CN115820033A - High-temperature-resistant ink for chip screen printing silk screen and preparation method thereof - Google Patents
High-temperature-resistant ink for chip screen printing silk screen and preparation method thereof Download PDFInfo
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- 238000002360 preparation method Methods 0.000 title abstract description 11
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 47
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- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 8
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 7
- 239000000049 pigment Substances 0.000 claims description 7
- 229920000570 polyether Polymers 0.000 claims description 7
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 6
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 6
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- Inks, Pencil-Leads, Or Crayons (AREA)
Abstract
The application relates to the technical field of chip printing ink, in particular to high-temperature-resistant ink for a silk screen of a chip screen printing and a preparation method thereof. The high-temperature-resistant printing ink for the screen printing of the chip comprises the following raw materials in parts by weight: 50-60 parts of organic silicon resin, 10-20 parts of epoxy resin, 5363 parts of curing agent 2~6 parts, 3242 parts of auxiliary agent 2~8 parts and 40-60 parts of solvent 0~5 parts.
Description
Technical Field
The application relates to the technical field of chip printing ink, in particular to high-temperature-resistant ink for a chip screen printing silk screen and a preparation method thereof.
Background
The qualified chip can be prepared only by SMT treatment in the preparation process after the chip is produced. Before SMT treatment, a layer of protective ink is coated on the surface of the chip to protect the chip from damage during and after the SMT treatment. The general protective ink mainly comprises UV system resin ink, wherein the UV system resin ink comprises resin, single polymer, additive and photoinitiator, and the UV system resin ink is rapidly cured and becomes the first choice of most merchants. However, the temperature can reach 220-260 ℃ during the SMT process, the color of the cured protective ink layer can be changed under the high-temperature condition, and when the SMT process time is a little longer, even the protective ink layer can fall off, so that improvement is needed.
Disclosure of Invention
In order to solve the problem of influence of high temperature on a protective ink layer in the SMT treatment process, the application provides high-temperature-resistant ink for a chip screen printing silk screen and a preparation method of the high-temperature-resistant ink.
In a first aspect, the present application provides a high temperature resistant ink for a screen printing screen of a chip, which adopts the following technical scheme:
the high-temperature-resistant ink for the screen printing of the chip comprises the following raw materials in parts by weight:
50-60 parts of organic silicon resin
10 to 20 portions of epoxy resin
2 to 6 portions of curing agent
1-2 parts of assistant
40 to 60 portions of solvent
0-5 parts of pigment.
Preferably, the organic silicon resin is polymethylphenyl silicone resin and polyaryl organic silicon resin, wherein the weight part of the polymethylphenyl silicone resin is 20-25 parts, and the weight part of the polyaryl organic silicon resin is 30-35 parts;
preferably, the epoxy value of the epoxy resin is 2 to 10eq/100g.
By adopting the technical scheme, the prepared high-temperature-resistant ink for the chip screen printing silk screen has good high-temperature resistance and bonding performance. The organic silicon resin can improve the high-temperature resistance of the ink, so that the chip does not turn yellow or bubble in the SMT process. The silicone resin can improve high temperature resistance, but can cause the adhesive property of the ink to be reduced, so that the ink cannot be stably attached to the surface of the chip. In contrast, in the present application, the adhesive property and printing property of the ink system are further improved by adding an epoxy resin having a specific epoxy value to a silicone resin. When the epoxy resin and the organic silicon resin are cured, a highly cross-linked network structure can be generated, the network structure can be stably attached to the surface of a chip, and the epoxy resin and the organic silicon resin have good strength and are not easy to discolor or fall off.
The curing agent enables the organic silicon resin and the epoxy resin to be cured into a film, and improves the hardness, the heat-resistant temperature and the bonding fastness of the cured ink layer.
Preferably, the high-temperature resistant ink for the screen printing of the chip also comprises 5 to 10 parts by weight of vinyl ester resin, and the viscosity is 800 to 5000cps at the temperature of 25 ℃.
By adopting the technical scheme, the corrosion resistance and the bonding property of an ink system are improved, and meanwhile, the glossiness of the ink can also be improved by the vinyl ester resin. The vinyl ester resin and the epoxy resin can form a three-dimensional network structure with stable structure and good bonding performance after curing, and the bonding stability of the ink layer and the chip is improved.
Preferably, the high-temperature-resistant ink for the screen printing screen of the chip also comprises 1-2 parts by weight of a defoaming agent, wherein the defoaming agent is a polyether modified organic silicon defoaming agent.
By adopting the polyether modified organic silicon defoaming agent, bubbles generated in the process of preparing the printing ink are reduced, so that the printing ink system is finer and smoother, and the printing ink layer with a smooth surface is obtained in the printing process.
Preferably, the auxiliary agent is an antioxidant or an ultraviolet resistant agent.
By adopting the technical scheme, the anti-aging performance of the printing ink is improved, the influence of external environment change on the printing ink layer on the surface of the chip is reduced, the printing ink layer can keep good luster for a long time, and the color is not easy to change.
Preferably, the high-temperature resistant ink for the screen printing screen of the chip also comprises 5 to 10 parts by weight of lubricant, wherein the lubricant is prepared from talcum powder, glycerol and tween according to the weight ratio of (10 to 15): (5-10): 3 is prepared.
By adopting the lubricant, the printing ink is smooth and free of blockage in the silk-screen printing process, and meanwhile, the fluidity among the organic silicon resin, the epoxy resin and the vinyl ester resin is improved, so that the organic silicon resin, the epoxy resin and the vinyl ester resin are mutually permeated, and the film forming is facilitated. The talcum powder improves the fluidity of the ink system, and simultaneously can further improve the strength of the ink layer, and the glycerol and the tween can further reduce the surface tension of the organic silicon resin, the epoxy resin and the vinyl ester resin, promote the fusion of the organic silicon resin, the epoxy resin and the vinyl ester resin, and improve the high temperature resistance, the bonding performance and the printing performance of the ink.
Preferably, the high-temperature-resistant ink for the chip screen printing screen also comprises 5-10 parts by weight of melamine formaldehyde resin, and the density of the melamine formaldehyde resin is 1.13-1.14 g/cm 3 。
The high temperature resistance, the adhesion and the water resistance of the ink can be further improved by adding the melamine formaldehyde resin into the ink.
Preferably, the high-temperature resistant ink for the chip screen printing screen further comprises 1-2 parts by weight of a leveling agent, wherein the leveling agent is BD-3033H, BD-2051, BD-3232, BD-252 or BD-3310.
The flowability of the silicone resin, the epoxy resin and the melamine formaldehyde resin is different, which is not beneficial to the flowing of the printing ink. By adopting the flatting agent, the surface tension of the organic silicon resin, the epoxy resin and the melamine formaldehyde resin in the process of preparing the printing ink is reduced, the leveling property and the uniformity of the printing ink are improved, and the silk screen sound bolt of the printing ink is facilitated, so that the protective printing ink layer has good heat resistance and bonding property.
Preferably, the solvent is at least one of toluene, ethyl acetate, xylene, and ethanol.
By adopting the solvent, the organic silicon resin and the epoxy resin can be mixed favorably, and the organic silicon resin, the epoxy resin, the auxiliary agent and the pigment in the ink can be mixed uniformly to obtain the ink with a stable system.
Preferably, the curing agent is naphthenate and a polyamide compound according to the weight ratio of (1-2): 1, mixing to obtain the product.
By adopting the curing agent, the ink system can be rapidly cured after printing and can be stably bonded with the surface of a chip. The curing degree of the organic silicon resin and the epoxy resin is controlled by controlling the dosage ratio of the naphthenate to the polyamide compound, so that the cured ink has good heat resistance, bonding strength and hardness.
Preferably, the naphthenate is zinc naphthenate, cobalt naphthenate, or lead naphthenate.
Preferably, the polyamide-type compound is polyamide curing agent 650, polyamide curing agent 651, or polyamide curing agent 300.
In a second aspect, the present application provides a method for preparing a high temperature resistant ink for a screen printing screen of a chip, which adopts the following technical scheme:
a preparation method of high-temperature-resistant ink for a screen printing screen of a chip comprises the following preparation steps:
s1, uniformly mixing a solvent, organic silicon resin and other resins, adding the mixture into a reaction device for dispersion, then adding epoxy resin and a lubricant while stirring, vacuumizing, grinding and stirring until the mixture is viscous, wherein the viscosity is 1000-1100 cps;
and S2, breaking vacuum, adding the raw materials except the auxiliary agent, the pigment and the curing agent, vacuumizing, grinding and stirring, breaking vacuum, and discharging to obtain the high-temperature-resistant ink for the chip screen printing silk screen.
By adopting the technical scheme, a fine and uniform ink system is obtained, and the ink system can be stored for a long time without layering. Wherein, the organic silicon resin is mixed with the solvent, so that part of organic silicon is dissolved, and the subsequent grinding is convenient. The compatibility between the silicone resin and the epoxy resin is poor, so that the solvent and the silicone resin are mixed and stirred firstly to disperse the silicone resin, reduce the cohesion between silicone resin molecules, and then the epoxy resin and the lubricant are added into the dispersed silicone resin to improve the compatibility between the silicone resin and the epoxy resin. In order to further ensure that the organic silicon resin and the epoxy resin can be stably stored, the viscosity of a finished product after grinding reaches 1000-1100 cps by a vacuum-pumping grinding mode, so that the organic silicon resin and the epoxy resin can stably coexist and are convenient to use.
Preferably, the grinding and stirring speed in the step S1 is 2500 to 3000r/min.
In summary, the present application has the following beneficial effects:
1. according to the high-temperature-resistant ink for the silk screen printing of the chip, the organic silicon resin, the epoxy resin, the curing agent, the auxiliary agent, the solvent and the pigment are adopted, wherein the organic silicon resin is polymethyl silicon resin and polyaryl organic silicon resin, the epoxy value of the epoxy resin is 2-10 eq/100g, and the high-temperature-resistant ink for the silk screen printing of the chip can be prepared, so that the high-temperature-resistant performance and the bonding performance of the ink can be improved, and the ink can be used at the temperature of 260 ℃ without yellowing or foaming. Under the action of curing agent, the organic silicon resin and the epoxy resin can form a three-dimensional network structure and stably attach to the surface of the chip to form an ink layer, the ink layer has good heat resistance,
2. vinyl ester resin is added into the high-temperature-resistant printing ink raw material for the chip screen printing silk screen, so that the glossiness of the printing ink is further improved, meanwhile, the alkenyl ester resin and the epoxy resin are cured to form a three-dimensional network structure with stable structure and good bonding performance, and the bonding stability of the printing ink layer and the chip is improved.
3. Naphthenate and polyamide compounds are mixed according to the weight ratio of (1-2): 1, mixing to prepare a curing agent, and controlling the curing degree of the organic silicon resin and the epoxy resin, so that the cured ink has good heat resistance, bonding strength and hardness.
Detailed Description
Examples
Example 1
A high-temperature-resistant ink for a chip screen printing screen is prepared by the following steps:
s1, uniformly mixing 40 parts of solvent and 50 parts of organic silicon resin according to parts by weight, adding the mixture into a reaction device for dispersion, adding 10 parts of epoxy resin while stirring, vacuumizing, grinding and stirring to be viscous, wherein the viscosity is 1000cps, and the stirring and grinding speed is 2500r/min;
and S2, breaking vacuum, adding 2 parts of auxiliary agent and 2 parts of curing agent, vacuumizing, grinding and stirring, breaking vacuum, and discharging to obtain the high-temperature-resistant ink for the chip screen printing silk screen.
The solvent is toluene, the organic silicon resin is 20 parts of polymethylphenyl silicone resin and 50 parts of polyaryl organic silicon resin, the auxiliary agent is an oxidizing agent, and the curing agent comprises 1 part by weight of silane coupling agent KH550 and 1 part by weight of polyamide curing agent 651.
The polymethyl phenyl silicone resin is purchased from new materials of Sihai, hubei Longsheng, inc., and has a viscosity of 12-30S and a model number of 1040 under the conditions of coating-4 cups and 25 ℃.
The polyaryl organic silicon resin is phenyl silicon resin which is purchased from new materials, inc. of Dongchang mountain and has the model number of CY-D2.
The epoxy value of the epoxy resin was 2eq/100g.
Examples 2 to 7 differ from example 1 in that: the types, amounts and test parameters of some of the raw materials were different, and the rest of the experimental procedures were the same as those of example 1. The types, amounts and test parameters of the raw materials used in examples 1 to 7 are shown in Table 1:
TABLE 1 kinds, amounts and test parameters of raw materials used in examples 1 to 7
Example 8
The high-temperature resistant ink for the screen printing screen of the chip is different from the high-temperature resistant ink in the embodiment 1 in that: the high-temperature-resistant ink for the chip screen printing screen also comprises 5 parts by weight of vinyl ester resin, the viscosity of the vinyl ester resin is 800cps at 25 ℃, the vinyl ester resin and the organic silicon resin are added together, and the types, the using amounts and the experimental steps of the rest raw materials are uniform, and the same as in example 1.
Example 9
The high-temperature resistant ink for the screen printing screen of the chip is different from the high-temperature resistant ink in the embodiment 1 in that: the high-temperature resistant ink for the chip screen printing screen also comprises 10 parts by weight of vinyl ester resin, the viscosity of the vinyl ester resin is 5000cps at 25 ℃, the vinyl ester resin and the organic silicon resin are added together, and the types, the using amounts and the experimental steps of the other raw materials are uniform, and the same as in example 1.
Example 10
The high-temperature resistant ink for the screen printing screen of the chip is different from the high-temperature resistant ink in the embodiment 1 in that: the high-temperature-resistant ink for the screen printing of the chip screen also comprises 1 part by weight of a defoaming agent, wherein the defoaming agent is a polyether modified organic silicon defoaming agent and is added together with a curing agent, and the types, the using amounts and the experimental steps of the rest raw materials are uniform, and are consistent with those in example 1.
The polyether modified organic silicon defoamer is purchased from Tianjin Daxu chemical industry Co., ltd, and is of a high-grade.
Example 11 (A + C)
The high-temperature resistant ink for the screen printing screen of the chip is different from the high-temperature resistant ink in the embodiment 8 in that: the high-temperature-resistant ink for the screen printing of the chip screen also comprises 2 parts by weight of a defoaming agent, the defoaming agent is a polyether modified organic silicon defoaming agent and is added together with a curing agent, and the types, the using amounts and the experimental steps of the rest raw materials are uniform, and the embodiment 8 is consistent.
The polyether modified organic silicon defoamer is purchased from Shandong energy-gathering chemical Co., ltd, and has the model of JN-2085.
Example 12
The high-temperature resistant ink for the screen printing screen of the chip is different from the high-temperature resistant ink in the embodiment 1 in that: the high-temperature-resistant printing ink for the chip screen printing silk screen also comprises 5 parts by weight of lubricant, wherein each part of lubricant is prepared from talcum powder, glycerol and tween according to the weight ratio of 10:5:3, adding the mixture and a curing agent, and uniformly mixing the types, the using amounts and the experimental steps of the rest raw materials, wherein the experimental steps are the same as those in the example 1.
Example 13
The high-temperature resistant ink for the screen printing screen of the chip is different from the high-temperature resistant ink in the embodiment 1 in that: the high-temperature-resistant printing ink for the chip screen printing silk screen also comprises 10 parts by weight of lubricant, wherein each part of lubricant is prepared from talcum powder, glycerol and tween according to a weight ratio of 15:10:3, adding the curing agent, and uniformly mixing the types, the using amounts and the experimental steps of the rest raw materials, wherein the preparation method is as in example 1.
Example 14
The high-temperature resistant ink for the screen printing screen of the chip is different from the high-temperature resistant ink in the embodiment 13 in that: the high-temperature resistant ink for the chip screen printing screen also comprises 5 parts by weight of vinyl ester resin, the viscosity of the vinyl ester resin is 800cps at 25 ℃, the vinyl ester resin and the organic silicon resin are added together, and the types, the using amounts and the experimental steps of the other raw materials are uniform, and the embodiment 13 is consistent.
Example 15
The high-temperature resistant ink for the screen printing screen of the chip is different from the high-temperature resistant ink in the embodiment 1 in that: the high-temperature-resistant ink for the chip screen printing silk screen also comprises 5 parts by weight of melamine-formaldehyde resin, the density of the melamine-formaldehyde resin is 1.14g/cm & lt 3 & gt, the melamine-formaldehyde resin and the organic silicon resin are added together, and the types, the using amounts and the experimental steps of the rest raw materials are uniform, and are consistent with those in example 1.
Example 16
The high-temperature resistant ink for the screen printing screen of the chip is different from the high-temperature resistant ink in the embodiment 8 in that: the high-temperature resistant ink for the chip screen printing screen also comprises 10 parts by weight of melamine formaldehyde resin, the density of the melamine formaldehyde resin is 1.14g/cm < 3 >, the melamine formaldehyde resin and the organic silicon resin are added together, and the types, the using amounts and the experimental steps of the other raw materials are uniform, and are consistent with those in example 8.
Example 17
The high-temperature resistant ink for the screen printing screen of the chip is different from the high-temperature resistant ink in the embodiment 13 in that: the high-temperature resistant ink for the chip screen printing screen also comprises 10 parts by weight of melamine formaldehyde resin, the density of the melamine formaldehyde resin is 1.13g/cm < 3 >, the melamine formaldehyde resin and the organic silicon resin are added together, and the types, the using amounts and the experimental steps of the other raw materials are uniform, and are consistent with those in example 13.
Example 18
The high-temperature resistant ink for the screen printing screen of the chip is different from the high-temperature resistant ink in the embodiment 1 in that: the high-temperature-resistant ink for the chip screen printing silk screen further comprises 1 part by weight of a flatting agent, the flatting agent is BD-3033H, and the types and the use amounts of the rest raw materials are consistent with those of the experiment step in example 1.
Example 19
The high-temperature resistant ink for the screen printing screen of the chip is different from the high-temperature resistant ink in the embodiment 8 in that: the high-temperature-resistant ink for the chip screen printing silk screen further comprises 2 parts by weight of a flatting agent, wherein the flatting agent is BD-2051, the flatting agent and a curing agent are added together, and the types, the using amounts and the experimental steps of the other raw materials are uniform, and are consistent with those in example 8.
Example 20
The high-temperature resistant ink for the screen printing screen of the chip is different from the high-temperature resistant ink in the embodiment 14 in that: the high-temperature-resistant ink for the chip screen printing silk screen further comprises 2 parts by weight of a flatting agent, wherein the flatting agent is BD-3232 and is added together with a curing agent, and the types, the using amounts and the experimental steps of the rest raw materials are uniform, and are consistent with those in example 14.
Example 21
The high-temperature resistant ink for the screen printing screen of the chip is different from the high-temperature resistant ink in the embodiment 1 in that: the curing agent is naphthenate and a polyamide compound according to the weight ratio of 1:1, adding the mixture and a curing agent, and uniformly mixing the types, the using amounts and the experimental steps of the rest raw materials, wherein the types, the using amounts and the experimental steps are consistent in the example 1.
The naphthenate is cobalt naphthenate.
The polyamide-type compound is a polyamide curing agent 651.
Example 22
The high-temperature resistant ink for the screen printing screen of the chip is different from the high-temperature resistant ink in the embodiment 8 in that: the curing agent is naphthenate and polyamide compound according to the weight ratio of 2:1, adding the mixture and a curing agent, and uniformly mixing the types, the using amounts and the experimental steps of the rest raw materials, wherein the types, the using amounts and the experimental steps are consistent in the example 1.
The naphthenate is zinc naphthenate.
The polyamide-type compound is a polyamide curing agent 650.
Comparative example
Comparative example 1
A high temperature resistant ink for use in a screen printing screen for die-casting, this comparative example differing from example 1 in that: the polyacrylic acid resin is replaced by the same amount of epoxy resin, and the types and the amounts of the other raw materials are consistent with those of the experimental steps in the example 1.
The polyurethane resin is purchased from Jiangsu Pu Le Si Biotechnology Limited company, and the density is 1.005g/cm 3 。
Comparative example 2
A high temperature resistant ink for use in a screen printing screen for die-casting, this comparative example differing from example 1 in that: the same amount of silicone resin was replaced with polyurethane resin, and the kinds and amounts of the remaining raw materials were the same as those in example 1.
The polyurethane resin is purchased from Jiangsu Pu Le Si Biotech Co., ltd, and has a density of 1.005g/cm 3 。
Performance test
And carrying out high-temperature storage test, salt spray test, poaching test, pencil hardness test and high-temperature welding simulation test on the prepared ink.
Detection method/test method
The inks obtained in examples 1 to 22 and comparative examples 1 to 2 were printed on the surface of the chip by screen printing, dried and cured to obtain a printed chip, the squeegee slope of the printing was 65 degrees, the printing speed was 350 mm/sec, the screen of the screen was 300 mesh, and the screen pitch was 3mm.
High-temperature storage test: and (3) placing the printed chip at the ambient temperature of 250 ℃ for 24 hours, taking out, cooling, standing for 2 hours, and observing whether the printed chip has heterochrosis or cracking.
And (3) salt spray testing: condition 1, saline solution concentration: 5 plus or minus 1 percent; 2. pH value: 6.5 to 7.23, supply air pressure: 10-25 psi4, salt spray collection: 1-2 mL/80cm2/hr5, brine barrel temperature: 5 ± 2 ℃ 6, continuous spray time: for 48hrs. After the experiment, the chip is cleaned by distilled water for 5min, air-dried and kept clean for 6 hours, and then whether the printed chip has abnormal color or cracks is observed.
Boiling test: boiling the printed chip in purified water at 100 deg.C for 30min; the adhesive force test is carried out after the mixture is placed for 2 hours at normal temperature. And (3) testing the adhesive force: scribing 10 multiplied by 10 small grids of 1mm multiplied by 1mm on the surface of the printed chip; 2. cleaning fragments on the surface of the sample by using dust-free cloth; 3. and pasting the 3M 610# gummed paper on the small grids, flattening, standing for 5S, quickly pulling up the gummed paper, calculating the falling area, and determining that the gummed paper is unqualified when the falling area exceeds 5%.
And (3) testing pencil hardness: the Mitsubishi test pencil lead is more than or equal to 3H, the clamping angle between the pencil lead and the surface to be tested is 45 degrees under 750gf pressure, 5 pencils are drawn at the position to be tested, each pencils is 10mm long (parallel 5 lines are adopted, the line distance is more than 3mm, and the test lines are not interfered with each other.
High-temperature welding simulation test: placing the printed chip on a high-temperature platform at 260 ℃ for 5 minutes, and judging the standard: the appearance is unchanged.
The test data are shown in table 2:
table 2 performance testing experimental data
As can be seen from examples 1 to 22 and comparative examples 1 to 2 in combination with Table 2, the high temperature resistant ink for the screen printing of chips, which is prepared by using the silicone resin, the epoxy resin, the curing agent, the assistant and the pigment, has good adhesive property and high temperature resistance.
The comparison between example 1 and comparative examples 1-2 shows that the use of silicone resin and epoxy resin in the present application is advantageous for improving the adhesion and high temperature resistance of the high temperature resistant ink used for the screen printing screen of the chip screen printing.
The comparison between example 1 and examples 4 to 5 shows that the adhesion and heat resistance of the high temperature resistant ink for screen printing screens for die printing can be further improved by using the polymethylsilicone resin, the polyarylsilicone resin and the epoxy resin having a specific epoxy value together.
Example 1 compares with example 8 and demonstrates that the use of vinyl ester resins to participate in the preparation of high temperature resistant inks for screen printing screens for chip printing improves the adhesion properties of the high temperature resistant inks for screen printing screens for chip printing.
Compared with example 12, example 1 shows that the preparation of the lubricant by using the talcum powder, the glycerol and the tween is beneficial to improving the fluidity among the silicone resin, the epoxy resin and the vinyl ester resin, so that the silicone resin, the epoxy resin and the vinyl ester resin mutually permeate, and the heat resistance of the ink and the bonding performance of the ink and a chip are improved.
Example 1 compares with example 15 and illustrates that the use of a melamine formaldehyde resin to prepare a high temperature resistant ink for a screen for die-printing can improve the adhesion of the high temperature resistant ink for a screen for die-printing.
The present embodiment is only for explaining the present application, and it is not limited to the present application, and those skilled in the art can make modifications of the present embodiment without inventive contribution as needed after reading the present specification, but all of them are protected by patent law within the scope of the claims of the present application.
Claims (10)
1. The high-temperature-resistant ink for the screen printing of the chip is characterized by being prepared from the following raw materials in parts by weight:
50 to 60 parts of organic silicon resin
10 to 20 parts of epoxy resin
Curing agent 2~6 parts
Auxiliary 2~8 parts
40 to 60 portions of solvent
Pigment 0~5 parts.
2. The high temperature resistant ink for screen printing of chips according to claim 1, wherein: the high-temperature-resistant ink for the chip screen printing silk screen further comprises 5-10 parts by weight of vinyl resin, and the viscosity is 800-5000 cps at the temperature of 25 ℃.
3. The high temperature resistant ink for use in a screen printing of chips of claim 1, wherein: the high-temperature-resistant ink for the screen printing of the chip screen also comprises 1~2 parts by weight of a defoaming agent, wherein the defoaming agent is a polyether modified organic silicon defoaming agent.
4. The high temperature resistant ink for screen printing screens of chips of claim 1, wherein: the auxiliary agent is an antioxidant or an anti-ultraviolet agent.
5. The high temperature resistant ink for use in a screen printing of chips of claim 1, wherein: the high-temperature-resistant ink for the chip screen printing silk screen further comprises a lubricant in parts by weight of 5-10, wherein the lubricant is prepared from talcum powder, glycerol and tween in a weight ratio of (10-15): (5 to 10): 3 is prepared.
6. The high temperature resistant ink for use in a screen printing of chips of claim 1, wherein: the high-temperature-resistant ink for the chip screen printing silk screen further comprises 5-10 parts by weight of melamine formaldehyde resin, wherein the density of the melamine formaldehyde resin is 1.13-1.14g/cm 3 。
7. The high temperature resistant ink for screen printing screens of chips of claim 1, wherein: the high-temperature-resistant ink for the chip screen printing screen further comprises 1~2 parts by weight of a leveling agent, wherein the leveling agent is BD-3033H, BD-2051, BD-3232, BD-252 or BD-3310.
8. The high temperature resistant ink for use in a screen printing of chips of claim 1, wherein: the solvent is at least one of toluene, ethyl acetate, xylene and ethanol.
9. The high temperature resistant ink for screen printing of chips according to claim 1, wherein: the curing agent is naphthenate and a polyamide compound according to the weight ratio of (1~2): 1, mixing to obtain the product.
10. A method of preparing a high temperature resistant ink for use in a screen printing screen of chips according to any one of claims 1~9 comprising the steps of:
s1, uniformly mixing a solvent, organic silicon resin and other resins, adding the mixture into a reaction device for dispersion, then adding epoxy resin and a lubricant while stirring, vacuumizing, grinding and stirring until the mixture is viscous, wherein the viscosity is 1000-1100 cps;
and S2, breaking vacuum, adding the raw materials except the auxiliary agent, the pigment and the curing agent, vacuumizing, grinding and stirring, breaking vacuum, and discharging to obtain the high-temperature-resistant ink for the chip screen printing silk screen.
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