CN115954278A - Full-automatic chip cap planting equipment - Google Patents
Full-automatic chip cap planting equipment Download PDFInfo
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- CN115954278A CN115954278A CN202310244566.8A CN202310244566A CN115954278A CN 115954278 A CN115954278 A CN 115954278A CN 202310244566 A CN202310244566 A CN 202310244566A CN 115954278 A CN115954278 A CN 115954278A
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- 230000007246 mechanism Effects 0.000 claims abstract description 147
- 239000003292 glue Substances 0.000 claims abstract description 31
- 230000033001 locomotion Effects 0.000 claims abstract description 25
- 238000003825 pressing Methods 0.000 claims abstract description 19
- 230000005540 biological transmission Effects 0.000 claims description 54
- 230000001681 protective effect Effects 0.000 claims description 28
- 230000000903 blocking effect Effects 0.000 claims description 14
- 230000003028 elevating effect Effects 0.000 claims description 11
- 238000001514 detection method Methods 0.000 claims description 8
- 238000001179 sorption measurement Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 4
- 238000007599 discharging Methods 0.000 abstract description 12
- 238000012546 transfer Methods 0.000 description 8
- 238000005303 weighing Methods 0.000 description 8
- 239000000969 carrier Substances 0.000 description 7
- 230000036961 partial effect Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
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- 239000002184 metal Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 230000002829 reductive effect Effects 0.000 description 1
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- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P60/00—Technologies relating to agriculture, livestock or agroalimentary industries
- Y02P60/20—Reduction of greenhouse gas [GHG] emissions in agriculture, e.g. CO2
- Y02P60/21—Dinitrogen oxide [N2O], e.g. using aquaponics, hydroponics or efficiency measures
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Transplanting Machines (AREA)
- Catching Or Destruction (AREA)
Abstract
The invention discloses full-automatic chip cap planting equipment which comprises a feeding mechanism, a dispensing mechanism, a cap planting mechanism, a pressing mechanism and a discharging mechanism which are sequentially arranged. The glue dispensing mechanism comprises a first support and two glue dispensing modules, wherein in each glue dispensing module, a first movable frame can be connected with the first support in a relative motion mode along a first direction, a glue dispensing frame can be connected with the first movable frame in a relative motion mode along a second direction, and a glue dispensing head can be connected with the glue dispensing frame in a relative motion mode along an up-down direction. The cover planting mechanism comprises a second support and two cover planting modules, wherein in each cover planting module, the second movable frame can be connected with the second support in a relative motion mode along a first direction, the cover planting frame can be connected with the second movable frame in a relative motion mode along a second direction, and the cover planting head can be connected with the cover planting frame in a relative motion mode along an up-down direction. The casing is equipped with at least one computer respectively along the both sides of first direction, and the computer of every side all can control the some glue module of both sides and/or the cover module of planting of both sides.
Description
Technical Field
The invention relates to the technical field of electronic product processing, in particular to full-automatic chip cap implanting equipment.
Background
In the production process of semiconductor devices such as chips, the chips themselves are very susceptible to breakage, and therefore, the chips are generally required to be protected by sealing the chips in a material having a certain strength. The common chip can be protected by sealing plastic on the outer part of the chip; for some chips with strong performance, a metal shell is required for protection, and the metal shell can play a role in heat dissipation at the same time. The equipment for placing and fixing the metal protective covers on the chips is called chip cover planting equipment, in the prior art, a plurality of chips are placed on carriers such as a substrate, after the carriers are loaded in the chip cover planting equipment, the chip cover planting equipment firstly carries out integral preheating on the chips, secondly coats heat dissipation glue on the back surfaces of the chips, thirdly places the protective covers on the chips, fourthly carries out hot pressing on the protective covers, and finally carries out blanking on the carriers and the chips. In the above main steps, each step needs an independent device, so that at least five devices for feeding, dispensing, cover planting, pressing, blanking and the like are required to be connected to form an automatic production line of the whole chip cover planting process. In the existing chip cap planting equipment, dispensing and cap planting are two stations which take more time, and the working efficiency of the two stations must be improved for improving the overall productivity of the equipment.
The utility model discloses a cover equipment is planted to full-automatic chip in chinese utility model patent CN218482208U adopts a plurality of adhesive deposite heads to glue simultaneously, adopts a plurality of capping heads of planting to plant the lid simultaneously, has improved production efficiency to a certain extent. However, in the apparatus, the dispensing heads or the capping heads can only dispense or cap the chips on one substrate at the same time, and the substrates still need to be transported one by one, so the improvement of efficiency still remains.
Disclosure of Invention
The invention aims to provide full-automatic chip cap planting equipment with higher productivity aiming at the defects in the prior art.
In order to achieve the purpose, the invention adopts the technical scheme that:
a full-automatic chip cover planting device is used for placing a plant protection cover on a chip, and comprises a shell, a feeding mechanism, a dispensing mechanism, a cover planting mechanism, a pressing mechanism and a discharging mechanism, wherein the feeding mechanism, the dispensing mechanism, the cover planting mechanism, the pressing mechanism and the discharging mechanism are sequentially arranged in the shell along the transmission direction of the chip; the cover planting mechanism comprises a second support and two cover planting modules, the two cover planting modules are arranged at intervals along the first direction, each cover planting module comprises a second movable frame, a cover planting frame and a cover planting head, in each cover planting module, the second movable frame can be connected with the second support in a relative motion mode along the first direction, the cover planting frame can be connected with the second movable frame in a relative motion mode along the second direction, and the cover planting heads can be connected with the cover planting frame in a relative motion mode along the up-down direction; the chip cap planting equipment further comprises a control system, the control system comprises a computer, at least one computer is arranged on each of two sides of the shell in the first direction, the computers on each side can control the dispensing modules on two sides, and/or the computers on each side can control the cap planting modules on two sides.
In some embodiments, a first computer, a second computer and a third computer are disposed on each side of the housing in the first direction, wherein the first computer on each side can control the feeding mechanism and the dispensing mechanism, and the first computer on each side can control the dispensing modules on both sides; the second computer on each side can control the cap planting mechanism, and the second computer on each side can control the cap planting modules on two sides; the third computer on each side can control the pressing mechanism and the blanking mechanism.
In some embodiments, each dispensing module comprises a dispensing conveying track, the dispensing conveying track is used for conveying the chip along the second direction, and the dispensing conveying track is arranged below the dispensing head; every plant and cover the module and all including planting the lid transmission track, plant the lid transmission track and be used for following the second direction transmission the chip, plant the lid transmission track and locate plant the below of capping head.
In some embodiments, the dispensing mechanism and the cap planting mechanism are connected along the second direction, two sets of dispensing conveying rails and two sets of cap planting conveying rails are connected in a one-to-one correspondence manner, and the corresponding dispensing conveying rails and the transmission directions of the cap planting conveying rails extend in a collinear manner.
In some embodiments, in the dispensing mechanism, the first brackets have two spaced apart first legs and two spaced apart first beams, each first bracket includes at least three spaced apart first legs and at least three spaced apart first beams, the first beams extend along the first direction, the three first legs are supported on a same horizontal plane, the three first legs are supported under the first beams in common, two ends of each first moving frame in the second direction are slidably connected to the first beams on the same side, and each group of dispensing conveying rails sequentially passes through between two first legs of each first bracket; in the cap planting mechanism, the second support has two that set up along the second direction interval, every the second support all includes along second landing leg and second crossbeam, the second landing leg has at least three that set up along the first direction interval, the second crossbeam extends along the first direction, three the second landing leg supports on same horizontal plane, three the second landing leg supports jointly in the below of second crossbeam, every the second of second moving frame is to the both ends of second direction respectively with the second crossbeam sliding connection of homonymy, every group plant the cap transmission track and pass in proper order from every the second support wherein two between the second landing leg.
In some embodiments, the chip cap planting apparatus further includes a conveying track for conveying the chip, each dispensing module and each cap planting module includes a set of conveying tracks, each set of conveying tracks includes a first side rail and a second side rail, the first side rail and the second side rail respectively extend along the second direction, the first side rail and the second side rail are arranged at intervals along the first direction, the first side rail is capable of being relatively movably arranged along the first direction, and each set of conveying tracks further includes a spacing adjustment mechanism for driving the first side rail to relatively move along the first direction.
In some embodiments, each set of the conveying tracks includes a side pushing member and a blocking member, the side pushing member is connected with the first side rail in a manner of relative movement along the first direction, the blocking member is connected with the second side rail in a manner of relative movement along the up-down direction, the blocking member is located between the first side rail and the second side rail along the first direction, the side pushing member has a pushing position and an avoiding position, and when the side pushing member is located at the pushing position, at least a part of the side pushing member is located between the first side rail and the second side rail along the first direction; when the side pushing piece is located at the avoiding position, the side pushing piece is withdrawn from between the first side rail and the second side rail along the first direction.
In some embodiments, the chip is transported in a carrier having a through hole over which the chip can be supported; every group the transmission orbit first side rail with all be equipped with the elevating platform between the second side rail, the elevating platform can set up along upper and lower direction relative motion ground, the top of elevating platform has the boss, the boss can be followed the upper and lower direction and passed the perforation motion, the upper surface of boss is located the horizontal plane, the boss has the vacuum adsorption structure.
In some embodiments, the cap planting mechanism includes a cap planting workbench, the cap planting modules are disposed on the cap planting workbench, each cap planting module includes a height detection assembly, the height detection assembly includes a first sensor and a second sensor, the first sensor is fixedly connected to the cap planting workbench, and the first sensor is configured to detect a height difference H1 between the protective cap adsorbed by the cap planting head and the first sensor upward; the second sensor is fixedly connected with the plant cover frame and used for detecting the height difference H2 between the chip and the second sensor downwards, the control system calculates the height difference H3 between the protective cover and the chip according to the H1 and the H2 and adjusts the height of the plant cover head according to the H3.
In some embodiments, the dispensing mechanism has two sequentially arranged dispensing mechanisms along the conveying direction of the chip.
In some embodiments, the implanting cover mechanism has two stages arranged in sequence along the conveying direction of the chip.
Due to the application of the technical scheme, the full-automatic chip cap planting equipment provided by the invention is mainly improved in the dispensing mechanism and the cap planting mechanism, and the two mechanisms are in double-shaft structures: the two dispensing modules can independently operate, and the two dispensing heads can respectively dispense glue on chips at different positions; two plant the lid module and can independently operate, two plant the caping and can plant the lid to the chip of different positions respectively to the point is glued, is planted the work efficiency that covers and all obtained double promotion at least. And two glue dispensing modules and two cover implanting modules are compact in structure and optimized in arrangement, so that the occupied space of equipment cannot be remarkably increased.
In addition, the full-automatic chip cap planting equipment is matched with an automatic control system, computers which can be operated by workers are arranged on two sides of the shell, the two glue dispensing modules and the two cap planting modules can share one control system respectively, the glue dispensing modules and/or the cap planting modules on two sides can be controlled simultaneously only by arranging the workers on one side of the equipment, personnel requirements are saved, control programs are simplified, production and operation costs are effectively saved, and the equipment can be flexibly placed according to actual field conditions.
Furthermore, the full-automatic chip cap planting equipment is suitable for a double-track type transmission mode, one dispensing module and one cap planting module are correspondingly connected with one another, and chips transmitted in a group of transmission tracks are processed together; and two sets of transmission tracks that set up side by side can the synchronous transmission two sets of chips. The whole device is smoothly connected front and back, which is beneficial to the series connection of different mechanisms and further improves the working efficiency. Practice proves that the chip cap implanting equipment can remarkably improve the productivity of chip cap implanting from 650UPH to 1200UPH, and has great market application value.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings used in the description of the embodiments will be briefly described below.
FIG. 1 is a schematic perspective view of a chip cap implanting apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic top view of the chip capping apparatus according to the embodiment;
FIG. 3 is a schematic front view of the internal structure of the chip capping device in this embodiment;
fig. 4 is a partial perspective view of the carrier carrying the implanted chip in the present embodiment;
FIG. 5 is a partial perspective view of the carrier of this embodiment;
FIG. 6 is a partial perspective view of the dispensing mechanism of this embodiment;
fig. 7 is another partial perspective view of the dispensing mechanism of the present embodiment;
FIG. 8 is a partial perspective view of the cap implanting mechanism in the present embodiment;
FIG. 9 is another perspective view of a portion of the cap implanting mechanism of the present embodiment;
FIG. 10 is a perspective view of the plant cover frame and the plant cover head in the present embodiment;
FIG. 11 is a perspective view of the first bracket of the present embodiment;
fig. 12 is a perspective view of the first movable frame in the present embodiment;
FIG. 13 is a perspective view of a second bracket according to the present embodiment;
fig. 14 is a perspective view of a second movable frame in the present embodiment;
FIG. 15 is a perspective view of the transportation rail and the lifting platform in this embodiment;
FIG. 16 is a perspective view of the transfer rail of this embodiment;
FIG. 17 is a schematic perspective view of the lift table of the present embodiment;
wherein: 100. a feeding mechanism; 200. a glue dispensing mechanism; 300. a cover planting mechanism; 400. a pressing mechanism; 500 of a blanking mechanism; 600. a transfer track; 1. a carrier; 11. perforating; 12. a limiting member; 2. a chip; 3. a protective cover; x, a first direction; y, a second direction; z, up-down direction;
201. a dispensing workbench; 210. a first bracket; 211. a first wire track; 212. a first movable base; 213. a first leg; 214. a first cross member; 220. a dispensing module; 221. a first movable frame; 222. dispensing a glue frame; 223. dispensing a glue head; 224. dispensing moving seats; 230. a weighing balance;
301. planting a cover workbench; 310. a second bracket; 311. a second linear rail; 312. a second movable base; 313. a second leg; 314. a second cross member; 320. a cover planting module; 321. a second moving frame; 322. planting a cover frame; 323. planting a capping head; 324. a plant cover moving seat; 330. a protective cover feeding mechanism;
610. a first side rail; 620. a second side rail; 630. a spacing adjustment mechanism; 631. a connecting rod; 632. adjusting the track; 640. a side pushing piece; 641. a side push cylinder; 650. a blocking member; 660. a lifting platform; 661. a boss; 662. a vacuum adsorption structure; 663. a vacuum generator; 664. a lifting drive motor; 665. a lifting support;
700. a housing; 710. a feeding side; 720. discharging side;
810. a first computer; 820. a second computer; 830. a third computer;
910. a first sensor; 920. a second sensor.
Detailed Description
Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings so that the advantages and features of the present invention can be more readily understood by those skilled in the art.
Referring to fig. 1 to 5, the present embodiment provides a full-automatic chip cover-planting device, which is used to plant a protective cover 3 on a chip 2, wherein the protective cover 3 is made of a metal material, and can protect and dissipate heat from the high-precision chip 2. The chip cap planting equipment comprises a shell 700, a feeding mechanism 100, a dispensing mechanism 200, a cap planting mechanism 300, a pressing mechanism 400 and a discharging mechanism 500, wherein the feeding mechanism 100, the dispensing mechanism 200, the cap planting mechanism 300, the pressing mechanism 400 and the discharging mechanism 500 are sequentially arranged in the shell 700 along the transmission direction of a chip 2, and the chip 2 can sequentially pass through the mechanisms along the transmission direction. The feeding mechanism 100 is used for feeding the chips 2 to be planted with the covers, the dispensing mechanism 200 is used for dispensing the chips 2, the cover planting mechanism 300 is used for placing the protective covers 3 on the chips 2, the pressing mechanism 400 is used for pressing the protective covers 3 and the chips 2, and the discharging mechanism 500 is used for discharging the covered chips 2.
In this embodiment, the housing 700 is substantially a rectangular parallelepiped extending along the second horizontal direction Y, and the feeding mechanism 100, the dispensing mechanism 200, the cap planting mechanism 300, the pressing mechanism 400, and the discharging mechanism 500 are sequentially disposed along the second direction Y. Further, a horizontal direction perpendicular to the second direction Y is defined as a first direction X, and a direction perpendicular to a horizontal plane is defined as an up-down direction Z, so that an XYZ three-dimensional coordinate system can be constructed with the housing 700 as a reference, so as to describe a specific structure of the chip mounting apparatus. Two different sides of the housing 700 along the second direction Y are a feeding side 710 and a discharging side 720, respectively.
In this embodiment, the whole second direction Y transmission of following of chip 2, along the transmission direction of chip 2, the point gum machine constructs 200 and has two that set gradually, plants and covers mechanism 300 and have two that set gradually, according to actual need, two point gum machines construct 200 and can be used to scribble different kind of glue on chip 2 in proper order, and two plant cover mechanism 300 can plant the lid to the different chip 2 in front and back simultaneously to improve and plant and cover efficiency. In other embodiments, the specific number of the glue dispensing mechanisms 200 and the cap implanting mechanisms 300 may also be increased or decreased according to actual requirements, and is not limited to the case in this embodiment.
Referring to fig. 4 and 5, in the present embodiment, the chip 2 is substantially rectangular, and the chip 2 is stored in the carrier 1 and transported. The carrier 1 is in a flat disc shape, the carrier 1 has through holes 11, the through holes 11 are in a rectangular shape similar to the chip 2, and the length and width dimensions of the through holes 11 are slightly smaller than those of the chip 2, so that the chip 2 can be supported above the through holes 11 by the carrier 1, and the periphery of each through hole 11 is further provided with a plurality of limiting parts 12 for limiting each chip 2 above the corresponding through hole 11. In order to improve the transmission efficiency, each carrier 1 has a plurality of through holes 11 arranged at intervals, and the plurality of through holes 11 are preferably arranged in an array, for example, fig. 15 of the embodiment shows 2 × 4 through holes 11 arranged in an array, and one chip 2 can be placed above each through hole 11, so that the carrier 1 can transmit eight chips 2 at the same time. In other embodiments, the shape, number and arrangement of the through holes 11 on each carrier 1 are not limited to the above.
Referring to fig. 6 and 8, in the present embodiment, each dispensing mechanism 200 includes a first support 210 and two dispensing modules 220, the two dispensing modules 220 are disposed at intervals along the first direction X, and the two dispensing modules 220 can work independently. Similarly, each cap setting mechanism 300 includes a second frame 310 and two cap setting modules 320, the two cap setting modules 320 are disposed at intervals along the first direction X, and the two cap setting modules 320 can work independently. Referring to fig. 1 and 2, the chip cap planting apparatus further includes a control system, the control system includes a computer, at least one computer is respectively disposed on two sides of the housing 700 along the first direction X, the computer on each side can control the dispensing modules 220 on two sides of the same dispensing mechanism 200, and/or the computer on each side can control the cap planting modules 320 on two sides of the same cap planting mechanism 300.
In this embodiment, a first computer 810, a second computer 820, and a third computer 830 are respectively disposed on each side of the housing 700 in the first direction X, and the three computers on each side are sequentially disposed outside the housing 700 along the second direction Y, so that a worker can monitor the operation condition inside the chip capping device from the outside, and set or adjust the operation parameters. Specifically, the first computer 810 on each side can control the feeding mechanism 100 and the dispensing mechanism 200, and the first computer 810 on each side can control the dispensing modules 220 on both sides of each dispensing mechanism 200; the second computer 820 on each side can control the cap planting mechanism 300, and the second computer 820 on each side can control the cap planting modules 320 on both sides of each cap planting mechanism 300; the third computer 830 on each side can control the pressing mechanism 400 and the blanking mechanism 500. Therefore, each computer is clearly divided into work, all mechanisms in the chip cover planting device can be completely controlled by the three computers on any side, personnel configuration is effectively simplified, and the placement layout of the device is convenient.
Referring to fig. 6 and 7, in the present embodiment, each dispensing mechanism 200 includes a dispensing table 201, and the dispensing module 220 is disposed on the dispensing table 201. Each dispensing module 220 includes a first movable frame 221, a dispensing frame 222 and a dispensing head 223. In each dispensing module 220, the first movable frame 221 is connected to the first support 210 in a manner of relatively moving along the first direction X, the dispensing frame 222 is connected to the first movable frame 221 in a manner of relatively moving along the second direction Y, and the dispensing head 223 is connected to the dispensing frame 222 in a manner of relatively moving along the up-down direction Z. With further reference to fig. 11 and 12, in the present embodiment, the first brackets 210 have two spaced apart members arranged along the second direction Y, each of the first brackets 210 includes a first leg 213 and a first beam 214, the first leg 213 has at least three spaced apart members arranged along the first direction X, and the first beam 214 extends along the first direction X. The three first legs 213 are supported on the same horizontal plane, specifically, fixedly supported on the dispensing table 201, the three first legs 213 are supported below the first beam 214, and two ends of each first moving frame 221 in the second direction Y are slidably connected to the first beam 214 on the same side. In this embodiment, three first legs 213 of each first bracket 210 are disposed at equal intervals, each first beam 214 is fixedly provided with a first track 211 extending along the first direction X, and each first track 211 is slidably provided with two first movable bases 212, so that one end of each first movable base 221 can be connected to a corresponding first movable base 212, thereby realizing stable sliding of the first movable base 221 on the first tracks 211 at two sides. In this embodiment, each of the first movable frames 221 extends along the second direction Y, and is further provided with a dispensing movable seat 224 capable of relatively sliding along the second direction Y, and the dispensing frame 222 is fixedly connected to the dispensing movable seat 224, so as to realize the sliding of the dispensing frame 222 on the first movable frame 221. In this embodiment, the dispensing frames 222 of the two dispensing modules 220 are respectively disposed at two different sides of the first direction X, and the two dispensing modules 220 are symmetrically disposed along the first direction X, so that the two first movable frames 221 can be as close as possible along the first direction X, and the dispensing head 223 can move within a wider range. Thus, the two dispensing modules 220 can independently move in different areas on the dispensing worktable 201 to dispense chips 2 at different positions, and the two dispensing modules 220 do not affect each other. The dispensing efficiency is improved by at least double.
In addition, referring to fig. 6, in the present embodiment, each dispensing module 220 includes a weighing scale 230, and the weighing scale 230 is disposed outside the first bracket 210 along the first direction X and is used for weighing the mass of the glue solution sprayed by the dispensing head 223. Before this cover equipment is planted to chip moves at every turn, control system can control earlier that dispensing head 223 removes to the top that corresponds weighing balance 230, to weighing balance 230 blowout predetermine the glue solution of quality, detect whether this dispensing head 223's single play glue volume meets the requirement through weighing, if there is the deviation, then need debug repeatedly in weighing balance 230 top, until obtaining the play glue volume that satisfies the requirement, then dispensing mechanism 200 side can put into operation, guarantees the quality of gluing.
Referring to fig. 8 to 9, in the present embodiment, the cap planting mechanism 300 has substantially the same structure as the glue dispensing mechanism 200. The cap planting mechanism 300 includes a cap planting table 301, the cap planting modules 320 are disposed on the cap planting table 301, and each cap planting module 320 includes a second movable frame 321, a cap planting frame 322, and a cap planting head 323. In each cap implanting module 320, the second movable frame 321 is connected to the second support 310 so as to be capable of moving relatively in the first direction X, the cap implanting frame 322 is connected to the second movable frame 321 so as to be capable of moving relatively in the second direction Y, and the cap implanting head 323 is connected to the cap implanting frame 322 so as to be capable of moving relatively in the up-down direction Z. The cap setting mechanism 300 is different from the dispensing mechanism 200 mainly in the structure and function of the cap setting head 323 and the dispensing head 223, the dispensing head 223 is used to apply the glue solution to the designated position of the chip 2, and the cap setting head 323 can suck the protective cap 3 and move to place on the chip 2.
Referring to fig. 13-14, in other respects, the cap planting mechanism 300 is configured similarly to the glue dispensing mechanism 200: the second brackets 310 have two spaced apart along the second direction Y, each of the second brackets 310 includes a second leg 313 and a second beam 314, the second leg 313 has at least three spaced apart along the first direction X, and the second beam 314 extends along the first direction X. The three second leg supports 313 are on the same horizontal plane, and herein are specifically fixedly supported on the implantation and capping workbench 301, the three second legs 313 are jointly supported below the second cross beam 314, and two end portions of each second moving frame 321 in the second direction Y are respectively connected with the second cross beam 314 on the same side in a sliding manner. In this embodiment, three second support legs 313 are disposed at equal intervals in each second support 310, a second rail 311 extending along the first direction X is fixedly disposed on each second beam 314, two second moving seats 312 are slidably disposed on each second rail 311, and each second moving seat 312 is connected to an end of one second moving frame 321. Further, each second moving frame 321 extends along the second direction Y, and a cap planting moving seat 324 capable of relatively sliding along the second direction Y is further disposed on each second moving frame 321, and the cap planting frame 322 is fixedly connected to the cap planting moving seat 324 so as to realize the sliding of the cap planting frame 322 on the second moving frame 321.
In addition, referring to fig. 8, in the present embodiment, each cap planting module 320 includes a protective cap feeding mechanism 330, and the protective cap feeding mechanism 330 is disposed outside the cap planting workbench 301 along the first direction X for feeding the protective cap 3, which may specifically adopt a cartridge loading mechanism or a disc loading mechanism in the prior art, which is not limited in the present invention.
Referring to fig. 6 to 8, in the present embodiment, the chip cap mounting apparatus further includes a transmission rail 600 for transmitting the chip 2, and each of the dispensing modules 220 and each of the cap mounting modules 320 includes a group of transmission rails 600. For the sake of distinction, the transfer track 600 in each dispensing module 220 is called dispensing transfer track, and the transfer track 600 in each cap-planting module 320 is called cap-planting transfer track. The dispensing conveying track is used for conveying the chip 2 along the second direction Y, and is specifically used for conveying the carrier 1, and the dispensing conveying track is arranged below the corresponding dispensing head 223; the cap planting conveying track is used for conveying the chips 2 along the second direction Y, particularly for conveying the carriers 1, and is arranged below the cap planting head 323. In this embodiment, along the second direction Y, each group of dispensing conveying rails sequentially passes through between two of the first support legs 213 of each first support 210, so that the carrier 1 on the dispensing conveying rails can be completely located in the moving range of the dispensing head 223; similarly, each set of the plant cover conveying rails sequentially passes between two of the second legs 313 of each second support 310, so that the carriers 1 on the plant cover conveying rails can be completely positioned in the moving range of the plant cover head 323. In this embodiment, at least one dispensing mechanism 200 is connected to one cap-planting mechanism 300 along the second direction Y, two dispensing transmission tracks are connected to two cap-planting transmission tracks in a one-to-one correspondence, and the corresponding dispensing transmission tracks and the cap-planting transmission tracks extend in a collinear manner in the transmission direction. Further, in the two dispensing mechanisms 200 connected in the second direction Y, the two dispensing transmission rails located on the front side and the two dispensing transmission rails located on the rear side can be connected in a one-to-one correspondence manner; in the two planting cover mechanisms 300 connected in the second direction Y, the two groups of planting cover transmission rails located on the front side and the two groups of planting cover transmission rails located on the rear side can also be connected in a one-to-one correspondence manner, so that each of the glue dispensing mechanisms 200 and the planting cover mechanisms 300 can directly receive the carrier 1 for upstream transmission. Furthermore, in the feeding mechanism 100, the pressing mechanism 400 and the discharging mechanism 500 of the chip cap planting device, two sets of rails disposed at intervals along the first direction X may be disposed correspondingly, so that the carrier 1 can move along the second direction Y all the time during the transmission process, and the connection is smooth. In other embodiments, because the processing speed in the feeding mechanism 100, the pressing mechanism 400 and the discharging mechanism 500 is faster, only one set of transfer tracks may be provided, and the carrier 1 may be distributed into two sets of dispensing transfer tracks after being fed from the feeding mechanism 100 and before entering the dispensing mechanism 200; similarly, after the carrier 1 flows out from the two sets of planting cover transmission rails of the planting cover mechanism 300, the carrier can be gathered to the single-line transmission rail of the pressing mechanism 400, so that the structure of the chip planting cover device is simplified, and the operation and maintenance cost is reduced.
As can be seen from the above, the structural arrangement of each group of dispensing conveying tracks and the planting cover conveying tracks is substantially the same, and the structure of one group of conveying tracks 600 is described in detail below. Referring to fig. 15 to 17, each set of the conveying tracks 600 includes a first side rail 610 and a second side rail 620, the first side rail 610 and the second side rail 620 extend along the second direction Y, and the first side rail 610 and the second side rail 620 are spaced along the first direction X. Wherein the first side rails 610 are disposed in a manner of being capable of relatively moving along the first direction X, and each set of conveying rails 600 further includes a spacing adjustment mechanism 630 for driving the first side rails 610 to relatively move along the first direction X, so as to be capable of adapting to carriers 1 with different width dimensions. In this embodiment, the distance adjusting mechanism 630 includes a connecting rod 631 and an adjusting rail 632, the connecting rod 631 and the adjusting rail 632 respectively extend along the first direction X, the connecting rod 631 can be relatively telescopically connected between the first side rail 610 and the second side rail 620, and the bottom of the first side rail 610 can be relatively slidably connected with the adjusting rail 632. Generally, the size of the carriers 1 in the same batch is the same, so the operator only needs to adjust the distance between the first side rail 610 and the second side rail 620 before the equipment is started, and does not need to adjust the distance again during the operation of the equipment. It should be noted that, in order to ensure that the carrier 1 can be smoothly transported and reduce friction, the distance between the first side rail 610 and the second side rail 620 should be slightly larger than the width of the carrier 1.
Referring to fig. 15 to 17, in the present embodiment, each set of the conveying rails 600 includes a side pushing member 640 and a blocking member 650. The side pushing member 640 is connected to the first side rail 610 in a manner of relatively moving along the first direction X, the blocking member 650 is connected to the second side rail 620 in a manner of relatively moving along the up-down direction Z, and the blocking member 650 is located between the first side rail 610 and the second side rail 620 along the first direction X. Further, the side pushing member 640 has a pushing position and an avoiding position, when the side pushing member 640 is located at the pushing position, along the first direction X, at least a portion of the side pushing member 640 is located between the first side rail 610 and the second side rail 620, and is capable of pushing the carrier 1 between the first side rail 610 and the second side rail 620 to the other side of the side pushing member 640; when the side pushing member 640 is located at the avoiding position, the side pushing member 640 exits from between the first side rail 610 and the second side rail 620 along the first direction X, and the transportation of the vehicle 1 along the second direction Y is not affected. In this embodiment, the outer side of the first side rail 610 is further provided with two side pushing cylinders 641 for driving the side pushing member 640 to move along the first direction X, the side pushing member 640 has two side pushing cylinders 641 arranged at intervals along the second direction Y, and the number of the side pushing cylinders 641 is two.
Referring to fig. 15 to 17, in the present embodiment, a lifting platform 660 is disposed between the first side rail 610 and the second side rail 620 of each set of conveying rails 600. The stopper 650 is located downstream of the lift stage 660 in the conveyance direction of the carrier 1. Elevating platform 660 can set up along upper and lower direction Z relative motion ground, and elevating platform 660's top has boss 661, boss 661 be with the perforation 11 matched with rectangle of carrier 1, and the length of side of boss 661 slightly is less than the length of side of perforation 11 to boss 661 can pass perforation 11 motion along upper and lower direction Z. The upper surface of the boss 661 is located in a horizontal plane, and the boss 661 further has a vacuum adsorption structure 662. In this embodiment, elevating platform 660 has a plurality of bosss 661 that the interval set up, the upper surface of a plurality of bosss 661 is located same horizontal plane, a plurality of bosss 661 and a plurality of perforation 11 one-to-one, a plurality of bosss 661 of here has eight of array arrangement equally, thereby when elevating platform 660 rises, eight bosss 661 can upwards pass in eight perforation 11 of carrier 1 from simultaneously, and then eight chips 2 above the perforation 11 of jack-up simultaneously, make chip 2 and carrier 1 break away from the contact. In this embodiment, the conveying track 600 further includes a vacuum generator 663, the vacuum generator 663 is connected with the vacuum adsorption structure 662 of each boss 661, the vacuum adsorption structure 662 is specifically an adsorption hole, the vacuum generator 663 extracts air from the adsorption hole, so that each boss 661 can vacuum adsorb the chip 2 above it, the chip 2 is stably lifted, a standard horizontal plane support is provided for the chip 2, and the process requirements of dispensing and cover planting are met.
Referring to fig. 15 to 17, in the present embodiment, each set of the conveying rails 600 includes a lifting bracket 665, the lifting platform 660 is connected to the lifting bracket 665 in a manner of being capable of relatively moving, the conveying rails 600 further include a lifting driving motor 664 for driving the lifting platform 660 to lift, and the lifting driving motor 664 and the vacuum generator 663 are connected to the lifting bracket 665. It should be noted that, in this embodiment, the carrier 1 is made of a thin plate material such as a stainless steel plate, and when the carrier is subjected to an external pressure, a certain bending deformation is generated, and the requirement of the dispensing or cap-planting process on the flatness cannot be met, so that the dispensing or cap-planting process cannot be directly performed on the carrier 1, and a rigid standard plane needs to be provided by the lifting table 660.
Referring to fig. 8 and 10, in the present embodiment, in order to further improve the capping accuracy, each capping module 320 includes a height detection assembly, and the height detection assembly includes a first sensor 910 and a second sensor 920. The first sensor 910 is fixedly connected to the cap setting table 301, and the first sensor 910 is located below a moving path of the cap setting head 323, when the cap setting head 323 moves right above the first sensor 910 after sucking the protective cover 3, the first sensor 910 is configured to detect a height difference H1 between the protective cover 3 sucked by the cap setting head 323 and the first sensor 910, where H1 specifically refers to a height difference between a lower surface of the protective cover 3 and a calibrated position of the first sensor 910. The second sensor 920 is fixedly connected to the cap implanting frame 322, and is specifically fixedly disposed on the back of the cap implanting frame 322, so that the second sensor 920 can translate in the horizontal plane along with the cap implanting frame 322, but cannot lift along with the cap implanting head 323, when the cap implanting frame 322 moves to a position right above the chip 2, the second sensor 920 is configured to detect a height difference H2 between the chip 2 and the second sensor 920 downward, where H2 specifically refers to a height difference between the upper surface of the chip 2 lifted by the lifting stage 660 and a position before a calibration position of the second sensor 920. The control system calculates the height difference H3 between the protective cover 3 and the chip 2 according to H1 and H2, and adjusts the height of the cap implanting head 323 according to H3. Specifically, if the height of the calibration position of the first sensor 910 is H1 and the height of the calibration position of the second sensor 920 is H2, then H3= (H1 + H1) - (H2-H2), and it should be noted that H1, H2, and H2 all refer to the distance in the vertical direction Z. Then, after calculating the actual height difference H3 between the protective cover 3 and the chip 2, the control system compares the actual height difference H3 with the preset optimal height difference H3, and then performs height compensation by driving the cap implanting head 323 to ascend and descend, so as to obtain an ideal cap implanting effect.
In this embodiment, the working principle of each dispensing module 220 is as follows: the carrier 1 carrying the chip 2 enters from one side of the dispensing conveying track and is conveyed along the second direction Y until being blocked by the raised blocking piece 650, and the carrier 1 stops at a preset position. Then, the two side pushing pieces 640 move from the avoiding position to the pushing position at the same time, so as to push the carrier 1 toward the second side rail 620, so that the carrier 1 abuts against the inner side wall of the second side rail 620, and positioning is achieved. Subsequently, the lifting platform 660 is lifted, the bosses 661 penetrate through the through holes 11 and jack up the chips 2, and the control system can control the dispensing heads 223 to sequentially dispense the chips 2 on the carrier 1. After dispensing, the lifting platform 660 descends, the chip 2 falls onto the carrier 1 again, the blocking piece 650 descends, the two side pushing pieces 640 return to the avoiding position, and the dispensing conveying track can continue to convey the carrier 1 along the second direction Y.
Similarly, in the present embodiment, the working principle of each plant cover module 320 is as follows: the carrier 1 carrying the chip 2 enters from one side of the implanting cover conveying track and is conveyed along the second direction Y until the carrier 1 is stopped by the raised blocking piece 650, and the carrier 1 stops at a preset position. Then, the two side pushing pieces 640 move from the avoiding position to the pushing position at the same time, so as to push the carrier 1 toward the second side rail 620, so that the carrier 1 abuts against the inner side wall of the second side rail 620, and positioning is achieved. Subsequently, the elevating table 660 is raised, and the plurality of bosses 661 simultaneously pass through the through holes 11 and lift up the plurality of chips 2. Meanwhile, the cover planting head 323 takes materials from the protective cover feeding mechanism 330 for the protective cover 3, then the height difference between the protective cover 3 and the chip 2 is accurately measured by the height detection assembly, the height compensation is carried out by lifting the cover planting head 323, the cover planting head 323 is controlled to plant the chips 2 on the carrier 1 in sequence, and after the protective cover 3 is placed on the chip 2 at the specified position, the cover planting head 323 can also carry out attachment prepressing, which is beneficial to positioning of the protective cover 3 and the chip 2. In this embodiment, each cap attaching head 323 has a pressure sensor (not shown in the figure) capable of detecting and recording the pressing force of each protective cap 3 on the chip 2. If abnormity occurs, alarming can be carried out in time. After the cover is planted, the lifting platform 660 descends, the chip 2 falls onto the carrier 1 again, the blocking piece 650 descends, the two side pushing pieces 640 return to the avoiding position, and the dispensing conveying track can continue to convey the carrier 1 along the second direction Y.
In this embodiment, the working modes of the dispensing modules 220 on both sides of the first direction X are completely the same, the working modes of the cap planting modules 320 on both sides are also completely the same, and the dispensing modules 220 and the cap planting modules 320 can respectively and independently operate without interfering with each other, and are controlled by the same set of control system. Two groups of transmission rails 600 are respectively arranged in parallel in each glue dispensing mechanism 200 and the cover planting mechanism 300, so that the glue dispensing mechanism can be conveniently connected with different mechanisms on the upstream and downstream in series, and one set of control system can control a plurality of glue dispensing mechanisms 200 and the cover planting mechanism 300. In the cover equipment is planted to this chip, the action is more coordinated between different modules, different mechanisms, and the setting of control system and height detection subassembly etc. more helps promoting to plant the lid precision, is showing simultaneously and improves work efficiency to the productivity effect has been improved.
The above embodiments are only for illustrating the technical idea and features of the present invention, and the purpose of the present invention is to enable those skilled in the art to understand the content of the present invention and implement the present invention, and not to limit the protection scope of the present invention by this means. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (10)
1. The utility model provides a cover equipment is planted to full-automatic chip for put plant protection cover on the chip, cover equipment is planted to chip includes the casing, and follows the direction of transmission of chip sets gradually feed mechanism, point gum machine constructs, plants cover mechanism, pressing mechanism and unloading mechanism in the casing, wherein, feed mechanism is used for treating to plant the lid the chip carries out the material loading, point gum machine constructs to be used for the point gum is glued on the chip, plant cover mechanism be used for with the visor pendulum is put on the chip, pressing mechanism be used for with the visor with the chip pressfitting, unloading mechanism is used for to plant behind the cover the chip carries out the unloading, its characterized in that:
the dispensing mechanism comprises a first support and two dispensing modules, the two dispensing modules are arranged at intervals along a first direction, each dispensing module comprises a first moving frame, a dispensing frame and a dispensing head, in each dispensing module, the first moving frame can be connected with the first support in a relative motion manner along the first direction, the dispensing frame can be connected with the first moving frame in a relative motion manner along a second direction, the dispensing head can be connected with the dispensing frame in a relative motion manner along the up-down direction, the first direction and the second direction respectively extend along the horizontal direction, and the first direction and the second direction are perpendicular to each other;
the cap planting mechanism comprises a second support and two cap planting modules, the two cap planting modules are arranged at intervals in the first direction, each cap planting module comprises a second movable frame, a cap planting frame and a cap planting head, the second movable frame can be connected with the second support in a relative motion mode in the first direction in each cap planting module, the cap planting frames can be connected with the second movable frame in a relative motion mode in the second direction, and the cap planting heads can be connected with the cap planting frames in a relative motion mode in the vertical direction;
the chip cap planting equipment further comprises a control system, the control system comprises a computer, at least one computer is arranged on each of two sides of the shell in the first direction, the computers on each side can control the dispensing modules on two sides, and/or the computers on each side can control the cap planting modules on two sides.
2. The full-automatic chip cap implanting device according to claim 1, wherein: a first computer, a second computer and a third computer are arranged on each side of the shell in the first direction, wherein the first computer on each side can control the feeding mechanism and the dispensing mechanism, and the first computer on each side can control the dispensing modules on the two sides; the second computer on each side can control the cap planting mechanism, and the second computer on each side can control the cap planting modules on two sides; the third computer on each side can control the pressing mechanism and the blanking mechanism.
3. The full-automatic chip cap implanting device according to claim 1, wherein: each dispensing module comprises a dispensing transmission track, the dispensing transmission track is used for transmitting the chip along the second direction, and the dispensing transmission track is arranged below the dispensing head; every plant and cover the module and all including planting the lid transmission track, plant the lid transmission track and be used for following the second direction transmission the chip, plant the lid transmission track and locate plant the below of capping head.
4. The full-automatic chip cap implanting device according to claim 3, wherein: the dispensing mechanism is connected with the cap planting mechanism along the second direction, the two dispensing transmission rails are connected with the two cap planting transmission rails in a one-to-one correspondence mode, and the corresponding dispensing transmission rails and the cap planting transmission rails extend in a collinear mode in the transmission direction.
5. The full-automatic chip cap implanting device according to claim 3, wherein: in the dispensing mechanism, the first supports are provided with two first support frames which are arranged at intervals along the second direction, each first support frame comprises at least three first support legs and a first cross beam, the first support legs are arranged at intervals along the first direction, the first cross beams extend along the first direction, the three first support legs are supported on the same horizontal plane, the three first support legs are supported below the first cross beam together, two end parts of each first moving frame in the second direction are respectively connected with the first cross beams on the same side in a sliding mode, and each group of dispensing conveying tracks sequentially penetrate through the space between two first support legs of each first support frame;
in the cap planting mechanism, the second supports are provided with two supports which are arranged at intervals along the second direction, each second support comprises a second supporting leg and a second cross beam, the second supporting legs are provided with at least three supports which are arranged at intervals along the first direction, the second cross beams extend along the first direction, the three second supporting legs are supported on the same horizontal plane, the three second supporting legs are supported below the second cross beam together, two end parts of each second moving frame in the second direction are respectively in sliding connection with the second cross beams on the same side, and each group of cap planting transmission tracks sequentially penetrate through two second supporting legs of each second support.
6. The full-automatic chip cap implanting device according to claim 1, wherein: the cover equipment is planted to chip still includes the transmission track that is used for transmitting the chip, every point is glued the module and is every plant the cover module and all include a set of the transmission track, every group the transmission track all includes first side rail and second side rail, first side rail with second side rail is followed respectively the second direction extends, first side rail with second side rail is followed first direction interval sets up, first side rail can be followed first direction relative motion ground sets up, every group the transmission track still includes and is used for ordering about first side rail is followed first direction relative motion's interval guiding mechanism.
7. The full-automatic chip cap implanting device according to claim 6, wherein: each group of the conveying tracks comprises a side pushing piece and a blocking piece, the side pushing piece can be connected with the first side rail in a relatively moving mode along the first direction, the blocking piece can be connected with the second side rail in a relatively moving mode along the up-down direction, the blocking piece is located between the first side rail and the second side rail along the first direction, the side pushing piece is provided with a pushing position and an avoiding position, and when the side pushing piece is located at the pushing position, at least part of the side pushing piece is located between the first side rail and the second side rail along the first direction; when the side pushing piece is located at the avoiding position, the side pushing piece is withdrawn from between the first side rail and the second side rail along the first direction.
8. The full-automatic chip cap implanting device according to claim 6, wherein: the chip is stored in a carrier and is transported, the carrier is provided with a through hole, and the chip can be supported above the through hole; every group the transmission orbit first side rail with all be equipped with the elevating platform between the second side rail, the elevating platform can set up along upper and lower direction relative motion ground, the top of elevating platform has the boss, the boss can be followed the upper and lower direction and passed the perforation motion, the upper surface of boss is located the horizontal plane, the boss has the vacuum adsorption structure.
9. The full-automatic chip cap implanting device according to claim 1, wherein: the cap planting mechanism comprises a cap planting workbench, the cap planting modules are arranged on the cap planting workbench, each cap planting module comprises a height detection assembly, each height detection assembly comprises a first sensor and a second sensor, the first sensors are fixedly connected with the cap planting workbench, and the first sensors are used for upwards detecting the height difference H1 between the protective caps adsorbed by the cap planting heads and the first sensors; the second sensor is fixedly connected with the plant cover frame and used for detecting the height difference H2 between the chip and the second sensor downwards, the control system calculates the height difference H3 between the protective cover and the chip according to the H1 and the H2 and adjusts the height of the plant cover head according to the H3.
10. The full-automatic chip cap implanting device according to any one of claims 1 to 9, wherein: the glue dispensing mechanism is provided with two glue dispensing mechanisms which are arranged in sequence along the transmission direction of the chip; and/or the cover planting mechanism is provided with two sets which are arranged in sequence along the transmission direction of the chip.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310850174.6A CN116798881A (en) | 2023-03-15 | 2023-03-15 | Full-automatic chip cover planting equipment |
| CN202310244566.8A CN115954278B (en) | 2023-03-15 | 2023-03-15 | Full-automatic chip cover planting equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310244566.8A CN115954278B (en) | 2023-03-15 | 2023-03-15 | Full-automatic chip cover planting equipment |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310850174.6A Division CN116798881A (en) | 2023-03-15 | 2023-03-15 | Full-automatic chip cover planting equipment |
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| CN115954278A true CN115954278A (en) | 2023-04-11 |
| CN115954278B CN115954278B (en) | 2023-06-13 |
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| CN202310850174.6A Pending CN116798881A (en) | 2023-03-15 | 2023-03-15 | Full-automatic chip cover planting equipment |
| CN202310244566.8A Active CN115954278B (en) | 2023-03-15 | 2023-03-15 | Full-automatic chip cover planting equipment |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202310850174.6A Pending CN116798881A (en) | 2023-03-15 | 2023-03-15 | Full-automatic chip cover planting equipment |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107961951A (en) * | 2017-12-30 | 2018-04-27 | 昆山希盟自动化科技有限公司 | Semi-automatic boss double-station dispenser |
| CN109482430A (en) * | 2019-01-22 | 2019-03-19 | 深圳市诺峰光电设备有限公司 | A kind of full-automatic double track dispenser and its gluing process |
| CN208627695U (en) * | 2018-05-29 | 2019-03-22 | 深圳市倍斯特科技股份有限公司 | Point glue equipment with two point rubber moulding group |
| CN110013946A (en) * | 2019-04-29 | 2019-07-16 | 佛山隆深机器人有限公司 | A kind of double-station automatic gluing production line |
| CN218482208U (en) * | 2022-10-31 | 2023-02-14 | 昆山鸿仕达智能科技股份有限公司 | Full-automatic chip cap planting equipment |
-
2023
- 2023-03-15 CN CN202310850174.6A patent/CN116798881A/en active Pending
- 2023-03-15 CN CN202310244566.8A patent/CN115954278B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107961951A (en) * | 2017-12-30 | 2018-04-27 | 昆山希盟自动化科技有限公司 | Semi-automatic boss double-station dispenser |
| CN208627695U (en) * | 2018-05-29 | 2019-03-22 | 深圳市倍斯特科技股份有限公司 | Point glue equipment with two point rubber moulding group |
| CN109482430A (en) * | 2019-01-22 | 2019-03-19 | 深圳市诺峰光电设备有限公司 | A kind of full-automatic double track dispenser and its gluing process |
| CN110013946A (en) * | 2019-04-29 | 2019-07-16 | 佛山隆深机器人有限公司 | A kind of double-station automatic gluing production line |
| CN218482208U (en) * | 2022-10-31 | 2023-02-14 | 昆山鸿仕达智能科技股份有限公司 | Full-automatic chip cap planting equipment |
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| Publication number | Publication date |
|---|---|
| CN116798881A (en) | 2023-09-22 |
| CN115954278B (en) | 2023-06-13 |
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