CN116099717B - Processing device for producing computer USB interface chip - Google Patents

Processing device for producing computer USB interface chip Download PDF

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Publication number
CN116099717B
CN116099717B CN202310382229.5A CN202310382229A CN116099717B CN 116099717 B CN116099717 B CN 116099717B CN 202310382229 A CN202310382229 A CN 202310382229A CN 116099717 B CN116099717 B CN 116099717B
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Prior art keywords
assembly
glue
dispensing
laser
wall
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CN202310382229.5A
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Chinese (zh)
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CN116099717A (en
Inventor
朱学良
陈溯
郭勇军
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Shenzhen Mire Electronic Co ltd
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Shenzhen Mire Electronic Co ltd
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Priority to CN202310382229.5A priority Critical patent/CN116099717B/en
Publication of CN116099717A publication Critical patent/CN116099717A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/027—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1015—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00—Means for manipulating or holding work, e.g. for separate articles
    • B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

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  • Coating Apparatus (AREA)

Abstract

The invention discloses a processing device for producing a computer USB interface chip, which comprises an adsorption component, a dispensing component and a main detection component; the adsorption assembly comprises an adsorption groove and a negative pressure hole, and is configured to limit the suction gluing object; the glue dispensing assembly comprises a glue storage frame for carrying out one-time glue injection on the surface of a gluing object, and the glue storage frame can form a rectangular glue water wall on the surface of the gluing object; the main detection assembly comprises an assembly frame, a detection end and a feedback end, wherein the assembly frame is arranged on the outer wall of the glue storage frame, the detection range of the detection end is coated on the periphery of the glue wall, the detection end can detect the integral levelness of a glue coating object, the feedback end is associated with the glue dispensing assembly and controls the input and output of the glue dispensing assembly.

Description

Processing device for producing computer USB interface chip
Technical Field
The invention relates to the technical field of USB interface chips, in particular to a processing device for producing a computer USB interface chip.
Background
The USB interface chip is an indispensable hardware in the USB interface, and the USB interface is also widely applied to the fields of computers, servers, personal computers, and the like, and is gradually derived outwards.
The interface chip needs to keep a certain levelness in the production and manufacturing process, the thickness degree of the chip and the limitation of the clamping tool can influence the whole of the chip, and the glue solution is prevented from flowing or flowing out of the chip in the glue dispensing process, so that the adhesive quality is prevented from being influenced.
Disclosure of Invention
The invention aims to provide a processing device for producing a computer USB interface chip, which can detect the horizontal state of a gluing object before the gluing object is subjected to glue dispensing, and control whether a glue dispensing component is used for dispensing the gluing object, so that the advantage of the yield of the glue dispensing of the gluing object is improved, and the problem of at least one of the background technologies is solved.
In order to achieve the above purpose, the present invention provides the following technical solutions: a processing device for producing computer USB interface chips comprises an adsorption component, a dispensing component and a main detection component;
the adsorption assembly comprises an adsorption groove and a negative pressure hole, and is configured to limit the suction gluing object;
the glue dispensing assembly comprises a glue storage frame for carrying out one-time glue injection on the surface of a gluing object, and the glue storage frame can form a rectangular glue water wall on the surface of the gluing object;
the main assembly of examining includes assembly frame, detection end and feedback end, the assembly frame is installed on the outer wall of storing up gluey frame, the detection scope cladding of detection end is in the periphery of glue water wall, just the detection end can detect the whole levelness of rubber coating object, the feedback end is relevant with the point subassembly of gluing, control the input and output of subassembly is glued to the point.
Preferably, the detecting end comprises a plurality of assembling cylinders which are arranged on the assembling frame in a rectangular array mode, and probes are connected to the inner bottoms of the assembling cylinders in a sliding mode in a vertical state;
the feedback end comprises a miniature pressure-sensitive sensor arranged in the assembly cylinder, the miniature pressure-sensitive sensor generates pressure signals when the probe is upwards displaced to abut against the bottom of the miniature pressure-sensitive sensor, when the pressure signal values of a plurality of miniature pressure-sensitive sensors are equal or within a preset range, the gluing object can be determined to be in a state capable of dispensing, otherwise, the input and the output of the dispensing assembly are stopped;
includes a driving source for controlling the main inspection assembly to move downwards.
Preferably, the limiting plate is installed at the top of probe, limiting plate limit sliding connection is at the inner wall of assembly section of thick bamboo, the top of limiting plate is provided with the bellying, install the spring between the bottom of limiting plate and the interior bottom of assembly section of thick bamboo.
Preferably, the top of the assembly cylinder is penetrated with a bolt, the bolt is in threaded connection with the penetrating part, the bottom of the bolt is rotationally connected with the top of the miniature pressure-sensitive sensor, and the miniature pressure-sensitive sensor is in limiting sliding connection on the inner wall of the assembly cylinder.
Preferably, the detection end comprises four groups of laser groups mounted on the assembly frame, the four groups of laser groups surround the periphery of the glue wall, the laser groups comprise a positioning laser range finder and two calibration laser range finders, the two calibration laser range finders symmetrically slide on two sides of the positioning laser range finders, the positioning laser range finders are fixedly connected with the assembly frame, and when vertical distance values measured by the two calibration laser range finders are distributed before and after the vertical distance values measured by the positioning laser range finders, the glue spreading object can be determined to be in a state of being incapable of dispensing glue;
the feedback end is associated with four laser groups.
Preferably, the laser group comprises a limit groove arranged on the outer wall of the assembly frame, two laser seats are connected in the limit groove in a sliding manner, and the two limit grooves are respectively arranged at the bottoms of the two laser seats;
the assembly block is arranged at the top of the assembly frame, the outer wall of the assembly block is vertically and slidably connected with a hinge seat, a connecting rod is hinged between the hinge seat and the tops of the two laser seats respectively, and a second linear driver for controlling the hinge seat to move up and down is arranged on the outer wall of the assembly block.
Preferably, the glue dispensing assembly comprises a glue injection piece, wherein the glue injection piece can input glue solution into the glue storage frame, and glue outlets distributed in a matrix array are formed in the bottom of the glue storage frame;
comprises a first linear driver for controlling the glue storage frame to move up and down.
Preferably, the adsorption component comprises a working platform, a buffer table is arranged at the top of the working platform, the adsorption groove is arranged on the upper surface of the buffer table, the negative pressure holes are arranged at the inner bottom of the adsorption groove, and the negative pressure holes are distributed in an array mode in an equidistant concentric circle mode.
Preferably, the assembly plate further comprises a tool sliding groove, and the dispensing assembly is slidably assembled in the tool sliding groove of the assembly plate.
Compared with the prior art, the invention has the following beneficial effects:
1. according to the invention, before dispensing, the whole levelness of the gluing object is detected through the detection end in the main detection assembly, so that whether the surface of the gluing object, which is required to be glued, meets the dispensing horizontal condition is obtained, and because the feedback end is associated with the dispensing assembly, when the feedback end knows that the gluing object does not meet the dispensing working condition, the dispensing assembly can be controlled to stop working, so that the failure of dispensing a chip or the dispensing difference can be avoided in advance, a worker can be reminded of adjusting and checking the adsorption assembly and the gluing object, and the dispensing quality of the surface of the gluing object is improved.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic diagram of a dispensing assembly according to the present invention;
FIG. 3 is a schematic structural diagram of a primary inspection assembly according to a first embodiment of the present invention;
FIG. 4 is a schematic diagram of the right-hand structure of FIG. 1 according to the present invention;
FIG. 5 is a schematic view of the structure of FIG. 4 taken along line A-A in accordance with the present invention;
fig. 6 is a schematic structural diagram of a second embodiment of a master detection assembly according to the present invention.
In the figure: 1. a working platform; 2. a buffer stage; 3. a negative pressure hole; 4. a gluing object; 5. an assembly plate; 7. a first linear driver; 8. a mounting block; 9. a glue storage frame; 11. assembling a frame; 12. a probe; 13. an assembly barrel; 14. a bolt; 15. a miniature pressure-sensitive sensor; 16. a limiting plate; 17. a spring; 18. a second linear driver; 19. a hinge base; 20. a connecting rod; 21. positioning a laser range finder; 22. a limit groove; 23. calibrating a laser range finder; 24. and a laser seat.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1 to 6, the present invention provides a technical solution: a processing device for producing computer USB interface chips comprises an adsorption component, a dispensing component and a main detection component.
The suction assembly comprises a suction tank and a negative pressure hole 3 configured to limit suction of the gluing object 4.
The glue dispensing assembly comprises a glue storage frame 9 for carrying out one-time glue injection on the surface of the gluing object 4, and the glue storage frame 9 can form a rectangular glue water wall on the surface of the gluing object 4.
The main assembly of examining includes assembly frame 11, detection end and feedback end, and assembly frame 11 installs on the outer wall of storing up gluey frame 9, the detection scope cladding of detection end is in the periphery of glue water wall, and the detection end can detect the whole levelness of rubber coating object 4, and the feedback end is relevant with the point subassembly of gluing, the input/output of control point subassembly of gluing.
Between the glue dispensing, the adsorption component is used for limiting and adsorbing the glue spreading object 4, so that shaking or displacement of the glue spreading object 4 in the glue injection process is avoided, and the stability of the glue spreading object 4 in glue injection is ensured.
The glue dispensing component is a rectangular glue wall on the surface of the glue dispensing object 4, which can make the glue adhesion between the glue plate or the chip mounting plate and the glue dispensing object 4 uniform, so that the glue dispensing object 4 is required to keep the level to ensure that each glue drop of the glue dispensing is not excessively different, and meanwhile, the random flow of the glue drops can be limited.
Therefore, before dispensing, the detection end in the main detection assembly is required to detect the whole levelness of the gluing object 4, so that whether the surface of the gluing object 4, which is required to be glued, meets the dispensing horizontal condition is obtained, and because the feedback end is associated with the dispensing assembly, when the feedback end knows that the gluing object 4 does not meet the dispensing working condition, the dispensing assembly can be controlled to stop working, so that the failure of dispensing a chip or the difference of dispensing can be avoided in advance, staff can be reminded of adjusting and checking the adsorption assembly and the gluing object 4, and the dispensing quality of the surface of the gluing object 4 is improved.
Two embodiments of the master detection assembly are provided below.
Embodiment one: referring to fig. 1 to 5, the probe end includes a plurality of mounting cylinders 13 mounted on a mounting frame 11 in a rectangular array, and probes 12 are slidably coupled to inner bottoms of the plurality of mounting cylinders 13 in a vertical state.
The feedback end comprises a miniature pressure-sensitive sensor 15 arranged in the assembly cylinder 13, when the probe 12 upwards displaces to abut against the bottom of the miniature pressure-sensitive sensor 15, the miniature pressure-sensitive sensor 15 can generate pressure signals, when the pressure signal values of the miniature pressure-sensitive sensors 15 are equal or within a preset range, the gluing object 4 can be determined to be in a state of being capable of dispensing, otherwise, the input and the output of the glue dispensing component can be stopped.
Includes a driving source for controlling the main inspection assembly to move downwards.
For the specific description of the first embodiment, the micro pressure-sensitive sensor 15 can directly receive the pressure of the top of the probe 12 due to the sliding fit between the probe 12 and the assembly cylinder 13, and the pressure signals of the micro pressure-sensitive sensors 15 are collected due to the rectangular array distribution of the plurality of probes 12, so that the deflection direction of the glue spreading object 4 and the level value thereof can be analyzed, and the operation of the glue dispensing assembly can be controlled by the micro pressure-sensitive sensor 15.
Before dispensing, the main detection component needs to be controlled to displace downwards through the driving source, so that the probe 12 can be contacted with the dispensing surface of the object 4 to be coated, the probe 12 can be further moved relative to the assembly barrel 13, then the top of the probe 12 can be abutted against the bottom of the micro pressure-sensitive sensor 15, and the micro pressure-sensitive sensor 15 can record the pressure caused by the probe 12 on the micro pressure-sensitive sensor.
In practice, it is necessary to extend the position of the probe 12 to avoid damage to the surface of the object 4 to be glued by the probe 12.
On the basis of the first embodiment, a limiting plate 16 is installed at the top of the probe 12, the limiting plate 16 is in limiting sliding connection with the inner wall of the assembly barrel 13, a protruding portion is arranged at the top of the limiting plate 16, and a spring 17 is installed between the bottom of the limiting plate 16 and the inner bottom of the assembly barrel 13.
As shown in fig. 5, by providing the positioning laser range finder 21, resistance can be provided for resetting the probe 12, and incomplete resetting under the condition of gravity can be avoided, and in practice, the probe 12 is displaced upwards relative to the mounting cylinder 13, that is, the limiting plate 16 moves upwards relative to the inner bottom of the mounting cylinder 13, so that the spring 17 can be stretched.
Wherein, the bulge can reduce the contact area to the miniature pressure-sensitive sensor 15, improves the degree of accuracy.
On the basis of the first embodiment, the top of the assembly barrel 13 is penetrated with a bolt 14, the bolt 14 is in threaded connection with the penetrating part, the bottom of the bolt 14 is rotationally connected with the top of the micro pressure sensor 15, the micro pressure sensor 15 is in limiting sliding connection on the inner wall of the assembly barrel 13, and the height of the micro pressure sensor 15 can be adjusted by rotating the bolt 14 through the cooperation of the assembly barrel 13, the bolt 14 and the micro pressure sensor 15.
Embodiment two: referring to fig. 5, the detecting end includes four groups of laser groups mounted on the mounting frame 11, the four groups of laser groups surround the periphery of the glue wall, the laser groups include a positioning laser ranging device 21 and two calibration laser ranging devices 23, the two calibration laser ranging devices 23 symmetrically slide on two sides of the positioning laser ranging device 21, the positioning laser ranging device 21 is fixedly connected with the mounting frame 11, and when vertical distance values measured by the two calibration laser ranging devices 23 are distributed before and after the vertical distance values measured by the positioning laser ranging device 21, the glue spreading object 4 can be determined to be in a state of non-glue dispensing.
Wherein the feedback end is associated with four laser groups.
For the second embodiment, since the two calibration laser rangefinders 23 are symmetrical with respect to the positioning laser rangefinder 21, the value detected between the two calibration laser rangefinders 23 should be close to or even the same as the value of the positioning laser rangefinder 21 within the preset range, and when a deviation occurs, for example, the line between the values of one calibration laser rangefinder 23, the positioning laser rangefinder 21 and the other calibration laser rangefinder 23 forms a line with a certain slope, at this time, the slope needs to be determined, and the quality of dispensing is not affected by the slope.
Due to the fact that the four laser groups are arranged, the horizontal state of the gluing object 4 can be judged through the summarized numerical values, accuracy is improved, and then information is transmitted to the glue dispensing assembly through the feedback end, so that accurate work of the glue dispensing assembly is controlled.
On the basis of the second embodiment, the laser group comprises a limit groove 22 formed on the outer wall of the assembly frame 11, two laser seats 24 are slidably connected in the limit groove 22, and the two limit grooves 22 are respectively arranged at the bottoms of the two laser seats 24.
The assembly block 8 is arranged at the top of the assembly frame 11, the hinge seat 19 is vertically and slidably connected to the outer wall of the assembly block 8, the connecting rods 20 are hinged between the hinge seat 19 and the tops of the two laser seats 24 respectively, and the second linear driver 18 for controlling the hinge seat 19 to move up and down is arranged on the outer wall of the assembly block 8.
Specifically, through the connection relationship between the two connecting rods 20, the two laser seats 24 can be driven to approach or separate from each other by the up-and-down movement of the hinge seat 19, so that the two calibration laser rangefinders 23 can be kept in a state in which the positioning laser rangefinders 21 are symmetrically distributed all the time.
In one preferred embodiment, the dispensing assembly comprises a glue injecting part, the glue injecting part can input glue solution into the glue storage frame 9, a glue outlet distributed in a matrix array is formed in the bottom of the glue storage frame 9, and the glue outlet comprises a first linear driver 7 for controlling the glue storage frame 9 to move up and down.
The first linear driver 7 can control the whole dispensing assembly and the main inspection assembly to be close to or far away from the gluing object 4 by controlling the glue storage frame 9.
In one preferred embodiment, the adsorption component comprises a working platform 1, a buffer table 2 is installed at the top of the working platform 1, an adsorption groove is installed on the upper surface of the buffer table 2, negative pressure holes 3 are formed in the inner bottom of the adsorption groove, the negative pressure holes 3 are distributed in an array mode in an equidistant concentric circle mode, and the adsorption stability of a gluing object 4 is improved.
The assembly plate 5 with the tool sliding groove is further included, and the dispensing assembly is slidingly assembled in the tool sliding groove of the assembly plate 5.
In summary, the invention can detect the horizontal state of the gluing object 4 before the gluing object 4 is glued, and control whether the gluing component is used for gluing the gluing object 4, thereby improving the yield of gluing the gluing object 4.
The standard components used in the present embodiment may be purchased directly from the market, but the nonstandard structural components according to the descriptions of the specification and the drawings may also be obtained by unambiguous processing according to the conventional technical knowledge, and meanwhile, the connection manner of each component adopts the conventional means mature in the prior art, and the machinery, the components and the equipment all adopt the conventional types in the prior art, so that the specific description will not be made here.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. The utility model provides a processing device is used in production of computer USB interface chip which characterized in that: comprises an adsorption component, a dispensing component and a main detection component;
the adsorption assembly comprises an adsorption groove and a negative pressure hole (3) and is configured to limit the suction gluing object (4);
the glue dispensing assembly comprises a glue storage frame (9) for carrying out one-time glue injection on the surface of a gluing object (4), wherein the glue storage frame (9) can form a rectangular glue wall on the surface of the gluing object (4);
the main detection assembly comprises an assembly frame (11), a detection end and a feedback end, wherein the assembly frame (11) is arranged on the outer wall of the glue storage frame (9), the detection range of the detection end is coated on the periphery of a glue wall, the detection end can detect the integral levelness of a gluing object (4), and the feedback end is associated with the glue dispensing assembly and controls the input and output of the glue dispensing assembly;
the detection end comprises four groups of laser groups arranged on the assembly frame (11), the four groups of laser groups surround the periphery of the glue wall, the laser groups comprise a positioning laser distance meter (21) and two calibration laser distance meters (23), the two calibration laser distance meters (23) symmetrically slide on two sides of the positioning laser distance meter (21), the positioning laser distance meters (21) are fixedly connected with the assembly frame (11), and when vertical distance values measured by the two calibration laser distance meters (23) are distributed before and after the vertical distance values measured by the positioning laser distance meters (21), the glue coating object (4) can be determined to be in a state of being incapable of dispensing glue;
the feedback end is associated with four laser groups;
the laser group comprises a limit groove (22) formed in the outer wall of the assembly frame (11), two laser seats (24) are connected in the limit groove (22) in a sliding mode, and two calibration laser distance measuring devices (23) are respectively arranged at the bottoms of the two laser seats (24);
the device comprises an assembly block (8) arranged at the top of an assembly frame (11), wherein a hinge seat (19) is vertically and slidably connected to the outer wall of the assembly block (8), a connecting rod (20) is hinged between the hinge seat (19) and the tops of two laser seats (24), and a second linear driver (18) for controlling the hinge seat (19) to move up and down is arranged on the outer wall of the assembly block (8).
2. The processing device for producing a computer USB interface chip according to claim 1, wherein: the detection end comprises a plurality of assembly cylinders (13) which are arranged on an assembly frame (11) in a rectangular array mode, and probes (12) are connected to the inner bottoms of the assembly cylinders (13) in a sliding mode in a vertical state;
the feedback end comprises a miniature pressure-sensitive sensor (15) arranged in the assembly cylinder (13), the miniature pressure-sensitive sensor (15) generates pressure signals when the probe (12) is upwards displaced to abut against the bottom of the miniature pressure-sensitive sensor (15), and when the pressure signal values of the miniature pressure-sensitive sensors (15) are equal or within a preset range, the gluing object (4) can be determined to be in a state capable of dispensing, otherwise, the input and the output of the dispensing assembly are stopped;
includes a driving source for controlling the main inspection assembly to move downwards.
3. The processing device for producing a computer USB interface chip according to claim 2, wherein: the top of probe (12) is installed limiting plate (16), limiting plate (16) spacing sliding connection is at the inner wall of assembly barrel (13), the top of limiting plate (16) is provided with the bellying, install spring (17) between the bottom of limiting plate (16) and the interior bottom of assembly barrel (13).
4. The processing device for producing a computer USB interface chip according to claim 2, wherein: the top of assembly section of thick bamboo (13) is run through has bolt (14), bolt (14) and run through department threaded connection, the bottom of bolt (14) is rotated with the top of miniature pressure-sensitive sensor (15) and is connected, the spacing sliding connection of miniature pressure-sensitive sensor (15) is on the inner wall of assembly section of thick bamboo (13).
5. The processing device for producing a computer USB interface chip according to any one of claims 1 to 4, wherein: the glue dispensing assembly comprises a glue injection piece, wherein the glue injection piece can input glue solution into the glue storage frame (9), and a glue outlet in a matrix array is formed in the bottom of the glue storage frame (9);
comprises a first linear driver (7) for controlling the glue storage frame (9) to move up and down.
6. The processing device for producing computer USB interface chips of claim 5, wherein: the adsorption component comprises a working platform (1), a buffer table (2) is arranged at the top of the working platform (1), the adsorption groove is arranged on the upper surface of the buffer table (2), the negative pressure holes (3) are arranged at the inner bottom of the adsorption groove, and the negative pressure holes (3) are distributed in an array mode in an equidistant concentric circle mode.
7. The processing device for producing computer USB interface chips of claim 5, wherein: the assembly plate (5) is provided with a tool sliding groove, and the dispensing assembly is slidingly assembled in the tool sliding groove of the assembly plate (5).
CN202310382229.5A 2023-04-12 2023-04-12 Processing device for producing computer USB interface chip Active CN116099717B (en)

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CN202310382229.5A CN116099717B (en) 2023-04-12 2023-04-12 Processing device for producing computer USB interface chip

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Application Number Priority Date Filing Date Title
CN202310382229.5A CN116099717B (en) 2023-04-12 2023-04-12 Processing device for producing computer USB interface chip

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CN116099717B true CN116099717B (en) 2023-07-07

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Publication number Priority date Publication date Assignee Title
JP4251793B2 (en) * 2001-07-27 2009-04-08 株式会社日立プラントテクノロジー Paste applicator
CN210411405U (en) * 2019-05-21 2020-04-28 东莞市旭晶光电科技有限公司 Dispensing jig and vacuum adsorption dispensing machine
CN114823371B (en) * 2022-06-28 2022-09-02 南通泓金贝电子科技有限公司 Dispensing packaging device for power chip
CN218380977U (en) * 2022-11-04 2023-01-24 上海飞睦建筑科技有限公司 Measuring device is used in indoor outer fitment construction

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