CN115910920A - Manufacturing method of flexible display panel - Google Patents
Manufacturing method of flexible display panel Download PDFInfo
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Abstract
The application relates to a manufacturing method of a flexible display panel, which comprises the following steps: providing a rigid substrate; respectively forming a flexible substrate and a protective layer on the surfaces of two opposite sides of the rigid base; forming a display function layer on one side of the flexible substrate, which is far away from the rigid base; separating the protective layer from the surface of the rigid substrate; the flexible substrate is irradiated with laser light from a side of the rigid base facing away from the flexible substrate, and the flexible substrate is peeled off from the rigid base. The manufacturing method of the flexible display panel can solve the problem that the flexible display panel is easily damaged in a laser peeling process.
Description
Technical Field
The application relates to the technical field of display, in particular to a manufacturing method of a flexible display panel.
Background
In the manufacturing process of the flexible display panel, when the flexible substrate and the rigid substrate are peeled by utilizing a laser peeling process, due to the fact that impurity particles and mechanical damage exist on the surface of the rigid substrate, the transmittance of the rigid substrate can be reduced by the impurity particles and the mechanical damage, laser irradiated on the flexible substrate is enabled to be unevenly distributed, the adhesion force between the flexible substrate and the rigid substrate is not evenly reduced after laser irradiation, the local area still has large adhesion force, and the flexible display panel is damaged due to pulling in the separation process of the flexible substrate and the rigid substrate.
Disclosure of Invention
In view of the above, it is necessary to provide a method for manufacturing a flexible display panel, which is directed to the problem that the flexible display panel is easily damaged by the laser lift-off process.
According to an aspect of the present application, there is provided a method for manufacturing a flexible display panel, including the steps of:
providing a rigid substrate;
respectively forming a flexible substrate and a protective layer on the surfaces of two opposite sides of the rigid base;
forming a display function layer on one side of the flexible substrate, which is far away from the rigid base;
separating the protective layer from the surface of the rigid substrate;
and irradiating laser to the flexible substrate from the side of the rigid base, which is far away from the flexible substrate, and peeling the flexible substrate from the rigid base.
According to the manufacturing method of the flexible display panel, the protective layer is formed on one side, away from the flexible substrate, of the rigid substrate, so that before the flexible substrate is stripped from the rigid substrate by using a laser stripping process, the surface of one side, exposed outside, of the rigid substrate can be protected by the protective layer, damage and pollution to the rigid substrate caused by a transportation process and a display function layer forming process on the flexible substrate are reduced, and therefore, after the display function layer is formed, the protective layer is removed, when the flexible substrate is stripped from the rigid substrate by using the laser stripping process, due to the fact that impurity particles and mechanical damage on the rigid substrate are few, laser irradiated to the flexible substrate is uniformly distributed, the flexible substrate is uniformly stripped from the rigid substrate, and the flexible display panel is prevented from being damaged due to overlarge stripping force required by insufficient local carbonization.
In some embodiments, the forming a protective layer on the rigid substrate comprises: and evaporating an AF material on one side surface of the rigid substrate to form the protective layer. The protection layer is formed by evaporating the AF material on the surface of one side of the rigid substrate, the risk of scratching or fouling the rigid substrate in the front process of the flexible display panel is reduced by utilizing the wear resistance and easy cleaning property of the AF material, so that laser can be uniformly applied to a contact surface between the flexible substrate and the rigid substrate in the laser stripping process, the material on the contact surface is uniformly carbonized, the stripping is smoothly completed, and the flexible display panel is prevented from being damaged due to insufficient local carbonization.
In some embodiments, the protective layer has a thickness of 1 μm to 30 μm; optionally, the protective layer has a thickness of 4 μm to 10 μm. It can be understood that, when the protective layer is formed on the surface of the rigid substrate, the impurity particles and the mechanical damage that may fall onto the rigid substrate may fall onto the protective layer, and the greater the thickness of the protective layer is, the greater the risk that the mechanical damage may penetrate through the protective layer and extend onto the rigid substrate is, but the greater the thickness of the protective layer is, the greater the process cost may also be. Based on this, through designing the thickness of protective layer, can guarantee that the technology cost is lower for the protective layer protects rigid substrate effectively.
In some embodiments, the protective layer is a hydrophobic layer. Optionally, the protective layer has a water drop angle > 110 °. Therefore, liquid impurities are not easy to remain on the protective layer, and impurity particles falling onto the protective layer in the front process of the flexible display panel can be cleaned more easily.
In some embodiments, said separating said protective layer from the surface of said rigid substrate comprises: and separating the protective layer from the surface of the rigid substrate by using a plasma cleaning process. After the front process of the flexible display panel is finished, the protective layer is separated from the surface of the rigid substrate, so that the protective layer damaged in the front process falls off, and thus when the flexible substrate is irradiated by laser through the rigid substrate, the influence of impurity particles and mechanical damage is avoided, the laser is uniformly distributed on the bottom surface of the flexible substrate, and the defect of local carbonization caused by scratching or dirt of the rigid substrate is avoided. And the protective layer is separated from the surface of the rigid substrate by adopting a plasma cleaning process, namely, the protective layer is bombarded by high-energy plasma, so that the protective layer is decomposed without chemical soaking, and the pollution of waste liquid is avoided.
In some embodiments, before detaching the protective layer from the surface of the rigid substrate using the plasma cleaning process, the method further comprises: and cleaning the whole formed by combining the protective layer, the rigid substrate, the flexible substrate and the display function layer. Because before the protective layer is separated from the surface of the rigid substrate, the integral structure formed by combining the protective layer, the rigid substrate, the flexible substrate and the display function layer is cleaned, the impurities remained on the protective layer can be effectively prevented from falling onto the rigid substrate in the separation process of the protective layer and the rigid substrate, namely, the impurities remained on the protective layer are prevented from being transferred onto the rigid substrate.
In some embodiments, the plasma cleaning process is used to separate the protective layer from the surface of the rigid substrate, and the gas source used comprises nitrogen gas and air. Based on this, utilize high-energy plasma to carry out the bombardment to the protective layer, make the protective layer decompose, need not to carry out chemical soaking, avoid producing waste liquid pollution.
In some embodiments, the separating the protective layer from the surface of the rigid substrate using a plasma cleaning process has a plasma spray power of 0.5kW to 15kW. The bombardment intensity of the plasma to the protective layer can be adjusted by adjusting the plasma jet power, so that the required bombardment effect is achieved.
In some embodiments, the flexible substrate is irradiated with laser light from a side of the rigid base facing away from the flexible substrate, the laser light wavelength being greater than or equal to 300nm; optionally, in the step of irradiating the flexible substrate with the laser from the side of the rigid base, which is away from the flexible substrate, the laser wavelength is greater than or equal to 500nm. Based on the method, laser with proper wavelength is selected for irradiation according to the absorption capacity of the material of the contact surface between the flexible substrate and the rigid base to laser with different wavelengths, so that a better carbonization effect can be obtained, and the flexible substrate and the rigid base can be smoothly peeled.
In some embodiments, said forming a display functional layer on a side of said flexible substrate facing away from said rigid base comprises: forming a driving layer group on one side surface of the flexible substrate, which faces away from the rigid base; the driving layer group comprises a plurality of thin film transistors arranged in an array; a display device layer is formed on the drive layer group. Because the protective layer is formed on the side, away from the flexible substrate, of the rigid substrate, the rigid substrate is covered by the protective layer in the process of forming the driving layer group and the display device layer on the flexible substrate, and mechanical damage and impurity particle residue caused by exposure of the rigid substrate in the manufacturing process are avoided.
Drawings
Fig. 1 is a flow chart illustrating a method for manufacturing a flexible display panel according to an embodiment of the present application;
FIG. 2a is a schematic diagram illustrating the state of residual impurity particles and mechanical damage on the protection layer according to an embodiment of the present disclosure;
FIG. 2b is a schematic diagram illustrating a state after cleaning of the protective layer according to an embodiment of the present disclosure;
FIG. 2c is a schematic view of an embodiment of the present application after the protective layer has been separated from the rigid substrate;
fig. 2d is a schematic diagram illustrating a state after the flexible substrate is peeled off from the rigid base in an embodiment of the present application.
The reference numbers illustrate:
10. a rigid substrate; 20. a flexible substrate; 30. a protective layer; 31. impurity particles; 32. and (4) mechanical damage.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of embodiments in many different forms than those described herein and that modifications may be made by one skilled in the art without departing from the spirit and scope of the application and it is therefore not intended to be limited to the specific embodiments disclosed below.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and encompass, for example, both fixed and removable connections or integral parts thereof; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, a first feature is "on" or "under" a second feature such that the first and second features are in direct contact, or the first and second features are in indirect contact via an intermediary. Also, a first feature "on," "above," and "over" a second feature may be directly on or obliquely above the second feature, or simply mean that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
Organic Light Emitting Display (OLED) Display panels are gradually replacing Liquid Crystal Display (LCD) panels due to their advantages of flexibility, portability, high contrast, short response time, and the like, and become revolutionary next-generation Display products.
The flexible display panel is usually manufactured by preparing a flexible substrate on a rigid support substrate, then preparing a thin film transistor, a light emitting element, and the like on the flexible substrate, and then separating the flexible substrate from the rigid support substrate by mechanical peeling or laser peeling. The rigid support substrate is usually made of mother glass, and the flexible substrate is mainly made of organic polymer materials, such as Polyimide (PI), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), and the like.
Currently, the flexible substrate and the rigid support substrate are mostly separated by a Laser Lift Off (LLO) process. Specifically, high-energy laser is irradiated onto the flexible substrate through the rigid support substrate, so that the material of the contact interface between the flexible substrate and the rigid support substrate is carbonized and decomposed, the adhesion between the flexible substrate and the glass substrate is reduced, and the flexible substrate and the rigid support substrate are separated.
However, in the process of manufacturing thin film transistors, light emitting elements, and the like on a flexible substrate, an intermediate product in which the flexible substrate is combined with a rigid support base is subjected to a coating process, a baking process, an evaporation process, and various transports, and a large amount of impurity particles existing in the environment fall onto the rigid support base during the coating, baking, evaporation, and transport processes, and remain on the rigid support base after baking and evaporation, thereby forming intractable stains which are difficult to clean; also, the rigid support substrate is susceptible to scratching during coating, baking, evaporation and transportation. In other words, before the flexible substrate and the rigid support substrate are subjected to laser peeling, dirt and scratches easily occur on the rigid support substrate, and the laser transmittance is reduced at the position where the dirt or scratches occur, so that the charring effect at the position where the dirt or scratches occur is not good in the laser peeling process, and the flexible substrate and the rigid support substrate are peeled off by local pulling, so that the screen body is damaged.
In order to solve the above problems, the present application provides a method for manufacturing a flexible display panel, in which a protection layer is formed on a side of a rigid substrate away from a flexible substrate, so that before the flexible substrate is peeled from the rigid substrate by using a laser peeling process, the surface of the side of the rigid substrate exposed outside can be protected by the protection layer, damage and pollution to the rigid substrate caused by a transportation process and a process of forming a display function layer on the flexible substrate are reduced, and thus, laser irradiated to the flexible substrate is uniformly distributed, and damage to the flexible display panel due to an excessively large peeling force required by insufficient local carbonization is avoided.
Fig. 1 is a flow chart illustrating a method for manufacturing a flexible display panel according to an embodiment of the present application. Fig. 2a is a schematic diagram illustrating states of residual impurity particles and mechanical damage on the protection layer according to an embodiment of the present application. Fig. 2b shows a schematic diagram of a state after the protective layer is cleaned in an embodiment of the present application. Fig. 2c shows a schematic view of the protective layer after being separated from the rigid substrate in an embodiment of the present application. Fig. 2d shows a schematic diagram of a state after the flexible substrate is peeled from the rigid base in an embodiment of the present application.
Referring to fig. 1 to fig. 2d, a method for manufacturing a flexible display panel according to an embodiment of the present application includes the following steps:
step S1, providing a rigid substrate 10;
step S2, respectively forming a flexible substrate 20 and a protective layer 30 on the two opposite side surfaces of the rigid base 10;
s3, forming a display function layer on one side of the flexible substrate 20, which is far away from the rigid base 10;
step S4, separating the protective layer 30 from the surface of the rigid substrate 10;
step S5, irradiating laser to the flexible substrate 20 from the side of the rigid base 10 away from the flexible substrate 20, and peeling the flexible substrate 20 from the rigid base 10.
According to the manufacturing method of the flexible display panel provided by the embodiment of the application, the protective layer 30 is formed on one side of the rigid base 10, which is far away from the flexible substrate 20, so that before the flexible substrate 20 is peeled from the rigid base 10 by using a laser peeling process, the surface of one side of the rigid base 10, which is exposed outside, can be protected by the protective layer 30, and damage and pollution to the rigid base 10 in a transportation process and a display function layer forming process on the flexible substrate 20 are reduced. In this embodiment, the carbonization effect is related to factors such as the wavelength, the frequency, and the emission power of the laser used in the carbonization process, and the carbonization degrees corresponding to different lasers are different, and may be reasonably determined according to the actual situation in practical application, which is not limited in this embodiment.
Alternatively, the rigid substrate 10 is a glass substrate, and the flexible substrate 20 is made of an organic polymer material such as Polyimide (PI), polyethylene terephthalate (PET), or polymethyl methacrylate (PMMA).
Alternatively, the protective layer 30 may be formed on the rigid substrate 10 by thermal evaporation, and specifically, the material forming the protective layer 30 is heated to be evaporated on the surface of the rigid substrate 10. For example, in an alternative embodiment, forming the protective layer 30 on the rigid substrate 10 includes: an AF material is evaporated on one surface of the rigid substrate 10 to form a protective layer 30. Wherein, the chemical composition of the AF material is the same as that of an Anti-Fingerprint (AF) film, specifically can be perfluoropolyether siloxane, and the molecular weight is 300g/mol-8000g/mol. Alternatively, the protective layer 30 may be formed on the rigid substrate 10 by spraying. Thus, the protective layer 30 is formed by evaporating the AF material on the surface of one side of the rigid substrate 10, and the risk of scratching or fouling the rigid substrate 10 in the front process of the flexible display panel is reduced by utilizing the wear resistance and easy cleaning property of the AF material, so that laser can uniformly hit the contact surface between the flexible substrate 20 and the rigid substrate 10 in the laser stripping process, the material on the contact surface is uniformly carbonized, the stripping is smoothly completed, and the damage to the flexible display panel due to insufficient local carbonization is avoided.
Further, the thickness of the protective layer 30 is 1 μm to 30 μm. Preferably, the thickness of the protective layer 30 is 4 μm to 10 μm. It can be understood that, when the protection layer 30 is formed on the surface of the rigid substrate 10, the impurity particles 31 and the mechanical damage 32 that may fall onto the rigid substrate 10 may fall onto the protection layer 30, and the greater the thickness of the protection layer 30 is, the greater the risk that the mechanical damage 32 may penetrate through the protection layer 30 and extend onto the rigid substrate is, but the greater the thickness of the protection layer 30 is, the greater the process cost is. Based on this, by designing the thickness of the protection layer 30, the protection layer 30 can effectively protect the rigid substrate while ensuring that the process cost is low.
In some embodiments, the protection layer 30 is a hydrophobic layer, so that liquid impurities are not easily remained on the protection layer 30, and the impurity particles 31 falling onto the protection layer 30 in the flexible display panel pre-process can be more easily cleaned.
Alternatively, the water drop angle of the protective layer 30 is > 110 °, for example, the water drop angle of the protective layer 30 is 115 °, 120 °, 125 °, 130 °, 140 °, 145 °, 150 °, 160 °, 170 °. The water drop Angle, contact Angle, is defined as the Angle between the gas-liquid interface and the solid-liquid interface at the three phase interface of solid, liquid and gas. A high contact angle indicates that the surface exhibits hydrophobicity. The water drop angle of the protection layer 30 is limited to be larger than 110 degrees in the embodiment of the application, so that the protection layer 30 is guaranteed to be easy to leave liquid impurities, and the impurity particles 31 falling onto the protection layer 30 in the front process of the flexible display panel can be cleaned more easily.
In some embodiments, detaching the protective layer 30 from the surface of the rigid substrate 10 comprises: the protective layer 30 is separated from the surface of the rigid substrate 10 using a plasma cleaning process. Wherein, in the plasma cleaning process, the removal speed of the protective layer 30 can be increased by increasing the ejection energy and the ejection rate of the plasma. The distance between the head for spraying plasma and the protective layer 30 is in the range of 3mm to 20mm. After the front process of the flexible display panel is completed, the protective layer 30 is separated from the surface of the rigid substrate 10, so that the protective layer 30 damaged in the front process falls off, and thus, when the flexible substrate 20 is irradiated by laser through the rigid substrate 10, the influence of impurity particles 31 and mechanical damage 32 is avoided, the laser is uniformly distributed on the bottom surface of the flexible substrate 20, and the defect of local carbonization caused by scratching or dirt of the rigid substrate 10 is avoided. Illustratively, the protective layer is a micron-sized organic layer with a small thickness, and in the plasma cleaning process, the organic layer is oxidized and decomposed by utilizing the oxidizing property of plasma, and substances generated by decomposition are evaporated under the high-energy action of the plasma without chemical soaking, so that the pollution of waste liquid is avoided.
Alternatively, the thickness of the protective layer 30 is set to 4 μm to 10 μm on the basis of separating the protective layer 30 from the surface of the rigid substrate 10 using a plasma cleaning process. Therefore, while the protective layer 30 effectively protects the rigid substrate, the process cost for forming the protective layer 30 is low, and the time consumed for removing the protective layer 30 by adopting a plasma bombardment mode is short, so that the manufacturing efficiency of the flexible display panel is improved.
In some embodiments, before detaching the protective layer 30 from the surface of the rigid substrate 10 using the plasma cleaning process, the method further comprises: the whole of the combination of the protective layer 30, the rigid base 10, the flexible substrate 20, and the display function layer is cleaned. Since the entire structure formed by combining the protective layer 30, the rigid base 10, the flexible substrate 20, and the display function layer is cleaned before the protective layer 30 is separated from the surface of the rigid base 10, it is possible to effectively prevent impurities remaining on the protective layer 30 from falling onto the rigid base 10 in the process of separating the protective layer 30 from the rigid base 10, that is, to prevent the impurities remaining on the protective layer 30 from being transferred onto the rigid base 10.
Alternatively, the protective layer 30 may be separated from the surface of the rigid substrate 10 by a plasma cleaning process using a gas source including nitrogen gas and air. Based on this, the protective layer 30 is bombarded by high-energy plasma, so that the protective layer 30 is decomposed without chemical soaking, and waste liquid pollution is avoided.
Alternatively, the protective layer 30 is separated from the surface of the rigid substrate 10 using a plasma cleaning process, and the plasma spraying power is 0.5kW to 15kW. By adjusting the plasma jet power, the bombardment intensity of the plasma on the protective layer 30 can be adjusted, thereby achieving the required bombardment effect. For example, when the thickness of the protective layer 30 is larger, a higher ejection power is used.
In some embodiments, the flexible substrate 20 is irradiated with laser light from a side of the rigid base 10 facing away from the flexible substrate 20 at a wavelength of greater than or equal to 300nm, which may be, for example, 330nm, 340nm, 350nm, 355nm, or 360nm. Alternatively, in irradiating laser light to the flexible substrate 20 from the side of the rigid base 10 facing away from the flexible substrate 20, the laser light wavelength used is greater than or equal to 500nm, and may be 9000nm, 9400nm, 9600nm, or 9800nm, for example. Based on this, according to the absorption capacity of the material of the contact surface between the flexible substrate 20 and the rigid base 10 to the laser with different wavelengths, the laser with proper wavelength is selected for irradiation, so that a good carbonization effect can be obtained, and the flexible substrate 20 and the rigid base 10 can be smoothly peeled.
In some embodiments, forming the display functional layer on the side of the flexible substrate 20 facing away from the rigid base 10 comprises: forming a driving layer group on the surface of one side of the flexible substrate 20, which faces away from the rigid base 10; the driving layer group comprises a plurality of thin film transistors arranged in an array; a display device layer is formed on the drive layer group. Because the protection layer 30 is formed on the side of the rigid substrate away from the flexible substrate 20, the rigid substrate is covered by the protection layer 30 in the process of forming the driving layer group and the display device layer on the flexible substrate 20, so that the mechanical damage 32 and the impurity particle 31 residue generated in the manufacturing process due to the exposure of the rigid substrate are avoided.
All possible combinations of the technical features of the above embodiments may not be described for the sake of brevity, but should be considered as within the scope of the present disclosure as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A manufacturing method of a flexible display panel is characterized by comprising the following steps:
providing a rigid substrate;
respectively forming a flexible substrate and a protective layer on the surfaces of two opposite sides of the rigid base;
forming a display function layer on one side of the flexible substrate, which is far away from the rigid base;
separating the protective layer from the surface of the rigid substrate;
and irradiating laser to the flexible substrate from the side of the rigid base, which is far away from the flexible substrate, and peeling the flexible substrate from the rigid base.
2. The method of claim 1, wherein the forming a protective layer on the rigid substrate comprises:
and evaporating an AF material on one side surface of the rigid substrate to form the protective layer.
3. The method of claim 2, wherein the protective layer has a thickness of 1 μm to 30 μm;
preferably, the thickness of the protective layer is 4 to 10 μm.
4. The method of claim 1, wherein the protective layer is a hydrophobic layer;
preferably, the water drop angle of the protective layer is > 110 °.
5. The method of claim 1, wherein the separating the protective layer from the surface of the rigid substrate comprises:
separating the protective layer from the surface of the rigid substrate using a plasma cleaning process.
6. The method for manufacturing a flexible display panel according to claim 5, wherein before the separating the protective layer from the surface of the rigid substrate by using the plasma cleaning process, the method further comprises:
and cleaning the whole formed by combining the protective layer, the rigid substrate, the flexible substrate and the display function layer.
7. The method as claimed in claim 5, wherein the protective layer is separated from the surface of the rigid substrate by a plasma cleaning process, and the gas source comprises nitrogen gas and air.
8. The method of claim 5, wherein the plasma jet power is 0.5kW to 15kW when the protective layer is separated from the surface of the rigid substrate by the plasma cleaning process.
9. The method according to any one of claims 1 to 8, wherein the irradiation of the flexible substrate with the laser light from the side of the rigid base facing away from the flexible substrate is performed at a laser wavelength of 300nm or more;
preferably, in the step of irradiating the flexible substrate with the laser from the side of the rigid base, which is away from the flexible substrate, the laser wavelength is greater than or equal to 500nm.
10. The method according to any one of claims 1 to 8, wherein the forming a display function layer on a side of the flexible substrate facing away from the rigid base includes:
forming a driving layer group on one side surface of the flexible substrate, which is far away from the rigid base; the driving layer group comprises a plurality of thin film transistors arranged in an array;
a display device layer is formed on the drive layer group.
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| CN202211342281.XA CN115910920A (en) | 2022-10-31 | 2022-10-31 | Manufacturing method of flexible display panel |
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| CN202211342281.XA CN115910920A (en) | 2022-10-31 | 2022-10-31 | Manufacturing method of flexible display panel |
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