CN116460928A

CN116460928A - Full-automatic splitting equipment for IR (infrared) filter

Info

Publication number: CN116460928A
Application number: CN202310224407.1A
Authority: CN
Inventors: 杨智
Original assignee: Guizhou Tongren Xujing Photoelectric Technology Co ltd
Current assignee: Guizhou Tongren Xujing Photoelectric Technology Co ltd
Priority date: 2023-03-09
Filing date: 2023-03-09
Publication date: 2023-07-21

Abstract

The invention belongs to the technical field of IR filter splitting, and particularly relates to full-automatic splitting equipment for an IR filter, which comprises a cabinet body, a material storing and taking device and a splitting device; the storing and taking device and the splitting device are both arranged on the cabinet body; the splitting device comprises a positioning component, a splitting direction control component, a splitting driving component and a scraping plate component, wherein the positioning component is arranged above at least part of the material storing and taking device, the splitting direction control component is arranged above the positioning component, a damping component is connected between the splitting driving component and the splitting direction control component and used for relieving the setback or vibration generated by the splitting direction control component, and an induction component is connected between the scraping plate component and the splitting driving component. The device can automatically complete wafer ring feeding and feeding, can also realize optical filter splitting in two directions, does not need manual participation in the whole process, greatly reduces labor cost, ensures quantification of splitting force, and improves the yield of optical filters.

Description

Full-automatic splitting equipment for IR (infrared) filter

Technical Field

The application relates to the technical field of IR filter production, in particular to full-automatic splitting equipment for an IR filter.

Background

In the photosensitive industry, the middle piece of the IR filter needs to be changed into the small piece of the IR filter through a series of processes, specifically, the middle piece of the 4 pieces of the IR filter is flatly covered on a wafer ring by a UV film, then the middle piece of the IR filter is cut transversely and vertically by a laser cutting machine, at the moment, the middle piece of the IR filter is not completely cracked, and then the middle piece of the IR filter is split into the small pieces through a splitting process.

In the related art, the splitting process adopts a manual splitting mode, the operation mode has low efficiency, splitting methods and force are different from person to person, the splitting cannot be quantized, operators are not separated, and the production cost is high.

It should be noted that the information disclosed in the above background section is only for enhancing understanding of the background of the present disclosure and thus may include information that does not form the prior art that is already known to those of ordinary skill in the art.

Disclosure of Invention

In view of at least one of the above technical problems, the present application provides an IR filter full-automatic splitting device, which solves the problems that in the related art, a manual splitting mode is adopted in the splitting process, the efficiency of the operation mode is low, the splitting method and the force are different from person to person, the splitting method and the force cannot be quantized, and the cost is high because the operation personnel are not separated.

The embodiment of the application provides full-automatic splitting equipment for an IR filter, which comprises a cabinet body, a material storing and taking device and a splitting device;

the material storing and taking device and the splitting device are both arranged on the cabinet body, and the material storing and taking device is used for conveying the wafer ring covered with the IR filter to the lower part of the splitting device or recovering the wafer ring covered with the IR filter passing through the splitting from the lower part of the splitting device;

the splitting device comprises a positioning component, a splitting direction control component, a splitting driving component and a scraping plate component, wherein the positioning component is arranged above at least part of the material storing and taking device, the splitting direction control component is arranged above the positioning component, a damping component is connected between the splitting driving component and the splitting direction control component and used for relieving the setback or vibration generated by the splitting direction control component, and an induction component is connected between the scraping plate component and the splitting driving component.

The application has the following technical effects: the device can automatically complete wafer ring feeding and feeding, can also realize optical filter splitting in two directions, does not need manual participation in the whole process, greatly reduces labor cost, ensures quantification of splitting force, and improves the yield of optical filters.

In one implementation, the material storing and taking device comprises a material storing component and a material taking and placing component, wherein the material storing component and the material taking and placing component are all installed on the cabinet body, the material taking and placing component is located on one side of the material storing component, the material taking and placing component is located below the positioning component, and the material taking and placing component is used for conveying the wafer ring coated with the IR filter from the material storing component to the positioning component or conveying the wafer ring coated with the IR filter after splitting from the positioning component to the material storing component.

In one implementation mode, the taking and placing assembly comprises a first moving module, a connecting sheet and a clamping ring air claw, wherein the first moving module is arranged below the positioning assembly along a first direction, the clamping ring air claw is connected with the first moving module through the connecting sheet, a first clamping block and a second clamping block are respectively connected to two moving ends of the clamping ring air claw, a first clamping surface is arranged on the first clamping block, a second clamping surface is arranged on the second clamping block, the first clamping surface and the second clamping surface are oppositely arranged, and the first clamping surface and the second clamping surface are respectively parallel to the edge of the wafer ring.

In one implementation, the first moving module is provided with a first sliding table, the connecting sheet is provided with an extension part extending to the storage component, and the clamping ring gas claw is connected with the extension part and used for biasing the clamping ring gas claw above the first sliding table.

In one implementation, the positioning assembly comprises a supporting base, a butt piece, a solid ring cylinder and a fixing frame, wherein the supporting base is arranged on the cabinet body, the butt piece is arranged on the supporting base and comprises a first main body and a butt part, the first main body is arranged on the supporting base, the upper surface of the first main body is flush with the upper edge of the supporting base, the butt part is arranged at the edge of the first main body and protrudes out of the first main body, the number of the solid ring cylinders is two and two sides of at least part of the storage and taking device are oppositely arranged, the number of the fixing frames is two and is in sliding connection with the supporting base, and the solid ring cylinder is in transmission connection with the fixing frame.

In one implementation, the damping assembly comprises a first rotary table and a second rotary table, the first rotary table is fixed on the body of the lobe direction control assembly, the second rotary table is connected with the output end of the lobe direction control assembly, the second rotary table is connected with the lobe driving assembly, and the first rotary table is connected with the second rotary table through a buffer mechanism.

In one implementation mode, a plurality of first assembly holes are distributed on the first turntable at intervals, and a plurality of second assembly holes are distributed on the second turntable at intervals;

the buffer mechanism comprises a first fixing piece, a second fixing piece and a tension spring, wherein the first fixing piece is arranged in the first assembly hole, the second fixing piece is arranged in the second assembly hole, one end of the tension spring is connected with the first fixing piece, and the other end of the tension spring is connected with the second fixing piece.

In one implementation, the scraper assembly comprises a fixed block, a fixed shaft, a rotary clamping plate and a splinter scraper, wherein the fixed block is connected with the sensing assembly, the fixed shaft is connected with the fixed block, the rotary clamping plate is sleeved on the fixed shaft, the rotary clamping plate can rotate around the axis of the fixed shaft, and the splinter scraper is installed on the rotary clamping plate.

In one implementation, the blade end of the lobe blade is V-shaped in cross section.

In one implementation, the sensing component is a pressure sensor.

The invention will be further described with reference to the drawings and examples.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following description will briefly explain the embodiments or the drawings needed in the prior art, and it is obvious that the drawings in the following description are only some embodiments of the present invention and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a block diagram of an IR filter full-automatic splinter device according to an embodiment of the application;

FIG. 2 is an exploded block diagram of a storage assembly according to an embodiment of the present application;

FIG. 3 is an exploded view of a pick-and-place assembly according to an embodiment of the present application;

FIG. 4 is a block diagram of a positioning assembly of an embodiment of the present application;

FIG. 5 is an enlarged block diagram of FIG. 4 at A;

FIG. 6 is a block diagram of a mount according to an embodiment of the present application;

FIG. 7 is a block diagram of a damping assembly according to an embodiment of the present application;

FIG. 8 is an exploded block diagram of a squeegee assembly of an embodiment of the application;

Detailed Description

In order to make the above objects, features and advantages of the present application more comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is, however, susceptible of embodiment in many other forms than those described herein and similar modifications can be made by those skilled in the art without departing from the spirit of the application, and therefore the application is not to be limited to the specific embodiments disclosed below.

In the description of the present application, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, merely to facilitate description of the present application and simplify the description, and do not indicate or imply that the devices or elements being referred to must have a specific orientation, be configured and operated in a specific orientation, and are not to be construed as limiting the present application.

In the description of the present application, it should be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or an implicit indication of the number of technical features being indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" is at least two, such as two, three, etc., unless explicitly defined otherwise.

In the embodiments of the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the embodiments of the present application will be understood by those of ordinary skill in the art according to the specific circumstances.

In the embodiment of the present application, the X-axis direction of the spatial coordinate axis represents the first direction (i.e., the left and right directions), the Y-axis direction of the spatial coordinate axis represents the second direction (i.e., the front and rear directions), and the Z-axis direction of the spatial coordinate axis represents the third direction (i.e., the up and down directions).

In the related art, the splitting process adopts a manual splitting mode, the operation mode has low efficiency, splitting methods and force are different from person to person, the splitting cannot be quantized, operators are not separated, and the generation cost is high. The device can automatically complete wafer ring feeding and feeding, can also realize optical filter splitting in two directions, does not need manual participation in the whole process, greatly reduces labor cost, ensures quantification of splitting force, and improves the yield of optical filters.

Referring to fig. 1, fig. 2, fig. 3, fig. 4, fig. 5, fig. 6, fig. 7, and fig. 8, fig. 1 is a block diagram of an IR filter full-automatic splitting apparatus according to an embodiment of the present application; FIG. 2 is an exploded block diagram of a storage assembly according to an embodiment of the present application; FIG. 3 is an exploded view of a pick-and-place assembly according to an embodiment of the present application; FIG. 4 is a block diagram of a positioning assembly of an embodiment of the present application; FIG. 5 is an enlarged block diagram of FIG. 4 at A; FIG. 6 is a block diagram of a mount according to an embodiment of the present application; FIG. 7 is a block diagram of a damping assembly according to an embodiment of the present application; FIG. 8 is an exploded block diagram of a squeegee assembly of an embodiment of the application; the embodiment of the application provides full-automatic splitting equipment for an IR filter, which comprises a cabinet body 100, a material storing and taking device 200 and a splitting device 300;

the following describes the specific structure and working principle of the full-automatic splitting device for the IR filter provided by the embodiment of the present application in detail.

As shown in fig. 1, the material storing and taking device 200 and the wafer breaking device 300 are both installed on the cabinet body 100, and the material storing and taking device 200 is used for sending the wafer ring covered with the IR filter to the lower part of the wafer breaking device 300 or recovering the wafer ring covered with the IR filter after being broken from the lower part of the wafer breaking device 300;

the lobe apparatus 300 includes a positioning component 310, a lobe direction control component 320, a lobe driving component 330 and a scraper component 340, the positioning component 310 is installed above at least a portion of the material storing and taking apparatus 200, the lobe direction control component 320 is installed above the positioning component 310, a damping component 350 is connected between the lobe driving component 330 and the lobe direction control component 320, the damping component 350 is used for relieving the bump or vibration generated by the lobe direction control component 320, and an induction component 360 is connected between the scraper component 340 and the lobe driving component 330.

For example, in operation of the apparatus of the embodiments of the present application, the wafer ring is first coated with a UV film and then the IR filter is coated over the IR filter. A plurality of wafers coated with IR filters are stacked in the material storing and taking device 200, and the material storing and taking device 200 takes one wafer ring at a time and sends the wafer ring to the splitting device 300 for splitting operation. After the completion of the dicing, the wafer ring coated with the IR filter after the dicing is recovered from the dicing apparatus 300.

The material storing and taking device 200 takes one wafer ring at a time and sends the wafer ring to the splitting device 300 for splitting operation, wherein the material storing and taking device 200 sends one wafer ring to the positioning component 310, the positioning component 310 positions and fixes the wafer ring, and then the splitting direction control component 320 controls the directions of the splitting driving component 330 and the scraping component 340, so that the scraping component 340 splits the IR filter in the first direction and the second direction.

In other examples, the lobe direction control assembly 320 may include a third moving module 321, a connecting frame 322 and a rotary air cylinder 323, where the third moving module 321 is installed right above the positioning assembly 310 and extends along the third direction, the connecting frame 322 is L-shaped, the connecting frame 322 is connected with the third moving module 321, the rotary air cylinder 323 is connected with the connecting frame 322, the damping assembly 350 is connected with an output end of the rotary air cylinder 323, and a rotation surface of the output end of the rotary air cylinder 323 is parallel to the plane of the cabinet 100.

The third moving module 321 is a common linear driving mechanism, which may be a linear motor or a screw driving mechanism. In the embodiment of the present application, the third moving module 321 is a linear motor.

For example, the third moving module 321 is configured to drive the connecting frame 322 and the rotary cylinder 323 to reciprocate along a third direction, and further drive the damping assembly 350, the splitting assembly and the scraper assembly 340 to reciprocate along the third direction, so that the scraper assembly 340 is close to or far from the wafer ring on the positioning assembly 310. When the squeegee assembly 340 approaches and contacts the wafer ring, the squeegee assembly 340 performs a breaking operation on the wafer ring. When the scraper assembly 340 is far away from the wafer ring, the wafer ring is conveniently taken out or stored by the material storing device 200.

For another example, the rotary air cylinder 323 is used to drive the damping assembly 350, the splitting driving assembly 330 and the scraper assembly 340 to rotate 90 °, wherein the rotary air cylinder 323 can change the arrangement of the scraper assembly 340 along the first direction to the arrangement along the second direction, and can also change the arrangement of the scraper assembly 340 along the second direction to the arrangement along the first direction, so that the optical filter is split from two directions, and the optical filter is split into four small pieces.

In other examples, the split driving assembly 330 may include a fourth moving module 331, the fourth moving module 331 is mounted on the damping assembly 350, and a moving direction of a moving end of the fourth moving module 331 is parallel to the surface of the cabinet 100, and the scraper assembly 340 is in driving connection with the fourth moving module 331.

The fourth moving module 331 is a common linear driving mechanism, which may be a linear motor or a screw driving mechanism. In the embodiment of the present application, the fourth moving module 331 is a linear motor.

For example, the fourth moving module 331 can drive the scraper assembly 340 to reciprocate along the first direction or the second direction, so as to split the optical filter and improve the splitting efficiency.

In some examples, the material storing and taking device 200 includes a material storing component 210 and a material taking and placing component 220, where the material storing component 210 and the material taking and placing component 220 are both installed on the cabinet 100, the material taking and placing component 220 is located at one side of the material storing component 210, and the material taking and placing component 220 is located below the positioning component 310, and the material taking and placing component 220 is used for sending the wafer ring covered with the IR filter from the material storing component 210 to the positioning component 310, or sending the wafer ring covered with the IR filter after being cracked from the positioning component 310 to the material storing component 210.

As shown in fig. 1 and 2, the storage assembly 210 may include a second moving module 211, a connecting plate 212 and a storage bin 213, wherein the second moving module 211 is installed on the cabinet 100 along a third direction, the connecting plate 212 is in transmission connection with the second moving module 211, the storage bin 213 is connected with the connecting plate 212, a plurality of storage layers 2131 are arranged in the storage bin 213, and a wafer ring is placed in the storage layers 2131. In this way, the second moving module 211 controls the storage bin 213 to reciprocate up and down, so that the wafer rings in the storage bin 213 are aligned with the picking and placing component 220, the picking and placing component 220 is convenient to pick the wafer rings, or the empty storage material layer 2131 in the storage bin 213 is aligned with the picking and placing component 220, and the picking and placing component 220 is convenient to put the wafer rings with the IR filters, which are subjected to splitting, into the storage material layer 2131 again.

Specifically, the second moving module 211 is a common linear driving mechanism, which may be a linear motor or a screw driving mechanism. In the embodiment of the present application, the second moving module 211 is a screw driving mechanism.

As shown in fig. 1 and 3, the pick-and-place assembly 220 may include a first moving module 221, a connecting piece 222 and a clamping ring air claw 223, wherein the first moving module 221 is installed below the positioning assembly 310 along a first direction, the clamping ring air claw 223 is connected with the first moving module 221 through the connecting piece 222, two moving ends of the clamping ring air claw 223 are respectively connected with a first clamping block 2231 and a second clamping block 2232, the first clamping block 2231 is provided with a first clamping surface 22311, the second clamping block 2232 is provided with a second clamping surface 22321, the first clamping surface 22311 and the second clamping surface 22321 are opposite, and the first clamping surface 22311 and the second clamping surface 22321 are respectively parallel to the edges of the wafer.

The first moving module 221 is a common linear driving mechanism, which may be a linear motor or a screw driving mechanism. In this embodiment, the first moving module 221 is a linear motor, where the first moving module 221 has a first sliding table.

The connecting piece 222 is in a sheet structure, the connecting piece 222 is provided with an extension part 2221 extending towards the storage component 210, and the clamping ring air claw 223 is connected with the extension part 2221 and used for enabling the clamping ring air claw 223 to be biased above the first sliding table. In this way, the extension part 2221 extends on the connecting piece 222, so that the clamping ring gas claw 223 is biased above the first sliding table, on one hand, interference of the first sliding table to the clamping ring gas claw 223 is avoided, the clamping ring gas claw 223 is influenced to clamp a wafer ring, and on the other hand, the clamping ring gas claw 223 is convenient to take out the wafer ring from the storage bin 213.

For example, when the first sliding table drives the clamping ring air claw 223 to slide to one end close to the storage bin 213, the clamping ring air claw 223 can extend out of the first moving module 221, so that the wafer ring in the discharge bin is taken out, the wafer ring is conveniently taken out, and the wafer ring is more efficiently taken out.

The two moving ends of the clamping ring air claw 223 respectively reciprocate along the third direction, so as to drive the first clamping block 2231 and the second clamping block 2232 to reciprocate along the third direction, wherein the moving directions of the first clamping block 2231 and the second clamping block 2232 are opposite. The first clamping surface 22311 on the first clamping block 2231 is matched with the second clamping surface 22321 on the second clamping block 2232, so that the edge of the wafer ring is clamped, and the wafer ring is stably and reliably taken and placed.

In some examples, the positioning assembly 310 includes a support base 311, an abutting piece 312, a ring fixing air cylinder 313 and a fixing frame 314, the support base 311 is mounted on the cabinet body 100, the abutting piece 312 is mounted on the support base 311, the abutting piece 312 includes a first main body 3121 and an abutting portion 3122, the first main body 3121 is mounted on the support base 311, the upper surface of the first main body 3121 is flush with the upper edge of the support base 311, the abutting portion 3122 is disposed at the edge of the first main body 3121 and protrudes out of the first main body 3121, the number of the ring fixing air cylinders 313 is two and is disposed at two opposite sides of at least part of the material storing and taking device 200, the number of the fixing frames 314 is two and is slidingly connected on the support base 311, and the ring fixing air cylinder 313 is in driving connection with the fixing frame 314.

As shown in fig. 1 and 4, the support base 311 is vertically installed on the cabinet 100, the support base 311 is composed of four support blocks, two support blocks arranged in parallel along the first direction are a support portion, and the picking and placing assembly 220 is arranged between the two support portions along the first direction. The supporting parts are used for supporting the wafer ring, and the wafer ring can be moved from the storage bin 213 to the two supporting parts under the cooperation of the two supporting parts and the pick-and-place assembly 220.

The abutting piece 312 is used for abutting with the wafer ring, limiting the wafer ring by arranging the abutting piece 312, so that the wafer ring is stopped at a preset position, the IR filter is opposite to the splitting device 300, the splitting accuracy is improved, and the quality of the filter is ensured. For example, the pick-and-place assembly 220 clamps the wafer ring and moves along the first direction, and finally, the edge of the wafer ring is supported on the first body 3121 and is abutted with the abutment portion 3122, at this time, the pick-and-place assembly 220 stops, so that the wafer ring continues to move along the first direction, and the edge of the wafer ring is abutted with the abutment portion 3122, so that the wafer ring moves in place.

The ring fixing cylinder 313 is matched with the fixing frame 314 to fix the front side end and the rear side end of the wafer ring.

Further, a flange portion 3141 is provided at an edge of the fixing frame 314, a positioning groove 3142 is formed between the flange portion 3141 and an upper surface of the fixing frame 314, and one side end of the wafer ring is positioned and fixed by the positioning groove 3142. For example, taking a ring fixing cylinder 313 and a fixing frame 314 on one side as an example, the ring fixing cylinder 313 drives the fixing member to move towards the wafer ring, and the edge of the wafer ring enters the positioning groove 3142 and is abutted with the flanging part 3141, so that positioning and fixing are realized.

In some examples, the damping assembly 350 includes a first rotary disc 351 and a second rotary disc 352, the first rotary disc 351 is fixed on the body of the lobe direction control assembly, the second rotary disc 352 is connected with the output end of the lobe direction control assembly, the second rotary disc 352 is connected with the lobe driving assembly 330, and the first rotary disc 351 and the second rotary disc 352 are connected through a buffer mechanism 353.

As shown in fig. 7, the diameter of the first rotary table 351 is smaller than the diameter of the second rotary table 352, the mass of the first rotary table 351 is smaller than the mass of the second rotary table 352, and the first rotary table 351 is parallel to the second rotary table 352, the first rotary table 351 being movable relative to the second rotary table 352. Further, the first rotary plate 351 is fixed to the body of the rotary cylinder 323, and the second rotary plate 352 is connected to the output end of the rotary cylinder 323.

For example, when the output end of the rotary cylinder 323 rotates 90 ° clockwise or 90 ° counterclockwise, the second turntable 352 rotates with respect to the first turntable 351, and when the output end of the rotary cylinder 323 rotates 45 ° clockwise or 45 ° counterclockwise, the buffer mechanism 353 is stretched and a certain tensile force is generated. When the output end of the revolving cylinder 323 rotates in place, that is, the second turntable 352 stops, under the action of the tensile force, the setback or vibration generated by the second turntable 352 due to the stopping of the output end of the revolving cylinder 323 is effectively relieved, so that the lobe driving assembly 330 and the scraper assembly 340 are protected, the damage of the components due to the setback and vibration is avoided, and the precision of the scraper assembly 340 can be ensured.

In other examples, a plurality of light-weight grooves are spaced on the second turntable 352 to reduce the mass of the second turntable 352 and make the revolving cylinder 323 rotate more labor-saving.

In some examples, a plurality of first assembly holes are spaced apart on the first turntable 351, and a plurality of second assembly holes are spaced apart on the second turntable 352;

the buffer mechanism 353 comprises a first fixing member 3531, a second fixing member 3532 and a tension spring 3533, wherein the first fixing member 3531 is installed in the first assembly hole, the second fixing member 3532 is installed in the second assembly hole, one end of the tension spring 3533 is connected with the first fixing member 3531, and the other end of the tension spring 3533 is connected with the second fixing member 3532.

As shown in fig. 7, the first fixing member 3531 and the second fixing member 3532 have the same structure and are both pins. For example, the first and second fixing members 3531 and 3532 pass through the tension spring 3533 and are respectively fitted in the first and second fitting holes, thus fixing the tension spring 3533.

The number of the first fixing members 3531, the second fixing members 3532, and the tension springs 3533 is the same, and the number of each is eight. The tension springs 3533 are spaced between the first rotating disc 351 and the second rotating disc 352 along the radial direction of the second rotating disc 352, and when the output end of the rotary cylinder 323 rotates 45 degrees clockwise or 45 degrees counterclockwise, the second rotating disc 352 also rotates therewith, and each tension spring 3533 correspondingly deforms elastically to different degrees, so that tensile force is generated.

In other examples, two sets of second mounting holes 3522 for mating mounting with the lobe drive assembly 330 are provided on the second rotary plate 352 at intervals along the second direction, and two sets of first mounting holes 3511 for mating mounting with the cylinder of the rotary cylinder 323 are provided on the first rotary plate 351 at intervals along the first direction. In the initial state, the extending directions of the two sets of second mounting holes 3522 and the extending directions of the two sets of first mounting holes 3511 are perpendicular to each other, so that the buffer mechanism 353 can rapidly respond when the second turntable 352 rotates 45 ° clockwise or 45 ° counterclockwise.

In some examples, the scraper assembly 340 includes a fixed block 341, a fixed shaft 342, a rotating clamping plate 343, and a breaking scraper 344, the fixed block 341 is connected with the sensing assembly 360, the fixed shaft 342 is connected with the fixed block 341, the rotating clamping plate 343 is sleeved on the fixed shaft 342, the rotating clamping plate 343 can rotate around the axis of the fixed shaft 342, and the breaking scraper 344 is mounted on the rotating clamping plate 343.

As shown in fig. 1 and 8, the rotating clamping plate 343 has a first cavity 3431 and a second cavity 3432, the first cavity 3431 and the second cavity 3432 extend along a first direction, and an arc-shaped limiting groove 3433 communicated with the first cavity 3431 is further formed at the top of the rotating clamping plate 343.

The fixed shaft 342 is provided with a mounting groove 3421 which is matched with the fixing hole, the fixed shaft 342 is inserted into the first cavity 3431, the mounting groove 3421 on the fixed shaft 342 just corresponds to the arc-shaped limiting groove 3433, and the fixed block 341 passes through the arc-shaped limiting groove 3433 and is assembled in the mounting groove 3421, so that the fixed block 341 is fixed with the fixed shaft 342. Thus, the rotating clamp plate 343 can rotate relative to the fixed block 341 and the fixed shaft 342, so as to adjust the angle of the split blade 344 relative to the optical filter. The optical filters with different thicknesses can be split by adopting different angles, so that the adjustment is convenient.

In addition, the fixed block 341 is limited by the arc-shaped limiting groove 3433, so that the fixed block 341 can only move along the arc-shaped limiting groove 3433, and the rotation range of the fixed block 341 and the fixed shaft 342 is further limited.

The splinter blade 344 is mounted in the second cavity 3432 such that the splinter blade 344 is fixedly coupled to the rotating clamp 343.

In other examples, the opposite ends of the wafer paddle 344 have rounded structures 3441 to prevent cutting the UV film on the wafer ring during wafer breaking.

In other examples, the side wall of the rotating clamping plate 343 has a rotation angle scale corresponding to the first cavity 3431, and the angle of the rotating clamping plate 343 can be adjusted visually by matching with the pointer on the fixed shaft 342, which is convenient and reliable.

In some examples, the blade end of the lobe blade 344 is V-shaped in cross-section. By the arrangement, the drag of the scraping plate can be reduced, the splitting effect of the optical filter can be improved, and the small optical filter piece with small area can be ensured to be split.

In some examples, sensing component 360 is a pressure sensor.

Because the optical filter is coated on the wafer ring by the UV film, the force of the optical filter, which is close to the outer film of the wafer ring, is larger under the same downward pressure, if the optical filter is cracked, the force acting on the optical filter under the same height can be changed greatly, the quality of the cracked piece can be influenced, the force during the cracked piece is monitored in real time by the pressure sensor, and the cracked piece state is controlled according to the measured value.

The specific working process of the equipment is as follows:

1. the wafer ring covered with the middle piece of the IR filter is placed in the storage bin 213, and then the storage bin 213 is placed on the connecting plate 212, and the first wafer ring of the storage bin 213 is aligned to the fixing frame 314 under the driving of the second moving module 211.

2. The first moving module 221 drives the ring clamping air claw 223 to approach the wafer ring, takes out the wafer ring from the storage bin 213, then moves to the supporting base 311 and the fixing frame 314, and the ring fixing cylinder 313 is started to drive the fixing frame 314 to fix the wafer ring.

3. The third moving module 321 drives the scraper assembly 340 to act on the middle piece of the IR filter of the wafer ring, then the fourth moving module 331 drives the scraper assembly 340 to split, the middle piece of the IR filter is split in the first direction, and after the completion, the rotary cylinder 323 rotates by 90 degrees, and the middle piece of the IR filter is split in the second direction.

4. After the wafer is cracked, the ring fixing air cylinder 313 is loosened, the first moving module 221 drives the ring clamping air claw 223, and the wafer ring is placed back into the storage bin 213, so that one layer of wafer ring cracking processing is completed, and the wafer ring cracking processing of the whole storage bin 213 is completed in the same way.

The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above is merely a preferred embodiment of the present application, and is not intended to limit the present application in any way. Any person skilled in the art may make many possible variations and modifications to the technical solution of the present application, or modify equivalent embodiments, using the methods and technical contents disclosed above, without departing from the scope of the technical solution of the present application. Therefore, all equivalent changes according to the shape, structure and principle of the present application are covered in the protection scope of the present application.

Claims

1. The full-automatic splitting equipment for the IR filter is characterized by comprising a cabinet body, a material storing and taking device and a splitting device;

the material storing and taking device and the splitting device are both arranged on the cabinet body, and the material storing and taking device is used for conveying the wafer ring covered with the IR filter to the lower part of the splitting device or recovering the wafer ring covered with the IR filter after splitting from the lower part of the splitting device;

the splitting device comprises a positioning component, a splitting direction control component, a splitting driving component and a scraping plate component, wherein the positioning component is installed above at least part of the material storing and taking device, the splitting direction control component is installed above the positioning component, a damping component is connected between the splitting driving component and the splitting direction control component, the damping component is used for relieving the setback or vibration generated by the splitting direction control component, and an induction component is connected between the scraping plate component and the splitting driving component.

2. The full-automatic IR filter splitting device according to claim 1, wherein the material storing and taking device comprises a material storing component and a picking and placing component, the material storing component and the picking and placing component are both installed on the cabinet body, the picking and placing component is located at one side of the material storing component and located below the positioning component, and the picking and placing component is used for conveying the wafer ring covered with the IR filter from the material storing component to the positioning component or conveying the wafer ring covered with the IR filter after splitting from the positioning component to the material storing component.

3. The full-automatic splitting device of the IR filter according to claim 2, wherein the picking and placing component comprises a first moving module, a connecting sheet and a clamping ring air claw, the first moving module is arranged below the positioning component along a first direction, the clamping ring air claw is connected with the first moving module through the connecting sheet, a first clamping block and a second clamping block are respectively connected to two moving ends of the clamping ring air claw, a first clamping surface is arranged on the first clamping block, a second clamping surface is arranged on the second clamping block, the first clamping surface and the second clamping surface are arranged opposite to each other, and the first clamping surface and the second clamping surface are respectively parallel to the edge of the wafer ring.

4. The full-automatic IR filter splitting device according to claim 3, wherein the first moving module is provided with a first sliding table, the connecting sheet is provided with an extension part extending towards the storage component, and the clamping ring gas claw is connected with the extension part and used for enabling the clamping ring gas claw to be biased above the first sliding table.

5. The full-automatic lobe of a leaf equipment of IR light filter according to claim 1, wherein, the locating component includes supporting base, butt spare, solid ring cylinder and mount, the supporting base install in on the cabinet body, the butt spare install in on the supporting base, the butt spare includes first main part and butt portion, first main part install in on the supporting base, the upper surface of this first main part with the upper edge parallel and level of supporting base, the butt portion set up in the edge of first main part and outstanding first main part, the quantity of solid ring cylinder has two and locates relatively the both sides of at least part of material storing and taking device, the quantity of mount has two and sliding connection in on the supporting base, solid ring cylinder with the mount transmission is connected.

6. The full-automatic lobe of a leaf equipment of IR light filter according to claim 1, wherein the damping subassembly includes first carousel and second carousel, first carousel is fixed on the body of lobe of a leaf direction control subassembly, the second carousel is connected with the output of lobe of a leaf direction control subassembly, the second carousel with lobe of a leaf drive subassembly is connected, pass through buffer gear between first carousel and the second carousel.

7. The full-automatic lobe of a leaf equipment of IR light filter of claim 6, wherein there are a plurality of first pilot holes on the first rotary disc of interval distribution, there are a plurality of second pilot holes on the second rotary disc of interval distribution;

the buffer mechanism comprises a first fixing piece, a second fixing piece and a tension spring, wherein the first fixing piece is installed in the first assembly hole, the second fixing piece is installed in the second assembly hole, one end of the tension spring is connected with the first fixing piece, and the other end of the tension spring is connected with the second fixing piece.

8. The full-automatic lobe of a leaf equipment of IR light filter according to claim 1, wherein, the scraper blade subassembly includes fixed block, fixed axle, rotatory splint and lobe of a leaf scraper blade, the fixed block with the response subassembly is connected, the fixed axle with the fixed block is connected, rotatory splint cover is located on the fixed axle, and this rotatory splint can rotate around the axis of fixed axle, the lobe of a leaf scraper blade is installed on the rotatory splint.

9. The fully automatic cleaving apparatus of claim 8, wherein the cross section of the blade end of the cleaving blade is V-shaped.

10. The fully automatic IR filter splitting device of claim 1 or 8, wherein the sensing component is a pressure sensor.