CN115785870A - Implanted tendon anchoring adhesive and preparation method thereof - Google Patents
Implanted tendon anchoring adhesive and preparation method thereof Download PDFInfo
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- CN115785870A CN115785870A CN202211623591.9A CN202211623591A CN115785870A CN 115785870 A CN115785870 A CN 115785870A CN 202211623591 A CN202211623591 A CN 202211623591A CN 115785870 A CN115785870 A CN 115785870A
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- planting
- bar
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- 239000000853 adhesive Substances 0.000 title claims abstract description 32
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 32
- 238000004873 anchoring Methods 0.000 title claims abstract description 14
- 238000002360 preparation method Methods 0.000 title abstract description 11
- 210000002435 tendon Anatomy 0.000 title 1
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 38
- 150000001412 amines Chemical class 0.000 claims abstract description 35
- 239000003085 diluting agent Substances 0.000 claims abstract description 25
- 239000003822 epoxy resin Substances 0.000 claims abstract description 20
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 20
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 3
- 239000010959 steel Substances 0.000 claims abstract description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 53
- 239000000377 silicon dioxide Substances 0.000 claims description 27
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 24
- 229910052710 silicon Inorganic materials 0.000 claims description 24
- 239000010703 silicon Substances 0.000 claims description 24
- 238000003756 stirring Methods 0.000 claims description 24
- 239000000203 mixture Substances 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 18
- 239000013008 thixotropic agent Substances 0.000 claims description 18
- 239000000843 powder Substances 0.000 claims description 16
- 239000003292 glue Substances 0.000 claims description 15
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 10
- 239000002994 raw material Substances 0.000 claims description 8
- 238000005303 weighing Methods 0.000 claims description 8
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 claims description 5
- QNYBOILAKBSWFG-UHFFFAOYSA-N 2-(phenylmethoxymethyl)oxirane Chemical compound C1OC1COCC1=CC=CC=C1 QNYBOILAKBSWFG-UHFFFAOYSA-N 0.000 claims description 5
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical group CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 claims description 4
- KFUSXMDYOPXKKT-UHFFFAOYSA-N 2-[(2-methylphenoxy)methyl]oxirane Chemical compound CC1=CC=CC=C1OCC1OC1 KFUSXMDYOPXKKT-UHFFFAOYSA-N 0.000 claims description 4
- 239000007822 coupling agent Substances 0.000 claims description 4
- 238000010276 construction Methods 0.000 abstract description 5
- 230000007547 defect Effects 0.000 abstract description 5
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 6
- 239000000243 solution Substances 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 229910001294 Reinforcing steel Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000012745 toughening agent Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a planting rib anchoring adhesive and a preparation method thereof, and belongs to the field of adhesives. The technical scheme comprises a component A and a component B, wherein the component A comprises 60-95 parts of epoxy resin E and 5-25 parts of reactive diluent by mass; the component B comprises 20-60 parts of dendritic amine curing agent. The invention is applied to the anchoring aspect of the embedded steel bars, and has the characteristics of high bonding strength, low viscosity, effective reduction of internal defects, safety, environmental protection and simple and convenient construction.
Description
Technical Field
The invention belongs to the field of adhesives, and particularly relates to a tendon-implanted anchoring adhesive and a preparation method thereof.
Background
The bar-planting anchoring adhesive is widely applied to anchoring and rooting of reinforcing steel bars, bolts, metal profiles, concrete, rocks and other base materials in buildings, bridges, curtain walls, guardrails, tower cranes and mine engineering. In which reinforcing bars are wrapped in concrete to enhance the connection of the concrete to the reinforcing bars in order to enable the two to work together to carry various stresses (working together to carry compressive, tensile and bending moments, torques, etc. from various loads). When the device is used, a group of strong bar-planting glue is taken and put into the sleeve, the sleeve is placed on a special manual injector, the trigger is slowly buckled, thinner glue at a platinum-discharging opening is not used for abandonment, then the spiral mixing nozzle is extended into the bottom of the hole, if the length is not enough, the plastic pipe is lengthened, then the trigger is buckled, and the injector is pulled back once in the hole of the trigger, so that the air in the hole can be discharged. In order to ensure that the glue solution in the holes is full after the reinforcing steel bars are implanted and the glue solution cannot flow outwards, the glue injection in the holes can reach 80 percent. And immediately planting the ribs after the holes are filled with the glue.
However, the existing bar-planting anchor glue generally has the following problems: in the aspect of performance, the adhesive strength is generally low, although the compression strength and the bending strength are high, the brittleness is high, and the comprehensive performance is not good; in the aspect of safety, the curing agent is hard and brittle, is easy to peel and crack, has high viscosity, is easy to generate internal defects, causes safety problems, and is odorous and not environment-friendly; in the aspect of constructability, the problems of high viscosity, time and labor waste and high construction strength exist.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides the bar-planting anchor adhesive and the preparation method thereof, wherein the bar-planting anchor adhesive has the characteristics of high bonding strength, low viscosity, safety, environmental protection and simple and convenient construction, and can effectively reduce internal defects.
In order to solve the technical problem, the technical scheme adopted by the invention is as follows:
the invention discloses a planting rib anchoring adhesive on one hand, which comprises a component A and a component B, wherein the component A comprises 60-95 parts of epoxy resin E and 5-25 parts of active diluent by mass; the component B comprises 20-60 parts of dendritic amine curing agent.
Preferably, the dendritic amine-based curing agent is a dendritic amine-based curing agent containing an ether bond.
Preferably, the reactive diluent is one of butyl glycidyl ether, benzyl glycidyl ether and o-tolyl glycidyl ether or a combination thereof.
Preferably, the component A consists of 70-95 parts of epoxy resin E51, 5-25 parts of reactive diluent, 80-200 parts of silica micropowder and 1-5 parts of thixotropic agent; the component B comprises 20-60 parts of dendritic amine curing agent, 0.5-3 parts of accelerator, 50-120 parts of silica powder and 1-3 parts of thixotropic agent.
Preferably, the promoter is DMP-30 or K54.
Preferably, the silicon micropowder is a mixture of silicon micropowder with the size of 200 meshes, 400 meshes and 600 meshes.
Preferably, the thixotropic agent is silica prepared by a gas phase method.
Preferably, the bar-planting anchor glue is prepared from a component A and a component B in a mass ratio of 100 (50-100).
Another aspect of the present invention provides a method for preparing the rebar planting anchor glue.
Preferably, the method comprises the following steps:
weighing the raw materials according to the mass ratio of the component A, adding the epoxy resin E51 and the reactive diluent into a container, stirring, uniformly mixing the silicon micropowder, adding the silicon micropowder into the container in batches, stirring, and finally adding the thixotropic agent and stirring uniformly;
weighing the raw materials according to the mass ratio of the component B, adding the dendritic amine curing agent into a container, stirring, sequentially adding the accelerator, the coupling agent and the silica micropowder, stirring uniformly, adding the thixotropic agent, and stirring uniformly;
and uniformly mixing the component A and the component B to obtain the bar-planting anchor adhesive.
Compared with the prior art, the invention has the beneficial effects that:
the planting bar anchoring adhesive provided by the invention has the characteristics that the bonding strength is higher than 150%, the impact toughness is good, the shearing resistance, the compressive strength and the bending strength are excellent, the planting bar anchoring adhesive is strong and tough, is not easy to peel and crack, the viscosity is low, the internal defects are reduced, the planting bar anchoring adhesive is safe and environment-friendly, and the construction is simple and convenient.
Detailed Description
The technical solutions in the embodiments of the present invention will be fully described in detail below. It is obvious that the described embodiments are only some specific embodiments, not all embodiments, of the general technical solution of the present invention. All other embodiments, which can be derived by a person skilled in the art from the general idea of the invention, fall within the scope of protection of the invention.
The invention discloses a planting rib anchoring adhesive on one hand, which comprises a component A and a component B, wherein the component A comprises 60-95 parts of epoxy resin E51 and 5-25 parts of active diluent by mass; the component B comprises 20-60 parts of dendritic amine curing agent. The embodiment specifically defines that the composition of the bar-planting anchor adhesive comprises a component A and a component B, wherein the component A comprises epoxy resin E51 and a reactive diluent, and the component B comprises a dendritic amine curing agent. This example specifically defines the amounts of epoxy resin E51, reactive diluent, and dendritic amine curing agent, and it is understood that epoxy resin E51 can also be used in amounts of 65 parts, 70 parts, 75 parts, 80 parts, 85 parts, and any value within the range, that reactive diluent can also be used in amounts of 10 parts, 15 parts, and any value within the range, and that dendritic amine curing agent can also be used in amounts of 25 parts, 30 parts, 35 parts, 40 parts, 45 parts, 50 parts, 55 parts, and any value within the range.
In a preferred embodiment, the dendritic amine-based curing agent is a dendritic amine-based curing agent containing an ether bond. This example specifically defines that the dendritic amine-based curing agent is a dendritic amine-based curing agent containing an ether bond, because the curing agent is modified into an ether bond structure with a flexible segment through structural design, so that the cured product has flexibility while curing the epoxy resin.
In a preferred embodiment, the reactive diluent is one of butyl glycidyl ether, benzyl glycidyl ether, o-tolyl glycidyl ether or a combination thereof. The present embodiment specifically defines the type of reactive diluent, because the structural adhesive itself requires a certain strength, and the addition of the diluent having a short segment or a rigid structure is beneficial to ensure the strength after curing.
In a preferred embodiment, the component A consists of 70-95 parts of epoxy resin E51, 5-25 parts of reactive diluent, 80-200 parts of silica powder and 1-5 parts of thixotropic agent; the component B comprises 20-60 parts of dendritic amine curing agent, 0.5-3 parts of accelerator, 50-120 parts of silicon micropowder and 1-3 parts of thixotropic agent. The embodiment specifically limits the compositions of the component A and the component B, and it should be noted that the bar-planting anchor adhesive can achieve the dual effects of curing and toughening by adopting the dendritic amine curing agent without additionally using other types of curing agents and toughening agents.
In a preferred embodiment, the promoter is DMP-30 or K54. The technical solution defines the kind of accelerator in particular, it being understood that the accelerator may also be other substances reasonably selected in the art by a person skilled in the art in combination with the general knowledge in the art.
In a preferred embodiment, the silica powder is a mixture of silica powder with the sizes of 200 meshes, 400 meshes and 600 meshes. The technical scheme particularly limits the size composition of the silicon micropowder, and the cost is reduced as far as possible on the premise of ensuring the performance of the adhesive. In addition, the proportion of the 200-mesh silicon micropowder is 20-50%, the proportion of the 400-mesh silicon micropowder is 30-40%, and the proportion of the 600-mesh silicon micropowder is 20-30% in terms of the size composition of the silicon micropowder.
In a preferred embodiment, the thixotropic agent is silicon dioxide CT380, M-5 and T-200H prepared by a gas phase method. The technical scheme particularly limits the thixotropic agent to be silicon dioxide prepared by a gas phase method, and the reason is that the excellent thixotropy of the glue is ensured, and the construction of a three-dimensional surface is facilitated.
In a preferred embodiment, the bar-planting anchor glue is prepared from a component A and a component B in a mass ratio of 100 (50-100).
Another aspect of the present invention provides a method for preparing the rebar planting anchor glue. In a preferred embodiment, the method comprises the following steps:
weighing the raw materials according to the mass ratio of the component A, adding the epoxy resin E51 and the reactive diluent into a container, stirring, uniformly mixing the silicon micropowder, adding the silicon micropowder into the container in batches, stirring, and finally adding the thixotropic agent and stirring uniformly;
weighing the raw materials according to the mass ratio of the component B, adding the dendritic amine curing agent into a container, stirring, sequentially adding the accelerator, the coupling agent and the silica micropowder, stirring uniformly, adding the thixotropic agent, and stirring uniformly;
and uniformly mixing the component A and the component B to obtain the anchor adhesive for the embedded steel bar.
In order to more clearly and specifically describe a tendon-embedded anchoring adhesive and a preparation method thereof according to embodiments of the present invention, the following description will be made with reference to specific embodiments.
Example 1
The component A comprises the following components: the epoxy resin composition comprises, by weight, 51 parts of epoxy resin, 10 parts of benzyl glycidyl ether serving as an active diluent, 100 parts of silica powder with 200 meshes, 60 parts of silica powder with 400 meshes and 40 parts of silica powder with 600 meshes, and 380 parts of silicon dioxide CT prepared by a gas phase method;
the component B comprises the following components: n164040 parts of a dendritic amine curing agent (ether bond-containing dendritic amine curing agent), 40 parts, 25 parts and 15 parts of 200-mesh, 400-mesh and 600-mesh silicon micro powder respectively added with DMP-30 parts, and 380 parts of silicon dioxide CT prepared by a gas phase method.
The preparation method comprises the following steps:
s1: weighing the raw materials according to the mass ratio of the component A, adding the epoxy resin E51 and the reactive diluent into a container for stirring, uniformly mixing the silicon micropowder, then adding the silicon micropowder into the container in batches for stirring, and finally adding the thixotropic agent for stirring uniformly;
s2: weighing the raw materials according to the mass ratio of the component B, adding the dendritic amine curing agent into a container, stirring, then sequentially adding the accelerator, the coupling agent and the silicon micropowder, stirring uniformly, adding the thixotropic agent, and stirring uniformly;
s3: and uniformly mixing the component A and the component B to obtain the bar-planting anchor adhesive.
Example 2
The composition of the component A is the same as that of the component 1, except that the epoxy resin E51 is 70 parts, the reactive diluent is 10 parts of benzyl glycidyl ether, the o-tolyl glycidyl ether is 15 parts, the addition amounts of 200-mesh, 400-mesh and 600-mesh silicon micro powders are respectively 80 parts, 50 parts and 30 parts, and the silicon dioxide M-5 parts is prepared by a gas phase method; the composition of the component B is the same as that of the component 1, except that 30 parts of a dendritic amine curing agent (ether bond-containing dendritic amine curing agent) N1403, 30 parts of an accelerator DMP-2, 50 parts, 30 parts and 10 parts of 200-mesh, 400-mesh and 600-mesh silicon micro powder are added, and 5 parts of silicon dioxide M-5 prepared by a gas phase method are used.
The preparation method is the same as example 1.
Example 3
The composition of the component A is the same as that of the component A in example 1, except that 80 parts of epoxy resin E, 20 parts of butyl glycidyl ether serving as a reactive diluent, 70 parts, 40 parts and 20 parts of 200-mesh, 400-mesh and 600-mesh silicon micro powder are added, and 5 parts of silicon dioxide M-5 prepared by a gas phase method are added; the composition of the component B is the same as that of the component A in example 1, except that the dendritic amine curing agent (ether bond-containing dendritic amine curing agent) N140640 parts, K54 parts, the addition amounts of 200-mesh, 400-mesh and 600-mesh silicon micro powder are respectively 60 parts, 40 parts and 20 parts, and the silica prepared by a gas phase method is T-200H 3 parts.
The preparation method is the same as example 1.
Example 4
The composition of the component A is the same as that of the component A in example 1, except that the components comprise 95 parts of epoxy resin E, 5 parts of butyl glycidyl ether serving as a reactive diluent, 50 parts, 35 parts and 15 parts of 200-mesh, 400-mesh and 600-mesh silicon micro powder respectively, and 5 parts of silicon dioxide M-5 prepared by a gas phase method; the composition of the component B is the same as that of the component A in example 1, except that the dendritic amine curing agent (ether bond-containing dendritic amine curing agent) is N1635 parts, K54 parts, the addition amounts of 200-mesh, 400-mesh and 600-mesh silicon micro powders are respectively 50 parts, 25 parts and 15 parts, and the silicon dioxide T-200H 1 parts is prepared by a gas phase method.
The preparation method is the same as example 1.
Example 5
The composition of the component A is the same as that of example 1; the composition of the component B was the same as in example 1 except that the dendritic amine-based curing agent was NJ301 which was a dendritic amine-based curing agent containing no ether bond.
The preparation method is the same as example 1.
Comparative example 1
The composition of component a was the same as in example 1 except that the dendritic amine based curing agent was replaced with 593.
Comparative example 2
The composition of the B component was the same as in example 1 except that the dendritic amine-based curing agent was replaced with D400.
Comparative example 3
The composition of the a and B components was the same as in example 1 except that the a component did not include a reactive diluent.
Comparative example 4
The composition of component A and component B was the same as in example 1 except that the reactive diluent was polypropylene glycol glycidyl ether.
Performance test
The products prepared in examples 1 to 5 and comparative examples 1 to 4 were subjected to tensile shear strength, bending strength, tensile strength, heat distortion temperature and compression strength tests, and the test results are shown in table 1.
TABLE 1 results of performance test of products prepared in examples 1 to 5 and comparative examples 1 to 4
Claims (10)
1. The tendon-planting anchoring adhesive is characterized by comprising a component A and a component B, wherein the component A comprises 60-95 parts of epoxy resin E and 5-25 parts of active diluent by mass; the component B comprises 20-60 parts of dendritic amine curing agent.
2. The bar-planting anchor glue of claim 1, wherein the dendritic amine-based curing agent is a dendritic amine-based curing agent containing an ether bond.
3. The tendon-embedded anchor adhesive of claim 1, wherein the reactive diluent is one of butyl glycidyl ether, benzyl glycidyl ether, o-tolyl glycidyl ether or a combination thereof.
4. The bar-planting anchor adhesive according to claim 1, wherein the component A comprises 70-95 parts of epoxy resin E51, 5-25 parts of reactive diluent, 80-200 parts of silica powder and 1-5 parts of thixotropic agent; the component B comprises 20-60 parts of dendritic amine curing agent, 0.5-3 parts of accelerator, 50-120 parts of silica powder and 1-3 parts of thixotropic agent.
5. The bar-planting anchor glue of claim 4, wherein the accelerator is DMP-30 or K54.
6. The bar-planting anchor adhesive of claim 4, wherein the silica micropowder is a mixture of silica micropowders with sizes of 200 meshes, 400 meshes and 600 meshes.
7. The bonded anchor adhesive of claim 4, wherein the thixotropic agent is silica prepared by a gas phase method.
8. The bonded anchor adhesive of claim 1, wherein the bonded anchor adhesive is prepared from a component A and a component B in a mass ratio of 100 (50-100).
9. The method for preparing the tendon-planting anchor adhesive according to any one of claims 1 to 8.
10. The method for preparing the bar-planting anchor glue according to claim 9, comprising the following steps:
weighing the raw materials according to the mass ratio of the component A, adding the epoxy resin E51 and the reactive diluent into a container, stirring, uniformly mixing the silicon micropowder, adding the silicon micropowder into the container in batches, stirring, and finally adding the thixotropic agent and stirring uniformly;
weighing the raw materials according to the mass ratio of the component B, adding the dendritic amine curing agent into a container, stirring, sequentially adding the accelerator, the coupling agent and the silica micropowder, stirring uniformly, adding the thixotropic agent, and stirring uniformly;
and uniformly mixing the component A and the component B to obtain the anchor adhesive for the embedded steel bar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211623591.9A CN115785870A (en) | 2022-12-16 | 2022-12-16 | Implanted tendon anchoring adhesive and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211623591.9A CN115785870A (en) | 2022-12-16 | 2022-12-16 | Implanted tendon anchoring adhesive and preparation method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN115785870A true CN115785870A (en) | 2023-03-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211623591.9A Pending CN115785870A (en) | 2022-12-16 | 2022-12-16 | Implanted tendon anchoring adhesive and preparation method thereof |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106010406A (en) * | 2016-06-02 | 2016-10-12 | 北京中德新亚建筑技术有限公司 | Modified epoxy resin anchor adhesive with high strength and toughness |
| CN110105546A (en) * | 2019-06-10 | 2019-08-09 | 威海晨源分子新材料有限公司 | Epoxy curing agent, preparation method and application |
| CN111040695A (en) * | 2019-12-10 | 2020-04-21 | 武汉市科达云石护理材料有限公司 | Bi-component epoxy adhesive for bonding honeycomb plate and stone thin plate and preparation method thereof |
| CN112745501A (en) * | 2020-12-29 | 2021-05-04 | 威海晨源分子新材料有限公司 | Dendritic toughening curing agent, and preparation method and application thereof |
-
2022
- 2022-12-16 CN CN202211623591.9A patent/CN115785870A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106010406A (en) * | 2016-06-02 | 2016-10-12 | 北京中德新亚建筑技术有限公司 | Modified epoxy resin anchor adhesive with high strength and toughness |
| CN110105546A (en) * | 2019-06-10 | 2019-08-09 | 威海晨源分子新材料有限公司 | Epoxy curing agent, preparation method and application |
| CN111040695A (en) * | 2019-12-10 | 2020-04-21 | 武汉市科达云石护理材料有限公司 | Bi-component epoxy adhesive for bonding honeycomb plate and stone thin plate and preparation method thereof |
| CN112745501A (en) * | 2020-12-29 | 2021-05-04 | 威海晨源分子新材料有限公司 | Dendritic toughening curing agent, and preparation method and application thereof |
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