CN104875017A - Novel chip welding device for smart card - Google Patents
Novel chip welding device for smart card Download PDFInfo
- Publication number
- CN104875017A CN104875017A CN201510254562.3A CN201510254562A CN104875017A CN 104875017 A CN104875017 A CN 104875017A CN 201510254562 A CN201510254562 A CN 201510254562A CN 104875017 A CN104875017 A CN 104875017A
- Authority
- CN
- China
- Prior art keywords
- axis
- chip
- mount pad
- suction nozzle
- slide block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P23/00—Machines or arrangements of machines for performing specified combinations of different metal-working operations not covered by a single other subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q7/00—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting
- B23Q7/14—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting co-ordinated in production lines
- B23Q7/1426—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting co-ordinated in production lines with work holders not rigidly fixed to the transport devices
- B23Q7/1494—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting co-ordinated in production lines with work holders not rigidly fixed to the transport devices using grippers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Resistance Welding (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention discloses a novel chip welding device for a smart card. The device comprises a rack, a chip carrying device, a chip welding device, a chip cutting device, a chip belt conveying mechanism and a card conveying mechanism, wherein the chip carrying device comprises a chip absorbing mechanism, and a moving mechanism which drives the chip absorbing mechanism to move on an X axis, a Y axis and a Z axis; the chip absorbing mechanism comprises an absorbing head, a vacuum device connected with the absorbing head, and a mounting frame for mounting the absorbing head; the mounting frame is connected to the moving mechanism; the chip welding device comprises a welding assembly, and a driving mechanism which drives the welding assembly to weld; the driving mechanism comprises a driving motor, a sliding block, a lead screw transmission mechanism which drives the sliding block to move, and a connecting assembly for connecting the sliding block and the welding assembly. The device is compact in overall layout; the chip welding device and the chip belt conveying mechanism are free of mutual interference; the chip carrying device has the advantages of being simple in structure, high in efficiency, and good in locating precision.
Description
Technical field
The present invention relates to smart card manufacturing equipment, be specifically related to a kind of intelligent card chip welding equipment.
Background technology
In the production process of double-interface smart card, need by chips welding on the antenna of card, then by chip package in card.The welding job completing chip mainly comprises following several actions: 1, utilize chip cutting means that the chip stamping-out be arranged on chip belt is become chip one by one, blanking movement carries out in blanking die; 2, utilize chip handling device to be picked up by the chip cut, and adjust the attitude of chip, move to welding post place; 3, utilize card transport that card to be welded is transported to welding post; 4, welder is utilized to be welded together by the antenna be positioned on the chip at welding post place and card.
In prior art, chip cutting means and chip handling device are arranged on the side of card transport, welder is arranged on the opposite side of card transport, is provided with chip belt conveying mechanism in the below of welding post, and the throughput direction of this chip belt conveying mechanism is perpendicular to card throughput direction.Because welder arranges by card transport side, in order to not interfere, therefore mutually must avoid between this welder and chip belt conveying mechanism, cause design, installment and debugging difficulty greatly, increasing device volume.
Open in prior art, chip handling device realizes the absorption of chip, upset and shift action by multiple mechanism, after chip is drawn by the first mechanism, first carry out 180 ° of upsets, transfer to subsequently in the second mechanism, and move to the 3rd place of mechanism and be transferred to the 3rd mechanism, finally by the 3rd mechanism, 90 ° of upsets are carried out to chip, now chip is positioned at welding post place, welds subsequently.This chip handling device not only complex structure, speed is slow, and chip needs through repeatedly exchanging and overturning, and positioning precision is poor, easily occurs the problem of chip welding spot and antenna misalignment, affects welding quality.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, a kind of novel smart card chip welding device is provided, this welding equipment integral layout is compact, die-bonding device wherein and chip belt conveying mechanism non-interference, design, the installment and debugging of chip belt conveying mechanism are convenient; Chip handling device wherein has the advantages such as structure is simple, volume is little, efficiency is high, positioning precision is good.
Object of the present invention is realized by following technical scheme:
A kind of novel smart card chip welding device, comprises frame, chip handling device, die-bonding device, chip cutting means, chip belt conveying mechanism and card transport; It is characterized in that:
Described chip handling device comprises chip pick-up mechanism and drives the travel mechanism of chip pick-up mechanism movement on X-axis, Y-axis and Z axis, described chip pick-up mechanism comprises suction nozzle, the vacuum plant be connected with suction nozzle and the installing rack for installing suction nozzle, described installing rack is connected in travel mechanism, and described travel mechanism is arranged in frame; Described suction nozzle is connected with switching mechanism, and this switching mechanism comprises the actuating unit doing vertical lines motion, the spring being located at articulated structure between suction nozzle and installing rack, being located at the driving syndeton between actuating unit and suction nozzle and being connected between suction nozzle and installing rack; Wherein, described driving syndeton comprises the sliding tray be located on suction nozzle and the drive rod be located on actuating unit, and described drive rod extend in sliding tray; When described drive rod to move to two end points of vertical stroke with actuating unit, described drive rod is positioned at the two ends of sliding tray, and the operative end surface of described suction nozzle is the level of state respectively and vertical state;
Described die-bonding device comprises weld assembly and drives weld assembly to perform the driving mechanism of welding action, described driving mechanism comprises drive motors, slide block, the lead-screw drive mechanism of driving slide block movement and the coupling assembling of connection sliding block and weld assembly, wherein, described drive motors and slide block are arranged in frame, described frame is provided with the chute extended along X-direction, and described slide block is arranged in this chute; Leading screw one end in described lead-screw drive mechanism is through described slide block, and the other end is connected with drive motors by power drive mechanism;
Described card transport is arranged on the below between chip handling device and die-bonding device, and the throughput direction of this card transport is perpendicular to described X-axis, and card transport is provided with for allowing card stop the welding post carrying out chips welding; Described chip cutting means is arranged on side corresponding with chip handling device in outside welding post; Described chip belt conveying mechanism is arranged along the direction perpendicular to X-axis, and the chip belt in this chip belt conveying mechanism is through described welding post and chip cutting means.
A preferred version of the present invention, in chip handling device, described actuating unit is made up of cylinder, and the cylinder body of this cylinder is fixed on installing rack, and the extensible member of this cylinder is provided with the linking arm to downward-extension, and described drive rod is arranged on the lower end of linking arm.Adopt cylinder as actuating unit, structure is simple, and it is convenient to control; By arranging the linking arm to downward-extension, thus by the power transmission of cylinder to drive rod, and can make, between the lower end of cylinder and suction nozzle, there is certain distance, being convenient to suction nozzle and freely rotating.
A preferred version of the present invention, in chip handling device, described suction nozzle is in " 7 " font, and the one end of being somebody's turn to do " 7 " font suction nozzle is operative end surface, and the other end arranges described articulated structure and sliding tray; Described sliding tray is straight trough, and the length direction of this sliding tray is parallel with the operative end surface of suction nozzle.By adopting " 7 " font suction nozzle, being convenient to arrange described articulated structure and sliding tray, making to have certain distance between articulated structure and sliding tray, this distance forms the arm of force that drive rod promotes suction nozzle rotation; Meanwhile, be also convenient on suction nozzle, arrange the vacuum tube be connected with vacuum plant; In addition, adopt " 7 " font suction nozzle also to have following benefit: when the operative end surface of suction nozzle turns to vertical state from level, the operative end surface of suction nozzle is positioned at the outside of installing rack, when avoiding butt-joint, soldering tip and installing rack collide.
A preferred version of the present invention, in chip handling device, described articulated structure comprises the axis hole be located on suction nozzle and the rotating shaft connecting described axis hole and installing rack; Described axis hole is provided with the breach extending to suction nozzle edge, and suction nozzle is provided with the screw hole perpendicular to breach; The position that described rotating shaft is being connected with installing rack is provided with bearing.Arrange described breach to be convenient to rotating shaft and to be encased in axis hole, and by arranging described screw hole and screw tightens up axis hole, prevent rotating shaft from getting loose.
A preferred version of the present invention, in chip handling device, one end of described spring is connected on the connecting hole that is located on suction nozzle, and the other end is connected on the connecting rod that is fixedly connected with the cylinder body of described cylinder.So more be conducive to allowing drive rod and sliding tray fully fit, eliminate gap, improve positioning precision.
A preferred version of the present invention, in chip handling device, described travel mechanism comprises X-axis travel mechanism, Y-axis moving mechanism and Z axis travel mechanism, wherein:
Described X-axis travel mechanism comprises X-axis motor, X-axis leading screw and X-axis slide block, and wherein, described X-axis motor is fixed in frame, and the main shaft that described X-axis leading screw is connected to X-axis motor is connected with X-axis slide block, and described X-axis slide block is arranged in the chute that is located in frame;
Described Y-axis moving mechanism comprises y-axis motor, Y-axis leading screw and Y-axis slide block, wherein, described y-axis motor is fixed on motor mount, this motor mount is fixed on X-axis slide block, the main shaft that described Y-axis leading screw is connected to y-axis motor is connected with Y-axis slide block, and described Y-axis slide block is arranged on motor mount by slide rail;
Described Z axis travel mechanism comprises Z axis motor, Z axis leading screw and Z axis slide block, wherein, Z axis motor is fixed on Y-axis slide block, the main shaft that described Z axis leading screw is connected to Z axis motor is connected with Z axis slide block, described Z axis slide block is arranged on Y-axis slide block by slide rail, and described installing rack is fixed on Z axis slide block.
By above-mentioned travel mechanism, drive installing rack and on suction nozzle move in three dimensions, to realize the movement of chip in three dimensions, chip is moved to welding post exactly.
A preferred version of the present invention, at die-bonding device, described coupling assembling comprises vertical adjustment mechanism, this vertical adjustment mechanism is made up of vertical slide mechanism and threaded adjusting mechanism, and described vertical slide mechanism comprises the vertical guide be connected with slide block and the vertical sliding part be connected in vertical guide; The adjusting screw(rod) that described threaded adjusting mechanism comprises the upper adjusting seat be located in vertical guide, is located at the lower adjusting seat on vertical sliding part and is connected on upper adjusting seat and lower adjusting seat, is threaded connection anatomical connectivity between described adjusting screw(rod) and lower adjusting seat.
By arranging above-mentioned vertical adjustment mechanism, the vertical position of soldering tip in weld assembly can be regulated, thus as required soldering tip can be adjusted to the correct position of vertical direction.The principle regulated is: by rotating adjusting screw(rod), thus drive vertical sliding part to slide in vertical guide, and move to suitable position.
A preferred version of the present invention, at die-bonding device, described coupling assembling also comprises elastic buffering mechanism, this elastic buffering mechanism comprises the upper mount pad be connected on vertical sliding part, arrange lower mount pad below mount pad, be connected to X between mount pad and lower mount pad to slide mechanism and the elastic buffering mechanism that is located between upper mount pad and lower mount pad, wherein, described X comprises to slide mechanism and is arranged on X bottom upper mount pad to slide rail be fixed on the X at lower mount pad top to slide, and described X is connected to slide rail to slide with X; Described elastic buffering mechanism comprises the buffer bar be connected on lower mount pad, and this buffer bar is from bottom to top through the cushion hole be located on upper mount pad; Locating part and buffer spring is provided with in described upper mount pad, this locating part and buffer spring are arranged on the both sides of buffer bar along X-direction, wherein, described locating part is positioned at the side near soldering tip, buffer spring is positioned at opposite side, and the end of described locating part and buffer spring to extend in cushion hole and acts on buffer bar.
The object arranging above-mentioned elastic buffering mechanism to be when performing welding action as weld assembly provides buffering: during welding, driving mechanism drives soldering tip in weld assembly along X-direction towards antenna to be welded and chip motion, and scolding tin antenna being pressed on chip realizes welding, when soldering tip Contact antenna and scolding tin, there is certain impulsive force, adopt above-mentioned elastic buffering mechanism that soldering tip can be avoided to produce excessive impact to antenna and chip, prevent antenna to be pressed down.The operation principle of this elastic buffering mechanism is: under normality, and buffer bar is pushed against on locating part by described buffer spring, and the weld assembly be now connected on lower mount pad is positioned at X-direction foremost; Perform in welding course of action, when soldering tip Contact antenna and chip and when producing impulsive force backward to lower mount pad, described buffer spring just plays cushioning effect, make mount pad and lower mount pad produce X at X to slide mechanism place and move to current buffer.
Preferably, be provided with in described upper mount pad two be oppositely arranged and the installing hole be communicated with cushion hole, described locating part and buffer spring arrange in one of them installing hole respectively; Described locating part is screw, and this screw is threaded with installing hole; The outer end of the installing hole corresponding with buffer spring is provided with closeouts.Adopt screw formation locating part can regulate the position of locating part, described closeouts is set for carrying out spacing to buffer spring.
A preferred version of the present invention, at die-bonding device, described coupling assembling also comprises Y-axis micro-adjusting mechanism, this Y-axis micro-adjusting mechanism comprises bottom mount pad, is arranged on the Y-direction slide mechanism between lower mount pad and bottom mount pad and finely tunes actuating unit, wherein, described bottom mount pad is located at the below of lower mount pad; Described Y-direction slide mechanism comprises the Y-direction slideway arranged bottom lower mount pad and the Y-direction sliding part being fixed on mount pad top, bottom, and described Y-direction sliding part is connected with Y-direction slideway; Described fine setting actuating unit comprises fine adjustment shaft, is located at the eccentric shaft of fine adjustment shaft lower end and is located at the fine setting hole in Y-direction sliding part, and described fine adjustment shaft vertically passes through lower mount pad, and is connected with lower mount pad by rotation connection structure; Described eccentric shaft coupling is in described fine setting hole; Described weld assembly is arranged on the mount pad of bottom.
Adopt the effect of above-mentioned Y-axis micro-adjusting mechanism to be that the fine setting of Y direction is carried out in the position of butt welding connected components, make soldering tip aim at antenna in Y direction.The operation principle of this Y-axis micro-adjusting mechanism is: drive eccentric shaft turns by rotating fine adjustment shaft, thus moves Y-direction slideway and bottom mount pad moves along Y-axis by finely tuning pore area, realizes the adjustment to weld assembly Y-direction position.
Preferably, described fine adjustment shaft is made up of described buffer bar, makes same parts have two functions, is conducive to simplifying structure; Described rotation connection structure comprises the shaft shoulder be located on fine adjustment shaft and the limit base being fixed on lower mount pad top; Described fine adjustment shaft passes from limit base, and be provided with the spacing hole matched with the described shaft shoulder in limit base, the described shaft shoulder is limited in spacing hole, and the lower end of the shaft shoulder is fitted on the end face of lower mount pad.Guarantee that fine adjustment shaft can freely rotate by above-mentioned rotation connection structure, with the axially-movable of limit fine adjustment shaft.
A preferred version of the present invention, at die-bonding device, described Y-axis micro-adjusting mechanism is two, and each Y-axis micro-adjusting mechanism connects a weld assembly.Arrange two weld assemblies can weld two strip antennas on card simultaneously, improve welding efficiency; By the Y-direction distance of soldering tip in two adjustable two weld assemblies of Y-axis micro-adjusting mechanism, to adapt to the different distance between two strip antennas on card.
A preferred version of the present invention, at die-bonding device, the soldering tip in described weld assembly comprises soldering tip matrix and weld part, wherein, described weld part comprises weld part and lower weld part, is provided with the groove caved inward between described upper weld part and lower weld part; The end of described upper weld part extends out to the end exceeding lower weld part.
Adopt the effect of the soldering tip of said structure to be: upper weld part first Contact antenna top in welding process, and push against in antenna top insertion scolding tin, the heat now gone up on weld part passes to scolding tin rapidly, makes the rapid melting of scolding tin; Descend weld part ability Contact antenna bottom subsequently and be pushed down in sky in the scolding tin of melting, weld part is very little to the impulsive force of the bottom of antenna at present for this, can not cause damage to the bottom of antenna, the bottom of antenna be there will not be and fracture, ensure that welding quality.Further, first contact scolding tin due to upper weld part during welding and stretch in scolding tin, therefore, it is possible to allow the rapid melting of scolding tin, improve welding efficiency, and there will not be fried tin, avoiding producing tin sweat(ing), improve welding quality.
A preferred version of the present invention, at die-bonding device, the end of described upper weld part is arc-shaped, the damage to antenna when compressing antenna to alleviate; The gradual change type structure that the end of described upper weld part is large in middle little, upper and lower two, being convenient to weld part like this when being pressed on scolding tin by antenna, reducing resistance, weld part on this can be rapidly inserted in scolding tin, thus allows the rapid melting of scolding tin; In addition, gradual change type structure also makes weld part can not cause great impact in the process inserting scolding tin.
A preferred version of the present invention, at die-bonding device, described power drive mechanism and drive motors be arranged on be located at chute end installing plate on, described power drive mechanism is synchronous belt drive mechanism.By described synchronous belt drive mechanism, by the power transmission of drive motors to the leading screw in lead-screw drive mechanism, thus drive skid.
Operation principle of the present invention is: card to be welded is moved to welding post place and stops by card transport; Chip on chip belt is transported to the blanking die place of chip cutting means by chip belt conveying mechanism; Chip on chip belt is gone out by chip cutting means, obtains one single chip;
The chip that stamping-out is good is transported to welding post place and regulates chip attitude by described chip handling device, matched with die-bonding device welding action, be specially: under original state, the operative end surface of suction nozzle down, travel mechanism drives suction nozzle to move to above the cutting mould of chip cutting means, then travel mechanism drives suction nozzle to move downward close to the chip in cutting mould, and now the solder joint of chip down, under the effect of vacuum plant, pick up chip; Switching mechanism work subsequently, actuating unit wherein promotes suction nozzle half-twist by drive rod and sliding tray, the chip on suction nozzle is made to be converted to vertical state from level, meanwhile, travel mechanism drives suction nozzle to move towards welding post place, antenna on the card allowing the solder joint of chip aim to have sent in card delivery track, the soldering tip subsequently in die-bonding device performs welding action, by chips welding on antenna; Last travel mechanism drives suction nozzle to reset, and actuating unit promotes suction nozzle toward back rotation 90 °, and the operative end surface making suction nozzle down, restPoses, and enters the work of next circulation subsequently.When actuating unit promotion suction nozzle turns to two final positions, described spring produces pulling force to suction nozzle all the time, and the end of described drive rod and sliding tray is close to, thus eliminates gap, guarantees the positioning precision of chip.
Drive motors in described die-bonding device drives slide block to do the movement of X-direction by power drive mechanism and lead-screw drive mechanism, thus drive weld assembly to do the motion of X-direction, weld assembly is close in the motion of X-direction or leaves the motion of antenna to be welded and chip, thus realizes the control to the welding action of weld assembly.
The present invention compared with prior art has following beneficial effect:
1, because die-bonding device of the present invention is located at the frame for chip Handling device, and this frame is arranged on the top of card transport, therefore described welder is also positioned at the top of card transport, do not occupy the position of card transport side, thus can not interfere with chip belt conveying mechanism, make the design of chip belt conveying mechanism, installment and debugging convenient, the volume of whole equipment is less, compacter.
2, in die-bonding device, the X axle slide block of the X-axis travel mechanism in described slide block and chip handling device is arranged in same chute, make described chute both for leading to the X-axis slide block in chip handling device, also for leading to the slide block of die-bonding device, make full use of the design feature of chute, make chip handling device and die-bonding device interrelated non-interference again, overall structure is compacter.
3, in chip handling device, only to adopt chip pick-up mechanism and switching mechanism just chip pick-up can be turned to required attitude, compare with turning-over of chip with adopting multiple mechanism in prior art to draw, not only structure greatly simplifies, saves installing space, and operating efficiency improves greatly.Further, chip, from picking up welding process, holds by same suction nozzle, does not have chip switching motion, and therefore the positioning precision of chip more easily ensures, guarantees that chip can be welded on the antenna of card exactly.
4, in chip handling device, because described suction nozzle has suction nozzle chip, packaged chip and 90 ° of functions overturn, therefore not only may be used for the chip carrying in double-interface card chip welding procedure, but also the chip carrying that may be used in contact chip package process and encapsulation, the intelligent card chip sealed in unit installing this intelligent card chip Handling device is made both to be applicable to carry out chip package to double-interface card, also be applicable to carry out chip package to contact intelligent card, improve the versatility of equipment, save equipment cost.
Accompanying drawing explanation
Fig. 1 ~ Fig. 4 is the structural representation of a detailed description of the invention of novel smart card chip welding device of the present invention, and wherein, Fig. 1 is front view, and Fig. 2 is left view, and Fig. 3 is top view, and Fig. 4 is stereogram.
Fig. 5 is the partial enlarged drawing of Fig. 4.
Fig. 6 ~ Fig. 9 is the structural representation of Fig. 1 ~ Fig. 4 illustrated embodiment chips Handling device, and wherein, Fig. 6 is front view, and Fig. 7 is right view, and Fig. 8 is top view, and Fig. 9 is stereogram.
Figure 10 is the perspective view of switching mechanism part in structure shown in Fig. 6 ~ Fig. 9.
Figure 11 and Figure 12 is the working state figure of suction nozzle in structure shown in Fig. 6 ~ Fig. 9, and wherein, Figure 11 is the schematic diagram before picking up chip, Figure 12 be absorption chip overturn after 90 ° prepare welding time schematic diagram.
Figure 13 ~ Figure 17 is the structural representation of Fig. 1 ~ Fig. 4 illustrated embodiment chips welder, and wherein, Figure 13 is front view, and Figure 14 is top view, and Figure 15 is left view, Figure 16 and Figure 17 is stereogram.
Figure 18 is the A-A sectional view of Figure 15.
Figure 19 is the upward view (saving weld assembly) of Figure 18.
The concrete structure schematic diagram that Figure 20 ~ Figure 22 is soldering tip in structure shown in Figure 13 ~ Figure 17, wherein, Figure 20 is front view, and Figure 21 is top view, and Figure 22 is stereogram.
Detailed description of the invention
Below in conjunction with embodiment and accompanying drawing, the present invention is described in further detail, but embodiments of the present invention are not limited thereto.
See Fig. 1 ~ Fig. 5, novel smart card chip welding device of the present invention comprises frame 1, chip handling device a, die-bonding device b, chip cutting means e, chip belt conveying mechanism c and card transport d.
See Fig. 1 ~ Figure 12, described chip handling device is primarily of chip pick-up mechanism and drive the travel mechanism of chip pick-up mechanism movement on X-axis, Y-axis and Z axis to form.Described X-axis is the trunnion axis perpendicular to card throughput direction, and described Y-axis is the trunnion axis vertical with X-axis, and described Z axis is vertical axis.Described chip pick-up mechanism comprises suction nozzle 6a, the vacuum plant be connected with suction nozzle 6a and the installing rack 7a for installing suction nozzle 6a, and described installing rack 7a is connected in travel mechanism, and described travel mechanism is arranged in frame 1.Described suction nozzle 6a is connected with switching mechanism 5a, and this switching mechanism 5a comprises the actuating unit 5-1a doing vertical lines motion, the spring being located at articulated structure between suction nozzle 6a and installing rack 7a, being located at the driving syndeton between actuating unit 5-1a and suction nozzle 6a and being connected between suction nozzle 6a and installing rack 7a; Wherein, described driving syndeton comprises the sliding tray 6-1a be located on suction nozzle 6a and the drive rod 5-4a be located on actuating unit 5-1a, and described drive rod 5-4a extend in sliding tray 6-1a; When described drive rod 5-4a to move to two end points of vertical stroke with actuating unit 5-1a, described drive rod 5-4a is positioned at the two ends of sliding tray 6-1a, and the operative end surface 6-4a of described suction nozzle 6a is the level of state respectively and vertical state.
See Fig. 1 ~ Figure 12, described travel mechanism comprises X-axis travel mechanism 2a, Y-axis moving mechanism 3a and Z axis travel mechanism 4a, wherein: described X-axis travel mechanism 2a comprises X-axis motor 2-1a, X-axis leading screw 2-2a and X-axis slide block 2-3a, wherein, described X-axis motor 2-1a is fixed in frame 1, the main shaft that described X-axis leading screw 2-2a is connected to X-axis motor 2-1a is connected with X-axis slide block 2-3a, and described X-axis slide block 2-3a is arranged in the chute 1-1 that is located in frame 1.Described Y-axis moving mechanism 3a comprises y-axis motor 3-1a, Y-axis leading screw 3-2a and Y-axis slide block 3-3a, wherein, described y-axis motor 3-1a is fixed on motor fixing seat 3-4a, this motor fixing seat 3-4a is fixed on X-axis slide block 2-3a, the main shaft that described Y-axis leading screw 3-2a is connected to y-axis motor 3-1a is connected with Y-axis slide block 3-3a, and described Y-axis slide block 3-3a is arranged on motor fixing seat 3-4a by slide rail.Described Z axis travel mechanism 4a comprises Z axis motor 4-1a, Z axis leading screw 4-2a and Z axis slide block 4-3a, wherein, Z axis motor 4-1a is fixed on Y-axis slide block 3-3a, the main shaft that described Z axis leading screw 4-2a is connected to Z axis motor 4-1a is connected with Z axis slide block 4-3a, described Z axis slide block 4-3a is arranged on Y-axis slide block 3-3a by slide rail, and described installing rack 7a is fixed on Z axis slide block 4-3a.By above-mentioned travel mechanism, drive installing rack 7a and on suction nozzle 6a move in three dimensions, to realize the movement of chip 8a in three dimensions, chip 8a is moved to welding post exactly.
See Fig. 1 ~ Figure 12, described actuating unit 5-1a is made up of cylinder, and the cylinder body 5-11a of this cylinder is fixed on installing rack 7a, and the extensible member 5-12a of this cylinder is provided with the linking arm 5-2a to downward-extension, and described drive rod 5-4a is arranged on the lower end of linking arm 5-2a.Adopt cylinder as actuating unit 5-1a, structure is simple, and it is convenient to control; By arranging the linking arm 5-2a to downward-extension, thus by the power transmission of cylinder to drive rod 5-4a, and can make, between the lower end of cylinder and suction nozzle 6a, there is certain distance, being convenient to suction nozzle 6a and freely rotating.
See Fig. 1 ~ Figure 12, described suction nozzle 6a is in " 7 " font, and the one end of being somebody's turn to do " 7 " font suction nozzle 6a is operative end surface 6-4a, and the other end arranges described articulated structure and sliding tray 6-1a; Described sliding tray 6-1a is straight trough, and the length direction of this sliding tray 6-1a is parallel with the operative end surface 6-4a of suction nozzle 6a.By adopting " 7 " font suction nozzle 6a, being convenient to arrange described articulated structure and sliding tray 6-1a, making to have certain distance between articulated structure and sliding tray 6-1a, this distance forms the arm of force that drive rod 5-4a promotes suction nozzle 6a rotation; Meanwhile, be also convenient on suction nozzle 6a, arrange the vacuum tube be connected with vacuum plant; In addition, " 7 " font suction nozzle 6a is adopted also to have following benefit: when the operative end surface 6-4a of suction nozzle 6a turns to vertical state from level, the operative end surface 6-4a of suction nozzle 6a is positioned at the outside of installing rack 7a, and when avoiding butt-joint, soldering tip 19a and installing rack 7a collides.
See Figure 10, described articulated structure comprises the axis hole be located on suction nozzle 6a and the rotating shaft 5-3a connecting described axis hole and installing rack 7a; Described axis hole is provided with the breach 6-2a extending to suction nozzle 6a edge, and suction nozzle 6a is provided with the screw hole 6-3a perpendicular to breach 6-2a; The position that described rotating shaft 5-3a is being connected with installing rack 7a is provided with bearing.Arrange described breach 6-2a to be convenient to rotating shaft 5-3a and to be encased in axis hole, and by arranging described screw hole 6-3a and screw tightens up axis hole, prevent rotating shaft 5-3a from getting loose.
See Fig. 1 ~ Figure 12, one end of described spring 5-13a is connected on the connecting hole that is located on suction nozzle 6a, the other end is connected on the connecting rod 5-13a that is fixedly connected with the cylinder body 5-11a of described cylinder, so more be conducive to allowing drive rod 5-4a and sliding tray 6-1a fully fit, eliminate gap, improve positioning precision.
When actuating unit 5-1a promotion suction nozzle 6a turns to two final positions, described spring produces pulling force to suction nozzle 6a all the time, and the end of described drive rod 5-4a and sliding tray 6-1a is close to, thus eliminates gap, guarantees the positioning precision of chip 8a.
See Fig. 1 ~ Fig. 5, Figure 13 ~ Figure 22, described die-bonding device comprises weld assembly 18 and drives weld assembly 18 to perform the driving mechanism of welding action.Described driving mechanism comprises drive motors 2, slide block 3, drives the lead-screw drive mechanism of slide block 3 movement and the coupling assembling of connection sliding block 3 and weld assembly 18, wherein, described drive motors 2 and slide block 3 are arranged on the frame 1 for chip Handling device, described frame 1 is provided with the chute 1-1 extended along X-direction, and described slide block 3 is arranged in this chute 1-1; Leading screw 4 one end in described lead-screw drive mechanism is through described slide block 3, and the other end is connected with drive motors 2 by power drive mechanism.Described X-axis is the trunnion axis perpendicular to card throughput direction, described weld assembly 18 along this direction close to antenna to be welded and chip.
See Fig. 1 ~ Fig. 5, Figure 13 ~ Figure 22, described coupling assembling comprises vertical adjustment mechanism, elastic buffering mechanism and Y-axis micro-adjusting mechanism.Described Y-axis is the trunnion axis being parallel to card throughput direction.
See Fig. 1 ~ Fig. 5, Figure 13 ~ Figure 22, described vertical adjustment mechanism is made up of vertical slide mechanism and threaded adjusting mechanism, and described vertical slide mechanism comprises the vertical guide 7 be connected with slide block 3 and the vertical sliding part 8 be connected in vertical guide 7; The adjusting screw(rod) 10 that described threaded adjusting mechanism comprises the upper adjusting seat 9 be located in vertical guide 7, is located at the lower adjusting seat 11 on vertical sliding part 8 and is connected on upper adjusting seat 9 and lower adjusting seat 11, is threaded connection anatomical connectivity between described adjusting screw(rod) 10 and lower adjusting seat 11.By arranging above-mentioned vertical adjustment mechanism, the vertical position of soldering tip 19 in weld assembly 18 can be regulated, thus as required soldering tip 19 can be adjusted to the correct position of vertical direction.The principle regulated is: by rotating adjusting screw(rod) 10, thus drive vertical sliding part 8 to slide in vertical guide 7, and move to suitable position.
See Fig. 1 ~ Fig. 5, Figure 13 ~ Figure 22, described elastic buffering mechanism comprises the upper mount pad 12 be connected on vertical sliding part 8, arrange lower mount pad 13 below mount pad 12, be connected to X between mount pad 12 and lower mount pad 13 to slide mechanism and the elastic buffering mechanism that is located between upper mount pad 12 and lower mount pad 13, wherein, described X comprises to slide mechanism and is arranged on X bottom upper mount pad 12 to slide rail 15 be fixed on the X at lower mount pad 13 top to slide 20, and described X is connected to slide rail 15 to slide 20 with X; Described elastic buffering mechanism comprises the buffer bar 15 be connected on lower mount pad 13, and this buffer bar 15 is from bottom to top through the cushion hole 12-1 be located on upper mount pad 12; Locating part 22 and buffer spring 21 is provided with in described upper mount pad 12, this locating part 22 and buffer spring 21 are arranged on the both sides of buffer bar 15 along X-direction, wherein, described locating part 22 is positioned at the side near soldering tip 19, buffer spring 21 is positioned at opposite side, and the end of described locating part 22 and buffer spring 21 to extend in cushion hole 12-1 and acts on buffer bar 15.
The object arranging above-mentioned elastic buffering mechanism to be when performing welding action as weld assembly 18 provides buffering: during welding, driving mechanism drives soldering tip 19 in weld assembly 18 along X-direction towards antenna to be welded and chip motion, and scolding tin antenna being pressed on chip realizes welding, when soldering tip 19 Contact antenna and scolding tin, there is certain impulsive force, adopt above-mentioned elastic buffering mechanism that soldering tip 19 pairs of antennas and chip can be avoided to produce excessive impact, prevent antenna to be pressed down.The operation principle of this elastic buffering mechanism is: under normality, and buffer bar 15 is pushed against on locating part 22 by described buffer spring 21, and the weld assembly 18 be now connected on lower mount pad 13 is positioned at X-direction foremost; Perform in welding course of action, when soldering tip 19 Contact antenna and chip and when impulsive force is backward produced to lower mount pad 13, described buffer spring 21 just plays cushioning effect, makes mount pad 12 and lower mount pad 13 produce X at X to slide mechanism place and moves to current buffer.
Further, be provided with in described upper mount pad 12 two be oppositely arranged and the installing hole be communicated with cushion hole 12-1, described locating part 22 and buffer spring 21 arrange in one of them installing hole respectively; Described locating part 22 is screw, and this screw is threaded with installing hole; The outer end of the installing hole corresponding with buffer spring 21 is provided with closeouts 23.Adopt screw formation locating part 22 can regulate the position of locating part 22, described closeouts 23 is set for carrying out spacing to buffer spring 21.
See Fig. 1 ~ Fig. 5, Figure 13 ~ Figure 22, described Y-axis micro-adjusting mechanism comprises bottom mount pad 16, is arranged on the Y-direction slide mechanism between lower mount pad 13 and bottom mount pad 16 and finely tunes actuating unit, wherein, described bottom mount pad 16 is located at the below of lower mount pad 13; Described Y-direction slide mechanism comprises the Y-direction slideway arranged bottom lower mount pad 13 and the Y-direction sliding part 17 being fixed on mount pad 16 top, bottom, and described Y-direction sliding part 17 is connected with Y-direction slideway; Described fine setting actuating unit comprises fine adjustment shaft, is located at the eccentric shaft 15-1 of fine adjustment shaft lower end and is located at the fine setting hole 17-1 in Y-direction sliding part 17, and described fine adjustment shaft vertically passes through lower mount pad 13, and is connected with lower mount pad 13 by rotation connection structure; Described eccentric shaft 15-1 mates in described fine setting hole 17-1; Described weld assembly 18 is arranged on the mount pad 16 of bottom.
Adopt the effect of above-mentioned Y-axis micro-adjusting mechanism to be that the fine setting of Y direction is carried out in the position of butt welding connected components 18, make soldering tip 19 aim at antenna in Y direction.The operation principle of this Y-axis micro-adjusting mechanism is: drive eccentric shaft 15-1 to rotate by rotating fine adjustment shaft, thus drive Y-direction slideway and bottom mount pad 16 to move along Y-axis by fine setting hole 17-1, realize the adjustment of weld assembly 18Y to position.
Further, described fine adjustment shaft is made up of described buffer bar 15, makes same parts have two functions, is conducive to simplifying structure; Described rotation connection structure comprises the shaft shoulder be located on fine adjustment shaft and the limit base 24 being fixed on lower mount pad 13 top; Described fine adjustment shaft passes from limit base 24, and be provided with the spacing hole matched with the described shaft shoulder in limit base 24, the described shaft shoulder is limited in spacing hole, and the lower end of the shaft shoulder is fitted on the end face of lower mount pad 13.Guarantee that fine adjustment shaft can freely rotate by above-mentioned rotation connection structure, with the axially-movable of limit fine adjustment shaft.
See Fig. 1 ~ Fig. 5, Figure 13 ~ Figure 22, described Y-axis micro-adjusting mechanism is two, and each Y-axis micro-adjusting mechanism connects a weld assembly 18.Arrange two weld assemblies 18 can weld two strip antennas on card simultaneously, improve welding efficiency; By the Y-direction distance of soldering tip 19 in two adjustable two weld assemblies 18 of Y-axis micro-adjusting mechanism, to adapt to the different distance between two strip antennas on card.
See Fig. 1 ~ Fig. 5, Figure 13 ~ Figure 22, described power drive mechanism and drive motors 2 be arranged on be located at chute 1-1 end installing plate 6 on, described power drive mechanism is synchronous belt drive mechanism 5.By described synchronous belt drive mechanism 5, by the power transmission of drive motors 2 to the leading screw 4 in lead-screw drive mechanism, thus slide block 3 is driven to slide.
See Figure 20 ~ Figure 22, soldering tip 19 in described weld assembly 18 comprises soldering tip matrix and weld part 19-1, wherein, described weld part 19-1 comprises weld part 19-2 and lower weld part 19-3, is provided with the groove 19-4 caved inward between described upper weld part 19-2 and lower weld part 19-3; The end of described upper weld part 19-2 extends out to the end exceeding lower weld part 19-3.Adopt the effect of the soldering tip 19 of said structure to be: upper weld part 19-2 first Contact antenna top in welding process, and push against in antenna top insertion scolding tin, the heat now gone up on weld part 19-2 passes to scolding tin rapidly, makes the rapid melting of scolding tin; Descend weld part 19-3 ability Contact antenna bottom subsequently and sky be pushed down in the scolding tin of melting, weld part 19-3 is very little to the impulsive force of the bottom of antenna at present for this, damage can not be caused to the bottom of antenna, the bottom of antenna be there will not be and fracture, ensure that welding quality.Further, because first upper weld part 19-2 contacts scolding tin and stretch in scolding tin during welding, therefore, it is possible to allow the rapid melting of scolding tin, improve welding efficiency, and there will not be fried tin, avoid producing tin sweat(ing), improve welding quality.
See Figure 20 ~ Figure 22, the end of described upper weld part 19-2 is arc-shaped, the damage to antenna when compressing antenna to alleviate; The end of described upper weld part 19-2 is the large gradual change type structure in middle little, upper and lower two, be convenient to weld part 19-2 like this when being pressed on scolding tin by antenna, reduce resistance, weld part 19-2 on this can be rapidly inserted in scolding tin, thus allow the rapid melting of scolding tin; In addition, gradual change type structure also makes weld part 19-2 can not cause great impact in the process inserting scolding tin.
See Fig. 1 ~ Figure 22, operation principle of the present invention is: card 25 to be welded is moved to welding post 1c place and stops by card transport c; Chip on chip belt 1d is transported to the blanking die 1e place of chip cutting means e by chip belt conveying mechanism d; Chip 8a on chip belt 1e goes out by chip cutting means e, obtains one single chip 8a;
Chip 8a good for stamping-out is transported to welding post 1c place and regulates chip 8a attitude by described chip handling device a, matched with die-bonding device b welding action, be specially: under original state, the operative end surface 6-4a of suction nozzle 6a down, travel mechanism drives suction nozzle 6a to move to above the cutting mould of chip cutting means, then travel mechanism drives suction nozzle 6a to move downward close to the chip 8a in cutting mould, now the solder joint 8-1a of chip 8a, picks up chip 8a down (see Figure 11) under the effect of vacuum plant; Switching mechanism 5a works subsequently, actuating unit 5-1a wherein promotes suction nozzle 6a half-twist by drive rod 5-4a and sliding tray 6-1a, the chip 8a on suction nozzle 6a is made to be converted to vertical state from level, meanwhile, travel mechanism drives suction nozzle 6a to move towards welding post place, antenna 25-1 (see Figure 12) on the card 25 allowing the solder joint 8-1a of chip 8a aim to have sent in card delivery track, soldering tip 10a subsequently in welder performs welding action, is welded on by chip 8a on antenna 25-1; Last travel mechanism drives suction nozzle 6a to reset, and actuating unit 5-1a promotes suction nozzle 6a toward back rotation 90 °, and the operative end surface 6-4a making suction nozzle 6a down, restPoses, and enters the work of next circulation subsequently.
Drive motors 2 in described die-bonding device drives slide block 3 to do the movement of X-direction by power drive mechanism and lead-screw drive mechanism, thus drive weld assembly 18 to do the motion of X-direction, weld assembly 18 is close in the motion of X-direction or leaves the motion of antenna to be welded and chip, thus realizes the control to the welding action of weld assembly 18.
See Fig. 1 ~ Figure 22, because welder b of the present invention is located at the frame 1 for chip Handling device a, and this frame 1 is arranged on the top of card transport c, therefore described welder b is also positioned at the top of card transport c, do not occupy the position of card transport c side, thus can not interfere with chip belt conveying mechanism d, make the design of chip belt conveying mechanism d, installment and debugging convenient, equipment volume is less compacter.Described slide block 3 is arranged in same chute 1-1 with the X-axis slide block 2-3a of the X-axis travel mechanism in chip handling device a, make described chute 1-1 both for leading to the X-axis slide block 2-3a in chip handling device a, also for leading to the slide block 3 of this welder b, make full use of the design feature of chute 1-1, make chip handling device a and welder b interrelated non-interference again, overall structure is compacter.
Above-mentioned is the present invention's preferably embodiment; but embodiments of the present invention are not by the restriction of foregoing; change, the modification done under other any does not deviate from Spirit Essence of the present invention and principle, substitute, combine, simplify; all should be the substitute mode of equivalence, be included within protection scope of the present invention.
Claims (10)
1. a novel smart card chip welding device, comprises frame, chip handling device, die-bonding device, chip cutting means, chip belt conveying mechanism and card transport; It is characterized in that:
Described chip handling device comprises chip pick-up mechanism and drives the travel mechanism of chip pick-up mechanism movement on X-axis, Y-axis and Z axis, described chip pick-up mechanism comprises suction nozzle, the vacuum plant be connected with suction nozzle and the installing rack for installing suction nozzle, described installing rack is connected in travel mechanism, and described travel mechanism is arranged in frame; Described suction nozzle is connected with switching mechanism, and this switching mechanism comprises the actuating unit doing vertical lines motion, the spring being located at articulated structure between suction nozzle and installing rack, being located at the driving syndeton between actuating unit and suction nozzle and being connected between suction nozzle and installing rack; Wherein, described driving syndeton comprises the sliding tray be located on suction nozzle and the drive rod be located on actuating unit, and described drive rod extend in sliding tray; When described drive rod to move to two end points of vertical stroke with actuating unit, described drive rod is positioned at the two ends of sliding tray, and the operative end surface of described suction nozzle is the level of state respectively and vertical state;
Described die-bonding device comprises weld assembly and drives weld assembly to perform the driving mechanism of welding action, described driving mechanism comprises drive motors, slide block, the lead-screw drive mechanism of driving slide block movement and the coupling assembling of connection sliding block and weld assembly, wherein, described drive motors and slide block are arranged in frame, described frame is provided with the chute extended along X-direction, and described slide block is arranged in this chute; Leading screw one end in described lead-screw drive mechanism is through described slide block, and the other end is connected with drive motors by power drive mechanism;
Described card transport is arranged on the below between chip handling device and die-bonding device, and the throughput direction of this card transport is perpendicular to described X-axis, and card transport is provided with for allowing card stop the welding post carrying out chips welding; Described chip cutting means is arranged on side corresponding with chip handling device in outside welding post; Described chip belt conveying mechanism is arranged along the direction perpendicular to X-axis, and the chip belt in this chip belt conveying mechanism is through described welding post and chip cutting means.
2. novel smart card chip welding device according to claim 1, it is characterized in that, described actuating unit is made up of cylinder, and the cylinder body of this cylinder is fixed on installing rack, the extensible member of this cylinder is provided with the linking arm to downward-extension, and described drive rod is arranged on the lower end of linking arm;
Described suction nozzle is in " 7 " font, and the one end of being somebody's turn to do " 7 " font suction nozzle is operative end surface, and the other end arranges described articulated structure and sliding tray; Described sliding tray is straight trough, and the length direction of this sliding tray is parallel with the operative end surface of suction nozzle.
3. novel smart card chip welding device according to claim 2, is characterized in that, described articulated structure comprises the axis hole be located on suction nozzle and the rotating shaft connecting described axis hole and installing rack; Described axis hole is provided with the breach extending to suction nozzle edge, and suction nozzle is provided with the screw hole perpendicular to breach; The position that described rotating shaft is being connected with installing rack is provided with bearing;
One end of described spring is connected on the connecting hole that is located on suction nozzle, and the other end is connected on the connecting rod that is fixedly connected with the cylinder body of described cylinder.
4. the novel smart card chip welding device according to any one of claim 2 ~ 4, is characterized in that, described travel mechanism comprises X-axis travel mechanism, Y-axis moving mechanism and Z axis travel mechanism, wherein:
Described X-axis travel mechanism comprises X-axis motor, X-axis leading screw and X-axis slide block, and wherein, described X-axis motor is fixed in frame, and the main shaft that described X-axis leading screw is connected to X-axis motor is connected with X-axis slide block, and described X-axis slide block is arranged in the chute that is located in frame;
Described Y-axis moving mechanism comprises y-axis motor, Y-axis leading screw and Y-axis slide block, wherein, described y-axis motor is fixed on motor mount, this motor mount is fixed on X-axis slide block, the main shaft that described Y-axis leading screw is connected to y-axis motor is connected with Y-axis slide block, and described Y-axis slide block is arranged on motor mount by slide rail;
Described Z axis travel mechanism comprises Z axis motor, Z axis leading screw and Z axis slide block, wherein, Z axis motor is fixed on Y-axis slide block, the main shaft that described Z axis leading screw is connected to Z axis motor is connected with Z axis slide block, described Z axis slide block is arranged on Y-axis slide block by slide rail, and described installing rack is fixed on Z axis slide block.
5. novel smart card chip welding device according to claim 1, it is characterized in that, described coupling assembling comprises vertical adjustment mechanism, this vertical adjustment mechanism is made up of vertical slide mechanism and threaded adjusting mechanism, and described vertical slide mechanism comprises the vertical guide be connected with slide block and the vertical sliding part be connected in vertical guide; The adjusting screw(rod) that described threaded adjusting mechanism comprises the upper adjusting seat be located in vertical guide, is located at the lower adjusting seat on vertical sliding part and is connected on upper adjusting seat and lower adjusting seat, is threaded connection anatomical connectivity between described adjusting screw(rod) and lower adjusting seat.
6. novel smart card chip welding device according to claim 5, it is characterized in that, described coupling assembling also comprises elastic buffering mechanism, this elastic buffering mechanism comprises the upper mount pad be connected on vertical sliding part, lower mount pad below mount pad is set, be connected to X between mount pad and lower mount pad to slide mechanism and the elastic buffering mechanism that is located between upper mount pad and lower mount pad, wherein, described X comprises to slide mechanism and is arranged on X bottom upper mount pad to slide rail be fixed on the X at lower mount pad top to slide, described X is connected to slide rail to slide with X, described elastic buffering mechanism comprises the buffer bar be connected on lower mount pad, and this buffer bar is from bottom to top through the cushion hole be located on upper mount pad, locating part and buffer spring is provided with in described upper mount pad, this locating part and buffer spring are arranged on the both sides of buffer bar along X-direction, wherein, described locating part is positioned at the side near soldering tip, buffer spring is positioned at opposite side, and the end of described locating part and buffer spring to extend in cushion hole and acts on buffer bar,
Be provided with in described upper mount pad two be oppositely arranged and the installing hole be communicated with cushion hole, described locating part and buffer spring arrange in one of them installing hole respectively; Described locating part is screw, and this screw is threaded with installing hole; The outer end of the installing hole corresponding with buffer spring is provided with closeouts.
7. novel smart card chip welding device according to claim 6, it is characterized in that, described coupling assembling also comprises Y-axis micro-adjusting mechanism, this Y-axis micro-adjusting mechanism comprises bottom mount pad, is arranged on the Y-direction slide mechanism between lower mount pad and bottom mount pad and finely tunes actuating unit, wherein, described bottom mount pad is located at the below of lower mount pad; Described Y-direction slide mechanism comprises the Y-direction slideway arranged bottom lower mount pad and the Y-direction sliding part being fixed on mount pad top, bottom, and described Y-direction sliding part is connected with Y-direction slideway; Described fine setting actuating unit comprises fine adjustment shaft, is located at the eccentric shaft of fine adjustment shaft lower end and is located at the fine setting hole in Y-direction sliding part, and described fine adjustment shaft vertically passes through lower mount pad, and is connected with lower mount pad by rotation connection structure; Described eccentric shaft coupling is in described fine setting hole; Described weld assembly is arranged on the mount pad of bottom.
8. novel smart card chip welding device according to claim 5, is characterized in that, described fine adjustment shaft is made up of described buffer bar; Described rotation connection structure comprises the shaft shoulder be located on fine adjustment shaft and the limit base being fixed on lower mount pad top; Described fine adjustment shaft passes from limit base, and be provided with the spacing hole matched with the described shaft shoulder in limit base, the described shaft shoulder is limited in spacing hole, and the lower end of the shaft shoulder is fitted on the end face of lower mount pad;
Described Y-axis micro-adjusting mechanism is two, and each Y-axis micro-adjusting mechanism connects a weld assembly.
9. the novel smart card chip welding device according to any one of claim 5 ~ 8, is characterized in that, described power drive mechanism and drive motors be arranged on be located at chute end installing plate on, described power drive mechanism is synchronous belt drive mechanism.
10. the novel smart card chip welding device according to any one of claim 5 ~ 8, it is characterized in that, soldering tip in described weld assembly comprises soldering tip matrix and weld part, wherein, described weld part comprises weld part and lower weld part, is provided with the groove caved inward between described upper weld part and lower weld part; The end of described upper weld part extends out to the end exceeding lower weld part;
The end of described upper weld part is arc-shaped; The end of described upper weld part is the large gradual change type structure in middle little, upper and lower two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510254562.3A CN104875017B (en) | 2015-05-16 | 2015-05-16 | Novel chip welding device for smart card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510254562.3A CN104875017B (en) | 2015-05-16 | 2015-05-16 | Novel chip welding device for smart card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104875017A true CN104875017A (en) | 2015-09-02 |
| CN104875017B CN104875017B (en) | 2017-04-26 |
Family
ID=53942826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510254562.3A Active CN104875017B (en) | 2015-05-16 | 2015-05-16 | Novel chip welding device for smart card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104875017B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105081554A (en) * | 2015-09-10 | 2015-11-25 | 昆山斯格威电子科技有限公司 | Sliding mechanism controlling position of stir friction welding head |
| CN106392646A (en) * | 2016-12-14 | 2017-02-15 | 深圳源明杰科技股份有限公司 | Intelligent card wire picking device and intelligent card production system |
| CN107293512A (en) * | 2017-08-05 | 2017-10-24 | 广州明森科技股份有限公司 | A kind of chip packaging device of multicore smart card |
| CN108364892A (en) * | 2018-03-31 | 2018-08-03 | 广州明森科技股份有限公司 | A kind of burning chip equipment |
| CN115770979A (en) * | 2022-11-24 | 2023-03-10 | 徐州市沂芯微电子有限公司 | Chip packaging detection machine with welding spot position fine adjustment function |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000163545A (en) * | 1998-11-25 | 2000-06-16 | Tokin Corp | Ic card production device |
| CN102820602A (en) * | 2012-07-13 | 2012-12-12 | 上海一芯智能科技有限公司 | Intelligent double-interface-card antenna welding process and equipment |
| CN103934605A (en) * | 2014-04-17 | 2014-07-23 | 福州开发区星云电子自动化有限公司 | Full-automatic spot welding machine for power battery pack electrode slice |
| CN204673277U (en) * | 2015-05-16 | 2015-09-30 | 广州市明森机电设备有限公司 | A kind of novel smart card chip welding device |
-
2015
- 2015-05-16 CN CN201510254562.3A patent/CN104875017B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000163545A (en) * | 1998-11-25 | 2000-06-16 | Tokin Corp | Ic card production device |
| CN102820602A (en) * | 2012-07-13 | 2012-12-12 | 上海一芯智能科技有限公司 | Intelligent double-interface-card antenna welding process and equipment |
| CN103934605A (en) * | 2014-04-17 | 2014-07-23 | 福州开发区星云电子自动化有限公司 | Full-automatic spot welding machine for power battery pack electrode slice |
| CN204673277U (en) * | 2015-05-16 | 2015-09-30 | 广州市明森机电设备有限公司 | A kind of novel smart card chip welding device |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105081554A (en) * | 2015-09-10 | 2015-11-25 | 昆山斯格威电子科技有限公司 | Sliding mechanism controlling position of stir friction welding head |
| CN106392646A (en) * | 2016-12-14 | 2017-02-15 | 深圳源明杰科技股份有限公司 | Intelligent card wire picking device and intelligent card production system |
| CN106392646B (en) * | 2016-12-14 | 2018-03-27 | 深圳源明杰科技股份有限公司 | The wire picking device of smart card and the production system of smart card |
| CN107293512A (en) * | 2017-08-05 | 2017-10-24 | 广州明森科技股份有限公司 | A kind of chip packaging device of multicore smart card |
| CN107293512B (en) * | 2017-08-05 | 2023-12-05 | 广州明森科技股份有限公司 | Chip packaging device of multi-core smart card |
| CN108364892A (en) * | 2018-03-31 | 2018-08-03 | 广州明森科技股份有限公司 | A kind of burning chip equipment |
| CN115770979A (en) * | 2022-11-24 | 2023-03-10 | 徐州市沂芯微电子有限公司 | Chip packaging detection machine with welding spot position fine adjustment function |
| CN115770979B (en) * | 2022-11-24 | 2023-08-22 | 徐州市沂芯微电子有限公司 | Chip packaging detector with welding spot position fine adjustment function |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104875017B (en) | 2017-04-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104875017A (en) | Novel chip welding device for smart card | |
| CN204673277U (en) | A kind of novel smart card chip welding device | |
| CN103111843B (en) | Automatic triangular spring assembly machine | |
| CN104835768A (en) | Intelligent card chip handling device | |
| CN108213645A (en) | A kind of power supply DC line automatic welding machines | |
| CN109462976A (en) | A kind of efficient accurately automatism card machine | |
| CN104302117B (en) | A kind of improved vertical inserter | |
| CN102120245A (en) | Contact riveter | |
| CN201969794U (en) | Riveting machine for contact point | |
| CN109250401A (en) | Electronic smoke atomizer self-feeding capping stitching integrated machine | |
| CN208575848U (en) | Single arm type manipulator for loading and unloading | |
| CN102244144A (en) | Automatic silicon wafer deviation-rectifying device | |
| CN110449684B (en) | Synchronous welding mechanism for multiple conducting wire chips | |
| CN114769067A (en) | Dispensing valve deviation correcting mechanism and dispensing equipment with dispensing valve deviation correcting mechanism | |
| CN105478984B (en) | A kind of chip spot welding device of double-interface card | |
| CN214917634U (en) | Double-valve asynchronous dispenser | |
| CN109822673A (en) | A kind of moulding integrated equipment of stamping die | |
| CN207577792U (en) | Glass cover-plate package system | |
| CN105750970B (en) | A kind of tool magazine is arranged on the Longmen machine tool on main shaft frame | |
| CN209628011U (en) | A kind of efficient accurately automatism card machine | |
| CN208775806U (en) | A kind of tooling circulation mechanism transmitted based on guide rail slide block, synchronous belt | |
| CN204248893U (en) | Realize the z-axis die set of open-close type manipulator accurate pick-and-place fritter rule material | |
| CN203109465U (en) | Material system for compressing materials elastically | |
| CN210498685U (en) | Synchronous welding mechanism for multiple lead chips | |
| CN208571872U (en) | Stablize press cutter mechanism and high-precision magnetite loading attachment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 510520 Guangdong city of Guangzhou province Tianhe District Guangshan Road No. 500 building (Building 3) tissue culture Applicant after: GUANGZHOU MINGSEN MECH.&ELEC. EQUIPMENT CO., LTD. Address before: 510640 Guangdong Province, Guangzhou Tianhe District, No. 87 ban 1 floor, 2 floor Applicant before: Guangzhou Mingsen Mech. & Elec. Equipment Co.,Ltd. |
|
| COR | Change of bibliographic data | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |