CN116027233A - Optical integration method of chip magnetometer and chip magnetometer - Google Patents
Optical integration method of chip magnetometer and chip magnetometer Download PDFInfo
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- CN116027233A CN116027233A CN202211475424.4A CN202211475424A CN116027233A CN 116027233 A CN116027233 A CN 116027233A CN 202211475424 A CN202211475424 A CN 202211475424A CN 116027233 A CN116027233 A CN 116027233A
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- 230000003287 optical effect Effects 0.000 title claims abstract description 81
- 230000010354 integration Effects 0.000 title claims abstract description 60
- 238000000034 method Methods 0.000 title claims abstract description 55
- 238000010438 heat treatment Methods 0.000 claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 238000001514 detection method Methods 0.000 claims abstract description 16
- 238000009529 body temperature measurement Methods 0.000 claims abstract description 14
- 238000004806 packaging method and process Methods 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 claims description 45
- 239000012790 adhesive layer Substances 0.000 claims description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 4
- 229910010293 ceramic material Inorganic materials 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 238000004861 thermometry Methods 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 description 12
- 238000005516 engineering process Methods 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000005485 electric heating Methods 0.000 description 4
- 238000012858 packaging process Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
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Abstract
The invention provides a chip magnetometer optical integration method and a chip magnetometer, wherein the chip magnetometer optical integration method comprises the following steps: integrating and packaging a laser light source on the surface of a substrate to form a light source integrated chip, and adding a dielectric layer on the surface of the substrate; bonding the chip collimating lens and a light source integrated chip with a preset dielectric layer; bonding the chipped polarized lens and the chipped collimating lens; bonding the chip atomic air chamber integrated with the heating temperature measuring chip with the chip polarized lens; and bonding the photoelectric detection chip with a chip-type atomic gas chamber integrated with the heating temperature measurement chip. The technical scheme of the invention is applied to solve the technical problems of complex structure and large volume of the atomic magnetometer in the prior art.
Description
Technical Field
The invention relates to the technical field of atomic magnetometers, in particular to an optical integration method of a chip magnetometer and the chip magnetometer.
Background
The atomic magnetometer is a sensor for precisely measuring weak magnetic fields. Because the existing atomic magnetometer is complex in structure, various devices are required to be integrated together, so that the atomic magnetometer gauge outfit is large in size, and the application range of the atomic magnetometer gauge outfit is limited.
Disclosure of Invention
The invention provides an optical integration method of a chip magnetometer and the chip magnetometer, which can solve the technical problems of complex structure and large volume of an atomic magnetometer in the prior art.
According to an aspect of the present invention, there is provided a chip magnetometer optical integration method including: integrating and packaging a laser light source on the surface of a substrate to form a light source integrated chip, and adding a dielectric layer on the surface of the substrate; bonding the chip collimating lens and a light source integrated chip with a preset dielectric layer; bonding the chipped polarized lens and the chipped collimating lens; bonding the chip atomic air chamber integrated with the heating temperature measuring chip with the chip polarized lens; and bonding the photoelectric detection chip with a chip-type atomic gas chamber integrated with the heating temperature measurement chip.
Further, in the process of bonding the chipped collimating lens and the light source integrated chip with the preset medium layer, the chipped collimating lens and the light source integrated chip with the preset medium layer are heated and pressurized so as to bond the chipped collimating lens and the light source integrated chip with the preset medium layer together.
Further, bonding the chipped polarized lens to the chipped collimating lens specifically includes: and prefabricating an adhesive layer on the outer ring surface of the chipped collimating lens, and bonding the chipped polarizing lens and the chipped collimating lens through an optical alignment device.
Further, the chip magnetometer optical integration method further comprises, before bonding the chip atomic gas chamber integrated with the heating temperature measurement chip with the chip polarized lens: and carrying out on-chip anode bonding connection on the heating temperature measuring chip and the chip atomic air chamber.
Further, the chip magnetometer optical integration method further comprises, before bonding the chip atomic gas chamber integrated with the heating temperature measurement chip with the chip polarized lens: prefabricating an adhesive layer on the outer ring of the chip atomic air chamber integrated with the heating temperature measuring chip, presetting the adhesive layer on the outer ring of the chip polarized lens, and performing optical alignment on the chip atomic air chamber integrated with the heating temperature measuring chip and the chip polarized lens so that a light beam passing through the chip polarized lens is aligned with a light passing hole of the chip atomic air chamber integrated with the heating temperature measuring chip.
Further, the optical integration method of the chip magnetometer before bonding the photodetector chip with the chip-formed atomic gas chamber integrated with the heating temperature measurement chip further comprises: and carrying out optical alignment on the photoelectric detector chip and the chip-type atomic gas chamber integrated with the heating temperature measuring chip so as to lead the light through holes of the atomic gas chamber to be aligned with the sensitive surface of the photoelectric detector chip.
Further, the chip magnetometer optical integration method further comprises, before integrating the packaged laser light source on the substrate surface to form a light source integrated chip: the collimating optic is chipped to form a chipped collimating optic, the polarizing optic is chipped to form a chipped polarizing optic, and the atomic cell is chipped to form a chipped atomic cell.
Further, the substrate comprises a ceramic, glass or silicon wafer, the laser light source comprises a VCSEL, DBR or DFB, and the dielectric layer comprises a metal layer, a resin layer or a layer of ceramic material.
According to yet another aspect of the present invention, there is provided a chip magnetometer optically integrated using the chip magnetometer optical integration method as described above.
Further, the chip magnetometer comprises a light source integrated chip, a chipped collimating lens, a chipped polarizing lens, a chipped atomic air chamber, a heating temperature measuring chip and a photoelectric detection chip which are sequentially stacked.
By applying the technical scheme of the invention, the optical integration method of the chip magnetometer is provided, and the chip integration is realized by all the device components of the chip magnetometer, so that the volume of the magnetometer gauge outfit is effectively reduced, and the processing cost is reduced; the magnetometer light source adopts an integrated packaging process technology to realize the chip integration of the atomic magnetometer head light source; the magnetometer optical component adopts the process technology of integrating the collimating lens and the polarized lens, so as to realize the chip formation of the optical device; the optical three-dimensional stacking mode is adopted, so that the components such as an atomic magnetometer gauge outfit light source, an optical device component, an atomic air chamber, electric heating and the like are integrated in a multi-layer stacking mode, and the processing difficulty of a magnetometer physical gauge outfit is further simplified; the photoelectric detection chip (PD) adopts a scheme of optical integration of a bare chip and an atomic gas chamber to realize closed loop detection of an optical path. Compared with the prior art, the chip magnetometer optical integration method provided by the invention can realize microminiature integrated manufacture of the atomic magnetometer head, and the chip atomic magnetometer manufactured by the integrated manufacture has the characteristics of microminiature, low cost and mass manufacture, so that the chip magnetometer optical integration method can effectively reduce the volume and cost of the atomic magnetometer.
Drawings
The accompanying drawings, which are included to provide a further understanding of embodiments of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention. It is evident that the drawings in the following description are only some embodiments of the present invention and that other drawings may be obtained from these drawings without inventive effort for a person of ordinary skill in the art.
FIG. 1 illustrates a side view of a chip magnetometer provided in accordance with certain embodiments of the invention;
fig. 2 to 6 are schematic views showing respective sub-steps of a flow of an optical integration method of a chip magnetometer according to a specific embodiment of the invention.
Wherein the above figures include the following reference numerals:
10. a light source integrated chip; 11. a substrate; 12. a laser light source; 13. a dielectric layer; 20. a chipped collimating optic; 30. a chipped polarized lens; 40. a chip-formed atomic gas cell; 50. heating the temperature measuring chip; 60. and a photoelectric detection chip.
Detailed Description
It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other. The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the invention, its application, or uses. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments in accordance with the present application. As used herein, the singular is also intended to include the plural unless the context clearly indicates otherwise, and furthermore, it is to be understood that the terms "comprises" and/or "comprising" when used in this specification are taken to specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof.
The relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless it is specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective parts shown in the drawings are not drawn in actual scale for convenience of description. Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but should be considered part of the specification where appropriate. In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.
As shown in fig. 1 to 6, there is provided a chip magnetometer optical integration method according to an embodiment of the present invention, the chip magnetometer optical integration method comprising: integrating and packaging a laser light source on the surface of a substrate to form a light source integrated chip 10, and adding a dielectric layer on the surface of the substrate; bonding the chip collimating lens 20 and the light source integrated chip 10 with a preset dielectric layer; bonding the chipped polarized lens 30 to the chipped collimating lens 20; bonding the chip-formed atomic gas cell 40 integrated with the heating temperature measuring chip 50 with the chip-formed polarized lens 30; the photodetection chip 60 is bonded to the chipped atomic gas chamber 40 integrated with the heating temperature measurement chip 50.
By applying the configuration mode, the optical integration method of the chip magnetometer is provided, and chip integration is realized through all the device components of the chip magnetometer, so that the volume of the magnetometer gauge head is effectively reduced, and the processing cost is reduced; the magnetometer light source adopts an integrated packaging process technology to realize the chip integration of the atomic magnetometer head light source; the magnetometer optical component adopts the process technology of integrating the collimating lens and the polarized lens, so as to realize the chip formation of the optical device; the optical three-dimensional stacking mode is adopted, so that the components such as an atomic magnetometer gauge outfit light source, an optical device component, an atomic air chamber, electric heating and the like are integrated in a multi-layer stacking mode, and the processing difficulty of a magnetometer physical gauge outfit is further simplified; the photoelectric detection chip (PD) adopts a scheme of optical integration of a bare chip and an atomic gas chamber to realize closed loop detection of an optical path. Compared with the prior art, the chip magnetometer optical integration method provided by the invention can realize microminiature integrated manufacture of the atomic magnetometer head, and the chip atomic magnetometer manufactured by the integrated manufacture has the characteristics of microminiature, low cost and mass manufacture, so that the chip magnetometer optical integration method can effectively reduce the volume and cost of the atomic magnetometer.
Further, in order to achieve reliable connection of the chipped collimating lens 20 and the light source integrated chip 10 with the preset dielectric layer, in the process of bonding the chipped collimating lens 20 and the light source integrated chip 10 with the preset dielectric layer, the chipped collimating lens 20 and the light source integrated chip 10 with the preset dielectric layer are heated and pressurized so that the chipped collimating lens 20 and the light source integrated chip 10 with the preset dielectric layer are bonded together.
In addition, in the present invention, in order to achieve reliable connection of the chipped polarized lens 30 and the chipped collimating lens 20, bonding the chipped polarized lens 30 and the chipped collimating lens 20 specifically includes: and prefabricating an adhesive layer on the outer ring surface of the chipped collimating lens 20, and bonding the chipped polarizing lens 30 and the chipped collimating lens 20 through an optical alignment device.
Further, in the present invention, before bonding the chip-formed atomic gas cell 40 integrated with the heating temperature measurement chip 50 with the chip-formed polarization lens 30, the chip magnetometer optical integration method further comprises: the heating temperature measuring chip 50 is connected with the chip-formed atomic gas chamber 40 by on-chip anodic bonding.
In this configuration, the heating temperature measuring chip 50 and the chip atomic gas chamber 40 are bonded on-chip anode at the same time, so as to realize chip integration of the atomic gas chamber and the heating temperature measuring chip.
Further, in the present invention, before bonding the chip-formed atomic gas cell 40 integrated with the heating temperature measurement chip 50 with the chip-formed polarization lens 30, the chip magnetometer optical integration method further comprises: the bonding layer is prefabricated on the outer ring of the chip atomic gas chamber 40 integrated with the heating temperature measuring chip 50, the bonding layer is preset on the outer ring of the chip polarized lens 30, and the chip atomic gas chamber 40 integrated with the heating temperature measuring chip 50 and the chip polarized lens 30 are optically aligned so that the light beam passing through the chip polarized lens 30 is aligned with the light-transmitting hole of the chip atomic gas chamber 40 integrated with the heating temperature measuring chip 50.
In addition, in the present invention, in order to secure the detection accuracy of the photodetector, the chip magnetometer optical integration method further includes, before bonding the photodetector chip with the chipped atomic gas chamber 40 integrated with the heating temperature measurement chip 50: the photodetector chip is optically aligned with the chipped atomic gas chamber 40 integrated with the heated temperature measurement chip 50 such that the light passing holes of the atomic gas chamber are aligned with the sensitive face of the photodetector chip.
Further, in the present invention, in order to reduce the volume of the magnetometer gauge outfit and reduce the processing cost, the chip magnetometer optical integration method further comprises, before integrating the packaged laser light source on the substrate surface to form the light source integrated chip 10: the collimating optic is chipped to form a chipped collimating optic 20, the polarizing optic is chipped to form a chipped polarizing optic 30, and the atomic cell is chipped to form a chipped atomic cell 40.
As a specific embodiment of the invention, the substrate comprises a ceramic, glass or silicon wafer, the laser light source comprises a VCSEL, DBR or DFB, and the dielectric layer comprises a metal layer, a resin layer or a ceramic material layer.
According to another aspect of the present invention, there is provided a chip magnetometer optically integrated using the chip magnetometer optical integration method as described above.
By applying the configuration mode, the chip magnetometer is provided, and the chip magnetometer is optically integrated by using the chip magnetometer optical integration method, and the chip magnetometer optical integration method provided by the invention realizes chip integration of all the device components of the chip magnetometer, so that the volume of a magnetometer head is effectively reduced, and the processing cost is reduced; the magnetometer light source adopts an integrated packaging process technology to realize the chip integration of the atomic magnetometer head light source; the magnetometer optical component adopts the process technology of integrating the collimating lens and the polarized lens, so as to realize the chip formation of the optical device; the optical three-dimensional stacking mode is adopted, so that the components such as an atomic magnetometer gauge outfit light source, an optical device component, an atomic air chamber, electric heating and the like are integrated in a multi-layer stacking mode, and the processing difficulty of a magnetometer physical gauge outfit is further simplified; the photoelectric detection chip (PD) adopts a scheme of optical integration of a bare chip and an atomic gas chamber to realize closed loop detection of an optical path. Therefore, the chip magnetometer optical integration method provided by the invention is used in the chip magnetometer, so that the microminiature integrated manufacture of the atomic magnetometer head can be realized, and the chip atomic magnetometer manufactured by the integrated manufacture has the characteristics of microminiature, low cost and mass manufacture, and therefore, the chip magnetometer optical integration method can effectively reduce the volume and cost of the atomic magnetometer.
Further, in the present invention, the chip magnetometer includes a light source integrated chip 10, a chipped collimating lens 20, a chipped polarizing lens 30, a chipped atomic gas chamber 40, a heating temperature measurement chip 50 and a photo detection chip 60, which are stacked in this order.
For further understanding of the present invention, the following describes the optical integration method of the chip magnetometer according to the present invention in detail with reference to fig. 1 to 6.
As shown in fig. 1 to 6, an optical integration method of a chip magnetometer and a chip magnetometer are provided according to an embodiment of the present invention, the chip magnetometer is mainly composed of a light source integration chip 10, a chipped collimating lens 20, a chipped polarizing lens 30, a chipped atomic gas chamber 40, a heating temperature measurement chip 50 and a photo detection chip 60. Wherein the light source integrated chip 10 is composed of an integrally packaged laser light source 12 and a substrate 11; the chip collimating lens and the chip polarizing lens are formed by combining integrated patches; the atomic air chamber and the heating temperature measuring chip are integrated and processed by adopting MEMS technology and are further integrated with the photoelectric detector chip.
As shown in FIG. 1, a chip magnetometer is formed by stacking the components of the magnetometer, and further, the components are integrated by using standard chip stack packaging technology.
As shown in fig. 2 to 6, a specific implementation method of the chip magnetometer is shown, and specifically described as follows:
first, a laser light source 12 is integrated and packaged on the surface of a ceramic/glass/silicon wafer, the light source comprises VCSEL/DBR/DFB light sources, the integrated light source has the functions of temperature control and thermal isolation, and a dielectric layer 13 is added on the surface of a substrate to enable the substrate to meet the subsequent bonding effect with an optical device component, wherein the dielectric layer can be a metal layer/a resin layer/a ceramic material, and the like.
And secondly, bonding the chip collimating lens on the surface of the light source integrated chip 10 with the preset medium layer through an optical alignment device, and heating and pressurizing in the bonding process to bond the chip collimating lens and the light source integrated chip together.
And thirdly, bonding the chip polarized lens with the chip collimating lens through an optical alignment device, and prefabricating a layer of bonding layer on the outer ring surface of the collimating lens to bond the chip polarized lens.
And fourthly, integrating a heating temperature measuring chip 50 on the surface of the chip atomic gas chamber, bonding the integrated atomic gas chamber with the chip polarized lens, prefabricating a layer of bonding layer on the polarized lens and the outer ring of the atomic gas chamber before bonding, and optically aligning the bonding layer so that the light beam can be aligned with the gas chamber light through hole.
And fifthly, finally, bonding the photoelectric detector chip and the atomic gas chamber, and aligning the light passing holes of the photoelectric detector chip and the atomic gas chamber to the sensitive surface of the photoelectric detector by using an optical alignment device.
In summary, the invention provides an optical integration method of a chip magnetometer, which realizes chip integration of all device components of the chip magnetometer, effectively reduces the volume of a magnetometer gauge outfit and reduces the processing cost; the magnetometer light source adopts an integrated packaging process technology to realize the chip integration of the atomic magnetometer head light source; the magnetometer optical component adopts the process technology of integrating the collimating lens and the polarized lens, so as to realize the chip formation of the optical device; the optical three-dimensional stacking mode is adopted, so that the components such as an atomic magnetometer gauge outfit light source, an optical device component, an atomic air chamber, electric heating and the like are integrated in a multi-layer stacking mode, and the processing difficulty of a magnetometer physical gauge outfit is further simplified; the photoelectric detection chip (PD) adopts a scheme of optical integration of a bare chip and an atomic gas chamber to realize closed loop detection of an optical path. Compared with the prior art, the chip magnetometer optical integration method provided by the invention can realize microminiature integrated manufacture of the atomic magnetometer head, and the chip atomic magnetometer manufactured by the integrated manufacture has the characteristics of microminiature, low cost and mass manufacture, so that the chip magnetometer optical integration method can effectively reduce the volume and cost of the atomic magnetometer.
Spatially relative terms, such as "above … …," "above … …," "upper surface at … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial location relative to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "over" other devices or structures would then be oriented "below" or "beneath" the other devices or structures. Thus, the exemplary term "above … …" may include both orientations of "above … …" and "below … …". The device may also be positioned in other different ways (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
In addition, the terms "first", "second", etc. are used to define the components, and are only for convenience of distinguishing the corresponding components, and the terms have no special meaning unless otherwise stated, and therefore should not be construed as limiting the scope of the present invention.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A chip magnetometer optical integration method, characterized in that the chip magnetometer optical integration method comprises:
integrating and packaging a laser light source on the surface of a substrate to form a light source integrated chip (10), and adding a dielectric layer on the surface of the substrate;
bonding a chip collimating lens (20) and a light source integrated chip (10) preset with the dielectric layer;
bonding a chipped polarized lens (30) to the chipped collimating lens (20);
bonding a chipped atomic gas chamber (40) integrated with a heating temperature measurement chip (50) with the chipped polarized lens (30);
a photoelectric detection chip (60) is bonded to a chip-formed atomic gas cell (40) integrated with a heating temperature measurement chip (50).
2. The chip magnetometer optical integration method according to claim 1, characterized in that in bonding a chipped collimating lens (20) with a light source integrated chip (10) preset with the dielectric layer, the chipped collimating lens (20) and the light source integrated chip (10) preset with the dielectric layer are heated and pressurized to bond the chipped collimating lens (20) with the light source integrated chip (10) preset with the dielectric layer.
3. The method of chip magnetometer optical integration according to claim 2, characterized in that bonding a chipped polarized lens (30) with the chipped collimating lens (20) specifically comprises: and prefabricating an adhesive layer on the outer ring surface of the chipped collimating lens (20), and bonding the chipped polarizing lens (30) and the chipped collimating lens (20) through an optical alignment device.
4. A chip magnetometer optical integration method according to claim 3, characterized in that it further comprises, before bonding a chipped atomic gas chamber (40) integrated with a heated thermometry chip (50) with the chipped polarized lens (30): and (3) carrying out on-chip anodic bonding connection on the heating temperature measuring chip (50) and the chip atomic gas chamber (40).
5. The chip magnetometer optical integration method according to claim 4, characterized in that it further comprises, before bonding a chipped atomic gas chamber (40) integrated with a heated thermometry chip (50) with the chipped polarized lens (30): prefabricating an adhesive layer on the outer ring of a chip atomic air chamber (40) integrated with a heating temperature measuring chip (50), presetting the adhesive layer on the outer ring of a chip polarized lens (30), and carrying out optical alignment on the chip atomic air chamber (40) integrated with the heating temperature measuring chip (50) and the chip polarized lens (30) so as to enable a light beam passing through the chip polarized lens (30) to be aligned with a light-transmitting hole of the chip atomic air chamber (40) integrated with the heating temperature measuring chip (50).
6. The chip magnetometer optical integration method according to claim 5, characterized in that it further comprises, before bonding the photodetector chip with the chip-formed atomic gas cell (40) integrated with the heating thermometric chip (50): and carrying out optical alignment on the photoelectric detector chip and a chip-type atomic gas chamber (40) integrated with a heating temperature measuring chip (50) so as to enable a light through hole of the atomic gas chamber to be aligned with a sensitive surface of the photoelectric detector chip.
7. The chip magnetometer optical integration method according to any one of claims 1-6, characterized in that it further comprises, before integrating a packaged laser light source at a substrate surface to form a light source integrated chip (10): the collimating optic is chipped to form a chipped collimating optic (20), the polarizing optic is chipped to form a chipped polarizing optic (30), and the atomic gas cell is chipped to form a chipped atomic gas cell (40).
8. The chip magnetometer optical integration method of claim 7, wherein the substrate comprises a ceramic, glass, or silicon wafer, the laser light source comprises a VCSEL, DBR, or DFB, and the dielectric layer comprises a metal layer, a resin layer, or a ceramic material layer.
9. Chip magnetometer, characterized in that it uses the chip magnetometer optical integration method according to any one of claims 1 to 8 for chip magnetometer optical integration.
10. The chip magnetometer of claim 9, comprising a light source integrated chip (10), a chipped collimating lens (20), a chipped polarizing lens (30), a chipped atomic gas chamber (40), a heated thermometry chip (50) and a photodetection chip (60) stacked in that order.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211475424.4A CN116027233A (en) | 2022-11-23 | 2022-11-23 | Optical integration method of chip magnetometer and chip magnetometer |
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| CN202211475424.4A CN116027233A (en) | 2022-11-23 | 2022-11-23 | Optical integration method of chip magnetometer and chip magnetometer |
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| CN106405450A (en) * | 2016-12-05 | 2017-02-15 | 中北大学 | End-coupling nanometer optical waveguide dual-optical-path chip-level magnetometer |
| CN106405449A (en) * | 2016-12-05 | 2017-02-15 | 中北大学 | Vertical-coupling nanometer optical waveguide dual-optical-path chip-level magnetometer |
| CN108844532A (en) * | 2018-08-14 | 2018-11-20 | 北京航天控制仪器研究所 | It is a kind of to use oblique incidence sounding optical path microminiature magnetic resonance gyroscope instrument |
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