CN116130390B - Temperature detection device and heat treatment equipment - Google Patents

Abstract

The invention relates to a temperature detection device and heat treatment equipment. The temperature detection device is used for carrying out temperature detection in the heat treatment equipment, and comprises: the bearing plate is provided with a first through hole and a second through hole, and is provided with a mounting surface, the mounting surface is provided with a first mounting area and a second mounting area, the first through hole is arranged in the first mounting area, and the second through hole is arranged in the second mounting area; the movable plate is accommodated in the second through hole in an openable and closable manner; a first temperature detection module mounted to the first mounting region of the mounting surface; and the second temperature sensing module is arranged in the second installation area of the installation surface. During the heat treatment, the movable plate can protect the second temperature sensing module below from volatile substances. When the temperature sensor is used, the movable plate can be opened to expose the second temperature sensing module, so that the second temperature sensing module detects the relatively real temperature.

Description

Temperature detection device and heat treatment equipment

Technical Field

The present disclosure relates to integrated circuit technology, and in particular, to a temperature detecting device and a heat treatment apparatus.

Background

With the development of scale integrated circuits, the device size of individual integrated circuits is continually shrinking to improve device performance, reduce power consumption, and reduce chip area, thereby causing various serious short channel effects. In order to ensure the product yield and reduce the fluctuation of performance parameters among devices, the temperature uniformity in the chip and the temperature repeatability among chips of the rapid thermal processing technology are more and more important.

In integrated circuit production processes, rapid thermal processing is commonly used for annealing after ion implantation, rapid thermal oxidation, metal silicide formation, and the like. During the rapid thermal processing process, dopant atoms may diffuse and redistribute at high temperatures. Especially, the rapid heat treatment process after light doping or heavy doping has great influence on key performance parameters of the device such as threshold voltage, driving current, grid overlap capacitance and the like because the diffusion degree of doping atoms to a channel is directly controlled by the heat treatment temperature.

In the heat treatment process of the wafer, in order to achieve better temperature uniformity control in the chip and better temperature repeatability between chips, fixed temperature sensors are arranged at different positions in the equipment. Comparing the temperature value detected by the temperature sensor with an ideal temperature value, and timely adjusting the output power of the heating equipment in the corresponding area to improve the temperature uniformity in the chip.

However, during the heat treatment, the probe of the temperature sensor may be contaminated. During heating, part of pollutants can volatilize on the surface or the back of the wafer and deposit on the probe of the temperature sensor, so that the deviation between the temperature value detected by the temperature sensor and the actual temperature value is caused, and the temperature uniformity in the chip is further affected.

Disclosure of Invention

Based on this, it is necessary to provide a temperature detecting device and a heat treatment apparatus for solving the problem that the probe of the temperature sensor in the prior art is contaminated.

In order to achieve the above object, in one aspect, the present invention provides a temperature detecting device for detecting a temperature in a heat treatment apparatus, comprising:

the bearing plate is provided with a first through hole and a second through hole, and is provided with a mounting surface, the mounting surface is provided with a first mounting area and a second mounting area, the first through hole is arranged in the first mounting area, and the second through hole is arranged in the second mounting area;

the movable plate is accommodated in the second through hole in an openable and closable manner;

a first temperature detection module mounted to the first mounting region of the mounting surface;

and the second temperature sensing module is arranged in the second installation area of the installation surface.

In one embodiment, the movable plate is movably connected with the bearing plate.

In one embodiment, the bearing plate is circular, and is provided with a plurality of first through holes distributed along the radial direction, the temperature detection device comprises a plurality of first temperature detection modules, and the first temperature detection modules are arranged in one-to-one correspondence with the first through holes.

In one embodiment, the second through hole extends along a radial direction, and the second temperature sensing module is movably arranged in the second mounting area.

In one embodiment, the temperature detecting device includes a driving module, where the driving module is connected to the second temperature sensing module and is used to drive the second temperature sensing module to move in the second installation area.

In one embodiment, the temperature detection device comprises a position detection module electrically connected to the second temperature sensing module and configured to obtain the position of the second temperature sensing module.

In one embodiment, the temperature detecting device comprises a control module electrically connected with the movable plate and used for controlling the movable plate to be opened or closed.

In one embodiment, the carrier plate and the movable plate are both reflective plates.

The present invention also provides a heat treatment apparatus comprising:

a heating device for heating the wafer;

in the foregoing temperature detecting device, the heating apparatus is located above the carrier plate.

In one embodiment, the heat treatment apparatus includes:

the supporting frames are positioned at two sides of the bearing plate and used for supporting the wafer;

and the power output device is connected with the heating equipment and used for adjusting the power of the heating equipment.

The temperature detection device and the heat treatment equipment have the following beneficial effects: during the heat treatment, the movable plate can protect the second temperature sensing module below from volatile substances. When the temperature sensor is used, the movable plate can be opened to expose the second temperature sensing module, so that the second temperature sensing module detects the relatively real temperature.

Drawings

In order to more clearly illustrate the technical solutions of embodiments or conventional techniques of the present application, the drawings required for the descriptions of the embodiments or conventional techniques will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person of ordinary skill in the art.

FIG. 1 is a schematic view of a heat treatment apparatus provided in one embodiment;

FIG. 2 is a schematic view of a heat treatment apparatus provided in another embodiment;

FIG. 3 is a schematic diagram of a temperature detecting device according to an embodiment;

FIG. 4 is a top view of a temperature sensing device according to one embodiment;

FIG. 5 is a top view of a temperature sensing device provided in another embodiment;

FIG. 6 is a top view of a related art reflection plate according to an embodiment;

FIG. 7 is a cross-sectional view of a related art reflection plate according to an embodiment;

FIG. 8 is a flow chart of a temperature detection method according to an embodiment.

Reference numerals illustrate:

a temperature detection device-100; a carrier plate-110; a movable plate 120; a first through-hole-130; a first temperature sensing module-131; a second through hole-140; a second temperature sensing module-141; a driving module-150; a position detection module-160; heating equipment-200; a power output means-210; a temperature controller-220; simulating a wafer-300; support frame-400.

Detailed Description

In order to facilitate an understanding of the present application, a more complete description of the present application will now be provided with reference to the relevant figures. Preferred embodiments of the present application are shown in the drawings. This application may, however, be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

It will be understood that when an element or layer is referred to as being "on," "adjacent to," "connected to" another element or layer, it can be directly on, adjacent to, connected to the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on," "directly adjacent to," "directly connected to" another element or layer, there are no intervening elements or layers present. It will be understood that, although the terms first, second, third, etc. may be used to describe various elements, components, these elements, components should not be limited by these terms. These terms are only used to distinguish one element or component from another element or component. Thus, a first element, component discussed below could be termed a second element, component without departing from the teachings of the present invention.

Spatially relative terms, such as "under", "below", "beneath", "under", "above", "over" and the like, may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use and operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements or features described as "under" or "beneath" other elements would then be oriented "on" the other elements or features. Thus, the exemplary terms "below" and "under" may include both an upper and a lower orientation. Furthermore, the device may also include an additional orientation (e.g., rotated 90 degrees or other orientations) and the spatial descriptors used herein interpreted accordingly.

As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. Also, as used herein, the term "and/or" includes any and all combinations of the associated listed items.

Embodiments of the invention are described herein with reference to cross-sectional illustrations that are schematic illustrations of idealized embodiments of the invention, such that variations of the illustrated shapes due to, for example, manufacturing techniques and/or tolerances are to be expected. Thus, embodiments of the present invention should not be limited to the particular shapes of the regions illustrated herein, but rather include deviations in shapes that result, for example, from manufacturing techniques. The regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of the invention.

In one embodiment, referring to fig. 1, a thermal processing apparatus is provided for thermally processing a wafer. As an example, the heat treatment apparatus may perform rapid heat treatment on the wafer. The heat treatment apparatus includes a heating apparatus 200 and a temperature detecting device 100, the heating apparatus 200 being located above the temperature detecting device 100.

The heating apparatus 200 is used to heat the wafer. As an example, the heating apparatus 200 may include a halogen lamp. Halogen gas such as iodine or bromine can be injected into the bulb of the halogen lamp.

The temperature detection device 100 is used for temperature detection in a heat treatment apparatus. As an example, the temperature detection device 100 includes a temperature sensor. The temperature detecting device 100 may be located under the wafer for detecting the temperature of the back surface of the wafer.

In one embodiment, referring to fig. 2, a heat treatment apparatus includes: a support 400 and a power take off 210.

A support frame 400 is positioned below the heating apparatus 200 for supporting a wafer. At this time, the temperature detecting device 100 is located between the supporting frames 400.

The power output means 210 is connected to the heating device 200 for adjusting the power of the heating device 200. As an example, the power output device 210 may be a programmable power output device. For example, the programmable power output device 210 may include a silicon controlled rectifier (Silicon Controlled Rectifier, SCR) or an insulated gate field effect transistor (Insulated Gate Bipolar Transistor, IGBT). Of course, the programmable power output device 210 may also have other corresponding control circuit combinations, such as controllable rectification, inversion, frequency conversion, voltage regulation, contactless switch, ac motor speed regulation, switching power supply, lighting circuit, traction drive, etc.

Of course, the heat treatment apparatus may further include a temperature controller 220. The temperature controller 220 is connected to the power output device 210 and to the temperature detecting device 100. The temperature controller 220 may control the power output device 210 according to the inputted set temperature, or may adjust the power output device 210 according to the feedback result of the temperature detecting device 100.

In one embodiment, referring to fig. 3, the temperature detecting apparatus 100 includes: the carrier plate 110, the movable plate 120, the first temperature detecting module 131 and the second temperature sensing module 141.

Referring to fig. 4, the carrier plate 110 is provided with a first through hole 130 and a second through hole 140, and the carrier plate 110 has a mounting surface. As an example, the mounting surface may be a bottom surface of the carrier plate 110. The mounting surface may have a first mounting region with a first through hole 130 therein and a second mounting region with a second through hole 140 therein.

Referring to fig. 5, the movable plate 120 may be movably accommodated in the second through hole 140. For example, the movable plate 120 may be opened or closed. When the movable plate 120 is opened, the second through hole 140 is exposed. When the movable plate 120 is closed, the second through hole 140 is covered.

The carrier plate 110 and the movable plate 120 may be both reflective plates. When the movable plate 120 is closed, the carrier plate 110 and the movable plate 120 may reflect heat together. When the movable plate 120 is opened, the loading plate 110 reflects heat.

The first temperature detection module 131 is mounted on the first mounting area and located below the first through hole 130. The second temperature sensing module 141 is mounted on the second mounting area and is located below the second through hole 140. When the movable plate 120 is closed, the first through hole 130 exposes the first temperature sensing module 131, and the second temperature sensing module 141 is shielded. When the movable plate 120 is opened, the second temperature sensing module 141 is exposed. At this time, the first through hole 130 still exposes the first temperature detecting module 131. As an example, both the first temperature detection module 131 and the second temperature sensing module 141 may include temperature sensors. The first temperature detecting module 131 can detect the temperature of the analog wafer 300 in real time, and the signal thereof can be sent to the temperature controller 220 after photoelectric conversion, and the output power of the power output device 210 is controlled by the output signal of the temperature controller 220.

In the prior art, referring to fig. 6 and 7, the first through hole 130 of the carrier plate 110 exposes the first temperature detection module 131. When the wafer is heated, volatile compounds in the wafer may spill over. For example, volatile compounds include phosphorus-containing compounds. These volatile compounds may deposit on the surface of the first temperature detection module 131, and affect the temperature of the wafer detected by the first temperature detection module 131.

In the above embodiment, the second temperature sensing module 141 under the movable plate 120 is protected by providing the movable plate 120 that can be opened and closed. During the heat treatment, when the second temperature sensing module 141 is not required, the movable plate 120 may be closed to cover the second temperature sensing module 141. The first temperature detection module 131 detects the temperature of the wafer. When the second temperature sensing module 141 is required to be used, the movable plate 120 may be opened to expose the second temperature sensing module 141. The second temperature sensing module 141 has almost no volatile compound deposited on the surface due to the protection of the movable plate 120. At this time, the second temperature sensing module 141 may detect a relatively real wafer temperature. By comparing the first temperature value transmitted by the first temperature detection module 131 with the second temperature value transmitted by the second temperature sensing module 141, a difference between the first temperature value and the second temperature value, i.e., a temperature compensation value, can be calculated. And then adjusts the output power of the power output device 210 based on the temperature compensation value, thereby controlling the heating apparatus 200 such that the product wafer is at the set temperature.

As an example, the dummy wafer 300 may be placed on the support frame 400 first, and then the power output device 210 may be controlled so that the heating apparatus 200 heats the dummy wafer 300. Meanwhile, the first temperature detection module 131 detects the temperature of the wafer. When the first temperature detecting module 131 detects that the simulated wafer 300 is at a specific temperature value, the movable plate 120 is opened, so that the second temperature sensing module 141 can also detect the temperature of the simulated wafer 300. And comparing the first temperature value transmitted by the first temperature detection module 131 with the second temperature value transmitted by the second temperature sensing module 141 to obtain a temperature compensation value. The movable plate 120 is closed and the coefficient of the power output device 210 is adjusted based on the temperature compensation value. The product wafer may then be transferred onto the support 400, and the temperature of the product wafer may be detected by the first temperature detection module 131.

Since the second temperature sensing module 141 is used to detect the temperature of the dummy wafer 300, and based on the temperature compensation value, the coefficient of the power output device 210 is adjusted. At this time, the heating apparatus 200 may be controlled to heat the product wafer using the adjusted power output device 210 so that the product wafer is at a desired temperature.

Specifically, when the first temperature detecting module 131 and the second temperature sensing module 141 may both include temperature sensors, the temperature sensors may include a bimetal thermometer, a glass liquid thermometer, a pressure type thermometer, a resistance thermometer, a thermistor, a thermocouple, and the like.

In one embodiment, referring to fig. 5, the movable plate 120 is movably connected to the carrier plate 110. At this time, when the movable plate 120 is opened or closed, the movable plate 120 is connected to the carrier plate 110.

Of course, when the movable plate 120 is opened, the movable plate 120 may be provided separately from the carrier plate 110. Alternatively, the movable plate 120 is rotatably coupled to the carrier plate 110, i.e., the movable plate 120 may include a rotation shaft. At this time, when the second temperature sensing module 141 is not required to detect the temperature, the second temperature sensing module 141 faces away from the wafer. When the second temperature sensing module 141 is required to detect temperature, the rotation shaft may be rotated such that the second temperature sensing module 141 faces the wafer.

In one embodiment, referring to fig. 4, the top view of the carrier plate 110 is circular, and a plurality of first through holes 130 are disposed along the radial direction. At this time, the temperature detecting device 100 includes a plurality of first temperature detecting modules 131, where the first temperature detecting modules 131 are disposed in one-to-one correspondence with the first through holes 130.

As an example, the first temperature detection module 131 may have seven. The plurality of first temperature detection modules 131 may be arranged along a radial direction of the carrier plate 110 to detect temperatures of the dummy wafer 300 or the product wafer at different radii.

Of course, the carrier plate 110 may have other shapes, and the first through holes 130 may be distributed in other manners. As an example, the first through holes 130 may be distributed at the periphery of the carrier plate 110, or the first through holes 130 may be disposed around the center of the carrier plate 110.

In one embodiment, referring to fig. 4, the second through hole 140 extends in a radial direction, and the second temperature sensing module 141 is movably disposed below the second through hole 140.

The second through holes 140 may also extend in a radial direction, but in a different direction from the arrangement of the first temperature detection modules. As an example, the top view of the second through hole 140 may be rectangular.

The second temperature sensing module 141 may be movable under the second through hole 140. Specifically, the second temperature sensing module 141 may be moved to a position having the same radius as the first temperature sensing module 131. As an example, seven first temperature sensing modules 131 are arranged along the radial direction of the carrier plate 110, and the second temperature sensing module 141 also has seven moving positions corresponding to each of the first temperature sensing modules 131 one by one.

Of course, the second through holes 140 may be distributed in other directions. As an example, the second through hole 140 may have a circular shape. Alternatively, there may be a plurality of second through holes 140, and the plurality of second through holes 140 may be uniformly distributed in the carrier plate 110.

In one embodiment, referring to fig. 3, the temperature detecting device 100 includes a driving module 150, where the driving module 150 is connected to the second temperature sensing module 141 and is used for driving the second temperature sensing module 141 to move under the second through hole 140.

As an example, the drive module 150 includes an electric or hydraulic transmission to effect movement of the second temperature sensing module 141 in a radial direction.

In particular, where the drive module 150 includes an electric transmission, the electric transmission may include an electric motor, a transmission mechanism for transmitting mechanical energy, an electrical control device for controlling the operation of the motor, and the like.

In particular, when the drive module 150 includes a hydraulic transmission, the hydraulic transmission may include hydraulic components (hydraulic oil pump), hydraulic control components (various hydraulic valves), hydraulic actuators (hydraulic cylinders, hydraulic motors, etc.), hydraulic auxiliaries (oil tanks, oil filters, piping and joints, coolers, pressure gauges, accumulators, etc.), and hydraulic oil, etc.

In one embodiment, referring to fig. 3, the temperature detecting device 100 includes a position detecting module 160, where the position detecting module 160 is electrically connected to the second temperature sensing module 141 and is used to obtain the position of the second temperature sensing module 141.

When the driving module 150 drives the second temperature sensing module 141 to move under the second through hole 140, the position detecting module 160 may determine a specific position of the second temperature sensing module 141. As an example, the position detection module 160 may include a position sensor.

Specifically, the position detection module 160 may be a linear displacement sensor, a pull-cord displacement sensor, an angular displacement sensor, a magnetostrictive displacement sensor, or a laser displacement sensor. For example, when the position detection module 160 is a linear displacement sensor, the linear displacement sensor can convert a linear mechanical displacement amount into an electrical signal. The linear displacement sensor generally comprises a variable resistance sliding rail which is fixed at a fixed part of the linear displacement sensor, and different resistance values are measured through the displacement of the sliding sheet on the sliding rail.

After the driving module 150 drives the second temperature sensing module 141 to move under the second through hole 140, the position detecting module 160 obtains different position data of the second temperature sensing module 141, and the plurality of second temperature values detected by the second temperature sensing module 141 may be compared with the plurality of first temperature values detected by the first temperature sensing module 131 to obtain a plurality of temperature compensation values, and finally obtain the temperature compensation table.

When the product wafer is subsequently heat-treated, the movable plate 120 may be closed, and the temperature of the product wafer may be detected using the first temperature sensing module 131. After receiving the first temperature value, a corresponding second temperature value in the temperature compensation table is searched, and the coefficient of the power output device 210 is adjusted together based on the first temperature value and the second temperature value. Therefore, the product wafers which need to be subjected to heat treatment later are in the set target temperature, the temperature of each position of the product wafers is uniform, and the heating equipment 200 can repeatedly heat a plurality of product wafers, so that the efficiency is improved.

In one embodiment, the temperature detection device 100 includes a control module. The control module is electrically connected to the movable plate 120, and is used for controlling the movable plate 120 to be opened or closed. Of course, the control module may be integrated with the temperature controller 220.

Based on the same inventive concept, referring to fig. 8, in one embodiment, a temperature detection method is provided. Specifically, the temperature detection device 100 may be connected to a server. The temperature detection method is applied to the server and comprises the following steps of:

step S100: the heating apparatus 200 is activated to heat the dummy wafer 300. Meanwhile, the first temperature value transmitted by each first temperature sensing module 131 is received.

Step S200: the movable plate 120 is opened, the second temperature sensing module 141 is controlled to move, and the second temperature value transmitted by the second temperature sensing module 141 is received.

Step S300: based on the first temperature value and the second temperature value of each position, a temperature compensation value is calculated, and a temperature compensation table is generated.

Step S400: based on the temperature compensation table, the output power of the heating apparatus 200 is adjusted.

In step S100, the dummy wafer 300 may be transferred onto the support frame 400. The heating apparatus 200 is connected to a power output device 210, and the power output device 210 is connected to a temperature controller 220. The temperature controller 220 controls the heating temperature of the heating apparatus 200 by controlling the power output device 210.

At this time, the movable plate 120 is closed, and reflects the heat emitted from the back surface of the dummy wafer 300 together with the carrier plate 110, and reflects the heat to other areas of the back surface of the dummy wafer 300, so that the heat of the dummy wafer 300 is more uniform.

The plurality of first temperature sensing modules 131 are arranged radially under the carrier plate 110 to detect temperatures at different radii of the dummy wafer 300.

In step S200, the movable plate 120 is opened, exposing the second temperature sensing module 141. The driving module 150 drives the second temperature sensing module 141 to move, and the position sensing module transmits the position where the second temperature sensing module 141 moves.

It is understood that each position where the second temperature sensing module 141 moves may correspond to a plurality of positions where the first temperature sensing modules 131 are arranged in the radial direction. As an example, seven first temperature sensing modules 131 are arranged in a radial direction, and the second temperature sensing module 141 may have seven moving positions, so that the second temperature value detected by the second temperature sensing module 141 and the first temperature value detected by the first temperature sensing module 131 each represent a temperature of the same radius of the dummy wafer 300. At this time, the position where the second temperature sensing module 141 transferred by the position sensing module moves may correspond to the positions of the plurality of first temperature sensing modules 131.

In step S300, the same radius of the simulated wafer 300 has both the first temperature value and the second temperature value, and the difference between the first temperature value and the second temperature value may be a temperature compensation value, and the plurality of temperature compensation values form a temperature compensation table.

In step S400, the output power of the heating apparatus 200 may be adjusted by adjusting the power output device 210 based on the temperature compensation table.

When the product wafer is subjected to the heating treatment afterwards, a target temperature for heating the product wafer is set by a temperature controller. At this time, the movable plate 120 may be closed, and the temperature of the product wafer may be detected using only the first temperature sensing module 131. The server receives the first temperature value sent by the first temperature sensing module 131, and searches the temperature compensation table for a second temperature value corresponding to the first temperature value. The power output device 210 is adjusted together based on the first temperature value and the second temperature value, so as to adjust the output power of the heating apparatus 200, so that the product wafer is in the set target temperature range.

The server may be, but is not limited to, various personal computers, notebook computers, smart phones, tablet computers, etc. The server may be implemented as a stand-alone server or as a server cluster composed of a plurality of servers.

It should be understood that, although the steps in the flowchart of fig. 8 are shown in order as indicated by the arrows, the steps are not necessarily performed in order as indicated by the arrows. The steps are not strictly limited to the order of execution unless explicitly recited herein, and the steps may be executed in other orders. Moreover, at least a portion of the steps in fig. 8 may include a plurality of steps or stages that are not necessarily performed at the same time, but may be performed at different times, and the order of execution of the steps or stages is not necessarily sequential, but may be performed in rotation or alternately with at least a portion of the steps or stages in other steps or other steps.

In one embodiment, the position correction of the second temperature sensing module 141 may be performed at the time of installation or maintenance of the temperature detecting device 100. Specifically, the position sensor module may be position-corrected, so that the position sensor module may detect the position of the second temperature sensor module 141 that is more accurate.

In one embodiment, the temperature correction of the second temperature sensing module 141 and the first temperature sensing module 131 may be performed at the time of installation or maintenance of the temperature detecting apparatus 100. Specifically, the second temperature value and the first temperature value can be corrected to obtain a more accurate temperature compensation value.

The technical features of the above embodiments may be arbitrarily combined, and for brevity, all of the possible combinations of the technical features of the above embodiments are not described, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples only represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the claims. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of protection of the present application is to be determined by the claims appended hereto.

Claims (10)

1. A temperature detection apparatus for detecting a temperature in a heat treatment device, comprising:

the bearing plate is provided with a first through hole and a second through hole, the bearing plate is provided with a mounting surface, the mounting surface is provided with a first mounting area and a second mounting area, the first through hole is arranged in the first mounting area, the second through hole is arranged in the second mounting area, and the bottom surface of the bearing plate comprises a mounting surface;

the movable plate is accommodated in the second through hole in an openable and closable manner;

the first temperature detection module is arranged in the first installation area of the installation surface and is positioned below the first through hole;

the second temperature sensing module is arranged in the second installation area of the installation surface and is positioned below the second through hole.

2. The temperature detecting device according to claim 1, wherein the movable plate is movably connected with the carrier plate.

3. The temperature detecting device according to claim 1, wherein the carrying plate is circular and is provided with a plurality of first through holes distributed in the radial direction, the temperature detecting device comprises a plurality of first temperature detecting modules, and the first temperature detecting modules are arranged in one-to-one correspondence with the first through holes.

4. A temperature sensing device according to any one of claims 1 to 3, wherein the second through hole extends in a radial direction, and the second temperature sensing module is movably disposed in the second mounting region.

5. The temperature sensing device of claim 4, comprising a drive module coupled to the second temperature sensing module and configured to drive the second temperature sensing module to move in the second mounting area.

6. The temperature sensing device of claim 5, comprising a position sensing module electrically connected to the second temperature sensing module and configured to obtain a position of the second temperature sensing module.

7. The temperature sensing device of claim 1, comprising a control module electrically connected to the movable plate for controlling the movable plate to open or close.

8. The temperature detecting device according to claim 1, wherein the carrier plate and the movable plate are both reflection plates.

9. A heat treatment apparatus, characterized by comprising:

a heating device for heating the wafer;

the temperature detection device of any one of claims 1 to 8, the heating apparatus being located above the carrier plate.

10. The heat treatment apparatus according to claim 9, characterized in that the heat treatment apparatus comprises:

the supporting frames are positioned at two sides of the bearing plate and used for supporting the wafer;

and the power output device is connected with the heating equipment and used for adjusting the power of the heating equipment.

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