US20090249624A1 - Method of making heat sink - Google Patents

Method of making heat sink Download PDF

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Publication number
US20090249624A1
US20090249624A1 US12/133,393 US13339308A US2009249624A1 US 20090249624 A1 US20090249624 A1 US 20090249624A1 US 13339308 A US13339308 A US 13339308A US 2009249624 A1 US2009249624 A1 US 2009249624A1
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United States
Prior art keywords
heat sink
base
fins
making
fin
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/133,393
Inventor
Qing-Lei Guo
Shou-Li Zhu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuzhun Precision Industry Shenzhen Co Ltd
Foxconn Technology Co Ltd
Original Assignee
Fuzhun Precision Industry Shenzhen Co Ltd
Foxconn Technology Co Ltd
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Filing date
Publication date
Application filed by Fuzhun Precision Industry Shenzhen Co Ltd, Foxconn Technology Co Ltd filed Critical Fuzhun Precision Industry Shenzhen Co Ltd
Assigned to FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD. reassignment FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: GUO, Qing-lei, ZHU, Shou-li
Publication of US20090249624A1 publication Critical patent/US20090249624A1/en
Abandoned legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
    • B23K20/233—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
    • B23K20/2333—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer one layer being aluminium, magnesium or beryllium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/04—Tubular or hollow articles
    • B23K2101/14—Heat exchangers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/18—Dissimilar materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Definitions

  • the present invention generally relates to heat sinks, and more particularly to a method of making a heat sink used for dissipating heat from heat-generating components.
  • a typical heat sink includes a base and a fin assembly attached to the base.
  • the base thermally contacts with a heat generating electronic component.
  • the fin assembly includes a plurality of fins joined together.
  • the fin assembly is welded to the base via tin soldering method.
  • solder and flux are required during soldering of the heat sink.
  • the base and the fin assembly are respectively made of different materials, such as copper and aluminum, an additional process for coating a nickel layer on welding surfaces of the base and the fin assembly is needed.
  • the cost of the heat sink is increased and the process of making the heat sink is complicated.
  • tiny air bubbles will be formed between the fin assembly and the base, thereby increasing a heat resistance between the base and the fin assembly, which further decreases the heat dissipating efficiency of the heat sink.
  • the present invention relates to a method of making a heat sink.
  • the method of making the heat sink includes the following steps: providing a base and a plurality of individual fins, and welding the fins successively to the base by ultrasonic welding method.
  • FIG. 1 is an isometric view showing fins of a heat sink to be joined to a base of the heat sink by an ultrasonic welding process in accordance with a first embodiment of the present invention.
  • FIG. 2 is an assembled, isometric view of the heat sink of FIG. 1 .
  • FIG. 3 is an isometric view showing fins of a heat sink to be jointed to a base of the heat sink by an ultrasonic welding process of a heat sink in accordance with a second embodiment of the present invention.
  • FIG. 4 is an assembled, isometric view of the heat sink of FIG. 3 .
  • FIG. 1 an ultrasonic welding process of a heat sink 10 in accordance with a first embodiment of the present invention is shown. Firstly, a base 11 and a plurality of individual fins 13 are provided.
  • the base 11 has a rectangular shape.
  • the base 11 is made of copper, which has good thermal conductivity.
  • the base 11 has a contacting surface 111 at a top thereof.
  • the fins 13 are made of aluminum, which has good thermal conductivity. Aluminum has a lower thermal conductivity than copper. Each fin 13 has a plate shape, and has a thickness in a range of 0.3 ⁇ 0.4 mm. Each fin 13 includes a rectangular main body 133 , and a flange 134 extending vertically and outwardly from a bottom side of the main body 133 .
  • the fins 13 are successively welded to the base 11 by ultrasonic welding method. Specifically, the flange 134 of each fin 13 is welded on the contacting surface 111 of the base 11 by the ultrasonic welding method. When one of the fins 13 is welded on the contacting surface 111 of the base 11 , a welding area 136 is defined at a front side of the welded one of the fins 13 for receiving another one of the fins 13 to be soldered to the base 11 .
  • the ultrasonic welding can seamlessly join two workpieces together when the workpieces are under high-frequency ultrasonic acoustic vibrations and pressure.
  • the ultrasonic welding method has many advantages, such as environment friendly, cleaning, energy and time saving and so on.
  • the ultrasonic welding method not only fits for joining different materials, but also has a lower requirement with respect to the quality of the surfaces to be welded together. Oxidated and electroplated surfaces also fit for the ultrasonic welding method.
  • the base 11 and the fins 13 of the heat sink 10 are respectively made of copper and aluminum, the ultrasonic welding method can easily weld the base 11 and the fins 13 together.
  • the base 11 and the fins 13 are seamlessly welded together by the ultrasonic welding method, thereby decreasing the heat resistance between the base 11 and the fins 13 .
  • heat dissipating efficiency of the heat sink 10 is accordingly improved.
  • solder and flux are not required during the ultrasonic welding method, whereby the cost of the heat sink 10 is decreased and the process of making the heat sink 10 is simplified.
  • each fin 13 has a small thickness in the range of 0.3 ⁇ 0.4 mm; thus, the required power for welding each fin 13 is in an acceptable range, thereby decreasing unnecessary energy consumption.
  • a larger welding head is generally required in the ultrasonic welding.
  • the flanges 134 of the fins 13 are successively welded on the contacting surface 111 of the base 11 by the ultrasonic welding method.
  • the welding head can be small.
  • the welding area 136 defined at the front side of the fin 13 to be welded can provide an adequate enough space for the welding head to press the flange 134 of the fin 13 to be welded.
  • the welding head can conveniently and evenly apply the pressure on the flange 134 of each fin 13 to be welded, which helps the fins 13 to have an intimate connection with the base 11 .
  • the heat sink 10 made by the ultrasonic welding method is shown.
  • the fins 13 of the heat sink 10 are stacked together and parallel to each other.
  • a bottom surface of the base 11 of the heat sink 10 thermally contacts with a heat generating component (not shown) to absorb heat therefrom, and then transfers the heat towards the fins 13 .
  • FIG. 3 an ultrasonic welding process of a heat sink 20 in accordance with a second embodiment of the present invention is shown. Firstly, a base 21 and a plurality of individual fins 23 are provided.
  • the base 21 has a cylindrical shape.
  • the base 21 is made of copper, which has good thermal conductivity.
  • the base 21 has a circular contacting surface 211 at a circumference thereof.
  • the fins 23 are made of aluminum, which has good thermal conductivity. Each fin 23 has a plate shape, and has a thickness in a range of 0.3 ⁇ 0.4 mm. Each fin 23 includes a main body 233 , and a flange 234 extending vertically and outwardly from an inner side of the main body 233 .
  • the main body 233 of each fin 23 includes a lower part 237 , a middle part 238 and an upper part 239 . A length from an inner side towards an outer side of each of the lower part 237 , the middle part 238 and the upper part 239 is successively increased, thereby forming two sidesteps at an outer side of the main body 233 .
  • the fins 23 are successively welded to the base 21 by ultrasonic welding method.
  • the flange 234 of each fin 23 is welded on the contacting surface 211 of the base 21 by the ultrasonic welding method.
  • a welding area 236 is defined at a front side of the welded fin 23 .
  • the heat sink 20 made by the ultrasonic welding method is shown.
  • the fins 23 of the heat sink 20 are radially welded to the base 21 .
  • a bottom surface of the base 21 of the heat sink 20 thermally contacts with a heat generating component (not shown) to absorb heat therefrom, and then transfers the heat towards the fins 23 .

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

A method of making a heat sink (10) includes the following steps: providing a base (11) and a plurality of individual fins (13), and welding the fins successively to the base by ultrasonic welding method.

Description

    BACKGROUND
  • 1. Technical Field
  • The present invention generally relates to heat sinks, and more particularly to a method of making a heat sink used for dissipating heat from heat-generating components.
  • 2. Description of Related Art
  • It is well known that heat is produced by electronic components such as integrated circuit chips during their normal operations. If the heat is not timely removed, these electronic components may overheat. Therefore, heat sinks are often used to cool these electronic components.
  • Presently, a typical heat sink includes a base and a fin assembly attached to the base. The base thermally contacts with a heat generating electronic component. The fin assembly includes a plurality of fins joined together. The fin assembly is welded to the base via tin soldering method. However, solder and flux are required during soldering of the heat sink. Specially, when the base and the fin assembly are respectively made of different materials, such as copper and aluminum, an additional process for coating a nickel layer on welding surfaces of the base and the fin assembly is needed. Thus, the cost of the heat sink is increased and the process of making the heat sink is complicated. In addition, during the soldering process, tiny air bubbles will be formed between the fin assembly and the base, thereby increasing a heat resistance between the base and the fin assembly, which further decreases the heat dissipating efficiency of the heat sink.
  • What is needed, therefore, is a new method of making a heat sink which can overcome the shortcomings of the prior art.
    • SUMMARY
  • The present invention relates to a method of making a heat sink. According to a preferred embodiment of the present invention, the method of making the heat sink includes the following steps: providing a base and a plurality of individual fins, and welding the fins successively to the base by ultrasonic welding method.
  • Other advantages and novel features of the present invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • Many aspects of the present method can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present method. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
  • FIG. 1 is an isometric view showing fins of a heat sink to be joined to a base of the heat sink by an ultrasonic welding process in accordance with a first embodiment of the present invention.
  • FIG. 2 is an assembled, isometric view of the heat sink of FIG. 1.
  • FIG. 3 is an isometric view showing fins of a heat sink to be jointed to a base of the heat sink by an ultrasonic welding process of a heat sink in accordance with a second embodiment of the present invention.
  • FIG. 4 is an assembled, isometric view of the heat sink of FIG. 3.
    •  DETAILED DESCRIPTION
  • Referring to FIG. 1, an ultrasonic welding process of a heat sink 10 in accordance with a first embodiment of the present invention is shown. Firstly, a base 11 and a plurality of individual fins 13 are provided.
  • The base 11 has a rectangular shape. The base 11 is made of copper, which has good thermal conductivity. The base 11 has a contacting surface 111 at a top thereof.
  • The fins 13 are made of aluminum, which has good thermal conductivity. Aluminum has a lower thermal conductivity than copper. Each fin 13 has a plate shape, and has a thickness in a range of 0.3˜0.4 mm. Each fin 13 includes a rectangular main body 133, and a flange 134 extending vertically and outwardly from a bottom side of the main body 133.
  • During assembly of the heat sink 10, the fins 13 are successively welded to the base 11 by ultrasonic welding method. Specifically, the flange 134 of each fin 13 is welded on the contacting surface 111 of the base 11 by the ultrasonic welding method. When one of the fins 13 is welded on the contacting surface 111 of the base 11, a welding area 136 is defined at a front side of the welded one of the fins 13 for receiving another one of the fins 13 to be soldered to the base 11. The ultrasonic welding can seamlessly join two workpieces together when the workpieces are under high-frequency ultrasonic acoustic vibrations and pressure.
  • The ultrasonic welding method has many advantages, such as environment friendly, cleaning, energy and time saving and so on. The ultrasonic welding method not only fits for joining different materials, but also has a lower requirement with respect to the quality of the surfaces to be welded together. Oxidated and electroplated surfaces also fit for the ultrasonic welding method. Although the base 11 and the fins 13 of the heat sink 10 are respectively made of copper and aluminum, the ultrasonic welding method can easily weld the base 11 and the fins 13 together. In addition, the base 11 and the fins 13 are seamlessly welded together by the ultrasonic welding method, thereby decreasing the heat resistance between the base 11 and the fins 13. Thus, heat dissipating efficiency of the heat sink 10 is accordingly improved. Furthermore, solder and flux are not required during the ultrasonic welding method, whereby the cost of the heat sink 10 is decreased and the process of making the heat sink 10 is simplified.
  • In the ultrasonic welding method, a required power is increased dramatically along with an increase of the thickness of the workpiece being welded. However, in the heat sink 10, each fin 13 has a small thickness in the range of 0.3˜0.4 mm; thus, the required power for welding each fin 13 is in an acceptable range, thereby decreasing unnecessary energy consumption. In addition, a larger welding head is generally required in the ultrasonic welding. However, in the heat sink 10, the flanges 134 of the fins 13 are successively welded on the contacting surface 111 of the base 11 by the ultrasonic welding method. Thus, the welding head can be small. The welding area 136 defined at the front side of the fin 13 to be welded can provide an adequate enough space for the welding head to press the flange 134 of the fin 13 to be welded. Thus, the welding head can conveniently and evenly apply the pressure on the flange 134 of each fin 13 to be welded, which helps the fins 13 to have an intimate connection with the base 11.
  • Referring to FIG. 2, the heat sink 10 made by the ultrasonic welding method is shown. The fins 13 of the heat sink 10 are stacked together and parallel to each other. A bottom surface of the base 11 of the heat sink 10 thermally contacts with a heat generating component (not shown) to absorb heat therefrom, and then transfers the heat towards the fins 13.
  • Referring to FIG. 3, an ultrasonic welding process of a heat sink 20 in accordance with a second embodiment of the present invention is shown. Firstly, a base 21 and a plurality of individual fins 23 are provided.
  • The base 21 has a cylindrical shape. The base 21 is made of copper, which has good thermal conductivity. The base 21 has a circular contacting surface 211 at a circumference thereof.
  • The fins 23 are made of aluminum, which has good thermal conductivity. Each fin 23 has a plate shape, and has a thickness in a range of 0.3˜0.4 mm. Each fin 23 includes a main body 233, and a flange 234 extending vertically and outwardly from an inner side of the main body 233. The main body 233 of each fin 23 includes a lower part 237, a middle part 238 and an upper part 239. A length from an inner side towards an outer side of each of the lower part 237, the middle part 238 and the upper part 239 is successively increased, thereby forming two sidesteps at an outer side of the main body 233.
  • During assembly of the heat sink 20, the fins 23 are successively welded to the base 21 by ultrasonic welding method. Specially, the flange 234 of each fin 23 is welded on the contacting surface 211 of the base 21 by the ultrasonic welding method. When one of the fins 23 is welded on the contacting surface 211 of the base 21, a welding area 236 is defined at a front side of the welded fin 23.
  • Referring to FIG. 4, the heat sink 20 made by the ultrasonic welding method is shown. The fins 23 of the heat sink 20 are radially welded to the base 21. A bottom surface of the base 21 of the heat sink 20 thermally contacts with a heat generating component (not shown) to absorb heat therefrom, and then transfers the heat towards the fins 23.
  • It is believed that the present invention and its advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the invention or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the invention.

Claims (8)

1. A method of making a heat sink, comprising:
providing a base and a plurality of individual fins; and
welding the fins successively to the base by ultrasonic welding method.
2. The method of making a heat sink of claim 1, wherein the base is made of copper, and the fins are made of aluminum.
3. The method of making a heat sink of claim 1, wherein the base has a rectangular shape, and the fins are stacked together and parallel to each other.
4. The method of making a heat sink of claim 1, wherein the base has a cylindrical shape, and the fins are radially welded to the base.
5. The method of making a heat sink of claim 4, wherein each fin includes a lower part, a middle part and an upper part, and a length from an inner side towards an outer side of each of the lower part, the middle part and the upper part is successively increased.
6. The method of making a heat sink of claim 1, wherein each fin includes a main body and a flange extending outwardly from the main body, the flange of each fin being welded to the base by the ultrasonic welding method.
7. The method of making a heat sink of claim 6, wherein each fin has a thickness in a range of 0.3˜0.4 mm.
8. The method of making a heat sink of claim 1, wherein each fin has a thickness in a range of 0.3˜0.4 mm.
US12/133,393 2008-04-03 2008-06-05 Method of making heat sink Abandoned US20090249624A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2008100663964A CN101549435B (en) 2008-04-03 2008-04-03 Method for manufacturing heat sink
CN200810066396.4 2008-04-03

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150184901A1 (en) * 2012-08-01 2015-07-02 Cooltech Applications One-piece part including a magnetocaloric material including an alloy including iron and silicon and at least one lanthanide, and method for manufacturing said one-piece part
WO2021014002A1 (en) 2019-07-25 2021-01-28 Abb Power Grids Switzerland Ag Arrangement of a power semiconductor module and a cooler

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Publication number Priority date Publication date Assignee Title
US6650215B1 (en) * 2002-06-17 2003-11-18 The Bergquist Company Finned heat sinks
US6742581B2 (en) * 2001-11-21 2004-06-01 Fujikura Ltd. Heat sink and fin module
US20070261242A1 (en) * 2006-05-15 2007-11-15 Foxconn Technology Co., Ltd. Method for manufacturing phase change type heat sink
US20090178794A1 (en) * 2008-01-16 2009-07-16 Wen Chen Wei Method for manufacturing heat sink having heat-dissipating fins and structure of the same
US20090236076A1 (en) * 2008-03-20 2009-09-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device

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CN1189284C (en) * 2002-01-04 2005-02-16 大连理工大学 Composite metal material explosion welding technology with shape protection function
CN2547004Y (en) * 2002-04-15 2003-04-23 奇鋐科技股份有限公司 Radiator of CPU
CN2682585Y (en) * 2004-01-12 2005-03-02 徐郁彰 Radiator forming structure
CN1647868A (en) * 2004-01-21 2005-08-03 十丰科技股份有限公司 Method for preparing welded heat radiator

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6742581B2 (en) * 2001-11-21 2004-06-01 Fujikura Ltd. Heat sink and fin module
US6650215B1 (en) * 2002-06-17 2003-11-18 The Bergquist Company Finned heat sinks
US20070261242A1 (en) * 2006-05-15 2007-11-15 Foxconn Technology Co., Ltd. Method for manufacturing phase change type heat sink
US20090178794A1 (en) * 2008-01-16 2009-07-16 Wen Chen Wei Method for manufacturing heat sink having heat-dissipating fins and structure of the same
US20090236076A1 (en) * 2008-03-20 2009-09-24 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150184901A1 (en) * 2012-08-01 2015-07-02 Cooltech Applications One-piece part including a magnetocaloric material including an alloy including iron and silicon and at least one lanthanide, and method for manufacturing said one-piece part
US10451319B2 (en) * 2012-08-01 2019-10-22 Cooltech Applications One-piece part including a magnetocaloric material including an alloy including iron and silicon and at least one lanthanide, and method for manufacturing said one-piece part
WO2021014002A1 (en) 2019-07-25 2021-01-28 Abb Power Grids Switzerland Ag Arrangement of a power semiconductor module and a cooler

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CN101549435A (en) 2009-10-07
CN101549435B (en) 2012-06-13

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