CN112538270A - Self-assembly light heat-conducting silicone rubber composite material in compression space and preparation method thereof - Google Patents
Self-assembly light heat-conducting silicone rubber composite material in compression space and preparation method thereof Download PDFInfo
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K7/04—Fibres or whiskers inorganic
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- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
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Abstract
The invention discloses a self-assembly light heat-conducting silicon rubber composite material in a compression space and a preparation method thereof, wherein the self-assembly light heat-conducting silicon rubber composite material in the compression space comprises the following components: silicone rubber; the compressed particles are distributed in the silicon rubber and are used for compressing a reaction space inside the silicon rubber; filler particles arranged around the compressed particles; wherein the filler particles are composed of molecules obtained by reacting silicon carbide whiskers having an amino structure with boron nitride having an epoxy structure. The invention is beneficial to the transmission of heat conduction phonons in the heat conduction network, thereby further improving the heat conduction coefficient of the heat conduction silicon rubber composite material, and the addition of the hollow glass microspheres reduces the overall density of the silicon rubber composite material, thereby becoming the light silicon rubber composite material.
Description
Technical Field
The invention belongs to the technical field of materials, and particularly relates to a self-assembly light heat-conducting silicone rubber composite material in a compression space and a preparation method thereof.
Background
With the rapid development of microelectronic integration technology and electronic industry, electronic components and devices are increasingly lighter, thinner and smaller, which makes their working environment increasingly trend to high temperature. If the electronic device wants to work normally, the requirement of timely heat dissipation capability is highlighted. The high-thermal-conductivity insulating material has increasingly important functions in the modern high-tech fields of electronic component heat dissipation, Light Emitting Diode (LED) illumination, solar energy, transportation, aerospace, national defense, military and the like. The high polymer material is a poor conductor of heat and electricity, and the heat conductivity coefficient is far lower than that of the traditional heat conduction materials such as ceramics, metals and the like. The filled heat conducting polymer and the intrinsic heat conducting polymer are two main heat conducting polymers. The heat conductive filler used in the filled heat conductive polymer includes metal particles, carbon-based particles, inorganic heat conductive particles, and the like. However, too much thermally conductive filler may affect the mechanical and electrical properties of the material. The requirements for the whole vehicle quality, the battery capacity and the endurance mileage are improved in the industries of automobiles, shared bicycles and the like, and the reduction of the weight of the vehicle body becomes a necessary trend. Lightweight composite materials are becoming more and more popular in the automotive industry and the shared-bicycle industry.
Disclosure of Invention
The invention aims to provide a self-assembly light heat-conducting silicone rubber composite material in a compression space, which can overcome the defect that the silicone rubber composite material has a low heat conductivity coefficient when the heat-conducting filler is low in loading capacity, and reduce the overall density of the silicone rubber composite material.
In order to solve the problems, the invention is realized by the following technical scheme: the invention provides a self-assembly light heat-conducting silicone rubber composite material in a compression space, which comprises the following components:
silicone rubber;
the compressed particles are distributed in the silicon rubber and are used for compressing a reaction space inside the silicon rubber;
filler particles arranged around the compressed particles;
wherein the filler particles are formed by self-assembling silicon carbide whiskers with an amino structure and boron nitride with an epoxy structure;
wherein, the filler particles are filled in the silicon rubber in a network structure;
wherein the structural formula of the filler particles is:
wherein A represents the surface of the silicon carbide whisker;
b represents a boron nitride surface.
In one embodiment, the compressed particles are hollow glass spheres, and the compressed particles have an average particle size of 60 microns to 80 microns.
In one embodiment, the silicon carbide whisker with an amino structure has a structural formula:
wherein A represents the surface of the silicon carbide whisker.
In one embodiment, the boron nitride having an epoxy structure has the formula:
Another object of the present invention is to provide a method for preparing a self-assembled light heat-conducting silicone rubber composite material in a compression space, which at least comprises the following steps:
modifying powdered boron nitride by using an epoxy silane coupling agent to obtain boron nitride with an epoxy structure;
modifying the powdery silicon carbide crystal whiskers by using an aminosilane coupling agent to obtain silicon carbide crystal whiskers with an amino structure;
carrying out mixing reaction on the boron nitride with the epoxy group structure, the silicon carbide whiskers with the amino group structure, the compressed particles and the silicon rubber to obtain the light heat-conducting silicon rubber composite material;
wherein, the silicon carbide whisker with an amino structure and the boron nitride with an epoxy structure undergo self-assembly reaction to form filler particles;
the filler particles are filled in the silicon rubber in a network structure;
wherein the structural formula of the filler particles is:
wherein A represents the surface of the silicon carbide whisker;
b represents a boron nitride surface.
In one embodiment, the powdered boron nitride is a hexagonal boron nitride powder having a particle size of 10-15 microns.
In one embodiment, the powdered silicon carbide whiskers have a particle size of 50-100 nanometers and a length of 10-50 micrometers
In one embodiment, the epoxysilane coupling agent is gamma- (2, 3-glycidoxy) propyltrimethoxysilane or gamma-glycidoxytrimethylsilane.
In one embodiment, the aminosilane coupling agent is gamma-aminopropyltriethoxysilane or N- (beta-aminoethyl) -gamma-aminopropyltrimethoxysilane.
In one embodiment, the silicone rubber is methyl vinyl polysiloxane having a molecular weight of 50 to 70 ten thousand.
The invention provides a self-assembly light heat-conducting silicon rubber composite material in a compression space and a preparation method thereof, wherein the compression space in which self-assembly fillers are scattered is compressed by adding compression particles such as large-particle-size hollow glass microspheres, the collision and contact probability between modified silicon carbide whiskers with amino functional groups and modified boron nitride with epoxy functional groups under the same volume loading is obviously increased, epoxy groups and amino groups after surface modification of the silicon carbide whiskers and the boron nitride are connected through chemical bonds in the processing process, and a heat-conducting network is communicated, so that heat-conducting phonons are more favorably transferred in the heat-conducting network, and the heat-conducting coefficient of the heat-conducting silicon rubber composite material is further improved. In the invention, the highest thermal conductivity of the self-assembled light silicone rubber composite material added with the compressed particles is 2.72W/mK, and the thermal conductivity of the composite material without the compressed particles is 1.78W/mK. The self-assembly light heat-conducting silicon rubber composite material in the compression space can still realize higher heat conductivity coefficient and reduce the overall density of the silicon rubber composite material when the heat-conducting filler has lower loading capacity. The preparation method has the advantages of high feasibility, easily obtained raw materials, easily understood principle and good openness and application prospect.
Drawings
FIG. 1 is a schematic flow chart of a method for preparing the composite material according to an embodiment of the present invention;
FIG. 2 is a schematic view of the internal structure of the composite material according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of the internal structure of a composite material without added compressed particles in an embodiment of the present invention.
Detailed Description
The present invention is further illustrated by the following specific examples, but it should be noted that the specific material ratios, process conditions, results, etc. described in the examples of the present invention are only for illustrating the present invention and should not be construed as limiting the scope of the present invention, and all equivalent changes and modifications made according to the spirit of the present invention should be covered by the scope of the present invention. Note that "%" shown in the description herein means "part by mass" unless otherwise specified.
In the present invention, it should be noted that, as the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. appear, their indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only for convenience of describing the present application and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first" and "second," if any, are used for descriptive and distinguishing purposes only and are not to be construed as indicating or implying relative importance.
According to the invention, the compressed particles such as large-particle-size hollow glass microspheres are added to compress the scattered reaction space of the self-assembly filler, the collision and contact probability between the modified silicon carbide whisker with an amino functional group and the modified boron nitride with an epoxy functional group under the same volume loading is obviously increased, and the epoxy group and the amino group of the modified silicon carbide whisker and the modified boron nitride with the amino functional group are connected through chemical bonds in the processing process, so that the heat conduction phonon is more favorably transferred in a heat conduction network, and the heat conduction coefficient of the heat conduction silicone rubber composite material is further improved.
Fig. 1 is a schematic flow chart of a method for preparing a self-assembled light heat-conducting silicone rubber composite material in a compression space according to an embodiment of the present invention, which at least includes the following steps:
s1, modifying the powdery boron nitride by using an epoxy silane coupling agent to obtain boron nitride with an epoxy structure;
s2, modifying the powdery silicon carbide crystal whiskers by using an aminosilane coupling agent to obtain silicon carbide crystal whiskers with amino structures;
s3, carrying out mixing reaction on the boron nitride with the epoxy group structure, the silicon carbide whiskers with the amino group structure, the compressed particles and the silicon rubber to obtain the light heat-conducting silicon rubber composite material.
Specifically, in step S1, the epoxy silane coupling agent is hydrolyzed, and the boron nitride powder and the hydrolyzed epoxy silane coupling agent are mixed at a high speed in a high-speed mixer to obtain boron nitride powder having an epoxy structure. The hydrolyzed epoxy silane coupling agent is prepared by mixing 10-12g of epoxy silane coupling agent, 2.3-2.5g of distilled water and 11-15g of ethanol, and hydrolyzing in a constant-temperature water bath tank at 30-35 ℃ for 30-50 minutes. The epoxy silane coupling agent is gamma- (2, 3-epoxypropoxy) propyl trimethoxy silane or gamma-epoxypropoxy trimethylsilane.
Specifically, in step S1, the structural formula of the boron nitride having an epoxy group structure is:
Specifically, in step S2, the aminosilane coupling agent is hydrolyzed, and the powdery silicon carbide whisker and the hydrolyzed aminosilane coupling agent are subjected to high-speed mixing treatment in a high-speed mixer to obtain powdery silicon carbide whisker having an amino structure. The hydrolyzed amino silane coupling agent is prepared by mixing 10-12g of amino silane coupling agent, 2.3-2.5g of distilled water and 11-15g of ethanol, and hydrolyzing in a constant-temperature water bath at 30-35 ℃ for 30-50 minutes. The amino silane coupling agent is gamma-aminopropyl triethoxysilane or N- (beta-aminoethyl) -gamma-aminopropyl trimethoxysilane.
Specifically, in step S2, the silicon carbide whisker having an amino structure has a structural formula:
Specifically, in step S3, the compressed particles are hollow glass spheres, and the average particle diameter of the compressed particles is 60 to 80 microns. The silicone rubber is, for example, methyl vinyl polysiloxane having a molecular weight of 64 ten thousand. The specific process of step S3 is, for example: adding 22.5-25g of boron nitride with an epoxy group structure, 7.5-8g of silicon carbide whiskers with an amino group structure, 0.41-1.64g of hollow glass microspheres and 27.51-28g of silicon rubber into a reactor, uniformly mixing in a cold manner, wherein the reactor is a torque rheometer, then heating, reacting the boron nitride with the epoxy group structure and the silicon carbide whiskers with the amino group structure in situ in the torque rheometer at a fixed temperature and rotation speed, taking out raw materials after reaction set time, and vulcanizing by a hot pressing method to obtain the light heat-conducting silicon rubber composite material. Wherein, the silicon carbide whisker with an amino structure and the boron nitride with an epoxy structure undergo a self-assembly reaction to form filler particles, the filler particles are filled in the silicon rubber in a network structure, a heat conduction network is communicated, and no break point exists, as shown in fig. 2, and the symbols in fig. 2 have the following meanings:
Specifically, in step S3, the structural formula of the filler particles is:
wherein A represents the surface of the silicon carbide whisker;
b represents a boron nitride surface.
Specifically, in step S3, the compressed particles, such as hollow glass microspheres, are added to compress the reaction space in the silicone rubber, so as to greatly increase the probability of self-assembly, i.e., reaction between the amino functional groups on the silicon carbide whiskers and the epoxy functional groups on the boron nitride, and to form network-like distribution of the filler particles, such that the heat conductive network is connected without break points, as shown in fig. 2.
In the present invention, the principle of self-assembly between the silicon carbide whisker having an amino group structure and the boron nitride having an epoxy group structure is as follows:
wherein A represents the surface of the silicon carbide whisker;
b represents a boron nitride surface.
Hereinafter, the present invention will be described in more detail by way of specific examples and comparative examples.
As shown in table 1, in one embodiment, the steps of obtaining silicon carbide whiskers a with an amino structure are as follows: weighing 10g of gamma-aminopropyltriethoxysilane, adding the gamma-aminopropyltriethoxysilane into a beaker, mixing and stirring the gamma-aminopropyltriethoxysilane with 2.5g of deionized water and 11g of absolute ethanol, putting the mixture into a constant-temperature water bath, and stirring and hydrolyzing the mixture at 30 ℃ for 30 minutes to obtain hydrolyzed gamma-aminopropyltriethoxysilane. 1000g of silicon carbide whisker is weighed, 15g of hydrolyzed gamma-aminopropyltriethoxysilane is added into a high-speed mixer for high-speed mixing treatment, the temperature of the high-speed mixer is adjusted to 120 ℃, the rotating speed is 1200rpm, and the modification time is 30 minutes. Obtaining the modified silicon carbide crystal whisker with an amino structure. And (3) shaking and washing the silicon carbide whisker with the amino structure by using absolute ethyl alcohol, standing at room temperature for 12 hours, and removing an ethanol clear solution containing residual gamma-aminopropyltriethoxysilane from the upper layer. And after repeated washing for three times, drying the silicon carbide crystal whisker A in an electrothermal blowing drying oven at 120 ℃ for 12 hours to obtain the silicon carbide crystal whisker A with the amino structure (namely the silicon carbide crystal whisker with the amino functional group grafted on the surface).
The steps for obtaining boron nitride B having an epoxy group structure are, for example: 10g of gamma-glycidoxy-trimethylsilane was weighed into a beaker and mixed with 2.3g of deionized water and 11g of absolute ethanol with stirring. And putting the mixture into a constant-temperature water bath kettle, stirring and hydrolyzing for 30 minutes at 30 ℃ to obtain hydrolyzed gamma-glycidoxy trimethylsilane. 1000g of silicon carbide whisker is weighed, 15g of hydrolyzed gamma-glycidoxy trimethylsilane is added into a high-speed mixer for high-speed mixing treatment, the temperature of the high-speed mixer is adjusted to be 120 ℃, the rotating speed is 1200rpm, and the modification time is 30 minutes. And obtaining the modified epoxy modified hexagonal boron nitride. And (3) oscillating and washing the epoxy modified boron nitride with absolute ethyl alcohol, standing at room temperature for 12 hours, and removing the supernatant containing the residual ethanol clear liquid of the gamma-glycidoxy trimethylsilane. And after washing is repeated three times, drying in an electrothermal blowing dry box at 120 ℃ for 12 hours to obtain the boron nitride B with the epoxy group structure (namely the hexagonal boron nitride with the surface grafted with the epoxy functional group).
Referring to table 1 and fig. 3, in a comparative example, 22.5g of boron nitride B having an epoxy group structure, 7.5g of silicon carbide whisker a having an amino group structure, and 27.51g of silicone rubber were taken. Adding boron nitride B with an epoxy group structure, silicon carbide whisker A with an amino group structure and silicon rubber into a torque rheometer, and cold mixing uniformly to obtain raw rubber. And recording the reaction time of the mixed raw rubber in a torque rheometer for 10 minutes, setting the rotating speed to be 50rpm, and recording the reaction temperature to be 140 ℃. And after the reaction is finished, taking out the rubber compound, sealing and storing for four hours for later use. And putting the cooled rubber compound into a mold with the temperature of 170 ℃ and the pressure of 10MPa for vulcanization and hot press molding, keeping the pressure for 15 minutes, then cold pressing for 5 minutes to prepare a silicon rubber composite material V, and carrying out a thermal conductivity coefficient test and a true density test on the obtained silicon rubber composite material V. The drawings in fig. 3 have the same meanings as those in fig. 2.
In another example, as shown in table 1, 22.5g of boron nitride B having an epoxy group structure, 7.5g of silicon carbide whisker a having an amino group structure, 0.41g of hollow glass microsphere, and 25.63g of silicone rubber were taken. Adding boron nitride B with an epoxy group structure, silicon carbide whisker A with an amino group structure, hollow glass microspheres and silicon rubber into a torque rheometer, cold-mixing uniformly, reacting the mixed raw rubber in the torque rheometer for 10 minutes, and setting the rotating speed of 50rpm to record the reaction temperature as 140 ℃. After the reaction is finished, the mixed rubber is taken out, sealed and stored for four hours for later use. And putting the cooled rubber compound into a mold with the temperature of 170 ℃ and the pressure of 10MPa for vulcanization and hot press molding, keeping the pressure for 15 minutes, and then cold pressing for 5 minutes to prepare the silicone rubber composite material W. And (3) carrying out a thermal conductivity test and a true density test on the obtained silicone rubber composite material W.
Referring to table 1, in one example, 22.5g of boron nitride B having an epoxy structure, 7.5g of silicon carbide whisker a having an amino structure, 0.82g of hollow glass microspheres, and 23.66g of silicone rubber were taken. Adding boron nitride B with an epoxy group structure, silicon carbide whisker A with an amino group structure, hollow glass microspheres and silicon rubber into a torque rheometer, cold-mixing uniformly, reacting the mixed raw rubber in the torque rheometer for 10 minutes, and setting the rotating speed of 50rpm to record the reaction temperature as 140 ℃. After the reaction is finished, the mixed rubber is taken out, sealed and stored for four hours for later use. And putting the cooled rubber compound into a mold with the temperature of 170 ℃ and the pressure of 10MPa for vulcanization and hot press molding, keeping the pressure for 15 minutes, and then cold pressing for 5 minutes to prepare the silicone rubber composite material X. And (3) carrying out a thermal conductivity test and a true density test on the obtained silicone rubber composite material X.
Referring to table 1, in one example, 22.5g of boron nitride B having an epoxy structure, 7.5g of silicon carbide whisker a having an amino structure, 1.23g of hollow glass microspheres, and 21.69g of silicone rubber were taken. Adding boron nitride B with an epoxy group structure, silicon carbide whisker A with an amino group structure, hollow glass microspheres and silicon rubber into a torque rheometer, cold-mixing uniformly, reacting the mixed raw rubber in the torque rheometer for 10 minutes, and setting the rotating speed of 50rpm to record the reaction temperature as 140 ℃. After the reaction is finished, the mixed rubber is taken out, sealed and stored for four hours for later use. And putting the cooled rubber compound into a mold with the temperature of 170 ℃ and the pressure of 10MPa for vulcanization and hot press molding, keeping the pressure for 15 minutes, and then cold pressing for 5 minutes to prepare the silicone rubber composite material Y. And carrying out a thermal conductivity coefficient test and a true density test on the obtained silicone rubber composite material Y.
Referring to table 1, in one example, 22.5g of boron nitride B having an epoxy structure, 7.5g of silicon carbide whisker a having an amino structure, 1.64g of hollow glass microspheres, and 19.72g of silicone rubber were taken. Adding boron nitride B with an epoxy group structure, silicon carbide whisker A with an amino group structure, hollow glass microspheres and silicon rubber into a torque rheometer, cold-mixing uniformly, reacting the mixed raw rubber in the torque rheometer for 10 minutes, and setting the rotating speed of 50rpm to record the reaction temperature as 140 ℃. After the reaction is finished, the mixed rubber is taken out, sealed and stored for four hours for later use. And putting the cooled rubber compound into a mold with the temperature of 170 ℃ and the pressure of 10MPa for vulcanization and hot press molding, keeping the pressure for 15 minutes, and then cold pressing for 5 minutes to prepare the silicone rubber composite material Z. And (3) carrying out a thermal conductivity test and a true density test on the obtained silicone rubber composite material Z.
TABLE 1 Performance test Table
As can be seen from the above Table 1, the thermal conductivity of the self-assembled silicone rubber composite material increases from 1.78W/mK to 2.72W/mK as the content of the hollow glass microspheres increases. While the density of the silicone rubber composite material is from 1.40g/cm3The pressure is reduced to 1.28g/cm3. The hollow glass microspheres compress the reaction space in which the self-assembly filler is scattered, the collision and contact probability between the modified silicon carbide whisker with the amino functional group and the modified boron nitride with the epoxy functional group is obviously increased under the same volume loading, and the reaction, namely self-assembly, of the amino functional group on the silicon carbide whisker and the epoxy functional group of the boron nitride is facilitated. The heat conduction phonons are more favorably transmitted in the heat conduction network, so that the heat conduction coefficient is improved.
In summary, in the present invention, a self-assembled lightweight thermal conductive silicone rubber composite material in a compression space is provided, wherein the compression particles such as large-particle-size hollow glass microspheres are added to compress a reaction space in which a self-assembled filler is scattered, collision and contact probability between modified silicon carbide whiskers with amino functional groups and modified boron nitride with epoxy functional groups is significantly increased under the same volume loading, epoxy groups and amino groups of the modified silicon carbide whiskers and boron nitride are connected by chemical bonds during processing, which is more beneficial to transfer of thermal conductive phonons in a thermal conductive network, thereby further improving thermal conductivity of the thermal conductive silicone rubber composite material. In the invention, the highest thermal conductivity of the self-assembled light silicone rubber composite material added with the compressed particles is 2.72W/mK, and the thermal conductivity of the composite material without the compressed particles is 1.78W/mK. The self-assembly light heat-conducting silicon rubber composite material in the compression space can still realize higher heat conductivity coefficient and reduce the density of the silicon rubber composite material when the load capacity of the heat-conducting filler is lower. The preparation method has the advantages of high feasibility, easily obtained raw materials, easily understood principle and good openness and application prospect.
While the invention has been described with respect to a preferred embodiment, it will be understood by those skilled in the art that the foregoing and other changes, omissions and deviations in the form and detail thereof may be made without departing from the scope of this invention. Those skilled in the art can make various changes, modifications and equivalent arrangements, which are equivalent to the embodiments of the present invention, without departing from the spirit and scope of the present invention, and which may be made by utilizing the techniques disclosed above; meanwhile, any changes, modifications and variations of the above-described embodiments, which are equivalent to those of the technical spirit of the present invention, are within the scope of the technical solution of the present invention.
Claims (10)
1. A self-assembled lightweight heat-conductive silicone rubber composite material in a compression space, comprising:
silicone rubber;
the compressed particles are distributed in the silicon rubber and are used for compressing a reaction space inside the silicon rubber;
filler particles arranged around the compressed particles;
wherein the filler particles are formed by self-assembling silicon carbide whiskers with an amino structure and boron nitride with an epoxy structure;
wherein, the filler particles are filled in the silicon rubber in a network structure;
wherein the structural formula of the filler particles is:
wherein A represents the surface of the silicon carbide whisker;
b represents a boron nitride surface.
2. The lightweight thermally conductive silicone rubber composite material of claim 1, wherein said compressed particles are hollow glass spheres, and the average particle size of said compressed particles is from 60 microns to 80 microns.
3. The lightweight heat-conducting silicone rubber composite material as claimed in claim 1, wherein the silicon carbide whiskers having an amino structure have a structural formula of:
wherein A represents the surface of the silicon carbide whisker.
4. The lightweight heat conductive silicone rubber composite material as claimed in claim 1, wherein the boron nitride having an epoxy-based structure has the structural formula:
wherein B represents a boron nitride surface.
5. A preparation method of a self-assembly light heat-conducting silicon rubber composite material in a compression space is characterized by at least comprising the following steps:
modifying powdered boron nitride by using an epoxy silane coupling agent to obtain boron nitride with an epoxy structure;
modifying the powdery silicon carbide crystal whiskers by using an aminosilane coupling agent to obtain silicon carbide crystal whiskers with an amino structure;
carrying out mixing reaction on the boron nitride with the epoxy group structure, the silicon carbide whiskers with the amino group structure, the compressed particles and the silicon rubber to obtain the light heat-conducting silicon rubber composite material;
wherein, the silicon carbide whisker with an amino structure and the boron nitride with an epoxy structure undergo self-assembly reaction to form filler particles;
the filler particles are filled in the silicon rubber in a network structure;
wherein the structural formula of the filler particles is:
wherein A represents the surface of the silicon carbide whisker;
b represents a boron nitride surface.
6. The lightweight thermally conductive silicone rubber composite material according to claim 5, wherein the powdered boron nitride is hexagonal boron nitride powder having a particle size of 10-15 microns.
7. The lightweight thermally conductive silicone rubber composite material according to claim 5, wherein the powdery silicon carbide whiskers have a particle size of 50 to 100 nanometers and a length of 10 to 50 micrometers.
8. The lightweight, thermally conductive silicone rubber composite material according to claim 5, wherein the epoxysilane coupling agent is gamma- (2, 3-glycidoxy) propyltrimethoxysilane or gamma-glycidoxytrimethylsilane.
9. The lightweight heat-conductive silicone rubber composite material as claimed in claim 5, wherein the aminosilane coupling agent is γ -aminopropyltriethoxysilane or N- (β -aminoethyl) - γ -aminopropyltrimethoxysilane.
10. The lightweight thermally conductive silicone rubber composite material according to claim 5, wherein the silicone rubber is methyl vinyl polysiloxane having a molecular weight of 50 to 70 ten thousand.
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