CN116263520A - CPO device and switch - Google Patents

CPO device and switch Download PDF

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Publication number
CN116263520A
CN116263520A CN202111538226.3A CN202111538226A CN116263520A CN 116263520 A CN116263520 A CN 116263520A CN 202111538226 A CN202111538226 A CN 202111538226A CN 116263520 A CN116263520 A CN 116263520A
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CN
China
Prior art keywords
waveguide
circuit board
optical chip
cpo
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111538226.3A
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Chinese (zh)
Inventor
黄智�
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ZTE Corp
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ZTE Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZTE Corp filed Critical ZTE Corp
Priority to CN202111538226.3A priority Critical patent/CN116263520A/en
Priority to PCT/CN2022/138949 priority patent/WO2023109854A1/en
Publication of CN116263520A publication Critical patent/CN116263520A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/1228—Tapered waveguides, e.g. integrated spot-size transformers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4287—Optical modules with tapping or launching means through the surface of the waveguide
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q11/00—Selecting arrangements for multiplex systems
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q11/00—Selecting arrangements for multiplex systems
    • H04Q11/0001—Selecting arrangements for multiplex systems using optical switching
    • H04Q11/0003—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q11/00—Selecting arrangements for multiplex systems
    • H04Q11/0001—Selecting arrangements for multiplex systems using optical switching
    • H04Q11/0005—Switch and router aspects

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
  • Optical Integrated Circuits (AREA)

Abstract

The disclosure provides an optical co-packaged CPO device, CPO device includes the optical chip, CPO device still includes optical chip waveguide and circuit board waveguide, optical chip waveguide is used for with the optical signal transmission of optical chip output extremely circuit board waveguide, at least a portion of optical chip waveguide sets up on the first surface of circuit board waveguide, along keeping away from in the direction of optical chip, optical chip waveguide is located the longitudinal section area of the part of circuit board waveguide's first surface reduces gradually, wherein, the longitudinal section is perpendicular to first surface. The present disclosure also provides a switch.

Description

CPO device and switch
Technical Field
The present disclosure relates to the field of communication devices, and in particular, to a CPO apparatus and a switch.
Background
The core device of the Co-Packaged Optics (CPO) device is an optical chip, and the optical chip needs to be coupled and butted with an external optical fiber link. However, there are problems such as a waveguide pitch between the optical chip and the external optical fiber link, and a mismatch in mode field diameter.
Disclosure of Invention
The present disclosure provides a CPO apparatus and a switch including the CPO apparatus.
As a first aspect of the present disclosure, there is provided an optical co-packaged CPO device comprising an optical chip, wherein the CPO device further comprises an optical chip waveguide for transmitting an optical signal output from the optical chip to a circuit board waveguide, at least a portion of the optical chip waveguide being disposed on a first surface of the circuit board waveguide, a longitudinal cross-sectional area of a portion of the optical chip waveguide located on the first surface of the circuit board waveguide gradually decreasing in a direction away from the optical chip, wherein the longitudinal cross-section is perpendicular to the first surface.
Optionally, the dimension of the optical chip waveguide in a direction away from the optical chip is smaller than the dimension of the circuit board waveguide in a direction away from the optical chip.
Optionally, the width of the optical chip waveguide is smaller than the width of the circuit board waveguide, wherein the width direction of the optical chip waveguide and the width direction of the circuit board waveguide are perpendicular to a direction away from the optical chip.
Optionally, the optical chip waveguide includes a rectangular portion for receiving an optical signal of the optical chip and a tapered portion having a rectangular longitudinal section, the tapered portion being located on the first surface and gradually decreasing in width in a direction away from the optical chip.
Optionally, the taper has a length of between 180 μm and 400 μm and a thickness of between 180nm and 250 nm.
Optionally, the circuit board waveguide has a width between 3 μm and 6 μm.
Optionally, the circuit board waveguide includes circuit board waveguide sandwich layer, circuit board coating cladding circuit board waveguide sandwich layer, just be provided with the printing opacity opening on the circuit board coating, the optical chip waveguide sets up printing opacity opening part, the refracting index of circuit board coating is less than the refracting index of circuit board waveguide sandwich layer.
Optionally, the refractive index of the circuit board waveguide core layer is between 1.55 and 1.8.
Optionally, the refractive index of the circuit board coating is between 1.5 and 1.6.
Optionally, the thickness of the circuit board waveguide core layer is between 1 μm and 3 μm.
Optionally, the CPO device includes a optoelectric hybrid printed circuit board (PCB, print Circuit Board), and the optical chip, the optical chip waveguide, and the circuit board waveguide are disposed on a surface of the optoelectric hybrid PCB, or the optical chip, the optical chip waveguide, and the circuit board waveguide are disposed inside the optoelectric hybrid PCB.
Optionally, the CPO device further includes a PCB optical connector disposed at an end of the circuit board waveguide, the waveguide of the PCB optical connector being aligned with the waveguide in the circuit board waveguide to receive and conduct the optical signal transmitted by the circuit board waveguide.
Optionally, the PCB optical connector is detachably disposed at an end of the circuit board waveguide.
As a second aspect of the present disclosure, there is provided a switch, the switch including a CPO device, wherein the CPO device is the CPO device provided in the first aspect of the present disclosure.
In the present disclosure, the optical chip completes modulation of an optical signal and transmits the modulated optical signal to an output end of an optical chip waveguide. Since the longitudinal sectional area of the portion of the optical chip waveguide located at the first surface of the circuit board waveguide gradually decreases, the optical signal energy field is gradually transferred from the optical chip waveguide to the inside of the circuit board waveguide. Due to the structure of the optical chip waveguide, the problems of unequal waveguide spacing and unequal mode field diameters between the optical chip waveguide and an external optical fiber link can be solved at the source.
Drawings
FIG. 1 is a schematic structural diagram of one embodiment of a CPO device provided by the present disclosure;
FIG. 2 is a schematic top view showing the relative relationship between a photo chip waveguide and a circuit board waveguide;
fig. 3 is a schematic diagram showing the arrangement of the PCB optical connector.
Detailed Description
In order to better understand the technical solutions of the present disclosure, the CPO device and the switch provided in the present disclosure are described in detail below with reference to the accompanying drawings.
Example embodiments will be described more fully hereinafter with reference to the accompanying drawings, but may be embodied in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
Embodiments of the disclosure and features of embodiments may be combined with each other without conflict.
As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present disclosure, and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
In the related art, it is necessary to package the pigtail fiber in the CPO device to achieve coupling and butt joint between the optical chip and the external fiber link.
As a first aspect of the present disclosure, there is provided an optical co-packaged CPO device, as shown in fig. 1, comprising an optical chip 100, wherein the CPO device further comprises an optical chip waveguide 200 and a circuit board waveguide 300, the optical chip waveguide 200 being for transmitting an optical signal output from the optical chip 100 to the circuit board waveguide 300, at least a portion of the optical chip waveguide 200 being disposed on a first surface (i.e., an upper surface in fig. 1) of the circuit board waveguide 300. As shown in fig. 2, in a direction away from the optical chip 100, a longitudinal cross-sectional area of a portion of the optical chip waveguide 200 located at the first surface of the circuit board waveguide 300 is gradually reduced, wherein the longitudinal cross-section is perpendicular to the first surface.
In the present disclosure, the optical chip 100 completes modulation of an optical signal and transmits the modulated optical signal to an output end of the optical chip waveguide 200.
Since the longitudinal sectional area of the portion of the optical chip waveguide 200 located at the first surface of the circuit board waveguide 300 is gradually reduced, the optical signal energy field is gradually transferred from the optical chip waveguide 200 to the inside of the circuit board waveguide 300. Due to the above-described structure of the optical chip waveguide 200, the problems of the unequal waveguide spacing between the optical chip waveguide and the external optical fiber link and the unequal mode field diameter can be eliminated from the source.
In order to reduce the overall cost of the CPO device, as an alternative embodiment, as shown in fig. 2, the dimensions of the optical chip waveguide 200 in a direction away from the optical chip 100 (right-to-left direction in fig. 2) are smaller than the dimensions of the circuit board waveguide 300 in a direction away from the optical chip 100. In other words, the length of the optical chip waveguide 200 is smaller than the length of the circuit board waveguide 300.
As another alternative embodiment, the width of the optical chip waveguide 200 is smaller than the width of the circuit board waveguide 300, wherein the width direction of the optical chip waveguide (up-down direction in fig. 2) and the width direction of the circuit board waveguide 300 (up-down direction in fig. 2) are perpendicular to the direction away from the optical chip 100.
In the present disclosure, the specific structure of the optical chip waveguide 200 is not particularly limited as long as the optical chip waveguide 200 can realize stepwise transmission of an optical signal to the circuit board waveguide 300. Alternatively, the optical chip waveguide 200 includes a rectangular portion 210 and a tapered portion 220, the rectangular portion 210 is configured to receive the optical signal of the optical chip 100, the tapered portion 220 has a rectangular longitudinal section, the tapered portion 220 is located on the first surface, and the width of the tapered portion 220 gradually decreases in a direction away from the optical chip 100.
As an alternative embodiment, the taper 220 has a length between 180 μm and 400 μm and the taper 220 has a thickness between 180nm and 250 nm.
In the present disclosure, the specific structure of the circuit board waveguide 300 is not particularly limited as long as transmission of an optical signal can be achieved. In order to improve transmission efficiency and reduce transmission loss, optionally, the circuit board waveguide 300 includes a circuit board waveguide core layer 310 and a circuit board coating layer 320, where the circuit board coating layer 320 encapsulates the circuit board waveguide core layer 310, and a light transmission opening is provided on the circuit board coating layer 320, where the optical chip waveguide 200 is disposed at the light transmission opening, and the refractive index of the circuit board coating layer 320 is smaller than that of the circuit board waveguide core layer 310.
The light transmission port is arranged to allow the light transmitted by the optical chip waveguide 200 to enter the circuit board waveguide core layer 300, and the refractive index of the circuit board coating 320 is smaller than that of the circuit board waveguide core layer 310, so that the light can be ensured to be transmitted in the circuit board waveguide core layer 310.
As an alternative embodiment, the circuit board waveguide core 310 the circuit board waveguide 300 has a width between 3 μm and 6 μm.
As an alternative embodiment, the refractive index of the circuit board waveguide core layer 310 is between 1.55 and 1.8.
As an alternative embodiment, the refractive index of circuit board coating 320 is between 1.5 and 1.6.
In the present disclosure, the circuit board waveguide core layer 310 and the circuit board coating layer 320 may be made of a polymer, and the refractive index of the circuit board waveguide core layer 310 and the circuit board coating layer 320 may be adjusted by adjusting the material chemical bond ratio or doping manner.
In the present disclosure, the circuit board coating 320 may be coated on the outside of the circuit board waveguide core layer 310 by photolithography, or printing.
Alternatively, the thickness of the circuit board waveguide core layer 310 is between 1 μm and 3 μm.
As shown in fig. 1, the CPO device includes a photo-electric hybrid printed circuit board PCB 400, and the optical chip 100, the optical chip waveguide 200, and the circuit board waveguide 300 are disposed on the surface of the photo-electric hybrid PCB 400, or the optical chip 100, the optical chip waveguide 200, and the circuit board waveguide 300 are disposed inside the photo-electric hybrid PCB 400.
In the present disclosure, the opto-electronic hybrid PCB 400 is a carrier of the optical chip 100, the optical chip waveguide 200, the circuit board waveguide 300.
In the present disclosure, how to output the optical signal in the circuit board waveguide 300 to the external optical fiber link is not particularly limited. For example, as shown in fig. 3, the CPO device further includes a PCB optical connector 500, the PCB optical connector 500 being disposed at an end of the circuit board waveguide 300, the waveguide of the PCB optical connector 500 being aligned with the waveguide in the circuit board waveguide 300 to receive and conduct the optical signal transmitted by the circuit board waveguide 300.
The PCB optical connector 500 is provided with a plurality of waveguides arranged at intervals, and the circuit board waveguide 300 is also provided with a plurality of waveguides arranged at intervals, so that by aligning the two waveguides, an optical signal transmitted from the circuit board waveguide 300 can be transmitted to the external optical fiber link 600.
As described above, the optoelectric hybrid PCB 400 is a carrier of the circuit board waveguide 300, and in the present disclosure, the PCB optical connector 500 may be fixedly connected with the optoelectric hybrid PCB 400.
To facilitate mating of the CPO device with external fiber links of different fiber arrays, the PCB optical connector 500 is optionally removably positioned at the end of the circuit board waveguide 300, so that mating with different external fiber links can be accomplished by replacing the PCB optical connector 500.
In the structure of "encapsulating fiber pigtails in CPO modules", adaptive modification of the optical chip is required if the spacing between the fibers of the fiber array needs to be adjusted. The cost is relatively high for different types of CPO modules. In the application, the optical chip is not required to be adjusted, and only the size of the waveguide of the optical chip is required to be adjusted, so that the overall cost of the CPO device is reduced.
As a second aspect of the present disclosure, a switch is provided, where the switch includes a CPO device, where the CPO device is the CPO device provided by the present disclosure.
The principles and advantages of the CPO device have been described in detail hereinabove, and are not repeated here.
Examples
Example 1
In the present embodiment, the optical chip 100 is a silicon optical chip, the waveguide in the optical chip waveguide 200 is a silicon optical waveguide, the circuit board waveguide core layer 310 is a polymer core layer in the circuit board waveguide 300, and the circuit board coating layer 320 is a polymer coating layer.
The optical signal generated by the modulation of the optical chip 100 has a wavelength of 1310nm, and is input to the optical chip waveguide 200 inside the optical chip 100, the optical chip waveguide 200 is structurally designed such that one side close to the optical chip 100 is a rectangular portion, the other side is a tapered portion 220, the optical chip waveguide 200 is disposed on the first surface of the circuit board waveguide 300, and extends a distance away from the optical chip 100 on the circuit board waveguide 300, and at the tapered portion 220, an optical signal energy field is gradually transferred from the optical chip waveguide 200 to the inside of the circuit board waveguide 300. The circuit board waveguide core 310 is rectangular in structure and is larger in size than the optical chip waveguide 200. The refractive index of the circuit board coating 320 is less than the refractive index of the circuit board waveguide core layer 310.
In this embodiment, the optical chip 100 transmits an optical signal to the optical chip waveguide 200.
The tapered portion 220 of the microchip waveguide 200 has a cross section of an isosceles trapezoid having a top edge length of 0.09 μm, a bottom edge length of 0.5 μm, and a thickness of 220nm. The taper 220 has a length greater than 220 μm.
The circuit board waveguide core layer 310 is rectangular in cross section, 3.8 μm wide and 1.5 μm high. Wherein the refractive index of the circuit board waveguide core layer 310 is 1.591.
The optical chip waveguide 200 is disposed on the first surface of the circuit board waveguide 300, wherein the optical chip waveguide 200 overlaps the circuit board waveguide 300 by a length of 220 μm.
The circuit board coating 320 encapsulates the circuit board waveguide core layer 310, and the circuit board waveguide 300 is disposed on the surface layer of the optoelectric hybrid printed PCB 400. The refractive index of the material of the circuit board coating 320 is 1.51.
Through the integrated circuit board waveguide core 310 to the PCB optical connector 500. And the waveguides in the PCB optical connector 500 and the waveguides in the circuit board waveguide core layer 310 are arranged on the same horizontal line side by side, and the distance between the waveguides is 127 μm, so that the signal transmission from the optical chip 100 to the PCB optical connector 500 on the board side is realized.
Example 2
In the present embodiment, the optical chip 100 is a silicon optical chip, the waveguide in the optical chip waveguide 200 is a silicon optical waveguide, the circuit board waveguide core layer 310 is a polymer core layer in the circuit board waveguide 300, and the circuit board coating layer 320 is a polymer coating layer.
The optical signal generated by the modulation of the optical chip 100 has a wavelength of 1310nm, and is input to the optical chip waveguide 200 inside the optical chip 100, the optical chip waveguide 200 is structurally designed such that one side close to the optical chip 100 is a rectangular portion, the other side is a tapered portion 220, the optical chip waveguide 200 is disposed on the first surface of the circuit board waveguide 300, and extends a distance away from the optical chip 100 on the circuit board waveguide 300, and at the tapered portion 220, an optical signal energy field is gradually transferred from the optical chip waveguide 200 to the inside of the circuit board waveguide 300. The circuit board waveguide core 310 is rectangular in structure and is larger in size than the optical chip waveguide 200. The refractive index of the circuit board coating 320 is less than the refractive index of the circuit board waveguide core layer 310.
In this embodiment, the optical chip 100 transmits an optical signal to the optical chip waveguide 200.
The tapered portion 220 of the microchip waveguide 200 has a cross section of an isosceles trapezoid having a top edge length of 0.09 μm, a bottom edge length of 0.5 μm, and a thickness of 220nm. The taper 220 has a length greater than 220 μm.
The circuit board waveguide core layer 310 is rectangular in cross section, 5 μm wide and 2 μm high. Wherein the refractive index of the circuit board waveguide core layer 310 is 1.591.
The optical chip waveguide 200 is disposed on the first surface of the circuit board waveguide 300, wherein the optical chip waveguide 200 overlaps the circuit board waveguide 300 by a length of 350 μm.
The circuit board coating 320 encapsulates the circuit board waveguide core 310 and the circuit board waveguide 300 is disposed on the optoelectric hybrid printed PCB
400. The refractive index of the material of the circuit board coating 320 is 1.51.
Through the integrated circuit board waveguide core 310 to the PCB optical connector 500. And the waveguides in the PCB optical connector 500 and the waveguides in the circuit board waveguide core layer 310 are placed on the same horizontal line side by side, and the distance between the waveguides is 250 μm, so that the signal transmission from the optical chip 100 to the PCB optical connector 500 on the board side is realized.
Example embodiments have been disclosed herein, and although specific terms are employed, they are used and should be interpreted in a generic and descriptive sense only and not for purpose of limitation. In some instances, it will be apparent to one skilled in the art that features, characteristics, and/or elements described in connection with a particular embodiment may be used alone or in combination with other embodiments unless explicitly stated otherwise. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the scope of the disclosure as set forth in the appended claims.

Claims (14)

1. An optical co-packaged CPO device, the CPO device comprising an optical chip, characterized in that the CPO device further comprises an optical chip waveguide and a circuit board waveguide, the optical chip waveguide is configured to transmit an optical signal output by the optical chip to the circuit board waveguide, at least a portion of the optical chip waveguide is disposed on a first surface of the circuit board waveguide, and a longitudinal cross-sectional area of a portion of the optical chip waveguide located on the first surface of the circuit board waveguide is gradually reduced along a direction away from the optical chip, wherein the longitudinal cross-section is perpendicular to the first surface.
2. The CPO device according to claim 1, wherein a dimension of said optical chip waveguide in a direction away from said optical chip is smaller than a dimension of said circuit board waveguide in a direction away from said optical chip.
3. The CPO device according to claim 2, wherein a width of said optical chip waveguide is smaller than a width of said circuit board waveguide, wherein a width direction of said optical chip waveguide and a width direction of said circuit board waveguide are perpendicular to a direction away from said optical chip.
4. The CPO device according to claim 1, wherein said optical chip waveguide comprises a rectangular portion for receiving an optical signal of said optical chip and a tapered portion having a rectangular longitudinal section, said tapered portion being located on said first surface and having a width gradually decreasing in a direction away from said optical chip.
5. The CPO device according to claim 4, wherein said taper has a length of between 180 μm and 400 μm and a thickness of between 180nm and 250 nm.
6. The CPO device according to claim 4, wherein said circuit board waveguide has a width of between 3 μm and 6 μm.
7. The CPO device according to claim 1, wherein said circuit board waveguide comprises a circuit board waveguide core layer, a circuit board coating layer, said circuit board coating layer covers said circuit board waveguide core layer, and said circuit board coating layer is provided with a light-transmitting opening, said light chip waveguide is disposed at said light-transmitting opening, and the refractive index of said circuit board coating layer is smaller than the refractive index of said circuit board waveguide core layer.
8. The CPO device of claim 7, wherein the refractive index of the circuit board waveguide core layer is between 1.55 and 1.8.
9. The CPO device of claim 8, wherein the refractive index of said circuit board coating is between 1.5 and 1.6.
10. The CPO device according to claim 7, wherein said circuit board waveguide core layer has a thickness of between 1 μm and 3 μm.
11. The CPO device according to any one of claims 1 to 10, wherein said CPO device comprises an optoelectric hybrid printed circuit board PCB, said optical chip waveguide, said circuit board waveguide being disposed on a surface of said optoelectric hybrid PCB, or said optical chip, said optical chip waveguide, said circuit board waveguide being disposed inside said optoelectric hybrid PCB.
12. The CPO device according to any one of claims 1-10, further comprising a PCB optical connector disposed at an end of said circuit board waveguide, said PCB optical connector waveguide aligned with a waveguide in said circuit board waveguide to receive and conduct optical signals transmitted by said circuit board waveguide.
13. The CPO device as claimed in claim 12, wherein said PCB optical connector is removably disposed at an end of said circuit board waveguide.
14. A switch comprising a CPO device, characterized in that the CPO device is the CPO device according to any one of claims 1 to 13.
CN202111538226.3A 2021-12-15 2021-12-15 CPO device and switch Pending CN116263520A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202111538226.3A CN116263520A (en) 2021-12-15 2021-12-15 CPO device and switch
PCT/CN2022/138949 WO2023109854A1 (en) 2021-12-15 2022-12-14 Cpo apparatus and switch

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111538226.3A CN116263520A (en) 2021-12-15 2021-12-15 CPO device and switch

Publications (1)

Publication Number Publication Date
CN116263520A true CN116263520A (en) 2023-06-16

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WO (1) WO2023109854A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004170924A (en) * 2002-11-05 2004-06-17 Tdk Corp Waveguide embedded optical circuit and optical element used therefor
US7643710B1 (en) * 2008-09-17 2010-01-05 Intel Corporation Method and apparatus for efficient coupling between silicon photonic chip and optical fiber
KR20130069146A (en) * 2011-12-16 2013-06-26 한국전자통신연구원 Optical coupling devices and silicon photonics chips having the same
CN114730047A (en) * 2019-12-02 2022-07-08 华为技术有限公司 Spot-on-film converter, method for manufacturing spot-on-film converter, silicon optical device and optical communication equipment

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