CN115770979B - Chip packaging detector with welding spot position fine adjustment function - Google Patents
Chip packaging detector with welding spot position fine adjustment function Download PDFInfo
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- CN115770979B CN115770979B CN202211485248.2A CN202211485248A CN115770979B CN 115770979 B CN115770979 B CN 115770979B CN 202211485248 A CN202211485248 A CN 202211485248A CN 115770979 B CN115770979 B CN 115770979B
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
A chip packaging detector with a welding spot position fine adjustment function belongs to the technical field of chip packaging test, and aims to solve the problems that a traditional chip packaging detector is inconvenient to rotate a chip at a designated welding position under the condition that power is not utilized in the transportation process of the chip, so that fixed-point welding of a welding mechanism is facilitated, and an automatic chip packaging test process under less driving force is realized; according to the application, the transportation assembly is transported through the frame until the transportation assembly is transported to one side of the welding mechanism, the chips are fixed through the plurality of groups of corresponding pressing columns, the transportation assembly can rotate in the process of being transported to the welding mechanism, so that the welding position of the chips on the transportation assembly is changed, and the welding structure of the welding mechanism can be finely adjusted, so that a better welding effect on the chips is achieved.
Description
Technical Field
The application relates to the technical field of chip packaging test, in particular to a chip packaging detector with a welding spot position fine adjustment function.
Background
The chip packaging detection is to perform packaging test on the chip to reach the purpose of enabling the chip to be used normally, the packaging test is the final step of chip manufacturing, and the packaging test is to cut, weld wires and mold the produced qualified wafer, so that the chip circuit is electrically connected with external devices, and mechanical and physical protection is provided for the chip.
The traditional chip packaging detector is inconvenient to transport the chip, and under the condition of not utilizing power, the chip is enabled to rotate at the appointed welding position, so that fixed-point welding of a welding mechanism is facilitated, an automatic chip packaging testing process under fewer driving forces is realized, and the welding mechanism of the traditional chip packaging detector is inconvenient to finely adjust welding spot positions to perform welding action on a plurality of welding spot positions.
To solve the above problems, a chip package inspection machine having a solder joint position fine adjustment function is proposed.
Disclosure of Invention
The application aims to provide a chip packaging detector with a welding spot position fine-tuning function, which solves the problems that the traditional chip packaging detector is inconvenient to rotate a chip at a designated welding position under the condition of not utilizing power in the transportation process of the chip, so that the fixed-point welding of a welding mechanism is convenient, the automatic chip packaging testing process under less driving force is realized, and the welding mechanism of the traditional chip packaging detector is inconvenient to fine-tune the welding spot positions to perform welding action on a plurality of welding spot positions.
In order to achieve the above purpose, the present application provides the following technical solutions: the utility model provides a chip package detects machine that possesses solder joint position fine setting function, including encapsulation test machine case and the frame of setting in encapsulation test machine incasement portion, encapsulation test machine incasement portion one end is provided with the transportation frame, and transportation frame position is in the position under the frame, frame one end position is in encapsulation test machine case outside, frame upper end slides and is provided with the transportation subassembly, and transportation subassembly sets up the multiunit, transportation subassembly one side is provided with welding mechanism, and welding mechanism sets up four groups, the frame upper end is provided with the operation track, and the operation track sets up at encapsulation test machine incasement portion upper end, the operation track lower extreme slides and is provided with down the post, and down the post sets up the multiunit, the structure of rotating is set for to the lower post lower extreme, the frame drives multiunit transportation subassembly and carries, when the transportation subassembly of same group is through welding mechanism one side of different groups, transportation subassembly upper end all rotates through welding mechanism to the transportation subassembly different positions of same group, welding mechanism's welded structure can mobilize, the welding point is changed.
Further, the rack is provided with grooves on two sides of the inner wall, strip-shaped plates are fixedly arranged in the grooves, the two groups of strip-shaped plates are provided with conveying belts, and the conveying assemblies are fixedly arranged on the outer sides of the conveying belts.
Further, the transportation assembly comprises a rotating disc and an external device which is embedded and arranged at the upper end of the rotating disc, a chip circuit is arranged at the upper end of the external device, a fixed disc is arranged at the lower end of the rotating disc, a connecting column is arranged at the lower end of the fixed disc, and the connecting column is fixedly connected with the outer side of the transportation belt.
Further, the rotary disk is internally provided with a mounting groove, an external device is embedded in the mounting groove, a tooth slot is arranged on the outer side of the rotary disk, the lower end of the rotary disk is provided with an embedded strip, and the rotary disk and the fixed disk are embedded in the gap positions of the strip-shaped plate and the groove.
Further, the annular groove is formed in the fixing disc, the first semicircular grooves are uniformly formed in the outer side of the annular groove, four groups of the first semicircular grooves are arranged, the four groups of the first semicircular grooves are located at the positions of four points of the annular groove, and the embedded strips are embedded in the annular groove.
Further, the jogged strip includes the strip body and sets up the fixed slot in strip body one side, and the inside gomphosis of fixed slot is provided with the semicircle piece, and semicircle piece one end is provided with connecting spring, connecting spring one end and fixed slot inner wall fixed connection, semicircle piece and first semicircle groove phase-match.
Further, a rack is arranged at the upper end position inside the groove, an inductive electric element is arranged on one side of the rack, three groups of racks and inductive electric elements are arranged, the racks are matched with the tooth grooves, and the racks and the tooth grooves are positioned at the same horizontal position.
Further, the welding mechanism comprises an L-shaped strip which is arranged on one side of the frame in a sliding manner, a telescopic rod is fixedly arranged at one end of the L-shaped strip, a welding assembly is arranged at one end of the telescopic rod, and a reciprocating strip is fixedly arranged at one end of the L-shaped strip.
Further, one side of the reciprocating bar is provided with a hollow bar, one side of the hollow bar is movably provided with a rotating shaft, the hollow bar and the rotating shaft are both arranged inside the frame in a sliding mode, one end of the rotating shaft is provided with a fixed motor through shaft connection, and the outer side of the shaft is provided with a fine adjustment assembly.
Further, the fine tuning assembly comprises a rotating block arranged on the outer side of the shaft, an outer side strip is arranged on the outer side of the rotating block, a fixing ring is arranged on the outer side of the outer side strip, the fixing ring is fixedly arranged inside the frame, a through groove is formed in the fixing ring in a penetrating mode, a second semicircular groove is formed in a quarter point of the circumference of the half side of the through groove, four groups of second semicircular grooves are formed, and the outer side strip and the embedded strip are members made in the same structure.
Compared with the prior art, the application has the following beneficial effects:
1. according to the chip packaging detector with the welding spot position fine adjustment function, the transportation assembly is transported through the frame until the transportation assembly is transported to one side of the welding mechanism, the chips are fixed through the plurality of groups of corresponding pressing columns, the transportation assembly rotates in the process of being transported to the welding mechanism, so that the welding positions of the chips on the transportation assembly are changed, the welding structure of the welding mechanism can be finely adjusted, and the problems that the traditional chip packaging detector is inconvenient to transport the chips, and the chips rotate at the appointed welding positions under the condition of not utilizing power, so that the fixed-point welding of the welding mechanism is facilitated, the automatic chip packaging testing process under fewer driving forces is realized, and the welding mechanism of the traditional chip packaging detector is inconvenient to finely adjust the welding spot positions to perform the welding action on the plurality of welding spot positions are solved.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present application;
FIG. 2 is a schematic view of the frame, transport assembly and welding mechanism of the present application;
FIG. 3 is a schematic view of a transport assembly according to the present application;
FIG. 4 is a schematic view of a fitting strip according to the present application;
FIG. 5 is a schematic diagram of the structure of the rack and the inductive electrical element according to the present application;
FIG. 6 is a schematic view of a welding mechanism according to the present application;
FIG. 7 is a schematic diagram of a trimming assembly according to the present application.
In the figure: 1. packaging the test case; 2. a frame; 21. a groove; 211. a rack; 212. an inductive electrical element; 22. a strip-shaped plate; 23. a conveyor belt; 3. a transport rack; 4. a transport assembly; 41. a rotating disc; 411. a placement groove; 412. tooth slots; 413. a fitting strip; 4131. a strip body; 4132. a fixing groove; 4133. a connecting spring; 4134. a semicircle block; 42. an external device; 43. a chip circuit; 44. a fixed plate; 441. a first semicircular groove; 442. an annular groove; 45. a connecting column; 5. a running rail; 6. pressing down a column; 7. a welding mechanism; 71. an L-shaped strip; 72. a telescopic rod; 73. welding the assembly; 74. fixing a motor; 75. a fine tuning assembly; 751. a fixing ring; 752. a rotating block; 753. a through groove; 754. a second semicircular groove; 755. an outer side bar; 76. a rotating shaft; 77. hollow strips; 78. a reciprocating bar.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
In order to solve the technical problems that the traditional chip packaging detector is inconvenient to rotate the chip at a designated welding position in the process of transporting the chip without using power, so that the fixed-point welding of a welding mechanism is facilitated, and the automatic chip packaging test process under less driving force is realized, as shown in fig. 1-5, the following preferable technical scheme is provided:
the chip packaging detection machine with the welding spot position fine adjustment function comprises a packaging test machine case 1 and a frame 2 arranged in the packaging test machine case 1, wherein one end in the packaging test machine case 1 is provided with a transportation frame 3, the transportation frame 3 is positioned at a position right below the frame 2, one end of the frame 2 is positioned outside the packaging test machine case 1, the upper end of the frame 2 is slidably provided with a transportation assembly 4, the transportation assembly 4 is provided with a plurality of groups, one side of the transportation assembly 4 is provided with a welding mechanism 7, the welding mechanism 7 is provided with four groups, the upper end of the frame 2 is provided with a running rail 5, the running rail 5 is arranged at the upper end in the packaging test machine case 1, the lower end of the running rail 5 is slidably provided with a pressing column 6, the pressing column 6 is provided with a plurality of groups, the lowest end of the pressing column 6 is set into a rotating structure, the frame 2 drives the plurality of transportation assemblies 4 to convey, when the same group of transport components 4 pass through one side of the welding mechanisms 7 of different groups, the upper ends of the transport components 4 rotate, the welding mechanisms 7 are used for welding different positions of the same group of transport components 4, the welding structures of the welding mechanisms 7 can be adjusted to change welding spots, grooves 21 are formed in two sides of the inner wall of the frame 2, strip-shaped plates 22 are fixedly arranged in the grooves 21, two groups of strip-shaped plates 22 are arranged, a transport belt 23 is arranged between the strip-shaped plates 22 of the two groups, the transport components 4 are fixedly arranged outside the transport belt 23, each transport component 4 comprises a rotating disk 41 and an external device 42 which is embedded and arranged at the upper end of the rotating disk 41, a chip circuit 43 is arranged at the upper end of the external device 42, a fixed disk 44 is arranged at the lower end of the rotating disk 41, a connecting column 45 is arranged at the lower end of the fixed disk 44, the connecting column 45 is fixedly connected with the outer side of the transport belt 23, a placement groove 411 is formed in the rotating disk 41, the external device 42 is embedded in the accommodating slot 411, a tooth slot 412 is formed on the outer side of the rotary disk 41, an embedded strip 413 is arranged at the lower end of the rotary disk 41, and the rotary disk 41 and the fixed disk 44 are embedded in the gap positions of the strip-shaped plate 22 and the groove 21.
The fixed disk 44 is internally provided with an annular groove 442, the outer side of the annular groove 442 is uniformly provided with first semicircular grooves 441, the first semicircular grooves 441 are provided with four groups, the first semicircular grooves 441 of the four groups are all positioned at the four-point positions of the annular groove 442, the embedded strip 413 is embedded in the annular groove 442, the embedded strip 413 comprises a strip body 4131 and a fixed groove 4132 formed on one side of the strip body 4131, a semicircular block 4134 is embedded in the fixed groove 4132, one end of the semicircular block 4134 is provided with a connecting spring 4133, one end of the connecting spring 4133 is fixedly connected with the inner wall of the fixed groove 4132, the semicircular block 4134 is matched with the first semicircular grooves 441, the upper end position inside the groove 21 is provided with a rack 211, one side of the rack 211 is provided with an inductive electric element 212, the rack 211 and the inductive electric element 212 are all provided with three groups, the rack 211 is matched with the tooth groove 412, and the rack 211 and the rack are positioned at the same horizontal position.
Specifically, a group of external devices 42 is embedded in a placement slot 411 provided in a group of transport assemblies 4, a chip circuit 43 is placed at the upper end of the external devices 42, the chip circuit 43 is fixed at the upper end of the external devices 42 by pressing down a pressing post 6, the outside of the chip circuit 43 is welded by a group of welding mechanisms 7, when the group of transport assemblies 4 is transported into a packaging test case 1, when a tooth slot 412 is transported to a rack 211 position, the tooth slot 412 is meshed with the rack 211, at this time, a rotating disk 41 drives the external devices 42 and the chip circuit 43 to rotate, at this time, an embedded strip 413 rotates in an annular slot 442, so that the embedded strip 413 moves from the inside of a first semicircular slot 441 of a group to the inside of a first semicircular slot 441 of a next group, and the connection spring 4133 pushes the semicircular block 4134 to be embedded in the first semicircular groove 441 to limit the adjusting position of the chip circuit 43, namely, adjust the position to be welded of the chip circuit 43 at this time, then weld the chip circuit 43 by the most recent group of welding mechanisms 7, after the transportation assembly 4 passes through the plurality of groups of racks 211, the chip circuit 43 and the external device 42 are adjusted in different positions until the weldable positions of the chip circuit 43 and the external device 42 are welded, the external device 42 and the chip circuit 43 are conveyed to be in a downward state, and then are separated from the placement groove 411 and fall to the upper end of the transportation frame 3 for conveying.
In order to solve the technical problem that a welding machine mechanism of a traditional chip packaging detector is inconvenient to finely adjust welding spot positions to perform welding action on a plurality of welding spot positions, as shown in fig. 6-7, the following preferable technical scheme is provided:
the welding mechanism 7 comprises an L-shaped strip 71 which is arranged on one side of the frame 2 in a sliding manner, a telescopic rod 72 is fixedly arranged at one end of the L-shaped strip 71, a welding assembly 73 is arranged at one end of the telescopic rod 72, a reciprocating strip 78 is fixedly arranged at one end of the L-shaped strip 71, a hollow strip 77 is arranged on one side of the reciprocating strip 78, a rotating shaft 76 is movably arranged on one side of the hollow strip 77, the hollow strip 77 and the rotating shaft 76 are both arranged inside the frame 2 in a sliding manner, one end of the rotating shaft 76 is provided with a fixed motor 74 through shaft connection, a fine adjustment assembly 75 is arranged on the outer side of the shaft, the fine adjustment assembly 75 comprises a rotating block 752 arranged on the outer side of the shaft, an outer side strip 755 is arranged on the outer side of the rotating block 752, a fixing ring 751 is fixedly arranged inside the frame 2, a through groove 753 is arranged in the fixing ring 751, a second semicircular groove 754 is formed at a quarter point of the half circumference of the through groove 753, the second semicircular groove 754 is provided with four groups, and the outer side strip 755 and the jogged strip 413 are members are made in the same structure.
Specifically, when the tooth slot 412 rotates through the position of the rack 211, the tooth slot 412 contacts the inductive electric element 212 at the first time, and at this time, the conveyor belt 23 stops working, so as to limit the position of the transport assembly 4, the inductive electric element 212 drives the fixed motor 74 to work, and at this time, the fixed motor 74 drives the rotating shaft 76 to rotate, so that the hollow bar 77, the reciprocating bar 78 and the L-shaped bar 71 reciprocate, since the second semicircular groove 754 is not disposed inside the half circle passing through the groove 753, the second semicircular groove 754 is uniformly distributed inside the half circle, that is, when the rotating shaft 76 rotates, the reciprocating bar 78 and the L-shaped bar 71 move in the forward direction, four positions are limited by the engagement of the outer bar 755 and the second semicircular groove 754, and the four positions are the four welding positions of the welding assembly 73, at this time, the welding positions of the welding assembly 73 are finely tuned to perform the welding work on the chip circuit 43 and the external device 42, when the rotating shaft 76 rotates one round, and when the rotating shaft 76 rotates so that the reciprocating bar 78 and the L-shaped bar 71 move in the reverse direction, the second semicircular groove 754 is not limited, until the L-shaped bar 71 is restored to the second semicircular groove 71 moves in the reverse direction, and the second semicircular groove 754 is disposed at the positions, so that the second semicircular groove 754 is not suitable for the welding position of the chip circuit 43 and the external device.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the application, the scope of which is defined in the appended claims and their equivalents.
Claims (1)
1. The utility model provides a chip package detects machine that possesses solder joint position fine setting function, includes encapsulation test machine case (1) and sets up in inside frame (2) of encapsulation test machine case (1), and the inside one end of encapsulation test machine case (1) is provided with transportation frame (3), and transportation frame (3) position is in the position under frame (2), and frame (2) one end position is in encapsulation test machine case (1) outside, its characterized in that: the upper end of the frame (2) is provided with a conveying assembly (4) in a sliding manner, the conveying assemblies (4) are provided with a plurality of groups, one side of each conveying assembly (4) is provided with a welding mechanism (7), the welding mechanisms (7) are provided with four groups, the upper end of the frame (2) is provided with a running rail (5), the running rail (5) is arranged at the upper end inside the packaging test case (1), the lower end of the running rail (5) is provided with a lower pressing column (6) in a sliding manner, the lower pressing columns (6) are provided with a plurality of groups, the bottommost end of each lower pressing column (6) is set to be in a rotating structure, the frame (2) drives the conveying assemblies (4) to convey, when the conveying assemblies (4) of the same group pass through one side of the welding mechanisms (7) of different groups, the upper ends of the conveying assemblies (4) are rotated, the welding structures of the conveying assemblies (4) of the same group are welded through the welding mechanisms (7), and the welding structures of the welding mechanisms (7) can be mobilized to change welding spots;
grooves (21) are formed in two sides of the inner wall of the frame (2), strip-shaped plates (22) are fixedly arranged in the grooves (21), two groups of strip-shaped plates (22) are arranged, a conveying belt (23) is arranged between the two groups of strip-shaped plates (22), and a conveying assembly (4) is fixedly arranged outside the conveying belt (23);
the conveying assembly (4) comprises a rotary disc (41) and an external device (42) which is embedded and arranged at the upper end of the rotary disc (41), a chip circuit (43) is arranged at the upper end of the external device (42), a fixed disc (44) is arranged at the lower end of the rotary disc (41), a connecting column (45) is arranged at the lower end of the fixed disc (44), and the connecting column (45) is fixedly connected with the outer side of the conveying belt (23);
a mounting groove (411) is formed in the rotary disk (41), an external device (42) is embedded in the mounting groove (411), a tooth slot (412) is formed in the outer side of the rotary disk (41), an embedded strip (413) is arranged at the lower end of the rotary disk (41), and the rotary disk (41) and the fixed disk (44) are embedded in the gap positions of the strip-shaped plate (22) and the groove (21);
an annular groove (442) is formed in the fixed disc (44), first semicircular grooves (441) are uniformly formed in the outer side of the annular groove (442), four groups of the first semicircular grooves (441) are formed, the four groups of the first semicircular grooves (441) are located at the four-point positions of the annular groove (442), and the embedded strips (413) are embedded in the annular groove (442);
the embedded strip (413) comprises a strip body (4131) and a fixing groove (4132) formed in one side of the strip body (4131), a semicircular block (4134) is embedded in the fixing groove (4132), a connecting spring (4133) is arranged at one end of the semicircular block (4134), one end of the connecting spring (4133) is fixedly connected with the inner wall of the fixing groove (4132), and the semicircular block (4134) is matched with the first semicircular groove (441);
a rack (211) is arranged at the upper end position inside the groove (21), an induction electric element (212) is arranged on one side of the rack (211), three groups of racks (211) and induction electric elements (212) are arranged, the racks (211) are matched with the tooth grooves (412), and the racks and the tooth grooves are positioned at the same horizontal position;
the welding mechanism (7) comprises an L-shaped strip (71) which is arranged on one side of the frame (2) in a sliding manner, a telescopic rod (72) is fixedly arranged at one end of the L-shaped strip (71), a welding assembly (73) is arranged at one end of the telescopic rod (72), and a reciprocating strip (78) is fixedly arranged at one end of the L-shaped strip (71);
a hollow bar (77) is arranged on one side of the reciprocating bar (78), a rotating shaft (76) is movably arranged on one side of the hollow bar (77), the hollow bar (77) and the rotating shaft (76) are both arranged in the frame (2) in a sliding manner, one end of the rotating shaft (76) is connected with a fixed motor (74) through a shaft, and a fine adjustment assembly (75) is arranged on the outer side of the shaft;
the fine adjustment assembly (75) comprises a rotating block (752) arranged on the outer side of the shaft, an outer side strip (755) is arranged on the outer side of the rotating block (752), a fixing ring (751) is arranged on the outer side of the outer side strip (755), the fixing ring (751) is fixedly arranged inside the frame (2), a through groove (753) is formed in the fixing ring (751) in a penetrating mode, a second semicircular groove (754) is formed in a position of a quarter point of the half circumference of the through groove (753), four groups of second semicircular grooves (754) are formed, and the outer side strip (755) and the embedded strip (413) are members made of the same structure;
when the tooth slot (412) rotates to pass through the position of the rack (211), the tooth slot (412) is contacted with the induction electric element (212) at the first time, the conveyer belt (23) stops working, the position of the conveying assembly (4) is limited, the induction electric element (212) drives the fixed motor (74) to work, the fixed motor (74) drives the rotating shaft (76) to rotate, namely, the hollow strip (77), the reciprocating strip (78) and the L-shaped strip (71) do not reciprocate, the second semicircular groove (754) is not arranged in the half circle of the through groove (753), the second semicircular groove (754) which is uniformly distributed is arranged in the half circle, namely, the rotating shaft (76) rotates to enable the reciprocating strip (78) and the L-shaped strip (71) to move in the positive direction, four positions are limited by the clamping of the outer strip (755) and the second semicircular groove (754), the four positions are the four welding positions of the welding assembly (73), the welding positions of the welding assembly (73) are finely adjusted at the moment, the welding positions of the chip circuit (43) and the outer device (42) are in order to work, the chip circuit (42) and the rotating shaft (76) do not rotate in the reverse direction until the L-shaped strip (71) does not rotate in the positive direction, the second half groove (754) can be provided with more groups of second half grooves (754) at the semicircular positions to manufacture more welding positions capable of limiting positions so as to be suitable for welding different types of chip circuits (43) and external devices (42).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211485248.2A CN115770979B (en) | 2022-11-24 | 2022-11-24 | Chip packaging detector with welding spot position fine adjustment function |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211485248.2A CN115770979B (en) | 2022-11-24 | 2022-11-24 | Chip packaging detector with welding spot position fine adjustment function |
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| CN115770979A CN115770979A (en) | 2023-03-10 |
| CN115770979B true CN115770979B (en) | 2023-08-22 |
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