CN116546800A - Integrated laser power supply and production process thereof - Google Patents
Integrated laser power supply and production process thereof Download PDFInfo
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- CN116546800A CN116546800A CN202310814256.5A CN202310814256A CN116546800A CN 116546800 A CN116546800 A CN 116546800A CN 202310814256 A CN202310814256 A CN 202310814256A CN 116546800 A CN116546800 A CN 116546800A
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- laser power
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- 238000004519 manufacturing process Methods 0.000 title abstract description 14
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 102
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 102
- 238000005219 brazing Methods 0.000 claims abstract description 55
- 238000001816 cooling Methods 0.000 claims abstract description 17
- 239000002826 coolant Substances 0.000 claims abstract description 8
- 239000000919 ceramic Substances 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 24
- 239000003292 glue Substances 0.000 claims description 20
- 238000005476 soldering Methods 0.000 claims description 13
- 239000004519 grease Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 12
- 229920001296 polysiloxane Polymers 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 230000008569 process Effects 0.000 claims description 9
- 230000001680 brushing effect Effects 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 4
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 10
- IYZWUWBAFUBNCH-UHFFFAOYSA-N 2,6-dichlorobiphenyl Chemical compound ClC1=CC=CC(Cl)=C1C1=CC=CC=C1 IYZWUWBAFUBNCH-UHFFFAOYSA-N 0.000 description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 239000004411 aluminium Substances 0.000 description 8
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Semiconductor Lasers (AREA)
Abstract
The invention discloses an integrated laser power supply and a production process thereof, wherein the laser power supply comprises a PCB (printed circuit board), a magnetic device, a brazing sheet and a plurality of heat conduction aluminum cans, wherein the magnetic device comprises an AC-DC module, a DC-DC constant current module and an AC-DC auxiliary source module, the AC-DC module, the DC-DC constant current module and the AC-DC auxiliary source module are welded on the PCB together, and the plurality of heat conduction aluminum cans are correspondingly covered outside the AC-DC module, the DC-DC constant current module and the AC-DC auxiliary source module and are fixed on the PCB; the brazing plate is tightly attached to the tops of the heat-conducting aluminum cans, and a cooling pipeline for accommodating cooling medium to cool the heat-conducting aluminum cans is arranged in the brazing plate. Therefore, the laser power supply is formed by integrating the magnetic devices on the same PCB board and assembling the heat conduction aluminum cans and the brazing sheet in a flip-chip mode, and compared with the traditional laser power supply, the laser power supply has the advantages of less used parts, small whole size, low production cost, high heat conduction and heat dissipation efficiency and rapid and convenient assembling.
Description
Technical Field
The invention relates to the technical field of laser power supply equipment, in particular to an integrated laser power supply and a production process thereof.
Background
The laser power supply is a high-performance automatic ignition constant current power supply and is divided into a continuous laser power supply and a pulse laser power supply, wherein the continuous laser power supply is a high-performance automatic ignition constant current power supply, and the pulse laser power supply is a power supply specially designed for a pulse laser.
The conventional laser power supply includes an AC-DC module, a DC-DC constant current module, an AC-DC auxiliary source module, and a water cooled plate. The traditional laser power supply is characterized in that an AC-DC module, a DC-DC constant current module and an AC-DC auxiliary source module are respectively arranged on a PCB, then assembled on a bottom plate and then combined with a water cooling plate. The traditional production process comprises the following assembly procedures: (1) the method comprises the steps of placing the magnetic device in the aluminum can, pouring heat conduction AB glue into the aluminum can, inserting the power tube onto the PCB, wave soldering, manually welding the magnetic device with the AB glue poured onto the PCB, locking the module onto the aluminum base plate, and locking the module onto the water cooling plate. Moreover, the placement of the main power magnetic device of the traditional laser power supply needs to be hollowed out at the corresponding position of the PCB, because the magnetic device needs to conduct heat to the bottom plate through the heat conduction aluminum pot. After the PCB is hollowed out, the heat conduction aluminum can be downwards attached to the bottom plate to conduct heat.
Such designs suffer from the following drawbacks: 1. the used parts are more, so that the cost is high, the assembly process is complex, the occupied space is large, the whole volume is large, and the method is not suitable for miniaturized application; 2. the heat dissipation needs to pass through the bottom plate, and then the water cooling plate is used for cooling and heat dissipation, so that the heat dissipation path is long, and the heat dissipation efficiency is slowed down; 3. the water cooling plate is positioned below the PCB, each module is in contact with the water cooling plate, the PCB is required to be hollowed out, the process is complex, the PCB space is occupied, and the large volume of the laser power supply is indirectly caused; 4. complicated assembly steps and low production efficiency.
Accordingly, improvements to existing laser power supplies have been made to address the above-described problems.
Disclosure of Invention
In view of the above, the present invention aims at overcoming the drawbacks of the prior art, and its main objective is to provide an integrated laser power supply and a production process thereof, wherein a plurality of magnetic devices are integrated on the same PCB board, and a plurality of heat-conducting aluminum cans and brazing plates are used for assembling to form the laser power supply in a flip-chip manner.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
the integrated laser power supply comprises a PCB, a magnetic device, a brazing sheet and a plurality of heat conduction aluminum cans, wherein the magnetic device comprises an AC-DC module, a DC-DC constant current module and an AC-DC auxiliary source module, the AC-DC module, the DC-DC constant current module and the AC-DC auxiliary source module are welded on the PCB together, and the plurality of heat conduction aluminum cans are correspondingly covered outside the AC-DC module, the DC-DC constant current module and the AC-DC auxiliary source module and are fixed on the PCB; the brazing plate is tightly attached to the tops of the heat-conducting aluminum cans, and a cooling pipeline for accommodating cooling medium to cool the heat-conducting aluminum cans is arranged in the brazing plate.
As a preferred embodiment: the laser power supply further comprises a power tube, and the power tube is arranged on the side wall of the heat conduction aluminum tank.
As a preferred embodiment: and a ceramic substrate is arranged on the side wall of the heat conduction aluminum tank, and the power tube is arranged on the ceramic substrate.
As a preferred embodiment: the upper surfaces of the plurality of heat conduction aluminum cans are flush.
As a preferred embodiment: the heat conduction AB glue which tightly combines the magnetic device and the heat conduction aluminum can is filled in the heat conduction aluminum can.
As a preferred embodiment: and a plurality of connecting studs are detachably arranged on the brazing plate and are detachably connected with the PCB.
The production process applied to the integrated laser power supply comprises the following steps:
s1, tightly locking a power tube on a heat conduction aluminum tank;
s2, inserting the magnetic device on the PCB;
s3, inserting the heat conduction aluminum pot provided with the power tube on a PCB;
s4, fixing the magnetic device and the heat conduction aluminum pot on the PCB by wave soldering;
s5, pouring heat conduction AB glue into the heat conduction aluminum pot;
s6, locking and fixing the brazing plate and the PCB.
As a preferred embodiment: in the step S1, the power tube is installed by the following steps:
s101, placing a heat conduction aluminum pot into a tool;
s102, coating heat-conducting silicone grease on the contact surface of the heat-conducting aluminum pot and the ceramic substrate;
s103, placing a ceramic substrate limiting jig and then placing a ceramic substrate;
s104, brushing silicone grease on the surface of the ceramic substrate;
s105, placing a power tube limiting tool, and placing a power tube in the power tube limiting tool;
s106, fastening the power tube on the ceramic substrate.
As a preferred embodiment: in the step S5, the heat conduction adhesive A and the heat conduction adhesive B are uniformly stirred by using a stirring machine according to the proportion of 1:1, the uniformly stirred heat conduction adhesive AB is injected into a heat conduction aluminum pot by using a glue filling device, then the heat conduction adhesive AB is integrally placed in chain type curing furnace equipment for heating and curing, and the heat conduction adhesive AB is completely solidified after baking is completed.
As a preferred embodiment: the step S6 comprises the following steps:
s601, fixing a connecting stud on a brazing sheet;
s602, brushing heat-conducting silicone grease on one surface of the heat-conducting aluminum pot, which is attached with the brazing sheet, by using a steel mesh;
s603, reversely buckling the brazing plate on the heat-conducting aluminum pot brushed with the heat-conducting silicone grease, and fastening the heat-conducting aluminum pot by using a screw;
s604, integrally overturning, namely upwards arranging the PCB on the surface of the soldering plate, and fixing the PCB on the connecting stud of the soldering plate by using the screw.
Compared with the prior art, the invention has obvious advantages and beneficial effects, in particular, the technical proposal shows that the laser power supply is formed by combining the PCB, the magnetic device, the brazing plate and the plurality of heat conduction aluminum cans, and has the following characteristics:
firstly, a plurality of magnetic devices (three modules of AC-DC, DC-DC constant current and AC-DC auxiliary source) are integrally arranged on the same PCB, so that the space for arranging the magnetic devices is reduced, and the whole volume of a laser power supply is reduced; and a plurality of magnetic devices are integrated into a module, only one integrated module is required to be assembled on the brazing sheet during assembly, and only one assembly step is required, so that the assembly is more rapid and convenient. The overall structure size length and width of the traditional laser power supply is 420 x 360 x 65mm, the overall structure size length and width of the laser power supply produced by adopting the scheme of the invention is 310 x 186 x 56mm, the volume is now one third of that of the traditional laser power supply, the whole volume is greatly reduced, and the transportation cost is reduced.
Secondly, a traditional aluminum base plate is omitted (compared with a traditional laser power supply, three aluminum base plates are reduced, an AC-DC module, a DC-DC constant current module and an AC-DC auxiliary source module are integrated on one PCB to form an integrated module, the integrated whole machine volume is effectively utilized), and a water cooling plate is directly replaced by a brazing plate, so that the material cost is reduced; and the heat dissipation does not need to pass through the medium of the aluminum base plate, heat is directly transferred to the brazing sheet, heat transfer is quicker, and finally the heat is taken away by the cooling medium in the brazing sheet, so that the heat dissipation efficiency is higher and the effect is better.
Thirdly, the brazing plate is closely arranged at the top of the heat conduction aluminum pot, namely the brazing plate and the PCB are respectively arranged at the upper end and the lower end of the magnetic module and the heat conduction aluminum pot; for traditional assembled mode, this mode of assembly is equivalent to the flip-chip (magnetic device is in heat conduction aluminium pot, and power tube lock is in heat conduction aluminium pot lateral wall tightly, and heat conduction AB glue is poured into to heat conduction aluminium pot inside, and the laminating brazing sheet is laminated at heat conduction aluminium pot top, and heat is taken away through the cooling medium in the brazing sheet, forms the flip-chip form from this). In the flip-chip mode, the PCB is not required to be hollowed out, and the saved hollowed-out position of the PCB is effectively utilized; the traditional water-cooling plate is produced in a machining mode, so that the thickness cannot be thinned, and the brazing plate is produced by using a stretching die and can be 6mm thick; in summary, compared with the traditional laser power supply, the laser power supply produced by adopting the scheme of the invention has the advantages that the aluminum cost is greatly reduced; and moreover, the PCB structure is more complete, the whole volume is greatly reduced, and the transportation cost is reduced.
Fourth, the complete machine assembly step of the traditional laser power supply: an AC-DC module, a DC-DC constant current module, an AC-DC auxiliary source module, an aluminum base plate and a water cooling plate; the existing whole machine assembling steps are as follows: flip-chip integrated module→brazing sheet. Six assembly operations are assembled on the traditional complete machine, only one assembly operation is needed at present, and the production and assembly operations are more convenient.
In order to more clearly illustrate the structural features and efficacy of the present invention, a detailed description thereof will be given below with reference to the accompanying drawings and examples.
Drawings
FIG. 1 is a schematic perspective view of a laser power supply of the present invention;
FIG. 2 is a schematic perspective view of another view of the laser power supply of the present invention;
FIG. 3 is an exploded perspective view of the laser power supply of the present invention;
FIG. 4 is an exploded perspective view of another view of the laser power supply of the present invention;
FIG. 5 is a schematic diagram of a laser power supply production process according to the present invention.
The attached drawings are used for identifying and describing:
10. a PCB board; 20. a magnetic device; 30. a brazing sheet; 31. a cooling pipe; 32. a connecting stud; 40. a thermally conductive aluminum can; 50. a power tube; 60. a ceramic substrate.
Detailed Description
The invention is as shown in fig. 1 to 5, an integrated laser power supply and a production process thereof, the laser power supply comprises a PCB board 10, a magnetic device 20, a brazing sheet 30 and a plurality of heat conducting aluminum cans 40, wherein:
the magnetic device 20 includes an AC-DC module, a DC-DC constant current module, and an AC-DC auxiliary source module, which are soldered together on the same PCB board 10.
The laser power supply further comprises a power tube 50, wherein the power tube 50 is arranged on the side wall of the heat conduction aluminum tank 40, specifically, a ceramic substrate 60 is arranged on the side wall of the heat conduction aluminum tank 40, and the power tube 50 is arranged on the ceramic substrate 60. And, the upper surfaces of the plurality of heat conductive aluminum cans 40 are flush so as to ensure that the upper surfaces of all the heat conductive aluminum cans are in full contact with the brazing sheet 30 when being adhered to the brazing sheet 30, thereby improving heat dissipation efficiency.
The plurality of heat conduction aluminum cans 40 are correspondingly covered outside the AC-DC module, the DC-DC constant current module and the AC-DC auxiliary source module and are fixed on the PCB 10; the heat conduction aluminum can 40 is filled with heat conduction AB glue which tightly combines the magnetic device 20 and the heat conduction aluminum can 40, and heat generated by the magnetic device 20 is transferred to the heat conduction aluminum can 40 through the heat conduction AB glue.
The brazing sheet 30 is tightly attached to the tops of the plurality of heat-conducting aluminum cans 40, and a cooling pipeline 31 for containing a cooling medium to cool the heat-conducting aluminum cans 40 is arranged in the brazing sheet 30; and a plurality of connection studs 32 (copper studs) are detachably mounted on the soldering plate 30, and the plurality of connection studs 32 are detachably connected with the PCB 10 by screws.
The production process applied to the integrated laser power supply is mainly carried out according to the following operation sequence: (1) the integrated module integrated with the PCB 10, the magnetic device 20, the power tube 50 and the heat conduction aluminum can 40 is tightly locked on the brazing sheet 30 through the fixture locking the power tube 50 on the heat conduction aluminum can 40 → (2) the magnetic device 20 is inserted on the PCB 10 → (3) the heat conduction aluminum can 40 provided with the power tube 50 is inserted on the PCB 10 → (4) wave soldering → (5) the heat conduction aluminum can 40 is filled with heat conduction AB glue → (6).
The specific processing process comprises the following operation steps:
s1, tightly locking the power tube 50 on the heat-conducting aluminum pot 40; the process comprises the following steps:
s101, placing the heat-conducting aluminum pot 40 into a tool;
s102, coating heat-conducting silicone grease on the contact surface of the heat-conducting aluminum pot 40 and the ceramic substrate 60;
s103, placing a ceramic substrate limiting jig, and then placing a ceramic substrate 60 in the limiting jig; the limiting jig limits the ceramic substrate 60 to prevent the position of the ceramic substrate from shifting;
s104, brushing silicone grease on the surface of the ceramic substrate 60;
s105, placing a power tube 50 limiting tool, and placing the power tube 50 in the power tube 50 limiting tool; the limiting tool has similar functions to the limiting tool, and belongs to limiting auxiliary components, and the limiting tool is not described in detail herein;
s106, the power tube 50 is fastened on the ceramic substrate 60.
S2, inserting the magnetic device 20 on the PCB 10; specifically, the magnetic device 20 is directly inserted on the PCB 10 according to the corresponding position number, and the priority order of the plug-ins is as follows: from small to large (from small to large in volume), and from inside to outside (from inside to outside in sequence); all magnetic devices 20 are attached to the PCB 10 as desired and are not allowed to float or tilt.
S3, the heat conduction aluminum pot 40 provided with the power tube 50 is inserted on the PCB 10, specifically, the heat conduction aluminum pot 40 provided with the power tube 50 in S1 is directly inserted on the PCB 10 corresponding to the hole position on the PCB 10, the heat conduction aluminum pot 40 cannot float and incline, and the whole heat conduction aluminum pot 40 needs to be locked on the brazing sheet 30.
S4, fixing the magnetic device 20 and the heat conduction aluminum pot 40 on the PCB 10 by wave soldering; before the wave soldering is adopted to pass through the board, the spray uniformity and penetration force of the soldering flux are required to be tested, the furnace temperature curve is measured after the test is finished, and the soldering flux can pass through the furnace after the parameters are confirmed.
S5, pouring heat conduction AB glue into the heat conduction aluminum pot 40; specifically, the heat conduction glue A and the glue B are uniformly stirred by using a stirring machine according to the proportion of 1:1, the uniformly stirred heat conduction glue AB is injected into the heat conduction aluminum pot 40 by using a glue filling device, then the heat conduction glue AB is integrally placed in chain type curing furnace equipment for heating and curing, and the heat conduction glue AB is completely solidified after baking is completed.
S6, locking and fixing the brazing sheet 30 and the PCB 10, wherein the process comprises the following steps:
s601, fixing the connecting stud 32 on the brazing sheet 30;
s602, brushing heat-conducting silicone grease on one surface of the heat-conducting aluminum pot 40, which is attached to the brazing sheet 30, by using a steel mesh;
s603, reversely buckling the brazing sheet 30 on the heat-conducting aluminum pot 40 brushed with the heat-conducting silicone grease, and fastening the heat-conducting aluminum pot 40 by using screws;
s604, integrally overturning, namely, upwards arranging one surface of the PCB 10, and fixing the PCB 10 on the connecting studs 32 of the brazing sheet 30 by using screws.
The design focus of the invention is that a laser power supply is formed by combining a PCB board, a magnetic device, a brazing plate and a plurality of heat conduction aluminum cans, and the laser power supply has the following characteristics:
firstly, a plurality of magnetic devices (three modules of AC-DC, DC-DC constant current and AC-DC auxiliary source) are integrally arranged on the same PCB, so that the space for arranging the magnetic devices is reduced, and the whole volume of a laser power supply is reduced; and a plurality of magnetic devices are integrated into a module, only one integrated module is required to be assembled on the brazing sheet during assembly, and only one assembly step is required, so that the assembly is more rapid and convenient. The overall structure size length and width of the traditional laser power supply is 420 x 360 x 65mm, the overall structure size length and width of the laser power supply produced by adopting the scheme of the invention is 310 x 186 x 56mm, the volume is now one third of that of the traditional laser power supply, the whole volume is greatly reduced, and the transportation cost is reduced.
Secondly, a traditional aluminum base plate is omitted (compared with a traditional laser power supply, three aluminum base plates are reduced, an AC-DC module, a DC-DC constant current module and an AC-DC auxiliary source module are integrated on a PCB, the integral volume is effectively utilized after integration), and a water cooling plate is directly replaced by a brazing plate, so that the material cost is reduced; and the heat dissipation does not need to pass through the medium of the aluminum base plate, heat is directly transferred to the brazing sheet, heat transfer is quicker, and finally the heat is taken away by the cooling medium in the brazing sheet, so that the heat dissipation efficiency is higher and the effect is better.
Thirdly, the brazing plate is closely arranged at the top of the heat conduction aluminum pot, namely the brazing plate and the PCB are respectively arranged at the upper end and the lower end of the magnetic module and the heat conduction aluminum pot; for traditional assembled mode, this mode of assembly is equivalent to the flip-chip (magnetic device is in heat conduction aluminium pot, and power tube lock is in heat conduction aluminium pot lateral wall tightly, and heat conduction AB glue is poured into to heat conduction aluminium pot inside, and the laminating brazing sheet is laminated at heat conduction aluminium pot top, and heat is taken away through the cooling medium in the brazing sheet, forms the flip-chip form from this). In the flip-chip mode, the PCB is not required to be hollowed out, and the saved hollowed-out position of the PCB is effectively utilized; the traditional water-cooling plate is produced in a machining mode, so that the thickness cannot be thinned, and the brazing plate is produced by using a stretching die and can be 6mm thick; in summary, compared with the traditional laser power supply, the laser power supply produced by adopting the scheme of the invention has the advantages that the aluminum cost is greatly reduced; and moreover, the PCB structure is more complete, the whole volume is greatly reduced, and the transportation cost is reduced.
Fourth, the complete machine assembly step of the traditional laser power supply: an AC-DC module, a DC-DC constant current module, an AC-DC auxiliary source module, an aluminum base plate and a water cooling plate; the existing whole machine assembling steps are as follows: flip-chip integrated module→brazing sheet. The traditional complete machine is assembled with six assembly operation steps, only one assembly operation is needed at present, and the production and assembly operations are more convenient.
The foregoing description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so any minor modifications, equivalent changes and modifications made to the above embodiments according to the technical principles of the present invention still fall within the scope of the technical solutions of the present invention.
Claims (10)
1. An integral type laser power, its characterized in that: the magnetic device comprises an AC-DC module, a DC-DC constant current module and an AC-DC auxiliary source module, wherein the AC-DC module, the DC-DC constant current module and the AC-DC auxiliary source module are welded on the PCB together, and the plurality of heat conduction aluminum cans are correspondingly covered outside the AC-DC module, the DC-DC constant current module and the AC-DC auxiliary source module and are fixed on the PCB; the brazing plate is tightly attached to the tops of the heat-conducting aluminum cans, and a cooling pipeline for accommodating cooling medium to cool the heat-conducting aluminum cans is arranged in the brazing plate.
2. The integrated laser power supply of claim 1, wherein: the heat conduction aluminum pot is characterized by further comprising a power tube, wherein the power tube is arranged on the side wall of the heat conduction aluminum pot.
3. The integrated laser power supply of claim 2, wherein: and a ceramic substrate is arranged on the side wall of the heat conduction aluminum tank, and the power tube is arranged on the ceramic substrate.
4. The integrated laser power supply of claim 1, wherein: the upper surfaces of the plurality of heat conduction aluminum cans are flush.
5. The integrated laser power supply of claim 1, wherein: the heat conduction AB glue which tightly combines the magnetic device and the heat conduction aluminum can is filled in the heat conduction aluminum can.
6. The integrated laser power supply of claim 1, wherein: and a plurality of connecting studs are detachably arranged on the brazing plate and are detachably connected with the PCB.
7. A process for producing an integrated laser power supply as claimed in any one of claims 1 to 6, comprising the steps of:
s1, tightly locking a power tube on a heat conduction aluminum tank;
s2, inserting the magnetic device on the PCB;
s3, inserting the heat conduction aluminum pot provided with the power tube on a PCB;
s4, fixing the magnetic device and the heat conduction aluminum pot on the PCB by wave soldering;
s5, pouring heat conduction AB glue into the heat conduction aluminum pot;
s6, locking and fixing the brazing plate and the PCB.
8. The process for producing an integrated laser power supply according to claim 7, wherein in S1, the mounting of the power tube comprises the steps of:
s101, placing a heat conduction aluminum pot into a tool;
s102, coating heat-conducting silicone grease on the contact surface of the heat-conducting aluminum pot and the ceramic substrate;
s103, placing a ceramic substrate limiting jig and then placing a ceramic substrate;
s104, brushing silicone grease on the surface of the ceramic substrate;
s105, placing a power tube limiting tool, and placing a power tube in the power tube limiting tool;
s106, fastening the power tube on the ceramic substrate.
9. The process for producing an integrated laser power supply according to claim 7, wherein: and S5, uniformly stirring the heat conduction adhesive A and the heat conduction adhesive B by using a stirring machine according to the proportion of 1:1, injecting the uniformly stirred heat conduction adhesive AB into a heat conduction aluminum pot by using a glue filling device, then integrally placing the heat conduction adhesive AB into chain type curing furnace equipment for heating and curing, and completely solidifying the heat conduction adhesive AB after baking is finished.
10. The process for producing an integrated laser power supply according to claim 7, wherein in S6, the steps of:
s601, fixing a connecting stud on a brazing sheet;
s602, brushing heat-conducting silicone grease on one surface of the heat-conducting aluminum pot, which is attached with the brazing sheet, by using a steel mesh;
s603, reversely buckling the brazing plate on the heat-conducting aluminum pot brushed with the heat-conducting silicone grease, and fastening the heat-conducting aluminum pot by using a screw;
s604, integrally overturning, namely upwards arranging the PCB on the surface of the soldering plate, and fixing the PCB on the connecting stud of the soldering plate by using the screw.
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| CN202310814256.5A CN116546800A (en) | 2023-07-05 | 2023-07-05 | Integrated laser power supply and production process thereof |
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Application publication date: 20230804 |