CN116001113A - Silicon ring surface punching method - Google Patents
Silicon ring surface punching method Download PDFInfo
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- CN116001113A CN116001113A CN202211726192.5A CN202211726192A CN116001113A CN 116001113 A CN116001113 A CN 116001113A CN 202211726192 A CN202211726192 A CN 202211726192A CN 116001113 A CN116001113 A CN 116001113A
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 101
- 238000004080 punching Methods 0.000 title claims abstract description 45
- 238000000034 method Methods 0.000 title claims abstract description 38
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 29
- 239000010703 silicon Substances 0.000 claims abstract description 29
- 238000003754 machining Methods 0.000 claims description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- 239000010687 lubricating oil Substances 0.000 claims description 8
- 239000000110 cooling liquid Substances 0.000 claims description 7
- 238000005553 drilling Methods 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 3
- 238000010009 beating Methods 0.000 claims description 3
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 238000011010 flushing procedure Methods 0.000 claims description 2
- 238000005406 washing Methods 0.000 claims 1
- 230000002035 prolonged effect Effects 0.000 abstract description 3
- 238000005530 etching Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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Abstract
The invention relates to a silicon ring surface punching method, which adopts a first drill bit to process pits with preset depth and width on the punching position of a silicon ring, and after all pit processing is completed, a second drill bit is utilized to punch each pit, and intermittent punching is performed in the process of punching the second drill bit, namely, after the preset punching depth is completed each time, the second drill bit is lifted up to be cooled and washed, then punching is performed again until the next pit is punched after the position is punched, and because the diameter of the first drill bit is slightly wider than that of the second drill bit, the processed pit has a larger width than that of the second drill bit, so that the second drill bit is convenient to enter the pit and can play the positioning purpose after being processed again, and meanwhile, chips and silicon mud generated by processing are discharged from the pits in the processing process of the second drill bit, so that the phenomenon of bumping a cutter is prevented, the normal processing of the silicon ring is ensured, the service life of the second drill bit is prolonged, and the processing cost is further saved.
Description
Technical Field
The invention relates to the technical field of semiconductor processing, in particular to a silicon ring surface punching method.
Background
The surface of the silicon ring is provided with a plurality of small holes, and the small holes on the surface of the silicon ring are used for exhausting gas in the process of etching the semiconductor in the process of fixing the semiconductor product on the silicon ring to remove liquid and impurities clamped between the silicon ring and an etching target. Because the silicon ring is also consumed by etching in the etching process, the silicon ring is a periodical consumable product, the market demand of silicon component products is mainly driven by the processing capacity of chip wafers, according to the global current wafer production condition, the number of 8 inch silicon rings and silicon electrodes is respectively 30 ten thousand sheets and 7 ten thousand sheets in the global year, and the number of 12 inch silicon rings and silicon electrodes is respectively 50 ten thousand sheets and 10 ten thousand sheets.
At present, when a small hole is machined, a machine tool is started to machine the small hole after the positioning of the silicon ring and the setting of the height of a cutter are carried out, small hole cutter breakage often occurs in the small hole machining process, the silicon ring is not found to displace after the fixture for fixing the silicon ring is confirmed, and the jump of the cutter for machining the small hole is also in a required qualified range, and because the cutter cannot be taken out after cutter breakage, the silicon ring has to be scrapped, and the production cost is increased.
Disclosure of Invention
The invention mainly aims to provide a silicon ring surface punching method, which solves the problems that in the prior art, small hole cutter breakage often occurs in the process of processing small holes, and the silicon ring is scrapped to increase the production cost.
A silicon ring surface punching method comprises the following steps:
step one, fixing a silicon ring to be processed on a fixed table of a processing center;
secondly, adopting a manual surface beating method to find circles of the silicon rings;
step three, a first drill bit is arranged on the main shaft, the main shaft is controlled by the processing center to move to the position above the silicon ring and to be opposite to the punching position of the silicon ring, and the punching position is used as an initial position;
step four, a processing center controls a spindle provided with a first drill bit to process corresponding pits at the punching position of a silicon ring, wherein the pits are used for enabling a second drill bit to be positioned in the pits and complete punching, the rotating speed of the first drill bit is 10000 revolutions per minute, the drilling depth of the pits is 0.35mm, a pit is formed on the surface of the silicon ring, the first drill bit is lifted after finishing one pit, a fixed table moves under the control of the processing center, the position of the next pit is located under the first drill bit, the first drill bit descends again to process the next pit on the silicon ring, the processing time of each pit is 0.4 minute, chips in flushing holes are adopted when each pit is punched, meanwhile, the first drill bit is cooled, and after all the pits are completed, a mechanical arm is controlled by the processing center to detach the first drill bit and then move the first drill bit to a tool magazine; wherein the diameter of the first drill bit is larger than the diameter of the second drill bit;
and fifthly, after all the pits are machined, the machining center takes out the second drill bit from the tool magazine and installs the second drill bit on the main shaft, the fixing table moves under the control of the machining center so that the initial position of the silicon ring moves to the position right below the second drill bit, at the moment, the pit corresponding to the initial position is located right below the second drill bit, the main shaft controls the second drill bit to punch the pit below the second drill bit for the second time, the rotating speed of the second drill bit is 11000 revolutions per minute, after the second drill bit is lifted up, the second drill bit is required to be washed and cooled by cooling liquid until the first pit is punched through, the second drill bit is lifted up, the fixing table moves under the control of the machining center again so that the next pit is located right below the second drill bit, and the second drill bit continues to punch under the control of the machining center until all the holes are punched.
Preferably, the diameter of the first drill is 1.25mm, and the effective length of the drill is 2.5mm.
Preferably, the diameter of the second drill bit is 0.65mm, and the effective length of the drill bit is 9-15mm.
Preferably, the front ends of the first drill bit and the second drill bit are made of diamond materials, the rest parts of the first drill bit and the second drill bit are made of alloy materials, and the rest parts of the first drill bit and the second drill bit refer to the drill bit parts except the first drill bit and the second drill bit.
Preferably, in the fourth step, before the first drill bit is controlled by the machining center to move to the tool magazine after all pits are formed, the silicon mud on the first drill bit is required to be washed clean, and then the first drill bit is wrapped by sponge containing industrial lubricating oil.
Preferably, in the fifth step, after the second drill bit is lifted and then washed and cooled by the cooling liquid, a water pipe arranged beside the machining center is adopted to extend into the current small hole machined by the second drill bit to wash, the water pressure sprayed by the water pipe is controlled to be 0.4-0.6mpa, so that the silicon mud in the current small hole is completely discharged, the second drill bit is convenient to machine the small hole again, and as no silicon mud exists in the small hole in the initial process of re-machining the small hole by the second drill bit, chips and silicon mud generated when the second drill bit contacts the bottom of the small hole to punch can be timely discharged from a chip removing groove of the second drill bit.
Preferably, after the second drill bit in the fifth step completes all punching, the silicon mud on the second drill bit is washed clean, and the second drill bit is wrapped by sponge containing industrial lubricating oil.
According to the technical scheme, firstly, pits with preset depth and width are machined at the punching position of the silicon ring by adopting the first drill bit, after all pit machining is finished, holes are drilled on each pit by utilizing the second drill bit, and intermittent holes are drilled in the process of drilling the second drill bit, namely, the second drill bit is lifted up to be cooled and washed after the preset drilling depth is finished each time, holes are drilled again until the position is punched, and then the next pit is drilled, because the diameter of the first drill bit is slightly wider than that of the second drill bit, the machined pit is wider than that of the second drill bit, so that the second drill bit can conveniently enter the pits and can play the positioning purpose after being machined again, chips and silicon mud generated by machining are discharged from the pits in the machining process, the phenomenon of bumping a cutter in the machining process of the second drill bit is avoided, the normal machining of the silicon ring is ensured, the service life of the second drill bit is prolonged, and the machining cost is further saved.
Drawings
Fig. 1 is a state diagram of a silicon ring being processed with a first drill bit to form pits in the silicon ring.
Fig. 2 is a state diagram of re-punching pits on a silicon ring using a second drill bit.
FIG. 3 is a schematic view of a machining center with a fine water tube and an air jet tube positioned beside the main shaft.
Fig. 4 is an enlarged view of the silicon ring after the pit is completed.
Fig. 5 is an enlarged view of the silicon ring after the pit is punched.
In the figure: on the fixed table 10, the main shaft 20, the first drill bit 30, the second drill bit 40, the water pipe 50, the air injection pipe 60, the silicon ring 200, the pit 201 and the small hole 202.
Detailed Description
The technical scheme and technical effects of the embodiments of the present invention are further described in detail below with reference to the accompanying drawings.
The silicon ring surface punching method provided by the application comprises the following steps:
step one, fixing a silicon ring 200 to be processed on a fixed table 10 of a processing center;
step two, a manual surface beating method is adopted to find circles of the silicon ring 200, and the specific process of finding the circles is as follows: firstly, aligning the circle center of a silicon ring 200 with the axis of a main shaft 20, fixing a dial indicator on the main shaft 20 of a machining center, abutting the tip of the dial indicator on the inner circumferential side wall of the silicon ring 200, manually rotating the main shaft 20, observing the rotation direction of a dial indicator needle, adjusting the X, Y direction of a fixed table 10 according to the rotation direction of the dial indicator needle, rotating the main shaft 20 again after adjustment, observing the rotation direction of the dial indicator needle, and manually rotating the main shaft 20 after several times or multiple times of adjustment tests to ensure that the dial indicator needle is stable or floats in a small range, so that the circle center position is found;
step three, a first drill 30 is arranged on the main shaft 20, the machining center controls the main shaft 20 to move to the position above the silicon ring 200 and to face the punching position of the silicon ring 200, and the punching position is used as an initial position;
step four, the machining center controls the spindle 20 with the first drill bit 30 installed to machine a corresponding pit 201 at the punching position of the silicon ring 200, wherein the pit 201 has the function of positioning the second drill bit 40 in the pit 201 and completing punching, specifically: the rotation speed of the first drill bit 30 is 10000 revolutions per minute, the drilling depth of the pits 201 is 0.35mm, one pit 201 is formed on the surface of the silicon ring 200, the first drill bit 30 is lifted after finishing one pit 201, the fixed table 10 moves under the control of the machining center, the position of the next pit 201 is positioned under the first drill bit 30, the first drill bit 30 descends again to machine the next pit 201 on the silicon ring 200, the machining duration of each pit 201 is 0.4 minute, when each pit 201 is perforated, cooling liquid is adopted to wash chips in holes, meanwhile, the first drill bit 30 is cooled, and after the first drill bit 30 finishes all the pits 201, a machining center controls a mechanical arm to detach the first drill bit 30 and then move the first drill bit 30 to a tool magazine; wherein the diameter of the first drill bit 30 is larger than the diameter of the second drill bit 40.
And fifthly, after all the pits 201 are machined, the machining center takes out the second drill bit 40 from the tool magazine and installs the second drill bit 40 on the main shaft 20, the fixing table 10 moves under the control of the machining center so that the initial position of the silicon ring 200 moves to the position right below the second drill bit 40, at this time, the pit 201 corresponding to the initial position is located right below the second drill bit 40, the main shaft 20 controls the second drill bit 40 to punch the pit 201 below the second drill bit, the rotating speed of the second drill bit 40 is 11000 revolutions per minute, after each punching depth of 0.1-0.5mm, the second drill bit 40 needs to be lifted up and then washed and cooled by cooling liquid until the first pit 201 is punched, the fixing table 10 moves again under the control of the machining center so that the next pit 201 is located right below the second drill bit 40, and then the second drill bit 40 continues to punch under the control of the machining center until all punching is completed.
The method comprises the steps of adopting a first drill bit 30 to carry out pit 201 with preset depth and width on the punching position of a silicon ring 200, after all pit 201 are processed, then using a second drill bit 40 to punch each pit 201, and intermittently punching in the punching process of the second drill bit 40, namely lifting the second drill bit 40 to cool and wash after each preset punching depth is finished, and punching again until the position is punched; then, the next pit 201 is punched. Because the diameter of the first drill bit 30 is larger than that of the second drill bit 40, the width of the machined pit 201 is larger than that of the second drill bit 40, so that the second drill bit 40 can conveniently enter the pit 201 to be machined again and then can play a role in positioning, meanwhile, scraps and silicon mud generated by machining are conveniently discharged from the pit 201 in the machining process of the second drill bit 40, the phenomenon of cutter collision in the machining process of the second drill bit 40 is prevented, normal machining of the silicon ring 200 is ensured, the service life of the second drill bit 40 is prolonged, and machining cost is further saved. By adopting the second drill 40 to directly process small holes on the silicon ring, one second drill 40 can complete the processing of 8-15 silicon rings, and after adopting the processing method of the application, the first drill 30 and the second drill 40 can process about 50 silicon rings.
In the above processing method, the first drill bit 30 is initially installed on the spindle 20, after all the pits 201 are processed by the first drill bit 30, the control center controls the manipulator to disassemble the first drill bit 30 according to a preset program and then place the first drill bit 30 in the tool magazine, then the required second drill bit 40 is taken out from the tool magazine and installed on the spindle 20, and the spindle 20 starts to process each pit 201 according to the instruction of the control center.
Further, the diameter of the first drill 30 is 1.25mm, and the effective length of the drill is 2.5mm. The slightly shorter length of the first drill bit 30 ensures accurate machining of the pit 201.
Further, the diameter of the second drill 40 is 0.65mm, and the effective length of the drill is 9-15mm. The 9-15mm second drill 40 is capable of punching holes into the silicon ring 200 to be machined.
Further, the front ends of the first drill bit 30 and the second drill bit 40 are made of diamond material, and the rest of the first drill bit 30 and the second drill bit 40 are made of alloy material, and the rest of the first drill bit 30 and the second drill bit 40 refer to the drill bit parts except the first drill bit 30 and the second drill bit 40.
Further, in the fourth step, before the first drill 30 is moved to the tool magazine under control of the machining center after all the pits 201 are completed, the silicon mud on the first drill 30 needs to be washed clean, and then the first drill 30 is wrapped by the sponge containing the industrial lubricating oil. When the sponge containing the industrial lubricating oil is used for wrapping the first drill bit 30, even though the first drill bit 30 is still adhered with the silicon mud after cleaning, the silicon mud is in a softened state under the action of the lubricating oil, when the first drill bit 30 is used for processing the silicon ring again, the residual silicon mud is easy to separate from the first drill bit, the silicon mud is not firmly adhered to the first drill bit after being dried, and when the silicon mud adhered to the first drill bit 30 is used for processing the pit 201 on the silicon ring, the silicon ring is damaged or the first drill bit 30 is damaged due to uneven cutting or the dried silicon mud is prevented from being discharged from the first drill bit, namely, one condition of cutter collision is caused.
Further, in the fifth step, after the second drill bit 40 is lifted and then washed and cooled by the cooling liquid in each punching depth of 0.1-0.5mm, the current small hole 202 machined by the second drill bit 40 is washed by adopting the water pipe 50 arranged beside the main shaft, the water pressure sprayed by the water pipe is controlled to be 0.4-0.6mpa, so that all the silicon mud in the current small hole 202 is discharged, the second drill bit 40 is convenient to machine the small hole 202 again, and because no silicon mud exists in the small hole 202 in the initial process of re-machining the small hole by the second drill bit 40, the chips and the silicon mud generated when the second drill bit 40 contacts the bottom of the small hole 202 for punching can be timely discharged from the chip removing groove of the second drill bit 40. In order to completely discharge the silicon mud in the small hole 202, the air ejector pipe 60 arranged beside the main shaft is adopted to blow the current small hole 202 processed by the second drill bit 40, and the water of the silicon mud in the current small hole 202 is blown out, so that the processing efficiency of the subsequent second drill bit 40 is improved.
Further, after the second drill 40 has completed all the holes in the fifth step, the silicon mud on the second drill 40 is washed clean, and the second drill 40 is wrapped by the sponge containing the industrial lubricating oil. The purpose of the second drill 40 to encase the sponge containing the industrial lubricant is the same as the purpose of the first drill 30 to encase the sponge containing the industrial lubricant.
Claims (7)
1. The surface punching method of the silicon ring is characterized by comprising the following steps of:
step one, fixing a silicon ring to be processed on a fixed table of a processing center;
secondly, adopting a manual surface beating method to find circles of the silicon rings;
step three, a first drill bit is arranged on the main shaft, the main shaft is controlled by the processing center to move to the position above the silicon ring and to be opposite to the punching position of the silicon ring, and the punching position is used as an initial position;
step four, a processing center controls a spindle provided with a first drill bit to process corresponding pits at the punching position of a silicon ring, wherein the pits are used for enabling a second drill bit to be positioned in the pits and complete punching, the rotating speed of the first drill bit is 10000 revolutions per minute, the drilling depth of the pits is 0.35mm, a pit is formed on the surface of the silicon ring, the first drill bit is lifted after finishing one pit, a fixed table moves under the control of the processing center, the position of the next pit is located under the first drill bit, the first drill bit descends again to process the next pit on the silicon ring, the processing time of each pit is 0.4 minute, chips in flushing holes are adopted when each pit is punched, meanwhile, the first drill bit is cooled, and after all the pits are completed, a mechanical arm is controlled by the processing center to detach the first drill bit and then move the first drill bit to a tool magazine; wherein the diameter of the first drill bit is larger than the diameter of the second drill bit;
and fifthly, after all the pits are machined, the machining center takes out the second drill bit from the tool magazine and installs the second drill bit on the main shaft, the fixing table moves under the control of the machining center so that the initial position of the silicon ring moves to the position right below the second drill bit, at the moment, the pit corresponding to the initial position is located right below the second drill bit, the main shaft controls the second drill bit to punch the pit below the second drill bit for the second time, the rotating speed of the second drill bit is 11000 revolutions per minute, after the second drill bit is lifted up, the second drill bit is required to be washed and cooled by cooling liquid until the first pit is punched through, the second drill bit is lifted up, the fixing table moves under the control of the machining center again so that the next pit is located right below the second drill bit, and the second drill bit continues to punch under the control of the machining center until all the holes are punched.
2. The method for punching the surface of a silicon ring according to claim 1, wherein: the diameter of the first drill bit is 1.25mm, and the effective length of the drill bit is 2.5mm.
3. The method for punching the surface of a silicon ring according to claim 1, wherein: the diameter of the second drill bit is 0.65mm, and the effective length of the drill bit is 9-15mm.
4. The method for punching the surface of a silicon ring according to claim 1, wherein: the front ends of the first drill bit and the second drill bit are made of diamond materials, the rest parts of the first drill bit and the second drill bit are made of alloy materials, and the rest parts of the first drill bit and the second drill bit refer to the drill bit parts except the first drill bit and the second drill bit.
5. The method for punching the surface of a silicon ring according to claim 1, wherein: and step four, before the first drill bit is controlled by a processing center to move to a tool magazine after all pits are formed, the silicon mud on the first drill bit is required to be washed clean, and then the first drill bit is wrapped by sponge containing industrial lubricating oil.
6. The method for punching the surface of a silicon ring according to claim 1, wherein: and in the fifth step, after the second drill bit is lifted and then washed and cooled by using the cooling liquid, a water-thin pipe arranged beside the machining center is adopted to extend into the current small hole machined by the second drill bit to wash, and the water pressure sprayed by the water-thin pipe is controlled at 0.4-0.6mpa, so that the silicon mud in the current machined small hole is completely discharged, the second drill bit is convenient to machine the small hole again, and because no silicon mud exists in the small hole in the initial process of re-machining the small hole by the second drill bit, chips and silicon mud generated when the second drill bit contacts the bottom of the small hole to punch can be timely discharged from a chip removing groove of the second drill bit.
7. The method for punching the surface of a silicon ring according to claim 1, wherein: and (3) after the second drill bit in the step five completes all punching, washing the silicon mud on the second drill bit, and wrapping the second drill bit by using sponge containing industrial lubricating oil.
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| CN202211726192.5A CN116001113B (en) | 2022-12-29 | 2022-12-29 | Silicon ring surface punching method |
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| CN202211726192.5A CN116001113B (en) | 2022-12-29 | 2022-12-29 | Silicon ring surface punching method |
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Citations (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005014360A (en) * | 2003-06-25 | 2005-01-20 | Yunika Kk | Drill |
| JP2005246818A (en) * | 2004-03-05 | 2005-09-15 | Okamoto Glass Co Ltd | Method and apparatus for boring brittle material |
| JP2011111370A (en) * | 2009-11-27 | 2011-06-09 | Nippon Electric Glass Co Ltd | Apparatus and method for manufacturing glass plate |
| CN102198527A (en) * | 2010-03-23 | 2011-09-28 | 宝山钢铁股份有限公司 | Method for correcting eccentricity of drill type deep hole |
| CN102935524A (en) * | 2012-11-09 | 2013-02-20 | 沈阳黎明航空发动机(集团)有限责任公司 | Deep hole drilling processing method of high temperature alloy material casing |
| CN202804272U (en) * | 2012-09-27 | 2013-03-20 | 上海哲成汽车装备工程有限公司 | Movable guide sleeve device |
| CN103143748A (en) * | 2013-02-28 | 2013-06-12 | 苏州力强机械制造有限公司 | Improved single-tube deep hole drilling machine |
| CN103302337A (en) * | 2006-03-02 | 2013-09-18 | 密尔沃基电动工具公司 | Cutting tool |
| CN103600424A (en) * | 2013-11-25 | 2014-02-26 | 广西玉柴机器股份有限公司 | Drilling tool for exhaust holes of sand cores |
| CN104723045A (en) * | 2015-03-24 | 2015-06-24 | 西安交通大学 | Machining process and tool for shaft with inner step hole with large depth-diameter ratio |
| CN107310060A (en) * | 2017-08-23 | 2017-11-03 | 鲁东大学 | A kind of water drilling perforate support |
| CN109604680A (en) * | 2018-12-06 | 2019-04-12 | 国家电网有限公司 | A set of deep hole processing tool and technique suitable for Overhaul site |
| CN110421650A (en) * | 2019-07-04 | 2019-11-08 | 安徽永卓自动化科技有限公司 | A kind of method of minor diameter bamboo and wood stick drilling |
| CN211516699U (en) * | 2019-12-31 | 2020-09-18 | 仪征市联兴汽车配件制造有限公司 | Inner hole machining device for camshaft |
| CN112676597A (en) * | 2020-12-17 | 2021-04-20 | 昆山利东精密工业有限公司 | Deep hole machining process for camera assembly |
| CN112917103A (en) * | 2021-02-02 | 2021-06-08 | 中国航发长春控制科技有限公司 | Method for processing titanium alloy deep groove or deep hole |
| KR20210075842A (en) * | 2019-12-13 | 2021-06-23 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | Cutter holder attached structure and cutter holder |
| CN113798551A (en) * | 2021-09-13 | 2021-12-17 | 江苏华龙铸铁型材有限公司 | Alloy cast iron section bar deep hole jacking processing and forming device and using method thereof |
| CN114136211A (en) * | 2021-11-26 | 2022-03-04 | 深圳市吉祥云科技有限公司 | Method and system for improving positioning accuracy of large-format glass |
| CN217799062U (en) * | 2022-06-06 | 2022-11-15 | 李习波 | Drilling machine for construction |
-
2022
- 2022-12-29 CN CN202211726192.5A patent/CN116001113B/en active Active
Patent Citations (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005014360A (en) * | 2003-06-25 | 2005-01-20 | Yunika Kk | Drill |
| JP2005246818A (en) * | 2004-03-05 | 2005-09-15 | Okamoto Glass Co Ltd | Method and apparatus for boring brittle material |
| CN103302337A (en) * | 2006-03-02 | 2013-09-18 | 密尔沃基电动工具公司 | Cutting tool |
| JP2011111370A (en) * | 2009-11-27 | 2011-06-09 | Nippon Electric Glass Co Ltd | Apparatus and method for manufacturing glass plate |
| CN102198527A (en) * | 2010-03-23 | 2011-09-28 | 宝山钢铁股份有限公司 | Method for correcting eccentricity of drill type deep hole |
| CN202804272U (en) * | 2012-09-27 | 2013-03-20 | 上海哲成汽车装备工程有限公司 | Movable guide sleeve device |
| CN102935524A (en) * | 2012-11-09 | 2013-02-20 | 沈阳黎明航空发动机(集团)有限责任公司 | Deep hole drilling processing method of high temperature alloy material casing |
| CN103143748A (en) * | 2013-02-28 | 2013-06-12 | 苏州力强机械制造有限公司 | Improved single-tube deep hole drilling machine |
| CN103600424A (en) * | 2013-11-25 | 2014-02-26 | 广西玉柴机器股份有限公司 | Drilling tool for exhaust holes of sand cores |
| CN104723045A (en) * | 2015-03-24 | 2015-06-24 | 西安交通大学 | Machining process and tool for shaft with inner step hole with large depth-diameter ratio |
| CN107310060A (en) * | 2017-08-23 | 2017-11-03 | 鲁东大学 | A kind of water drilling perforate support |
| CN109604680A (en) * | 2018-12-06 | 2019-04-12 | 国家电网有限公司 | A set of deep hole processing tool and technique suitable for Overhaul site |
| CN110421650A (en) * | 2019-07-04 | 2019-11-08 | 安徽永卓自动化科技有限公司 | A kind of method of minor diameter bamboo and wood stick drilling |
| KR20210075842A (en) * | 2019-12-13 | 2021-06-23 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | Cutter holder attached structure and cutter holder |
| CN211516699U (en) * | 2019-12-31 | 2020-09-18 | 仪征市联兴汽车配件制造有限公司 | Inner hole machining device for camshaft |
| CN112676597A (en) * | 2020-12-17 | 2021-04-20 | 昆山利东精密工业有限公司 | Deep hole machining process for camera assembly |
| CN112917103A (en) * | 2021-02-02 | 2021-06-08 | 中国航发长春控制科技有限公司 | Method for processing titanium alloy deep groove or deep hole |
| CN113798551A (en) * | 2021-09-13 | 2021-12-17 | 江苏华龙铸铁型材有限公司 | Alloy cast iron section bar deep hole jacking processing and forming device and using method thereof |
| CN114136211A (en) * | 2021-11-26 | 2022-03-04 | 深圳市吉祥云科技有限公司 | Method and system for improving positioning accuracy of large-format glass |
| CN217799062U (en) * | 2022-06-06 | 2022-11-15 | 李习波 | Drilling machine for construction |
Non-Patent Citations (2)
| Title |
|---|
| 王世清;朱林;刘战锋;彭海;: "新型无横刃深孔麻花钻的结构特点及刃形分析", 机械制造, no. 02, 2 March 1993 (1993-03-02) * |
| 陈春: "《机械制造设计基础》", 31 August 2008, 西南交通大学出版社, pages: 172 - 183 * |
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