CN116454193A - LED packaging structure and packaging method thereof - Google Patents
LED packaging structure and packaging method thereof Download PDFInfo
- Publication number
- CN116454193A CN116454193A CN202310705772.4A CN202310705772A CN116454193A CN 116454193 A CN116454193 A CN 116454193A CN 202310705772 A CN202310705772 A CN 202310705772A CN 116454193 A CN116454193 A CN 116454193A
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- substrate
- layer
- resin
- led
- resin film
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 43
- 238000000034 method Methods 0.000 title claims abstract description 16
- 239000010410 layer Substances 0.000 claims abstract description 87
- 239000011347 resin Substances 0.000 claims abstract description 85
- 229920005989 resin Polymers 0.000 claims abstract description 85
- 239000000758 substrate Substances 0.000 claims abstract description 65
- 239000011241 protective layer Substances 0.000 claims abstract description 15
- 238000005507 spraying Methods 0.000 claims description 8
- 238000002955 isolation Methods 0.000 claims description 6
- 239000012530 fluid Substances 0.000 claims description 4
- 238000000926 separation method Methods 0.000 claims description 4
- 238000005086 pumping Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses an LED packaging structure and a packaging method thereof, and relates to the field of LED packaging. According to the LED panel, the groove structure is arranged on the substrate, the resin film is covered on the substrate and the lamp strip, the resin film is protruded towards the groove direction by utilizing the air pressure difference method, then resin is injected on the resin film and covers the protective layer, light emitted by the LED chip irradiates on the reflecting layer, is condensed by the concave lens-shaped resin layer after being reflected by the reflecting layer, finally is emitted outwards through the protective layer, and the effective luminous brightness of the LED panel is greatly improved.
Description
Technical Field
The invention relates to the field of LED packaging, in particular to an LED packaging structure and a packaging method thereof.
Background
The light emitting diode is simply called an LED, is a commonly used light emitting device, emits light by energy released by recombination of electrons and holes, is widely applied in the field of illumination, and LED packaging is a step necessary for using an LED chip.
The existing LED packaging structure often comprises a substrate, a dam, an LED chip and fluorescent resin, wherein the substrate is a circuit board, the LED chip is welded on the substrate, then the dam is formed on the substrate in an injection molding mode, and then the LED chip is sealed by the fluorescent resin.
However, the existing LED packaging structure emits light through point light sources of a plurality of LED chips in the dam, and the light scattering degree of the LED chips is not uniform enough; the light emitted by the LED chip is easy to be blocked by the dam, and the brightness of the packaged LED panel is low; the fluorescent resin used for sealing is easy to generate uneven holes after being injected into the dam, and the holes are easy to influence the luminous effect of the LED chip; the LED chip is welded on the substrate, and heat generated by the working of the LED chip can be effectively dissipated after penetrating through the thicker fluorescent resin layer, so that the heat dissipation efficiency of the packaging structure is also required to be improved.
In summary, the effective light-emitting brightness of the existing LED package structure needs to be improved.
Disclosure of Invention
Based on the above, the invention aims to provide an LED packaging structure and a packaging method thereof, so as to solve the technical problem of insufficient effective light-emitting brightness of the existing LED packaging structure.
In order to achieve the above purpose, the present invention provides the following technical solutions: LED packaging structure, including base plate and lamp area, the lamp area is for separating the bar circuit board that the welding has the LED chip, the interval is provided with the recess on the base plate, the recess is horizontal closely arranged, and vertical equidistance interval arrangement, the base plate is provided with the lamp area in the longitudinal direction in the recess middle part, the LED chip on the lamp area is towards the bottom surface of recess, the spraying has the reflector layer in the recess, the top surface of lamp area flushes with the top surface of base plate, the top surface of base plate is provided with the resin film layer, the resin film layer is sunken to recess bottom surface direction in recess department, be provided with the resin layer on the resin film layer, the laminating resin film in the bottom surface of resin layer, and the top surface is the plane, the top surface of resin layer is provided with the protective layer.
Through adopting above-mentioned technical scheme, through setting up groove structure on the base plate, arrange the lamp area that is provided with the LED chip on groove structure, make LED chip orientation groove structure's bottom surface, spray coating reflector layer in groove structure, cover the resin film in the top of base plate and lamp area simultaneously, make the resin film protruding to the groove direction by the method of atmospheric pressure difference, then pour into resin and cover the protective layer in the resin film top, the light that the LED chip sent shines on the reflector layer, through concave lens shape's resin layer spotlight after the reflection of reflector layer, finally outwards give off through the protective layer, the effective luminance of LED panel has been promoted by a wide margin.
The invention is further characterized in that the top surface of the lamp strip is provided with a heat conducting strip with the same area as the lamp strip, and the bottom surface of the substrate is provided with a heat conducting layer.
Through adopting above-mentioned technical scheme, the heat level with the lamp area of heat conduction strip can be efficient is derived, carries LED packaging structure's radiating efficiency, and the gap of base plate bottom surface can be filled to the heat conduction layer, makes the heat of base plate can be quick transfer to the bottom plate to discharge packaging structure through the bottom plate.
The invention further provides that the bottom surface of the heat conducting layer is attached with a bottom plate.
By adopting the technical scheme, the bottom plate can well protect the LED packaging structure.
The invention is further characterized in that a separation table is arranged between the longitudinal intervals of the grooves, a concave table is arranged at the middle position of each groove, and the depth and the width of the concave table are matched with the lamp strip.
Through adopting above-mentioned technical scheme, make the base plate leave the space of convenient installation for the lamp area to make the lamp area top surface flush with the top surface of base plate after the installation.
The packaging method of the LED packaging structure comprises the following steps:
step one: spraying a reflective layer
Covering temporary protection structures on the isolation table and the concave table of the substrate, and then spraying a reflecting layer on the surface of the substrate;
step two: mounting lamp strip
Removing the temporary protection structure in the first step, and clamping a lamp strip in the concave table to enable the top surface of the lamp strip to be flush with the top surface of the substrate;
step three: forming a resin film layer on a substrate
Placing the substrate after the second step into a sealed space, pumping out air in the sealed space to reduce the air pressure in the sealed space to 40kPa, adhering a resin film on the substrate, and recovering the air pressure to normal pressure after the resin film is completely adhered to the substrate;
step four: forming a resin layer on the resin film layer
Injecting fluid resin on the resin film layer, arranging a heat conducting strip which is overlapped with the projection area of the lamp strip above the lamp strip, placing the lamp strip into a sealed space after the resin flows uniformly, reducing the air pressure in the sealed space to be lower than 5kPa, waiting for the resin to be solidified to form the resin layer, and recovering the air pressure to normal pressure;
step five: completing the package
And adhering a protective layer on the surface of the resin layer, spraying a heat conducting layer on the bottom surface of the substrate, and attaching a bottom plate on the bottom surface of the substrate after the heat conducting layer is solidified.
Through the technical scheme, the qualified LED packaging structure is conveniently produced.
In summary, the invention has the following advantages:
1. according to the LED panel, the groove structure is arranged on the substrate, the lamp strip provided with the LED chip is arranged on the groove structure, the LED chip faces the bottom surface of the groove structure, the reflecting layer is sprayed in the groove structure, meanwhile, the resin film is covered above the substrate and the lamp strip, the resin film is protruded towards the groove direction by using an air pressure difference method, then resin is injected above the resin film and covers the protective layer, light emitted by the LED chip irradiates on the reflecting layer, is condensed through the concave lens-shaped resin layer after being reflected by the reflecting layer, finally is emitted outwards through the protective layer, and the effective luminous brightness of the LED panel is greatly improved;
2. according to the LED panel light distribution structure, the LED chips are reversely arranged, so that light emitted by the LED chips is reflected by the groove structures and then is concentrated by the light concentrating structures and then is emitted in rectangular areas arranged in a matrix, and the light emission of the LED panel is more uniform;
3. according to the LED packaging structure, the LED chips are welded on the strip-shaped circuit board to form the lamp strip structure, the lamp strip structure is arranged at the position, close to the outer layer, of the LED packaging structure, the heat generated by the working of the LED chips can be rapidly LED out by using the heat dissipation structure to attach to the strip-shaped circuit board, and the heat dissipation efficiency of the LED chips is greatly improved.
Drawings
FIG. 1 is a perspective view of the present invention;
FIG. 2 is a perspective view of a substrate and a lamp strip according to the present invention;
FIG. 3 is an enlarged view of FIG. 2A in accordance with the present invention;
FIG. 4 is a perspective view of another view angle substrate and lamp strip according to the present invention;
FIG. 5 is a front interior view of the present invention;
FIG. 6 is a front interior view of a substrate of the present invention;
fig. 7 is a perspective view of a protective net according to the present invention:
fig. 8 is a perspective view of the protective net of the present invention mounted on a substrate.
In the figure: 1. a substrate; 2. a light strip; 3. a groove; 4. a separation table; 5. a resin film layer; 6. a resin layer; 7. a protective layer; 8. a heat conducting strip; 9. a heat conducting layer; 10. a bottom plate; 11. a concave table; 12. a protective net; 13. a boss.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
Hereinafter, an embodiment of the present invention will be described in accordance with its entire structure.
The LED packaging structure comprises a substrate 1 and a lamp strip 2, wherein the lamp strip 2 is a strip-shaped circuit board with LED chips welded at intervals, grooves 3 are formed in the substrate 1 at intervals, specifically, the cross sections of the grooves 3 are in inverted isosceles trapezoids, the grooves 3 are transversely and tightly arranged and longitudinally equidistantly arranged at intervals, the lamp strip 2 is longitudinally arranged in the middle of the grooves 3 of the substrate 1, the LED chips on the lamp strip 2 face the bottom surface of the grooves 3, a reflecting layer is sprayed in the grooves 3, the top surface of the lamp strip 2 is flush with the top surface of the substrate 1, a resin film layer 5 is arranged on the top surface of the substrate 1, the resin film layer 5 is recessed towards the bottom surface of the grooves 3 in the position of the grooves 3, a resin layer 6 is arranged on the resin film layer 5, the bottom surface of the resin layer 6 is in a plane, the top surface of the resin layer 6 is provided with a protective layer 7, light emitted by the LED chips irradiates on the reflecting layer, the light is concentrated through the resin layer 6 in the shape of a concave lens after being reflected by the reflecting layer, finally, the light is emitted outwards through the protective layer 7, the effective light-emitting brightness of the LED packaging structure is greatly improved, and the LED packaging structure can be used after the LED packaging structure is completed.
Referring to fig. 3, a spacer 4 is disposed between the longitudinal spaces of the grooves 3, the spacer 4 is provided with a recess 11 at the middle position of each groove 3, and the depth and width of the recess 11 are adapted to the lamp strip 2, so that the substrate 1 provides a space for the lamp strip 2 to be conveniently mounted, and the top surface of the lamp strip 2 is flush with the top surface of the substrate 1 after being mounted.
Referring to fig. 5, the top surface of the lamp strip 2 is provided with a heat conducting strip 8 with the same area as the lamp strip 2, the heat conducting strip 8 can be used for rapidly transferring heat from the lamp strip 2 to the protective layer 7, the heat dissipation efficiency of the lamp strip 2 is accelerated, the bottom surface of the substrate 1 is provided with a heat conducting layer 9, specifically, the substrate 1 can also be used for transferring heat generated by the lamp strip 2, the heat passing through the substrate 1 can be conducted through the heat conducting layer 9 and then rapidly guided to the bottom plate 10 and emitted to the outside, the heat conducting strip 8 can be used for simultaneously and efficiently guiding out the heat level of the lamp strip 2, the heat dissipation efficiency of the LED package structure is improved, the heat conducting layer 9 can be used for filling gaps on the bottom surface of the substrate 1, the heat of the substrate 1 can be rapidly transferred to the bottom plate 10, the package structure is discharged through the bottom plate 10, the bottom surface of the heat conducting layer 9 is attached with the bottom plate 10, and the bottom plate 10 can well protect the LED package structure.
A packaging method of an LED package structure, as shown in figures 1-8,
the isolation table 4 and the concave table 11 of the substrate 1 are covered with temporary protection structures, the protection structures are specifically protection nets 12 clamped on the substrate 1, the projection area of each protection net 12 coincides with the isolation table 4, the lower surface of each protection net is fixedly connected with a boss 13, each boss 13 is clamped with the corresponding concave table 11, when the protection nets 12 are connected to the substrate 1, sprayed light reflecting layer spray does not fall on the corresponding concave table 11 and the corresponding isolation table 4, the light reflecting layer is prevented from being formed on the corresponding concave table 11 and the corresponding isolation table 4, the thickness of the packaging structure is effectively reduced, then the light reflecting layer is sprayed on the surface of the substrate 1, specifically, the light reflecting layer is made of fine glass bead mixed adhesive and is adhered in the groove 3 of the substrate 1 in a spraying mode, and the light reflecting layer is formed; removing the temporary protection structure, and clamping the lamp strip 2 in the concave table 11 to enable the top surface of the lamp strip 2 to be flush with the top surface of the substrate 1; placing the substrate 1 after the lamp strip 2 is installed in a sealed space, pumping out air in the sealed space to reduce the air pressure in the sealed space to 40kPa, adhering a resin film on the substrate 1, recovering the air pressure to normal pressure after the resin film is completely attached to the substrate 1, specifically, forming a cavity in a low-air-pressure environment in a groove 3 of the substrate 1 after the resin film is attached to the substrate 1, and forming a resin film layer 5 because the air pressure in the outside is greater than the air pressure in the cavity of the groove 3 in the process of recovering the air pressure to normal pressure; injecting fluid resin on the resin film layer 5, arranging a heat conducting strip 8 which is overlapped with the projection area of the lamp strip above the lamp strip 2, placing the lamp strip into a sealing space after the resin flows uniformly, reducing the air pressure in the sealing space to be lower than 5kPa, waiting for the resin to solidify to form a resin layer 6, recovering the air pressure to normal pressure, specifically, after flowing on the resin film layer 5, filling the space recessed on the resin film layer 5, after placing the heat conducting strip 8, immersing the heat conducting strip 8 into the fluid resin by gravity, contacting with the resin film layer 5, and the projection area is overlapped with the lamp strip 2, and then smoothly discharging some tiny bubbles in the resin in the process of reducing the air pressure, thereby effectively avoiding the occurrence of small cavities in the resin layer 6, and forming the resin layer 6 after waiting for the resin to solidify; the protective layer 7 is adhered to the surface of the resin layer 6, the heat conducting layer 9 is sprayed on the bottom surface of the substrate 1, after the heat conducting layer 9 is solidified, the bottom plate 10 is attached to the bottom surface of the substrate 1, the packaging of the LED packaging structure is completed, and particularly, the heat conducting layer 9 can be well filled in some small gaps on the bottom surface of the substrate 1, and after the packaging of the LED packaging structure is completed, the heat transfer efficiency towards the bottom plate 10 can be greatly improved.
Although embodiments of the invention have been shown and described, the detailed description is to be construed as exemplary only and is not limiting of the invention as the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples, and modifications, substitutions, variations, etc. may be made in the embodiments as desired by those skilled in the art without departing from the principles and spirit of the invention, provided that such modifications are within the scope of the appended claims.
Claims (7)
- LED packaging structure, including base plate (1) and lamp area (2), lamp area (2) are for separating the bar circuit board that welds there is the LED chip, its characterized in that: the LED lamp comprises a substrate (1), wherein grooves (3) are formed in the substrate (1) at intervals, the grooves (3) are transversely and tightly arranged, the grooves are longitudinally and equidistantly arranged at intervals, a lamp strip (2) is longitudinally arranged in the middle of the grooves (3) on the substrate (1), an LED chip on the lamp strip (2) faces the bottom surface of the grooves (3), a reflecting layer is sprayed in the grooves (3), the top surface of the lamp strip (2) is flush with the top surface of the substrate (1), a resin film layer (5) is arranged on the top surface of the substrate (1), the resin film layer (5) is recessed towards the bottom surface of the grooves (3), a resin layer (6) is arranged on the resin film layer (5), the bottom surface of the resin layer (6) is attached to a resin film, the top surface of the resin layer (6) is a plane, and a protective layer (7) is arranged on the top surface of the resin layer (6).
- 2. The LED package structure of claim 1, wherein: the top surface of lamp area (2) is provided with heat conduction strip (8) that are equal with lamp area (2), the bottom surface of base plate (1) is provided with heat conduction layer (9).
- 3. The LED package structure of claim 2, wherein: the bottom surface of the heat conduction layer (9) is attached with a bottom plate (10).
- 4. The LED package structure of claim 3, wherein: the lamp strip is characterized in that a separation table (4) is arranged between the longitudinal intervals of the grooves (3), a concave table (11) is arranged at the middle position of each groove (3) of the separation table (4), and the depth and the width of the concave table (11) are matched with those of the lamp strip (2).
- 5. The packaging method of the LED packaging structure is characterized by comprising the following steps of: the method comprises the following steps:step one: spraying a reflective layerCovering temporary protection structures on the isolation table (4) and the concave table (11) of the substrate (1), and then spraying a reflecting layer on the surface of the substrate (1);step two: mounting lamp stripRemoving the temporary protection structure in the first step, and clamping the lamp strip (2) in the concave table (11) to enable the top surface of the lamp strip (2) to be flush with the top surface of the substrate (1);step three: forming a resin film layer on a substratePlacing the substrate (1) subjected to the second step into a sealed space, pumping out air in the sealed space, reducing the air pressure in the sealed space to 40kPa, adhering a resin film on the substrate (1), and recovering the air pressure to normal pressure after the resin film is completely adhered to the substrate (1);step four: forming a resin layer on the resin film layerInjecting fluid resin on the resin film layer (5), uniformly flowing the resin, then placing the resin into a sealed space, reducing the air pressure in the sealed space to be lower than 5kPa, waiting for the resin to be solidified to form a resin layer (6), and recovering the air pressure to normal pressure;step five: completing the packageThe protective layer (7) is adhered to the surface of the resin layer (6), and then the bottom plate (10) is adhered to the bottom surface of the substrate (1).
- 6. The packaging method of the LED packaging structure according to claim 5, characterized in that: and in the fourth step, after the fluidized resin is injected, a heat conducting strip (8) which is overlapped with the projection area of the lamp strip is arranged above the lamp strip (2).
- 7. The packaging method of the LED packaging structure according to claim 5, characterized in that: in the fifth step, before the bottom plate (10) is attached, a heat conducting layer (9) is sprayed on the bottom surface of the substrate (1), and after the heat conducting layer (9) is solidified, the bottom plate (10) is attached to the bottom surface of the substrate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310705772.4A CN116454193B (en) | 2023-06-15 | 2023-06-15 | LED packaging structure and packaging method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310705772.4A CN116454193B (en) | 2023-06-15 | 2023-06-15 | LED packaging structure and packaging method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116454193A true CN116454193A (en) | 2023-07-18 |
| CN116454193B CN116454193B (en) | 2023-08-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310705772.4A Active CN116454193B (en) | 2023-06-15 | 2023-06-15 | LED packaging structure and packaging method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116454193B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201795372U (en) * | 2010-04-21 | 2011-04-13 | 广东昭信光电科技有限公司 | LED backlight structure with inverted light source and using freeform surface reflector |
| CN102032453A (en) * | 2009-09-25 | 2011-04-27 | 李永臣 | Aluminum section strip LED multipurpose lamp |
| KR20120003717A (en) * | 2010-07-05 | 2012-01-11 | 엘지디스플레이 주식회사 | Light emitting diode and method for fabricating of the same |
| CN109131059A (en) * | 2018-07-28 | 2019-01-04 | 霍尔果斯德仁科技有限公司 | A kind of surface has the inside gadget and its production technology of atmosphere lamp effect |
| CN109244115A (en) * | 2018-09-19 | 2019-01-18 | 京东方科技集团股份有限公司 | A kind of OLED display panel and preparation method thereof and display device |
| CN216405164U (en) * | 2021-10-19 | 2022-04-29 | 南京易通纺织科技有限公司 | Road safety reflection of light sticker |
| CN218731036U (en) * | 2022-11-04 | 2023-03-24 | 广东安珂光电科技有限公司 | High-brightness LED lamp bead |
-
2023
- 2023-06-15 CN CN202310705772.4A patent/CN116454193B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102032453A (en) * | 2009-09-25 | 2011-04-27 | 李永臣 | Aluminum section strip LED multipurpose lamp |
| CN201795372U (en) * | 2010-04-21 | 2011-04-13 | 广东昭信光电科技有限公司 | LED backlight structure with inverted light source and using freeform surface reflector |
| KR20120003717A (en) * | 2010-07-05 | 2012-01-11 | 엘지디스플레이 주식회사 | Light emitting diode and method for fabricating of the same |
| CN109131059A (en) * | 2018-07-28 | 2019-01-04 | 霍尔果斯德仁科技有限公司 | A kind of surface has the inside gadget and its production technology of atmosphere lamp effect |
| CN109244115A (en) * | 2018-09-19 | 2019-01-18 | 京东方科技集团股份有限公司 | A kind of OLED display panel and preparation method thereof and display device |
| CN216405164U (en) * | 2021-10-19 | 2022-04-29 | 南京易通纺织科技有限公司 | Road safety reflection of light sticker |
| CN218731036U (en) * | 2022-11-04 | 2023-03-24 | 广东安珂光电科技有限公司 | High-brightness LED lamp bead |
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| Publication number | Publication date |
|---|---|
| CN116454193B (en) | 2023-08-22 |
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