CN116373029B - Automatic chip removal ultrasonic jack device - Google Patents
Automatic chip removal ultrasonic jack device Download PDFInfo
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- CN116373029B CN116373029B CN202310668668.2A CN202310668668A CN116373029B CN 116373029 B CN116373029 B CN 116373029B CN 202310668668 A CN202310668668 A CN 202310668668A CN 116373029 B CN116373029 B CN 116373029B
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- 238000012545 processing Methods 0.000 claims abstract description 28
- 238000000034 method Methods 0.000 claims abstract description 26
- 230000005540 biological transmission Effects 0.000 claims abstract description 24
- 238000003754 machining Methods 0.000 claims abstract description 4
- 238000005520 cutting process Methods 0.000 claims description 64
- 230000005389 magnetism Effects 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 description 57
- 238000010586 diagram Methods 0.000 description 8
- 238000005553 drilling Methods 0.000 description 6
- 239000000835 fiber Substances 0.000 description 5
- 238000001179 sorption measurement Methods 0.000 description 4
- 230000033001 locomotion Effects 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000005489 elastic deformation Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000004323 axial length Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/16—Perforating by tool or tools of the drill type
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/18—Means for removing cut-out material or waste
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Milling, Broaching, Filing, Reaming, And Others (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The application discloses an automatic chip removal ultrasonic jack device, relates to the technical field of jack devices, and is used for solving the technical problem that in the prior art, the machining efficiency of a jack knife on a target object is low. The chip removing device comprises a cutter handle, a jack cutter, a chip removing mechanism and a transmission mechanism, wherein the jack cutter is arranged on the cutter handle and is used for processing a target object; the chip removing mechanism is arranged in the jack knife and is used for removing chips in the jack knife; the transmission mechanism is arranged on the cutter handle and is used for providing power for the chip removal mechanism and the jack cutter. The chip removing mechanism is arranged, so that chips in the jack knife can be timely discharged through the chip removing mechanism, the jack knife can continuously process a target object, the time of manual chip removing is saved, and the processing efficiency of the device on the target object can be greatly improved.
Description
Technical Field
The application relates to the technical field of jack devices, in particular to an automatic chip removal ultrasonic jack device.
Background
The paper-based honeycomb material is a material with high specific strength and high specific stiffness, and is commonly used as a filling material in an aerospace structure due to low density, strong heat insulation performance, high axial strength and the like. Paper-based honeycomb materials are required to be installed into a particular structure in applications, and therefore often require a large number of through holes as mounting holes, which require corresponding jack devices to machine the mounting holes.
However, prior art jack devices have not been efficient enough to machine mounting holes in a target object, such as paper-based honeycomb materials.
Disclosure of Invention
The application mainly aims to provide an automatic chip removal ultrasonic jack device, and aims to solve the technical problem that in the prior art, the jack device is low in processing efficiency on a target object.
To achieve the above object, the present application provides an automatic chip removing ultrasonic jack device comprising:
a knife handle;
the jack knife is arranged on the knife handle and is used for processing a target object;
the chip removing mechanism is arranged in the jack knife and is used for removing chips in the jack knife;
the transmission mechanism is arranged on the cutter handle and is used for providing power for the chip removal mechanism and the jack cutter.
Optionally, the chip removal mechanism includes:
the electromagnetic core is fixedly arranged in the jack knife;
the armature is arranged at one end, close to the target object, of the jack knife;
the coil is arranged on the electromagnetic core, and is used for enabling the electromagnetic core to generate magnetism after being electrified, and the magnetism is used for adsorbing the armature;
the reset piece is connected between the electromagnetic core and the armature, and is used for enabling the armature to slide in the jack knife so that the armature can remove chips in the jack knife.
Optionally, the return member includes a return spring, and the return spring is connected between the electromagnetic core and the armature.
Optionally, the jack knife comprises a cylindrical section and a cylindrical section which are integrally formed, the cylindrical section is connected with the knife handle, and the cylindrical section is used for processing the target object;
the chip removal mechanism is mounted within the cylindrical section.
Optionally, a main cutting edge is provided on the cylinder section, and the main cutting edge is used for processing the target object.
Optionally, a rear cutter surface is arranged on the outer cylindrical surface of the cylindrical section, and a main front cutter surface is arranged on the inner conical surface of the cylindrical section;
the primary rake surface is used to cause the chips to be pressed and the target object to be unprocessed without being pressed.
Optionally, a step surface is provided on the cylindrical section, and the step surface is used for separating the clearance surface and the outer cylindrical surface of the cylindrical section, so as to reduce the contact area between the clearance surface and the processed surface of the target object.
Optionally, the main cutting edge comprises an axial cutting edge and a lateral cutting edge, and the main rake surface comprises a first rake surface and a second rake surface;
the cylinder section is provided with an incomplete cylinder for reducing the contact area of the axial cutting edge with the target object, the first rake surface with the target object, and for laterally cutting the lateral cutting edge and the second rake surface.
Optionally, the main cutting edge is provided with saw teeth, and the saw teeth are used for cutting off the fiber structure of the target object.
Optionally, the tool handle comprises a mounting part, and the mounting part is provided with a transducer and a horn;
the energy converter is used for converting the electric energy provided by the transmission mechanism into vibration information, and the amplitude transformer is used for transmitting the vibration information to the jack knife so that the jack knife can process the target object.
Through the technical scheme, the application has the following beneficial effects at least realized:
the application provides an automatic chip removal ultrasonic jack device which comprises a tool handle, a jack tool, a chip removal mechanism and a transmission mechanism, wherein the jack tool is arranged on the tool handle and is used for processing a target object; the chip removing mechanism is arranged in the jack knife and is used for removing chips in the jack knife; the transmission mechanism is arranged on the cutter handle and is used for providing power for the chip removal mechanism and the jack cutter.
When a target object (such as a paper-based honeycomb material) needs to be processed (such as drilled), the jack knife is aligned to the target object, and then power is provided for the jack knife through the transmission mechanism, so that the jack knife drills the target object, and in the process that the jack knife drills the target object, chips of the target object can enter the jack knife; meanwhile, the chip removing mechanism is powered by the transmission mechanism, so that chips in the jack knife are continuously discharged by the chip removing mechanism. That is, the chip removing mechanism is arranged, chips in the jack knife can be timely discharged through the chip removing mechanism, so that the jack knife can continuously process a target object, the time of manual chip removing is saved, and the processing efficiency of the device on the target object can be greatly improved.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. Like elements or portions are generally identified by like reference numerals throughout the several figures. In the drawings, elements or portions thereof are not necessarily drawn to scale.
FIG. 1 is a schematic view of an automatic chip removal ultrasonic receptacle device provided in an embodiment of the present application;
FIG. 2 is a schematic diagram of a return spring in a chip ejection mechanism according to an embodiment of the present application;
FIG. 3 is a schematic view of a return spring in the chip removing mechanism according to an embodiment of the present application;
FIG. 4 is a schematic diagram of an automatic chip removal jack knife cutting process provided by an embodiment of the present application;
FIG. 5 is a schematic view of a return spring in a chip ejection mechanism according to an embodiment of the present application compressed by chips;
FIG. 6 is a schematic view of a return spring in a chip ejection mechanism according to an embodiment of the present application when the return spring is restored to its original state to eject chips;
FIG. 7 is a schematic view of a cylindrical segment provided with a step surface according to an embodiment of the present application;
FIG. 8 is a schematic view of a cylinder segment provided with an incomplete cylinder according to an embodiment of the present application;
fig. 9 is a schematic view of a main cutting edge provided with serrations according to an embodiment of the present application.
Reference numerals: 110. a mounting part; 120. a transducer; 130. a horn; 131. a spiral groove; 210. a transmission mechanism; 230. a rectifying circuit; 300. a jack knife; 310. a cylindrical section; 320. a cylindrical section; 322. a rear cutter surface; 323. a main cutting edge; 3231. an axial cutting edge; 3232. a lateral cutting edge; 324. a main rake face; 3241. a first rake surface; 3242. a second rake surface; 400. a chip removal mechanism; 410. an electromagnetic core; 420. a coil; 430. a return spring; 440. an armature; 510. a processed material; 520. and (5) cutting.
The achievement of the objects, functional features and advantages of the present application will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
In the present application, unless specifically stated and limited otherwise, the terms "connected," "affixed," and the like are to be construed broadly, and for example, "affixed" may be a fixed connection, a removable connection, or an integral body; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present application, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" as it appears throughout includes three parallel schemes, for example "A and/or B", including the A scheme, or the B scheme, or the scheme where A and B are satisfied simultaneously. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present application.
The paper-based honeycomb material is a material with high specific strength and high specific stiffness, and is commonly used as a filling material in an aerospace structure due to low density, strong heat insulation performance, axial strength and the like. The paper-based honeycomb material needs to be installed in a specific structure in application, so a large number of through holes are often required to be used as installation holes, the surface quality is reduced, burrs are generated and the like when the paper-based honeycomb material is drilled by traditional drilling and ultrasonic drilling, and the hole making efficiency is low. Ultrasonic processing is an effective way of processing paper-based honeycomb materials, and by applying ultrasonic frequency vibration to the sheet knife, the sheet knife can finish the common characteristic processing of the paper-based honeycomb materials with high quality and high efficiency.
The common ultrasonic cutters for paper-based honeycomb materials are an ultrasonic dagger (also called an ultrasonic straight blade) and an ultrasonic disc blade, and at present, a classical ultrasonic processing system, namely an ultrasonic disc blade and an ultrasonic dagger blade, are used for forming holes, two or three cutters are needed, ultrasonic hole forming can be completed only by four times of cutting respectively, the profile of a formed through hole and the like are realized by virtue of a cutting path, the processing efficiency is low, and the quality of the through hole cannot be ensured. The traditional methods for drilling the paper-based honeycomb rely on ultrasonic drill bits to drill or use jack cutters, and the methods can finish the feature processing of the through holes of the paper-based honeycomb materials, but the drill bits or the traditional jack cutters crush the paper-based honeycomb materials in the cutting process, so that the damage of fiber structures and the collapse of filling materials are easily caused, and simultaneously, the cutting chips of the paper-based honeycomb materials are torn off from the surface of the holes to be processed in the drill bit drilling process, so that the tearing of the fiber structures and the damage of unit cells are easily generated, and the processing with high quality and high efficiency is not facilitated. The rotary jack knife can realize quick hole making, but the surface quality after processing by the method cannot be ensured because of effective auxiliary means such as rotary motion cutting, ultrasonic intermittent cutting and the like are not needed, chips remain in the knife after each processing, the next hole making can be carried out after manual cleaning, and the machine tool efficiency is low; some jack cutters also need to be cleaned manually to perform the next hole making, and have larger lateral cutting force, which may cause tearing, burrs, collapse and the like of the paper-based honeycomb lattice. In summary, current jack devices are not efficient enough to machine mounting holes in a target object, such as paper-based honeycomb materials.
In order to solve the above technical problems, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, but not all embodiments.
Referring to fig. 1, fig. 1 is a schematic view of an automatic chip removing ultrasonic jack device according to an embodiment of the present application; the embodiment provides an automatic chip removal ultrasonic jack device, which comprises a cutter handle, a jack cutter 300, a chip removal mechanism 400 and a transmission mechanism 210, wherein the jack cutter 300 is arranged on the cutter handle, and the jack cutter 300 is used for processing a target object; the chip removing mechanism 400 is installed in the jack knife 300, and the chip removing mechanism 400 is used for removing chips 520 in the jack knife 300; the transfer mechanism 210 is mounted on the shank, and the transfer mechanism 210 is configured to power the chip ejection mechanism 400 and the jack knife 300.
In this embodiment, the transmission mechanism 210 is a non-contact energy transmission structure, the transmission mechanism 210 includes a rectifying circuit 230, and the rectifying circuit 230 connects the transmission mechanism 210 with the chip removing mechanism 400, so that the transmission mechanism 210 can provide power for the chip removing mechanism 400; the jack knife 300 is an ultrasonic jack knife; the knife handle is an ultrasonic knife handle, the alternating current provided by the transmission mechanism 210 drives the piezoelectric ceramics to generate ultrasonic frequency vibration, and the knife handle provides torsional vibration and longitudinal vibration for the jack knife 300 so as to enable the jack knife 300 to process a target object; the connection between the transfer mechanism 210 and the chip ejection mechanism 400, the jack knife 300 is known to those skilled in the art. Specifically, when a target object (for example, a paper-based honeycomb material is taken as an example in the application) needs to be processed (such as drilling), the jack knife 300 is aligned to the target object, and then the power is provided for the jack knife 300 through the transmission mechanism 210, so that the jack knife 300 drills the target object, and in the process of drilling the target object by the jack knife 300, chips 520 of the target object can enter the jack knife 300; at the same time, the chip removing mechanism 400 is powered by the transmission mechanism 210, so that the chip removing mechanism 400 continuously discharges chips 520 in the jack knife 300. That is, since the chip removing mechanism 400 is provided in the device, chips 520 in the jack knife 300 can be timely discharged through the chip removing mechanism 400, so that the jack knife 300 can continuously process a target object, the time of manual chip removing is saved, and the processing efficiency of the device on the target object can be greatly improved.
In some embodiments, as shown in fig. 2-3, fig. 2 is a schematic diagram illustrating compression of a return spring in a chip removing mechanism according to an embodiment of the present application; fig. 3 is a schematic diagram of a return spring in the chip removing mechanism according to an embodiment of the present application. A preferred structure of the chip removing mechanism is given, that is, the chip removing mechanism 400 includes an electromagnetic core 410, an armature 440, a coil 420 and a reset member, the electromagnetic core 410 is fixedly installed in the jack knife 300; the armature 440 is mounted at an end of the jack knife 300 near the target object; the coil 420 is mounted on the electromagnetic core 410, and the coil 420 is used for generating magnetism to the electromagnetic core 410 after being electrified, and the magnetism is used for adsorbing the armature 440; the return element is connected between the electromagnetic core 410 and the armature 440, and is used for enabling the armature 440 to slide in the jack knife 300, so that the armature 440 can remove the chips 520 in the jack knife 300.
In this embodiment, the chip removing mechanism 400 further includes a magnetizer, the reset element includes a reset spring 430, and the reset spring 430 is connected between the electromagnetic core 410 and the armature 440; when the ultrasonic hole is made, the transmission mechanism 210 is electrified, the electromagnetic core 410 has an adsorption effect on the armature 440, the armature 440 is adsorbed on the electromagnetic core 410, and at the moment, the return spring 430 is compressed; after ultrasonic hole making is completed, the transmission mechanism 210 is powered off, the electromagnet core 410 loses magnetism, and the armature 440 and the chips 520 are ejected by the return spring 430, so that the chips 520 in the jack knife 300 are removed. Electromagnetic core 410 and armature 440 in chip removing mechanism 400 are kerfed and then bonded by non-magnetic glue, so as to reduce the eddy current influence caused by high-frequency current; the elastic force of the return spring 430 in the chip removing mechanism 400 is larger than the friction force to be overcome when the chip 520 is ejected, and the return spring 430 can quickly push the armature 440 and the chip 520 out of the jack knife 300 after the electromagnetic core 410 is powered off; the attraction force of the electromagnetic core 410 to the armature 440 at any position in the jack knife 300 after the power is on is larger than the shrinkage resistance force of the return spring 430, and the electromagnetic core 410 can quickly absorb the armature 440 back to the initial position after the power is on. 4-6, FIG. 4 is a schematic diagram of an automatic chip removal jack knife cutting process according to an embodiment of the present application; FIG. 5 is a schematic view of a return spring compressed by cuttings in a cuttings removal mechanism provided by an embodiment of the present application; fig. 6 is a schematic view of the return spring in the chip removing mechanism according to the embodiment of the present application, which is restored to its original state to discharge chips.
(1) In the first process, the vibration speed of the ultrasonic longitudinal vibration is consistent with the feeding direction, the jack knife 300 contacts the paper-based honeycomb material, and the jack knife 300 extrudes the paper-based honeycomb material to generate elastic deformation as the ultrasonic longitudinal vibration speed is far greater than the feeding speed, so that the paper-based honeycomb material reaches the fracture limit deformation and is cut off, and at the moment, the jack knife 300 does not reach the maximum value of the longitudinal vibration speed, continues to extrude the paper-based honeycomb material and fracture more paper-based honeycomb material;
(2) In the second process, the vibration speed of the ultrasonic longitudinal vibration is opposite to the feeding direction, the relative speed of the jack knife 300 and the paper-based honeycomb material is negative, the jack knife 300 has a movement trend of leaving the paper-based honeycomb material, the paper-based honeycomb material is elastically restored to a non-deformation state, and at the moment, the jack knife 300 does not reach the maximum value of the negative longitudinal vibration speed and continues to leave the paper-based honeycomb material;
(3) In the third process, the vibration speed of the ultrasonic longitudinal vibration is opposite to the feeding direction, the relative speed of the jack knife 300 and the paper-based honeycomb material is negative, the paper-based honeycomb material is separated from the jack knife 300, and the internal stress is concentrated to a weak point in the separation time, and the next first process is waited for cutting. When in processing, the three processes are repeated until the jack knife 300 completely penetrates through the paper-based honeycomb material, the paper-based honeycomb material inside the jack knife 300 is extruded and deformed, and is completely separated from the paper-based honeycomb material outside the jack knife 300, so that chips 520 are formed; the chip 520 in the jack knife 300 is discharged timely through the chip discharging mechanism 400, so that the jack knife 300 can continuously process a target object, and further the processing efficiency of the target object can be improved; meanwhile, since the chips 520 are discharged in time, the paper-based honeycomb material outside the pocket knife 300 is not extruded by the chips 520, so that the quality of the machined surface can be ensured.
In some embodiments, as shown in fig. 2, a preferred structure of the jack knife 300 is provided, that is, the jack knife 300 includes a cylindrical section 310 and a cylindrical section 320 integrally formed, the cylindrical section 310 is connected with the knife handle, and the cylindrical section 320 is used for machining the target object; the chip ejection mechanism 400 is installed in the cylinder section 320; a main cutting edge 323 is arranged on the cylinder section 320, and the main cutting edge 323 is used for processing the target object; a rear cutter surface 322 is arranged on the outer cylindrical surface of the cylindrical section 320, and a main front cutter surface 324 is arranged on the inner conical surface of the cylindrical section 320; the primary rake surface 324 serves to cause the chips 520 to be pressed and the target object to be unprocessed without being pressed.
In this embodiment, the cylindrical section 310 of the jack knife 300 is connected with the knife handle by a general method such as hot-set or ER chuck or welding or screw connection or morse taper, the jack knife 300 is composed of the cylindrical section 310 for connection and the cylindrical section 320 for cutting, the end of the cylindrical section 320 is a main cutting edge 323, the outer cylindrical surface of the cylindrical section 320 is a rear cutting surface 322, the inner conical surface of the cylindrical section 320 is a main front cutting surface 324, the main front cutting surface 324 ensures that the paper-based honeycomb material chips 520 are extruded during the cutting process, and the processed surface is not extruded; the length of the cylindrical section 320 of the jack knife 300 is greater than the sum of the maximum depth of the through hole to be machined and the axial length of the chip removing mechanism 400 when the armature 440 is electrically attracted; the length of the cylindrical section 310 of the jack knife 300 can be adjusted to ensure that the vibration mode of the jack knife 300 is longitudinal vibration or longitudinal-torsional compound vibration, so that the jack knife 300 can perform better processing on a target object.
In some embodiments, as shown in fig. 7, fig. 7 is a schematic diagram of a cylinder section provided with a step surface according to an embodiment of the present application; the cylindrical section 320 is provided with a step surface for separating the clearance surface 322 from the outer cylindrical surface of the cylindrical section 320, so as to reduce the contact area between the clearance surface 322 and the machined surface of the target object.
In this embodiment, the step surface is disposed on the cylindrical section 320 of the jack knife 300, so that the contact area between the rear knife surface 322 and the processed surface of the paper-based honeycomb material can be reduced by separating the rear knife surface 322 from the outer cylindrical surface of the cylindrical section 320, and the area of the rear knife surface 322 required to be processed with high precision by the jack knife 300 can be reduced, thereby saving the cost.
In some embodiments, as shown in fig. 8, fig. 8 is a schematic diagram of a cylinder segment 320 provided with an incomplete cylinder according to an embodiment of the present application; the main cutting edge 323 includes an axial cutting edge 3231 and a lateral cutting edge 3232, and the main rake surface 324 includes a first rake surface 3241 and a second rake surface 3242; the cylinder segment 320 is provided with an incomplete cylinder for reducing the contact area of the axial cutting edge 3231 with the target object, the first rake surface 3241 with the target object, and for laterally cutting the lateral cutting edge 3232 and the second rake surface 3242 with the lateral chip 520.
In this embodiment, the cylindrical section 320 of the jack knife 300 is configured as an incomplete cylinder, so that the contact area between the axial cutting edge 3231 and the first rake face 3241 and the paper-based honeycomb can be reduced in the cutting process, the axial acting force is reduced, and meanwhile, the lateral cutting edge 3232 and the second rake face 3242 perform lateral cutting to generate a certain lateral cutting force, so that better processing can be performed on the target object.
In some embodiments, as shown in fig. 9, fig. 9 is a schematic diagram of a main cutting edge 323 provided by an embodiment of the present application provided with serrations; the main cutting edge 323 is provided with serrations for cutting the fibrous structure of the target object.
In this embodiment, the saw teeth are machined on the main cutting edge 323 so as to cut the fiber structure, and prevent the fiber structure from locking to cause cutter abrasion, damage to the machined surface, and the like.
In summary, the application comprehensively considers the continuous hole making requirement of a large number of through holes for actually producing the paper-based honeycomb material and the ultrasonic processing technology requirement of cutting rather than crushing, and provides the automatic chip removal jack knife device.
The following is an example of an ultrasonic jack device to which the present application is applied:
the paper-based honeycomb material is provided with through holes, the diameter of the through holes is 25 mm, the depth of the through holes is 20 mm, the breaking limit deformation of the paper-based honeycomb material is 5 mu m, and the number of the continuous holes is 70. According to the above characteristics, the automatic chip removing jack knife device is developed according to the present specification, the ultrasonic equipment provides longitudinal vibration and torsional vibration for the jack knife 300, the length of the cylindrical section 320 of the jack knife 300 is 38 mm, the length of the cylindrical section 310 is 21.3 mm, the outer diameter is 25 mm, the included angle between the front knife surface and the rear knife surface 322 is 15 degrees, the working current of the jack knife 300 system is about 0.8A, the longitudinal vibration amplitude of the jack knife 300 is 10 μm, the torsional vibration amplitude is 8 μm, and the vibration frequency is 20000 Hz. According to the above characteristics, according to the chip removing mechanism 400 provided in the present specification, the elastic coefficient of the return spring 430 is 0.3N/mm, the adsorption force of the electromagnetic core 410 to the armature 440 at the limit position, namely, the position of 30 mm is 3N, as the return spring 430 is adsorbed close to the electromagnetic core 410, the elastic force increases linearly with the compression amount, but the adsorption force increases in a convex function form and is always greater than the elastic force, so that the armature 440 can be rapidly adsorbed to the return spring 430 and kept in a stable adsorption state when power is supplied; the friction force required to be overcome for ejecting the chip 520 with the diameter of about 25 and mm is about 2 and N, and the return spring 430 can rapidly eject the chip 520 after power failure, so that the electromagnetic core 410 and the armature 440 are subjected to kerf non-magnetic bonding treatment, and the influence of eddy current is reduced.
The jack knife 300 cuts the paper-based honeycomb material, the ultrasonic equipment is electrified, the non-contact energy transmission structure transmits electric energy from the power supply to the ultrasonic knife handle and the chip removal mechanism 400, the knife handle provides ultrasonic vibration for the jack knife 300, and the electromagnetic core 410 in the chip removal mechanism 400 adsorbs the armature 440 to the electromagnetic core 410; the jack knife 300 contacts and presses the paper-based honeycomb material, intermittent cutting occurs, and the following three processes are repeated continuously, keeping the electromagnetic core 410 in a state of adsorbing the armature 440:
(1) In the first process, the vibration speed of the ultrasonic longitudinal vibration is consistent with the feeding direction, the jack knife 300 contacts the paper-based honeycomb material, and the jack knife 300 extrudes the paper-based honeycomb material to generate elastic deformation to reach the breaking limit deformation of 5 mu m and is cut off because the ultrasonic longitudinal vibration speed is far greater than the feeding speed, at the moment, the jack knife 300 does not reach the maximum value of the longitudinal vibration speed, and continues to extrude the paper-based honeycomb material until the amplitude reaches 10 mu m and more paper-based honeycomb materials are broken;
(2) In the second process, the vibration speed of the ultrasonic longitudinal vibration is opposite to the feeding direction, the relative speed of the jack knife 300 and the paper-based honeycomb material is negative, the jack knife 300 has a movement trend of leaving the paper-based honeycomb material, the paper-based honeycomb material is elastically restored to a non-deformation state, and at the moment, the jack knife 300 does not reach the maximum value of the negative longitudinal vibration speed and continues to leave the paper-based honeycomb material;
(3) In the third process, the vibration speed of the ultrasonic longitudinal vibration is opposite to the feeding direction, the relative speed of the jack knife 300 and the paper-based honeycomb material is negative, the paper-based honeycomb material is separated from the jack knife 300, and the internal stress is concentrated to a weak point in the separation time, and the next first process is waited for cutting.
The above three processes are repeated in a certain cycle until the cutting edge of the jack knife 300 exceeds the bottom surface of the paper-based honeycomb material, cutting the paper-based honeycomb material into the processed material 510 and the chips 520.
Lifting the jack knife 300 under the condition that ultrasonic vibration is not stopped, enabling the jack knife 300 to leave the paper-based honeycomb material for completing the hole making of the through hole, and completing the processing of the through hole; the non-contact energy transmission structure is stopped from being powered, the tool shank stops vibrating, the electromagnetic core 410 in the chip removing mechanism 400 loses magnetism, the return spring 430 pushes the armature 440 out of the jack knife 300, and the armature 440 pushes the chips 520 out of the jack knife 300.
And repeating the above process to finish the processing of the rest sixty-nine through holes without suspending the machine tool for manual chip removal.
The foregoing description is only of the preferred embodiments of the present application, and is not intended to limit the scope of the application, but rather is intended to cover any equivalents of the structures or equivalent processes disclosed herein or in the alternative, which may be employed directly or indirectly in other related arts.
Claims (9)
1. An automatic chip removal ultrasonic jack device, comprising:
a knife handle;
the jack knife is arranged on the knife handle and is used for processing a target object;
the chip removing mechanism is arranged in the jack knife and is used for removing chips in the jack knife;
the transmission mechanism is arranged on the cutter handle and is used for providing power for the chip removal mechanism and the jack cutter;
the chip removal mechanism includes:
the electromagnetic core is fixedly arranged in the jack knife;
the armature is arranged at one end, close to the target object, of the jack knife;
the coil is arranged on the electromagnetic core, and is used for enabling the electromagnetic core to generate magnetism after being electrified, and the magnetism is used for adsorbing the armature;
the reset piece is connected between the electromagnetic core and the armature, and is used for enabling the armature to slide in the jack knife so as to enable the armature to remove chips in the jack knife;
the electromagnetic core is bonded with the jack knife through nonmagnetic glue, and the armature is bonded with the reset piece through nonmagnetic glue.
2. The automatic chip removing ultrasonic receptacle device of claim 1, wherein the return member comprises a return spring connected between the electromagnet core and the armature.
3. The automatic chip removing ultrasonic jack device of claim 1, wherein the jack knife comprises an integrally formed cylindrical section and a cylindrical section, the cylindrical section being connected to the handle, the cylindrical section being for machining the target object;
the chip removal mechanism is mounted within the cylindrical section.
4. An automatic chip removing ultrasonic receptacle device according to claim 3, wherein said cylindrical section is provided with a main cutting edge for machining said target object.
5. The automatic chip removal ultrasonic jack device of claim 4, wherein a rear face is provided on an outer cylindrical surface of the cylindrical section, and a main front face is provided on an inner conical surface of the cylindrical section;
the primary rake surface is used to cause the chips to be pressed and the target object to be unprocessed without being pressed.
6. The automatic chip removing ultrasonic jack device of claim 5, wherein a stepped surface is provided on the cylindrical section for separating the clearance surface from an outer cylindrical surface of the cylindrical section to reduce a contact area of the clearance surface with a processed surface of the target object.
7. The automatic chip removal ultrasonic receptacle device of claim 5, wherein the main cutting edge comprises an axial cutting edge and a lateral cutting edge, the main rake surface comprising a first rake surface and a second rake surface;
the cylinder section is provided with an incomplete cylinder for reducing the contact area of the axial cutting edge with the target object, the first rake surface with the target object, and for laterally cutting the lateral cutting edge and the second rake surface.
8. The automatic chip removing ultrasonic receptacle device according to claim 4, wherein the main cutting edge is provided with serrations for cutting the fibrous structure of the target object.
9. The automatic chip removing ultrasonic jack device of any one of claims 1 to 8, wherein the shank includes a mounting portion having a transducer and horn mounted thereon;
the energy converter is used for converting the electric energy provided by the transmission mechanism into vibration information, and the amplitude transformer is used for transmitting the vibration information to the jack knife so that the jack knife can process the target object.
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| CN202310668668.2A CN116373029B (en) | 2023-06-07 | 2023-06-07 | Automatic chip removal ultrasonic jack device |
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| CN116373029A (en) | 2023-07-04 |
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