CN116038152A

CN116038152A - Laser cutting system of flexible screen

Info

Publication number: CN116038152A
Application number: CN202310066400.1A
Authority: CN
Inventors: 凌步军; 朱鹏程; 冷志斌; 袁培龙; 孟礼; 潘泳求; 金德濬
Original assignee: Jiangsu Yawei Aosi Laser Technology Co ltd
Current assignee: Jiangsu Yawei Aosi Laser Technology Co ltd
Priority date: 2023-01-18
Filing date: 2023-01-18
Publication date: 2023-05-02

Abstract

The invention provides a laser cutting system of a flexible screen, and relates to the technical field of laser cutting of flexible panels. The mother board feeding device receives the mother board and sends the mother board to the mother board cutting device; the mother board cutting device comprises a visual positioning unit, a CO2 laser, a UV laser and a galvanometer cutting device, wherein the visual positioning unit is used for positioning the laser cutting position, the CO2 laser is used for cutting a PET layer on the surface layer of the mother board, and the UV laser is used for cutting the mother board into panel units; the mother board blanking device separates the panel units from the waste materials and moves the separated panel units to the screen body rotating device; and the screen body rotating device is used for stripping the PET layer on the surface of the panel unit, detecting whether the panel unit is qualified or not, and sub-packaging the detected panel unit. The technical problems of low automation degree and low production efficiency of the existing laser slitting device are solved.

Description

Laser cutting system of flexible screen

Technical Field

The invention relates to the technical field of flexible panel laser cutting, in particular to a laser cutting system of a flexible screen.

Background

The OLED display technology has the characteristics of self-luminescence, wide viewing angle, high contrast ratio, low power consumption and fast response speed, and is gradually replacing the conventional LCD, becoming the mainstream of flat panel displays. In the current preparation process of the OLED flexible screen, a plurality of flexible OLED display panels are often manufactured on a large glass substrate, the substrate is called a motherboard, and after the motherboard is manufactured, the motherboard is cut into single-chip OELD display panels required by customers. One common scheme is to remove the entire OLED display panel of the motherboard, attach a large PET protective film, and then cut the PET protective film into OELD monolithic display panels. Because the flexible material has special performance and can not be directly acted by strong external force, only a laser cutting mode can be adopted. At present, domestic laser cutting devices in the market are few, the degree of automation and the production efficiency are not high, and a laser cutting system with a flexible screen is needed to improve the degree of automation and the production efficiency.

Disclosure of Invention

In view of the above drawbacks of the prior art, the present invention provides a laser cutting system for a flexible screen, so as to solve the technical problems of low automation degree and low production efficiency of the existing laser cutting device.

To achieve the above and other related objects, the present invention provides a laser cutting system for a flexible screen, including a motherboard feeding device, which receives a motherboard and sends the motherboard to a motherboard cutting device; mother board cutting device, mother board cutting device includes visual positioning unit, CO ₂ Laser, UV laser and galvanometer cutting device, visual positioning unit location laser cutting's position, CO ₂ Cutting the PET layer on the surface layer of the mother plate by a laser, and cutting the mother plate into panel units by the UV laser; motherboard unloaderThe mother board blanking device separates the panel units from the waste materials and moves the separated panel units to the screen body rotating device; and the screen body rotating device is used for stripping the PET layer on the surface of the panel unit, detecting whether the panel unit is qualified or not, and sub-packaging the detected panel unit.

In an exemplary embodiment of the present application, the motherboard cutting device includes: the rotary base is driven by the rotary motor to rotate; the cutting workbench is fixed on the rotating base and is driven to rotate by the rotating base.

In an exemplary embodiment of the present application, the motherboard feeding device includes: a table storage mechanism that stores the cutting table; and the first workbench transmission mechanism replaces the workbench and the cutting workbench stored by the workbench storage mechanism.

In an exemplary embodiment of the present application, the table storage mechanism includes: a storage table carrying the cutting table; the storage lifting mechanism drives the storage table to move up and down; the storage guide wheel is arranged around the storage table.

In an exemplary embodiment of the present application, the motherboard loading device includes a motherboard loading platform, the motherboard loading platform receives the motherboard, the motherboard loading platform includes: the material waiting platform is provided with a vacuumizing port and a dividing groove, and the mother board is adsorbed and fixed by the material waiting platform through the vacuumizing port; the aligning mechanisms are arranged on two sides of the material waiting table and used for aligning the mother board; the lifting support plate is arranged on the material waiting table, and extends out of the material waiting table through the dividing groove after rising, and the lifting support plate is hidden in the dividing groove after falling.

In an exemplary embodiment of the present application, the motherboard loading device includes a motherboard handling device, where the motherboard handling device handles the motherboard disposed on the motherboard loading platform, and the motherboard handling device includes: the carrying bottom plate is provided with a plurality of vacuum chucks, and the carrying bottom plate adsorbs the mother board through the vacuum chucks; the first driving mechanism drives the conveying bottom plate to move; the first gravity balance mechanism is connected with the first driving mechanism in a sliding manner through the first gravity balance mechanism, and when the carrying bottom plate is in contact with the motherboard, the first gravity balance mechanism provides a reverse force to offset part of acting force of the carrying bottom plate on the motherboard.

In an exemplary embodiment of the present application, the motherboard blanking device includes: the blanking conveying mechanism is arranged at the lower end of the blanking conveying mechanism, a plurality of vacuum chucks are arranged on the blanking bottom plate, each panel unit is correspondingly provided with at least one vacuum chuck, and the blanking conveying mechanism drives the blanking bottom plate to move; the waste clamping mechanism clamps the motherboard edge waste, so that the blanking conveying mechanism drives the panel unit to be separated from the motherboard edge waste; the blanking workbench is provided with a vacuumizing port corresponding to the panel unit, and the panel unit is adsorbed by the blanking workbench through the vacuumizing port; and the unit blanking mechanism moves the panel unit to the screen body rotating device.

In an exemplary embodiment of the present application, the screen turning device includes: the rotary platform is driven by a rotary motor to rotate around a central shaft of the rotary platform, a plurality of stations are arranged on the rotary platform, working flat plates are arranged at the stations, and the working flat plates fix the panel units; a peeling mechanism that peels off the PET layer on the surface layer of the panel unit; the detection mechanism is used for detecting whether the panel unit is qualified or not; and the blanking mechanism sorts the panel units according to the detection result of the detection mechanism.

In an exemplary embodiment of the present application, the peeling mechanism includes: a peeling support plate supporting a portion of the panel unit beyond the work plate, the peeling support plate being liftable; a peeling jaw which peels off the PET layer on the surface of the panel unit; and the distance sensor senses the height distance between the stripping clamping jaw, the stripping support plate and the panel unit.

In an exemplary embodiment of the present application, the system comprises a magazine palletizing device that delivers the panel units to a palletizing region.

The invention has the beneficial effects that in combination with the prior art:

the existing laser slitting device is few, and the degree of automation and the production efficiency are not high. According to the automatic feeding device, the automatic feeding of the mother board can be achieved through the setting of the mother board feeding device, the mother board cutting device automatically cuts the mother board, then the mother board discharging device separates cut panel units from waste materials, the separated panel units are moved to the screen body rotating device, the screen body rotating device peels off PET layers on the surfaces of the cut panel units, whether the cut panel units are qualified or not is checked, and the detected panel units are split-packaged. The automatic feeding, dividing, stripping and checking of the mother board to the panel unit can be realized, the automation of the flexible screen is effectively improved, and the production efficiency is improved.

Drawings

In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is an exemplary flexible screen laser cutting system;

FIG. 2 is a schematic structural view of a motherboard feeding device;

FIG. 3 is a schematic structural view of a motherboard loading platform;

FIG. 4 is a schematic diagram of a motherboard handling device;

FIG. 5 is a schematic diagram of a mechanism of a table storage mechanism;

FIG. 6 is a schematic view of a first table transfer mechanism;

FIG. 7 is a schematic view of a second table transport mechanism;

fig. 8 is a schematic structural view of a motherboard cutting device;

fig. 9 is a schematic perspective view of a motherboard cutting device;

FIG. 10 is a schematic structural view of a motherboard blanking device;

FIG. 11 is a schematic view of a structure of a screen rotator;

FIG. 12 is a schematic view of a structure of a rotary platform;

FIG. 13 is a schematic structural view of a peeling mechanism;

FIG. 14 is a schematic view of a cartridge palletizing apparatus;

FIG. 15 is a schematic view of a cartridge palletizing apparatus;

fig. 16 is a schematic structural view of the storage unit.

Description of element reference numerals

1. Mother board feeding device; 11. a motherboard feeding platform; 111. a material waiting table; 112. an alignment mechanism; 113. lifting the supporting plate; 12. motherboard carrying device; 121. carrying a bottom plate; 122. a first gravity balancing mechanism; 13. a table storage mechanism; 131. a storage table; 132. a storage guide wheel; 133. a ball-shaped roller; 15. a first table transfer mechanism; 151. a first transmission structure; 152. a first clamping and positioning mechanism; 153. a first sensor; 154 first guide wheels; 155. a first ball roller; 14. a second table transfer mechanism; 141. a second transmission module; 142 a second limiting mechanism; 143. a second clamping and positioning mechanism; 144. a second sensor; 145. a second guide wheel; 2. motherboard cutting device; 21. a cutting table unit; 211. a cutting workbench; 212. a rotating base; 22. a cutting unit; 221. CO ₂ A laser; 222. a UV laser; 223. a vibrating mirror cutting device; 23. a visual positioning unit; 231. pre-alignment assembly; 232. a final alignment assembly; 233. a line scanning assembly; 24.a dust removal unit; 3. a motherboard blanking device; 31. a blanking conveying mechanism; 311. a blanking bottom plate; 312. a second gravitational equilibrium mechanism; 32. a blanking workbench; 33. a waste material clamping mechanism; 331. waste material clamping jaws; 34. a waste bin; 35. a unit blanking mechanism; 351. a single-chip blanking mechanical arm; 4. a screen body turning device; 41. a rotary platform; 411. a working platform; 412. an air bearing; 42. a cutting assembly; 43. a peeling mechanism; 431. stripping the support plate; 432. stripping jaws; 433. a distance sensor; 45. a detection mechanism; 5. a material box stacking device; 51. a magazine handling mechanism; 511 material rack; 512. a horizontal feeding screw rod module; 513. a vertical feeding screw rod module; 52. a storage unit; 521. a loading box area; 522. a good product area; 523. a defective product region; 53. and a material box sorting mechanism.

Detailed Description

Other advantages and effects of the present invention will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present invention with reference to specific examples. The invention may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present invention. It should be noted that the following embodiments and features in the embodiments may be combined with each other without conflict. It is also to be understood that the terminology used in the examples of the invention is for the purpose of describing particular embodiments only, and is not intended to limit the scope of the invention. The test methods in the following examples, in which specific conditions are not noted, are generally conducted under conventional conditions or under conditions recommended by the respective manufacturers.

Where numerical ranges are provided in the examples, it is understood that unless otherwise stated herein, both endpoints of each numerical range and any number between the two endpoints are significant both in the numerical range. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs and to which this invention belongs, and any method, apparatus, or material of the prior art similar or equivalent to the methods, apparatus, or materials described in the examples of this invention may be used to practice the invention.

It should be understood that the terms such as "upper," "lower," "left," "right," "middle," and "a" and the like are used in this specification for descriptive purposes only and not for purposes of limitation, and that the invention may be practiced without materially departing from the novel teachings and without departing from the scope of the invention.

Referring to fig. 1, fig. 1 is an exemplary flexible screen laser cutting system, and the application claims a flexible screen laser cutting system to solve the problems of low automation degree and low production efficiency of the existing laser cutting device.

The laser cutting system of the flexible screen comprises a mother board feeding device 1, a mother board cutting device 2, a mother board blanking device 3, a screen body turning device 4 and a material box stacking device 5, wherein the mother board feeding device 1 receives a mother board and sends the mother board to the mother board cutting device; the motherboard cutting device 2 comprises a visual positioning unit 23, CO ₂ Laser cutter 221, UV laser 222 and galvanometer cutting device 223, visual positioning unit 23 positions the laser cutting position, CO ₂ The laser 221 cuts the PET layer of the mother board surface layer, and the UV laser 222 cuts the mother board into panel units; the mother board blanking device 3 separates the panel units from the waste materials and moves the separated panel units to the screen body rotating device 4; the panel body turning device 4 peels off the PET layer on the surface of the panel unit, detects whether the panel unit is qualified or not, and sub-packages the detected panel unit.

Referring to fig. 2, fig. 2 is a schematic structural diagram of a motherboard feeding device, and the motherboard feeding device 1 includes a motherboard feeding platform 11, a motherboard carrying device 12, a workbench storage and storage mechanism 13, a first workbench transmission unit 15, and a second workbench transmission unit 14.

Referring to fig. 3, a schematic structural diagram of a motherboard feeding platform is shown, in which in an embodiment, a motherboard feeding platform 11 includes a material waiting platform 111, a vacuum pumping port is arranged on the material waiting platform 111, and the material waiting platform 111 performs vacuum pumping through the vacuum pumping port to fix the motherboard. The aligning mechanisms 112 are arranged at two sides of the material waiting platform 111, so as to realize mechanical alignment of the mother board. In an embodiment, the motherboard loading platform 11 further includes a lifting support plate 113, the lifting support plate 113 is disposed on the to-be-loaded platform 111, a dividing groove is disposed on the to-be-loaded platform 111, and the purpose of setting the dividing groove is to enable the lifting support plate 113 to extend out of the to-be-loaded platform 111 to receive the motherboard. In an embodiment, the uppermost layer of the lifting support plate 113 is a buffer layer, and the buffer layer can provide buffer when receiving the motherboard, so as to avoid surface damage caused by rigid contact between the motherboard and the lifting support plate 113, and the buffer layer is preferably made of plastic or rubber.

Referring to fig. 4, fig. 4 is a schematic structural diagram of a motherboard handling device 12, in an embodiment, the motherboard handling device 12 handles a motherboard placed on a motherboard loading platform 11, the motherboard handling device 12 includes a handling base plate 121, a plurality of vacuum chucks are disposed on the handling base plate 121, the handling base plate 121 adsorbs the motherboard through the vacuum chucks, and the vacuum chucks can effectively adsorb the motherboard, so as to drive the motherboard to move along with the handling base plate 121. The first driving mechanism drives the carrying bottom plate 121 to move, so as to drive the motherboard to move, and in one embodiment, the first driving mechanism is a linear motor or a motor plus screw module. The first gravity balancing mechanism 122, the carrying bottom plate 121 is slidably connected with the first driving mechanism through the first gravity balancing mechanism 122, and when the carrying bottom plate 121 contacts with the motherboard, the first gravity balancing mechanism 122 provides a reverse force to counteract the acting force of part of the carrying bottom plate 121 on the motherboard. Preferably, the first gravity balancing mechanism 122 is a cylinder, and the carrying base plate 121 is slidably connected with the cylinder and provided with a guide rod to ensure that the movement direction is vertical. When the mother board is vacuum sucked, the first gravity balance mechanism 122 provides opposite force to reduce the acting force of the carrying bottom board 121, so that the whole contact process is gentle and the impact on the screen is avoided, because the carrying bottom board 121 is large and heavy in size, so as to prevent impact on the screen.

Referring to fig. 5, fig. 5 is a schematic diagram of a mechanism of the table storage mechanism. When producing the screen of different specifications, need to use different cutting tables 211, cutting tables 211 are huge and heavy, current cutting tables 211 change usually need the cooperation completion of many people jointly, waste time and energy, and this embodiment stores, changes cutting tables 211 through workstation storage mechanism 13 to be favorable to realizing the production of different specification screens. The table storage mechanism 13 includes a storage table 131, and the storage table 131 carries and stores the cutting table 211, and preferably, the storage table 131 is provided with a plurality of layers so that the cutting table 211 can be stored. The storage lifting mechanism drives the storage platform 131 to move up and down, the butt joint of the storage platform 131, the first workbench conveying mechanism 15 and the second workbench conveying mechanism 14 is at a fixed height for facilitating the loading and unloading of the cutting workbench 211, and the storage lifting mechanism drives the storage platform 131 to move up and down, so that the loading and unloading requirements of different layers of cutting workbench 211 can be met. In one embodiment, the storage lifting mechanism comprises a driving motor, a screw module and the like.

In an embodiment, the material storage table 131 is provided with a plurality of material storage guide wheels 132, and the material storage guide wheels 132 can reduce the resistance of the cutting table 211 when moving, so that the cutting table 211 is convenient to assemble and disassemble, and preferably, the material storage guide wheels 132 are arranged on the side surface of each layer of the material storage table 131, so that the resistance of the cutting table 211 moving is reduced, and the material storage guide wheels 132 can provide guidance for the movement of the cutting table 211. Because the area of the bottom of the cutting table 211 is large, in an embodiment, the bottom of each layer of the storage table 131 is provided with the first material storage ball roller 133, and the material storage ball roller 133 is embedded on the storage table 131 and can rotate around its own center, and by setting the material storage ball roller 133, the friction resistance when the cutting table 211 is assembled and disassembled can be further reduced.

Referring to fig. 6, fig. 6 is a schematic structural diagram of the first table conveying mechanism 15. The first table transfer mechanism 15 includes a first transmission structure 151, a first clamping and positioning mechanism 152, a first sensor 153, a first guide wheel 154, and a bottom first ball roller 155, which are laterally and independently movable along a three-dimensional three-axis coordinate system. The first sensor 153 senses the position of the cutting table 211, and the first clamping and positioning mechanism 152 clamps the cutting table 211 and is driven to move by the first transmission structure 151, so that the cutting table 211 is moved. The first guide wheels 154 and the first ball rollers 155 are mounted on the first transfer base plates 156 on both left and right sides. The first transmission bottom plate 156 can be lifted and moved close to or away from the cutting table under the driving of the module, so as to facilitate docking of the table. When the first clamping and positioning mechanism 152 completes positioning with the cutting table 211, the first clamping and positioning mechanism 152 and the cutting table are driven by the first transmission structure to move along the first guide wheel 154, and the first guide wheel 154 and the first ball roller 155 are similar to the storage guide wheel 132 and the storage ball roller 133, respectively, which are not described herein.

Referring to fig. 7, fig. 7 is a schematic structural diagram of a second table conveying mechanism. The second table conveying mechanism 14 includes a second transmission module 141, a second limiting mechanism 142, a second sensor 144 of a second clamping and positioning mechanism 143, and a second guide wheel 145. The second sensor 144 senses the position of the cutting table 211, the second clamping and positioning mechanism 143 moves synchronously with the sliding block of the second transmission module 141, and when the second clamping mechanism 143 completes positioning and clamping with the cutting table 211, the second clamping and positioning mechanism 143 and the cutting table 211 are driven to move along the second guide wheel 145 through the second transmission module 141.

When a new cutting workbench 211 needs to be replaced to meet the requirement of a new motherboard, the existing motherboard locking device is firstly released, the first conveying bottom plates 156 on two sides are moved to the lower part of the cutting workbench 211 by the first workbench conveying unit 15 through the first transmission mechanism 151 to bear the cutting workbench 211, after the clamping positioning mechanism 152 clamps the cutting workbench 211, the cutting workbench 211 is driven by the first transmission mechanism 151 to move to an empty layer in the material storage platform 131 along the first guide wheel 154, and the storage of the cutting workbench 211 is realized. The material storage table 131 moves up and down so that the cutting table 211 to be used reaches the height of being butted with the first table transmission unit 15, then the cutting table 211 is clamped by the first clamping and positioning mechanism 152 of the first table transmission unit 15, and the cutting table is brought to the cutting rotary base of the motherboard cutting device 2 by the first transmission mechanism 151, thereby completing automatic replacement of the cutting table.

When the cutting table 211 in the material storage table 131 needs to be replaced, a new cutting table 211 is placed at the inlet of the conveying unit of the second table 14, the second clamping and positioning mechanism 143 clamps the cutting table 211, and the second driving module 141 brings the cutting table 211 into the material storage table 131. The extraction of the cutting table 211 in the magazine 131 is opposite to the above-described flow, and will not be described in detail here.

Referring to fig. 8 to 9, fig. 8 to 9 are schematic structural diagrams of a motherboard cutting device. The motherboard cutting device 2 includes a cutting table unit 21, a cutting unit 22, a visual positioning unit 23, and a dust removing unit 24.

In one embodiment, the cutting table unit 21 includes a cutting table 211 and a rotating base 212, the cutting table 211 is detachably fixed on the rotating base 212, and the rotating base 212 is driven by a rotating motor to drive the cutting table 211 to rotate, so as to change the cutting angle, and realize transverse cutting, vertical cutting, and the like of the mother board. The cutting unit 21 is provided with a plurality of vacuum ports for vacuuming and fixing the mother board.

In one embodiment, the cutting unit comprises CO ₂ The laser 221, the UV laser 222 and the corresponding galvanometer cutting device 223, wherein the galvanometer cutting device 223 can change the angle of laser cutting to adjust the size of the heat affected zone. The vision unit 23 includes a pre-alignment component 231, a final alignment component 232, and a line scanning component 233, which are used for precisely positioning the laser cutting position and ensuring the cutting line overlap ratio. The dust removing unit 24 may suck away a large amount of particles generated during the cutting process, preventing damage or contamination of the screen.

The cutting table 211 is pre-aligned, final aligned and line scanned using CO ₂ The 221 laser performs scribing cutting, the purpose of scribing cutting is to remove the PET layer on the surface layer of the motherboard, and the rest layers below the PET layer are not cut, so that the cutting precision of secondary cutting can be improved. The remaining layers of the master are then cut off again using UV laser 222. From the following componentsDuring the cutting of the material, a lot of particles and dust are generated, and the cutting process is dedusted by the dedusting unit 24. After cutting in one direction is completed, the workbench rotates 90 degrees, and at the moment, fine alignment is needed to be carried out again, and CO is carried out again ₂ 221 and a UV laser 222.

Referring to fig. 10, fig. 10 is a schematic structural diagram of a motherboard blanking device 3, and a motherboard blanking unit 3 includes a blanking conveying mechanism 31, a blanking table 32, a waste clamping mechanism 33, a waste bin 34, and a unit blanking mechanism 35.

The lower end of the motherboard blanking conveying mechanism 31 is provided with a blanking bottom plate 311, a plurality of suckers arranged on the blanking bottom plate 311 and the blanking conveying mechanism 31 drives the blanking bottom plate 311 to move. Similar to the motherboard handling device 12, the blanking bottom plate 311 is provided with a second gravity balance mechanism 312, the second gravity balance mechanism 312 is similar to the first gravity balance mechanism 122 in functional structure, and specific structures are not described herein, so that buffering is provided when the blanking bottom plate 311 contacts with the cut motherboard. Each panel unit is correspondingly provided with at least one vacuum chuck, so that the condition that the panel unit falls down due to the fact that the panel unit is not adsorbed is prevented. In one embodiment, the waste area of the motherboard non-panel unit is also provided with suction cups. The outer edge of the blanking bottom plate 311 is provided with a groove for facilitating the insertion of the waste gripping jaw 331 of the waste gripping mechanism 33. The blanking workbench 32 is provided with a plurality of vacuumizing ports corresponding to the panel units and used for adsorbing the OLED units; the power of the single-sheet blanking mechanism 35 is a single-sheet blanking mechanical arm 351, and the lower end of the single-sheet blanking mechanical arm is provided with a vacuum chuck corresponding to the size of the panel unit.

The work flow of the mother board blanking device 3 is that the mother board blanking conveying device 31 conveys the mother board cut into units to the vicinity of the waste clamping mechanism 33 in a vacuum chuck adsorption mode. After the cylinder of the waste clamping assembly 33 drives the waste clamping jaw 331 to swing to a position not interfering with the motherboard, the motherboard moves down to a designated position. The mother board is sensed through the sensor, the cylinder drives the waste clamping jaw 331 to act, the waste clamping jaw 331 clamps the outer waste area of the mother board after passing through the groove of the blanking bottom plate 311 of the blanking conveying mechanism 31, then the blanking conveying mechanism 31 moves upwards and forwards to enable the panel unit and the outer waste to move relatively, the waste of the mother board automatically drops in the process, and the waste clamping jaw 331 is loosened after dropping to enable the waste to fall into the waste box 34. The blanking conveying device 31 then continues to move, and finally all the panel units sucked up are put to the blanking table 32. The blanking workbench is driven by a linear motor or a transmission mechanism such as a screw rod module and the like to move to the unit blanking device 35, and the unit blanking mechanism 35 carries the panel unit of the blanking workbench 32 to a material waiting station of the rotary platform.

Referring to fig. 11, fig. 11 is a schematic structural diagram of a screen turning device. In one embodiment, the screen rotator 4 includes: the rotary platform 41 is driven by a rotary motor to rotate around the central shaft of the rotary platform 41, a plurality of stations are arranged on the rotary platform 41, working platforms 411 are arranged at the stations, and the working platforms 411 fix panel units; a peeling mechanism 43, the peeling mechanism 43 peeling the PET layer on the surface layer of the panel unit; a detecting mechanism 45 for detecting whether the panel unit is acceptable; the blanking mechanism 46 is used for sorting the panel units according to the detection result of the detection mechanism; and a cutting assembly 42, wherein the cutting assembly 42 performs operations such as corner cutting on the panel unit.

Referring to fig. 12, fig. 12 is a schematic structural diagram of a rotary platform 41, in an embodiment, the rotary platform 41 is driven by a rotary motor to rotate, a plurality of stations including, but not limited to, a visual alignment station, a stripping station, a cutting station, and a detecting station are provided on the rotary platform 41, a working platform 411 is provided at each station, the size of the working platform 411 is determined according to the size of the cut panel unit, and each working platform 411 is provided with a vacuumizing port, which has a vacuum adsorption function and is used for fixing the panel unit. The size and weight of the rotary platform 41 are large, vibration, deviation and the like are easy to occur in the rotation process, and in one embodiment, the air bearing 412 is arranged on the back side of the bottom plate of the rotary platform 41, and by arranging the air bearing 412, the rotation stability of the rotary platform 41 can be increased, and the precision of the rotary platform 41 can be ensured.

In one embodiment, the cutting assembly 41 uses a green laser to cut the panel unit to meet the small-size cutting requirements of the panel unit.

Referring to fig. 13, fig. 13 is a schematic structural diagram of a peeling mechanism 43, where the peeling mechanism 43 is used to peel off the PET layer on the surface layer of the panel unit. In one embodiment, the peeling mechanism 43 includes a peeling support plate 431, the peeling support plate 431 supports the portion of the panel unit beyond the working plate, and the peeling support plate 431 can be lifted to meet different support requirements; a peeling jaw 432, the peeling jaw 432 peeling the PET layer on the surface of the panel unit; a distance sensor 433, the distance sensor 433 sensing a height distance of the peeling claw 432, the peeling support plate 431 and the panel unit.

The visual alignment component 44 is configured to record the coordinate position of the current panel unit by means of visual sensing. The detecting component 45 includes heat affected zone detection or line scan detection, etc. for performing functional inspection on finished products after finishing processing and distinguishing qualified products from waste products. The blanking mechanism 46 can sort the finished products into qualified product areas, defective product areas and the like according to the detection result of the panel unit.

The rotary platform 41 is driven by the rotary motor to rotate, and each time the rotary platform rotates by the angle of one station, the workpiece rotates to a pre-alignment station, a stripping station, a final alignment station, a cutting station, a cleaning station, a detection station and the like, so that the multi-process machining is realized. Finally, the panel unit is placed into the areas such as the good product area and the defective product area corresponding to the magazine stacking device 5 by the blanking mechanism 46 according to the detection result of the detection assembly 45.

Referring to fig. 14 to 15, fig. 14 to 15 are schematic structural views of a magazine stacking device. The magazine palletizing device 5 includes a magazine handling mechanism 51, a storage unit 52, and a magazine sorting mechanism 53.

The magazine handling mechanism 51 has a magazine 511 for storing a plurality of magazines, and the magazine 511 with a batch of empty magazines can be transported to the storage unit 52 by mechanical transmission such as a horizontal feed screw module 512 and a vertical feed screw module 513, or the magazines stacked with panel units can be transported from the storage table unit 52 to the finished product stacking area; the storage unit 52 is divided into a loading box area 521, a good product area 522, a defective product area 523 and other areas, and a box support 524, a mechanical alignment device 525 and the like.

The work flow of the material box stacking device 5 is as follows: when loading the material platform, an operator fills the empty material box in a material rack 511 of the material box stacking device 5, the material rack 511 is conveyed to a material box loading area of the material storage unit 52 through a mechanical transmission structure such as a horizontal material feeding screw module 512, a vertical material feeding screw module 513 and the like, and then the empty material box is placed in areas such as 521 good product areas and 522 defective product areas by a material box sorting mechanism 53; when stacking the full material platform, the material boxes which are fully stacked are conveyed to a final stacking area from 521 good product areas, 522 defective product areas and the like through structures such as a horizontal feeding screw module 512, a vertical feeding screw module 513 and the like.

The cutting method of the flexible screen corresponding to the system comprises the following steps: preparation, mother board feeding, mother board conveying, visual alignment and CO ₂ Laser half cutting, UV laser full cutting, mother board transmission, waste removal, OLED unit transmission, unit surface layer removal, visual alignment, green laser corner cutting, unit function detection and unit stacking.

For the cutting method of the flexible screen, the specific operation flow of the system is as follows: firstly, preparation is carried out in advance, on the one hand, an operator fills empty material boxes in a material rack 511 of a material box stacking device 5, the material rack 511 is conveyed to a material box feeding area of a material storage unit 52 through a mechanical transmission structure such as a horizontal material feeding screw rod module 512 and a vertical material feeding screw rod module 513, and then the empty material boxes are placed in areas such as a good product area and a defective product area by a material box sorting mechanism 53; on the other hand, a new cutting table 211 needs to be replaced to adapt to the requirement of a new mother board, the existing mother board locking device is firstly released, the bottom boards on two sides are moved to the lower part of the cutting table 211 by the first table conveying mechanism 15 through the first transmission mechanism 151 to receive the cutting table 211, after the first clamping and positioning mechanism 152 clamps the cutting table 211, the cutting table 211 is driven by the first transmission mechanism 151 to move to any layer of the material storage table 131 in the table storage mechanism 13 along the first guide wheel 154. A new cutting table 211 is placed at the inlet of the second table conveying mechanism 14, the second clamping and positioning mechanism 143 clamps the cutting table 211, and the second driving module 141 brings the cutting table 211 into the other layer of the table storage mechanism 13A magazine 131. When the magazine 131 carries the cutting table 211, docking needs to be achieved by lifting. After the original cutting table 211 is clamped by the second clamping and positioning mechanism 143 of the second table conveying mechanism 14, the second transmission module 141 brings out, and the existing cutting table 211 is clamped by the first clamping and positioning mechanism 143 of the first table conveying mechanism 15 to the cutting table 211, and the first transmission mechanism 14 brings the cutting table to the rotating pedestal 212 of the mother board cutting unit, so that automatic replacement of the cutting table is completed. And then starting automatic feeding of the mother board. When the mechanical arm absorbs the mother board to the upper end of the mother board feeding platform, the sensor senses the mother board, the motor drives the lifting support plate 113 to ascend beyond the material waiting platform 111 to receive the mother board, after receiving of the mother board is completed, the motor drives the lifting support plate 113 to descend, at the moment, the mother board is transferred to the material waiting platform 111, and the material waiting platform 111 fixes the mother board in a vacuum adsorption mode and performs alignment through mechanical alignment mechanisms 112 around the material waiting platform 111. After completion, the mother board carrying device 12 moves down, and when the carrying bottom plate 121 of the mother board carrying device 12 completes vacuum adsorption to the mother board, the gravity balance cylinder acts to offset the gravity of the carrying bottom plate 121, so that the adsorption process is very stable. The motherboard handling device 12 suctions and places the motherboard onto the dicing table 211. The cutting table 211 is pre-aligned, final aligned and line scanned using CO ₂ The laser 221 performs scribing cutting for removing the PET layer on the surface layer of the mother board, and does not cut the rest layers below the PET layer, which can also improve the cutting accuracy of the secondary cutting. The remaining layers of the master are then cut off again using UV laser 222. Since a lot of particles and dust are generated during the cutting process of the material, it is necessary to remove dust during the cutting process. After cutting in one direction is completed, the cutting table 211 is rotated by 90 °, and at this time, fine alignment is required again, and CO is performed again ₂ Half cut and full cut with UV laser 222. Finally, until all-direction cutting is completed, the mother board blanking device 3 conveys the mother board cut into panel units to the vicinity of the waste clamping mechanism 33 in a vacuum chuck adsorption manner. After the cylinder of the waste clamping mechanism 33 drives the waste clamping jaw 331 to swing to a position not interfering with the motherboard, the motherboard moves down to a designated positionPosition. The sensor senses the mother board, so that the air cylinder drives the material clamping jaw 331 to act, the material clamping jaw 331 clamps the outer waste material area of the mother board through the groove of the blanking bottom plate 311, then the blanking conveying mechanism 31 generates relative motion in an upward moving and forward moving mode, in the process, the waste material of the mother board automatically drops off, and after the waste material drops off, the waste material clamping jaw 331 is loosened, so that the waste material falls into the waste box 34. The motherboard blanking transport mechanism 31 then continues to move, eventually placing all panel units sucked up to the blanking table 32. The blanking table 32 is moved to the unit blanking mechanism 35 by a linear motor or a transmission mechanism such as a screw die set. The panel unit of the blanking table 32 is carried to the waiting station of the rotary table 41 by the unit blanking mechanism 35. The rotary platform is driven by the motor to rotate, and the workpiece rotates to a pre-alignment station, a stripping station, a final alignment station, a cutting station, a cleaning station, a detection station and the like when the rotary platform rotates by the angle of one station at a time, so that the multi-procedure processing is realized. Finally, the unit blanking mechanism 35 puts the panel unit into the areas such as the good product area and the defective product area corresponding to the magazine stacking device according to the detection result of the detection mechanism 45. After sorting, the fully stacked material boxes are conveyed to a final stacking area through structures such as a horizontal feeding screw rod module 512, a vertical feeding screw rod module 513 and the like.

The laser cutting system of the flexible screen has the advantages of high automation degree, high production efficiency, high processing precision, small heat affected zone, no waste residue and the like. Therefore, the invention effectively overcomes some practical problems in the prior art, thereby having high utilization value and use significance. The above embodiments are merely illustrative of the principles of the present invention and its effectiveness, and are not intended to limit the invention. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the invention. Accordingly, it is intended that all equivalent modifications and variations of the invention be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.

Claims

1. A flexible screen laser cutting system, comprising:

the mother board feeding device receives the mother board and sends the mother board to the mother board cutting device;

mother board cutting device, mother board cutting device includes visual positioning unit, CO ₂ Laser, UV laser and galvanometer cutting device, visual positioning unit location laser cutting's position, CO ₂ The PET layer on the surface layer of the mother board is cut by a laser cutting device, and the mother board is cut into panel units by the UV laser cutting device;

the mother board blanking device separates the panel units from waste materials and moves the separated panel units to the screen body rotating device;

and the screen body rotating device is used for stripping the PET layer on the surface of the panel unit, detecting whether the panel unit is qualified or not, and sub-packaging the detected panel unit.

2. The flexible screen laser cutting system of claim 1, wherein the motherboard cutting device comprises:

the rotary base is driven by the rotary motor to rotate;

the cutting workbench is fixed on the rotating base and is driven to rotate by the rotating base.

3. The flexible screen laser cutting system of claim 2, wherein the motherboard loading device comprises:

a table storage mechanism that stores the cutting table;

and the first workbench transmission mechanism replaces the workbench and the cutting workbench stored by the workbench storage mechanism.

4. A flexible screen laser cutting system as in claim 3 wherein the table storage mechanism comprises:

a storage table carrying the cutting table;

the storage lifting mechanism drives the storage table to move up and down;

the storage guide wheel is arranged around the storage table.

5. The flexible screen laser cutting system of claim 1, wherein the motherboard loading device comprises a motherboard loading platform that receives the motherboard, the motherboard loading platform comprising:

the material waiting platform is provided with a vacuumizing port and a dividing groove, and the mother board is adsorbed and fixed by the material waiting platform through the vacuumizing port;

the aligning mechanisms are arranged on two sides of the material waiting table and used for aligning the mother board;

the lifting support plate is arranged on the material waiting table, and extends out of the material waiting table through the dividing groove after rising, and the lifting support plate is hidden in the dividing groove after falling.

6. The flexible screen laser cutting system of claim 5, wherein the motherboard loading device comprises a motherboard handling device, the motherboard handling device handling the motherboard disposed on the motherboard loading platform, the motherboard handling device comprising:

the carrying bottom plate is provided with a plurality of vacuum chucks, and the carrying bottom plate adsorbs the mother board through the vacuum chucks;

the first driving mechanism drives the conveying bottom plate to move;

the first gravity balance mechanism is connected with the first driving mechanism in a sliding manner through the first gravity balance mechanism, and when the carrying bottom plate is in contact with the motherboard, the first gravity balance mechanism provides a reverse force to offset part of acting force of the carrying bottom plate on the motherboard.

7. The flexible screen laser cutting system of claim 1, wherein the motherboard blanking device comprises:

the blanking conveying mechanism is arranged at the lower end of the blanking conveying mechanism, a plurality of vacuum chucks are arranged on the blanking bottom plate, each panel unit is correspondingly provided with at least one vacuum chuck, and the blanking conveying mechanism drives the blanking bottom plate to move;

the waste clamping mechanism clamps the motherboard edge waste, so that the blanking conveying mechanism drives the panel unit to be separated from the motherboard edge waste;

the blanking workbench is provided with a vacuumizing port corresponding to the panel unit, and the panel unit is adsorbed by the blanking workbench through the vacuumizing port;

and the unit blanking mechanism moves the panel unit to the screen body rotating device.

8. The flexible screen laser cutting system of claim 1, wherein the screen rotator comprises:

the rotary platform is driven by a rotary motor to rotate around a central shaft of the rotary platform, a plurality of stations are arranged on the rotary platform, working flat plates are arranged at the stations, and the working flat plates fix the panel units;

a peeling mechanism that peels off the PET layer on the surface layer of the panel unit;

the detection mechanism is used for detecting whether the panel unit is qualified or not;

and the blanking mechanism sorts the panel units according to the detection result of the detection mechanism.

9. The flexible screen laser cutting system of claim 8, wherein the peeling mechanism comprises:

a peeling support plate supporting a portion of the panel unit beyond the work plate, the peeling support plate being liftable;

a peeling jaw which peels off the PET layer on the surface of the panel unit;

and the distance sensor senses the height distance between the stripping clamping jaw, the stripping support plate and the panel unit.

10. The flexible screen laser cutting system of claim 1, wherein the system includes a magazine palletizer that delivers the panel units to a palletizing area.