CN116344424B - High-efficient silicon chip detects sorting unit - Google Patents

High-efficient silicon chip detects sorting unit Download PDF

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Publication number
CN116344424B
CN116344424B CN202310623076.9A CN202310623076A CN116344424B CN 116344424 B CN116344424 B CN 116344424B CN 202310623076 A CN202310623076 A CN 202310623076A CN 116344424 B CN116344424 B CN 116344424B
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China
Prior art keywords
streamline
measuring
feeding
guide rail
sorting
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CN202310623076.9A
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Chinese (zh)
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CN116344424A (en
Inventor
刘磊
刘涛荣
赵瑞刚
沈玉懿
李�杰
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Nordisk Suzhou Intelligent Equipment Co ltd
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Nordisk Suzhou Intelligent Equipment Co ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/36—Sorting apparatus characterised by the means used for distribution
    • B07C5/361—Processing or control devices therefor, e.g. escort memory
    • B07C5/362—Separating or distributor mechanisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/36—Sorting apparatus characterised by the means used for distribution
    • B07C5/38—Collecting or arranging articles in groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Robotics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

The invention discloses a high-efficiency silicon wafer detecting and sorting device which comprises a feeding machine, a measuring machine and a discharging machine, wherein the feeding machine comprises a feeding mechanism, a buffer mechanism and a feeding streamline which are sequentially arranged, and the two feeding streamlines are parallel and are mutually close to each other and arranged at the downstream of the buffer mechanism; the measuring machine comprises a first measuring streamline, a second measuring streamline, a carrying mechanism and a plurality of detecting mechanisms, wherein the second measuring streamline is at least partially intersected with the first measuring streamline, the carrying mechanism is positioned at the intersection of the first measuring streamline and the second measuring streamline, and the detecting mechanisms are arranged along the first measuring streamline and the second measuring streamline; the blanking machine comprises a blanking streamline and a plurality of sorting mechanisms, and the sorting mechanisms are respectively arranged along the two blanking streamlines. The silicon wafer can be cached through the caching mechanism, so that shutdown waiting during feeding is avoided, continuous operation of the sorting device is realized, and sorting efficiency is improved; by arranging two first measuring streamline which are close to each other, the use efficiency of the detection mechanism is improved, and the manufacturing cost is reduced.

Description

High-efficient silicon chip detects sorting unit
Technical Field
The invention relates to the technical field of silicon chip sorting, in particular to a high-efficiency silicon chip detecting and sorting device.
Background
Silicon wafers are widely used as important industrial raw materials in the production and manufacture of solar cells, circuit boards and other products. To ensure the quality of the product manufactured from the silicon wafer, the silicon wafer needs to be detected and sorted. The silicon wafer sorter can measure and detect the thickness, TTV, line mark, resistivity, size, dirt, broken edge, hidden crack and other items of the silicon wafer, and automatically sort the silicon wafer into different boxes according to the quality grade requirement according to sorting menus.
The application publication number CN112676175A discloses an intelligent silicon chip sorting machine, which comprises: loading attachment, detection device and unloading sorting unit. Continuous and efficient feeding of the silicon wafers can be realized through the feeding device; the detection device is used for completing the detection of a plurality of items of the silicon wafer, so that the actual detection requirement of the silicon wafer is fully met; through the blanking sorting device, the sorting of good products and defective products of the silicon wafers and the sorting of the silicon wafers with different defect types are realized. However, when the existing silicon wafer sorting device is used for feeding, the detection streamline is in a waiting state, so that the sorting efficiency is reduced; and moreover, the single streamline cannot realize the full utilization of the detection mechanism, so that the separation efficiency is reduced, and the use cost is increased.
Disclosure of Invention
The invention aims to provide a high-efficiency silicon wafer detection and separation device to solve the technical problems in the background art, and the aim of the invention is realized by the following technical scheme:
the high-efficiency silicon wafer detecting and sorting device comprises a feeding machine, a measuring machine and a discharging machine, wherein the feeding machine comprises a feeding mechanism, a caching mechanism and a feeding streamline which are sequentially arranged, the caching mechanism is used for caching part of silicon wafers transmitted by the feeding mechanism, and the two feeding streamlines are parallel and are mutually close to each other and arranged at the downstream of the caching mechanism; the measuring machine comprises a first measuring streamline, a second measuring streamline, a carrying mechanism and a plurality of detecting mechanisms, wherein the two first measuring streamlines are arranged at the downstream of the feeding streamline in parallel and close to each other, the two second measuring streamlines are respectively positioned at the outer sides of the two first measuring streamlines, the second measuring streamline is at least partially intersected with the first measuring streamline, the carrying mechanism is positioned at the intersection of the first measuring streamline and the second measuring streamline and is used for carrying a silicon wafer on the first measuring streamline to the second measuring streamline, and the detecting mechanisms are arranged along the first measuring streamline and the second measuring streamline; the blanking machine comprises two blanking flow lines and a plurality of sorting mechanisms, wherein the two blanking flow lines are respectively arranged at the downstream of the two second measuring flow lines, and the sorting mechanisms are respectively arranged along the two blanking flow lines.
Further, the feeding mechanism comprises a first horizontal guide rail, at least two groups of feeding units and a pumping unit, wherein the two groups of feeding units are both arranged on the first horizontal guide rail, and the feeding units can transversely reciprocate along the first horizontal guide rail under the drive of a first driving piece; each group of feeding units comprises a first vertical guide rail, a feeding box is arranged on the first vertical guide rail, and the feeding box can move up and down along the first vertical guide rail under the drive of a second driving piece; a turnover driving piece is arranged between the feeding box and the first vertical guide rail, and the feeding box can turn over by 90 degrees around the bottom of the feeding box under the driving of the turnover driving piece; two flower baskets are arranged in the feeding box and are arranged in parallel; the quantity of the material pumping units is consistent with that of the feeding units, each group of material pumping units comprises two material pumping conveying belts, the material pumping conveying belts are arranged on one side, far away from the feeding box, of the first vertical guide rail, the two material pumping conveying belts are respectively matched with the positions of the two flower baskets, three detection sensors are arranged at one ends, close to the flower baskets, of the material pumping conveying belts, and the three detection sensors are arranged in a triangular shape.
Further, the buffer mechanism comprises buffer streamline and buffer unit, the buffer streamline is at least two groups, each group of buffer streamline comprises two buffer conveyer belts, the two buffer conveyer belts are parallel and close to each other, and the upstream of each buffer conveyer belt is provided with a first guide mechanism; the buffer unit comprises a second horizontal guide rail, a second vertical guide rail and a buffer box, wherein the second vertical guide rail is arranged on the second horizontal guide rail, and the second vertical guide rail can horizontally reciprocate along the second horizontal guide rail under the drive of a third driving piece; the buffer material box is arranged on the second vertical guide rail, and can move up and down along the second vertical guide rail under the drive of the fourth driving piece.
Further, a first receiving box is arranged at the tail end of the buffer streamline.
Further, the downstream of the buffer mechanism is provided with a rejection mechanism, the rejection mechanism comprises a rejection streamline, an appearance detection unit, a turnover rejection unit and a second receiving box, the appearance detection unit is arranged on the rejection streamline, the turnover rejection unit is arranged at the downstream of the rejection streamline, and the second receiving box is positioned at the lower side of the turnover rejection unit.
Further, a second guide mechanism is arranged at the rear side of the removing mechanism, and the second guide mechanism is positioned between the removing unit and the feeding streamline.
Further, the detection mechanism comprises one or a combination of a plurality of measurement mechanisms, an upper part dirt detection mechanism, a front and back crack detection mechanism, a hidden crack detection mechanism, a lower part dirt detection mechanism, a left and right crack detection mechanism, a four-corner crack detection mechanism, a resistivity detection mechanism and a thickness detection mechanism, wherein the measurement mechanisms, the upper part dirt detection mechanism, the front and back crack detection mechanism, the hidden crack detection mechanism and the lower part dirt detection mechanism are positioned at a first measuring streamline, and the left and right crack detection mechanisms, the four-corner crack detection mechanism, the resistivity detection mechanism and the thickness detection mechanism are positioned at a second measuring streamline.
Further, the conveying mechanisms are two groups, each group of conveying mechanism comprises a conveying support and a conveying line fixed below the conveying support, one end of the conveying line is positioned on the upper side of the first measuring flow line, and the other end of the conveying line is positioned on the upper side of the second measuring flow line; the third guide mechanism is arranged at the upstream of the conveying mechanism, and the fourth guide mechanism is arranged at the downstream of the conveying mechanism.
Further, the sorting mechanism comprises a sorting carrying unit and a sorting receiving unit, wherein the sorting receiving unit is arranged on one side of the blanking streamline, the sorting carrying unit is arranged on one side of the blanking streamline and used for carrying silicon wafers on the blanking streamline to the sorting receiving unit, and a third receiving box is arranged at the tail end of the blanking streamline.
Further, the sorting receiving unit comprises a receiving rack, a fixed receiving box and a movable receiving box, wherein the fixed receiving box is fixedly arranged on the upper side of one end, far away from the blanking streamline, of the receiving rack; the lower side of the material receiving frame is horizontally provided with a third horizontal guide rail, a third vertical guide rail is arranged on the third horizontal guide rail, the third vertical guide rail can transversely reciprocate along the third horizontal guide rail under the drive of a fifth driving piece, the movable material receiving box is arranged on the third vertical guide rail, and the movable material receiving box can vertically reciprocate along the third vertical guide rail under the drive of a sixth driving piece.
The technical scheme provided by the embodiment of the application has at least the following technical effects or advantages:
1. the buffer mechanism is arranged on the feeding machine, so that silicon wafers can be buffered, the stop waiting of a time division streamline during feeding of the feeding machine is avoided, the continuous operation of the sorting device is realized, and the sorting efficiency is improved;
2. through setting up two first measuring flow lines that are close to, can realize going on dirty, front and back crack limit and hidden crack detection about the silicon chip on two first measuring flow lines through single group detection mechanism, improved detection mechanism's availability factor, reduced manufacturing cost.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention.
FIG. 1 is a schematic diagram of a sorting apparatus according to an embodiment of the present application;
fig. 2 is a schematic structural diagram of a feeding machine according to an embodiment of the present application;
fig. 3 is a schematic structural diagram of a feeding mechanism according to an embodiment of the present application;
fig. 4 is a schematic structural diagram of a material pumping unit according to an embodiment of the present application;
FIG. 5 is a schematic diagram of a cache streamline structure according to an embodiment of the present application;
FIG. 6 is a schematic diagram of a cache unit according to an embodiment of the present disclosure;
FIG. 7 is a schematic structural diagram of a first alignment mechanism according to an embodiment of the present disclosure;
FIG. 8 is a schematic diagram of a detecting portion of a rejecting mechanism according to an embodiment of the present disclosure;
fig. 9 is a schematic diagram of a rejecting portion of a rejecting mechanism according to an embodiment of the present application;
FIG. 10 is a schematic diagram of a measuring machine according to an embodiment of the present disclosure;
FIG. 11 is a front view of a metrology tool according to an embodiment of the present disclosure;
FIG. 12 is a schematic view of a first measurement flow line and a second measurement flow line according to an embodiment of the present disclosure;
FIG. 13 is an enlarged view of a portion of FIG. 12;
FIG. 14 is a schematic view of a carrying mechanism according to an embodiment of the present disclosure;
FIG. 15 is an enlarged view of a portion of FIG. 14;
FIG. 16 is a schematic view of a measuring mechanism according to an embodiment of the present disclosure;
FIG. 17 is a schematic view of an upper contamination detection mechanism according to an embodiment of the present disclosure;
FIG. 18 is a schematic diagram of a front-rear edge crack detection mechanism according to an embodiment of the present application;
FIG. 19 is a schematic structural diagram of a hidden crack detection mechanism according to an embodiment of the present application;
FIG. 20 is a schematic view of a lower portion contamination detection mechanism according to an embodiment of the present disclosure;
FIG. 21 is a schematic diagram of a left-right crack detecting mechanism according to an embodiment of the present application;
FIG. 22 is a schematic structural diagram of a four-corner edge detection mechanism according to an embodiment of the present disclosure;
FIG. 23 is a schematic view of a resistivity detection mechanism according to an embodiment of the present disclosure;
FIG. 24 is a schematic view of a thickness detecting mechanism according to an embodiment of the present application;
FIG. 25 is a schematic view of a blanking machine according to an embodiment of the present disclosure;
FIG. 26 is an enlarged view of a portion of FIG. 25;
FIG. 27 is a left side view of a blanking machine according to an embodiment of the present application;
FIG. 28 is a schematic view of a sorting and receiving unit according to an embodiment of the present disclosure;
FIG. 29 is a front view of a sorting and receiving unit according to an embodiment of the present application;
FIG. 30 is a schematic view of another embodiment of a sorting and receiving unit;
FIG. 31 is a front view of another sort receiving unit according to an embodiment of the present application;
FIG. 32 is a schematic view of a sorting and conveying unit according to an embodiment of the present disclosure;
FIG. 33 is a schematic view of a blanking streamline structure according to an embodiment of the present disclosure;
fig. 34 is a schematic diagram of a blanking principle in an embodiment of the present application.
Detailed Description
In order that the manner in which the above recited features of the present invention can be better understood, a more particular description of the invention will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings. The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the invention, its application, or uses. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The high-efficiency silicon wafer detecting and sorting device shown in fig. 1 comprises a feeding machine 1000, a measuring machine 2000 and a discharging machine 3000, wherein the measuring machine 2000 is positioned at the downstream of the feeding machine 1000, and the discharging machine 3000 is positioned at the downstream of the measuring machine 2000.
As shown in fig. 2, the feeding machine 1000 includes a feeding frame 1100, and a feeding mechanism 1200, a buffer mechanism 1300, a rejecting mechanism 1400 and a feeding streamline 1500 sequentially disposed on the feeding frame 1100 from left to right, wherein the feeding mechanism 1200 is mounted at the left end of the feeding frame 1100, the feeding frame 1200 partially protrudes out of the left end of the feeding frame 1100, two collision avoidance columns 1110 are respectively fixed at two sides of the feeding mechanism 1200, so as to avoid collision between personnel, skip and the feeding mechanism 1200, and ensure safety of the personnel and equipment.
As shown in fig. 3 and 4, the feeding mechanism 1200 includes a first horizontal guide 1210, a feeding unit 1220, and a drawing unit 1230. The feeding units 1220 have two groups, and each group of feeding units 1220 includes a first vertical rail 1221, the first vertical rail 1221 is slidably mounted on the first horizontal rail 1210, and the first vertical rail 1221 can be reciprocally moved laterally along the first horizontal rail 1210 by a first driving member (not shown). A connection mount 1222 is fixed to the first vertical rail 1221, and the connection mount 1222 is movable up and down along the first vertical rail 1221 by a second driving member (not shown). The left end of the connecting seat 1222 is hinged with a feeding box 1224, a turnover driving piece 1223 is arranged at the joint of the connecting seat 1222 and the feeding box 1224, the turnover driving piece 1223 can drive the feeding box 1224 to turn 90 degrees around the connecting seat 1222, and when the feeding box 1224 turns left to be in a horizontal state, the feeding box 1224 is in a loading position; when the upper cartridge 1224 is flipped right to be in a vertical state, the upper cartridge 1224 is in the working position. Clamping members 1225 are mounted on both ends of the upper magazine 1224, and a basket 1226 is provided between the clamping members 1225. Wherein, two baskets 1226 are installed in each feeding box 1224, and the two baskets 1226 are arranged in parallel.
The two sets of material drawing units 1230 are also provided, and the two sets of material drawing units 1230 are all fixed on the right side of the feeding unit 1220. Each set of extraction units 1230 includes two extraction conveyors 1231, the two extraction conveyors 1231 respectively matching the positions of the two baskets 1226 for extracting silicon wafers from the baskets 1226. Wherein, take out material conveyer belt 1231 has three belt to realize high-speed take out material. Three detection sensors 1232 are installed at the left end of the material pumping conveyor belt 1231, and the three detection sensors 1232 are arranged in a triangular shape, so that the three detection sensors 1232 can detect the whole surface of a silicon wafer, and the problem that the silicon wafer is damaged due to the fact that the silicon wafer is not completely pumped out and the basket 1226 is pressed down is avoided.
Preferably, the first horizontal guide rail 1210 and the first vertical guide rail 1221 are linear modules, and the first driving member and the second driving member are servo motors. In use, first, the loading cartridge 1224 is in the loading position, the basket 1226 is manually placed horizontally on the loading cartridge 1224, and the overturning driving member 1223 drives the loading cartridge 1224 to overturn 90 ° rightward after the clamping member 1225 clamps the basket 1226, so that the loading cartridge 1224 is in the vertical state. The material pumping unit 1230 starts to pump materials from the bottom of the flower basket 1226, and the feeding box 1224 moves downwards along the first vertical guide rail 1221 under the drive of the second driving piece, so that the silicon wafers are pumped one by one. The two groups of feeding mechanisms 1220 are fed alternately, and the two groups of feeding mechanisms 1220 can move transversely along the first horizontal guide rail 1210 under the driving of the first driving piece, so that the two groups of material pumping units 1230 are respectively connected with the next station.
As shown in fig. 2, 5 and 6, the buffer mechanism 1300 is mounted on the right side of the feeding mechanism 1200, and is used for buffering a part of the silicon wafers transferred by the feeding mechanism 1200.
The caching mechanism 1300 includes a cache stream 1310 and a cache unit 1320. The buffer flow lines 1310 are provided with three groups, the three groups of buffer flow lines 1310 are arranged side by side, and the distance between two adjacent groups of buffer flow lines 1310 is equal to the distance between two groups of pumping units 1230. Each group of buffer streamline 1310 comprises two buffer conveyer belts 1311, the two buffer conveyer belts 1311 are parallel and are close to each other, and the buffer conveyer belts 1311 are uniformly provided with a plurality of detection sensors along the length direction of the buffer conveyer belts 1311 so as to detect whether silicon chips exist at each position of the buffer conveyer belts 1311. The right ends of the two buffer streamlines 1310 located at two sides are provided with a first receiving box 1313 for receiving the dropped silicon wafer, so as to avoid breakage and dirt of the silicon wafer caused by that the silicon wafer directly drops on the feeding frame 1100.
As shown in fig. 5 and 7, a first guide 1330 is mounted on each of the buffer conveyors 1311. The first guiding mechanism 1330 includes two guiding seats 1331, the two guiding seats 1331 are respectively located at two sides of the buffer conveyor belt 1311, a positive guiding motor 1333 is installed on the guiding seats 1331, a guiding belt 1332 is fixed at one side of the guiding seats 1331 close to the buffer conveyor belt 1311, and the guiding belt 1332 is vertically arranged and in transmission connection with the positive guiding motor 1333. The distance between the left ends of the two guide belts 1332 is larger than the width of the silicon wafer, and the distance between the right ends of the two guide belts 1322 is equal to the width of the silicon wafer, so that the guide operation of the silicon wafer is realized.
As shown in fig. 2 and 6, the buffer unit 1320 includes a second horizontal rail 1321, a second vertical rail 1322, and a buffer magazine 1323. A second horizontal rail 1321 is installed on the right side of the cache line 1310, a second vertical rail 1322 is installed on the second horizontal rail 1321, and the second vertical rail 1322 can horizontally reciprocate along the second horizontal rail 1321 under the driving of a third driving member (not shown). The buffer cartridge 1323 is mounted on the second vertical rail 1322, and the buffer cartridge 1323 can move up and down along the second vertical rail 1322 by a fourth driving member (not shown). The second horizontal guide 1321 and the second vertical guide 1322 are linear modules, and the third driving member and the fourth driving member are servo motors. The buffer material box 1323 is of an inverted U-shaped structure, and buffer flower baskets are fixed on two sides of the buffer material box 1323.
When in use, the redundant silicon wafers are firstly transmitted to the buffer streamline 1310 at the two sides by the feeding mechanism 1200, and are guided by the first guide mechanism 1330 and then are inserted into the buffer box 1323 from top to bottom; when the feeding mechanism 1200 is in a material shortage state, the buffer material box 1323 moves to the buffer flow line in the middle, and the silicon wafer in the buffer material box 1323 is extracted from bottom to top, so as to ensure uninterrupted operation of the equipment.
As shown in fig. 2, 8, and 9, the reject mechanism 1400 is mounted on the right side of the buffer mechanism 1300, and the reject mechanism 1400 includes a reject flow line 1410, an appearance detection unit 1420, a flip-flop reject unit 1430, and a second receiving box 1440.
The reject flow line 1410 is connected to a middle group of buffer flow lines 1310 of the buffer mechanism 1300, two groups of reject flow lines 1410 are provided, the two groups of reject flow lines 1410 are arranged at intervals, each group of reject flow lines 1410 comprises two reject conveyor belts 1411, and the two reject conveyor belts 1411 are parallel and are arranged close to each other. The appearance detection unit 1420 includes an appearance detection bracket 1421, an appearance detection camera 1422, and an appearance detection light source 1423, the appearance detection camera 1422 is mounted above the front set of culling streamlines 1410 through the appearance detection bracket 1421, and the appearance detection light source 1423 is mounted below the front set of culling streamlines 1410. Preferably, the appearance detecting camera 1422 is a surface scanning camera, and is used for photographing the silicon wafer passing through the appearance detecting light source, and transmitting the photographed silicon wafer to the image detecting unit to determine whether the silicon wafer is damaged.
The overturning removing unit 1430 is provided with the left end of the rear group of removing streamline 1410, the overturning removing unit 1430 comprises an overturning conveying belt 1431 and an overturning motor 1432, the right end of the overturning conveying belt 1431 is hinged with the left end of the rear group of removing streamline 1410, the overturning motor 1432 is fixed on the outer side of the removing streamline 1410, an output shaft of the overturning motor 1432 is connected with the overturning conveying belt 1431, and the second receiving box 1440 is installed on the lower side of the overturning removing unit 1430. When the appearance detection unit 1420 judges that a certain silicon wafer is damaged, the overturning motor 1432 drives the overturning conveying belt 1431 to overturn rightwards, so that the two groups of removing streamline 1410 are disconnected, and the damaged silicon wafer falls into the second receiving box 1440, thereby avoiding the time waste caused by the fact that the damaged silicon wafer continuously flows to the post-stage station. When the damaged silicon wafer falls, the overturning motor 1432 drives the overturning conveying belt 1431 to reset in time.
As shown in fig. 2, the second guide 1450 is mounted on the right side of the rejecting mechanism 1400, and the feeding streamline 1500 is mounted on the right side of the second guide 1450. The feeding streamline 1500 comprises two feeding conveyer belts, the two feeding conveyer belts are parallel and close to each other, and the second guide mechanism 1450 is fixed at the left ends of the two feeding conveyer belts and used for guiding the silicon wafer passing through the rejecting mechanism 1400 and transmitting the silicon wafer to the measuring machine 2000 from the feeding streamline 1500. The structure of the second guide 1450 is the same as that of the first guide 1330, and will not be described here again.
A chaser mechanism is installed downstream of the reject mechanism 1400, and the chaser mechanism performs shaft position synchronization using a position compensation function algorithm. When the silicon wafers are simultaneously transmitted on two identical-length identical-speed belts respectively and have a position fall, the belt with the position lag of the silicon wafers is changed at a slower speed at a fixed distance to catch up to the same position of the silicon wafer on the other belt line, and the two later belts are operated at the same speed. Through the material following structure with three sections and more than three sections, position compensation material following is carried out for a plurality of times, so that the position synchronization of the silicon wafer is realized.
As shown in fig. 10 and 11, the measuring machine 2000 includes a measuring frame 2100, a first measuring streamline 2200, a carrying mechanism 2300, a second measuring streamline 2400, and a plurality of detecting mechanisms distributed along the first measuring streamline 2200 and the second measuring streamline 2400.
As shown in fig. 11 and 12, the first metrology flow line 2200 is mounted on the left half of the metrology frame 2100, and the first metrology flow line 2200 is located on the center axis of the long side of the metrology frame 2100. The first measuring line 2200 includes two measuring belts, which are parallel and disposed close to each other. The second measuring streamline 2400 is installed on the right half of the measuring frame 2100, the second measuring streamline 2400 includes two measuring conveyer belts, and the two measuring conveyer belts of the second measuring streamline 2400 are located on two sides of the long side of the measuring frame 2100 and are axisymmetric with respect to the first measuring streamline 2200. The right half of the first metrology flow line 2200 intersects the left half of the second metrology flow line 2400, and the handling mechanism 2300 is mounted at the intersection of the first metrology flow line 2200 and the second metrology flow line 2400.
As shown in fig. 13, the photoelectric sensors 2700 are mounted on the measurement conveyor belts of the first measurement streamline 2200 and the second measurement streamline 2400, and are used for detecting the positions of the silicon wafers on the first measurement streamline 2200 and the second measurement streamline 2400.
As shown in fig. 10, 11 and 14, the two sets of conveying mechanisms 2300 are respectively installed at the intersection of the first measuring streamline 2200 and the second measuring streamline 2400 by the conveying support 2310, two cross beams 2311 are installed at the top of the conveying support 2310, and the cross beams 2311 are perpendicular to the long sides of the measuring frame 2100. Each set of transport mechanism 2300 includes a transport rack 2320 and a transport line 2330 secured below the transport rack, and a bernoulli chuck is mounted at the lower end of the transport line 2330 for adsorbing silicon wafers. As shown in fig. 14 and 15, the handling frame 2320 is respectively installed at two sides of the cross beam 2311, one end of the handling conveying line 2330 is located at the upper side of the first measuring streamline 2200, and the other end of the handling conveying line 2330 is located at the upper side of the second measuring streamline 2400, so as to be used for handling the silicon wafer from the first measuring streamline 2200 to the second measuring streamline 2400. A fourth pod 2800 is mounted at the end of the first metrology flow line 2200 to prevent wafers from falling directly onto the metrology frame 2100.
As shown in fig. 11 and 14, the third guide mechanism 2500 is mounted on the left side of the conveying mechanism 2300, the fourth guide mechanism 2600 is mounted on the right side of the conveying mechanism 2300, and the third guide mechanism 2500 is mounted on the first measuring line 2200 and is positioned on the left side of the left conveying line 2330; the fourth guide mechanism 2600 is mounted on the second measurement flowline 2400 and is located on the right side of the right side handling conveyor line 2330. The third guide mechanism 2500 and the fourth guide mechanism 2600 have the same structure as the first guide mechanism 1330, and will not be described here again.
As shown in fig. 11, the detecting means includes a measuring means 2010, an upper dirty detecting means 2020, a front-rear cracked edge detecting means 2030, a hidden cracked edge detecting means 2040, a lower dirty detecting means 2050, a left-right cracked edge detecting means 2060, a four-corner cracked edge detecting means 2070, a resistivity detecting means 2080 and a thickness detecting means 2090, and the measuring means 2010, the upper dirty detecting means 2020, the front-rear cracked edge detecting means 2030, the hidden cracked edge detecting means 2040 and the lower dirty detecting means 2050 are installed at the first measuring streamline 2200 for detecting two rows of silicon wafers on the first measuring streamline 2200. The pair of left and right crack edge detecting mechanisms 2060, the four corner crack edge detecting mechanism 2070, the resistivity detecting mechanism 2080 and the thickness detecting mechanism 2090 are respectively arranged at the second measuring streamline 2400 to respectively detect a row of silicon wafers on the second measuring streamline 2400, thereby realizing the simultaneous detection of two rows of silicon wafers and greatly improving the sorting efficiency.
As shown in fig. 11 and 16, the measurement mechanism 2010 includes a measurement bracket 2011, a measurement camera 2012, and a measurement light source 2013, the measurement camera 2012 is mounted on the left end of the first measurement flow line 2200 by the measurement bracket 2011, and the measurement light source 2013 is mounted on the lower side of the first measurement flow line 2200 and directly below the measurement camera 2012. The measurement camera 2012 is a surface scanning camera, and is configured to take a picture of the silicon wafer passing through the measurement light source 2013, and transmit the picture to the image processing unit, and is configured to detect the size of the silicon wafer, so as to determine whether the silicon wafer meets the corresponding size standard.
As shown in fig. 11 and 17, the upper contamination detection mechanism 2020 is configured to detect contamination of the upper surface of the silicon wafer to determine whether the upper portion of the silicon wafer meets the corresponding cleanliness standard. The upper contamination detection mechanism 2020 is disposed above the first measurement flow line 2200, and includes an upper contamination detection camera 2021 and an upper contamination detection light source 2022. The upper contamination detection camera 2021 is a line camera, and the upper contamination detection camera 2021 is located at a gap position where two measurement conveyor belts are in transitional connection. The upper contamination detection light source 2022 includes a light emitting diode and a lamp cover, where the light emitting diode is located below the lamp cover, so that light emitted by the light emitting diode is in a large-angle diffuse reflection state, so as to uniformly irradiate the silicon wafer.
As shown in fig. 11 and 18, the front-rear edge detection mechanism 2030 is installed at a gap position where the two measurement conveyor belts of the first measurement streamline 2200 are in transitional connection, and includes two front-rear edge detection cameras 2031 and a front-rear edge detection light source 2032. The front and rear edge crack detection light source 2032 includes two light emitting diodes and a lampshade, the two light emitting diodes are respectively arranged at two sides of the first measurement streamline perpendicular to the conveying direction, and the two edge crack detection cameras 2031 respectively collect edge images of the front and rear edges of the silicon wafer and judge the edge crack condition of the front and rear ends of the silicon wafer.
As shown in fig. 11 and 19, the hidden crack detection mechanism 2040 is used to detect surface cracks of the silicon wafer. The hidden crack detection mechanism 2040 includes: two sets of hidden crack detection cameras 2041 and an infrared light source 2042. The infrared light source 2042 is installed below the gap position where the two measuring conveyor belts are in transitional connection, and the two sets of hidden crack detection cameras 2041 are symmetrically distributed on two sides of the infrared light source 2042. The angle of the british detecting camera 2041 can be adjusted to meet the actual detecting requirement, so that the detecting areas of the two sets of hidden crack detecting cameras 2041 cover the transitional connection positions of the two measuring conveying lines.
As shown in fig. 11 and 20, the lower portion contamination detection mechanism 2050 is configured to detect contamination of the lower surface of the silicon wafer to determine whether the lower portion of the silicon wafer meets the corresponding cleanliness criteria. The lower contamination detection mechanism 2050 is disposed below the first measuring line 2200, and includes a lower contamination detection camera 2051 and a lower contamination detection light source 2052. The lower contamination detection camera 2051 is a line camera, and the lower contamination detection camera 2051 is located at a gap position where two measurement conveyor belts are in transitional connection. The lower contamination detection light source 2052 includes a light emitting diode and a lamp cover, and the light emitting diode is located below the lamp cover, so that light emitted by the light emitting diode is in a large-angle diffuse reflection state, so as to uniformly irradiate the silicon wafer.
As shown in fig. 11 and 21, the left and right edge detection mechanism 2060 is used for detecting the quality of the left and right edges of the silicon wafer, and comprises two edge breakage detection units respectively mounted on two sides of the second measurement streamline 2400. Each edge burst detection unit includes: the left and right crack detection cameras 2061 and the left and right crack detection light sources 2062, the left and right crack detection cameras 2061 being horizontally installed on one side of the second measurement flow line 2400 and being disposed toward the second measurement flow line 2400. The left and right crack detection light source 2062 is used to provide illumination required for detection by the left and right crack detection camera 2061.
As shown in fig. 11 and 22, the four corner edge detection mechanism 2070 is used to detect the quality of the four chamfers of the silicon wafer. The four corner edge detection mechanism 2070 includes: the two groups of four-corner edge detection units are oppositely and symmetrically arranged on two sides of the streamline 2400 on the second two sides, each group of four-corner edge detection units comprises two four-corner edge detection cameras 2071 and two four-corner edge detection light sources, and the two four-corner edge detection cameras 2071 have an included angle of 45 degrees so as to realize detection of two chamfers of the corresponding side silicon wafer. The four-corner-edge detection light source 2072 is obliquely arranged and illuminates the detection areas of the two four-corner-edge detection cameras 2071.
As shown in fig. 11 and 23, the resistivity detection mechanism 2080 is used to detect the resistivity of the silicon wafer. Comprising the following steps: upper test probe 2081 and lower test probe 2082, and a channel for a silicon wafer to pass through is reserved between upper test probe 2081 and lower test probe 2082. Preferably, one side of the upper test probe 2081 is also provided with a PN sensor 2083, so that the polarity of the silicon wafer can be measured.
As shown in fig. 11 and 24, the thickness detecting mechanism 2090 is configured to detect the thickness of the silicon wafer, and includes a plurality of sets of thickness detecting units. Each group of thickness detection units comprises two line laser transmitters 2091 which are arranged up and down oppositely, so that the height information of the upper surface and the lower surface of the silicon wafer through the two line laser transmitters can be measured, and the thickness, the line mark and the roughness of the silicon wafer can be calculated.
In use, a silicon wafer enters the measuring machine 2000 from the first measuring line 2200, passes through the measuring mechanism 2010, the upper portion dirt detecting mechanism 2020, the front and rear edge crack detecting mechanism 2030, the hidden crack detecting mechanism 2040, and the lower portion dirt detecting mechanism 2050 in this order, and is then transported to the second measuring line 2400 via the transporting mechanism 2300, and then the left and right edge crack detecting mechanism 2060, the four corner edge crack detecting mechanism 2070, the resistivity detecting mechanism 2080, and the thickness detecting mechanism 2090 are continued.
As shown in fig. 25, the blanking machine 3000 includes a blanking frame 3100, a blanking streamline 3200 and a plurality of sorting mechanisms 3300, the number of the blanking streamlines 3200 is two, the two blanking streamlines 3200 are respectively installed on two sides of a long side of the blanking frame 3100, the positions of the blanking streamlines 3200 are respectively matched with the second measuring streamline 2400 of the measuring machine 2000, and the plurality of sorting mechanisms 3300 are respectively arranged on one side of the two blanking streamlines 3200.
As shown in fig. 25 and 33, each blanking flow line 3200 is formed by connecting two double belt conveyors, and includes a bottom frame 3201, a belt frame 3202, a belt 3203, a driving mechanism 3204, a driving wheel 3205 and a position switch 3206. The two bottom frames 3201 are vertically fixed at the top of the blanking frame 3100, the belt frame 3202 is transversely fixed between the two bottom frames 3201, the four driving wheels 3205 are installed on two sides of the end portion of the belt frame 3203 in pairs, and the two driving wheels 3205 at the same end are connected through a rotating shaft. The driving mechanism 3204 is a stepping motor, the stepping motor is fixed on one of the underframe 3201, and an output shaft of the stepping motor is connected with any rotating shaft through a synchronous wheel assembly, so that two belts 3203 are driven to synchronously move, and the stability of silicon wafer transmission is ensured. The position switches 3206 are photoelectric sensors, and the three position switches 3206 are uniformly arranged at intervals along the length direction of the belt frame 3202 and are used for detecting the position of the silicon wafer.
As shown in fig. 25 to 27, the twelve-component sorting mechanism 3300 is fixed to the top of the blanking frame 3100 in two rows. The sorting mechanism 3300 comprises a sorting carrying unit 3310 and a sorting receiving unit 3320, wherein the sorting receiving unit 3320 is arranged on one side of the blanking streamline 3200, and the sorting carrying unit 3310 is arranged on the upper side of the blanking streamline 3200 and is used for carrying silicon wafers on the blanking streamline 3200 to the sorting receiving unit 3320. The end of the blanking streamline 3200 is provided with a tail carrying unit 3500, and a third receiving box 3400 for collecting miscellaneous silicon wafers or undetected silicon wafers is installed at the lower side of the tail carrying unit 3500.
As shown in fig. 28 and 29, the sorting receiving unit 3320 comprises a receiving rack 3321, a fixed receiving box 3322 and a movable receiving box 3323, wherein the fixed receiving box 3322 is fixedly arranged on the upper side of one end of the receiving rack 3321 far from the blanking streamline 3200; a third horizontal guide rail 3324 is horizontally installed on the lower side of the material receiving frame 3321, a third vertical guide rail 3325 is installed on the third horizontal guide rail 3324, the third vertical guide rail 3325 can transversely reciprocate along the third horizontal guide rail 3324 under the driving of a fifth driving piece (not shown), a movable material receiving box 3323 is installed on the third vertical guide rail 3325, and the movable material receiving box 3323 can vertically reciprocate along the third vertical guide rail 3325 under the driving of a sixth driving piece (not shown). The fifth driving piece can be an air cylinder, a linear module, a motor and a synchronous wheel synchronous belt assembly, and the fifth driving piece can be arranged according to the actual installation space and the scene, and the sixth driving piece is a jacking air cylinder.
When the third vertical guide rail 3325 moves to the right end of the third horizontal guide rail 3324, and the movable receiving box 3323 is positioned at the top of the third vertical guide rail 3325, the movable receiving box 3323 is positioned at the right side of the fixed receiving box 3322 and at the same height as the fixed receiving box 3322, and at this time, the movable receiving box 3323 is positioned at the receiving position; when the movable receiving box 3323 is positioned at the bottom of the third vertical guide rail 3325 and the third vertical guide rail 3325 moves to the left end of the third horizontal guide rail 3324, the movable receiving box 3323 is positioned under the fixed receiving box 3322, and the movable receiving box 3323 is positioned at the unloading position.
As another embodiment of the present application, as shown in fig. 30 and 31, the sorting receiving unit 3320 includes a receiving rack 3321', an upper receiving box 3322' and a lower receiving box 3323', an upper horizontal rail 3326' and a lower horizontal rail 3324 'are respectively fixed to one side of the receiving rack 3321', and the upper horizontal rail 3326 'and the lower horizontal rail 3324' are parallel and aligned at both ends. The upper deck cassette 3322' is slidably mounted on the upper horizontal rail 3326' and is capable of horizontally reciprocating along the upper horizontal rail 3326' under the drive of an upper deck cassette driver (not shown). The lower horizontal guide rail 3324 'is slidably provided with a fourth vertical guide rail 3325', and the fourth vertical guide rail 3325 'can horizontally reciprocate along the lower horizontal guide rail 3324' under the driving of the lower cartridge driving member. The lower cartridge 3323' is mounted on the fourth vertical guide 3325' and can reciprocate up and down along the fourth vertical guide 3325' by a lower cartridge lifting drive (not shown). The upper layer material receiving box driving piece and the lower layer material receiving box driving piece can be air cylinders, linear modules, motors and synchronous wheel synchronous belt assemblies, and can be arranged according to the actual installation space and scenes, and the lower layer material receiving box lifting driving piece is a jacking air cylinder.
When the upper receiving box 3322 'moves to the right end of the upper horizontal guide rail 3326', the upper receiving box 3322 'is at the receiving position, and the lower receiving box lifting driving member is at a contracted state, so that the lower receiving box 3323' is at a low position. When the upper receiving box 3322 'moves left to the left end of the upper horizontal guide rail 3326', the upper receiving box 3322 'is at a discharging position, and the lower receiving box 3323' can be driven to move right to the right end of the lower horizontal guide rail 3324 'and to ascend, so that the lower receiving box 3323' is at a receiving position, and when the lower receiving box 3323 'is full, the lower receiving box 3323' descends and moves left to the discharging position of the lower receiving box 3323 'along the lower horizontal guide rail 3324'. Preferably, the upper layer material receiving box 3322 'and the lower layer material receiving box 3323' are linked through the synchronous wheel synchronous belt assembly, so that the upper layer material receiving box 3322 'and the lower layer material receiving box 3323' are always in a staggered state at the horizontal position, the structure is simplified, and shielding of the lower layer material receiving box 3323 'during discharging caused by the upper layer material receiving box 3322' is avoided.
As shown in fig. 32 and 34, the sorting and conveying mechanism 3310 includes an adsorption module 3311, a first conveying module 3312, a second conveying module 3313, a first connecting base 334, a second connecting base 3315, and a third connecting base 3316, the third connecting base 3316 is fixed on the top of the blanking frame 3100 by bolts, the adsorption module 3311 is fixed on the lower end of the third connecting base 3316 by the first connecting base 3314, and the first conveying module 3312 and the second conveying module 3313 are fixed on the lower end of the third connecting base 3316 by the second connecting base 3315. The adsorption module 3311 is located right above the blanking streamline 3200 and is used for adsorbing and picking up the silicon chip on the blanking streamline 3200. The first and second transporting modules 3312, 3313 are sequentially mounted on the left side of the adsorbing module 3311 such that the first transporting module 3312 is located directly above the movable receiving box 3323 and the second transporting module 3313 is located directly above the fixed receiving box 3322. In use, the adsorption module 3311 is used to pick up a silicon wafer on the blanking flow line 3200, the first conveying module 3312 is used to convey the silicon wafer into the movable receiving box 3323, and the first conveying module 3312 and the second conveying module 3313 cooperate to convey the silicon wafer into the fixed receiving box 3322.
The adsorption module 3311, the first transport module 332, and the second transport module 3313 each include a belt transport and a bernoulli chuck, and the belt bottom surface of the belt transport is lower than the bottom surface of the bernoulli chuck, thereby achieving non-contact pickup of the silicon wafer. The belt conveying part at least comprises two belts, and the distance between the two belts is adjustable; the position of the Bernoulli sucker is also adjustable, so that the sorting machine is suitable for sorting silicon wafers with different sizes. The Bernoulli sucker controls the air passage in a pressurizing and pressure stabilizing mode through the booster pump so as to keep stability when the Bernoulli sucker picks up the silicon wafer.
When in use, in an initial state, the movable receiving box 3323 is positioned at a receiving position, and at this time, the sorting and carrying unit 3310 transmits the silicon wafer to the position right above the movable receiving box 3323 through the adsorption module 3311 and the first conveying module 3312, and places the silicon wafer into the movable receiving box 3323;
when the movable receiving box 3323 is full, the movable receiving box 3323 moves to a discharging position, so that the movable receiving box 3323 can be discharged; at this time, the sorting and carrying unit 3310 transfers the silicon wafer to the position right above the fixed receiving box 3322 through the adsorption module 3311, the first conveying module 3312, and the second conveying module 3313, and places the silicon wafer into the fixed receiving box 3322;
After the movable receiving box 3323 finishes discharging, the movable receiving box 3323 returns to the receiving position, when the fixed receiving box 3322 is full, the sorting and carrying unit 3310 switches to throw the material to the movable receiving box 3323, so that the circulation is realized, continuous discharging is realized, equipment shutdown is avoided, and sorting and discharging efficiency is improved.
The technical scheme in the embodiment of the application at least has the following technical effects or advantages:
1. the buffer mechanism is arranged on the feeding machine, so that silicon wafers can be buffered, the stop waiting of a time division streamline during feeding of the feeding machine is avoided, the continuous operation of the sorting device is realized, and the sorting efficiency is improved;
2. through setting up two first measuring flow lines that are close to, can realize going on dirty, front and back crack limit and hidden crack detection about the silicon chip on two first measuring flow lines through single group detection mechanism, improved detection mechanism's availability factor, reduced manufacturing cost.
In the description of the present invention, it should be understood that the azimuth or positional relationships indicated by the azimuth terms such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal", and "top, bottom", etc., are generally based on the azimuth or positional relationships shown in the drawings, merely to facilitate description of the present invention and simplify the description, and these azimuth terms do not indicate and imply that the apparatus or elements referred to must have a specific azimuth or be constructed and operated in a specific azimuth, and thus should not be construed as limiting the scope of protection of the present invention: the orientation word "inner and outer" refers to inner and outer relative to the contour of the respective component itself.
In addition, the terms "first", "second", etc. are used to define the components, and are only for convenience of distinguishing the corresponding components, and the terms have no special meaning unless otherwise stated, and therefore should not be construed as limiting the scope of the present invention.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. The utility model provides a high-efficient silicon chip detects sorting unit, includes material loading machine, measuring machine and unloader, its characterized in that:
the feeding machine comprises a feeding mechanism, a caching mechanism and a feeding streamline which are sequentially arranged, wherein the caching mechanism is used for caching part of the silicon wafers transmitted by the feeding mechanism, and the two feeding streamlines are parallel and mutually close to each other and are arranged at the downstream of the caching mechanism;
the measuring machine comprises a first measuring streamline, a second measuring streamline, a carrying mechanism and a plurality of detecting mechanisms, wherein the two first measuring streamlines are arranged at the downstream of the feeding streamline in parallel and close to each other, the two second measuring streamlines are respectively positioned at the outer sides of the two first measuring streamlines, the second measuring streamline is at least partially intersected with the first measuring streamline, the carrying mechanism is positioned at the intersection of the first measuring streamline and the second measuring streamline and is used for carrying a silicon wafer on the first measuring streamline to the second measuring streamline, and the detecting mechanisms are arranged along the first measuring streamline and the second measuring streamline;
The blanking machine comprises two blanking flow lines and a plurality of sorting mechanisms, wherein the two blanking flow lines are respectively arranged at the downstream of the two second measuring flow lines, and the plurality of sorting mechanisms are respectively arranged along the two blanking flow lines.
2. The high-efficiency silicon wafer detecting and sorting device according to claim 1, wherein the feeding mechanism comprises a first horizontal guide rail, feeding units and a material extracting unit, the number of the feeding units is at least two, the two groups of the feeding units are all arranged on the first horizontal guide rail, and the feeding units can transversely reciprocate along the first horizontal guide rail under the driving of a first driving piece; each group of feeding units comprises a first vertical guide rail, a feeding box is arranged on the first vertical guide rail, and the feeding box can move up and down along the first vertical guide rail under the driving of a second driving piece; a turnover driving piece is arranged between the feeding box and the first vertical guide rail, and the feeding box can turn 90 degrees around the bottom of the feeding box under the driving of the turnover driving piece; two flower baskets are arranged in the feeding box and are arranged in parallel; the material sucking units are consistent with the material feeding units in number, each group of material sucking units comprises two material sucking conveyor belts, the material sucking conveyor belts are arranged on one side, far away from the material feeding box, of the first vertical guide rail, the two material sucking conveyor belts are matched with the two flower baskets respectively, three detection sensors are arranged at one end, close to the flower baskets, of each material sucking conveyor belt, and the three detection sensors are arranged in a triangular mode.
3. The high-efficiency silicon wafer detecting and sorting device according to claim 1, wherein the buffer mechanism comprises buffer streamline and buffer units, the buffer streamline is at least two groups, each group of buffer streamline comprises two buffer conveyer belts, the two buffer conveyer belts are parallel and close to each other, and a first guide mechanism is arranged at the upstream of each buffer conveyer belt; the buffer unit comprises a second horizontal guide rail, a second vertical guide rail and a buffer box, wherein the second vertical guide rail is arranged on the second horizontal guide rail, and the second vertical guide rail can horizontally reciprocate along the second horizontal guide rail under the drive of a third driving piece; the buffer storage material box is arranged on the second vertical guide rail, and the buffer storage material box can move up and down along the second vertical guide rail under the drive of the fourth driving piece.
4. A high efficiency silicon wafer detecting and sorting device according to claim 3, wherein the end of the buffer flow line is provided with a first receiving box.
5. The efficient silicon wafer detecting and sorting device according to claim 1, wherein a rejection mechanism is arranged at the downstream of the buffer mechanism, the rejection mechanism comprises a rejection streamline, an appearance detection unit, a turnover rejection unit and a second receiving box, the appearance detection unit is arranged on the rejection streamline, the turnover rejection unit is arranged at the downstream of the rejection streamline, and the second receiving box is positioned at the lower side of the turnover rejection unit.
6. The high-efficiency silicon wafer detecting and sorting device according to claim 5, wherein a second guide mechanism is arranged at the rear side of the rejecting mechanism, and the second guide mechanism is located between the rejecting unit and the feeding streamline.
7. The high-efficiency silicon wafer detecting and sorting device according to claim 1, wherein the detecting mechanism comprises one or a combination of several of a measuring mechanism, an upper portion dirt detecting mechanism, a front and rear crack detecting mechanism, a hidden crack detecting mechanism, a lower portion dirt detecting mechanism, a left and right crack detecting mechanism, a four corner crack detecting mechanism, a resistivity detecting mechanism and a thickness detecting mechanism, wherein the measuring mechanism, the upper portion dirt detecting mechanism, the front and rear crack detecting mechanism, the hidden crack detecting mechanism and the lower portion dirt detecting mechanism are located at the first measuring streamline, and the left and right crack detecting mechanism, the four corner crack detecting mechanism, the resistivity detecting mechanism and the thickness detecting mechanism are located at the second measuring streamline.
8. The high-efficiency silicon wafer detecting and sorting device according to claim 1, wherein the two groups of conveying mechanisms are provided, each group of conveying mechanism comprises a conveying bracket and a conveying line fixed under the conveying bracket, one end of the conveying line is positioned on the upper side of the first measuring line, and the other end of the conveying line is positioned on the upper side of the second measuring line; the upper reaches of transport mechanism are provided with the third and lead the mechanism, the low reaches of transport mechanism are provided with the fourth and lead the mechanism.
9. The efficient silicon wafer detecting and sorting device according to claim 1, wherein the sorting mechanism comprises a sorting carrying unit and a sorting receiving unit, the sorting receiving unit is arranged on one side of the blanking streamline, the sorting carrying unit is arranged on one side of the blanking streamline and used for carrying silicon wafers on the blanking streamline to the sorting receiving unit, and a third receiving box is arranged at the tail end of the blanking streamline.
10. The high-efficiency silicon wafer detecting and sorting device according to claim 9, wherein the sorting receiving unit comprises a receiving rack, a fixed receiving box and a movable receiving box, wherein the fixed receiving box is fixedly arranged on the upper side of one end, far away from the blanking streamline, of the receiving rack; the lower side of the material receiving frame is horizontally provided with a third horizontal guide rail, a third vertical guide rail is arranged on the third horizontal guide rail, the third vertical guide rail can transversely reciprocate along the third horizontal guide rail under the drive of a fifth driving piece, the movable material receiving box is arranged on the third vertical guide rail, and the movable material receiving box can reciprocate up and down along the third vertical guide rail under the drive of a sixth driving piece.
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TWM637372U (en) * 2022-08-12 2023-02-11 銓發科技股份有限公司 Chip inspection device

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