CN116487290B - New energy-based integrated circuit chip manufacturing ion implantation equipment - Google Patents
New energy-based integrated circuit chip manufacturing ion implantation equipment Download PDFInfo
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- CN116487290B CN116487290B CN202310255846.9A CN202310255846A CN116487290B CN 116487290 B CN116487290 B CN 116487290B CN 202310255846 A CN202310255846 A CN 202310255846A CN 116487290 B CN116487290 B CN 116487290B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 238000005468 ion implantation Methods 0.000 title claims abstract description 17
- 230000007246 mechanism Effects 0.000 claims abstract description 51
- 238000007789 sealing Methods 0.000 claims abstract description 46
- 238000012545 processing Methods 0.000 claims abstract description 31
- 238000010438 heat treatment Methods 0.000 claims abstract description 21
- 230000000903 blocking effect Effects 0.000 claims abstract description 16
- 238000009423 ventilation Methods 0.000 claims abstract description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000000428 dust Substances 0.000 claims description 22
- 238000007664 blowing Methods 0.000 claims description 12
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 10
- 230000001681 protective effect Effects 0.000 claims description 10
- 230000005540 biological transmission Effects 0.000 claims description 9
- 238000002347 injection Methods 0.000 claims description 9
- 239000007924 injection Substances 0.000 claims description 9
- 238000006116 polymerization reaction Methods 0.000 claims description 7
- 238000000889 atomisation Methods 0.000 claims description 5
- 238000005507 spraying Methods 0.000 claims description 5
- 238000003754 machining Methods 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 238000010521 absorption reaction Methods 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 claims 3
- 238000002513 implantation Methods 0.000 abstract 2
- 230000003028 elevating effect Effects 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 5
- 229910001873 dinitrogen Inorganic materials 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning In General (AREA)
Abstract
The utility model discloses an integrated circuit chip manufacturing ion implantation device based on new energy, which comprises a chip processing implantation device body, wherein the chip processing implantation device body comprises supporting legs, a chip processing assembly mechanism is detachably arranged on the outer surface of the top of each supporting leg, a closed sealing mechanism is arranged on the outer surface of the right side of each chip processing assembly mechanism, a clear water lifting mechanism is arranged on the outer surface of the top of each supporting leg, and one side surface of the clear water lifting mechanism is arranged on the top surface of each chip processing assembly mechanism. The utility model has the characteristics of strong practicability, capability of injecting external air into the high-temperature processor by matching with the air exhauster, capability of converging the entered wind source by matching with the converging arm plate on one side surface of the blocking ventilation plate, capability of heating the entered wind source at high temperature by the high-temperature heating column, capability of injecting the wind source into the air guide pipe by matching with the blocking ventilation plate along with continuous entry of air.
Description
Technical Field
The utility model relates to the technical field of integrated circuit injection, in particular to ion injection equipment for manufacturing an integrated circuit chip based on new energy.
Background
An integrated circuit is a miniature electronic device or component, which is made up by interconnecting the transistors, resistors, capacitors and inductors, etc. needed in a circuit and wiring together, and then making them into a miniature structure with needed circuit function by making them on a small or several small semiconductor wafers or dielectric substrates and then packaging them in a tube shell. The micro-electromechanical system is the integration of a microcircuit and a micro machine on a chip according to the functional requirements, and is a micro device or system integrating a micro sensor, a micro actuator, a micro mechanical structure, a micro power source micro energy source, signal processing and control, a high-performance electronic integrated device, an interface and communication. With the technological advancement, integrated circuit chips and microelectromechanical chips are required to be mixed and integrated together to realize high integration of functional modules.
Such as Chinese patent publication No.: CN218145869U is a hybrid packaging machine for micro-electromechanical chips and integrated circuit chips. The circuit board comprises a bottom plate and a cover plate, wherein two sides of the top of the bottom plate are respectively connected with support columns, the middle parts of the two support columns are respectively and movably connected with a circuit board, the bottoms of the circuit boards are symmetrically and movably connected with springs, the other ends of the springs are fixedly connected with the top of the bottom plate, the top of the circuit board is provided with a connecting groove, and pins of an integrated circuit or a micro-electromechanical chip are movably connected in the connecting groove. According to the utility model, a plurality of circuit boards can be connected together as required, the micro-electromechanical chip and the integrated circuit chip are respectively placed on the circuit boards for packaging, packaging glue is injected between the cover plate and the circuit boards, and the cover plate is pressed down, so that the packaged heights of different chips are consistent, and redundant packaging glue flows onto the bottom plate from gaps between the circuit boards; the baffle and the buffer spring are arranged in the communication groove, so that a downward moving space is provided for pins at two sides when the chip is pressed, and the pins are prevented from being bent.
The following problems exist in the prior art:
1. when the electronic chip is manufactured and packaged, dust is required to be cleaned on the surface of the chip and then the electronic chip is injected into the equipment, but if dust is left on the surface of the chip, the quality of the chip is affected;
2. when the chip is packaged, the chip needs to be in a completely closed state, if the environment is not in a vacuum state, dust can be adsorbed again on the surface of the chip, and when the chip is heated and ash is removed, waste heat can be reserved on the surface of the chip, so that the surface of the chip cannot be cooled rapidly.
Therefore, the ion implantation device is very necessary to manufacture an integrated circuit chip based on new energy, wherein the ion implantation device has strong design practicability, is matched with an air exhauster to infuse outside air into the high-temperature processor, is matched with a polymerization arm plate on the surface of one side of a blocking ventilation plate to polymerize an entering air source, and then is used for heating the entering air source at high temperature through a high-temperature heating column, and is matched with the blocking ventilation plate to infuse the air source into the air inlet pipe along with the continuous entering of air.
Disclosure of Invention
The utility model aims to provide an integrated circuit chip manufacturing ion implantation device based on new energy so as to solve the problems in the background technology.
In order to solve the technical problems, the utility model provides the following technical scheme: the utility model provides an integrated circuit chip makes ion implantation equipment based on new forms of energy, includes chip processing injection device body, chip processing injection device body includes the supporting legs, detachably installs chip processing equipment mechanism on the top surface of supporting legs, be provided with closed sealing mechanism on the right side surface of chip processing equipment mechanism, be provided with on the top surface of supporting legs and go up and down clear water mechanism's one side surface and set up on the top surface of chip processing equipment mechanism, slip overlap joint has the chip to remove the platen on the top surface of chip processing equipment mechanism.
The lifting clear water mechanism comprises a lifting unit, a lap joint ash removal unit is arranged on the outer surface of one side of the lifting unit, a wind source heating unit is detachably arranged on the outer surface of the top of the lap joint ash removal unit, and a limit sliding unit is arranged on the outer surface of the left side of the lap joint ash removal unit.
The closing seal mechanism comprises a transmission unit, and a closing seal unit is arranged on the outer side surface of the transmission unit.
The chip processing and assembling mechanism comprises a lap joint sliding machine tool fixedly connected to the top surface of a supporting leg, a closed sealing sleeve shell is fixedly connected to the outer surface of the top of the lap joint sliding machine tool, a sliding groove is formed in the outer surface of the top of the lap joint sliding machine tool, a nitrogen injector is fixedly mounted on the outer surface of the top of the closed sealing sleeve shell, and an atomization spraying groove is formed in the inner side surface of the top of the closed sealing sleeve shell.
The transmission unit comprises a lap joint dragon door frame fixedly connected to the outer side surface of the lap joint sliding machine tool, a rotary lifter is fixedly installed on the inner side surface of the lap joint dragon door frame, and a strip-shaped groove is formed in the top surface of the lap joint dragon door frame.
According to the technical scheme, the lifting unit comprises a protective casing fixedly connected to the outer surface of the top of the supporting leg, a threaded lifting mechanism is fixedly installed on the inner side surface of the protective casing, a sliding block is movably sleeved on the outer surface of the output end of the threaded lifting mechanism, and a fixed slat is fixedly connected to the outer surface of one side of the sliding block.
According to the technical scheme, overlap joint deashing unit includes the overlap joint lamina tecti of fixed slat bottom surface of fixed connection, the slope water conservancy diversion blast groove has been seted up on the bottom surface of overlap joint lamina tecti and is located the intermediate position, auxiliary blast groove has been seted up on the bottom surface of overlap joint lamina tecti and the edge position that is located both sides, fixed mounting has the dust to absorb the groove on the both sides surface of overlap joint lamina tecti.
According to the technical scheme, the wind source heating unit comprises a high Wen Jiagong device fixedly installed on the top surface of the fixed slat, blocking ventilation plates are fixedly connected to the inner surfaces of two sides of the high-temperature processor, an exhaust fan is fixedly installed on the front surface of the high-temperature processor, the output end of the exhaust fan is arranged on one side surface of the blocking ventilation plates, a polymerization arm plate is fixedly connected to the outer surface of one side of the blocking ventilation plates, high-temperature heating columns are arranged on the inner side surface of the high-temperature processor and located in the middle of the inner side of the blocking ventilation plates, and air guide pipes fixedly connected to the top surface of the lap joint top cover plate are arranged on the outer surfaces of two sides of the high-temperature processor.
According to the technical scheme, the limiting sliding unit comprises a limiting sliding block fixedly connected to the outer side surface of the lap joint top cover plate, a limiting sliding rod is sleeved on the inner side surface of the limiting sliding block in a sliding mode, and a fixing plate arranged on the surface of one side of the supporting leg is fixedly connected to one end of the limiting sliding rod.
According to the technical scheme, the machining mechanical arm is fixedly arranged on the inner side surface of the closed sealing sleeve shell.
According to the technical scheme, the front face of the lap joint dragon door frame is provided with the shielding opening plate.
According to the technical scheme, the closed sealing unit comprises a pushing strip-shaped plate movably lapped on the outer side surface of the rotary lifter, one end of the pushing strip-shaped plate penetrates through the inner side surface of the strip-shaped groove, and the bottom end of the pushing strip-shaped plate is fixedly connected with a closed sealing door.
Compared with the prior art, the utility model has the following beneficial effects:
1. according to the utility model, the chip is lapped on the surface of the chip moving platen, the chip moving platen is slid by matching with the sliding groove on the top surface of the lap sliding machine tool, the sliding block is lowered by matching with the thread lifting mechanism on the inner side surface of the protective sleeve shell, the lap top cover plate on the bottom surface of the fixed slat is attached to the top surface of the chip moving platen, the production heat source is added by the high-temperature processor to infuse the chip into the lap top cover plate, dust is cleaned on the chip on the top surface of the chip moving platen, and meanwhile, the chip is vertically slid on the surface of the limit sliding rod by matching with the limit sliding block, and the position of the limit sliding block is limited by using the limit sliding rod.
2. According to the utility model, the air exhauster is matched to inject external air into the high-temperature processor, the polymerization arm plate on one side surface of the blocking ventilation plate is matched to polymerize the entered air source, the high-temperature heating column is used to heat the entered air source at high temperature, and the ventilation plate is matched to block the air source to inject the air source into the air guide pipe along with continuous entry of air.
3. According to the utility model, when the wind source of the wind guide pipe is infused into the lap joint top cover plate, the wind source is infused onto the surface of the chip by matching with the inclination angle of the inclined diversion blowing groove on the bottom surface of the lap joint top cover plate, the surface of the chip is heated at high temperature by using the wind source, dust on the surface of the chip is cleaned by using the fluidity of the wind source, the secondary auxiliary heating is carried out on the internal space by matching with the auxiliary blowing groove, the internal heat source is kept, the temperature is not reduced due to the flowing of air, and meanwhile, the dust driven by the flowing of air is absorbed and cleaned by matching with the dust absorbing groove.
4. According to the utility model, after dust and water vapor on the surface of a chip are cleaned, the chip is moved to the inside of the closed sealing sleeve shell by matching with the chip moving platen, the closed sealing door and one side surface of the pushing strip plate are moved downwards by matching with the rotating lifter on the inner side surface of the lap joint gantry frame, the closed sealing door is butted to the top surface of the lap joint sliding machine tool, the inlet of the closed sealing sleeve shell is sealed, and when the closed sealing door and the pushing strip plate are moved, one end of the pushing strip plate extends to the outside through the inner side surface of the strip groove.
Drawings
The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model. In the drawings:
FIG. 1 is a schematic view of the overall front cross-sectional structure of the present utility model;
FIG. 2 is a schematic perspective view of the clear water lifting mechanism of the present utility model;
FIG. 3 is a top perspective view of the bottom of the clear water lifting mechanism of the present utility model;
FIG. 4 is a partially cut-away perspective view of the high temperature processor of the present utility model;
FIG. 5 is a schematic perspective view of a lap top cover plate of the present utility model;
FIG. 6 is a partially cut-away perspective view of the closure seal mechanism of the present utility model;
FIG. 7 is a partially cut-away perspective view of the closure seal mechanism of the present utility model;
FIG. 8 is a schematic diagram of a chip handling assembly mechanism according to the present utility model;
in the figure: 1. chip processing injection device body; 11. supporting feet;
2. a clear water lifting mechanism; 21. a protective casing; 22. a thread lifting mechanism; 23. a slide block;
24. overlapping the top cover plate; 241. inclined diversion blowing groove; 242. an auxiliary blowing groove; 243. a dust absorption groove;
25. fixing the lath;
26. a height Wen Jiagong gauge; a1, an air exhauster; a2, blocking the ventilation plate; a3, polymerizing arm plates; a4, heating the column at a high temperature; a5, an air guide pipe;
27. a limit sliding block; 28. a limit slide bar;
3. closing the sealing mechanism; 31. overlapping the door frame; 32. a strip-shaped groove; 33. a shielding opening plate; 34. rotating the lifter; 35. pushing the strip-shaped plate; 36. closing the sealing door;
4. the chip processing and assembling mechanism; 41. overlap joint sliding machine tool; 42. closing the sealed casing; 43. a sliding groove; 44. a nitrogen injector; 45. an atomization spraying groove; 46. machining a mechanical arm;
5. the chip moves the platen.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-8, the present utility model provides the following technical solutions: the utility model provides an integrated circuit chip manufacturing ion implantation equipment based on new energy, including chip processing injection device body 1, chip processing injection device body 1 includes supporting legs 11, chip processing equipment mechanism 4 is detachably installed on the top surface of supporting legs 11, be provided with closed sealing mechanism 3 on the right side surface of chip processing equipment mechanism 4, be provided with on the top surface of supporting legs 11 and lift clear water mechanism 2's one side surface setting is on the top surface of chip processing equipment mechanism 4, slide lap joint has chip removal platen 5 on the top surface of chip processing equipment mechanism 4, lap joint chip on the surface of chip removal platen 5, lift clear water mechanism 2 includes the elevating unit, be provided with the overlap joint ash removal unit on one side surface of elevating unit, detachably install the wind source heating unit on the top surface of overlap joint ash removal unit, the left side surface of overlap joint ash removal unit is provided with spacing sliding unit, the elevating unit includes the protective housing 21 of fixed connection on the top surface of supporting legs 11, fixedly install screw thread elevating mechanism 22 on the inboard surface of protective housing 21, the output end surface upper movable sleeve 23 of screw thread elevating mechanism 22 has, the inside of protective housing 21 carries out the sliding block 23 on the surface of the cover plate 25 is connected to the surface of the inside of the top surface of the cover plate 25 on the top surface of the cover plate 25, the inside surface of the upper sleeve plate 25 is connected to the surface of the upper plate 25 in a sliding joint, the upper surface of the upper plate 25 is connected to the upper surface of the upper plate 25, simultaneously, the limiting slide block 27 is matched to slide up and down on the surface of the limiting slide bar 28, the position of the limiting slide block 27 is limited by the limiting slide bar 28, a fixed plate arranged on one side surface of the supporting leg 11 is fixedly connected to one end of the limiting slide bar 28, the chip moving platen 5 is matched to slide in a sliding groove 43 on the top surface of the lap joint sliding machine tool 41, and dust is cleaned from the chip on the top surface of the chip moving platen 5;
the air source heating unit comprises a high Wen Jiagong device 26 fixedly arranged on the top surface of a fixed slat 25, a production heat source is added through the high Wen Jiagong device 26 to infuse the high Wen Jiagong device into the lap joint top cover plate 24, a high-temperature heating column a4 is fixedly connected to the inner surfaces of the two sides of the high Wen Jiagong device 26, an air exhauster a1 is fixedly arranged on the front surface of the high Wen Jiagong device 26, the output end of the air exhauster a1 is arranged on one side surface of the air barrier top cover plate a2, the air from the outside is infused into the interior of the high Wen Jiagong device 26 by matching with the air exhauster a1, a polymerization arm plate a3 is fixedly connected to the outer surface of one side of the air barrier top cover plate a2, the polymerization arm plate a3 on one side surface of the matched with the air barrier top cover plate a2 polymerizes the entered air source, a high-temperature heating column a4 is arranged on the inner side middle position of the inner side surface of the high Wen Jiagong device 26, the entered air source is heated at high temperature by the high-temperature heating column a4, and the top surface of the two sides of the high Wen Jiagong device 26 is fixedly connected to the top surface of the air guide plate 24 a5 matched with the air inlet pipe 5;
the lap joint ash removal unit comprises a lap joint top cover plate 24 fixedly connected to the bottom surface of a fixed slat 25, when a wind source of a wind guide pipe a5 is infused into the lap joint top cover plate 24, an inclined diversion blowing groove 241 is formed in the middle position on the bottom surface of the lap joint top cover plate 24, the wind source is infused to the surface of a chip by matching with the inclined angle of the inclined diversion blowing groove 241 on the bottom surface of the lap joint top cover plate 24, the surface of the chip is heated at high temperature by utilizing the wind source, dust on the surface of the chip is cleaned by utilizing the fluidity of the wind source, auxiliary blowing grooves 242 are formed in the bottom surface of the lap joint top cover plate 24 and at the edge positions of two sides, secondary auxiliary heating is performed on the inner space by matching with the auxiliary blowing grooves 242, an inner heat source is kept, the temperature is not reduced due to the flowing of air, dust absorbing grooves 243 are fixedly arranged on the two outer surfaces of the lap joint top cover plate 24, and meanwhile dust brought by the flowing of the dust absorbing grooves 243 is absorbed and cleaned;
the closing sealing mechanism 3 comprises a transmission unit, wherein a closing sealing unit is arranged on the outer side surface of the transmission unit, the transmission unit comprises a lapping keel frame 31 fixedly connected to the outer side surface of a lapping sliding machine tool 41, a rotary lifter 34 is fixedly arranged on the inner side surface of the lapping keel frame 31, the rotary lifter 34 on the inner side surface of the lapping keel frame 31 is matched for rotation, a strip-shaped groove 32 is formed in the top surface of the lapping keel frame 31, a shielding opening plate 33 is arranged on the front surface of the lapping keel frame 31, the closing sealing unit comprises a pushing strip-shaped plate 35 movably lapped on the outer side surface of the rotary lifter 34, the closing sealing door 36 and the pushing strip-shaped plate 35 are moved, one end of the pushing strip-shaped plate 35 extends out through the inner side surface of the strip-shaped groove 32, one end of the pushing strip-shaped plate 35 passes through the inner side surface of the strip-shaped groove 32, a closing sealing door 36 is fixedly connected to the bottom end of the pushing strip-shaped plate 35, after dust and moisture on the surface of a chip are removed, the chip is matched for moving 5 to move the chip to the inside of the closing sealing plate 42, and the chip is sealed up to the inner side surface of the closing sealing plate 42, and the sealing plate is sealed up to the top surface of the sealing plate 42;
the chip processing and assembling mechanism 4 comprises a lap joint sliding machine tool 41 fixedly connected to the top surface of the supporting leg 11, a closed sealing sleeve shell 42 is fixedly connected to the top outer surface of the lap joint sliding machine tool 41, after the entrance of the closed sealing sleeve shell 42 is sealed, a sliding groove 43 is formed in the top outer surface of the lap joint sliding machine tool 41, a nitrogen gas injector 44 is fixedly mounted on the top outer surface of the closed sealing sleeve shell 42, nitrogen gas is injected into the interior of the closed sealing sleeve shell 42 in cooperation with the nitrogen gas injector 44, an atomization spraying groove 45 is formed in the inner side surface of the top of the closed sealing sleeve 42, the nitrogen gas is fully filled in the inner space of the closed sealing sleeve 42 in cooperation with the atomization spraying groove 45, a processing mechanical arm 46 is fixedly mounted on the inner side surface of the closed sealing sleeve 42, and the chip on the top surface of the chip moving platen 5 is processed in cooperation with the processing mechanical arm 46.
The working principle of the ion implantation device manufactured by the integrated circuit chip based on new energy is specifically described below.
As shown in fig. 1 to 8, the chip is lapped on the surface of the chip moving platen 5, the chip moving platen 5 is slid by the sliding groove 43 on the top surface of the lapping sliding machine 41, the slide 23 is lowered by the screw thread lifting mechanism 22 on the inner side surface of the protective cover shell 21, the lapping top cover plate 24 on the bottom surface of the fixed slat 25 is stuck on the top surface of the chip moving platen 5, the production heat source is added by the high Wen Jiagong device 26 to infuse into the interior of the lapping top cover plate 24, the chip on the top surface of the chip moving platen 5 is cleaned of dust, the limit slide 2723 is slid up and down on the surface of the limit slide 28, the position of the limit slide 2723 is limited by the limit slide 28, the external air is infused into the interior of the high Wen Jiagong device 26 by the air exhauster a1, the air source is polymerized by the polymerization arm plate a3 on one side surface of the blocking air permeable plate a2, then the entered air source is heated at high temperature by the high temperature heating column a4, the air source is infused into the air guide pipe a5 by the blocking air permeable plate a2 along with the continuous entering of air, when the air source of the air guide pipe a5 is infused into the lap joint top cover plate 24, the air source is infused onto the surface of the chip by the inclined angle of the inclined diversion blowing groove 241 on the bottom surface of the lap joint top cover plate 24, the surface of the chip is heated at high temperature by the air source, the dust on the surface of the chip is cleaned by the fluidity of the air source, the secondary auxiliary heating is carried out by the auxiliary blowing groove 242, the internal heat source is kept, the temperature is not reduced due to the flowing of the air, meanwhile, the dust driven by the flowing of the air is absorbed and cleaned by the dust absorbing groove 243, when dust and moisture on the surface of the chip are cleaned, the chip is moved to the inside of the closed sealing sleeve 42 by the chip moving platen 5, the rotary lifter 34 on the inner side surface of the lap joint gantry 31 is rotated, one side surface of the closed sealing door 36 and the pushing strip 35 is moved downward, the closed sealing door 36 is butted to the top surface of the lap joint sliding machine tool 41, the entrance of the closed sealing sleeve 42 is sealed, and when the closed sealing door 36 and the pushing strip 35 are moved, one end of the pushing strip 35 extends to the outside through the inner side surface of the strip groove 32.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present utility model, and the present utility model is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present utility model has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (8)
1. The utility model provides an integrated circuit chip manufacturing ion implantation equipment based on new forms of energy, includes chip processing injection device body (1), chip processing injection device body (1) include supporting legs (11), its characterized in that: the chip processing and assembling mechanism (4) is detachably arranged on the top outer surface of the supporting leg (11), the closed sealing mechanism (3) is arranged on the right outer surface of the chip processing and assembling mechanism (4), the clear water lifting mechanism (2) is arranged on the top outer surface of the supporting leg (11), one side of the clear water lifting mechanism (2) is arranged on the top surface of the chip processing and assembling mechanism (4), and the chip moving platen (5) is in sliding lap joint on the top outer surface of the chip processing and assembling mechanism (4);
the lifting clear water mechanism (2) comprises a lifting unit, wherein an overlap joint ash cleaning unit is arranged on the outer surface of one side of the lifting unit, a wind source heating unit is detachably arranged on the outer surface of the top of the overlap joint ash cleaning unit, and a limit sliding unit is arranged on the outer surface of the left side of the overlap joint ash cleaning unit;
the closing sealing mechanism (3) comprises a transmission unit, and a closing sealing unit is arranged on the outer side surface of the transmission unit;
the chip processing and assembling mechanism (4) comprises a lap joint sliding machine tool (41) fixedly connected to the top surface of the supporting leg (11), a closed sealing sleeve shell (42) is fixedly connected to the top outer surface of the lap joint sliding machine tool (41), a sliding groove (43) is formed in the top outer surface of the lap joint sliding machine tool (41), a nitrogen injector (44) is fixedly mounted on the top outer surface of the closed sealing sleeve shell (42), and an atomization spraying groove (45) is formed in the top inner side surface of the closed sealing sleeve shell (42);
the transmission unit comprises a lap joint gantry (31) fixedly connected to the outer side surface of the lap joint sliding machine tool (41), a rotary lifter (34) is fixedly installed on the inner side surface of the lap joint gantry (31), and a strip-shaped groove (32) is formed in the top surface of the lap joint gantry (31).
2. The ion implantation apparatus for manufacturing integrated circuit chips based on new energy as defined in claim 1, wherein: the lifting unit comprises a protective casing (21) fixedly connected to the outer surface of the top of the supporting leg (11), a threaded lifting mechanism (22) is fixedly installed on the inner side surface of the protective casing (21), a sliding block (23) is movably sleeved on the outer surface of the output end of the threaded lifting mechanism (22), and a fixing slat (25) is fixedly connected to the outer surface of one side of the sliding block (23).
3. The ion implantation apparatus for manufacturing integrated circuit chips based on new energy as defined in claim 2, wherein: the lap joint ash removal unit comprises a lap joint top cover plate (24) fixedly connected to the bottom surface of a fixed slat (25), an inclined diversion blowing groove (241) is formed in the bottom surface of the lap joint top cover plate (24) and located in the middle position, auxiliary blowing grooves (242) are formed in the bottom surface of the lap joint top cover plate (24) and located at the edge positions of two sides, and dust absorption grooves (243) are fixedly mounted on the outer surfaces of two sides of the lap joint top cover plate (24).
4. A new energy based integrated circuit chip fabrication ion implantation apparatus according to claim 3, wherein: the wind source heating unit comprises a high Wen Jiagong device (26) fixedly installed on the top surface of a fixed slat (25), a blocking ventilation plate (a 2) is fixedly connected to the inner surfaces of two sides of the high-temperature processor (26), an air exhauster (a 1) is fixedly installed on the front surface of the high-temperature processor (26), the output end of the air exhauster (a 1) is arranged on one side surface of the blocking ventilation plate (a 2), a polymerization arm plate (a 3) is fixedly connected to the outer surface of one side of the blocking ventilation plate (a 2), a high-temperature heating column (a 4) is arranged on the inner side surface of the high-temperature processor (26) and located at the middle position of the inner side of the blocking ventilation plate (a 2), and an air guide pipe (a 5) fixedly connected to the top surface of a lap joint top cover plate (24) is arranged on the outer surfaces of two sides of the high-temperature processor (26).
5. The ion implantation apparatus for manufacturing integrated circuit chips based on new energy as defined in claim 4, wherein: the limiting sliding unit comprises a limiting sliding block (27) fixedly connected to the outer side surface of the lap joint top cover plate (24), a limiting sliding rod (28) is sleeved on the inner side surface of the limiting sliding block (27) in a sliding mode, and a fixing plate arranged on one side surface of the supporting leg (11) is fixedly connected to one end of the limiting sliding rod (28).
6. The ion implantation apparatus for manufacturing integrated circuit chips based on new energy as defined in claim 1, wherein: a machining robot (46) is fixedly mounted on the inner side surface of the closed sealing sleeve (42).
7. The ion implantation apparatus for manufacturing integrated circuit chips based on new energy as defined in claim 6, wherein: a shielding opening plate (33) is arranged on the front surface of the lap joint door frame (31).
8. The ion implantation apparatus for manufacturing integrated circuit chips based on new energy as defined in claim 1, wherein: the closing sealing unit comprises a pushing strip-shaped plate (35) movably lapped on the outer side surface of the rotary lifter (34), one end of the pushing strip-shaped plate (35) penetrates through the inner side surface of the strip-shaped groove (32), and a closing sealing door (36) is fixedly connected to the bottom end of the pushing strip-shaped plate (35).
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| CN202310255846.9A CN116487290B (en) | 2023-03-16 | 2023-03-16 | New energy-based integrated circuit chip manufacturing ion implantation equipment |
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