CN116218460A - Organic silicon conductive adhesive and preparation method and application thereof - Google Patents
Organic silicon conductive adhesive and preparation method and application thereof Download PDFInfo
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- CN116218460A CN116218460A CN202211644979.7A CN202211644979A CN116218460A CN 116218460 A CN116218460 A CN 116218460A CN 202211644979 A CN202211644979 A CN 202211644979A CN 116218460 A CN116218460 A CN 116218460A
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- silicone oil
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- 239000000853 adhesive Substances 0.000 title claims abstract description 75
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 75
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 26
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 26
- 239000010703 silicon Substances 0.000 title claims abstract description 26
- 238000002360 preparation method Methods 0.000 title abstract description 14
- 239000000843 powder Substances 0.000 claims abstract description 32
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 31
- 239000002904 solvent Substances 0.000 claims abstract description 31
- 150000001335 aliphatic alkanes Chemical class 0.000 claims abstract description 21
- 229920002545 silicone oil Polymers 0.000 claims description 84
- 239000001257 hydrogen Substances 0.000 claims description 52
- 229910052739 hydrogen Inorganic materials 0.000 claims description 52
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 46
- 229920002554 vinyl polymer Polymers 0.000 claims description 46
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 32
- 239000003054 catalyst Substances 0.000 claims description 31
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 28
- 229920001296 polysiloxane Polymers 0.000 claims description 20
- 229910052697 platinum Inorganic materials 0.000 claims description 16
- 238000003756 stirring Methods 0.000 claims description 16
- 239000003960 organic solvent Substances 0.000 claims description 14
- 239000012752 auxiliary agent Substances 0.000 claims description 13
- 238000002156 mixing Methods 0.000 claims description 13
- 239000003921 oil Substances 0.000 claims description 9
- 239000002994 raw material Substances 0.000 claims description 7
- 239000013008 thixotropic agent Substances 0.000 claims description 5
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 claims description 3
- 239000002318 adhesion promoter Substances 0.000 claims description 3
- 239000002270 dispersing agent Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 230000000712 assembly Effects 0.000 claims 1
- 238000000429 assembly Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 16
- 238000010438 heat treatment Methods 0.000 abstract description 6
- 238000007711 solidification Methods 0.000 abstract description 5
- 230000008023 solidification Effects 0.000 abstract description 5
- 229920005989 resin Polymers 0.000 abstract description 4
- 239000011347 resin Substances 0.000 abstract description 4
- 239000006185 dispersion Substances 0.000 abstract description 3
- 238000001723 curing Methods 0.000 description 21
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 20
- 150000002431 hydrogen Chemical class 0.000 description 17
- 229910021485 fumed silica Inorganic materials 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 7
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 5
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 5
- 241000282817 Bovidae Species 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 238000009835 boiling Methods 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000012745 toughening agent Substances 0.000 description 3
- BANXPJUEBPWEOT-UHFFFAOYSA-N 2-methyl-Pentadecane Chemical compound CCCCCCCCCCCCCC(C)C BANXPJUEBPWEOT-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000012808 vapor phase Substances 0.000 description 2
- 229940043268 2,2,4,4,6,8,8-heptamethylnonane Drugs 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- KUVMKLCGXIYSNH-UHFFFAOYSA-N isopentadecane Natural products CCCCCCCCCCCCC(C)C KUVMKLCGXIYSNH-UHFFFAOYSA-N 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention provides an organosilicon conductive adhesive and a preparation method and application thereof. The organic silicon conductive adhesive comprises conductive powder, wherein the conductive powder comprises clustered silver powder; the clustered silver powder is introduced into the resin of the organic carrier, so that the contact effect can be improved, the contact point can be reduced, and the resistance after solidification can be reduced; meanwhile, the cluster silver powder is relatively large, the edge edges and corners of the cluster silver powder are relatively obvious, and when an organic curing system is cured, contact points are more, so that the phenomena of bubbles and holes generated by extremely rapid heating during rapid curing can be relatively inhibited; according to the organic silicon conductive adhesive, the high-boiling-point alkane solvent is introduced, so that the alkane solvent has a good dissolving effect on the whole organic system, the dispersion effect of conductive powder in an organic carrier is improved, and the conductivity can be increased through the dispersion density of organic matters on the conductive powder.
Description
Technical Field
The invention relates to the technical field of conductive adhesive, in particular to an organosilicon conductive adhesive and a preparation method and application thereof.
Background
The organosilicon conductive adhesive is a curable homogeneous substance obtained by uniformly dispersing an organosilicon carrier (curing phase), conductive powder, a solvent and other auxiliary agents, and comprises two main types of organosilicon resin and organosilicon rubber. The cured silicone resin has a high hardness and has a large disadvantage in terms of flexibility. At present, a large number of organic silicon rubber systems are adopted. The application range of the organosilicon conductive adhesive is very wide, and the organosilicon conductive adhesive is mainly applied to some electronic equipment, household equipment and office equipment, such as conductive silica gel keys, wire connecting pipes, photocopier rollers, cable plugs, connector gaskets, various electric appliance switches and the like, which are all required to be conductive silica gel. In the aspect of new energy, the current photovoltaic Gao Xiaodie W component also needs to use organic silicon conductive adhesive.
The organosilicon conductive adhesive component in the current market often contains nanoscale weather silica as a toughening agent to increase the tensile strength of the conductive adhesive. When the organosilicon conductive adhesive is heated and cured, the specific surface of the meteorological silica is large, the organosilicon conductive adhesive is fluffy, the crosslinking effect between chains of the organosilicon conductive adhesive is weaker during curing, and the phenomenon of bubbles after curing is caused by the effect between curing reaction and fluffy powder in the rapid heating and curing process. The presence of bubbles after curing of the silicone conductive adhesive may lead to weakening of the conductivity and also to deterioration of the connection effect between the connectors. Therefore, an organosilicon conductive adhesive free of bubbles after rapid curing is particularly important. The main conductive powder used for the organosilicon conductive adhesive in the current market is mainly flake silver powder. To ensure the use effect of the flake silver powder, the flake silver powder is required to have higher specific surface area and lower apparent density, a fluffy mechanism is easy to be heated and expanded when rapidly cured at high temperature, and the adhesive force of an organosilicon curing carrier in the system to the powder is lower, so that the situation of holes after curing can be caused.
Based on the defect that bubbles or holes exist after the current organosilicon conductive adhesive is cured, improvement is needed.
Disclosure of Invention
In view of the above, the invention provides an organosilicon conductive adhesive, a preparation method and application thereof, so as to solve the defect that bubbles exist after the organosilicon conductive adhesive is cured in the prior art.
In a first aspect, the invention provides an organosilicon conductive adhesive, which comprises the following raw materials: an organosilicon carrier, a catalyst, an organic solvent, and conductive powder;
wherein the conductive powder comprises at least one of clustered silver powder, spherical silver powder, indium powder, copper powder and silver-coated copper powder.
Preferably, the organosilicon conductive adhesive, the organosilicon carrier comprises vinyl silicone oil and hydrogen-containing silicone oil.
Preferably, the silicone conductive adhesive comprises high molecular weight vinyl silicone oil and/or low molecular weight vinyl silicone oil;
wherein the molecular weight of the high molecular weight vinyl silicone oil is 50000-70000;
the molecular weight of the low molecular weight vinyl silicone oil is 4000-6000.
Preferably, the organic silicon conductive adhesive comprises high-hydrogen silicone oil and/or low-hydrogen silicone oil;
wherein the hydrogen mass content of the high-hydrogen silicone oil is 0.5-1.0%;
the hydrogen mass content of the low-hydrogen silicone oil is 0.2-0.4%.
Preferably, the mass ratio of the vinyl silicone oil to the hydrogen-containing silicone oil in the organosilicon conductive adhesive is (1-3).
Preferably, the organic silicon conductive adhesive, the organic solvent is alkane solvent;
and/or the mass ratio of the organosilicon carrier, the catalyst, the organic solvent and the conductive powder is (5-20)/(0.05-0.1)/(1-10)/(60-100).
Preferably, the silicone conductive adhesive, the alkane solvent comprises at least one of cyclohexane, no. 120 solvent oil or No. 140 solvent oil.
Preferably, the organosilicon conductive adhesive, the catalyst is platinum catalyst;
and/or the organosilicon conductive adhesive further comprises an auxiliary agent, wherein the auxiliary agent comprises at least one of a thixotropic agent, a dispersing agent and an adhesion promoter;
the mass ratio of the auxiliary agent to the conductive powder is (0.1-3) to (60-100).
In a second aspect, the invention also provides a preparation method of the organic silicon conductive adhesive, which is characterized by comprising the following steps:
mixing the organosilicon carrier and the organic solvent, stirring, adding conductive powder, optional auxiliary agent and catalyst, continuously stirring, and solidifying at 150-200 ℃ to obtain the organosilicon conductive adhesive.
In a third aspect, the invention also provides application of the organosilicon conductive adhesive in a photovoltaic shingle assembly, an electronic component and a printed circuit board.
Compared with the prior art, the organic silicon conductive adhesive and the preparation method thereof have the following beneficial effects:
1. the organic silicon conductive adhesive comprises conductive powder, wherein the conductive powder comprises at least one of clustered silver powder, spherical silver powder, indium powder, copper powder and silver-coated copper powder; the clustered silver powder is introduced into the resin of the organic carrier, so that the contact effect can be improved, the contact point can be reduced, and the resistance after solidification can be reduced; meanwhile, the cluster silver powder is relatively large, the edge edges and corners of the cluster silver powder are relatively obvious, and when an organic curing system is cured, contact points are more, so that the phenomena of bubbles and holes generated by extremely rapid heating during rapid curing can be relatively inhibited;
2. the organic silicon conductive adhesive adopts high molecular weight vinyl silicone oil, and the high molecular weight vinyl silicone oil is used for replacing fumed silica in the prior art; the applicant finds through continuous experimental comparison that the content of the fumed silica in the organic silicon conductive adhesive of the system has obvious trend with bubbles: that is, the higher the fumed silica content, the more serious the air bubbles are in the cured product after quick curing, and the simple reduction of the amount of the fumed silica used as a toughening agent and a thixotropic agent in the organosilicon conductive adhesive has great negative effect on the final product performance. It is therefore desirable to increase the content of high molecular weight vinyl silicone oils while reducing or eliminating the use of vapor phase silicon dioxide;
3. according to the invention, the organic solvent of the organic silicon conductive adhesive is an alkane solvent, and the vinyl silicone oil and the hydrogen-containing silicone oil in the organic silicon conductive adhesive are relatively similar to the alkane structure by introducing the alkane solvent with high boiling point, so that the alkane solvent has good dissolving effect on the whole organic system according to the similar compatibility principle, and is beneficial to the dispersing effect of conductive powder in an organic carrier, thereby increasing the conductivity through the dispersing density of the organic matters on the conductive powder. High boiling point solvents relatively low boiling point solvents are not prone to bubble formation when rapidly cured by heat.
Detailed Description
The following description of the embodiments of the present invention will be made in detail and with reference to the embodiments of the present invention, but it should be apparent that the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, are intended to fall within the scope of the present invention.
The embodiment of the application provides an organosilicon conductive adhesive, and a preparation method and application thereof. The following will describe in detail. The following description of the embodiments is not intended to limit the preferred embodiments. In addition, in the description of the present application, the term "comprising" means "including but not limited to". Various embodiments of the invention may exist in a range of forms; it should be understood that the description in a range format is merely for convenience and brevity and should not be construed as a rigid limitation on the scope of the invention; it is therefore to be understood that the range description has specifically disclosed all possible sub-ranges and individual values within that range. For example, it should be considered that a description of a range from 1 to 6 has specifically disclosed sub-ranges, such as from 1 to 3, from 1 to 4, from 1 to 5, from 2 to 4, from 2 to 6, from 3 to 6, etc., as well as single numbers within the ranges, such as 1, 2, 3, 4, 5, and 6, wherever applicable. In addition, whenever a numerical range is referred to herein, it is meant to include any reference number (fractional or integer) within the indicated range.
The embodiment of the application provides an organosilicon conductive adhesive, which comprises the following raw materials: an organosilicon carrier, a catalyst, an organic solvent, and conductive powder;
wherein the conductive powder comprises clustered silver powder.
It should be noted that the silicone conductive adhesive of the present application includes conductive powder including clustered silver powder; the clustered silver powder is introduced into the resin of the organic carrier, so that the contact effect can be improved, the contact point can be reduced, and the resistance after solidification can be reduced; meanwhile, the cluster silver powder is relatively large, the edge angles of the cluster silver powder are relatively obvious, and when an organic curing system is cured, contact points are more, so that the phenomena of bubbles and holes generated by extremely rapid heating during rapid curing can be relatively inhibited.
In some embodiments, the silicone carrier includes a vinyl silicone oil and a hydrogen-containing silicone oil.
In some embodiments, the vinyl silicone oil comprises a high molecular weight vinyl silicone oil and/or a low molecular weight vinyl silicone oil;
wherein the molecular weight of the high molecular weight vinyl silicone oil is 50000-70000, preferably 60000;
the molecular weight of the low molecular weight vinyl silicone oil is 4000-6000, preferably 5000.
Specifically, the vinyl silicone oil adopts high molecular weight vinyl silicone oil, and the high molecular weight vinyl silicone oil is used for replacing fumed silica in the prior art; the applicant finds through continuous experimental comparison that the content of the fumed silica in the organic silicon conductive adhesive of the system has obvious trend with bubbles: that is, the higher the fumed silica content, the more serious the air bubbles are in the cured product after quick curing, and the simple reduction of the amount of the fumed silica used as a toughening agent and a thixotropic agent in the organosilicon conductive adhesive has great negative effect on the final product performance. It is therefore desirable to increase the content of high molecular weight vinyl silicone oils while reducing or eliminating the use of vapor phase silicon dioxide.
In some embodiments, the hydrogen-containing silicone oil comprises a high hydrogen-containing silicone oil and/or a low hydrogen-containing silicone oil;
wherein the hydrogen mass content of the high hydrogen silicone oil is 0.5-1.0%, preferably 0.7%;
the hydrogen mass content of the low-hydrogen silicone oil is 0.2-0.4%, preferably 0.35%.
In some embodiments, the mass ratio of vinyl silicone oil to hydrogen-containing silicone oil in the silicone carrier is (1-3): 1-3.
In some embodiments, the organic solvent is an alkane solvent. By introducing the alkane solvent with high boiling point, the vinyl silicone oil and the hydrogen-containing silicone oil in the organic silicon conductive adhesive have relatively similar molecular chain structures with alkane structures, and according to the similar compatibility principle, the alkane solvent has good dissolving effect on the whole organic system, thereby being beneficial to improving the dispersing effect of the conductive powder in the organic carrier, and further improving the conductivity through the dispersing density of the organic matters on the conductive powder.
In some embodiments, the alkane solvent comprises at least one of cyclohexane, no. 120 solvent oil, or No. 140 solvent oil, isopar (i.e., isopar isohexadecane, isopar is an Isopar solvent oil, which is an alkane solvent oil), isopar L (Isopar L is an Isopar solvent oil).
Specifically, the thixotropic property is increased by introducing high molecular weight vinyl silicone oil, and the dispersibility is improved by selecting a solvent which is better in solubility to the silicone.
In some embodiments, the catalyst is a platinum catalyst; the platinum catalyst is a latent catalyst, the catalyst does not work at normal temperature, and the active functional group is exposed to play a role in catalysis after being heated, so that the curing reaction is completed.
In some embodiments, the mass ratio of the organosilicon carrier, the catalyst, the organic solvent, and the conductive powder is (5-20): 0.05-0.1): 1-10): 60-100.
In some embodiments, the silicone conductive paste further comprises an auxiliary agent comprising at least one of a thixotropic agent, a dispersing agent, and an adhesion promoter.
In some embodiments, the mass ratio of the auxiliary agent to the conductive powder is (0.1-3): 60-100.
Based on the same inventive concept, the embodiment of the application also provides a preparation method of the organic silicon conductive adhesive, which is characterized by comprising the following steps:
mixing the organosilicon carrier and the organic solvent, stirring, adding conductive powder, optional auxiliary agent and catalyst, continuously stirring, and solidifying at 150-200 ℃ to obtain the organosilicon conductive adhesive.
Specifically, mixing an organosilicon carrier and an organic solvent, uniformly stirring, adding conductive powder, optional auxiliary agents and a catalyst, mixing, uniformly stirring, dispersing by using a three-roller mill, and curing at 150-200 ℃ for 15-30 s to obtain organosilicon conductive adhesive; wherein, the solidification adopts either infrared lamp tube heating or drying oven blast heating.
Based on the same inventive concept, the embodiment of the application also provides application of the organic silicon conductive adhesive in a photovoltaic shingle assembly, an electronic component and a printed circuit board.
The silicone conductive paste and the preparation method thereof of the present application are further described in the following specific examples. This section further illustrates the summary of the invention in connection with specific embodiments, but should not be construed as limiting the invention. The technical means employed in the examples are conventional means well known to those skilled in the art, unless specifically stated. Unless specifically stated otherwise, the reagents, methods and apparatus employed in the present invention are those conventional in the art.
Example 1
The embodiment of the application provides an organosilicon conductive adhesive, which comprises the following raw materials in parts by weight:
5 parts of low molecular weight vinyl silicone oil (molecular weight: 5000), 10 parts of high molecular weight vinyl silicone oil (molecular weight: 60000), 0.8 part of high hydrogen silicone oil (hydrogen mass content: 0.7%), 0.2 part of low hydrogen silicone oil (hydrogen mass content: 0.35%), 80 parts of clustered silver powder (purchased from Guangdong antelope light New materials Co., ltd.), 2 parts of alkane solvent (ISOparom), 0.1 part of platinum catalyst (Windon pt2000 platinum catalyst).
The preparation method of the organic silicon conductive adhesive comprises the following steps:
mixing 5 parts of low molecular weight vinyl silicone oil, 10 parts of high molecular weight vinyl silicone oil, 0.8 part of high hydrogen silicone oil, 0.2 part of low hydrogen silicone oil and 2 parts of alkane solvent, uniformly stirring, adding 80 parts of clustered silver powder and 0.1 part of platinum catalyst, continuously mixing, stirring, and curing at 200 ℃ for 30s to obtain the organosilicon conductive adhesive.
Example 2
The embodiment of the application provides an organosilicon conductive adhesive, which comprises the following raw materials in parts by weight:
5 parts of low molecular weight vinyl silicone oil (molecular weight: 5000), 10 parts of high molecular weight vinyl silicone oil (molecular weight: 60000), 0.8 part of high hydrogen silicone oil (hydrogen mass content: 0.7%), 0.2 part of low hydrogen silicone oil (hydrogen mass content: 0.35%), 75 parts of clustered silver powder (purchased from Guangdong antelope light New materials Co., ltd.), 2 parts of alkane solvent (ISOparom), 0.1 part of platinum catalyst (Windon pt2000 platinum catalyst).
The preparation method of the organic silicon conductive adhesive comprises the following steps:
mixing 5 parts of low molecular weight vinyl silicone oil, 10 parts of high molecular weight vinyl silicone oil, 0.8 part of high hydrogen silicone oil, 0.2 part of low hydrogen silicone oil and 2 parts of alkane solvent, uniformly stirring, adding 75 parts of clustered silver powder and 0.1 part of platinum catalyst, continuously mixing, stirring, and curing at 200 ℃ for 30s to obtain the organosilicon conductive adhesive.
Comparative example 1
The comparative example provides an organic silicon conductive adhesive, which comprises the following raw materials in parts by weight:
10 parts of low molecular weight vinyl silicone oil (molecular weight: 5000), 5 parts of high molecular weight vinyl silicone oil (molecular weight: 60000), 0.8 part of high hydrogen silicone oil (hydrogen mass content: 0.7%), 0.2 part of low hydrogen silicone oil (hydrogen mass content: 0.35%), 80 parts of clustered silver powder (purchased from Guangdong antelope light New materials Co., ltd.), 2 parts of diethylene glycol monobutyl ether, 1 part of fumed silica, and 0.05 part of platinum catalyst (Yalong pt2000 platinum catalyst).
The preparation method of the organic silicon conductive adhesive comprises the following steps:
mixing 10 parts of low molecular weight vinyl silicone oil, 5 parts of high molecular weight vinyl silicone oil, 0.8 part of high hydrogen silicone oil, 0.2 part of low hydrogen silicone oil, 2 parts of diethylene glycol monobutyl ether and 1 part of fumed silica, uniformly stirring, adding 80 parts of clustered silver powder and 0.05 part of platinum catalyst, continuously mixing, stirring, and curing for 30S at 200 ℃ to obtain the organosilicon conductive adhesive.
Comparative example 2
The comparative example provides an organic silicon conductive adhesive, which comprises the following raw materials in parts by weight:
10 parts of low molecular weight vinyl silicone oil (molecular weight: 5000), 5 parts of high molecular weight vinyl silicone oil (molecular weight: 60000), 0.8 part of high hydrogen silicone oil (hydrogen mass content: 0.7%), 0.2 part of low hydrogen silicone oil (hydrogen mass content: 0.35%), 80 parts of clustered silver powder (purchased from Guangdong antelope light New materials Co., ltd.), 2 parts of diethylene glycol monobutyl ether, and 0.1 part of platinum catalyst (dragon pt2000 platinum catalyst).
The preparation method of the organic silicon conductive adhesive comprises the following steps:
mixing 10 parts of low molecular weight vinyl silicone oil, 5 parts of high molecular weight vinyl silicone oil, 0.8 part of high hydrogen silicone oil, 0.2 part of low hydrogen silicone oil and 2 parts of diethylene glycol monobutyl ether, uniformly stirring, adding 80 parts of clustered silver powder and 0.1 part of platinum catalyst, continuously mixing, stirring, and curing at 200 ℃ for 30s to obtain the organosilicon conductive adhesive.
Performance testing
The properties of the silicone conductive adhesives prepared in examples 1 to 2 and comparative examples 1 to 2 were respectively tested, and the results are shown in table 1 below.
TABLE 1 Properties of Silicone conductive gums prepared in examples 1-2 and comparative examples 1-2
In Table 1, slight voids refer to a thickness of 0.5cm, 1cm 2 The proportion of the cut surface of the trace after the solidification of the large and small conductive adhesive to the open cavity is not more than 20 percent.
As can be seen from table 1, the silicone conductive adhesive prepared in examples 1 to 2 has no holes; and compared with comparative example 1, the conductive paste has lower resistivity, because alkane solvent is used for replacing diethylene glycol monobutyl ether, the dispersion effect of conductive powder clustered silver powder in an organic carrier is improved, and the conductivity of the organosilicon conductive paste is further improved.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the invention.
Claims (10)
1. The organic silicon conductive adhesive is characterized by comprising the following raw materials: an organosilicon carrier, a catalyst, an organic solvent, and conductive powder;
wherein the conductive powder comprises clustered silver powder.
2. The silicone conductive paste of claim 1, wherein the silicone carrier comprises a vinyl silicone oil and a hydrogen-containing silicone oil.
3. The silicone conductive adhesive according to claim 2, wherein the vinyl silicone oil comprises a high molecular weight vinyl silicone oil and/or a low molecular weight vinyl silicone oil;
wherein the molecular weight of the high molecular weight vinyl silicone oil is 50000-70000;
the molecular weight of the low molecular weight vinyl silicone oil is 4000-6000.
4. The silicone conductive adhesive according to claim 2, wherein the hydrogen-containing silicone oil comprises a high hydrogen-containing silicone oil and/or a low hydrogen-containing silicone oil;
wherein the hydrogen mass content of the high-hydrogen silicone oil is 0.5-1.0%;
the hydrogen mass content of the low-hydrogen silicone oil is 0.2-0.4%.
5. The organosilicon conductive adhesive according to claim 2, wherein the mass ratio of the vinyl silicone oil to the hydrogen-containing silicone oil in the organosilicon carrier is (1-3): 1-3.
6. The silicone conductive paste according to any one of claims 1 to 5, wherein the organic solvent is an alkane solvent;
and/or the mass ratio of the organosilicon carrier, the catalyst, the organic solvent and the conductive powder is (5-20)/(0.05-0.1)/(1-10)/(60-100).
7. The silicone conductive adhesive of claim 6, wherein the alkane solvent comprises at least one of cyclohexane, no. 120 solvent oil, or No. 140 solvent oil.
8. The silicone conductive paste of claim 1, wherein the catalyst is a platinum catalyst;
and/or the organosilicon conductive adhesive further comprises an auxiliary agent, wherein the auxiliary agent comprises at least one of a thixotropic agent, a dispersing agent and an adhesion promoter;
the mass ratio of the auxiliary agent to the conductive powder is (0.1-3) to (60-100).
9. A method for preparing the organic silicon conductive adhesive as claimed in any one of claims 1 to 8, comprising the steps of:
mixing the organosilicon carrier and the organic solvent, stirring, adding conductive powder, optional auxiliary agent and catalyst, continuously stirring, and solidifying at 150-200 ℃ to obtain the organosilicon conductive adhesive.
10. Use of the silicone conductive paste according to any one of claims 1 to 8 in photovoltaic shingle assemblies, electronic components and printed circuit boards.
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