CN116360810A - Rolling code burning method for programmable integrated circuit element - Google Patents
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Abstract
The invention relates to the field of programmable chip burning, in particular to a programmable integrated circuit element rolling code burning method; and (5) performing rolling code burning on the element in the integrated circuit wafer level middle measurement stage. The research and development period and the cost of the self-made burner are reduced; simplifying the production flow of the product and reducing the risk of mistakes in the production process of the product. Three blocks are established: the system comprises a rolling code configuration module, a burning module and a rolling code recovery module, wherein the rolling code configuration module is in communication connection with the burning module of the test machine, and the burning module is in communication connection with the rolling code recovery module; rolling code configuration templates: storing a text file in the engineering root directory for storing rolling code configuration; and a burning module: based on dynamic memory modification statement provided by the tester, according to the rolling code configuration parameters, unique rolling code values are burnt for the plurality of station integrated circuit elements according to the programmable chip burning time sequence; rolling code recycling module: the method is used for recovering the wasted rolling codes and participating in the next round of burning test.
Description
Technical Field
The invention relates to the field of programmable chip burning, in particular to a programmable integrated circuit element rolling code burning method.
Background
The existing application market needs that a plurality of electronic products have unique identification, and the electronic products range from early remote controllers to the existing internet of things products. Such a need can be achieved by burning a unique serial number in the internal memory area of the chip.
The current market mainly solves the problems by self-making a writer, and is matched with a special upper computer to configure rolling code parameters, and the rolling code is written into a specified area inside a chip by the writer. According to the method, on one hand, manufacturers are required to self-manufacture a special burner and a matched upper computer, so that the research and development cost of products is increased; on the other hand, the chip burning process is required to be added, and the production cost of the product is increased. The chip burning mode cannot meet the high-efficiency development and production requirements of products.
For example, the rolling code burning of the chip is realized by a homemade special burner disclosed in Chinese patent CN 105094925B, the basic principle is as shown in figure 1, and the system comprises one or more universal one-time programmable chips; the upper computer is used for setting the rolling code parameters and generating a burning instruction based on the set rolling code parameters, wherein the rolling code parameters comprise a specified value, a minimum value, a maximum value and a stepping value of the rolling code; the burner is provided with an initial firmware program of the general one-time programmable chip, receives a burning instruction from the upper computer, analyzes the burning instruction to obtain a specified value, a minimum value, a maximum value and a stepping value of a rolling code, forms a new firmware program according to the rolling code parameter and the initial firmware program, and burns the new firmware program into the general one-time programmable chip. Thus, the software of the burner is modified to realize the burning rolling code of the universal one-time programmable chip.
However, in such a mode, manufacturers need to self-control a burner and a matched upper computer, so that the research and development cost of the product is increased; and secondly, a manufacturer needs to increase the chip burning production flow, so that the production cost is increased, and the error risk in the production process is increased.
In summary, how to simplify the production process of the product, control the research and development costs, and perform rolling code burning in the testing stage of the integrated circuit wafer is still a technical problem to be solved.
Disclosure of Invention
In view of the problems mentioned in the background art, an object of the present invention is to provide a method for burning rolling codes of programmable integrated circuit elements; and (5) performing rolling code burning on the element in the integrated circuit wafer level middle measurement stage. On one hand, the research and development period and cost of the self-made burner are reduced; in addition, the production flow of the product is simplified, and the risk of mistakes in the production process of the product is reduced.
The technical aim of the invention is realized by the following technical scheme: a programmable integrated circuit element rolling code burning method comprises the following steps:
step one, three program blocks are established: the system comprises a rolling code configuration module, a burning module and a rolling code recovery module, wherein the rolling code configuration module is in communication connection with the burning module of a plurality of test machines, and the burning module is in communication connection with the rolling code recovery module;
step two, configuring a rolling code configuration template: storing a text file in the engineering root directory for storing rolling code configuration;
comprising the following steps: the test engineering comprises a text processing function, a file with a designated name is indexed, related configuration is obtained and stored in a designated variable, and the same engineering can realize simultaneous burning of a plurality of machines by obtaining different rolling code files;
step three, configuring a burning module: based on dynamic memory modification statement provided by the tester, according to the rolling code configuration parameters, unique rolling code values are burnt for the plurality of station integrated circuit elements according to the programmable chip burning time sequence;
step four, configuring a rolling code recovery module: the method is used for recovering the wasted rolling codes and participating in the next round of burning test.
Preferably, when the rolling code configuration template starts to run, firstly judging whether the rolling code file is normally opened, if the rolling code file can be normally opened, acquiring the rolling code configuration, updating the current value of the rolling code, configuring the test engineering parameters, closing the rolling code file after the test engineering parameters are configured, ending the rolling code configuration step, and if the rolling code file cannot be normally opened, directly ending the rolling code configuration step and reporting errors of the test system.
Preferably, in the testing process of the rolling code recovery module, an abnormal chip exists, so that the rolling code allocated to the abnormal chip is not actually used, the testing program monitors the abnormal burning chip, and the wasted rolling code is recovered for participating in the next round of burning test.
In summary, the invention has the following advantages: the programmable integrated circuit element rolling code burning method integrates chip rolling code burning and integrated circuit element in-process measurement, reduces the research and development period of self-made burner, simplifies the production flow of products, and reduces the risk of errors in the production process of the products.
The method can realize simultaneous measurement and rolling code burning of integrated circuit elements at multiple stations, and greatly improves the production efficiency.
Drawings
FIG. 1 is a diagram illustrating a conventional rolling code burning process;
FIG. 2 is a schematic diagram of a system architecture according to the present invention;
FIG. 3 is a schematic diagram illustrating the steps for opening a rolling code according to the present invention;
FIG. 4 is a schematic diagram illustrating the steps of rolling code recovery according to the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The invention relates to a testing machine-based integrated circuit element rolling code burning method, which mainly aims at: and (5) performing rolling code burning on the element in the integrated circuit wafer level middle measurement stage. On one hand, the research and development period and cost of the self-made burner are reduced; in addition, the production flow of the product is simplified, and the risk of mistakes in the production process of the product is reduced.
The burning method is nested in the middle test program, and realizes the rolling code burning while testing the integrated circuit element. The system recovers and reuses the rolling code allocated to the abnormal element, and maximizes the rolling code utilization. And can realize the simultaneous test of multiple machine stations, multistation, improved production efficiency greatly.
The whole burning system is nested in the middle test program, after the middle test project is finished, the test program obtains the configuration of the rolling code, and the rolling code is burned to the appointed storage area of the integrated circuit element through the test machine according to the burning time sequence of the programmable chip.
The burning system comprises three program modules: the device comprises a rolling code configuration module, a burning module and a rolling code recovery module.
Rolling code configuration templates: the project root directory stores a text file for storing rolling code configuration, comprising: the test engineering comprises a text processing function, a file with a designated name is indexed, related configuration is obtained, and the related configuration is stored in a designated variable. The same project can realize the simultaneous burning of a plurality of machines by acquiring different rolling code files.
Main program of rolling code configuration template: the part of the program is developed based on the environment of the tester and is programmed by adopting the S50/S100 special statement of the tester. And monitoring the text read-write state of the rolling code and the configuration condition of the rolling code.
@@PLAN GDM_PROCESS
SITE_SEQUENCE = OFF;
DISABLE_BY_MARK_NO = NULL;
S_SETUP_FILE = c:\set.dat;
REMARK = GDM_PROCESS;
char buffer[100];
get_gdm_data();
C_COMPARE(_C_file_rd_res, UP_LIMIT=0, DOWN_LIMIT=0, UNIT=num, LOG_ALIAS=file_rd_res_get, LOG_UNIT=num);
C_COMPARE(_C_ch_rd_res, UP_LIMIT=0, DOWN_LIMIT=0, UNIT=num, LOG_ALIAS=ch_rd_res_get, LOG_UNIT=num);
C_ASSIGN(GB3, _C_gtm_data);
sprintf(buffer,"gtm_data_rd = %f", GB[2]);
WRITELN(buffer);
C_COMPARE(GB3, UP_LIMIT=16777215, DOWN_LIMIT=1, UNIT=num, LOG_ALIAS=gtm_data_rd, LOG_UNIT=num);
change_gdm_data();
C_COMPARE(_C_file_rd_res, UP_LIMIT=0, DOWN_LIMIT=0, UNIT=num, LOG_ALIAS=file_rd_res_change, LOG_UNIT=num);
C_ASSIGN(GB3, _C_gtm_data);
sprintf(buffer,"gtm_data_wr = %f", GB[2]);
WRITELN(buffer);
C_COMPARE(GB3, UP_LIMIT=16777215, DOWN_LIMIT=1, UNIT=num, LOG_ALIAS=gtm_data_wr, LOG_UNIT=num);
CONDITION
IF_FAIL
REJECT_BIN=31;
@@END_PLAN
get_gdm_data function: based on the C-standard library functions (fopen, fread, and fclose), an 8-bit rolling code initial value is obtained from the k1_gdm text file. According to the burning requirement, the configuration of the rolling codes obtained from different text files is different.
void get_gdm_data(void)
{
FILE *fp;
FILE *fp_temp;
char ch[100] = {0};
for(int i = 0;i<= 7;i++)
{
ch[i] = 0x30;
}
fp_temp = fopen("T:\\K1_GDM.txt", "r");
if(fp_temp == NULL)
{
_C_file_rd_res = 1;
}
else
{
fp = fp_temp;
_C_file_rd_res = 0;
fread(ch, 8, 1, fp);
_C_gtm_data = 0;
for(int i = 0;i<= 7;i++)
{
if((ch[i]<0x30) || (ch[i]>0x39))
{
_C_ch_rd_res = 1;
break;
}
else
{
_C_ch_rd_res = 0;
_C_gtm_data *= 10;
_C_gtm_data += ch[i]-0x30;
}
}
}
fclose(fp);
}
change_gdm_data function: based on the C-standard library functions (fopen, sprintf, fprintf and fclose), the current value is calculated from the rolling code minimum, maximum and step values and updated into the k1_gdm text file. The simultaneous burning of the rolling codes of multiple probe stations can be realized by matching with the get_gdm_data function.
void change_gdm_data(void)
{
char tmp_str[100]={0};
char ch[9]={0};
FILE *fp;
FILE *fp_temp;
for(int i = 0;i<= 99;i++)
{
tmp_str[i] = 0;
}
_C_gtm_data += 4;
if(_C_gtm_data>= 16777216)
{
_C_gtm_data = 1;
}
ch[0] = (char)((_C_gtm_data / 10000000)+0x30);
ch[1] = (char)(((_C_gtm_data%10000000) / 1000000)+0x30);
ch[2] = (char)(((_C_gtm_data%1000000) / 100000)+0x30);
ch[3] = (char)(((_C_gtm_data%100000) / 10000)+0x30);
ch[4] = (char)(((_C_gtm_data%10000) / 1000)+0x30);
ch[5] = (char)(((_C_gtm_data%1000) / 100)+0x30);
ch[6] = (char)(((_C_gtm_data%100) / 10)+0x30);
ch[7] = (char)((_C_gtm_data%10)+0x30);
ch[8] = 0;
fp_temp = fopen("T:\\K1_GDM.txt", "w");
if(fp_temp == NULL)
{
_C_file_rd_res = 1;
}
else
{
fp = fp_temp;
_C_file_rd_res = 0;
sprintf(tmp_str,"%s", ch);
fprintf(fp, tmp_str);
}
fclose(fp);
}
And a burning module: based on the dynamic memory modification statement provided by the tester, unique rolling code values are burnt for the plurality of station integrated circuit elements according to the rolling code configuration parameters and the programmable chip burning time sequence.
And a burning module: the S50/S100 test machine supports parallel sentences, so that the simultaneous operation of multi-station elements can be realized. The machine can support the statement of 'LOGIC_WRITE_PATTERN_MEMORY', and can realize the dynamic modification of the MEMORY of the burning vector by matching with a special GB array.
The program module can carry out byte-dividing processing on the current value of the rolling code, and simultaneously records unique rolling code values for a plurality of station integrated circuit elements according to the programmable chip recording time sequence.
In addition, the module MARKs the station with failed burning through the statement "mark_no=2" so as to recycle the unused rolling code.
@@PLAN PROG_WROM
SITE_SEQUENCE = OFF;
DISABLE_BY_MARK_NO = NULL;
S_SETUP_FILE = c:\set.dat;
REMARK = PROG_WROM;
//first byte
for(int site=0;site<Sys_TEST_DIE;site++)
{
GB[3+64*site] = ((unsigned int)GB[2+64*site]+site)%256; //read first byte
GB[4+64*site] = (unsigned int)GB[3+64*site]^0xff; //wr first byte
}
C_COMPARE(GB4, UP_LIMIT=255, DOWN_LIMIT=0, UNIT=num, LOG_ALIAS=rd_gtm_data_first_byte, LOG_UNIT=num);
C_COMPARE(GB5, UP_LIMIT=255, DOWN_LIMIT=0, UNIT=num, LOG_ALIAS=wr_gtm_data_first_byte, LOG_UNIT=num);
LOGIC_WRITE_PATTERN_MEMORY(MC1617_PROG_WROM_KH1221:XA00, MC1617_PROG_WROM_KH1221:XA01, PB6, GB5, BIT_COUNT=8, SERIAL);
//second byte
for(int site=0;site<Sys_TEST_DIE;site++)
{
GB[5+64*site] = ((unsigned int)(GB[2+64*site]+site)>>8)%256;//read second byte
GB[6+64*site] = (unsigned int)GB[5+64*site]^0xff; //wr second byte
}
C_COMPARE(GB6, UP_LIMIT=255, DOWN_LIMIT=0, UNIT=num, LOG_ALIAS=rd_gtm_data_second_byte, LOG_UNIT=num);
C_COMPARE(GB7, UP_LIMIT=255, DOWN_LIMIT=0, UNIT=num, LOG_ALIAS=wr_gtm_data_second_byte, LOG_UNIT=num);
LOGIC_WRITE_PATTERN_MEMORY(MC1617_PROG_WROM_KH1221:XA01, MC1617_PROG_WROM_KH1221:XA02, PB6, GB7, BIT_COUNT=8, SERIAL);
//third byte
for(int site=0;site<Sys_TEST_DIE;site++)
{
GB[12+64*site] = ((unsigned int)GB[2+64*site]+site)/65536; //read third byte
GB[13+64*site] = (unsigned int)GB[12+64*site]^0xff; //wr third byte
}
C_COMPARE(GB13, UP_LIMIT=255, DOWN_LIMIT=0, UNIT=num, LOG_ALIAS=rd_gtm_data_third_byte, LOG_UNIT=num);
C_COMPARE(GB14, UP_LIMIT=255, DOWN_LIMIT=0, UNIT=num, LOG_ALIAS=wr_gtm_data_third_byte, LOG_UNIT=num);
LOGIC_WRITE_PATTERN_MEMORY(MC1617_PROG_WROM_KH1221:XA02, MC1617_PROG_WROM_KH1221:XA03, PB6, GB14, BIT_COUNT=8, SERIAL);
LOGIC_CLOSE_PMU_RELAY(PB5,WAIT=0.5MS);
LOGIC_CLOSE_PMU_RELAY(VDD_CH,CONNECT_MODE,WAIT=0.5MS);
WAIT(2MS);
LOGIC_FORCE_PMU(VPP_PMU,FORCE_V,0.0V,100MA,I6);
LOGIC_FORCE_PMU(VDD_PMU,FORCE_V,0.0V,100MA,I6);
LOGIC_SET_DRV_LEVEL(ALL_PIN, 5.0V, 0.0V, 0.0V, VR1);
LOGIC_SET_CMP_LEVEL(ALL_PIN, 2.5V, 2.5V, VR1);
LOGIC_CLOSE_PE_RELAY(ALL_PIN, WAIT=0.5MS);
RUN_PATTERN(MC1617_PROG_WROM_KH1221:START, MC1617_PROG_WROM_KH1221:S0, 2, 1);
WAIT(2MS);
LOGIC_FORCE_PMU(VDD_PMU,FORCE_V,5V,100MA,I6);
LOGIC_FORCE_PMU(VPP_PMU,FORCE_V,9.25V,100MA,I6);
WAIT(30MS);
LOGIC_SET_RESISTIVE_LOAD_PIN(PB6, 5V, RS_1.95K, DYNAMIC);
WAIT(1MS);
RUN_PATTERN(MC1617_PROG_WROM_KH1221:S0, MC1617_PROG_WROM_KH1221:STOP, 2, 1);
LOGIC_FORCE_PMU(VPP_PMU,FORCE_V,0V,100MA,I6);
LOGIC_FORCE_PMU(VDD_PMU,FORCE_V,0V,100MA,I6);
LOGIC_SET_DRV_LEVEL(ALL_PIN, 0.0V, 0.0V, 0.0V, VR1);
LOGIC_SET_CMP_LEVEL(ALL_PIN, 0.0V, 0.0V, VR1);
WAIT(2MS);
LOGIC_CLOSE_PMU_RELAY(NULL,WAIT=0.5MS);
LOGIC_CLOSE_PE_RELAY(NULL,WAIT=0.5MS);
WAIT(2MS);
CONDITION
IF_FAIL
REJECT_BIN=29;
MARK_NO=2;
@@END_PLAN
Rolling code recycling module: during the test, there is an abnormal chip, resulting in the rolling code assigned to this part of the chip being practically unused. The test program can monitor the chip with abnormal burning, recover the wasted rolling code and participate in the next burning test.
And the program module stores the rolling code in the original GB array into a new GB array by identifying MARK_NO=2, so that the recycling of the rolling code is realized.
@@PLAN GDM_RECOVER
SITE_SEQUENCE = OFF;
ENABLE_BY_MARK_NO = 2;
S_SETUP_FILE = c:\set.dat;
REMARK = GDM_RECOVER;
for(int site=0;site<Sys_TEST_DIE;site++)
{
if(Sys_ActiveSite[site]==0)
GB[14+64*site] = GB[3+64*site]; //read first byte
GB[15+64*site] = GB[4+64*site]; //wr first byte
GB[16+64*site] = GB[5+64*site]; //read second byte
GB[17+64*site] = GB[6+64*site]; //wr second byte
GB[18+64*site] = GB[12+64*site]; //read third byte
GB[19+64*site] = GB[13+64*site]; //wr third byte
}
CONDITION
IF_FAIL
REJECT_BIN=30;
@@END_PLAN
The invention integrates chip rolling code burning and integrated circuit element middle measurement, reduces the research and development period of self-made burner, simplifies the production flow of the product, and reduces the error risk in the production process of the product.
And the integrated circuit element middle measurement and rolling code burning can be realized at the same time by multiple machine stations and multiple stations, and the production efficiency is greatly improved.
The scheme of the invention can effectively realize the following characteristics:
the method is characterized in that: the integrated circuit element is integrated with the measurement and the rolling code burning;
and the second characteristic is that: realizing the simultaneous testing of a plurality of machine stations on the integrated circuit wafer;
realizing simultaneous testing of integrated circuit wafers by a plurality of stations;
and the characteristics are as follows: maximizing rolling code utilization.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (3)
1. The method for burning the rolling code of the programmable integrated circuit element is characterized by comprising the following steps:
step one, three program blocks are established: the system comprises a rolling code configuration module, a burning module and a rolling code recovery module, wherein the rolling code configuration module is in communication connection with the burning module of a plurality of test machines, and the burning module is in communication connection with the rolling code recovery module;
step two, configuring a rolling code configuration template: storing a text file in the engineering root directory for storing rolling code configuration;
comprising the following steps: the test engineering comprises a text processing function, a file with a designated name is indexed, related configuration is obtained and stored in a designated variable, and the same engineering can realize simultaneous burning of a plurality of machines by obtaining different rolling code files;
step three, configuring a burning module: based on dynamic memory modification statement provided by the tester, according to the rolling code configuration parameters, unique rolling code values are burnt for the plurality of station integrated circuit elements according to the programmable chip burning time sequence;
step four, configuring a rolling code recovery module: the method is used for recovering the wasted rolling codes and participating in the next round of burning test.
2. The method for burning rolling code of programmable integrated circuit element as set forth in claim 1, wherein the rolling code configuration template first judges whether the rolling code file is normally opened when starting operation, if the rolling code file can be normally opened, the rolling code configuration is obtained, the current value of the rolling code is updated, the test engineering parameters are configured, after the test engineering parameters are configured, the rolling code file is closed, the rolling code configuration step is ended, if the rolling code file cannot be normally opened, the rolling code configuration step is ended directly, and the test system error report is performed.
3. The method of claim 1, wherein,
in the testing process of the rolling code recovery module, abnormal chips exist, so that the rolling codes distributed to the chips are not actually used, a testing program can monitor the abnormal burning chips, and the wasted rolling codes are recovered and used for participating in the next burning test.
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CN114489695A (en) * | 2021-12-30 | 2022-05-13 | 嘉兴威伏半导体有限公司 | Safe chip burning method and system |
CN115454749A (en) * | 2022-09-21 | 2022-12-09 | 深圳市灵微科技有限公司 | Burning and testing system of universal burning machine |
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