CN116380207B - Semiconductor strain gauge dust fall monitoring device and method - Google Patents
Semiconductor strain gauge dust fall monitoring device and method Download PDFInfo
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- CN116380207B CN116380207B CN202310371445.XA CN202310371445A CN116380207B CN 116380207 B CN116380207 B CN 116380207B CN 202310371445 A CN202310371445 A CN 202310371445A CN 116380207 B CN116380207 B CN 116380207B
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- 239000000428 dust Substances 0.000 title claims abstract description 326
- 239000004065 semiconductor Substances 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title claims abstract description 41
- 238000012806 monitoring device Methods 0.000 title claims abstract description 13
- 238000012544 monitoring process Methods 0.000 claims abstract description 133
- 239000000758 substrate Substances 0.000 claims abstract description 56
- 238000004891 communication Methods 0.000 claims abstract description 28
- 230000007246 mechanism Effects 0.000 claims abstract description 27
- 238000012545 processing Methods 0.000 claims description 50
- 238000007790 scraping Methods 0.000 claims description 25
- 238000004140 cleaning Methods 0.000 claims description 17
- 230000008569 process Effects 0.000 claims description 16
- 238000012423 maintenance Methods 0.000 claims description 6
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 238000004062 sedimentation Methods 0.000 abstract description 3
- 238000001514 detection method Methods 0.000 description 9
- 239000002817 coal dust Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000008021 deposition Effects 0.000 description 4
- 238000004880 explosion Methods 0.000 description 4
- 230000002349 favourable effect Effects 0.000 description 3
- 238000005070 sampling Methods 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000000779 smoke Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- -1 polydimethylsiloxane Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01G—WEIGHING
- G01G3/00—Weighing apparatus characterised by the use of elastically-deformable members, e.g. spring balances
- G01G3/12—Weighing apparatus characterised by the use of elastically-deformable members, e.g. spring balances wherein the weighing element is in the form of a solid body stressed by pressure or tension during weighing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/16—Rigid blades, e.g. scrapers; Flexible blades, e.g. wipers
- B08B1/165—Scrapers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01G—WEIGHING
- G01G17/00—Apparatus for or methods of weighing material of special form or property
- G01G17/04—Apparatus for or methods of weighing material of special form or property for weighing fluids, e.g. gases, pastes
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Abstract
A semiconductor strain gauge dust fall monitoring device and method, the device: the center of the top plate of the shell is provided with a dust sedimentation opening and a chamber cover; the dust fall monitoring cavity is arranged in the shell, and the upper opening end of the dust fall monitoring cavity is communicated with the dust settling opening; the bottom of the left side plate of the dust fall monitoring chamber is provided with a chamber communication hole and a chamber on-off control device; the lower part of the right side plate of the dust fall monitoring chamber is provided with a guide through hole for the telescopic rod to slide through, and the scraper is driven to slide by a linear telescopic mechanism; the center of the bottom plate of the dust fall monitoring chamber is provided with a flexible substrate, and the semiconductor strain gauge is arranged at the lower part of the flexible substrate; the dust collection chamber is arranged in the shell, a dust mass balance is assembled in the center of a bottom plate of the dust collection chamber, and a dust feeding notch is formed in the upper part of the right side of the dust collection chamber. Then go to: opening the chamber cover to perform monitoring operation; and acquiring strain quantity signals of the flexible substrate in real time by utilizing the semiconductor strain gauge, and obtaining dust fall quality. The device and the method can be beneficial to realizing the automatic operation of dust fall monitoring.
Description
Technical Field
The invention belongs to the technical field of dust fall detection, and particularly relates to a semiconductor strain gauge dust fall monitoring device and method.
Background
Dust formed during the production process in connection with the production process is called productive dust. The productive dust source is very wide, and the main sources are solid particles suspended in air by mechanical impact, grinding and rolling, smoke dust formed by condensing or oxidizing vapor produced by heating substances in air and smoke formed by incomplete combustion of organic substances. After the dust is generated, the dust naturally falls on the ground under the action of gravity to form falling dust, and the falling dust deposition can be caused by the continuous generation of the dust. When the operation environment conditions change, dust fall can be raised, so that dust is resuspended, the dust concentration in the operation space is rapidly increased, and if the dust explosion concentration is reached, dust explosion is easily caused. Therefore, the detection of the dust falling amount in the operation place is essential for ensuring the safe production.
The existing dust fall amount measuring method mainly comprises the steps of firstly adopting a wet method to sample, then adopting a method of filtering and drying dust-containing filter paper and aqueous solution to measure the total dust fall amount, and has the defects of fixed sampling points, higher cost of sampling equipment, poorer instantaneity, higher dependence degree of the measuring process on test staff and the like. There is also a method for measuring the mass of deposited dust by measuring the thickness of the deposited dust in combination with a mathematical relationship between the mass of the deposited dust and the thickness of the deposited dust. The method is mainly applied to measuring dust deposition in the ventilating dust removing pipeline, and is difficult to be applied to measuring the quality of deposited dust in a working place. In the coal industry, methods such as a hanging scaffold method, a cleaning method, a floating coal dust concentration difference method and the like are also used for measuring the deposition intensity of coal dust. The hanging scaffold method is to set a measuring point at intervals along the trend of the roadway, and to use a dust collecting plate with a certain size to receive the settled coal dust so as to measure and calculate the settling amount of the coal dust in unit area and unit time of the roadway at the measuring point; the cleaning method is to clean coal dust on the peripheral wall of a roadway for sampling so as to realize the measurement of the sedimentation strength of the coal dust; the floating dust concentration difference method can only be used under the condition of a single dust source, so that the application range is narrow. The method can not realize real-time and automatic monitoring of dust falling quantity. In addition, in the existing researches, the deposition amount of dust in the operation place is rarely monitored specially, and most of the researches are limited to monitoring and early warning of dust emission. Therefore, the instrument and the device which can accurately monitor the dust falling amount of the working space are developed, the characteristics of inaccuracy and timeliness of the traditional detection method can be made up, and the automatic real-time accurate detection of the dust falling amount of the working space can be realized.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides the device and the method for monitoring the dust falling of the semiconductor strain gauge, which have the advantages of simple structure, low manufacturing cost, good instantaneity and high monitoring efficiency, are favorable for realizing the automatic operation of dust falling monitoring, and can accurately monitor the dust falling amount in an operation space in real time. The method has the advantages of simple steps and high automation degree, and can automatically realize the real-time accurate detection of the dust falling quality of the space to be detected.
In order to achieve the above purpose, the invention provides a semiconductor strain gauge dust fall monitoring device, which comprises a shell, a dust fall monitoring chamber, a flexible substrate, a semiconductor strain gauge, a chamber on-off control device, a dust fall collecting chamber, a dust fall cleaning device and a processing unit;
the shell is of a box type structure, a square dust settling opening is formed in the central area of the top plate of the shell, a cavity cover is connected to one side edge of the dust settling opening, and the cavity cover is a rotary cover plate driven by a first micro motor and is used for opening or closing the dust settling opening in the rotating process;
the dust fall monitoring chamber is of a box-type structure with an open upper end, and the size of the upper open end of the dust fall monitoring chamber is matched with the size of the dust settling opening; the dust fall monitoring cavity is arranged in the shell, and the upper opening end of the dust fall monitoring cavity is fixedly connected with the top plate of the shell, aligned with the dust settling port and communicated with the dust settling port; a substrate mounting hole is formed in the central area of the bottom plate of the dust fall monitoring chamber, a circular guide through hole is formed in the bottom of the right side plate of the dust fall monitoring chamber, and a chamber communication hole is formed in the bottom of the left side plate of the dust fall monitoring chamber; the length direction of the chamber communication hole extends along the front-back direction and is matched with the size of the dust fall monitoring chamber in the front-back direction;
the size of the flexible substrate is matched with the size of the substrate mounting hole, and the flexible substrate is mounted in the substrate mounting hole;
the semiconductor strain gauge is arranged on the lower part of the flexible substrate;
the cavity on-off control device is connected to the upper edge of the cavity communication hole and provided with a rotary cover plate driven by a second micro motor and used for opening or closing the cavity communication hole in the rotation process of the rotary cover plate;
the dust collection chamber is of a box type structure, is arranged in the shell and is positioned at the left side of the dust monitoring chamber, a dust mass balance is assembled in the central area of the bottom plate of the dust collection chamber, and a dust feeding gap is formed in the upper part of the right side of the dust collection chamber at a position corresponding to the chamber communication hole and is communicated with the chamber communication hole through the dust feeding gap;
the dust removing device is fixedly arranged on the inner side of the shell and is positioned on the right side of the dust monitoring chamber, the dust removing device mainly comprises a scraping plate and a linear telescopic mechanism, the length direction of the scraping plate extends along the front-back direction, the length of the scraping plate is matched with the front-back direction of the dust monitoring chamber, and the scraping plate is arranged on the bottom plate of the dust monitoring chamber in a sliding manner; the linear telescopic mechanism is horizontally arranged, the end part of the telescopic rod of the linear telescopic mechanism passes through the guide through hole in a sliding manner and is fixedly connected with the right end surface of the scraping plate, the linear telescopic mechanism is used for driving the scraping plate to slide along the left-right direction in the telescopic process, the scraping plate is pushed to the position of the chamber communication hole when the linear telescopic mechanism is in a fully extended state, and the scraping plate is driven to the position of the right side plate of the dust fall monitoring chamber when the linear telescopic mechanism is in a fully retracted state;
the processing unit is fixedly arranged on the inner side of the shell and positioned below the dust fall monitoring cavity, and is respectively connected with the first micro motor in the cavity cover, the semiconductor strain gauge, the second micro motor in the cavity on-off control device and the dust fall mass balance.
Further, in order to effectively remove dust accumulated on the upper surface of the flexible substrate, the lower end of the scraper 14 is connected with a plurality of bristles throughout along the length direction thereof.
Preferably, the processing unit is a PLC controller.
Further, in order to facilitate operators to view dust fall data and prompt messages in real time, the portable dust collector further comprises a display screen, wherein the display screen is embedded on the outer surface of one side plate of the shell and is connected with the processing unit, and is used for displaying monitoring results and prompt messages in real time under the control of the processing unit.
Preferably, the linear telescopic mechanism is a linear electric push rod or a cylinder.
Further, in order to conveniently draw out the dust collection chamber from the shell, so as to clean dust in the dust collection chamber, meanwhile, in order to conveniently reload the dust collection chamber into the shell, a maintenance bin gate is arranged on a front side plate or a rear side plate of the shell at a position corresponding to the dust collection chamber, and the size of the maintenance bin gate is larger than that of the dust collection chamber.
According to the invention, the sizes of the upper end and the opening of the dust falling monitoring cavity are matched with the size of the dust settling opening at the upper end of the shell, so that dust falling from the dust falling settling opening can be ensured to be uniformly deposited at the bottom of the dust falling monitoring cavity in the monitoring process, and the monitoring precision is improved; the flexible substrate is assembled on the bottom plate of the dust fall monitoring chamber, and the semiconductor strain gauge is arranged on the lower surface of the flexible substrate, so that strain quantity signals of the flexible substrate can be accurately acquired in real time, and further the processing unit can conveniently acquire dust quality data deposited in the dust fall monitoring chamber in real time; the chamber communication hole is formed in the lower left side of the dust fall monitoring chamber, the guide through hole is formed in the lower right side of the chamber communication hole, and meanwhile, the linear telescopic mechanism is used for driving the scraping plate to slide on the bottom plate of the dust fall monitoring chamber, so that dust at the bottom of the dust fall monitoring chamber can be cleaned rapidly in a manner of transversely sliding the scraping plate, and further monitoring operation in the next stage is facilitated rapidly. Make dust collection cavity setting in the left side of dust monitoring cavity to make its right side upper portion seted up the dust feeding breach that is linked together with the cavity intercommunicating pore, can concentrate the collection by the dust that the dust monitoring cavity bottom scraped, thereby be convenient for follow-up centralized processing, can effectively avoid the dust to discharge into the environment once more. The dust falling mass balance is assembled at the bottom of the dust falling collecting chamber, so that the dust mass deposited in the dust falling collecting chamber can be monitored in real time, and the automatic cleaning reminding of the processing unit according to the dust mass deposited in the dust falling collecting chamber is facilitated. The device simple structure, low in manufacturing cost, real-time are good, monitoring efficiency is high, and it can be favorable to realizing the automation mechanized operation of dust fall monitoring, the dust fall volume in the monitoring operation space that can be accurate in real time.
The invention also provides a method for monitoring the dust falling of the semiconductor strain gauge, which adopts the device for monitoring the dust falling of the semiconductor strain gauge and comprises the following steps:
step one: maintaining the closed state of the chamber on-off control device so that the dust fall monitoring chamber and the dust fall collecting chamber are not communicated with each other;
the processing unit controls the chamber cover to be opened, so that the dust fall monitoring chamber is communicated with the environment to be monitored through the dust settling port, and the dust fall monitoring operation of the area to be monitored is carried out;
step two: in the monitoring process, strain quantity signals of the flexible substrate are acquired in real time by utilizing the semiconductor strain gauge and are sent to the processing unit in real time, the processing unit obtains stress values in real time according to the received strain quantity signals, and the falling dust quality of the falling dust monitoring chamber is matched in real time according to the stress values, and meanwhile, the falling dust quality data of the falling dust monitoring chamber is sent to the display screen for real-time display;
step three: after the monitoring time of the set stage is reached, the stage monitoring operation is finished, the processing unit firstly controls the chamber cover to be closed, controls the chamber on-off control device to be opened, enables the dust fall monitoring chamber and the dust fall collecting chamber to be communicated with each other, then controls the dust fall cleaning device to act, enables the telescopic rod of the linear telescopic mechanism to extend outwards gently until reaching the maximum extending state, scrapes dust deposited at the bottom of the dust fall monitoring chamber into the dust fall collecting chamber by utilizing the scraping plate to collect the dust fall, and in the process, the processing unit acquires the strain quantity signal of the flexible substrate in real time by utilizing the semiconductor strain gauge and obtains the stress value of the flexible substrate in real time, and controls the chamber on-off control device to be closed and controls the dust fall cleaning device to be closed when the stress value of the flexible substrate is equal to the initial state;
meanwhile, the processing unit acquires dust fall mass data of the dust fall monitoring chamber in real time by using the dust fall mass balance and sends the dust fall mass data to the processing unit in real time, the processing unit compares the dust fall mass data of the dust fall monitoring chamber with a set threshold value in real time, and when the dust fall mass of the dust fall monitoring chamber is greater than or equal to the set threshold value, prompt information for cleaning the dust fall collecting chamber is displayed through the display screen.
The invention has simple steps and high degree of automation, can automatically realize the real-time accurate detection operation of the dust fall quality of the space to be detected, can display the monitored data in real time, and is beneficial to the manager to take different treatment measures in time. Meanwhile, the method can automatically clean and collect the settled dust in the detection process, and can effectively prevent explosion accidents caused by dust resuspension.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic view of a semiconductor strain gauge structure in accordance with the present invention;
fig. 3 is an equivalent circuit diagram of a semiconductor strain gauge in the present invention.
In the figure: 1. a shell, 2 dust settling ports, 3 dust fall monitoring chambers, 4, a semiconductor strain gauge, 5, a flexible substrate, 6, a dust fall cleaning device, 7, a chamber on-off control device, 8, a dust fall collecting chamber, 9, a dust falling mass balance, 10, a processing unit, 11, a chamber cover, 12, a chamber communication hole, 13, a linear telescopic mechanism, 14, a scraper, 15, a substrate mounting hole, 16 and a guide through hole;
40. sensing element 41, inner lead 42, electrode 43, substrate 44, outer lead.
Description of the embodiments
The present invention will be further described below.
As shown in fig. 1 to 3, a semiconductor strain gauge dust fall monitoring device comprises a shell 1, a dust fall monitoring chamber 3, a flexible substrate 5, a semiconductor strain gauge 4, a chamber on-off control device 7, a dust fall collecting chamber 8, a dust fall cleaning device 6 and a processing unit 10;
the shell 1 is of a box type structure, a square dust settling opening 2 is formed in the central area of a top plate of the shell, a cavity cover 11 is connected to one side edge of the dust settling opening 2, and the cavity cover 11 is a rotary cover plate driven by a first micro motor and is used for opening or closing the dust settling opening 2 in the rotating process;
the dust fall monitoring chamber 3 is of a box-type structure with an open upper end, and the size of the upper open end of the dust fall monitoring chamber is matched with the size of the dust settling opening 2; the dust fall monitoring cavity 3 is arranged in the shell 1, and the upper opening end of the dust fall monitoring cavity is fixedly connected with the top plate of the shell 1 and is aligned with and communicated with the dust settling opening 2; a base mounting hole 15 is formed in the central area of the bottom plate of the dust fall monitoring chamber 3, a circular guide through hole 16 is formed in the bottom of the right side plate of the base mounting hole, and a chamber communication hole 12 is formed in the bottom of the left side plate of the base mounting hole; the length direction of the chamber communication hole 12 extends along the front-back direction and is matched with the size of the dust fall monitoring chamber 3 along the front-back direction;
the size of the flexible substrate 5 is matched with the size of the substrate mounting hole 15, and the flexible substrate is mounted in the substrate mounting hole 15; the flexible substrate 5 may be a polydimethylsiloxane film, although other materials may be used.
The semiconductor strain gauge 4 is arranged on the lower part of the flexible substrate 5; as one preferable aspect, the semiconductor strain gauge 4 is composed of a substrate 43, a sensing element 40, an inner lead 41, two electrodes 42 and an outer lead 44, wherein the sensing element 40 is disposed inside the substrate 43, the two electrodes are disposed on the surface of the substrate 43 at intervals, the two electrodes 42 are connected to two ends of the sensing element 40 through the two inner leads 41 located inside the substrate 43, and the two electrodes 42 are connected to an input end of the processing unit 10 through the two outer leads 44;
the chamber on-off control device 7 is connected to the upper edge of the chamber communication hole 12, the chamber on-off control device 7 is provided with a rotary cover plate driven by a second micro motor, wherein the rotary cover plate is matched with the size of the chamber communication hole 12 and is used for opening or closing the chamber communication hole 12 in the rotation process of the rotary cover plate;
the dust collection chamber 8 is of a box type structure, is arranged in the shell 1 and is positioned at the left side of the dust monitoring chamber 3, a dust mass balance 9 is assembled in the central area of the bottom plate of the dust collection chamber 8, and a dust feeding gap is formed in the upper part of the right side of the dust collection chamber at a position corresponding to the chamber communication hole 12 and is communicated with the chamber communication hole 12 through the dust feeding gap;
the dust removing device 6 is fixedly arranged on the inner side of the shell 1 and positioned on the right side of the dust monitoring chamber 3, the dust removing device 6 mainly comprises a scraping plate 14 and a linear telescopic mechanism 13, the length direction of the scraping plate 14 extends along the front-back direction, the length of the scraping plate is matched with the size of the dust monitoring chamber 3 in the front-back direction, and the scraping plate 14 is slidably arranged on the bottom plate of the dust monitoring chamber 3; the linear telescopic mechanism 13 is horizontally arranged, the end part of the telescopic rod of the linear telescopic mechanism passes through the guide through hole 16 and is fixedly connected with the right end surface of the scraper 14, and the linear telescopic mechanism is used for driving the scraper 14 to slide back and forth along the left-right direction in the telescopic process, when the linear telescopic mechanism 13 is in a fully extended state, the scraper 14 is pushed to the position of the chamber communication hole 12, and when the linear telescopic mechanism 13 is in a fully retracted state, the scraper 14 is driven to the position of the right side plate of the dust fall monitoring chamber 3; in order to effectively clean the dust falling from the bottom of the dust falling monitoring chamber 3, the lower end of the scraper 14 is connected with a plurality of bristles along the length direction, and the dust falling accumulated on the upper surface of the flexible substrate 5 can be effectively cleaned through the arrangement of the bristles.
The processing unit 10 is fixedly arranged on the inner side of the shell 1 and is positioned below the dust fall monitoring cavity 3, and is respectively connected with the first micro motor in the cavity cover 11, the semiconductor strain gauge 4, the second micro motor in the cavity on-off control device 7 and the dust fall mass balance 9.
Preferably, the processing unit 10 is a PLC controller.
In order to facilitate operators to view dust fall data and prompt information in real time, the dust fall monitoring device further comprises a display screen, wherein the display screen is embedded on the outer surface of one side plate of the shell 1 and is connected with the processing unit 10, and is used for displaying monitoring results and prompt information in real time under the control of the processing unit 10. The display screen is a touch screen in order to be convenient for an operator to issue an operation instruction to the processing unit 10.
Preferably, the linear telescopic mechanism 13 is a linear electric push rod or a cylinder.
In order to conveniently draw out the dust collecting chamber from the shell so as to clean dust in the dust collecting chamber, and simultaneously, in order to conveniently reload the dust collecting chamber into the shell, a maintenance bin gate is arranged on a front side plate or a rear side plate of the shell 1 at a position corresponding to the dust collecting chamber 8, and the size of the maintenance bin gate is larger than that of the dust collecting chamber 8.
According to the invention, the sizes of the upper end and the opening of the dust falling monitoring cavity are matched with the size of the dust settling opening at the upper end of the shell, so that dust falling from the dust falling settling opening can be ensured to be uniformly deposited at the bottom of the dust falling monitoring cavity in the monitoring process, and the monitoring precision is improved; the flexible substrate is assembled on the bottom plate of the dust fall monitoring chamber, and the semiconductor strain gauge is arranged on the lower surface of the flexible substrate, so that strain quantity signals of the flexible substrate can be accurately acquired in real time, and further the processing unit can conveniently acquire dust quality data deposited in the dust fall monitoring chamber in real time; the chamber communication hole is formed in the lower left side of the dust fall monitoring chamber, the guide through hole is formed in the lower right side of the chamber communication hole, and meanwhile, the linear telescopic mechanism is used for driving the scraping plate to slide on the bottom plate of the dust fall monitoring chamber, so that dust at the bottom of the dust fall monitoring chamber can be cleaned rapidly in a manner of transversely sliding the scraping plate, and further monitoring operation in the next stage is facilitated rapidly. Make dust collection cavity setting in the left side of dust monitoring cavity to make its right side upper portion seted up the dust feeding breach that is linked together with the cavity intercommunicating pore, can concentrate the collection by the dust that the dust monitoring cavity bottom scraped, thereby be convenient for follow-up centralized processing, can effectively avoid the dust to discharge into the environment once more. The dust falling mass balance is assembled at the bottom of the dust falling collecting chamber, so that the dust mass deposited in the dust falling collecting chamber can be monitored in real time, and the automatic cleaning reminding of the processing unit according to the dust mass deposited in the dust falling collecting chamber is facilitated. The device simple structure, low in manufacturing cost, real-time are good, monitoring efficiency is high, and it can be favorable to realizing the automation mechanized operation of dust fall monitoring, the dust fall volume in the monitoring operation space that can be accurate in real time.
The invention also provides a method for monitoring the dust falling of the semiconductor strain gauge, which adopts the device for monitoring the dust falling of the semiconductor strain gauge and comprises the following steps:
step one: maintaining the closed state of the chamber on-off control device 7 so that the dust fall monitoring chamber 3 and the dust fall collecting chamber 8 are not communicated with each other;
the processing unit 10 controls the opening of the chamber cover 11, so that the dust fall monitoring chamber 3 is communicated with the environment to be monitored through the dust settling port 2, and the dust fall monitoring operation of the area to be monitored is performed;
step two: in the monitoring process, when falling dust is deposited at the bottom of the falling dust monitoring chamber 3, the flexible substrate 5 generates corresponding strain, the strain quantity signals of the flexible substrate 5 are acquired in real time by utilizing the semiconductor strain gauge 4 and are sent to the processing unit 10 in real time, the processing unit 10 obtains stress values in real time according to the received strain quantity signals, and the falling dust quality of the falling dust monitoring chamber 3 is matched in real time according to the stress values, and meanwhile, the falling dust quality data of the falling dust monitoring chamber 3 is sent to the display screen for real-time display;
the flexible substrate 5 is affected by the dust falling weight to generate a certain deformation quantity (the relation between the stress sigma and the strain epsilon of the flexible substrate 5 is that sigma=E×epsilon, wherein E is the elastic modulus of a corresponding sensitive grid material), the semiconductor strain gauge 4 generates a certain deformation quantity, and then the internal resistivity is changed, so that the elastic deformation of the flexible substrate 5 caused by dust sedimentation can be converted into a voltage signal and transmitted to the processing unit 10, the processing unit 10 processes the received electric signal and converts the electric signal into a strain quantity, and the strain quantity of the flexible substrate 5 can be conveniently converted into the dust falling quality deposited on the flexible substrate 5.
Step three: after the monitoring time of the set stage is reached, the stage monitoring operation is finished, the processing unit 10 firstly controls the chamber cover 11 to be closed, controls the chamber on-off control device 7 to be opened, enables the dust fall monitoring chamber 3 and the dust fall collecting chamber 8 to be communicated with each other, then controls the dust fall cleaning device 6 to act, enables the telescopic rod of the linear telescopic mechanism 13 to extend outwards gently until reaching the maximum extending state, scrapes dust deposited at the bottom of the dust fall monitoring chamber 3 into the dust fall collecting chamber 8 by utilizing the scraper 14 for collecting, and in the process, the processing unit 10 acquires the strain quantity signal of the flexible substrate 5 in real time by utilizing the semiconductor strain gauge 4 and obtains the stress value of the flexible substrate 5 in real time, and controls the chamber on-off control device 7 to be closed and controls the dust fall cleaning device 6 to be closed when the stress value of the flexible substrate 5 is equal to the initial state;
meanwhile, the processing unit 10 acquires dust fall mass data of the dust fall monitoring chamber 3 in real time by using the dust fall mass balance 9 and sends the dust fall mass data to the processing unit 10 in real time, the processing unit 10 compares the dust fall mass data of the dust fall monitoring chamber 3 with a set threshold in real time, and when the dust fall mass of the dust fall monitoring chamber 3 is greater than or equal to the set threshold, prompt information for cleaning the dust fall collecting chamber is displayed through a display screen.
The invention has simple steps and high degree of automation, can automatically realize the real-time accurate detection operation of the dust fall quality of the space to be detected, can display the monitored data in real time, and is beneficial to the manager to take different treatment measures in time. Meanwhile, the method can automatically clean and collect the settled dust in the detection process, and can effectively prevent explosion accidents caused by dust resuspension.
Claims (7)
1. The semiconductor strain gauge dust fall monitoring device comprises a shell (1) and is characterized by further comprising a dust fall monitoring cavity (3), a flexible substrate (5), a semiconductor strain gauge (4), a cavity on-off control device (7), a dust fall collecting cavity (8), a dust fall cleaning device (6) and a processing unit (10);
the shell (1) is of a box type structure, a square dust settling opening (2) is formed in the central area of a top plate of the shell, a cavity cover (11) is connected to one side edge of the dust settling opening (2), and the cavity cover (11) is a rotary cover plate driven by a first micro motor and is used for opening or closing the dust settling opening (2) in the rotating process;
the dust fall monitoring chamber (3) is of a box-type structure with an open upper end, and the size of the upper opening end of the dust fall monitoring chamber is matched with the size of the dust settling opening (2); the dust fall monitoring cavity (3) is arranged in the shell (1), and the upper opening end of the dust fall monitoring cavity is fixedly connected with the top plate of the shell (1) and is aligned with and communicated with the dust settling port (2); a base mounting hole (15) is formed in the central area of the bottom plate of the dust fall monitoring chamber (3), a circular guide through hole (16) is formed in the bottom of the right side plate, and a chamber communication hole (12) is formed in the bottom of the left side plate; the length direction of the chamber communication hole (12) extends along the front-back direction and is matched with the front-back direction of the dust fall monitoring chamber (3);
the size of the flexible substrate (5) is matched with the size of the substrate mounting hole (15), and the flexible substrate is mounted in the substrate mounting hole (15);
the semiconductor strain gauge (4) is arranged at the lower part of the flexible substrate (5);
the cavity on-off control device (7) is connected to the upper edge of the cavity communication hole (12), and the cavity on-off control device (7) is provided with a rotary cover plate driven by a second micro motor and is used for opening or closing the cavity communication hole (12) in the rotation process of the rotary cover plate;
the dust collection chamber (8) is of a box type structure, is arranged in the shell (1) and is positioned at the left side of the dust monitoring chamber (3), a dust mass balance (9) is assembled in the central area of the bottom plate of the dust collection chamber (8), and a dust feeding gap is formed in the upper part of the right side of the dust collection chamber at a position corresponding to the chamber communication hole (12) and is communicated with the chamber communication hole (12) through the dust feeding gap;
the dust removing device (6) is fixedly arranged on the inner side of the shell (1) and is positioned on the right side of the dust monitoring cavity (3), the dust removing device (6) mainly comprises a scraping plate (14) and a linear telescopic mechanism (13), the length direction of the scraping plate (14) extends along the front-back direction, the length of the scraping plate is matched with the front-back direction of the dust monitoring cavity (3), and the scraping plate (14) is slidably arranged on the bottom plate of the dust monitoring cavity (3); the linear telescopic mechanism (13) is horizontally arranged, the end part of the telescopic rod of the linear telescopic mechanism passes through the guide through hole (16) in a sliding manner and is fixedly connected with the right end surface of the scraping plate (14) and is used for driving the scraping plate (14) to slide along the left-right direction in the telescopic process, when the linear telescopic mechanism (13) is in a fully extended state, the scraping plate (14) is pushed to the position of the chamber communication hole (12), and when the linear telescopic mechanism (13) is in a fully retracted state, the scraping plate (14) is driven to the position of the right side plate of the dust fall monitoring chamber (3);
the processing unit (10) is fixedly arranged on the inner side of the shell (1) and positioned below the dust fall monitoring cavity (3), and is respectively connected with the first micro motor in the cavity cover (11), the semiconductor strain gauge (4), the second micro motor in the cavity on-off control device (7) and the dust fall mass balance (9).
2. A semiconductor strain gauge dust fall monitoring device according to claim 1, wherein the lower end of the scraper (14) is connected with a plurality of bristles extending over the length thereof.
3. A semiconductor strain gauge dust fall monitoring device according to claim 1 or 2, characterized in that the processing unit (10) is a PLC controller.
4. A semiconductor strain gauge dust fall monitoring device according to claim 3, further comprising a display screen embedded on the outer surface of a side plate of the housing (1) and connected with the processing unit (10), and configured to display monitoring results and prompt information in real time under the control of the processing unit (10).
5. The semiconductor strain gauge dust fall monitoring device according to claim 4, wherein the linear telescopic mechanism (13) is a linear electric push rod or a cylinder.
6. The semiconductor strain gauge dust monitoring device according to claim 5, wherein a maintenance bin gate is provided on a front side plate or a rear side plate of the housing (1) at a position corresponding to the dust collection chamber (8), and the maintenance bin gate has a size larger than that of the dust collection chamber (8).
7. A method for monitoring the dust of a semiconductor strain gauge, which is characterized by comprising the following steps of:
step one: maintaining the closed state of the chamber on-off control device (7) so that the dust fall monitoring chamber (3) and the dust fall collecting chamber (8) are not communicated with each other;
the processing unit (10) controls the chamber cover (11) to be opened, so that the dust fall monitoring chamber (3) is communicated with the environment to be detected through the dust settling port (2), and the dust fall monitoring operation of the area to be detected is performed;
step two: in the monitoring process, strain quantity signals of the flexible substrate (5) are acquired in real time by utilizing the semiconductor strain gauge (4) and are sent to the processing unit (10) in real time, the processing unit (10) obtains stress values in real time according to the received strain quantity signals, and the falling dust quality of the falling dust monitoring room (3) is matched in real time according to the stress values, and meanwhile, the falling dust quality data of the falling dust monitoring room (3) are sent to the display screen for real-time display;
step three: after the monitoring time of the set stage is reached, the stage monitoring operation is finished, the processing unit (10) firstly controls the chamber cover (11) to be closed, controls the chamber on-off control device (7) to be opened, enables the dust monitoring chamber (3) and the dust collecting chamber (8) to be communicated with each other, then controls the dust cleaning device (6) to act, enables the telescopic rod of the linear telescopic mechanism (13) to extend outwards gently until reaching the maximum extending state, scrapes dust deposited at the bottom of the dust monitoring chamber (3) into the dust collecting chamber (8) by utilizing the scraper (14) to collect the dust, and in the process, the processing unit (10) acquires strain quantity signals of the flexible substrate (5) in real time by utilizing the semiconductor strain gauge (4) and obtains stress values of the flexible substrate (5) in real time, and controls the chamber on-off control device (7) to be closed and controls the dust cleaning device (6) to be closed when the stress values of the flexible substrate (5) are equal to the initial state;
meanwhile, the processing unit (10) collects dust fall quality data of the dust fall monitoring chamber (3) in real time by using the dust fall mass balance (9) and sends the dust fall quality data to the processing unit (10) in real time, the processing unit (10) compares the dust fall quality data of the dust fall monitoring chamber (3) with a set threshold value in real time, and when the dust fall quality of the dust fall monitoring chamber (3) is greater than or equal to the set threshold value, prompt information for cleaning the dust fall collecting chamber is displayed through the display screen.
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| JPH07151664A (en) * | 1993-11-30 | 1995-06-16 | Norio Isahaya | Method for measuring mass/concentration of dust particle in gas |
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| CN108896144A (en) * | 2018-05-10 | 2018-11-27 | 唐山松下产业机器有限公司 | Dust monitoring system and dust monitoring method |
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| JPH07151664A (en) * | 1993-11-30 | 1995-06-16 | Norio Isahaya | Method for measuring mass/concentration of dust particle in gas |
| KR20160121151A (en) * | 2015-04-10 | 2016-10-19 | 한양대학교 에리카산학협력단 | Fine partcles measuring system used by quartz crystal microbalance |
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