CN115837527A - Multi-parameter real-time monitoring optical device and method in laser processing process - Google Patents
Multi-parameter real-time monitoring optical device and method in laser processing process Download PDFInfo
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Abstract
The invention discloses an optical device and a method for multi-parameter real-time monitoring in a laser processing process. The optical device comprises a processing system and at least one path of detection system, wherein in the processing system, a processing light beam emitted by a laser is amplified and collimated through a beam expanding collimating lens, then guided to a focusing device through a first reflector group, and finally focused to the surface of a product to be processed by the focusing device, in the detection system, the detection light beam emitted by a detection light source is deflected through a scanning device, then guided to the first reflector group through a second reflector group in sequence, guided to the focusing device through the first reflector group, and focused to the surface of the product to be processed by the focusing device, the detection light beam is reflected on the surface of the product to be processed, then sequentially passes through the first reflector group, the second reflector group and the scanning device, and finally is received by a detector. The invention can accurately monitor multiple parameters in real time in the laser processing process, has high response speed and low cost, and has strong industrial practicability.
Description
Technical Field
The invention relates to the technical field of laser processing detection, in particular to an optical device and method for multi-parameter real-time monitoring in a laser processing process.
Background
The laser processing technology is a novel processing technology developed in recent decades, and due to the characteristic of high energy of a laser beam, a material can reach a very high temperature in a short time, so that the material is processed through a melting or gasification effect. In addition, the laser is a non-contact processing mode, mechanical impact and mechanical abrasion are not generated on materials, and therefore a heat affected zone is small. In addition, since the laser beam can be focused to a very small size, high-quality precision machining can be performed on various materials, and the laser beam is widely applied to various industrial and scientific research fields.
In order to further ensure the quality of laser processing, various phenomena or parameters in the processing process often need to be monitored in real time, such as: a visual image of the machining area is observed in real time to correct machining parameters, feedback control of the average power of the laser output by real-time temperature monitoring, and the like. These parameters are also typically monitored by optical detection or imaging, but different objects to be monitored often have different wavelengths. For example, visual imaging generally uses a visible light band for detection, and temperature measurement generally uses an infrared band for detection, wherein detection wavelengths in different temperature ranges are different. The laser wavelength as the processing light source is mainly 355nm, 532nm and 1064nm, and is almost different from the wavelengths of the detection light sources, which causes the problem that the processing light source and the detection light source cannot be focused on the same position due to the dispersion effect when passing through the same set of optical system, and thus cannot be accurately monitored, even cannot be monitored.
The achromatic lens is an optical device specially designed for eliminating the dispersion effect of a multi-wavelength light source, but for high-power laser, the type of glass used by a focusing lens in laser equipment is limited due to the thermal lens effect of a common glass material, so that the focusing lens cannot realize achromatic design. The other method is an area array scanning mode, an area array is scanned near a processing area through a galvanometer, and then a final detection result is obtained through analysis and processing of a detector.
The invention patent with publication number CN112828452B discloses a two-dimensional laser cloud scanning imaging device, which uses a single or two lasers to emit scanning imaging laser and processing laser, and realizes two-dimensional scanning imaging of the surface of a sample piece through scanning of a processing optical path galvanometer. Since the two wavelengths are the same or close, the effect of dispersion effects can be avoided. However, in the case of a single laser, since the scanning imaging laser is a low-power laser and is output in a time-division manner with respect to the processing laser, real-time monitoring cannot be achieved. Although real-time monitoring can be achieved using two lasers, the determined wavelength limits the range of applications for this imaging device. In addition, if the adopted laser source is infrared or ultraviolet, a special detector is needed to realize the imaging function, and the cost is increased.
Disclosure of Invention
The invention aims to provide an optical device and a method for real-time monitoring of multiple parameters in a laser processing process, aiming at the existing technical situation, so that the multiple parameters can be accurately monitored in real time in the laser processing process, and the optical device and the method have the advantages of high response speed, low cost and strong industrial practicability.
In order to achieve the purpose, the invention adopts the following technical scheme:
a multi-parameter real-time monitoring optical device in a laser processing process comprises a processing system and at least one path of detection system;
the processing system comprises a laser, a beam expanding collimating lens, a first reflecting mirror group and a focusing device, wherein processing light beams emitted by the laser are amplified and collimated by the beam expanding collimating lens, are guided to the focusing device by the first reflecting mirror group, and are finally focused to the surface of a product to be processed by the focusing device to form a processing action point;
the detection system comprises a detector, a detection light source, a scanning device and a second reflector group, wherein detection light beams emitted by the detection light source are deflected by the scanning device, then are guided to a first reflector group through the second reflector group in sequence, are guided to a focusing device through the first reflector group, and are focused to the surface of a product to be processed by the focusing device, so that detection action points coincident with the processing action points are formed, the detection light beams are reflected on the surface of the product to be processed, and then sequentially pass through the first reflector group, the second reflector group and the scanning device, and finally are received by the detector.
Further, the scanning device is a galvanometer, a piezoelectric scanner or an acousto-optic modulator.
Further, the focusing device is of a galvanometer scanning type or an objective lens type.
Further, the laser is an ultrafast laser or a non-ultrafast laser, and the wavelength of the laser is an ultraviolet band or a visible light band or an infrared band.
Furthermore, the first reflector group comprises a first reflector and a second reflector, the first reflector is used for guiding light to the second reflector, and the second reflector is used for guiding light to the focusing device.
Further, the second reflecting mirror group comprises a third reflecting mirror, and the third reflecting mirror is used for guiding light to the second reflecting mirror.
A multi-parameter real-time monitoring method in the laser processing process adopts the multi-parameter real-time monitoring optical device in the laser processing process, and comprises the following steps: carry out the laser beam machining operation through processing system, simultaneously, carry out the real-time supervision of different parameters through each detecting system, wherein:
when the focusing device of the processing system is in an objective lens type, the method comprises the following steps: correcting the scanning device of each detection system to enable the detection action point to coincide with the processing action point, then carrying out laser processing operation, and executing real-time monitoring of different parameters;
when the focusing device of the processing system is of a galvanometer scanning type, the method comprises the following steps:
s1, correcting a focusing device of a processing system to enable a processing action point to meet processing requirements;
s2, correcting the scanning device of each detection system to obtain a compensation relation between a detection action point and a corresponding processing action point;
and S3, executing processing scanning by the processing system along the processing path to carry out laser processing operation, executing compensation scanning by each detection system along the processing path according to the compensation relation obtained in the step S2, enabling the detection action point of each detection system to be always coincident with the processing action point of the processing system, and executing real-time monitoring of different parameters.
Furthermore, after the scanning device of each detection system is corrected, real-time monitoring of different parameters is executed, and the method comprises the following steps: the scanning device drives the detection light beam to perform high-speed two-dimensional scanning, and the detector identifies and analyzes the detection light beam reflected from the surface of the product to be processed to obtain a final monitoring result of the corresponding parameter.
The beneficial effects of the invention are as follows:
compared with the prior art, the invention adds the scanning device in the detection system, can deflect the detection light beam by a specific angle, further enables the detection light beam and the processing light beam to be transmitted in a non-coaxial way, corrects the scanning device, and ensures that the detection action point and the processing action point are superposed on the surface of a product to be processed, thereby avoiding the influence of dispersion effect, realizing the accurate real-time monitoring of multiple parameters in the laser processing process, and having high response speed, low cost and strong industrial practicability.
Drawings
FIG. 1 is a schematic diagram of an optical path structure of a multi-parameter real-time monitoring optical device in a laser processing process according to the present invention;
FIG. 2 is a schematic diagram of an optical path structure of an optical device for coaxial transmission of a processing beam and a probe beam;
FIG. 3 is a schematic diagram of the dispersion effect in an optical device for coaxial transmission of a processing beam and a probe beam, wherein: (a) a focusing schematic of the processing beam; (b) Schematic diagrams of processing action points and monitoring action points on the surface of a product to be processed.
Description of the labeling: 1. the device comprises a laser 2, a beam expanding collimating mirror 3, a first reflector 4, a second reflector 5, a focusing device 6, a detector 7, a detection light source 8, a scanning device 9 and a third reflector.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific examples described herein are intended to be illustrative only and are not intended to be limiting.
Referring to fig. 1, an optical device for real-time monitoring of multiple parameters in a laser processing process includes a processing system and at least one detection system.
The processing system comprises a laser 1, a beam expanding collimating lens 2, a first reflector group and a focusing device 5, wherein processing light beams emitted by the laser 1 are amplified and collimated through the beam expanding collimating lens 2, then guided to the focusing device 5 through the first reflector group, and finally focused to the surface of a product to be processed through the focusing device 5 to form a processing action point.
In the above technical scheme:
the laser 1 is an ultrafast laser or a non-ultrafast laser, the wavelength of the laser is an ultraviolet band or a visible light band or an infrared band, and the specific type selection is subject to the process requirements;
the first reflector group comprises a first reflector 3 and a second reflector 4, the first reflector 3 is used for guiding light to the second reflector 4, and the second reflector 4 is used for guiding light to the focusing device 5;
the focusing device 5 is of a galvanometer scanning type or an objective lens type, and the specific type is based on the process requirement.
The detection system comprises a detector 6, a detection light source 7, a scanning device 8 and a second reflector group, wherein detection light beams emitted by the detection light source 7 are deflected by the scanning device 8, then are guided to a first reflector group through the second reflector group in sequence, are guided to a focusing device 5 through the first reflector group, and are focused to the surface of a product to be processed by the focusing device 5, so that detection action points coincident with the processing action points are formed, the detection light beams are reflected on the surface of the product to be processed, and then sequentially pass through the first reflector group, the second reflector group and the scanning device 8, and are finally received by the detector 6.
In the above technical scheme:
the detector 6 is reasonably selected according to the monitored object, such as: the vision monitoring adopts CCD (charge coupled device), the temperature sensing adopts thermocouple or infrared thermometer, etc.;
the detection light source 7 also needs to be reasonably selected according to the monitored object, such as: the visual monitoring adopts a light source with the wavelength of 480nm, 650nm or 850nm, the low-temperature measurement adopts an infrared light source with the wavelength of 10 mu m, the high-temperature measurement adopts an infrared light source with the wavelength of 1.0 mu m, and other temperature regions can adopt infrared light sources with the wavelength of 1.6 mu m, 2.2 mu m or 3.9 mu m;
the scanning device 8 is a galvanometer, a piezoelectric scanner or an acousto-optic modulator, and the specific type selection is based on the process requirement. The galvanometer is a double-shaft scanning device, so that the speed is high, and microsecond-level response can be realized; although the piezoelectric scanner is slower than the galvanometer, the piezoelectric scanner can still meet the requirements of static detection such as visual monitoring and the like, and has simple configuration, flexible and changeable system and economic price; the response speed of the acousto-optic modulator reaches the nano-second level, so that the requirement of high-speed real-time monitoring can be met;
the second mirror group comprises a third mirror 9, the third mirror 9 being adapted to guide light to the second mirror 4.
Referring to fig. 1, a multi-parameter real-time monitoring method in a laser processing process, which uses the multi-parameter real-time monitoring optical device in the laser processing process, carries out laser processing operations through processing systems, and simultaneously, executes real-time monitoring of different parameters through each detection system, wherein:
when the focusing device 5 of the processing system is in an objective lens type, the laser focus is static, the processing operation can be realized only by moving the displacement table of the product to be processed, and the operation steps are as follows: correcting the scanning device 8 of each detection system to enable the detection action point to coincide with the processing action point, then carrying out laser processing operation, and carrying out real-time monitoring of different parameters;
when the focusing device 5 of the processing system is in a galvanometer scanning type, the processing action point realizes processing operation by depending on the driving of the galvanometer scanning type focusing device 5, the track of the processing action point on the surface of a product to be processed is continuously changed, and the operation steps are as follows:
s1, correcting a focusing device 5 of a processing system to enable a processing action point to meet processing requirements;
s2, correcting the scanning device 8 of each detection system to obtain a compensation relation between a detection action point and a corresponding processing action point;
and S3, executing processing scanning by the processing system along the processing path to carry out laser processing operation, executing compensation scanning by each detection system along the processing path according to the compensation relation obtained in the step S2, enabling the detection action point of each detection system to be always coincident with the processing action point of the processing system, and executing real-time monitoring of different parameters.
In the above technical solution, in order to obtain the compensation relationship (including distance, direction, and other elements) between the detection action point and the corresponding processing action point, the scanning device 8 of each detection system needs to be corrected to form a compensation value between the detection action point and the corresponding processing action point, however, the number of the correction points is limited, and the limited correction points need to be enlarged to the whole processing breadth by a fitting method.
In addition, because the execution time of the scanning devices 8 of each detection system is different, a coordination command needs to be issued to the controller through the upper computer so as to ensure the consistency of different detection action points and processing action points in time.
Preferably, in order to reduce the alignment difficulty, the scanning device 8 of each detection system is corrected and then real-time monitoring of different parameters is performed, including the following steps: the detection light beam is driven by the scanning device 8 to carry out high-speed two-dimensional scanning, and then the detector 6 identifies and analyzes the detection light beam reflected from the surface of the product to be processed to obtain a final monitoring result of the corresponding parameter.
Referring to fig. 2-3, in contrast, in an optical device in which a processing light beam and a probe light beam are transmitted coaxially, since the wavelengths of the detection light source and the processing light source are different, the optical device is obviously affected by the dispersion effect in the same optical path system.
Specifically, in order to ensure the processing quality, the focusing device 5 of the processing system needs to be matched with the processing light source, and the detection light sources with other wavelengths can generate axial offset and vertical axis offset after passing through the optical path system, and finally, the processing action point and the detection action point are inconsistent on the surface of a product to be processed.
In summary, the scanning device 8 is added in the detection system, so that the detection light beam can deflect a specific angle, the detection light beam and the processing light beam are transmitted in a non-coaxial way, the scanning device 8 is corrected, the detection action point and the processing action point are ensured to be superposed on the surface of a product to be processed, the influence of a dispersion effect is avoided, the multi-parameter is accurately monitored in real time in the laser processing process, and the laser processing system is high in response speed, low in cost and high in industrial practicability.
The present invention is not limited to the above embodiments, and those skilled in the art can implement the present invention in other various embodiments according to the disclosure of the present invention, so that all designs and concepts of the present invention can be changed or modified without departing from the scope of the present invention.
Claims (8)
1. The utility model provides an optical device is monitored in real time to many parameters in laser beam machining process which characterized in that: comprises a processing system and at least one detection system;
the processing system comprises a laser, a beam expanding collimating lens, a first reflector group and a focusing device, wherein a processing light beam emitted by the laser is amplified and collimated by the beam expanding collimating lens, is guided to the focusing device by the first reflector group, and is finally focused to the surface of a product to be processed by the focusing device to form a processing action point;
the detection system comprises a detector, a detection light source, a scanning device and a second reflector group, wherein detection light beams emitted by the detection light source are deflected by the scanning device, then are guided to a first reflector group through the second reflector group in sequence, are guided to a focusing device through the first reflector group, and are focused to the surface of a product to be processed by the focusing device, so that detection action points coincident with the processing action points are formed, the detection light beams are reflected on the surface of the product to be processed, and then sequentially pass through the first reflector group, the second reflector group and the scanning device, and finally are received by the detector.
2. The optical device for multi-parameter real-time monitoring in laser processing according to claim 1, wherein: the scanning device is a galvanometer, a piezoelectric scanner or an acousto-optic modulator.
3. The optical device for multi-parameter real-time monitoring in laser processing according to claim 1, wherein: the focusing device is of a galvanometer scanning type or an objective lens type.
4. The optical device for multi-parameter real-time monitoring in laser processing according to claim 1, wherein: the laser is an ultrafast laser or a non-ultrafast laser, and the wavelength of the laser is an ultraviolet band or a visible light band or an infrared band.
5. The optical device for multi-parameter real-time monitoring in laser processing according to claim 1, wherein: the first reflector group comprises a first reflector and a second reflector, the first reflector is used for guiding light to the second reflector, and the second reflector is used for guiding light to the focusing device.
6. The optical device for multi-parameter real-time monitoring in laser processing according to claim 5, wherein: the second reflector group comprises a third reflector for guiding light to the second reflector.
7. A multi-parameter real-time monitoring method in the laser processing process adopts the multi-parameter real-time monitoring optical device in the laser processing process of any one of claims 1 to 4, which is characterized in that: the method comprises the following steps: carry out the laser beam machining operation through processing system, simultaneously, carry out the real-time supervision of different parameters through each detecting system, wherein:
when the focusing device of the processing system is in an objective lens type, the method comprises the following steps: correcting the scanning device of each detection system to enable the detection action point to coincide with the processing action point, then carrying out laser processing operation, and executing real-time monitoring of different parameters;
when the focusing device of the processing system is of a galvanometer scanning type, the method comprises the following steps:
s1, correcting a focusing device of a processing system to enable a processing action point to meet processing requirements;
s2, correcting the scanning device of each detection system to obtain a compensation relation between a detection action point and a corresponding processing action point;
and S3, executing processing scanning by the processing system along the processing path to carry out laser processing operation, executing compensation scanning by each detection system along the processing path according to the compensation relation obtained in the step S2, enabling the detection action point of each detection system to be always coincident with the processing action point of the processing system, and executing real-time monitoring of different parameters.
8. The real-time multi-parameter monitoring method of claim 7, wherein: after correcting the scanning device of each detection system, the real-time monitoring of different parameters is executed, and the method comprises the following steps: the scanning device drives the detection light beam to perform high-speed two-dimensional scanning, and the detector identifies and analyzes the detection light beam reflected from the surface of the product to be processed to obtain a final monitoring result of the corresponding parameter.
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