CN116254586B

CN116254586B - Electroplating device

Info

Publication number: CN116254586B
Application number: CN202310541563.0A
Authority: CN
Inventors: 蒋新; 刘礼勇; 刘苏凯; 胡磊; 施利君
Original assignee: Suzhou Kzone Equipment Technology Co Ltd
Current assignee: Suzhou Kzone Equipment Technology Co Ltd
Priority date: 2023-05-15
Filing date: 2023-05-15
Publication date: 2023-08-04
Anticipated expiration: 2043-05-15
Also published as: CN116254586A

Abstract

The invention discloses an electroplating device, and relates to the technical field of solar cell electroplating. The electroplating device comprises a bracket, a gate mechanism and a cathode assembly, wherein an electroplating bath is arranged on the bracket, an anode plate and electroplating liquid are arranged in the electroplating bath, and a first opening is formed in one end of the electroplating bath along a first direction; the gate mechanism comprises a first gate and a second gate which are arranged at intervals along a first direction, the first gate and the second gate are both movably connected to the bracket, and the first opening can be plugged when the first gate and the second gate descend; the cathode assembly comprises a cross beam, the cross beam extends along the second direction and can bear the battery piece, the cross beam can pass through the gate mechanism along the first direction and move into the electroplating bath, the battery piece enters the electroplating liquid and is arranged at intervals with the anode plate, and the first direction is perpendicular to the second direction. The electroplating device can electroplate the horizontally moving battery piece, so that the electroplating quality of the battery piece is ensured, and the electroplating efficiency is improved.

Description

Electroplating device

Technical Field

The invention relates to the technical field of solar cell electroplating, in particular to an electroplating device.

Background

In the preparation of solar cells, it is necessary to deposit a grid line on the surface of the cell. In the prior art, the grid line formed by electroplating has higher aspect ratio and better conductivity, so that the internal resistance of the battery is reduced, and the loss of shading and the like is reduced, thereby improving the photoelectric conversion efficiency of the solar battery.

In the prior art, when a metal layer is plated on a battery sheet, the battery sheet is usually placed in a plating tank for plating. Because the battery piece needs to be electroplated in multiple layers, the battery piece needs to be placed in one electroplating tank to complete electroplating of one layer of metal, and then the battery piece is conveyed to another electroplating tank to complete electroplating of the next layer of metal. However, when the battery piece is electroplated by adopting the electroplating mode, the battery piece needs to be lifted repeatedly, so that the equipment input cost is increased, the continuity of the whole electroplating process and the electroplating quality of the battery piece are difficult to ensure, and the electroplating efficiency of the battery piece is reduced.

In view of the above, there is a need to develop an electroplating apparatus to solve the problem that the quality and efficiency of electroplating of a battery sheet are reduced due to repeated lifting and lowering of the battery sheet.

Disclosure of Invention

The invention aims to provide an electroplating device which can electroplate a horizontally moving battery piece, so that the electroplating quality of the battery piece is ensured, and the electroplating efficiency is improved.

To achieve the purpose, the invention adopts the following technical scheme:

an electroplating apparatus comprising:

the electroplating device comprises a bracket, wherein an electroplating bath is arranged on the bracket, an anode plate and electroplating liquid are arranged in the electroplating bath, and a first opening is formed in one end of the electroplating bath along a first direction;

the gate mechanism comprises a first gate and a second gate which are arranged at intervals along the first direction, the first gate and the second gate are arranged on the bracket in a sliding manner along the vertical direction, and the first opening can be blocked when the first gate and the second gate descend;

the cathode assembly comprises a cross beam, the cross beam extends along a second direction and can bear a battery piece, the cross beam can pass through the gate mechanism along a first direction and move into the electroplating bath, the battery piece enters the electroplating liquid and is arranged with the anode plate at intervals, and the first direction is perpendicular to the second direction.

In some embodiments, a plurality of anode plates are arranged in the electroplating tank at intervals along the second direction, and the cathode assembly can bear a plurality of battery pieces, wherein each battery piece is positioned between two adjacent anode plates.

In some embodiments, the plating tank further includes a spacer disposed in the first opening and between the first gate and the second gate, the spacer having a gap through which the battery sheet can pass along the first direction.

In some embodiments, the spacer includes a plurality of spacer plates spaced apart along the second direction, and the gap is formed between two adjacent spacer plates.

In some embodiments, the support is connected with a plurality of rollers at two ends of the plating tank along the second direction in a rolling manner, the rollers on the same side are arranged along the first direction, and two ends of the cross beam cross the plating tank and are in rolling abutting connection with the rollers on the corresponding side.

In some embodiments, the electroplating apparatus further comprises a driving assembly capable of driving the plurality of rollers at least one end to rotate in the same direction.

In some embodiments, the electroplating device further comprises a guide assembly, the support is provided with the guide assembly at two ends of the electroplating bath along the second direction, and the guide assembly extends along the first direction and can guide the cross beam.

In some embodiments, a plugging slot is formed in the plating tank, and the anode plate is in plugging fit with the plugging slot.

In some embodiments, a second opening is formed at the other end of the plating tank along the first direction, the gate mechanism is disposed at the second opening, and both the first gate and the second gate of the gate mechanism can block the second opening when they descend.

In some embodiments, the electroplating device further comprises a conductive rail disposed at one end of the electroplating bath and extending along the first direction, and the cathode assembly further comprises a conductive connecting member slidably abutting the conductive rail, the conductive connecting member being electrically connected with the battery plate.

The invention has the beneficial effects that:

the invention provides an electroplating device. In this electroplating device, the negative pole subassembly can bear the battery piece and follow the first direction and remove towards the plating bath, and the first gate of gate mechanism is opened preferentially, and after the negative pole subassembly passed through first gate, first gate was closed, and then the second gate was opened, and the negative pole subassembly can be through the second gate removal to in the plating bath, and the battery piece that the negative pole subassembly born gets into in the plating bath and electroplates. After electroplating is finished, the gate mechanism opens the second gate first, and after the cathode component enters between the first gate and the second gate, closes the second gate and opens the first gate, so that the cathode component can leave the electroplating bath. The first gate and the second gate are alternately opened or closed, so that the electroplating solution in the electroplating tank can not flow out of the electroplating tank, and the battery piece is not required to be lifted and only moves along the horizontal direction.

The electroplating device can electroplate the horizontally moving battery piece, thereby ensuring the electroplating quality of the battery piece and improving the electroplating efficiency.

Drawings

FIG. 1 is a schematic view of a plating apparatus according to the present invention;

FIG. 2 is a schematic view of a cathode assembly according to the present invention;

FIG. 3 is a schematic view of a structure of a gate removing mechanism of an electroplating device provided by the invention;

FIG. 4 is an enlarged view of a portion of FIG. 1 at A;

fig. 5 is a partial enlarged view at B in fig. 1.

In the figure:

100. a battery sheet;

1. a bracket; 2. a gate mechanism; 3. a cathode assembly; 4. a roller; 5. a synchronizing wheel; 6. a guide assembly; 7. a conductive rail;

11. plating bath; 12. an anode plate; 21. a first gate; 22. a second gate; 23. a screw rod; 24. a guide rail; 31. a cross beam; 32. a conductive connection; 61. a guide rod; 62. a guide wheel; 71. a conductive groove;

111. a first opening; 112. a second opening; 113. a spacer.

Detailed Description

Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present invention and should not be construed as limiting the invention.

In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Wherein the terms "first position" and "second position" are two different positions.

Unless specifically stated or limited otherwise, the terms "mounted," "connected," and "fixed" are to be construed broadly, and may be, for example, either fixed or removable; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.

Unless expressly stated or limited otherwise, a first feature being "above" or "below" a second feature may include the first feature and the second feature being in direct contact, or may include the first feature and the second feature not being in direct contact but being in contact with each other by way of additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

The technical scheme of the invention is further described below by the specific embodiments with reference to the accompanying drawings.

The embodiment provides an electroplating device, as shown in fig. 1-3, which comprises a bracket 1, a gate mechanism 2 and a cathode assembly 3. Be provided with plating bath 11 on support 1, be provided with anode plate 12 and plating solution in the plating bath 11, first opening 111 has been seted up to plating bath 11 along the one end of first direction (X direction in the figure), gate mechanism 2 includes first gate 21 and second gate 22 that set up along first direction interval, first gate 21 and second gate 22 swing joint are in support 1, first opening 111 can be opened or shutoff to first gate 21 and second gate 22, cathode assembly 3 includes crossbeam 31, crossbeam 31 extends and can bear battery piece 100 along the second direction (Y direction in the figure), crossbeam 31 can pass through gate mechanism 2 and remove to plating bath 11 along first direction, battery piece 100 gets into plating solution and sets up with anode plate 12 interval, first direction perpendicular to second direction.

Wherein, the anode plate 12 is connected with the positive electrode of the power supply and the cathode of the battery piece 100 carried by the cathode component 3 is connected with the negative electrode of the power supply and has negative electrode potential, when the battery piece 100 enters the electroplating solution and approaches the anode plate 12, the voltage between the anode plate 12 and the battery piece 100 reaches a certain value, metal ions in the electroplating solution start to be accumulated on the surface of the battery piece 100 to form a grid line.

In the electroplating device, the cathode assembly 3 can bear the cell 100 and move towards the electroplating tank 11 along the first direction, the first gate 21 of the gate mechanism 2 is preferentially opened, after the cathode assembly 3 passes through the first gate 21, the first gate 21 is closed, and then the second gate 22 is opened, the cathode assembly 3 can move into the electroplating tank 11 through the second gate 22, and the cell 100 borne by the cathode assembly 3 enters the electroplating liquid for electroplating. After the electroplating is finished, the gate mechanism 2 opens the second gate 22, and after the cathode assembly 3 enters between the first gate 21 and the second gate 22, closes the second gate 22 and opens the first gate 21, so that the cathode assembly 3 can leave the electroplating tank 11. The first gate 21 and the second gate 22 are opened or closed alternately, so that the plating solution in the plating tank 11 can be ensured not to flow out of the plating tank 11, and the battery plate 100 does not need to be lifted and moved only in the horizontal direction.

The electroplating device can electroplate the horizontally moving battery piece 100, thereby ensuring the electroplating quality of the battery piece 100 and improving the electroplating efficiency.

As shown in fig. 3, the plating vessel 11 has a second opening 112 at the other end in the first direction, and a shutter mechanism 2 is provided at the second opening 112, so that the second opening 112 can be blocked when both the first shutter 21 and the second shutter 22 of the shutter mechanism 2 are lowered. After the plating of the battery plate 100 in the plating tank 11 is completed, the cathode assembly 3 can bear the movement of the battery plate 100 towards the second opening 112, at this time, the second gate 22 located in the second opening 112 is opened, and after the cathode assembly 3 enters between the first gate 21 and the second gate 22, the second gate 22 is closed and the first gate 21 is opened, so that the cathode assembly 3 can leave the plating tank 11. Through setting up second opening 112 and another gate mechanism 2 for when battery piece 100 got into and left plating bath 11, the direction of movement did not change, in actual production process, can set gradually a plurality of plating baths 11 along first direction, can effectively promote the continuity of electroplating process, thereby improve the electroplating quality of battery piece 100, improve electroplating efficiency.

In the present embodiment, the first shutter 21 of the shutter mechanism 2 is an outside shutter, the second shutter 22 is an inside shutter, and the first shutter 21 and the second shutter 22 are only for convenience of distinction, and the actual first shutter 21 and the second shutter 22 are not distinguished.

It will be appreciated that when the first shutter 21 is opened, the plating solution between the first shutter 21 and the second shutter 22 flows out of the plating tank 11, and in order to avoid waste and ensure sanitation, the plating apparatus further includes a recovery tank provided with two recovery tanks, and the recovery tanks are respectively disposed at two ends of the plating tank 11 in the first direction, whether the first shutter 21 at the first opening 111 or the first shutter 21 at the second opening 112 is opened, and the plating solution between the first shutter 21 and the second shutter 22 can flow into the corresponding recovery tank.

Preferably, the first shutter 21 and the second shutter 22 are slidably coupled to the bracket 1 in the second direction to open or close the first opening 111 or the second opening 112. In some embodiments, the first shutter 21 and the second shutter 22 may also be hinged to the bracket 1, and open or close the first opening 111 or the second opening 112 by rotating.

In the present embodiment, the first shutter 21 and the second shutter 22 are slidably provided in the vertical direction to the bracket 1. As shown in fig. 1, the gate mechanism 2 further includes a structure of two sets of screw rods 23 and a guide rail 24, the screw rods 23 are rotatably disposed on the support 1 and extend along a vertical direction, the guide rail 24 is fixedly disposed on the support 1 and extends along the vertical direction, the first gate 21 and the second gate 22 are slidably disposed on the corresponding guide rail 24 and are rotatably connected with the corresponding screw rods 23, and the corresponding first gate 21 or the corresponding second gate 22 can be controlled to lift by controlling the rotation of the screw rods 23. Specifically, both ends of the first shutter 21 and the second shutter 22 are slidably connected with guide rails 24.

Further, the electroplating device further comprises a reflux pump, and the reflux pump can pump the electroplating liquid in the recovery tank into the electroplating tank 11 again so as to circulate the electroplating liquid, thereby avoiding the condition of stopping replenishment due to the reduction of the electroplating liquid in the electroplating tank 11.

In the process that the battery piece 100 enters the electroplating tank 11, when the battery piece 100 moves between the first gate 21 and the second gate 22 at the first opening 111 and closes the first gate 21, the electroplating liquid can be supplemented between the first gate 21 and the second gate 22 until the electroplating liquid is level with the liquid level of the electroplating liquid in the electroplating tank 11, and when the second gate 22 is opened again at the moment, the flow of the electroplating liquid in the electroplating tank 11 can be effectively avoided, the stability of the electroplating liquid is ensured, and the electroplating quality and the electroplating efficiency are improved.

In the process that the battery piece 100 leaves the electroplating tank 11, when the second gate 22 at the second opening 112 is required to be opened, the electroplating solution can be supplemented between the first gate 21 and the second gate 22 until the electroplating solution is level with the electroplating solution level in the electroplating tank 11, and when the second gate 22 is opened again at the moment, the flow of the electroplating solution in the electroplating tank 11 can be effectively avoided, the stability of the electroplating solution is ensured, and the electroplating quality and the electroplating efficiency are improved.

That is, each time the second shutter 22 needs to be opened, it is necessary to ensure that the level of the plating solution between the second shutter 22 and the corresponding first shutter 21 is flush with the level of the plating solution in the plating vessel 11, thereby preventing problems such as plating failure due to the flow of the plating solution in the plating vessel 11. The operation of replenishing the plating liquid between the first shutter 21 and the second shutter 22 may be performed by a reflux pump connected to the recovery tank, or may be performed by another method.

As shown in fig. 3, the plating tank 11 further includes a spacer 113, where the spacer 113 is disposed in the first opening 111 and located between the first shutter 21 and the second shutter 22, and the spacer 113 is provided with a gap through which the battery plate 100 can pass along the first direction. The spacer 113 does not block the battery 100 from entering the plating tank 11, and can occupy a part of the space between the first shutter 21 and the second shutter 22, so that when the plating solution needs to be replenished between the first shutter 21 and the second shutter 22, the amount of the plating solution needed can be greatly reduced, thereby improving the efficiency of replenishing the plating solution, reducing the waiting time of the battery 100 between the first shutter 21 and the second shutter 22, and improving the plating efficiency.

Specifically, the spacer 113 includes a plurality of spacer plates arranged at intervals in the second direction, and a gap is formed between two adjacent spacer plates. The smaller the interval between the spacers 113, the better the battery sheet 100 can be made to pass through in the first direction and enter the plating tank 11.

Preferably, a plurality of anode plates 12 are disposed in the plating tank 11 at intervals along the second direction, and the cathode assembly 3 is capable of carrying a plurality of battery plates 100, each battery plate 100 being located between two adjacent anode plates 12. The cathode assembly 3 is utilized to bear a plurality of battery pieces 100, so that the electroplating device can simultaneously electroplate the battery pieces 100, thereby improving the electroplating efficiency of the battery pieces 100. In addition, each battery piece 100 is positioned between two adjacent anode plates 12, and the two sides of the battery piece 100 can be plated at the same time, so that the plating efficiency is further improved.

It is understood that the spacers 113 are disposed in a one-to-one correspondence with the anode plates 12, and the battery sheet 100 can directly go between two adjacent anode plates 12 after being spaced by the spacers 113.

As shown in fig. 4, the electroplating apparatus further includes a driving assembly capable of driving the cathode assembly 3 to move in the first direction. The drive assembly can be moved by driving the cathode assembly 3 so that the cathode assembly 3 can pass through the electroplating bath 11 along the first direction, and the cathode assembly 3 is driven by the drive assembly to move, so that the speed stability can be ensured, and the working strength of operators can be reduced.

In this embodiment, the driving assembly includes a driving motor and a plurality of rollers 4, the bracket 1 is connected with the plurality of rollers 4 at two ends of the plating tank 11 along the second direction in a rolling manner, the plurality of rollers 4 on the same side are arranged along the first direction, two ends of the cross beam 31 span the plating tank 11 and are in rolling contact with the rollers 4 on the corresponding side, and the driving motor can drive the plurality of rollers 4 on at least one side to rotate in the same direction. When the driving motor drives the rollers 4 on at least one side to rotate in the same direction, the cross beam 31 can be moved in the first direction.

Specifically, the driving assembly further comprises a synchronous belt, the driving shaft of the driving motor and each roller 4 on the same side of the electroplating tank 11 are coaxially fixed with synchronous wheels 5, the synchronous belt is connected with all the synchronous wheels 5 in a synchronous transmission manner, and when the driving shaft of the driving motor rotates, the synchronous belt can drive the rollers 4 to rotate through the synchronous wheels 5, so that the cross beam 31 is driven to move. The synchronous wheel 5 can be meshed with the synchronous belt, and slipping is effectively prevented. It will be appreciated that the timing belt may be replaced by a chain and the timing wheel 5 may be replaced by a sprocket, as well as the drive of the roller 4 by the drive motor.

In some embodiments, the driving assembly may further include a conveyor belt tensioned by two conveyor wheels, and the conveyor belts are disposed at two ends of the plating tank 11 along the second direction, the driving motor is in driving connection with one of the conveyor wheels, and two ends of the cross beam 31 span the plating tank 11 and are abutted against the conveyor belts at the corresponding side.

As shown in fig. 4, the plating apparatus further includes a guide member 6, and the bracket 1 is provided with the guide member 6 at both ends of the plating tank 11 in the second direction, and the guide member 6 extends in the first direction and is capable of guiding the cross member 31. Since the distance between the battery plate 100 and the anode plate 12 is relatively short when the battery plate 100 moves in the plating tank 11 along the first direction, the guide assembly 6 can guide the beam 31, so as to prevent the beam 31 from moving in the second direction to cause the collision between the battery plate 100 and the anode plate 12.

Specifically, the guide assembly 6 includes a plurality of guide bars 61 arranged at intervals in the first direction and disposed in the vertical direction, and a guide wheel 62 is rotatably connected to each guide bar 61, and the cross beam 31 is in rolling abutment with the guide wheel 62. When the cross beam 31 moves, the guide wheel 62 abuts against the cross beam 31, so that the cross beam 31 can only move along the first direction, the guide function is achieved, and the guide wheel 62 can also reduce the resistance force received by the cross beam 31.

In this embodiment, the guide rod 61 is fixedly connected to the bracket 1 through a gap between the rollers 4, and the guide assembly 6 and the rollers 4 do not affect each other.

Preferably, a plugging groove is formed in the electroplating bath 11, and the anode plate 12 is in plugging fit with the plugging groove. The anode plates 12 are detachable, so that the number of the anode plates 12 and proper plugging positions can be selected according to the electroplating requirements of the battery piece 100, thereby improving the applicability of the electroplating device.

Specifically, the bottom of the plating tank 11 is provided with a conductive plate electrically connected to the positive electrode of the power source, the insertion slot is provided on the upper surface of the conductive plate, and when the anode plate 12 is inserted into the insertion slot, the anode plate 12 is electrically connected to the conductive plate to have a positive electrode potential.

As shown in fig. 5, the electroplating apparatus further includes a conductive rail 7, the conductive rail 7 is disposed at one end of the electroplating tank 11 and extends along the first direction, the cathode assembly 3 further includes a conductive connecting member 32, the conductive connecting member 32 is slidably abutted to the conductive rail 7, and the conductive connecting member 32 is electrically connected to the battery plate 100. In order to electrically connect the battery tab 100 to the negative electrode of the power supply, it is only necessary to electrically connect the conductive rail 7 to the negative electrode of the power supply. During the movement of the cross beam 31 in the first direction, the conductive connection 32 is always in sliding abutment with the conductive rail 7, bringing the battery plate 100 to a negative potential.

Preferably, the conductive rail 7 is provided with a conductive groove 71 along a length direction, and the conductive connector 32 is located in the conductive groove 71. By providing the conductive groove 71, the reliability of connection between the conductive connecting member 32 and the conductive rail 7 can be improved, and the conductive connecting member 32 can be clamped by the two side walls of the conductive groove 71, so that the occurrence of the virtual connection phenomenon between the conductive connecting member 32 and the conductive rail 7 can be effectively prevented.

The foregoing is merely exemplary of the present invention, and those skilled in the art should not be considered as limiting the invention, since modifications may be made in the specific embodiments and application scope of the invention in light of the teachings of the present invention.

Claims

1. An electroplating apparatus, comprising:

the electroplating device comprises a bracket (1), wherein an electroplating bath (11) is arranged on the bracket (1), an anode plate (12) and electroplating liquid are arranged in the electroplating bath (11), and a first opening (111) is formed in one end of the electroplating bath (11) along a first direction;

the gate mechanism (2) comprises a first gate (21) and a second gate (22) which are arranged at intervals along the first direction, the first gate (21) and the second gate (22) are both movably connected with the bracket (1), and the first opening (111) can be opened or blocked by the first gate (21) and the second gate (22);

-a cathode assembly (3), the cathode assembly (3) comprising a cross beam (31), the cross beam (31) extending in a second direction and being capable of carrying a plurality of battery pieces (100), the cross beam (31) being capable of passing through the shutter mechanism (2) in a first direction and being moved into the plating bath (11), the battery pieces (100) entering the plating bath and being spaced from the anode plate (12), the first direction being perpendicular to the second direction;

the spacer (113), the spacer (113) set up in first opening (111) and be located between first gate (21) and second gate (22), a plurality of clearances have been seted up to spacer (113), a plurality of battery piece (100) can be followed first direction is passed through corresponding the clearance.

2. Electroplating device according to claim 1, wherein a plurality of anode plates (12) are arranged in the electroplating tank (11) at intervals along the second direction, and each cell (100) is located between two adjacent anode plates (12).

3. The plating apparatus according to claim 1, wherein said spacer (113) includes a plurality of spacer plates arranged at intervals along said second direction, and said gap is formed between adjacent two of said spacer plates.

4. Electroplating device according to claim 1, characterized in that it further comprises a drive assembly capable of driving the cathode assembly (3) to move in the first direction.

5. The electroplating device according to claim 4, wherein the driving assembly comprises a driving motor and a plurality of rollers (4), the plurality of rollers (4) are connected to the bracket (1) in a rolling manner at two ends of the electroplating bath (11) along the second direction, the plurality of rollers (4) on the same side are arranged along the first direction, two ends of the cross beam (31) span the electroplating bath (11) and are in rolling abutting connection with the rollers (4) on the corresponding side, and the driving motor can drive the plurality of rollers (4) on at least one side to rotate in the same direction.

6. Electroplating device according to claim 1, characterized in that it further comprises a guiding assembly (6), the bracket (1) being provided with the guiding assembly (6) at both ends of the electroplating bath (11) in the second direction, the guiding assembly (6) extending in the first direction and being capable of guiding the cross beam (31).

7. Electroplating device according to any one of claims 1-6, characterized in that a plugging slot is arranged in the electroplating bath (11), and the anode plate (12) is in plugging fit with the plugging slot.

8. The electroplating device according to any one of claims 1-6, wherein a second opening (112) is formed at the other end of the electroplating tank (11) along the first direction, the gate mechanism (2) is disposed at the second opening (112), and both the first gate (21) and the second gate (22) of the gate mechanism (2) can block the second opening (112) when descending.

9. The electroplating device according to any one of claims 1-6, further comprising a conductive rail (7), the conductive rail (7) being disposed at one end of the electroplating bath (11) and extending along the first direction, the cathode assembly (3) further comprising a conductive connecting member (32), the conductive connecting member (32) being in sliding abutment with the conductive rail (7), the conductive connecting member (32) being electrically connected with the battery plate (100).