pad, and the 2 nd terminal pad by solder.

14. The light source unit according to claim 13,

the power supply body is held in a state where the terminal holding portion is buried in the socket housing.

15. The light source unit according to claim 14,

The socket housing is provided with a resin molding part formed by a resin material with heat conductivity,

the terminal holding portion is embedded in the resin molding portion.

16. The light source unit according to claim 13, 14 or 15,

a package-type light emitting body is provided, which is formed by bonding a plurality of the light emitting elements respectively with die bonding pads and sealing at least a plurality of the heat dissipation plates and a plurality of the light emitting elements by a sealing resin,

the light emitting element of the light emitting body is connected to the wiring pattern.

17. A light source unit is provided with:

a socket housing having an engagement portion engaged with a predetermined member and a heat radiation plate for radiating heat to the outside;

a substrate having a base plate made of a resin material, a wiring pattern formed on at least one surface of the base plate in a thickness direction, and a heat dissipation pattern formed on the other surface of the base plate in the thickness direction, the heat dissipation pattern being connected to the heat dissipation plate;

a light emitting element connected to the wiring pattern and functioning as a light source; and

a plurality of electronic components connected to the wiring pattern, including an integrated circuit,

A ground portion is formed between the outer periphery of the substrate and the integrated circuit as a part of the wiring pattern.

18. The light source unit according to claim 17,

the grounding portion is formed on an outer peripheral portion of the substrate.

19. The light source unit according to claim 17 or 18,

a resist non-forming region to which no resist is applied is formed in the ground portion.

20. The light source unit according to claim 17, 18 or 19,

the substrate is composed of a plurality of layers stacked in a thickness direction, including a ground layer,

the ground layer is formed with a ground pattern in more than half of the area,

a ground through hole connected to the ground part is formed in the substrate,

the ground portion is connected to the ground pattern via the ground through hole.