CN116082962A - Pseudoplastic fluid polishing solution and polishing method - Google Patents
Pseudoplastic fluid polishing solution and polishing method Download PDFInfo
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- CN116082962A CN116082962A CN202310012240.2A CN202310012240A CN116082962A CN 116082962 A CN116082962 A CN 116082962A CN 202310012240 A CN202310012240 A CN 202310012240A CN 116082962 A CN116082962 A CN 116082962A
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- polishing
- pseudoplastic fluid
- pseudoplastic
- polishing liquid
- fluid
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- 238000005498 polishing Methods 0.000 title claims abstract description 111
- 239000012530 fluid Substances 0.000 title claims abstract description 55
- 238000000034 method Methods 0.000 title claims abstract description 18
- 239000002245 particle Substances 0.000 claims abstract description 9
- 239000007788 liquid Substances 0.000 claims description 24
- 239000002562 thickening agent Substances 0.000 claims description 8
- 239000013543 active substance Substances 0.000 claims description 7
- 230000007246 mechanism Effects 0.000 claims description 7
- 239000004033 plastic Substances 0.000 claims description 7
- 229920002545 silicone oil Polymers 0.000 claims description 7
- 238000003756 stirring Methods 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- 229910052580 B4C Inorganic materials 0.000 claims description 3
- 229910052582 BN Inorganic materials 0.000 claims description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 3
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 230000001788 irregular Effects 0.000 claims description 3
- JMANVNJQNLATNU-UHFFFAOYSA-N oxalonitrile Chemical compound N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 5
- 238000010008 shearing Methods 0.000 abstract description 4
- 238000007517 polishing process Methods 0.000 abstract description 2
- 230000006872 improvement Effects 0.000 description 7
- 238000012545 processing Methods 0.000 description 7
- 230000005684 electric field Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
- B24B31/10—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor involving other means for tumbling of work
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a pseudoplastic fluid polishing solution and a polishing method, wherein the polishing solution comprises 75-97% of pseudoplastic fluid and 3-25% of abrasive particles according to the volume ratio. The invention provides a pseudoplastic fluid polishing solution and a polishing method with simple principle and low cost, namely, during the relative shearing movement between a workpiece and the polishing solution in the polishing process, the characteristic of shearing thinning of the pseudoplastic fluid is utilized, the viscosity of the polishing solution is reduced and the resistance is reduced along with the increase of the movement rate, and the polishing effect of an abrasive on the workpiece is weakened, so that the ultrahigh precision polishing is facilitated.
Description
Technical Field
The invention relates to the technical field of precision polishing, in particular to a pseudoplastic fluid polishing solution and a polishing method.
Background
Along with the continuous improvement of the requirements of precision instruments and high-precision parts on the surface smoothness of a workpiece, how to realize simple, efficient and low-cost polishing of the surface of the workpiece is a problem to be solved. In general, surface polishing is a process of polishing and removing protrusions on the surface of a workpiece under the conditions of certain relative pressure and motion by contacting a polishing tool with the surface of the workpiece, and the more precise polishing is, the more the curved surface of the polishing tool is required to have good contact consistency with the curved surface of the workpiece. However, as the curved surface of the design becomes more complex, it is difficult for the polishing tool to adapt to the curvature requirements of the workpiece surface.
In China, a large amount of manual operation is still used in actual polishing production, so that the polishing machine has the advantages of long processing process, poor stability and repeatability and high processing cost. Therefore, research and development of a polishing method which is simple to operate, low in cost and suitable for complex curved surfaces are very necessary. The currently existing novel polishing technology mainly comprises abrasive fluid polishing, electrochemical polishing, plasma polishing, electrorheological polishing, magnetorheological polishing and the like. The polishing of the abrasive fluid is to treat the surface of a workpiece under the action of impact pressure by using the fluid containing the abrasive, and the method needs to adopt an abrasive fluid conveying device, and has complex structure and difficult maintenance; the electrochemical polishing processing surface has good quality and high processing efficiency, but the electrolyte is easy to pollute the environment and is greatly limited by environmental protection policy. The plasma polishing is to polish the surface of the workpiece by utilizing the plasma formed by a high-voltage electric field at the interface between the workpiece and the working medium, and has good surface quality, large size and low processing efficiency. The electrorheological polishing and the magnetorheological polishing mainly utilize an electric field or a magnetic field to control the rheological polishing liquid of conductive abrasive particles or magnetic abrasive particles to polish the surface of a workpiece, are high-efficiency and flexible polishing methods, can obtain good processing effects, but the application of the polishing methods is restricted by complicated electric field and magnetic field auxiliary equipment and high processing medium use cost.
Disclosure of Invention
The invention aims to provide a pseudoplastic fluid polishing solution and a polishing method, which can overcome the defects and shortcomings of the existing contact polishing and other polishing technologies, and utilize the special shear thinning characteristic of the pseudoplastic fluid to exert the advantages of the pseudoplastic fluid on ultra-high precision polishing.
The invention realizes the above purpose through the following technical scheme:
a pseudo-plastic fluid polishing solution comprises 75-97% of pseudo-plastic fluid and 3-25% of abrasive particles by volume ratio.
A further improvement is that the viscosity of the pseudoplastic fluid is 8000-80000mcP at 20 ℃ and 200-8000mcP at 100 rpm.
A further improvement consists in that the components of the pseudoplastic fluid comprise silicone oil, water, an active agent and a thickener.
The further improvement is that the weight ratio of each component in the pseudoplastic fluid is silicone oil, water, active agent, thickener=15-25% (50-70%), 5-15% and 10-20%.
The further improvement is that the abrasive is in a regular or irregular appearance shape and has a particle size ranging from 0.02 to 100 μm.
The further improvement is that the abrasive material is one or a mixture of more of silicon dioxide, silicon carbide, aluminum oxide, zirconium oxide, diamond, carbon nitride, boron nitride and boron carbide.
The further improvement is that the working temperature range of the polishing solution is 0-40 ℃ and the polishing rotating speed is 0-300rpm.
The invention also provides a pseudoplastic fluid polishing method, which comprises the following steps:
preparing a polishing working cavity, arranging a stirring sheet with a rotating mechanism at the bottom of the cavity, filling the pseudoplastic fluid polishing solution into the cavity, and hanging a workpiece to be polished in the cavity through a fixing frame;
and starting a rotating mechanism, driving the pseudoplastic fluid polishing liquid to rotate at a high speed through the stirring sheet, immersing all the workpieces to be polished into the pseudoplastic fluid polishing liquid through the fixing frame, moving the workpieces to be polished in the vertical and horizontal directions, and polishing the workpieces in different states.
The invention has the beneficial effects that: the invention provides a pseudoplastic fluid polishing solution and a polishing method with simple principle and low cost, namely, during the relative shearing movement between a workpiece and the polishing solution in the polishing process, the characteristic of shearing thinning of the pseudoplastic fluid is utilized, the viscosity of the polishing solution is reduced and the resistance is reduced along with the increase of the movement rate, and the polishing effect of an abrasive on the workpiece is weakened, so that the ultrahigh precision polishing is facilitated.
Drawings
FIG. 1 is a schematic diagram of an embodiment of a method of pseudoplastic fluid polishing;
in the figure: 1. a fixing frame; 2. a workpiece to be polished; 3. pseudoplastic fluid polishing solution; 4. a cavity; 5. stirring sheets; 6. a rotating mechanism.
Detailed Description
The following detailed description of the present application is provided in conjunction with the accompanying drawings, and it is to be understood that the following detailed description is merely illustrative of the application and is not to be construed as limiting the scope of the application, since numerous insubstantial modifications and adaptations of the application will be to those skilled in the art in light of the foregoing disclosure.
A pseudo-plastic fluid polishing solution comprises 75-97% of pseudo-plastic fluid and 3-25% of abrasive particles by volume ratio.
The pseudoplastic fluid comprises, by weight, 15-25% of silicone oil, 50-70% of active agent and 5-15% of thickening agent, and 10-20% of thickening agent. At 20 ℃, the viscosity of the pseudoplastic fluid is 8000-80000mcP at a rotational speed of 1rpm and 200-8000mcP at a rotational speed of 100 rpm.
Wherein the abrasive is in a regular or irregular appearance shape, and the particle size range is 0.02-100 mu m. The abrasive is one or more of silicon dioxide, silicon carbide, aluminum oxide, zirconium oxide, diamond, carbon nitride, boron nitride and boron carbide.
The optimal working temperature range of the polishing solution is 0-40 ℃, and the polishing rotating speed is 0-300rpm.
Two polishing method embodiments using the above-described pseudo-plastic fluid polishing liquid are described below with reference to fig. 1:
example 1:
in this example, the formulation of the polishing liquid and the abrasive were respectively prepared in the proportions shown in table 1.
Table 1: polishing solution proportioning meter
| Pseudoplastic fluid proportion of polishing solution | Silicone oil water active agent thickener=15%: 70%:5%:20% |
| Polishing liquid abrasive | 2000 mesh silicon carbide and alumina abrasive, 1:1 volume ratio |
| Pseudoplastic fluid volume ratio | 85％ |
| Viscosity at room temperature (20 ℃ C.) | 20000mcP |
The workpiece 2 to be polished (stainless steel pipe fitting, diameter phi 150mm, height 100mm, thickness 2mm, three groups of round holes are formed on the workpiece 2) is fixed on the workpiece fixing frame 1, 200L of polishing liquid according to the proportion of the table 1 is poured into the polishing working cavity 4, the rotating mechanism 6 is started, and the stirring blade 5 drives the pseudoplastic fluid polishing liquid 3 to rotate at high speed. The work holder 1 immerses the work 2 to be polished in the polishing liquid entirely, and moves in the vertical and horizontal directions and the like to adjust the polishing work state. The specific polishing sequences are shown in Table 2:
table 2: polishing time schedule
| Rotational speed | Time |
| 50rpm | For 6 |
| 80rpm | |
| 2 minutes | |
| 150rpm | 8 minutes |
After polishing, the surface roughness of the workpiece is reduced from 50.4nm to 14nm, and the polishing effect is good.
Example 2:
in this example, the formulation of the polishing liquid and the abrasive were respectively prepared in the proportions shown in table 3.
Table 3: polishing solution proportioning meter
| Pseudoplastic fluid proportion of polishing solution | Silicone oil water active agent thickener=25%: 50%:15%:10% |
| Polishing liquid abrasive | 2500 mesh zirconia abrasive |
| Pseudoplastic fluid volume ratio | 80％ |
| Viscosity at room temperature (20 ℃ C.) | 42000mcP |
The workpiece 2 to be polished (stainless steel pipe piece, length 550mm, height 400mm, thickness 50mm, a plurality of flow channels are formed on the workpiece 2) is fixed on the workpiece fixing frame 1, the polishing liquid 400L in the proportion shown in the table 3 is poured into the polishing working cavity 4, the rotating mechanism 6 is started, and the stirring blade 5 drives the pseudoplastic fluid polishing liquid 3 to rotate at a high speed. The work holder 1 immerses the work 2 to be polished in the polishing liquid entirely, and moves in the vertical and horizontal directions and the like to adjust the polishing work state. The specific polishing sequences are shown in Table 4:
table 4: polishing time schedule
After polishing, the surface roughness of the workpiece is reduced from 18.4nm to 2.5nm, and the polishing effect is good.
The polishing liquid has the advantages of simple structure, low cost, simple operation and good stability, and is a high-efficiency and flexible polishing method by utilizing the physical characteristics of the polishing liquid fluid and utilizing the differences of viscosity, resistance and acting force of the fluid at different flow rates.
The foregoing examples illustrate only a few embodiments of the invention and are described in detail herein without thereby limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention.
Claims (8)
1. A pseudoplastic fluid polishing solution, which is characterized by comprising 75-97% of pseudoplastic fluid and 3-25% of abrasive particles by volume.
2. A pseudoplastic fluid polishing liquid according to claim 1, wherein the viscosity of the pseudoplastic fluid is 8000-80000mcP at a rotational speed of 1rpm and 200-8000mcP at a rotational speed of 100rpm at 20 ℃.
3. A pseudoplastic fluid polishing liquid according to claim 2, wherein the components of the pseudoplastic fluid comprise silicone oil, water, an active agent and a thickener.
4. A polishing liquid for a pseudo-plastic fluid according to claim 3, wherein the weight ratio of each component in the pseudo-plastic fluid is that silicone oil, water, active agent, thickener=15-25% (50-70%) (5-15%) (10-20%).
5. A pseudoplastic fluid polishing liquid according to claim 1, wherein said abrasive is of regular or irregular appearance and has a particle size in the range of 0.02 to 100 μm.
6. A pseudoplastic fluid polishing solution according to claim 1, wherein the abrasive is selected from one or more of silica, silicon carbide, alumina, zirconia, diamond, carbon nitride, boron nitride, and boron carbide.
7. A pseudoplastic fluid polishing liquid according to claim 1, wherein the working temperature of the polishing liquid is in the range of 0-40 ℃ and the polishing rotational speed is in the range of 0-300rpm.
8. A method of pseudoplastic fluid polishing, comprising the steps of:
preparing a polishing working cavity, arranging a stirring sheet with a rotating mechanism at the bottom of the cavity, filling the pseudoplastic fluid polishing solution according to any one of claims 1-7 into the cavity, and suspending a workpiece to be polished in the cavity through a fixing frame;
and starting a rotating mechanism, driving the pseudoplastic fluid polishing liquid to rotate at a high speed through the stirring sheet, immersing all the workpieces to be polished into the pseudoplastic fluid polishing liquid through the fixing frame, moving the workpieces to be polished in the vertical and horizontal directions, and polishing the workpieces in different states.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310012240.2A CN116082962A (en) | 2023-01-05 | 2023-01-05 | Pseudoplastic fluid polishing solution and polishing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310012240.2A CN116082962A (en) | 2023-01-05 | 2023-01-05 | Pseudoplastic fluid polishing solution and polishing method |
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| Publication Number | Publication Date |
|---|---|
| CN116082962A true CN116082962A (en) | 2023-05-09 |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101772838A (en) * | 2007-07-31 | 2010-07-07 | 卡伯特微电子公司 | Wire saw process |
| CN102257092A (en) * | 2008-12-19 | 2011-11-23 | 嘉柏微电子材料股份公司 | Slurry composition containing non-ionic polymer and method for use |
| CN102717325A (en) * | 2012-06-08 | 2012-10-10 | 浙江工业大学 | Ultra-precise curved surface finishing method based on non-Newtonian fluid shear thickening effect |
| CN108907906A (en) * | 2018-08-08 | 2018-11-30 | 西安工业大学 | A kind of non-Newtonian power-law fluid floats polishing method as the liquid of polishing medium |
| CN111515874A (en) * | 2020-03-12 | 2020-08-11 | 浙江工业大学 | Efficient ultra-precision polishing method based on shear expansion effect |
| CN112008594A (en) * | 2020-08-31 | 2020-12-01 | 浙江工业大学 | Chemically enhanced efficient ultra-precise polishing method based on shear expansion effect |
| CN113787383A (en) * | 2021-09-18 | 2021-12-14 | 杭州智谷精工有限公司 | High-efficiency ultraprecise force rheological polishing method |
| CN115533731A (en) * | 2022-10-06 | 2022-12-30 | 湘潭大学 | Shearing thickening polishing device |
-
2023
- 2023-01-05 CN CN202310012240.2A patent/CN116082962A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101772838A (en) * | 2007-07-31 | 2010-07-07 | 卡伯特微电子公司 | Wire saw process |
| CN102257092A (en) * | 2008-12-19 | 2011-11-23 | 嘉柏微电子材料股份公司 | Slurry composition containing non-ionic polymer and method for use |
| CN102717325A (en) * | 2012-06-08 | 2012-10-10 | 浙江工业大学 | Ultra-precise curved surface finishing method based on non-Newtonian fluid shear thickening effect |
| CN108907906A (en) * | 2018-08-08 | 2018-11-30 | 西安工业大学 | A kind of non-Newtonian power-law fluid floats polishing method as the liquid of polishing medium |
| CN111515874A (en) * | 2020-03-12 | 2020-08-11 | 浙江工业大学 | Efficient ultra-precision polishing method based on shear expansion effect |
| CN112008594A (en) * | 2020-08-31 | 2020-12-01 | 浙江工业大学 | Chemically enhanced efficient ultra-precise polishing method based on shear expansion effect |
| CN113787383A (en) * | 2021-09-18 | 2021-12-14 | 杭州智谷精工有限公司 | High-efficiency ultraprecise force rheological polishing method |
| CN115533731A (en) * | 2022-10-06 | 2022-12-30 | 湘潭大学 | Shearing thickening polishing device |
Non-Patent Citations (2)
| Title |
|---|
| 汪文友, 段润保: "粘弹磨料流加工机理的探讨", 金刚石与磨料磨具工程, no. 03 * |
| 王伟;: "叶轮表面各种抛光方法的去除机理研究及磨料的研制", 南京工业职业技术学院学报, no. 04 * |
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