CN116038774A - Parallelism adjusting structure and method for wafer carrying platform and mechanical arm - Google Patents
Parallelism adjusting structure and method for wafer carrying platform and mechanical arm Download PDFInfo
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- CN116038774A CN116038774A CN202310332211.4A CN202310332211A CN116038774A CN 116038774 A CN116038774 A CN 116038774A CN 202310332211 A CN202310332211 A CN 202310332211A CN 116038774 A CN116038774 A CN 116038774A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J18/00—Arms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a parallelism adjusting structure and a parallelism adjusting method of a wafer carrying platform and a mechanical arm. The wafer carrying platform and the mechanical arm parallelism adjusting structure comprises a substrate, a wafer carrying platform and a transverse moving driving piece are arranged on the substrate, a leveling block is arranged on the wafer carrying platform, the transverse moving driving piece is located on one side of the wafer carrying platform, an adapter plate is arranged at the movable end of the transverse moving driving piece, a first adjusting block is arranged on the adapter plate, a second adjusting block is rotationally connected to the first adjusting block, a fixing plate is rotationally connected to the second adjusting block, a lifting driving piece is arranged on the fixing plate, a mechanical arm extending to the upper portion of the wafer carrying platform is arranged at the movable end of the lifting driving piece, and the posture of the mechanical arm is adjustable by adjusting the rotation angle of the second adjusting block relative to the first adjusting block and the rotation angle of the fixing plate relative to the second adjusting block.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a parallelism adjusting structure and a parallelism adjusting method of a wafer carrying platform and a mechanical arm.
Background
In the process of manufacturing semiconductor chips, each performance of the wafer reaches the standard, which is an important premise for ensuring the performance of finished chips, so that the wafer is particularly important to detect. In wafer detection, a wafer on a wafer carrier is generally contacted by a mechanical arm loading probe, and as a translation part of the mechanical arm is generally fixed on an adapter plate, machining errors exist in all parts, so that the parallelism between the mechanical arm and the wafer carrier after installation is deviated, and once the deviation exceeds a set value, the positioning and clamping precision is affected, even the surface of the wafer is damaged, and further optimization is needed.
Disclosure of Invention
Based on the above-mentioned problems, an object of the present invention is to provide a parallelism adjusting structure for a wafer carrier and a mechanical arm, which can achieve fine adjustment of the mechanical arm according to the plane of the wafer carrier and improve parallelism of the wafer carrier and the mechanical arm.
The invention further aims to provide an adjusting method, which reduces the leveling difficulty of the mechanical arm and ensures the parallelism of the mechanical arm and the wafer carrier.
In order to achieve the above purpose, on one hand, the present invention adopts the following technical scheme:
the parallelism adjusting structure comprises a substrate, wherein a wafer carrying platform and a transverse moving driving piece are arranged on the substrate, a leveling block is arranged on the wafer carrying platform, the transverse moving driving piece is positioned on one side of the wafer carrying platform, an adapter plate is arranged at the movable end of the transverse moving driving piece, a first adjusting block is arranged on the adapter plate, a second adjusting block is rotationally connected to the first adjusting block, a fixed plate is rotationally connected to the second adjusting block, a lifting driving piece is arranged on the fixed plate, and a mechanical arm extending to the upper side of the wafer carrying platform is arranged at the movable end of the lifting driving piece; a first locking piece for fixing the rotation angle of the first adjusting block and the second adjusting block is arranged between the first adjusting block and the second adjusting block, and a second locking piece for fixing the rotation angle of the second adjusting block and the fixed plate is arranged between the second adjusting block and the fixed plate; the rotation angle of the second adjusting block relative to the first adjusting block is adjusted so that the mechanical arm can swing around the horizontal X axis, and the rotation angle of the fixing plate relative to the second adjusting block is adjusted so that the mechanical arm can swing around the horizontal Y axis; and in a state that the lower surface of the mechanical arm is completely attached to the leveling block, the mechanical arm is parallel to the wafer carrier.
Optionally, the first locking piece includes first connecting screw, is provided with first round pin axle on the first regulating block, and first round pin axle inserts in the second regulating block, makes the second regulating block rotate around first round pin axle, and is provided with first screw hole on the face that the second regulating block leaned on with first regulating block, has seted up first hole of dodging on the first regulating block, and first connecting screw passes first hole and first screw hole cooperation of dodging, locks second regulating block and first regulating block through first connecting screw.
Optionally, the second locking piece includes the second connecting screw, is provided with the second round pin axle on the second regulating block, and the second round pin axle inserts in the fixed plate, makes the fixed plate rotate around the second round pin axle, and is provided with the second screw hole on the face that the fixed plate leans on with the second regulating block, has seted up the second on the second regulating block and has dodged the hole, and the second connecting screw passes the second and dodges hole and second screw hole cooperation, locks fixed plate and second regulating block through the second connecting screw.
Optionally, the first pin and the second pin are perpendicular to each other in a horizontal plane.
Optionally, the lifting driving piece comprises a driving motor and a connecting block, the driving motor is arranged on the adapter plate, a cam is arranged on an output shaft of the driving motor, the mechanical arm is arranged on the upper surface of the connecting block, a guide rail which is vertically arranged is arranged on the fixing plate, a sliding block matched with the guide rail is arranged on one side surface of the connecting block, a follower which is positioned above the cam and is in matched contact with the cam is arranged on the other side surface of the connecting block, and the connecting block is driven to move up and down along the guide rail through the rotation of the cam.
Optionally, the transverse moving driving piece comprises a linear sliding table module which is horizontally arranged, and the adapter plate is fixed on a sliding table of the linear sliding table module.
Optionally, a rotating motor is disposed on the substrate, an output shaft of the rotating motor faces vertically upwards, and the wafer carrier is fixed on the output shaft of the rotating motor.
On the other hand, the invention adopts the following technical scheme:
the parallelism adjusting method of the wafer carrying platform and the mechanical arm is based on the parallelism adjusting structure of the wafer carrying platform and the mechanical arm, and comprises the following steps:
initializing the position of a mechanical arm, namely lifting the mechanical arm to the highest point and positioning the mechanical arm at one side of a wafer carrying platform, and placing a leveling block on the wafer carrying platform;
step two, the mechanical arm is moved to the position right above the wafer carrying platform through the transverse moving driving piece;
step three, enabling the lower surface of the mechanical arm to be in contact with the leveling block part through the lifting driving piece;
step four, unlocking the connection between the first adjusting block and the second adjusting block and the connection between the second adjusting block and the fixed plate, so that the second adjusting block and the fixed plate can freely rotate, and the lower surface of the mechanical arm is completely attached to the leveling block;
step five, locking the connection of the first regulating block and the second regulating block and the connection of the second regulating block and the fixed plate;
and step six, resetting the position of the mechanical arm, taking out the leveling block, and finishing leveling.
Optionally, in the process that the lower surface of the mechanical arm and the leveling block are completely attached from partial contact, the cam of the lifting driving piece is separated from the connecting block on the mechanical arm, and the mechanical arm is subjected to gravity to complete the complete attachment of the leveling block.
In summary, compared with the prior art, the parallelism adjusting structure of the wafer carrier and the mechanical arm has the beneficial effects that two adjusting blocks capable of being adjusted in a rotating way are added in the structure of the prior mechanical arm, so that the posture adjusting capability of the mechanical arm is given, the parallelism of the mechanical arm and the wafer carrier is determined through being attached to the leveling block, the parallelism adjustment of the mechanical arm and the wafer carrier can be realized after components with different processing errors are assembled, and the action precision of the mechanical arm is improved. In addition, the corresponding adjusting method is simple to operate, high in leveling efficiency and reliable in leveling result.
Drawings
Fig. 1 is a schematic diagram of a parallelism adjusting structure of a wafer carrier and a mechanical arm according to an embodiment of the invention.
Fig. 2 is a front view of a parallelism adjusting structure of a wafer carrier and a mechanical arm according to an embodiment of the invention.
Fig. 3 is a schematic diagram illustrating a state of a parallelism adjusting structure of a wafer carrier and a mechanical arm according to an embodiment of the invention.
Fig. 4 is a second schematic state diagram of a parallelism adjusting structure of a wafer carrier and a mechanical arm according to an embodiment of the invention.
Fig. 5 is a schematic diagram illustrating the detachment of the first adjusting block, the second adjusting block and the fixing plate in the parallelism adjusting structure of the wafer carrier and the mechanical arm according to the embodiment of the invention.
In the figure:
1. a substrate; 2. a wafer carrier; 3. leveling blocks; 4. a rotating electric machine; 5. a linear slipway module; 6. an adapter plate; 7. a first adjustment block; 8. a second adjustment block; 9. a fixing plate; 10. a mechanical arm; 11. a driving motor; 12. a connecting block; 13. a cam; 14. a guide rail; 15. a slide block; 16. a follower; 17. a first pin; 18. a first avoidance hole; 19. a first connecting screw; 20. a second pin; 21. a second threaded hole; 22. and a second connecting screw.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar parts throughout, or parts having like or similar functions. The embodiments described below by referring to the drawings are illustrative and intended to explain the present invention and should not be construed as limiting the invention.
In the description of the present invention, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, mechanically connected, electrically connected, indirectly connected through an intermediary, or may be in communication with each other between two elements or in an interaction relationship between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In the description of the present invention, unless explicitly stated and limited otherwise, a first feature "above" or "below" a second feature may include the first feature and the second feature being in direct contact, or may include the first feature and the second feature not being in direct contact but being in contact by another feature therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature. The technical scheme of the invention is further described below by the specific embodiments with reference to the accompanying drawings.
Referring to fig. 1 and 2, the preferred embodiment provides a parallelism adjusting structure of a wafer carrier and a mechanical arm, which comprises a substrate 1, wherein the substrate 1 is provided with a wafer carrier 2 and a traverse driving member.
The leveling block 3 is placed on the wafer carrier 2, further, the rotating motor 4 is arranged on the substrate 1, the output shaft of the rotating motor 4 faces upwards vertically, the wafer carrier 2 is fixed on the output shaft of the rotating motor 4, and the wafer carrier 2 is endowed with a rotating function.
The sideslip driving piece is located one side of wafer carrier 2, preferably adopts the straight line slip table module 5 that the level was arranged, and the loose end of sideslip driving piece (i.e. on the slip table of straight line slip table module 5) is provided with keysets 6, is provided with first regulating block 7 on the keysets 6, rotates on the first regulating block 7 to be connected with second regulating block 8, rotates on the second regulating block 8 to be connected with fixed plate 9, is provided with the lift driving piece on the fixed plate 9, and the loose end of lift driving piece is provided with the arm 10 that extends to wafer carrier 2 top.
The lifting driving piece comprises a driving motor 11 and a connecting block 12, the driving motor 11 is arranged on the adapter plate 6, a cam 13 is arranged on an output shaft of the driving motor 11, the mechanical arm 10 is arranged on the upper surface of the connecting block 12, a guide rail 14 which is vertically arranged is arranged on the fixing plate 9, a sliding block 15 which is matched with the guide rail 14 is arranged on one side surface of the connecting block 12, a follower 16 which is positioned above the cam 13 and is contacted with the cam 13 in a matched manner is arranged on the other side surface of the connecting block 12, and the connecting block 12 is driven to move up and down along the guide rail 14 through the rotation of the cam 13.
Thereby, by adjusting the rotation angle of the second adjusting block 8 with respect to the first adjusting block 7 so that the robot arm 10 can swing around the horizontal X axis (direction shown in fig. 1), by adjusting the rotation angle of the fixing plate 9 with respect to the second adjusting block 8 so that the robot arm 10 can swing around the horizontal Y axis (direction shown in fig. 1), the posture of the robot arm 10 is made adjustable, and in a state where the lower surface of the robot arm 10 is completely attached to the leveling block 3, the robot arm 10 is parallel to the wafer stage 2.
Specifically, referring to fig. 5 in detail, a first pin 17 is disposed on the first adjusting block 7, the first pin 17 is inserted into the second adjusting block 8, so that the second adjusting block 8 can rotate around the first pin 17, a first threaded hole is disposed on a surface, which is close to the first adjusting block 7, of the second adjusting block 8, a first avoiding hole 18 is disposed on the first adjusting block 7, a first locking piece matched with the first threaded hole is disposed in the first avoiding hole 18 in a penetrating manner, the first locking piece is preferably a first connecting screw 19 or a connecting piece with other same functions, the second adjusting block 8 and the first adjusting block 7 are locked through the first connecting screw 19, and therefore the second adjusting block 8 is adjustable in angle relative to the first adjusting block 7.
The second pin shaft 20 is arranged on the second adjusting block 8, the second pin shaft 20 is inserted into the fixed plate 9, the fixed plate 9 can rotate around the second pin shaft 20, a second threaded hole 21 is formed in the surface, close to the second adjusting block 8, of the fixed plate 9, a second avoiding hole is formed in the second adjusting block 8, a second locking piece matched with the second threaded hole 21 is arranged in the second avoiding hole in a penetrating mode, the second locking piece is preferably a second connecting screw 22 or a connecting piece with the same function, the fixed plate 9 and the second adjusting block 8 are locked through the second connecting screw 22, and the angle of the fixed plate 9 relative to the second adjusting block 8 is adjustable.
Further, the first pin 17 and the second pin 20 are perpendicular to each other in the horizontal plane, so as to improve the flexibility of angle adjustment of the mechanical arm 10.
In view of the above, the present embodiment further provides a method for adjusting parallelism between a wafer carrier and a mechanical arm, based on the above structure for adjusting parallelism between a wafer carrier and a mechanical arm, including the following steps:
step one, initializing the position of the mechanical arm 10, so that the mechanical arm 10 is lifted to the highest point and is positioned at one side of the wafer carrying platform 2, and placing the leveling block 3 on the wafer carrying platform 2, as shown in fig. 3, at this time, the linear sliding table module 5 operates to drive the adapter plate 6 to move to the original point position, and the driving motor 11 drives the cam 13 to rotate, so as to drive the follower 16 and the connecting block 12 to move, so that the mechanical arm 10 is lifted to the highest point.
And secondly, moving the mechanical arm 10 to the position right above the wafer carrier 2 through the transverse moving driving piece, and aligning the leveling block 3.
Step three, the lower surface of the mechanical arm 10 contacts with the leveling block 3 through the lifting driving piece, as shown in fig. 4, the driving motor 11 rotates to drive the connecting block 12 and the mechanical arm 10 to move downwards until the lower surface of the mechanical arm 10 contacts with the upper surface of the leveling block 3, wherein the 'partial contact' is that the mechanical arm 10 is not parallel to the wafer carrier 2, so that the mechanical arm 10 can only contact with a certain point or a certain line with the leveling block 3, and thus the leveling block 3 cannot be completely attached, and at the moment, the driving motor 11 continues to rotate to drive the cam 13 to rotate until the cam 13 and the follower 16 are separated.
And step four, unlocking the connection between the first adjusting block 7 and the second adjusting block 8 and the connection between the second adjusting block 8 and the fixed plate 9, so that the second adjusting block 8 and the fixed plate 9 can rotate freely, and the lower surface of the mechanical arm 10 is completely attached to the leveling block 3.
In the process from partial contact to complete lamination of the lower surface of the mechanical arm 10 and the leveling block 3, the cam 13 of the lifting driving member is separated from the connecting block 12 on the mechanical arm 10, and the mechanical arm 10 is subjected to gravity to complete lamination with the leveling block 3, so that a mechanism is prevented from being damaged. Specifically, the connecting screw of the first adjusting block 7 and the second adjusting block 8 and the connecting screw of the second adjusting block 8 and the fixing plate 9 are unscrewed, so that the guide rail 14 can fix the fixing plate 9 and the second adjusting block 8 in a rotatable and fine-tuning manner.
Step five, locking the connection of the first adjusting block 7 and the second adjusting block 8 and the connection of the second adjusting block 8 and the fixed plate 9, specifically, after the mechanical arm 10 and the leveling block 3 are completely attached, screwing the connection screw of the first adjusting block 7 and the second adjusting block 8 and the connection screw of the second adjusting block 8 and the fixed plate 9, and locking the positions of the three.
Step six, resetting the position of the mechanical arm 10, taking out the leveling block 3, specifically, operating the driving motor 11 to lift and driving the cam 13 to rotate, driving the connecting block 12 and the mechanical arm 10 to rise to the highest point, taking out the leveling block 3, and finishing leveling.
In summary, the parallelism adjusting structure of the wafer carrier and the mechanical arm adds two adjusting blocks capable of being adjusted in a rotating manner in the structure of the existing mechanical arm, so that the posture of the mechanical arm can be adjusted, the parallelism of the mechanical arm and the wafer carrier is determined through the lamination with the leveling blocks, the parallelism adjustment of the mechanical arm and the wafer carrier can be realized after the assembly of components with different processing errors, the action precision of the mechanical arm is improved, the operation of the adjusting method based on the parallelism adjusting structure is simple, the leveling efficiency is high, and the leveling result is reliable.
The above embodiments merely illustrate the basic principles and features of the present invention, and the present invention is not limited to the above embodiments, but can be variously changed and modified without departing from the spirit and scope of the present invention, which is within the scope of the present invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (9)
1. The utility model provides a parallelism adjusting structure of wafer carrier and arm, its characterized in that, including base plate (1), be provided with wafer carrier (2) and sideslip driving piece on base plate (1), leveling piece (3) have been placed on wafer carrier (2), sideslip driving piece is located one side of wafer carrier (2), and the loose end of sideslip driving piece is provided with keysets (6), be provided with first regulating block (7) on keysets (6), rotate on first regulating block (7) and be connected with second regulating block (8), rotate on second regulating block (8) and be connected with fixed plate (9), be provided with the lift driving piece on fixed plate (9), the loose end of lift driving piece is provided with arm (10) that extend to wafer carrier (2) top;
a first locking piece for fixing the rotation angle of the first regulating block (7) and the second regulating block (8) is arranged between the first regulating block (7) and the second regulating block (8), and a second locking piece for fixing the rotation angle of the second regulating block (8) and the fixed plate (9) is arranged between the second regulating block (8) and the fixed plate (9);
the mechanical arm (10) can swing around a horizontal X axis by adjusting the rotation angle of the second adjusting block (8) relative to the first adjusting block (7), and the mechanical arm (10) can swing around a horizontal Y axis by adjusting the rotation angle of the fixed plate (9) relative to the second adjusting block (8);
and in a state that the lower surface of the mechanical arm (10) is completely attached to the leveling block (3), the mechanical arm (10) is parallel to the wafer carrying table (2).
2. The parallelism adjusting structure of the wafer carrier and the mechanical arm according to claim 1, wherein the first locking piece comprises a first connecting screw (19), a first pin shaft (17) is arranged on the first adjusting block (7), the first pin shaft (17) is inserted into the second adjusting block (8), the second adjusting block (8) can rotate around the first pin shaft (17), a first threaded hole is formed in the surface, close to the first adjusting block (7), of the second adjusting block (8), a first avoiding hole (18) is formed in the first adjusting block (7), the first connecting screw (19) penetrates through the first avoiding hole (18) to be matched with the first threaded hole, and the second adjusting block (8) and the first adjusting block (7) are locked through the first connecting screw (19).
3. The parallelism adjusting structure of the wafer carrier and the mechanical arm according to claim 2, wherein the second locking piece comprises a second connecting screw (22), a second pin shaft (20) is arranged on the second adjusting block (8), the second pin shaft (20) is inserted into the fixing plate (9), the fixing plate (9) can rotate around the second pin shaft (20), a second threaded hole (21) is arranged on the surface, close to the second adjusting block (8), of the fixing plate (9), a second avoiding hole is formed in the second adjusting block (8), the second connecting screw (22) penetrates through the second avoiding hole to be matched with the second threaded hole (21), and the fixing plate (9) and the second adjusting block (8) are locked through the second connecting screw (22).
4. A wafer carrier and robot parallelism adjustment mechanism according to claim 3, characterized in that the first pin (17) and the second pin (20) are mutually perpendicular in a horizontal plane.
5. The parallelism adjusting structure of a wafer carrier and a mechanical arm according to claim 1, wherein the lifting driving piece comprises a driving motor (11) and a connecting block (12), the driving motor (11) is installed on the adapter plate (6), a cam (13) is arranged on an output shaft of the driving motor (11), the mechanical arm (10) is installed on the upper surface of the connecting block (12), a guide rail (14) which is vertically arranged is arranged on the fixing plate (9), a sliding block (15) which is matched with the guide rail (14) is arranged on one side surface of the connecting block (12), and a follower (16) which is located above the cam (13) and is contacted with the cam (13) in a matched mode is arranged on the other side surface of the connecting block (12), and the connecting block (12) is driven to move up and down along the guide rail (14) through rotation of the cam (13).
6. The parallelism adjusting structure of the wafer carrier and the mechanical arm according to claim 1, wherein the traverse driving member comprises a linear sliding table module (5) horizontally arranged, and the adapter plate (6) is fixed on a sliding table of the linear sliding table module (5).
7. The parallelism adjustment structure of a wafer carrier and a mechanical arm according to claim 1, wherein a rotating motor (4) is arranged on the substrate (1), an output shaft of the rotating motor (4) faces vertically upwards, and the wafer carrier (2) is fixed on the output shaft of the rotating motor (4).
8. The method for adjusting the parallelism of the wafer carrier and the mechanical arm, based on the structure for adjusting the parallelism of the wafer carrier and the mechanical arm according to any one of claims 1 to 7, is characterized by comprising the following steps:
step one, initializing the position of a mechanical arm (10), enabling the mechanical arm (10) to rise to the highest point and be positioned on one side of a wafer carrying platform (2), and placing a leveling block (3) on the wafer carrying platform (2);
step two, the mechanical arm (10) is moved to the position right above the wafer carrying platform (2) through the transverse moving driving piece;
step three, enabling the lower surface of the mechanical arm (10) to be in partial contact with the leveling block (3) through the lifting driving piece;
step four, unlocking the connection between the first regulating block (7) and the second regulating block (8) and the connection between the second regulating block (8) and the fixed plate (9) to enable the second regulating block (8) and the fixed plate (9) to freely rotate, so that the lower surface of the mechanical arm (10) is completely attached to the leveling block (3);
step five, locking the connection of the first regulating block (7) and the second regulating block (8) and the connection of the second regulating block (8) and the fixed plate (9);
and step six, resetting the position of the mechanical arm (10), taking out the leveling block (3), and finishing leveling.
9. The method for adjusting the parallelism of the wafer carrier and the mechanical arm according to claim 8, wherein the cam (13) of the lifting driving member is separated from the connecting block (12) on the mechanical arm (10) in the process that the lower surface of the mechanical arm (10) is completely attached to the leveling block (3) from partial contact to complete attachment, and the mechanical arm (10) is subjected to the action of gravity to complete the complete attachment to the leveling block (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310332211.4A CN116038774B (en) | 2023-03-31 | 2023-03-31 | Parallelism adjusting structure and method for wafer carrying platform and mechanical arm |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310332211.4A CN116038774B (en) | 2023-03-31 | 2023-03-31 | Parallelism adjusting structure and method for wafer carrying platform and mechanical arm |
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| CN116038774A true CN116038774A (en) | 2023-05-02 |
| CN116038774B CN116038774B (en) | 2023-07-04 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116525515A (en) * | 2023-05-30 | 2023-08-01 | 苏州天准科技股份有限公司 | Carrier device with circumferential positioning function |
| CN117192341A (en) * | 2023-11-08 | 2023-12-08 | 深圳市森美协尔科技有限公司 | Wafer probe station |
| CN117976508A (en) * | 2024-04-02 | 2024-05-03 | 浙江求是创芯半导体设备有限公司 | Wafer driving device and semiconductor device |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000002524A (en) * | 1998-06-18 | 2000-01-07 | Shin Etsu Handotai Co Ltd | Semiconductor wafer surface shape measuring device and surface shape measuring method |
| JP2007329225A (en) * | 2006-06-07 | 2007-12-20 | Tokyo Seimitsu Co Ltd | Prober, and parallelism adjusting method |
| CN103901334A (en) * | 2012-12-28 | 2014-07-02 | 深圳市劲升迪龙科技发展有限公司 | Micro-adjustable wafer test machine |
| CN112490158A (en) * | 2020-11-30 | 2021-03-12 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Chip back-mounted splicing equipment and splicing method |
| CN112902903A (en) * | 2021-03-17 | 2021-06-04 | 厦门特仪科技有限公司 | Detection mechanism and detection method for thickness of wafer |
| CN213971202U (en) * | 2020-12-02 | 2021-08-17 | 苏州凌云视界智能设备有限责任公司 | Fine adjustment assembly, adjusting mechanism and mechanical arm |
| CN114227684A (en) * | 2021-12-24 | 2022-03-25 | 上海果纳半导体技术有限公司 | Mechanical arm levelness dynamic adjusting method |
-
2023
- 2023-03-31 CN CN202310332211.4A patent/CN116038774B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000002524A (en) * | 1998-06-18 | 2000-01-07 | Shin Etsu Handotai Co Ltd | Semiconductor wafer surface shape measuring device and surface shape measuring method |
| JP2007329225A (en) * | 2006-06-07 | 2007-12-20 | Tokyo Seimitsu Co Ltd | Prober, and parallelism adjusting method |
| CN103901334A (en) * | 2012-12-28 | 2014-07-02 | 深圳市劲升迪龙科技发展有限公司 | Micro-adjustable wafer test machine |
| CN112490158A (en) * | 2020-11-30 | 2021-03-12 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Chip back-mounted splicing equipment and splicing method |
| CN213971202U (en) * | 2020-12-02 | 2021-08-17 | 苏州凌云视界智能设备有限责任公司 | Fine adjustment assembly, adjusting mechanism and mechanical arm |
| CN112902903A (en) * | 2021-03-17 | 2021-06-04 | 厦门特仪科技有限公司 | Detection mechanism and detection method for thickness of wafer |
| CN114227684A (en) * | 2021-12-24 | 2022-03-25 | 上海果纳半导体技术有限公司 | Mechanical arm levelness dynamic adjusting method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116525515A (en) * | 2023-05-30 | 2023-08-01 | 苏州天准科技股份有限公司 | Carrier device with circumferential positioning function |
| CN117192341A (en) * | 2023-11-08 | 2023-12-08 | 深圳市森美协尔科技有限公司 | Wafer probe station |
| CN117192341B (en) * | 2023-11-08 | 2024-02-13 | 深圳市森美协尔科技有限公司 | Wafer probe station |
| CN117976508A (en) * | 2024-04-02 | 2024-05-03 | 浙江求是创芯半导体设备有限公司 | Wafer driving device and semiconductor device |
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