TW202245982A - Auxiliary device capable of automatically replacing cutting blades - Google Patents
Auxiliary device capable of automatically replacing cutting blades Download PDFInfo
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- TW202245982A TW202245982A TW111117661A TW111117661A TW202245982A TW 202245982 A TW202245982 A TW 202245982A TW 111117661 A TW111117661 A TW 111117661A TW 111117661 A TW111117661 A TW 111117661A TW 202245982 A TW202245982 A TW 202245982A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/024—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with the stock carried by a movable support for feeding stock into engagement with the cutting blade, e.g. stock carried by a pivoted arm or a carriage
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a plurality of cutting blades
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Machine Tool Units (AREA)
- Details Of Cutting Devices (AREA)
- Accessories And Tools For Shearing Machines (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Dicing (AREA)
Abstract
Description
本發明是有關於一種連結於切削裝置之輔助裝置。The invention relates to an auxiliary device connected with a cutting device.
將IC、LSI等的複數個器件藉由交叉之複數條分割預定線來區劃且形成在正面之晶圓,可藉由切削裝置來分割成一個個的器件晶片,並且可將經分割之各器件晶片應用在行動電話、個人電腦等的電氣機器上。A plurality of devices such as IC, LSI, etc. are divided by a plurality of crossing dividing lines and formed on the front side of the wafer, which can be divided into individual device wafers by a cutting device, and each divided device can be divided into Chips are used in electrical equipment such as mobile phones and personal computers.
切削裝置具備:工作夾台,具備有保持晶圓之保持面;切削機構,以固定螺帽裝設有切削刀片,前述切削刀片對已保持在工作夾台之晶圓進行切削;X軸進給機構,使工作夾台在X軸方向上加工進給;Y軸進給機構,使切削機構在和X軸方向正交之Y軸方向上分度進給;及Z軸進給機構,使切削機構在和X軸方向以及Y軸方向正交之Z軸方向上切入進給,保持面是以X軸方向以及Y軸方向來規定,且可以高精度地將晶圓分割成一個個的器件晶片。The cutting device is equipped with: a work clamp table with a holding surface for holding the wafer; a cutting mechanism with a cutting blade mounted on a fixed nut, and the aforementioned cutting blade cuts the wafer held on the work clamp table; X-axis feed Mechanism to make the work clamp table feed in the X-axis direction; Y-axis feed mechanism to make the cutting mechanism index-feed in the Y-axis direction orthogonal to the X-axis direction; and Z-axis feed mechanism to make the cutting The mechanism cuts and feeds in the Z-axis direction perpendicular to the X-axis direction and the Y-axis direction. The holding surface is defined by the X-axis direction and the Y-axis direction, and the wafer can be divided into individual device wafers with high precision. .
本發明之申請人已提出一種可以自動地更換已裝設於切削機構之切削刀片的自動更換裝置(參照例如專利文獻1)。 先前技術文獻 專利文獻 The applicant of the present invention has proposed an automatic exchange device that can automatically exchange cutting inserts installed in a cutting mechanism (see, for example, Patent Document 1). prior art literature patent documents
專利文獻1:日本特開2007-98536號公報Patent Document 1: Japanese Patent Laid-Open No. 2007-98536
發明欲解決之課題The problem to be solved by the invention
但是,有以下問題:要在之後將自動更換裝置裝設到已經交貨給使用者之切削裝置是困難的。However, there is a problem that it is difficult to later attach the automatic changer to the cutting device that has been delivered to the user.
據此,本發明之目的在於提供一種可以在之後裝設到已經交貨給使用者之切削裝置之輔助裝置。 用以解決課題之手段 Accordingly, it is an object of the present invention to provide an auxiliary device that can be subsequently fitted to a cutting device that has been delivered to the user. means to solve problems
根據本發明,可提供一種輔助裝置,可連結於切削裝置,前述切削裝置具備:工作夾台,具備有保持被加工物之保持面;切削機構,以固定螺帽裝設有切削刀片,前述切削刀片對已保持在該工作夾台之被加工物進行切削;X軸進給機構,使該工作夾台在X軸方向上加工進給;Y軸進給機構,使該切削機構在和該X軸方向正交之Y軸方向上分度進給;及Z軸進給機構,使該切削機構在和該X軸方向以及該Y軸方向正交之Z軸方向上切入進給,且該保持面是以該X軸方向以及該Y軸方向來規定,前述輔助裝置具備有: 切削刀片保管機構,保管複數個切削刀片; 搬出入機構,從該切削刀片保管機構保持切削刀片的正面並進行搬出以及搬入; Y軸方向定位機構,讓該搬出入機構相對於該切削刀片保管機構定位到Y軸方向的作用位置與退避位置; Z軸移動機構,讓該搬出入機構在Z軸方向上移動; X軸移動機構,讓該搬出入機構在X軸方向上移動,來作用於已裝設在該切削機構的主軸之切削刀片;及 洗淨機構,對已被該搬出入機構保持之切削刀片的背面進行洗淨。 According to the present invention, an auxiliary device can be provided, which can be connected to the cutting device. The cutting device includes: a work clamp table with a holding surface for holding the workpiece; a cutting mechanism with a cutting blade mounted on a fixed nut. The blade cuts the workpiece held on the work clamp; the X-axis feed mechanism makes the work clamp work in the direction of the X-axis; the Y-axis feed mechanism makes the cutting mechanism and the X-axis Indexing feed in the Y-axis direction orthogonal to the axis direction; and Z-axis feed mechanism, so that the cutting mechanism cuts in and feeds in the Z-axis direction orthogonal to the X-axis direction and the Y-axis direction, and the holding The surface is defined by the X-axis direction and the Y-axis direction, and the aforementioned auxiliary device has: The cutting blade storage mechanism stores a plurality of cutting blades; A carrying-in/out mechanism for carrying out and carrying-in the cutting insert while holding the front side of the cutting insert; A positioning mechanism in the Y-axis direction, allowing the carrying-in and out-in mechanism to be positioned at the active position and the retracted position in the Y-axis direction relative to the cutting blade storage mechanism; The Z-axis moving mechanism allows the moving in and out mechanism to move in the Z-axis direction; An X-axis moving mechanism for moving the carry-in/out mechanism in the X-axis direction to act on the cutting blade installed on the main shaft of the cutting mechanism; and The cleaning mechanism cleans the back surface of the cutting blade held by the carrying-in/out mechanism.
較佳的是,該切削刀片保管機構包含:驅動齒輪,具有在Y軸方向上延伸之旋轉軸;從動齒輪,和該驅動齒輪在Z軸方向上分開且具有在Y軸方向上延伸之旋轉軸;無端軌道,捲繞於該驅動齒輪與該該從動齒輪;及支撐軸,在Y軸方向上延伸並以預定的間隔配設在該無端軌道,且可***切削刀片的中央開口部來支撐切削刀片, 該洗淨機構具備空氣噴嘴,前述空氣噴嘴相鄰於該切削刀片保管機構而配設,且對已被該搬出入機構所保持之切削刀片的背面噴附空氣來進行洗淨。 較佳的是,該空氣噴嘴配設在該切削刀片保管機構的該支撐軸的背部,且對已支撐於該支撐軸之切削刀片的背部噴附空氣來使切削刀片朝該支撐軸的前端移動,而相對於該搬出入機構來定位切削刀片的正面。 較佳的是,該搬出入機構包含:Z旋轉軸,在Z軸方向上延伸;刀片保持部,呈放射狀地連結於該Z旋轉軸且吸引保持切削刀片;及固定螺帽保持部,對已形成於該主軸的前端之公螺絲來螺接以及螺鬆該固定螺帽,相對於1個該固定螺帽保持部具備有2個該刀片保持部。 較佳的是,該搬出入機構配設於框體,且該框體呈可滑動地被已配設在升降工作台之在Y軸方向上延伸之導軌支撐,並藉由該Y軸方向定位機構來相對於該切削刀片保管機構定位到Y軸方向的該作用位置與該退避位置。 較佳的是,該搬出入機構配設在已配設於該框體的內部之第一移動體,該第一移動體以被懸吊之狀態可滑動地支撐在已配設在第二移動體的下部之在X軸方向上延伸之第一導軌,該第二移動體以被懸吊之狀態可滑動地支撐在已配設在該框體的頂板部之在X軸方向上延伸之第二導軌,該搬出入機構是藉由該第一移動體以及該第二移動體而構成為在X軸方向上進出自如。 發明效果 Preferably, the cutting blade storage mechanism includes: a driving gear having a rotation shaft extending in the Y-axis direction; a driven gear separated from the driving gear in the Z-axis direction and having a rotation shaft extending in the Y-axis direction; shaft; an endless rail wound around the drive gear and the driven gear; and a support shaft extending in the Y-axis direction and arranged on the endless rail at predetermined intervals, and insertable into the central opening of the cutting blade to support cutting inserts, The cleaning mechanism includes an air nozzle disposed adjacent to the cutting blade storage mechanism, and sprays air to the back surface of the cutting blade held by the carrying-in/out mechanism for cleaning. Preferably, the air nozzle is arranged at the back of the support shaft of the cutting blade storage mechanism, and sprays air on the back of the cutting blade supported by the support shaft to move the cutting blade toward the front end of the support shaft , and the front side of the cutting insert is positioned relative to the carry-in mechanism. Preferably, the carrying-in mechanism includes: a Z rotation shaft extending in the Z-axis direction; a blade holder radially connected to the Z rotation shaft and attracting and holding the cutting blade; and a fixed nut holder for holding the cutting blade. The male screw formed on the front end of the main shaft is used to screw and unscrew the fixing nut, and there are two blade holding parts for one fixing nut holding part. Preferably, the carrying-in/out mechanism is arranged on a frame body, and the frame body is slidably supported by a guide rail extending in the Y-axis direction that has been arranged on the lifting table, and is positioned by the Y-axis direction. The mechanism is used to locate the active position and the retracted position in the Y-axis direction relative to the cutting blade storage mechanism. Preferably, the carrying-in/out mechanism is arranged on the first moving body arranged inside the frame body, and the first moving body is slidably supported on the second moving body arranged in a suspended state. The first guide rail extending in the X-axis direction at the lower part of the body, and the second moving body is slidably supported on the first guide rail extending in the X-axis direction arranged on the top plate of the frame in a suspended state. Two guide rails, the carrying in and out mechanism is configured by the first moving body and the second moving body so that it can move in and out freely in the X-axis direction. Invention effect
本發明之輔助裝置可以在之後裝設到已經交貨給使用者之切削裝置。The auxiliary device according to the invention can then be fitted to the cutting device already delivered to the user.
用以實施發明之形態form for carrying out the invention
以下,針對本發明實施形態之輔助裝置,一面參照圖式一面說明。Hereinafter, an auxiliary device according to an embodiment of the present invention will be described with reference to the drawings.
參照圖1來說明,整體以符號2表示之輔助裝置至少具備:切削刀片保管機構4,保管複數個切削刀片;搬出入機構6,從切削刀片保管機構4保持切削刀片的正面並進行搬出以及搬入;Y軸方向定位機構8,讓搬出入機構6相對於切削刀片保管機構4定位到Y軸方向的作用位置與退避位置;Z軸移動機構10,讓搬出入機構6在Z軸方向上移動;X軸移動機構12,讓搬出入機構6在X軸方向上移動,來作用於已裝設在切削裝置的切削機構的主軸之切削刀片;及洗淨機構13,對已被搬出入機構6保持之切削刀片的背面進行洗淨。Referring to FIG. 1 for illustration, the auxiliary device represented by the
再者,X軸方向是在圖1以箭頭X表示之方向,Y軸方向是在圖1以箭頭Y表示之方向且為正交於X軸方向之方向,Z軸方向是在圖1以箭頭Z表示之方向且為正交於X軸方向以及Y軸方向之上下方向。又,X軸方向以及Y軸方向所規定之平面實質上是水平的。Furthermore, the X-axis direction is the direction indicated by the arrow X in FIG. 1, the Y-axis direction is the direction indicated by the arrow Y in FIG. The direction indicated by Z is an up-down direction perpendicular to the X-axis direction and the Y-axis direction. Moreover, the plane defined by the X-axis direction and the Y-axis direction is substantially horizontal.
如圖2所示,切削刀片保管機構4包含:驅動齒輪16,具有在Y軸方向上延伸之旋轉軸14;從動齒輪20,和驅動齒輪16在Z軸方向上分開且具有在Y軸方向上延伸之旋轉軸18;無端軌道22,捲繞於驅動齒輪16與從動齒輪20;及支撐軸24,在Y軸方向上延伸並以預定的間隔配設在無端軌道22,且可***切削刀片的中央開口部來支撐切削刀片。As shown in Figure 2, the cutting
參照圖1以及圖2來說明,本實施形態之切削刀片保管機構4包含基座板26(參照圖1)、從基座板26的上表面朝上方延伸之支撐壁28、與固定在支撐壁28的單面之馬達30。如圖2所示,在馬達30連結有驅動齒輪16的旋轉軸14,且馬達30形成為以Y軸方向為軸心來使驅動齒輪16旋轉。1 and 2, the cutting
如圖2所示地,從動齒輪20配置於驅動齒輪16的上方,且從動齒輪20的旋轉軸18是以Y軸方向為軸心而旋轉自如且在Z軸方向上升降自如地支撐於支撐壁28。於支撐壁28設置有使從動齒輪20在Z軸方向上升降之升降機構(未圖示)。升降機構亦可為例如以下之構成:具有連結於從動齒輪20的旋轉軸18且在Z軸方向上延伸之滾珠螺桿、及使此滾珠螺桿旋轉之馬達。As shown in FIG. 2 , the driven
無端軌道22是由相互連結的多數個連結片(省略符號)所構成,且捲繞於驅動齒輪16與從動齒輪20。無端軌道22形成為因應於藉由馬達30使驅動齒輪16旋轉而旋轉。再者,圖示之無端軌道22雖然描繪成連結片呈無間隙地配置,但在連結片之間有間隙,而形成為可以讓從後述之空氣噴嘴142所噴附之空氣在連結片之間通過。The
在本實施形態之切削刀片保管機構4中是形成為可以藉由以升降機構改變從動齒輪20的Z軸方向的位置,來調整驅動齒輪16與從動齒輪20的Z軸方向之間隔。又,在切削刀片保管機構4中是形成為可以藉由合宜增減無端軌道22的連結片之數量,來調整無端軌道22的長度。In the cutting
如圖2所示,支撐軸24是隔著預定的間隔而在無端軌道22配設有複數個。又,如藉由將圖3和圖2一起參照所可理解地,支撐軸24具有連結於無端軌道22的圓柱狀的基部32、與從基部32的端面朝Y軸方向延伸之圓柱狀的軸部34。軸部34的直徑比基部32的直徑更小。As shown in FIG. 2 , a plurality of
在圖3中也顯示有被支撐軸24所支撐之切削刀片36。圖3所示之切削刀片36是從切削刀片36的正面側所觀看到之切削刀片。切削刀片36具有環狀的基台38、與固定在基台38的外周部之環狀的切刃40。基台38可由鋁合金等合宜的金屬材料來形成。基台38的中央部設置有圓形的中央開口部38a。切刃40由鑽石等之磨粒、與金屬或樹脂等之結合材來形成為預定的厚度(例如10~30μm左右),且從基台38的外周緣朝徑方向外側突出。Also shown in FIG. 3 is the
於支撐軸24中,形成為軸部34可***切削刀片36的中央開口部38a,而以軸部34支撐複數個(例如5個)切削刀片36。在本實施形態中,如藉由參照圖2所可理解地,是在複數個支撐軸24當中一半數量的支撐軸24上支撐有切削刀片36。又,如圖3所示,在軸部34的前端側,在圓周方向上隔著間隔而裝設有複數個定位珠(ball plunger)42,前述複數個定位珠42用於防止以軸部34所支撐之切削刀片36的跑出。In the
如圖4所示,支撐軸24的各基部32的內部形成有流路32a,且在無端軌道22形成有連通於各流路32a的一端部之複數條流路22a。如圖3所示,各流路32a的另一端部在比軸部34更靠近徑方向外側之基部32的端面形成有開口。As shown in FIG. 4 , a
參照圖5來說明搬出入機構6。搬出入機構6至少具備在Z軸方向上延伸之Z旋轉軸46、呈放射狀地連結於Z旋轉軸46且吸引保持切削刀片36之刀片保持部48、及對已形成於切削裝置的主軸的前端之公螺絲來螺接以及螺鬆固定螺帽之固定螺帽保持部50。The carry-in/
如圖5所示,本實施形態的搬出入機構6更具備罩殼52,罩殼52具有正六角形狀之頂板54、與從頂板54的周緣垂下之矩形板狀的6個側壁56。從頂板54的上表面突出有上述Z旋轉軸46。在罩殼52的內部容置有連結於Z旋轉軸46之馬達(未圖示)。As shown in FIG. 5 , the loading/
在本實施形態中,在罩殼52的6個側壁56當中,於4個側壁56裝設有刀片保持部48,於2個側壁56裝設有固定螺帽保持部50,且2個固定螺帽保持部50是設置在相向之一對側壁56。像這樣,搬出入機構6相對於1個固定螺帽保持部50具備有2個刀片保持部48。In the present embodiment, among the six
刀片保持部48形成為圓筒狀,且在刀片保持部48的端面58設有可承接上述支撐軸24的軸部34以及切削裝置的主軸的前端部之圓形的中央開口部60、與在中央開口部60的周圍沿著圓周方向隔著等間隔而配置之複數個吸引孔62。又,各吸引孔62已連接到吸引機構(未圖示)。The
在刀片保持部48中形成為:在已定位在刀片保持部48的端面58會接觸於被切削刀片保管機構4所保管之切削刀片36的基台38的位置之狀態下,藉由吸引機構在各吸引孔62生成吸引力來吸引保持切削刀片36。In the
參照圖5來繼續說明,固定螺帽保持部50包含:圓筒狀的殼體64,固定於罩殼52的側壁56;環狀的旋轉體66,旋轉自如地容置在殼體64的內部;及馬達(未圖示),使旋轉體66旋轉。Continuing description with reference to FIG. 5 , the fixed
於旋轉體66形成有可承接切削裝置的主軸的前端部之中央開口部68。於旋轉體66的端面66a,在圓周方向上隔著間隔交互地設置有複數個吸引孔70與複數個銷72。又,各吸引孔70已連接到吸引機構(未圖示)。銷72是藉由內置於旋轉體66的彈簧(未圖示)而定位在從旋轉體66的端面66a突出之位置(圖5所示之位置),並且若朝向旋轉體66的內部被按壓時,會讓彈簧收縮而容置於旋轉體66的內部。又,銷72和已形成於固定螺帽之銷孔的位置對應而配置。A
在固定螺帽保持部50中,形成為以吸引機構在各吸引孔70生成吸引力來吸引保持固定螺帽,並且在已將銷72***形成於固定螺帽之銷孔的狀態下,藉由馬達使旋轉體66旋轉,藉此可以對已形成於主軸的前端之公螺絲來螺接以及螺鬆用於將切削刀片36固定於切削裝置的主軸之固定螺帽。In the fixing
再者,在將固定螺帽從主軸螺鬆(取下)時,即使在固定螺帽保持部50的銷72的位置與固定螺帽的銷孔的位置已偏離的情況下,仍可將旋轉體66的端面66a定位在已裝設於主軸之固定螺帽的端面,並且若在將銷72容置於旋轉體66的內部之後,藉由馬達使旋轉體66旋轉,銷72會在銷72的位置對齊於銷孔的位置時被彈簧推出,而可對銷孔***銷72。Furthermore, when the fixing nut is screwed (removed) from the main shaft, even if the position of the
可如上述地構成之搬出入機構6,在本實施形態中是如圖1所示地配設在框體74的內部。框體74是在Y軸方向上移動自如地支撐於升降工作台76,且升降工作台76是在Z軸方向上升降自如地支撐於基座架台78。The carry-in/out
若將圖6和圖1一起參照來說明,框體74包含矩形板狀的底部80、從底部80的上表面四個角落朝上方延伸之4個支柱82、及固定於各支柱82的上端之板狀的頂板部84(參照圖1)。在底部80的下表面,在X軸方向上隔著間隔而設置有一對被導引構件86,前述被導引構件86形成有在Y軸方向上延伸之溝86a。If Fig. 6 and Fig. 1 are referred to illustrate together,
升降工作台76包含矩形狀的頂板88、與從頂板88的下表面四個角落朝下方延伸之4個圓柱狀的腳部90。在頂板88的上表面設置有在X軸方向上隔著間隔且在Y軸方向上延伸之一對導軌92,且一對導軌92滑動自如地嵌合於框體74的一對被導引構件86的溝86a。The elevating table 76 includes a rectangular
又,在升降工作台76的頂板88的上表面設置有Y軸方向定位機構8。Y軸方向定位機構8具有在一對導軌92間在Y軸方向上延伸之滾珠螺桿94、與使滾珠螺桿94旋轉之馬達96。滾珠螺桿94的螺帽部(未圖示)已固定在框體74的底部80的下表面。In addition, the Y-axis
在Y軸方向定位機構8中,藉由滾珠螺桿94將馬達96的旋轉運動轉換成直線運動並傳達至框體74,而使框體74沿著一對導軌92在Y軸方向上移動。如此,配設有搬出入機構6之框體74形成為可滑動地支撐在已配設於升降工作台76之在Y軸方向上延伸之導軌92,且可藉由Y軸方向定位機構8來相對於切削刀片保管機構4定位到Y軸方向的作用位置與退避位置。In the Y-axis
上述作用位置是搬出入機構6的刀片保持部48接近於切削刀片保管機構4的位置,且為可藉由刀片保持部48吸引保持已支撐於切削刀片保管機構4之切削刀片36的位置。又,上述退避位置是搬出入機構6的刀片保持部48比上述作用位置更遠離切削刀片保管機構4之位置。The above-mentioned active position is the position where the
如圖6所示,基座架台78包含框架98、與固定於框架98的上部之矩形狀的基座板100。在基座板100的四個角落形成有供升降工作台76的腳部90滑動自如地***之4個圓形孔102。又,基座板100的中央部形成有母螺絲104。As shown in FIG. 6 , the
參照圖6繼續說明,在升降工作台76以及基座架台78連結有Z軸移動機構10。Z軸移動機構10包含在Z軸方向上延伸之滾珠螺桿106、使滾珠螺桿106旋轉之馬達108、與固定於馬達108的上端之連結板110。滾珠螺桿106已螺合於基座板100的母螺絲104。連結板110可藉由螺栓(未圖示)等之合宜的連結機構而固定到升降工作台76的頂板88的下表面。Continuing the description with reference to FIG. 6 , the Z-
在Z軸移動機構10中,是藉由滾珠螺桿106將馬達108的旋轉運動轉換成直線運動,而使升降工作台76相對於基座架台78升降,藉此使配設有搬出入機構6之框體74在Z軸方向上移動。In the Z-
參照圖7來說明,搬出入機構6配設在已配設於框體74的內部之第一移動體112,且第一移動體112以被懸吊之狀態可滑動地支撐在已配設在第二移動體114的下部之在X軸方向上延伸之第一導軌116,第二移動體114以被懸吊之狀態可滑動地支撐在已配設在框體74的頂板部84之在X軸方向上延伸之第二導軌118。Referring to Fig. 7, the carrying-in/out
第一移動體112具有矩形板狀的本體120。本體120的中央部形成有圓形孔122。可在圓形孔122***搬出入機構6的Z旋轉軸46,且Z旋轉軸46呈無法旋轉地固定於本體120。若驅動已連結於Z旋轉軸46之搬出入機構6的馬達時,搬出入機構6的罩殼52即相對於第一移動體112旋轉,且可將刀片保持部48以及固定螺帽保持部50定位到任意的方向。The first moving
在第一移動體112的本體120的上表面,在Y軸方向上隔著間隔而設置有一對被導引構件124,並且固定有塊體126,前述一對被導引構件124形成有在X軸方向上延伸之溝124a,前述塊體126形成有在X軸方向上延伸之貫通孔126a。On the upper surface of the
第二移動體114具有矩形板狀的本體128,且在本體128的下表面在Y軸方向上隔著間隔而設置有一對第一導軌116。第一導軌116滑動自如地嵌合於第一移動體112的一對被導引構件124的溝124a,且第一移動體112以被懸吊之狀態可滑動地支撐在已配設在第二移動體114之第一導軌116。The second moving
在第二移動體114的本體128的下方設置有使第一移動體112相對於第二移動體114在X軸方向上移動之第一X軸移動機構。本實施形態的第一X軸移動機構是由氣缸130所構成。氣缸130的壓缸管130a固定在本體128的下表面,且在一對第一導軌116之間朝X軸方向延伸。氣缸130的活塞桿130b的前端已嵌合並連結於第一移動體112的塊體126的貫通孔126a。A first X-axis moving mechanism for moving the first moving
作為第一X軸移動機構的氣缸130是藉由使活塞桿130b進退,而使第一移動體112相對於第二移動體114沿著第一導軌116在X軸方向上移動。The
在第二移動體114的本體128的上表面,在Y軸方向上隔著間隔而設置有一對被導引構件132,並且固定有塊體134,前述一對被導引構件132形成有在X軸方向上延伸之溝132a,前述塊體134形成有在X軸方向上延伸之母螺絲134a。On the upper surface of the
在框體74的頂板部84的下表面在Y軸方向上隔著間隔而設置有一對第二導軌118。第二導軌118滑動自如地嵌合於第二移動體114的一對被導引構件132的溝132a,且第二移動體114以被懸吊之狀態可滑動地支撐在已配設在頂板部84之第二導軌118。A pair of
在框體74的頂板部84的下方設置有使第二移動體114相對於頂板部84在X軸方向上移動之第二X軸移動機構136。本實施形態的第二X軸移動機構136具有在一對第二導軌118間在X軸方向上延伸之滾珠螺桿138、與使滾珠螺桿138旋轉之馬達140。滾珠螺桿138是螺合於第二移動體114的塊體134的母螺絲134a,且馬達140是固定在頂板部84的下表面。A second
第二X軸移動機構136是藉由滾珠螺桿138而將馬達140的旋轉運動轉換成直線運動並傳達至第二移動體114,而使第二移動體114相對於頂板部84沿著第二導軌118在X軸方向上移動。The second
本實施形態之X軸移動機構12包含作為第一X軸移動機構之氣缸130、與具有滾珠螺桿138以及馬達140之第二X軸移動機構136。在本實施形態中,藉由以作為第一X軸移動機構之氣缸130使第一移動體112移動,而形成為可以使搬出入機構6快速地在X軸方向上前進,並且可以藉由以第二X軸移動機構136使第二移動體114移動,而容易地對搬出入機構6的X軸方向位置進行微調整。像這樣,搬出入機構6構成為藉由第一移動體112以及第二移動體114而在X軸方向上進出自如。The
參照圖1、圖2以及圖8來說明,洗淨機構13具備空氣噴嘴142,前述空氣噴嘴142相鄰於切削刀片保管機構4而配設,且對已被搬出入機構6保持之切削刀片36的背面噴附空氣來進行洗淨。空氣噴嘴142已連接於高壓空氣供給機構(未圖示)。Referring to Fig. 1, Fig. 2 and Fig. 8, the
本實施形態之空氣噴嘴142是配設在切削刀片保管機構4的支撐軸24的背部。具體而言,如圖1以及圖2所示,空氣噴嘴142是在切削刀片保管機構4的驅動齒輪16的下方,從支撐壁28朝Y軸方向突出。又,空氣噴嘴142的前端是定位成和以下的支撐軸24相面對:伴隨於無端軌道22旋轉之支撐軸24之在軌道中位於最下端之支撐軸24。The
並且,如圖8所示,在洗淨機構13中是形成為藉由從空氣噴嘴142朝向已被搬出入機構6的刀片保持部48所吸引保持之切削刀片36的背面噴附空氣,來洗淨切削刀片36的背面。And, as shown in FIG. 8 , in the
從空氣噴嘴142對切削刀片36噴附空氣時,是將無端軌道22作動成支撐軸24不會位於空氣噴嘴142的前端。藉此,不會有從空氣噴嘴142所噴附之空氣受到支撐軸24阻擋之情形。又,如上述,雖然圖示的無端軌道22描繪成連結片呈無間隙地配置,但由於連結片之間有間隙,且從空氣噴嘴142所噴附之空氣可以在連結片之間通過,因此不會有利用空氣所進行之切削刀片36的洗淨被無端軌道22的連結片阻礙之情形。When spraying air from the
此外,在洗淨機構13的空氣噴嘴142中,也可以將空氣噴附到被支撐軸24支撐之切削刀片36的背部,來使切削刀片36朝支撐軸24的前端移動,而相對於搬出入機構6來定位切削刀片36的正面。In addition, in the
參照圖4來說明,在藉由搬出入機構6將位於支撐軸24的軸部34的前端側之切削刀片36搬出的情況下,形成為可以藉由從空氣噴嘴142透過無端軌道22之流路22a來對支撐軸24的基部32的流路32a供給空氣,而將留在軸部34的切削刀片36朝軸部34的前端側推出。不過,因為定位珠42的作用而不會有切削刀片36從軸部34掉落之情形。再者,在該情況下,會將無端軌道22的流路22a定位在和空氣噴嘴142面對之位置。Referring to FIG. 4 , when the
其次,參照圖9至圖14來說明連結有上述之輔助裝置2之切削裝置170。Next, the
如圖9所示,切削裝置170具備:工作夾台172,具備有保持被加工物之保持面;切削機構174,以固定螺帽裝設有切削刀片,前述切削刀片對已保持在工作夾台172之被加工物進行切削;X軸進給機構176,使工作夾台172在X軸方向上加工進給;Y軸進給機構178,使切削機構174在和X軸方向正交之Y軸方向上分度進給;及Z軸進給機構180,使切削機構174在和X軸方向以及Y軸方向正交之Z軸方向上切入進給。As shown in Figure 9, the
參照圖9以及圖10來說明,切削裝置170具備在基台182(參照圖9)的上表面以在X軸方向上移動自如的方式設置之X軸可動板184、固定於X軸可動板184的上表面之支柱186、與固定於支柱186的上端之罩板188。在罩板188形成有圓形開口188a。工作夾台172是旋轉自如地搭載在支柱186的上端,且通過罩板188的圓形開口188a而朝上方延伸。工作夾台172是藉由內置於支柱186之馬達(未圖示)而以Z軸方向作為軸心來旋轉。9 and 10, the
如圖10所示,在工作夾台172的上端部分配置有已連接到吸引機構(未圖示)之多孔質的圓形狀的吸附夾頭190。並且,在工作夾台172中形成為藉由以吸引機構在吸附夾頭190的上表面生成吸引力,而吸引保持已載置在吸附夾頭190的上表面之被加工物。如此,在工作夾台172中,吸附夾頭190的上表面會成為保持被加工物之保持面,且保持面是定位在以X軸方向以及Y軸方向所規定之XY平面上。又,在工作夾台172的周緣,於圓周方向上隔著間隔而配置有複數個夾具192。As shown in FIG. 10 , a porous
如圖10所示,X軸進給機構176具有連結於X軸可動板184並在X軸方向上延伸之滾珠螺桿198、與使滾珠螺桿198旋轉之馬達200。X軸進給機構176藉由滾珠螺桿198將馬達200的旋轉運動轉換成直線運動並傳達至X軸可動板184,使X軸可動板184沿著基台182的引導軌道182a移動,並且使工作夾台172在X軸方向上加工進給。As shown in FIG. 10 , the
如圖9所示,切削裝置170包含橫跨工作夾台172而配置之門型的框架202。框架202具有在Y軸方向上隔著間隔而從基台182的上表面朝上方延伸之一對支柱204、與橫跨架設在一對支柱204的上端間而在Y軸方向上延伸之樑206。As shown in FIG. 9 , the
切削機構174是在樑206的單側的側面(在圖9中為背面側的側面)於Y軸方向上隔著間隔而設置有一對。在本實施形態之切削裝置170中,是以讓切削刀片36相面對的方式而設置有一對切削機構174,且形成為可以藉由一對切削刀片36同時地對已保持在工作夾台172之被加工物施行切削加工。再者,切削機構174亦可為1個。A pair of cutting
如圖11所示,各切削機構174具備在Y軸方向上移動自如地支撐於樑206的單側的側面之矩形狀的Y軸可動構件208、在Z軸方向上升降自如地支撐於Y軸可動構件208之截面L字形的Z軸可動構件210、與固定在Z軸可動構件210的下端之主軸殼體212。As shown in FIG. 11 , each
在Y軸可動構件208的單側的側面(在圖11中為近前側的側面),形成有在Z軸方向上隔著間隔而在Y軸方向上延伸之一對被引導溝208a,被引導溝208a以滑動自如的方式連結於一對引導軌道(未圖示),前述一對引導軌道在樑206的單側的側面且在上下方向上隔著間隔而在Y軸方向上延伸。A pair of guided
Y軸進給機構178具有在樑206的單側的側面且在Y軸方向上延伸之滾珠螺桿214、與使滾珠螺桿214旋轉之馬達216。滾珠螺桿214已連結於Y軸可動構件208。Y軸進給機構178是藉由滾珠螺桿214將馬達216的旋轉運動轉換成直線運動並傳達至Y軸可動構件208,而將Y軸可動構件208沿著附設於樑206的單側的側面之引導軌道在Y軸方向上分度進給。The Y-
在Y軸可動構件208的另一側的側面(在圖11中為背面側的側面)形成有在Y軸方向上隔著間隔而在Z軸方向上延伸之一對引導軌道(未圖示),Z軸可動構件210具有滑動自如地連結於Y軸可動構件208的一對引導軌道之一對被引導溝(未圖示)。A pair of guide rails (not shown) extending in the Z-axis direction at intervals in the Y-axis direction is formed on the other side of the Y-axis movable member 208 (the rear side in FIG. 11 ). The Z-axis
Z軸進給機構180具有連結於Z軸可動構件210且在Z軸方向上延伸之滾珠螺桿(未圖示)、與使此滾珠螺桿旋轉之馬達218。Z軸進給機構180是藉由滾珠螺桿將馬達218的旋轉運動轉換成直線運動並傳達至Z軸可動構件210,而將Z軸可動構件210沿著Y軸可動構件208的引導軌道朝Z軸方向切入進給。The Z-
參照圖12來說明,在主軸殼體212中以Y軸方向作為軸心而旋轉自如地支撐有圓柱狀的主軸220,並且容置有使主軸220旋轉之馬達(未圖示)。在主軸220的前端,藉由固定螺帽222而裝卸自如地固定有切削被加工物之切削刀片36。Referring to FIG. 12 , a cylindrical
主軸殼體212的前端裝設有覆蓋切削刀片36之刀片蓋224。刀片蓋224具有固定於主軸殼體212的前端之第一罩蓋構件224a、與移動自如地裝設在第一罩蓋構件224a的前端之第二罩蓋構件224b。第二罩蓋構件224b形成為可藉由氣缸等之合宜的致動器(未圖示)而在X軸方向上移動,且在切削刀片36的更換時是定位在圖12所示之開放位置,在切削加工時則是定位在圖11所示之封閉位置。The front end of the
如圖13所示,在主軸220的前端側外周面設置有朝徑方向外側突出之環狀的安裝座凸緣226。在安裝座凸緣226的前端面的徑方向內側部分形成有環狀的凹處226a,安裝座凸緣226的前端面的外周側部分是成為朝軸方向突出之環狀的承受部226b。又,在主軸220之比安裝座凸緣226更前端側的外周面形成有公螺絲228。As shown in FIG. 13 , an annular mounting
並且,藉由將切削刀片36的中央開口部38a嵌合於主軸220的前端部,且螺接(緊固)主軸220的公螺絲228與固定螺帽222,切削刀片36會被安裝座凸緣226的承受部226b與固定螺帽222夾入而呈裝卸自如地固定在主軸220的前端。又,在固定螺帽222的側面,在圓周方向上隔著等間隔而形成有複數個銷孔222a,前述銷孔222a可供搬出入機構6的固定螺帽保持部50的銷72***。And, by fitting the
如圖9所示,在框架202的樑206的另一側的側面(在圖9中為近前側的側面)以在Y軸方向上移動自如的方式裝設有對已保持在工作夾台172之被加工物進行拍攝之一對拍攝機構230,並且裝設有使拍攝機構230在Y軸方向上移動一對移動機構232。移動機構232具有在樑206的另一側的側面且在Y軸方向上延伸之滾珠螺桿234、與使滾珠螺桿234旋轉之馬達236。滾珠螺桿234已連結於拍攝機構230。並且,移動機構232是將馬達236的旋轉運動轉換成直線運動並傳達至拍攝機構230,使拍攝機構230沿著附設於樑206的另一側的側面之引導軌道206a在Y軸方向上移動。再者,拍攝機構230亦可為1個。As shown in FIG. 9 , on the side surface on the other side of the
在使用切削裝置170來對晶圓等之被加工物施行切削加工時,首先是使工作夾台172吸附被加工物。接著,以X軸進給機構176使工作夾台172移動至拍攝機構230的下方,並且以移動機構232調整拍攝機構230的Y軸方向位置。接著,以拍攝機構230從上方拍攝被加工物來檢測被加工物的切削區域。When cutting a workpiece such as a wafer using the
接著,依據以拍攝機構230所檢測出之被加工物的切削區域,使工作夾台172旋轉,來調整被加工物的切削區域相對於切削機構174的切削刀片36之方向。接著,以X軸進給機構176使工作夾台172在X軸方向上移動,並且以Y軸進給機構178使主軸殼體212在Y軸方向上移動,而將一對切削刀片36定位到被加工物的切削區域的上方。Then, according to the cutting area of the workpiece detected by the
接著,以Z軸進給機構180使主軸殼體212下降,使已高速旋轉之切削刀片36的切刃40切入被加工物的切削區域,並且一邊對已切入切削刀片36的切刃40之部分供給切削水一邊將工作夾台172在X軸方向上加工進給,藉此對被加工物的切削區域施行預定的切削加工。又,一邊以Y軸進給機構178將主軸殼體212在Y軸方向上分度進給,一邊合宜地重複上述切削加工,而對被加工物的整個切削區域施行切削加工。已結束切削步驟之切削加工完畢之被加工物會被搬送至下一個步驟。Then, the
因為若重複實施切削步驟,切削刀片36會磨耗,且若切削刀片36的磨耗到達預定量時會變得無法維持切削精度,所以必須將已裝設於主軸220之切削刀片36更換為新的切削刀片36。又,即便在已裝設於主軸220之切削刀片36的磨耗尚未到達預定量的情況下,在對與之前施行切削加工之被加工物的素材不同的素材之被加工物施行切削加工時,也必須更換為和被加工物的素材相應之切削刀片36。Because if the cutting step is repeatedly implemented, the
在本實施形態中,是如圖14所示,已將可以自動地更換切削裝置170的切削刀片36之輔助裝置2連結於切削裝置170,以下針對使用輔助裝置2來更換切削刀片36之方法進行說明。In this embodiment, as shown in FIG. 14, the
如圖14所示,輔助裝置2是配置在切削裝置170的X軸方向後側,且形成為可以在之後裝設到已經交貨給使用者之切削裝置170。使用輔助裝置2來更換已裝設在切削裝置170之切削刀片36時,首先是使切削刀片保管機構4的無端軌道22旋轉,並將支撐有用來搬入切削裝置170之新的切削刀片36之支撐軸24定位在預定位置(例如支撐軸24的軌道中的最下端的位置)。As shown in FIG. 14 , the
接著,如圖15所示,藉由已連結於搬出入機構6的Z旋轉軸46之馬達使罩殼52旋轉,藉此使裝設有刀片保持部48之罩殼52的側壁56沿著X軸方向,而使刀片保持部48面對切削刀片保管機構4。又,作動X軸移動機構12以及Z軸移動機構10,以將刀片保持部48的X軸方向位置以及Z軸方向位置調整成可以將上述預定位置的支撐軸24的軸部34***刀片保持部48的中央開口部60(參照圖5)。Next, as shown in FIG. 15 , the
接著,如圖16所示,藉由Y軸方向定位機構8使框體74在Y軸方向上移動,並將搬出入機構6定位到可藉由刀片保持部48來保持已支撐於支撐軸24之切削刀片36的作用位置。藉此,將上述預定位置的支撐軸24的軸部34***刀片保持部48的中央開口部60,並且使刀片保持部48的端面58接觸位於軸部34的前端側之切削刀片36的端面。接著,在刀片保持部48的各吸引孔62生成吸引力,而以刀片保持部48吸引保持位於軸部34的前端側之切削刀片36。Next, as shown in FIG. 16 , the
以刀片保持部48吸引保持切削刀片36後,藉由使Y軸方向定位機構8作動,使搬出入機構6從切削刀片保管機構4朝Y軸方向遠離,並將切削刀片36從軸部34拔出。接著,從空氣噴嘴142透過無端軌道22的流路22a來對支撐軸24的基部32的流路32a供給空氣。藉此,可以將空氣噴附於已支撐於支撐軸24之其餘的切削刀片36的背部,讓留在支撐軸24之切削刀片36朝支撐軸24的前端移動。After the
使留在軸部34之切削刀片36朝支撐軸24的前端移動後,使切削刀片保管機構4的無端軌道22旋轉,而從以刀片保持部48所吸引保持之切削刀片36與空氣噴嘴142的前端之間移動支撐軸24。接著,從空氣噴嘴142朝向已被刀片保持部48吸引保持之切削刀片36的背面噴附空氣(參照圖8)。藉此,可以洗淨切削刀片36的背面。又,在對切削刀片36噴附空氣時,是藉由使X軸移動機構12以及Z軸移動機構10作動,而對切削刀片36的背面整體噴附空氣。After the
在洗淨切削刀片36後,使Y軸方向定位機構8作動,而使搬出入機構6在Y軸方向上從切削刀片保管機構4遠離。接著,使搬出入機構6的罩殼52旋轉180°,並使吸引保持有切削刀片36之刀片保持部48的相反側的刀片保持部48面對切削刀片保管機構4。又,使切削刀片保管機構4的無端軌道22旋轉,將支撐有用來搬入切削裝置170之新的切削刀片36的支撐軸24定位到刀片保持部48的正面。After the
接著,使Y軸方向定位機構8作動,而將搬出入機構6定位到可藉由相反側的刀片保持部48保持支撐軸24的切削刀片36之作用位置。接著,在相反側的刀片保持部48的各吸引孔62生成吸引力,而藉由刀片保持部48來吸引保持位於軸部34的前端側之切削刀片36。藉此,成為以4個刀片保持部48當中相向的一對刀片保持部48吸引保持有新的切削刀片36之狀態。並且,與上述同樣地,對留在支撐軸24之切削刀片36的背部噴附空氣,使切削刀片36朝支撐軸24的前端移動,並且從空氣噴嘴142對以相反側的刀片保持部48所吸引保持之切削刀片36噴附空氣,來洗淨切削刀片36的背面。Next, the Y-axis
接著,如圖17所示,藉由Y軸方向定位機構8使框體74在Y軸方向上移動,並且以Z軸移動機構10使升降工作台76在Z軸方向上移動。藉此,使搬出入機構6從切削刀片保管機構4遠離而定位到退避位置,並且調整搬出入機構6相對於切削裝置170之Y軸方向位置以及Z軸方向位置。位置調整後之搬出入機構6的Y軸方向位置是在切削裝置170的一對切削機構174之間,且位置調整後之搬出入機構6的Z軸方向位置在比工作夾台172的保持面更上方。Next, as shown in FIG. 17 , the
接著,如圖18所示,藉由作為第一X軸移動機構之氣缸130使第一移動體112在X軸方向上移動,並使搬出入機構6朝向切削裝置170的一對切削機構174之間前進。接著,如圖19所示,藉由第二X軸移動機構136使第二移動體114在X軸方向上移動,並調整搬出入機構6相對於一對切削機構174之X軸方向位置。Next, as shown in FIG. 18, the first moving
具體而言,是使以搬出入機構6的一對刀片保持部48所吸引保持之新的一對切削刀片36的中心的X軸方向位置、與裝設於一對切削機構174之一對切削刀片36的中心的X軸方向位置對齊。又,使輔助裝置2的Z軸移動機構10或切削裝置170的Z軸進給機構180作動,來讓刀片保持部48的切削刀片36的中心的Z軸方向位置、與切削機構174的切削刀片36的中心的Z軸方向位置對齊。Specifically, the X-axis direction position of the center of the new pair of cutting
接著,使搬出入機構6的罩殼52旋轉60°,使一對固定螺帽保持部50面對一對切削機構174的切削刀片36。再者,亦可在使第一、第二移動體112、114前進之前,使罩殼52旋轉60°。Next, the
接著,將一對切削機構174的每一個刀片蓋224的第二罩蓋構件224b定位到開放位置(參照圖12)。接著,藉由切削裝置170的Y軸進給機構178使切削機構174在Y軸方向上移動,使已將切削刀片36固定於主軸220之固定螺帽222接觸於固定螺帽保持部50的旋轉體66的端面66a。如此一來,固定螺帽保持部50的銷72會被固定螺帽222按壓而容置到旋轉體66的內部,且主軸220的前端會容置於旋轉體66的中央開口部68。Next, the
接著,當以固定螺帽保持部50的馬達使旋轉體66旋轉後,在各銷72和固定螺帽222的銷孔222a一致時,各銷72會嵌合於銷孔222a,且旋轉體66的旋轉運動會透過各銷72傳達至固定螺帽222,使固定螺帽222鬆開。藉此,可以從切削機構174的主軸220的公螺絲228將固定螺帽222螺鬆(取下)。又,在固定螺帽保持部50的各吸引孔70生成吸引力,而以固定螺帽保持部50吸引保持已取下之固定螺帽222。Next, when the
接著,藉由Y軸進給機構178使切削機構174從搬出入機構6遠離,並且使搬出入機構6的罩殼52旋轉60°,使未吸引保持有切削刀片36之空的刀片保持部48面對切削機構174的切削刀片36。Then, the
接著,藉由Y軸進給機構178使切削機構174接近於搬出入機構6,來將切削機構174的主軸220***刀片保持部48的中央開口部60,並且使空的刀片保持部48的端面58接觸於切削機構174的切削刀片36的端面。接著,在刀片保持部48的各吸引孔62生成吸引力,而以刀片保持部48吸引保持切削機構174的切削刀片36。Then, the
接著,藉由Y軸進給機構178使切削機構174從搬出入機構6遠離,並且使搬出入機構6的罩殼52旋轉60°,而使吸引保持有新的切削刀片36之刀片保持部48面對切削機構174的主軸220。Next, the
接著,藉由Y軸進給機構178使切削機構174接近於搬出入機構6,來將主軸220***到新的切削刀片36的中央開口部38a,且使切削刀片36的端面接觸於主軸220的安裝座凸緣226的承受部226b。接著,解除刀片保持部48的吸引力,將新的切削刀片36從刀片保持部48交接至主軸220。Next, the
接著,藉由Y軸進給機構178使切削機構174從搬出入機構6遠離,並且使搬出入機構6的罩殼52旋轉60°,使吸引保持有已取下之固定螺帽222的固定螺帽保持部50面對切削機構174的主軸220。Then, the
接著,藉由Y軸進給機構178使切削機構174接近於搬出入機構6,來使以固定螺帽保持部50所吸引保持之固定螺帽222嵌合於主軸220的前端部。接著,使固定螺帽保持部50的馬達朝和取下固定螺帽222時為相反之方向作動來讓固定螺帽222旋轉,而將固定螺帽222螺接(緊固)於主軸220的公螺絲228。藉此,可以將用來裝設於切削機構174之新的切削刀片36以主軸220的安裝座凸緣226的承受部226b與固定螺帽222來夾入而固定於主軸220。Next, the
接著,在解除固定螺帽保持部50的吸引力後,將切削機構174的刀片蓋224的第二罩蓋構件224b定位到封閉位置。再者,關於如上述之固定螺帽222以及切削刀片36的取下、安裝,可對一對切削機構174同時進行,亦可個別地進行。Next, the
接著,使第一、第二移動體112、114後退,並且使搬出入機構6的罩殼52旋轉60°,來讓已取下之一對切削刀片36的其中一個與洗淨機構13的空氣噴嘴142面對。此時,使切削刀片保管機構4的無端軌道22預先旋轉,以免支撐軸24位於已取下的切削刀片36的其中一個與空氣噴嘴142的前端之間。然後,一邊使X軸移動機構12以及Z軸移動機構10作動,一邊從空氣噴嘴142朝向已取下之切削刀片36的其中一個的背面整體噴附空氣,來洗淨其中一個切削刀片36的背面。Then, the first and second
接著,使切削刀片保管機構4的無端軌道22旋轉,而將未支撐有切削刀片36之空的支撐軸24定位到預定位置(例如支撐軸24在軌道中的最下端的位置)。接著,作動X軸移動機構12以及Z軸移動機構10,將刀片保持部48的X軸方向位置以及Z軸方向位置調整成可以將上述預定位置的支撐軸24的軸部34***以刀片保持部48所吸引保持之其中一個切削刀片36的中央開口部38a。Next, the
接著,藉由Y軸方向定位機構8使框體74在Y軸方向上移動,而將上述預定位置的支撐軸24的軸部34***以刀片保持部48所吸引保持之其中一個切削刀片36的中央開口部38a,並且使其中一個切削刀片36的端面接觸於支撐軸24的基部32的端面。接著,解除刀片保持部48的吸引力,將所取下之一對切削刀片36的其中一個交接到支撐軸24。Next, the
又,藉由Y軸方向定位機構8使搬出入機構6從切削刀片保管機構4遠離,並且使搬出入機構6的罩殼52旋轉180°,使吸引保持已取下之一對切削刀片36的另一個之相反側的刀片保持部48面對切削刀片保管機構4。Also, the carrying-in/out
接著,使切削刀片保管機構4的無端軌道22旋轉,以免支撐軸24位於已取下之切削刀片36的另一個與空氣噴嘴142的前端之間。然後,一邊使X軸移動機構12以及Z軸移動機構10作動,一邊從空氣噴嘴142朝向已取下之切削刀片36的另一個的背面整體噴附空氣,來洗淨另一個切削刀片36的背面。Then, the
接著,使切削刀片保管機構4的無端軌道22旋轉,而將可支撐切削刀片36(有支撐之餘地)的支撐軸24定位到預定位置。接著,藉由Y軸方向定位機構8使框體74在Y軸方向上移動,且將上述預定位置之支撐軸24的軸部34***以相反側的刀片保持部48所吸引保持之另一個切削刀片36的中央開口部38a,並且使另一個切削刀片36的端面接觸於被支撐軸24所支撐之切削刀片36的端面。接著,解除刀片保持部48的吸引力,將所取下之一對切削刀片36的另一個交接到支撐軸24。Next, the
如以上所述,在本實施形態的輔助裝置2中形成為可以在之後裝設到已經交貨給使用者之切削裝置170,而對已裝設在切削裝置170的切削機構174之切削刀片36進行更換。As mentioned above, in the
此外,在本實施形態的輔助裝置2中,可以藉由從洗淨機構13的空氣噴嘴142對已保管在切削刀片保管機構4之更換用的新的切削刀片36、或從切削裝置170取下之切削刀片36噴附空氣,來洗淨切削刀片36的背面,並將切削屑等異物從切削刀片36去除。從而,在已將切削刀片36裝設於切削裝置170時,不會有在切削刀片36與安裝座凸緣226之間夾入異物之情形,而可將切削刀片36定位在適當的位置,並且防止切削刀片36以及安裝座凸緣226的偏磨耗。In addition, in the
2:輔助裝置 4:切削刀片保管機構 6:搬出入機構 8:Y軸方向定位機構 10:Z軸移動機構 12:X軸移動機構 13:洗淨機構 14,18:旋轉軸 16:驅動齒輪 20:從動齒輪 22:無端軌道 22a,32a:流路 24:支撐軸 26,100:基座板 28:支撐壁 30,96,108,140,200,216,218,236:馬達 32:基部 34:軸部 36:切削刀片 38,182:基台 38a,60,68:中央開口部 40:切刃 42:定位珠 46:Z旋轉軸 48:刀片保持部 50:固定螺帽保持部 52:罩殼 54,88:頂板 56:側壁 58,66a:端面 60:中央開口部 62,70:吸引孔 64:殼體 66:旋轉體 72:銷 74:框體 76:升降工作台 78:基座架台 80:底部(框體) 82,186,204:支柱 84:頂板部(框體) 86,124,132:被導引構件 86a,124a,132a:溝 90:腳部 92:導軌(升降工作台) 94,106,138,198,214,234:滾珠螺桿 98,202:框架 102,122:圓形孔 104,134a:母螺絲 110:連結板 112:第一移動體 114:第二移動體 116:第一導軌 118:第二導軌 120,128:本體 126,134:塊體 126a:貫通孔 130:氣缸 130a:壓缸管 130b:活塞桿 136:第二X軸移動機構 142:空氣噴嘴 170:切削裝置 172:工作夾台 174:切削機構 176:X軸進給機構 178:Y軸進給機構 180:Z軸進給機構 182a,206a:引導軌道 184:X軸可動板 188:罩板 188a:圓形開口 190:吸附夾頭 192:夾具 206:樑 208:Y軸可動構件 208a:被引導溝 210:Z軸可動構件 212:主軸殼體 220:主軸 222:固定螺帽 222a:銷孔 224:刀片蓋 224a:第一罩蓋構件 224b:第二罩蓋構件 226:安裝座凸緣 226a:凹處 226b:承受部 228:公螺絲 230:拍攝機構 232:移動機構 X,Y,Z:箭頭(方向) 2: Auxiliary device 4: Cutting blade storage mechanism 6: Moving in and out of institutions 8: Y-axis direction positioning mechanism 10: Z-axis moving mechanism 12: X-axis moving mechanism 13: Cleaning mechanism 14,18: axis of rotation 16: Drive gear 20: driven gear 22: Endless track 22a, 32a: flow path 24: Support shaft 26,100: base plate 28: support wall 30,96,108,140,200,216,218,236: Motor 32: base 34: Shaft 36: Cutting blade 38,182: abutments 38a, 60, 68: central opening 40: cutting edge 42: positioning beads 46:Z rotation axis 48:Blade holder 50: fixed nut holding part 52: Shell 54,88: top plate 56: side wall 58,66a: end face 60: central opening 62,70: suction holes 64: Shell 66: rotating body 72: pin 74: frame 76: Lifting workbench 78: Base stand 80: Bottom (frame) 82, 186, 204: pillars 84: Top plate (frame) 86,124,132: Guided components 86a, 124a, 132a: ditch 90: feet 92: guide rail (elevating table) 94, 106, 138, 198, 214, 234: ball screw 98,202: frame 102,122: circular hole 104, 134a: female screw 110: connecting plate 112: The first moving body 114: Second mobile body 116: The first guide rail 118: Second guide rail 120,128: Ontology 126,134: blocks 126a: through hole 130: Cylinder 130a: Cylinder tube 130b: piston rod 136: Second X-axis moving mechanism 142: Air nozzle 170: cutting device 172: Work clamp table 174: cutting mechanism 176: X-axis feed mechanism 178: Y-axis feed mechanism 180: Z-axis feed mechanism 182a, 206a: guide track 184: X-axis movable plate 188: cover plate 188a: round opening 190: adsorption chuck 192: Fixture 206: Beam 208: Y-axis movable member 208a: Guided ditch 210: Z-axis movable member 212: Spindle housing 220: spindle 222: fixed nut 222a: pin hole 224: blade cover 224a: first cover member 224b: second cover member 226: Mounting flange 226a: Recess 226b: receiving part 228: male screw 230: Shooting Agency 232: Mobile Mechanism X,Y,Z: Arrow (direction)
圖1是本發明實施形態之輔助裝置的立體圖。 圖2是圖1所示之切削刀片保管機構的分解立體圖。 圖3是圖2所示之支撐軸以及從正面側所觀看到之切削刀片的立體圖。 圖4是圖2所示之支撐軸的剖面圖。 圖5是圖1所示之搬出入機構的立體圖。 圖6是圖1所示之框體、升降工作台以及基座架台的分解立體圖。 圖7是圖1所示之框體的分解立體圖。 圖8是顯示正在藉由圖1所示之洗淨機構洗淨切削刀片之狀態的立體圖。 圖9是可連結圖1所示之輔助裝置的切削裝置的立體圖。 圖10是圖9所示之工作夾台的立體圖。 圖11是圖9所示之切削機構的立體圖。 圖12是圖11所示之刀片蓋已開放之狀態下的切削機構的立體圖。 圖13是圖9所示之切削機構的分解立體圖。 圖14是顯示圖1所示之輔助裝置已連結於圖9所示之切削裝置之狀態的立體圖。 圖15是顯示圖1所示之輔助裝置的切削刀片保管機構與搬出入機構已相面對之狀態的立體圖。 圖16是顯示框體從圖15所示之狀態朝向切削刀片保管機構前進後之狀態的立體圖。 圖17是顯示框體從圖16所示之狀態後退,並且升降工作台上升後之狀態的立體圖。 圖18是顯示第一移動體從圖17所示之狀態朝向切削裝置前進後之狀態的立體圖。 圖19是顯示第二移動體從圖18所示之狀態朝向切削裝置前進後之狀態的立體圖。 Fig. 1 is a perspective view of an auxiliary device according to an embodiment of the present invention. Fig. 2 is an exploded perspective view of the cutting blade storage mechanism shown in Fig. 1 . Fig. 3 is a perspective view of the support shaft shown in Fig. 2 and the cutting insert viewed from the front side. Fig. 4 is a sectional view of the supporting shaft shown in Fig. 2 . Fig. 5 is a perspective view of the carry-in mechanism shown in Fig. 1 . Fig. 6 is an exploded perspective view of the frame, the lifting table and the base stand shown in Fig. 1 . Fig. 7 is an exploded perspective view of the frame shown in Fig. 1 . Fig. 8 is a perspective view showing a state in which the cutting insert is being cleaned by the cleaning mechanism shown in Fig. 1 . Fig. 9 is a perspective view of a cutting device that can be connected with the auxiliary device shown in Fig. 1 . Fig. 10 is a perspective view of the work clamp shown in Fig. 9 . Fig. 11 is a perspective view of the cutting mechanism shown in Fig. 9 . Fig. 12 is a perspective view of the cutting mechanism in the state where the blade cover shown in Fig. 11 is opened. Fig. 13 is an exploded perspective view of the cutting mechanism shown in Fig. 9 . Fig. 14 is a perspective view showing a state where the auxiliary device shown in Fig. 1 is connected to the cutting device shown in Fig. 9 . Fig. 15 is a perspective view showing a state in which the cutting blade storage mechanism and the carrying-in/out mechanism of the auxiliary device shown in Fig. 1 face each other. Fig. 16 is a perspective view showing a state in which the housing has advanced from the state shown in Fig. 15 toward the cutting blade storage mechanism. Fig. 17 is a perspective view showing a state in which the frame body retreats from the state shown in Fig. 16 and the elevating table rises. Fig. 18 is a perspective view showing a state in which the first moving body advances toward the cutting device from the state shown in Fig. 17 . Fig. 19 is a perspective view showing a state in which the second moving body advances toward the cutting device from the state shown in Fig. 18 .
2:輔助裝置 2: Auxiliary device
4:切削刀片保管機構 4: Cutting blade storage mechanism
6:搬出入機構 6: Moving in and out of institutions
8:Y軸方向定位機構 8: Y-axis direction positioning mechanism
10:Z軸移動機構 10: Z-axis moving mechanism
12:X軸移動機構 12: X-axis moving mechanism
13:洗淨機構 13: Cleaning mechanism
16:驅動齒輪 16: Drive gear
18:旋轉軸 18: Rotation axis
20:從動齒輪 20: driven gear
22:無端軌道 22: Endless track
24:支撐軸 24: Support shaft
26,100:基座板 26,100: base plate
28:支撐壁 28: support wall
30,96:馬達 30,96: motor
36:切削刀片 36: Cutting blade
74:框體 74: frame
76:升降工作台 76: Lifting workbench
78:基座架台 78: Base stand
80:底部(框體) 80: Bottom (frame)
82:支柱 82: Pillar
84:頂板部(框體) 84: Top plate (frame)
86:被導引構件 86: Guided component
88:頂板 88: top plate
90:腳部 90: feet
92:導軌(升降工作台) 92: guide rail (lifting table)
98:框架 98: frame
102:圓形孔 102: round hole
112:第一移動體 112: The first moving body
114:第二移動體 114: Second moving body
142:空氣噴嘴 142: Air nozzle
X,Y,Z:方向 X, Y, Z: direction
Claims (6)
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JP2021-085999 | 2021-05-21 | ||
JP2021085999A JP2022178891A (en) | 2021-05-21 | 2021-05-21 | Auxiliary device |
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TW202245982A true TW202245982A (en) | 2022-12-01 |
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TW111117661A TW202245982A (en) | 2021-05-21 | 2022-05-11 | Auxiliary device capable of automatically replacing cutting blades |
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2022
- 2022-05-11 TW TW111117661A patent/TW202245982A/en unknown
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