CN115763623A - Chip mounter applicable to optical device and optical module - Google Patents
Chip mounter applicable to optical device and optical module Download PDFInfo
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- CN115763623A CN115763623A CN202211459130.2A CN202211459130A CN115763623A CN 115763623 A CN115763623 A CN 115763623A CN 202211459130 A CN202211459130 A CN 202211459130A CN 115763623 A CN115763623 A CN 115763623A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The invention relates to a chip mounter applied to optical devices and optical modules, which comprises an operation table, a negative pressure adsorption assembly, a transverse rotating shaft and an operation handle for driving the transverse rotating shaft to rotate, wherein a transverse moving member is arranged on the transverse rotating shaft and is connected with the operation handle through a connecting rod mechanism; the vertical moving member is arranged in front of the transverse moving member, the lower end of the vertical moving member is in longitudinal sliding fit with the transverse moving member, and the transverse rotating shaft drives the vertical moving member to move when rotating; the vertical moving member is provided with a vertical slideway, the negative pressure adsorption assembly comprises a negative pressure suction nozzle in sliding fit with the vertical slideway, a detection assembly connected with the alarm module is arranged on the upper side of the negative pressure suction nozzle, and when the detection assembly detects the upper end of the negative pressure suction nozzle, the alarm module sends out an alarm instruction. The invention is convenient for manually controlling the position of the chip, is convenient for operation and improves the chip mounting efficiency; and after the chip is pasted in place, an alarm module is used for sending an alarm indication, so that an operator can stop pasting the chip quickly, and the chip is prevented from being damaged.
Description
The technical field is as follows:
the invention relates to a chip mounter applicable to optical devices and optical modules.
Background art:
an optical module is a core of optical communication, and is used for converting optical signals and electrical signals. The optical module mainly comprises an optical device and a circuit board, wherein the optical device can place an optical chip inside the optical device on the circuit board or inside the optical device according to a packaging form, the process is usually completed by means of automatic chip mounting equipment, and the automatic chip mounting equipment is expensive, so that the product development cost can be greatly increased. In the conventional manual chip mounting equipment, the chip position is controlled by adjusting the sliding table in the chip mounting process, so that the operation is not convenient and fast enough, and the efficiency is low; and the condition that the paster pressure is insufficient or the paster pressure is too big easily appears when the paster operation is carried out manually, influences the paster quality.
The invention content is as follows:
the invention aims to solve the problems in the prior art, namely, the invention provides a chip mounter which can be applied to optical devices and optical modules, and has the advantages of reasonable design, convenience in operation and improvement on chip mounting quality.
In order to achieve the purpose, the invention adopts the technical scheme that: a chip mounter applicable to optical devices and optical modules comprises an operation table, a negative pressure adsorption assembly, a transverse rotating shaft and an operation handle, wherein the negative pressure adsorption assembly is arranged above the operation table and used for adsorbing chips, the operation handle is used for driving the transverse rotating shaft to rotate, a transverse moving member is mounted on the transverse rotating shaft, the transverse moving member is connected with the operation handle through a connecting rod mechanism, and the operation handle drives the transverse moving member to move along the transverse direction; the lower end of the vertical moving member is in longitudinal sliding fit with the transverse moving member, and when the transverse rotating shaft rotates, the transverse moving member drives the vertical moving member to vertically move; the vertical moving member is provided with a vertical through slide, the negative pressure adsorption assembly comprises a negative pressure suction nozzle in sliding fit with the vertical slide, a detection assembly connected with the alarm module is arranged on the upper side of the negative pressure suction nozzle, and when the detection assembly detects the upper end of the negative pressure suction nozzle, the alarm module sends out an alarm instruction.
Further, the transverse moving member is in sliding fit with a transverse sliding rail arranged at the bottom of the left end of the transverse rotating shaft; the connecting rod mechanism comprises a first connecting rod and a second connecting rod, the rear end of the first connecting rod is hinged with the right end of the transverse rotating shaft in the horizontal direction, the front end of the first connecting rod is hinged with the right end of the second connecting rod in the horizontal direction, and the left end of the second connecting rod is hinged with the transverse moving piece in the horizontal direction; the operating handle is fixedly connected with the front end of the first connecting rod.
Furthermore, the front end of the upper part of the transverse moving part is provided with a pair of longitudinal sliding chutes which are distributed left and right; the vertical moving member is arranged between the pair of longitudinal sliding grooves and is in sliding fit with the vertical sliding rail positioned on the rear side of the vertical moving member, and sliding idler wheels are arranged on the left side face and the right side face of the lower portion of the vertical moving member and are contained in the longitudinal sliding grooves and are in sliding fit with the longitudinal sliding grooves.
Further, the lower end of the vertical moving piece is fixedly connected with an installation block, and a vertical slideway is arranged on the installation block; the upper end of the negative pressure suction nozzle is connected with a suction nozzle clamping block movably arranged at the top of the mounting block, a connecting piece connected with the negative pressure suction nozzle is arranged above the suction nozzle clamping block, a rotating disc driven by a rotating mechanism to rotate in the horizontal direction is arranged above the connecting piece, and the lower end of the rotating disc is provided with a vertical slot for the connecting piece to extend into; the detection assembly is arranged at the upper end of one side of the vertical slot and used for detecting the connecting piece.
Furthermore, an elastic piece capable of deforming vertically is connected between the suction nozzle clamping block and the vertical moving piece, the elastic piece comprises a pair of tension springs arranged on the left side and the right side of the suction nozzle clamping block, the tension springs are vertically arranged, and the upper end and the lower end of each tension spring are connected with the suction nozzle clamping block and the vertical moving piece through connecting bolts respectively.
Furthermore, the connecting piece comprises a connecting pipe, the side wall of the connecting pipe is connected with a negative pressure air pipe, the lower end of the connecting pipe is connected with the negative pressure suction nozzle, the outer wall of the upper end of the connecting pipe is provided with a rotating shifting block which is used for extending into the vertical slot, one opposite side of the rotating shifting block is provided with an induction block which is beneficial to the detection assembly to induce, and the induction block is fixed on the outer wall of the upper end of the connecting pipe; the detection assembly comprises a micro optical sensor, the micro optical sensor is fixedly installed at the bottom of the rotating disc, and the sensing grooves of the micro optical sensor and the vertical slots are distributed oppositely to facilitate the sensing blocks to extend into the rotating disc vertically.
Further, the rotating mechanism comprises a belt pulley mechanism horizontally arranged on the vertical moving member, and a driving motor of the belt pulley mechanism is controlled by a foot switch; the middle of the rotating disc is connected with the left end of the belt pulley mechanism, the belt pulley mechanism drives the rotating disc to rotate in the horizontal direction, a positioning block is arranged in the middle of the bottom face of the rotating disc, a vertical inserting groove is formed in the middle of the positioning block, and the vertical inserting groove penetrates through the rotating disc in the radial direction.
Furthermore, the week side of vertical slide is equipped with the vertical guide that a plurality of is the circumference equipartition, vertical guide includes a pair of upper and lower distribution and is used for the leading wheel that contacts with the outer wall of negative pressure suction nozzle.
Further, still including locating the manual lift slip table on the operation panel, manual lift slip table is located the negative pressure adsorption component under, and manual lift slip table is used for placing the article of treating the paster and the magazine that is equipped with the chip.
Further, a microscope is arranged on the front side of the negative pressure suction nozzle, a vertical support fixed on the operating table is arranged on the left side of the microscope, a longitudinal moving slide rail is mounted at the upper end of the vertical support, a vertical moving slide rail is mounted on a sliding portion of the longitudinal moving slide rail, a transverse moving slide rail is mounted on a sliding portion of the vertical moving slide rail, and a microscope mounting frame is mounted on a sliding portion of the transverse moving slide rail and used for mounting the microscope; and locking screws for locking the sliding parts are arranged on the longitudinal movable sliding rail, the vertical movable sliding rail and the transverse movable sliding rail.
Compared with the prior art, the invention has the following effects: the invention has reasonable structural design, is convenient for manually controlling the position of the chip, is convenient for operation and improves the chip mounting efficiency; and after the chip is pasted in place, an alarm module is used for sending an alarm indication, so that an operator can stop pasting the chip quickly, and the chip is prevented from being damaged.
Description of the drawings:
FIG. 1 is a first perspective view of an embodiment of the present invention;
FIG. 2 is a schematic perspective view of the second embodiment of the present invention;
FIG. 3 is a schematic perspective view of a linkage mechanism in an embodiment of the present invention;
FIG. 4 is a schematic top configuration view of a linkage mechanism in an embodiment of the present invention;
FIG. 5 is a partial configuration diagram of a link mechanism in the embodiment of the invention;
FIG. 6 is a first schematic view of the configuration of the vertical moving member and the horizontal moving member in cooperation in the embodiment of the present invention;
FIG. 7 is a second schematic view of the configuration of the vertical moving member and the horizontal moving member in cooperation in the embodiment of the present invention;
FIG. 8 is an enlarged schematic view at A in FIG. 7;
FIG. 9 is a schematic perspective view of a connecting plate according to an embodiment of the present invention;
FIG. 10 is a schematic perspective view of a negative pressure adsorption module according to an embodiment of the present invention;
FIG. 11 is a first schematic view of a portion of a vacuum adsorption assembly in an embodiment of the present invention;
FIG. 12 is a second partial schematic view of the negative pressure adsorption module according to the embodiment of the present invention;
FIG. 13 is a first partial schematic configuration of an embodiment of the present invention;
FIG. 14 is a second partial schematic view of the embodiment of the present invention.
The specific implementation mode is as follows:
the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate orientations or positional relationships based on those shown in the drawings, and are used merely for convenience in describing the present invention, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
As shown in fig. 1 to 14, the chip mounter applicable to an optical device and an optical module of the present invention includes an operation table, a negative pressure adsorption component disposed above the operation table and used for adsorbing a chip, a transverse rotating shaft, and an operation handle used for driving the transverse rotating shaft to rotate, wherein the transverse rotating shaft is provided with a transverse moving member, the transverse moving member 5 is connected with the transverse rotating shaft 3 in a transverse sliding manner, the transverse moving member is connected with the operation handle through a link mechanism, and when the operation handle is swung left and right, the operation handle drives the transverse moving member to move in a transverse direction through the link mechanism; the vertical moving part is arranged in front of the transverse moving part, the lower end of the vertical moving part is longitudinally and slidably matched and hinged with the transverse moving part, when the operating handle 4 swings up and down, the operating handle drives the transverse rotating shaft to rotate, and the transverse moving part drives the vertical moving part to vertically move so as to drive the negative pressure adsorption component 2 to vertically move; the vertical moving member is provided with a vertical through slide, the negative pressure adsorption assembly comprises a negative pressure suction nozzle in sliding fit with the vertical slide, a detection assembly connected with the alarm module is arranged on the upper side of the negative pressure suction nozzle, the negative pressure suction nozzle can move upwards along the vertical slide when the patch is mounted, when the detection assembly detects the upper end of the negative pressure suction nozzle, the alarm module sends out an alarm instruction, the patch mounting operation is just completed at the moment, and the vertical moving member is stopped moving downwards continuously.
In this embodiment, a first transverse slide rail 8 is installed at the bottom of the left end of the transverse rotating shaft 3, the lower portion of the rear end of the transverse moving member 5 is fixedly connected with a slide block on the first transverse slide rail 8, and the transverse moving member 5 moves along the first transverse slide rail 8.
In this embodiment, the link mechanism 6 includes a first link 9 and a second link 10, the rear end of the first link 9 is hinged to the right end of the transverse rotating shaft 3 in the horizontal direction through a vertically arranged hinge shaft, the front end of the first link 9 is hinged to the right end of the second link 10 in the horizontal direction, and the left end of the second link 10 is hinged to the transverse moving member 5 in the horizontal direction; the operating handle 4 is fixedly connected with the front end of the first connecting rod 9. During the use, when swing operating handle 4 when the left and right sides, operating handle 4 drives first connecting rod 9 and rotates at the horizontal direction, and first connecting rod 9 drives transverse moving member 5 through second connecting rod 10 and slides along first transverse slide rail, and transverse moving member 5 drives vertical moving member 22, negative pressure adsorption component 2 synchronous motion this moment to realize getting the removal between material station and the paster station.
In this embodiment, the upper portion front end of lateral shifting member 5 is equipped with U type installing port 11, both ends outside difference fixedly connected with connecting plate 12 about U type installing port 11, the front end medial surface of connecting plate 12 is equipped with vertical spout 13, promptly: the two connecting plates form a pair of longitudinal sliding grooves which are distributed left and right. The lower end of the vertical moving part 22 is provided with a U-shaped connecting part 14 extending backwards, the U-shaped connecting part 14 is opposite to the U-shaped mounting opening 11 and is located between the two connecting plates 12, the left side surface and the right side surface of the U-shaped connecting part 14 are provided with sliding rollers 15, and the sliding rollers 15 are accommodated in the longitudinal sliding grooves 13 and are in sliding fit with the longitudinal sliding grooves. The rear side of vertical moving member 6 is equipped with vertical slide rail 17, the rear side of vertical moving member 5 and the slider fixed connection on the vertical slide rail 17. During the use, when pushing down or lifting operating handle 4, operating handle 4 drive transverse rotating shaft 3 is rotatory around its axis, and transverse rotating shaft 3 drives transverse moving member 5 synchronous revolution, and slip gyro wheel 15 forms relative slip with vertical spout 13 when transverse moving member 5 is rotatory to the realization drives vertical moving member 22 and removes along vertical slide rail 17, and vertical moving member 6 drives negative pressure adsorption component 2 synchronous movement this moment, in order to realize putting down of chip.
In this embodiment, still including locating the material platform 19 of operation panel 1, material platform 19 is located negative pressure adsorption component 3 under, and material platform 19 is used for placing the article 20 of treating the paster and the magazine 21 that is equipped with the chip, and operating handle 4 moves between article 20 and magazine 21 through horizontal pivot 3 and 6 drive negative pressure adsorption component 2 of link mechanism, realizes getting the material, and negative pressure adsorption component can follow vertical removal, realizes the paster operation.
In this embodiment, in order to improve the stationarity that vertical moving member 22 moved along with lateral moving member 5, the upper end rear side of vertical moving member 22 is equipped with second lateral slide rail 23, and second lateral slide rail does not rotate along with the horizontal rotating shaft, and the upper end rear portion of vertical moving member 22 is connected with the slider of second lateral slide rail 23, plays further guide effect. In order to improve the protection effect, a protection cover 46 is arranged on the outer side of the link mechanism, an abdicating window 47 which is beneficial to the vertical moving piece 22 to extend forwards is arranged at the left end of the front side wall of the protection cover 46, and an abdicating notch 48 which is beneficial to the operation handle 4 to extend forwards is arranged at the lower part of the right end of the front side wall of the protection cover 46. The second transverse sliding rail is fixedly arranged in the protective cover, and the lower end of the protective cover is fixedly connected with the operating table.
In this embodiment, the lower end of the front part of the vertical moving member 22 is fixedly connected with an installation block 24, and a vertical through vertical slideway 25 is arranged on the installation block 24; the negative pressure suction nozzle 26 is in movable fit with the vertical slideway 25, the upper end of the negative pressure suction nozzle 26 is connected with the rotating mechanism through a connecting piece, the negative pressure suction nozzle is used for adsorbing a chip, and the rotating mechanism drives the negative pressure suction nozzle to rotate so as to adjust the chip mounting angle.
In this embodiment, the upper end of the negative pressure suction nozzle 26 is connected with a suction nozzle clamping block 27 movably arranged on the top of the mounting block 24, a connecting member connected with the negative pressure suction nozzle 26 is arranged above the suction nozzle clamping block 27, a rotating disk 28 driven by a rotating mechanism to rotate in the horizontal direction is arranged above the connecting member, and a vertical slot 29 for the connecting member to extend into is arranged at the lower end of the rotating disk 28. The detection assembly is arranged at the upper end of one side of the vertical slot and used for detecting the connecting piece, and when the detection assembly detects the connecting piece, the alarm module sends out an alarm indication. When the device is used, the vertical moving piece 22 is controlled to move downwards through the operating handle 4, the vertical moving piece 22 drives the negative pressure suction nozzle 26, the rotating disk 28 and the connecting piece to synchronously move downwards, a chip at the suction port at the lower end of the negative pressure suction nozzle 26 is contacted with an article 20 (such as the inside of a circuit board or an optical device) on the material table, and in the process that the vertical moving piece 22 continues to move downwards, the negative pressure suction nozzle 26 can move upwards along the vertical slideway 25, so that the situation that the pressure value required by the chip is reached or even exceeded at one time and the chip is damaged is avoided; and when the negative pressure suction nozzle moves upwards to the detected component to be sensed, the alarm module sends out an alarm instruction, an operator stops the vertical moving part to move downwards to complete the paster operation, and then controls the vertical moving part to move upwards.
In this embodiment, an elastic member capable of deforming vertically is connected between the nozzle clamping block 27 and the vertically movable member 22. Negative pressure suction nozzle can follow vertical rebound at paster in-process, presss from both sides tight piece and sets up the elastic component through at the suction nozzle between vertical moving member to drive negative pressure suction nozzle downstream to initial position after the paster operation finishes. Preferably, the elastic member includes a pair of tension springs 30 disposed at left and right sides of the nozzle clamping block 27, the tension springs 30 are vertically disposed, and upper and lower ends of the tension springs 30 are respectively connected to the nozzle clamping block 27 and the vertical moving member 22 through connecting bolts 50. It should be noted that, according to the pressure required by the patch and the gravity of the part, the tension of the tension spring at the moment sensed by the detection assembly can be calculated, so that the selection of the spring parameters is completed.
In this embodiment, the connecting member includes a connecting pipe 32 having a side wall connected with a negative pressure air pipe 31, and the negative pressure air pipe 31 is connected with a negative pressure generating apparatus through a pipeline, so that an adsorption port of the negative pressure suction nozzle forms negative pressure and adsorbs the chip. The lower end of the connecting pipe 32 is fixedly connected with the negative pressure suction nozzle 26, the top surface of the suction nozzle clamping block 27 is contacted with the bottom surface of the connecting pipe 32, and the suction nozzle clamping block 27 is movably arranged at the top of the vertical moving part 22 to support the connecting pipe 32; the suction nozzle clamping block clamps the upper end of the negative pressure suction nozzle by using the clamping port of the suction nozzle clamping block. When the negative pressure suction nozzle moves upwards along the vertical sliding rail, the negative pressure suction nozzle drives the connecting pipe and the suction nozzle clamping block to synchronously move upwards.
In this embodiment, the outer wall of the upper end of the connecting pipe 32 is provided with a rotating shifting block 33 for extending into the vertical slot 29, when the rotating disk 28 rotates in the horizontal direction, the side surface of the rotating shifting block 33 contacts with the side wall of the vertical slot 29, the rotating disk 28 pushes the rotating shifting block 33 to rotate, the rotating shifting block 33 drives the negative pressure suction nozzle 26 to rotate in the vertical slideway 25 through the connecting pipe 32, and this can adjust the angle of the chip, so that the chip rotates to a proper chip mounting angle.
In this embodiment, one opposite side of the rotary shifting block 33 is provided with a sensing block 34 for facilitating sensing of the detection assembly, the sensing block 34 is fixed on the outer wall of the upper end of the connecting pipe 32, and the rotary shifting block 33 and the sensing block 34 are distributed in a vertically staggered manner. In the process of mounting, the negative pressure suction nozzle 26 moves upwards, and the negative pressure suction nozzle 26 drives the induction block 34 to move upwards synchronously; when the detection assembly senses the induction block 34, the alarm module gives an alarm instruction, and the operator stops the downward movement of the vertical moving part (namely stops the paster). The detection assembly comprises a miniature optical sensor which is fixedly arranged at the bottom of the 15 rotating disc and synchronously rotates along with the rotating disc.
In this embodiment, the rotating mechanism includes a belt pulley mechanism 35 horizontally mounted on the vertical moving member 22, and a driving motor of the belt pulley mechanism is controlled by a foot switch; the middle of the rotating disc 28 is connected with the left end of the belt pulley mechanism 35, the belt pulley mechanism 35 drives the rotating disc 28 to rotate in the horizontal direction, a positioning block 36 is arranged in the middle of the bottom face of the rotating disc 28, a vertical slot 29 is formed in the middle of the positioning block 36, and the vertical slot 29 penetrates through the rotating disc 28 in the radial direction. The detection assembly includes a micro light sensor 37, and the micro light sensor 37 is fixedly installed at the bottom of the rotary disk 28 and rotates synchronously with the rotary disk 28. The U-shaped sensing slots of the micro-optical sensor 37 are distributed opposite to the vertical slots 29 and are beneficial for the sensing blocks 34 to extend into along the vertical direction. In a normal state, the rotating shifting block 33 always extends into the vertical slot, the sensing block 34 is located below the sensing groove of the micro optical sensor 37, and the sensing block 34 is driven by the negative pressure suction nozzle 26 to move upwards to the sensing groove of the micro optical sensor 37. It should be noted that the micro optical sensor may be a U-shaped micro optical sensor in the prior art, which is a mature product, and the detailed description of the specific structure and the detection principle is not repeated here.
In this embodiment, the belt pulley mechanism 35 is located above the rotating disc 28, and includes a driving pulley 38, a driven pulley 39 and a driving motor 40, the driving motor 40 is vertically installed on the vertical moving member 22, a motor shaft of the driving motor 40 is connected with the driving pulley 38 horizontally arranged, the driven pulley 39 is horizontally arranged, a central shaft of the driven pulley 39 is connected with the middle part of the rotating disc 28, the driven pulley 39 is connected with the driving pulley 38 through a transmission belt 41, and the driving motor drives the rotating disc to rotate in the horizontal direction through the transmission belt. For convenience of operation, the driving motor is controlled by a foot switch (not shown). The drive motor is vertically mounted on a motor mount 49 which is fixedly mounted on the vertical moving member and moves with the vertical moving member.
In this embodiment, the peripheral side of the vertical slideway 25 is provided with three vertical guides which are circumferentially and uniformly distributed, and each vertical guide comprises a pair of guide wheels 42 which are distributed up and down and are used for contacting with the outer wall of the negative pressure suction nozzle. By providing the guide wheels on the circumferential side, the horizontal degree of freedom of the negative pressure suction nozzle can be limited, so that the negative pressure suction nozzle can only rotate vertically and move vertically within the vertical sliding.
In this embodiment, still including locating the manual lift slip table on the operation panel, manual lift slip table is located negative pressure adsorption component under, and manual lift slip table is used for placing the article of treating the paster and the magazine that is equipped with the chip. It should be noted that manual lift slip table is current product, through the height of manual regulation article and magazine, the paster requirement of adaptable different grade type.
In this embodiment, the alarm module includes a buzzer, and the buzzer is electrically connected to the micro optical sensor through a control unit (e.g., a single chip microcomputer or a PLC). When the induction block enters the induction groove of the micro optical sensor under the driving of the negative pressure suction nozzle, the micro optical sensor sends an electric signal to the control unit, and the control unit controls the buzzer to send an alarm indication.
In this embodiment, negative pressure suction nozzle's size or model can be changed as required, can satisfy the different encapsulation optical chip's of equidimension paster requirement, improves the commonality.
In this embodiment, a microscope 43 is disposed on the front side of the negative pressure suction nozzle, a vertical support 50 fixed on an operation table is disposed on the left side of the microscope 43, a longitudinal moving slide rail 44 is mounted at the upper end of the vertical support 50, a vertical moving slide rail 45 is mounted on a sliding portion of the longitudinal moving slide rail 44, a transverse moving slide rail 51 is mounted on a sliding portion of the vertical moving slide rail 45, and a microscope mounting bracket 52 is mounted on a sliding portion of the transverse moving slide rail 51 and used for mounting a microscope; and the longitudinal moving slide rail, the vertical moving slide rail and the transverse moving slide rail are all provided with locking screws 53 for locking the sliding parts. It should be noted that, the longitudinal movable slide rail, the vertical movable slide rail and the transverse movable slide rail may all adopt the prior art, and the structure thereof is not repeated herein.
In this embodiment, the negative pressure suction nozzle 26 is matched with the optical sensor through the tension spring 30 to realize setting of the moving stroke, the purpose of setting the vertical moving stroke of the negative pressure suction nozzle is to provide a buffering stage for the stress in the mounting process, which can be observed by naked eyes, so that the pressure value required by the mounting is prevented from being reached or even exceeded, and after the setting is formed, the optical sensor can generate an electric signal to be output to a buzzer, and then an alarm prompt is sent. When in specific use: an article 20 to be pasted and a material box 21 with chips are placed on a material table, a negative pressure suction nozzle 26 is positioned above the material table, the vertical moving member 22 is controlled by the operating handle 4 to move downwards, the vertical moving member 22 drives the negative pressure suction nozzle 26, a rotating disk 28 and a connecting piece to synchronously move downwards, an adsorption port at the lower end of the negative pressure suction nozzle 26 adsorbs one chip in the material box, and then the vertical moving member 22 moves to the position above the article to be pasted; then the vertical moving member 22 is manually controlled to move downwards, the chip at the suction port at the lower end of the negative pressure suction nozzle 26 is in contact with an article (such as the inside of a circuit board or an optical device) on the material table, and in the process that the vertical moving member 22 continues to move downwards, the negative pressure suction nozzle 26 can move upwards along the vertical slideway 25, so that the situation that the required pressure value of the chip is reached or even exceeded, the chip is damaged, and at the moment, the suction nozzle clamping block 27 applies upward pulling force to the pulling force spring 30 is avoided. When the negative pressure suction nozzle 26 moves upwards to the induction block 34 and enters the induction groove of the micro photoelectric sensor 37, the micro photoelectric sensor 37 sends an electric signal to the control unit, the control unit controls the buzzer to send an alarm indication, the operator stops the vertical moving member to move downwards to complete the patching operation, then the vertical moving member is controlled to move upwards, and the negative pressure suction nozzle is reset downwards under the action of the tension spring 30.
The specific implementation process comprises the following steps: the negative pressure adsorption component is positioned right above the material box in an initial state, (1) the right hand presses down the operating handle 4, the operating handle 4 drives the transverse rotating shaft 3 to rotate anticlockwise around the axis of the transverse rotating shaft 3, the transverse rotating shaft 3 drives the transverse moving component 5 to rotate downwards, the sliding roller 15 and the longitudinal sliding groove 13 form relative sliding when the transverse moving component 5 rotates downwards, and drives the vertical moving component 22 to move downwards along the vertical sliding rail 17, at the moment, the vertical moving component 22 drives the negative pressure adsorption component 2 to synchronously move downwards to be close to the material box 21, the negative pressure adsorption component 2 adsorbs chips in the material box 21, and meanwhile, the left hand moves the articles to be pasted on the manual lifting sliding table to quickly finish material taking and feeding; (2) The operating handle 4 is lifted upwards, the transverse rotating shaft 3 rotates reversely, the transverse rotating shaft 3 drives the transverse moving piece 5 to rotate upwards until reset, and the transverse moving piece 5 drives the vertical moving piece 22 to move upwards until reset; (3) Swinging the operating handle 4 leftwards, driving the first connecting rod 9 to rotate leftwards in the horizontal direction by the operating handle 4, driving the transverse moving member 5 to slide leftwards along the first transverse sliding rail 8 by the first connecting rod 9 through the second connecting rod 10, and driving the vertical moving member 22 and the negative pressure adsorption component 2 to synchronously move at the moment until the negative pressure adsorption component 2 is positioned right above the article 20 to be pasted; (4) Checking and checking the angle of the chip by a microscope, controlling the driving motor 40 to start by a foot switch if the angle needs to be rotated, driving the negative pressure suction nozzle 26 to rotate by the driving motor, rotating the chip to the required angle, repeating the step (1), enabling the negative pressure adsorption component 2 to move downwards to be close to the object to be pasted, and then loosening the chip by the negative pressure adsorption component to enable the chip to fall on the object to be pasted, thereby completing the pasting operation; (5) During chip mounting, a chip at the suction port at the lower end of the negative pressure suction nozzle 26 is in contact with an article (such as a circuit board or the inside of an optical device) on the material table, and in the process that the vertical moving member 22 continues to move downwards, the negative pressure suction nozzle 26 can move upwards along the vertical slideway 25, so that the situation that the pressure value required by the chip is reached or even exceeds the pressure value required by the chip and the chip is damaged is avoided, and at the moment, the suction nozzle clamping block 27 applies upward pulling force to the pulling force spring 30. When the negative pressure suction nozzle 26 moves upwards to the induction block 34 and enters the induction groove of the micro photoelectric sensor 37, the micro photoelectric sensor 37 sends an electric signal to the control unit, the control unit controls the buzzer to send an alarm instruction, the operator stops the downward movement of the vertical moving part to complete the paster operation, then the vertical moving part is controlled to move upwards, and the negative pressure suction nozzle is reset downwards under the action of the tension spring 30.
If the invention discloses or relates to parts or structures which are fixedly connected to each other, the fixedly connected parts can be understood as follows, unless otherwise stated: a detachable fixed connection (for example using bolts or screws) is also understood as: non-detachable fixed connections (e.g. riveting, welding), but of course, fixed connections to each other may also be replaced by one-piece structures (e.g. manufactured integrally using a casting process) (unless it is obviously impossible to use an integral forming process).
In addition, terms used in any technical solutions disclosed in the present invention to indicate positional relationships or shapes include approximate, similar or approximate states or shapes unless otherwise stated.
Any part provided by the invention can be assembled by a plurality of independent components, or can be manufactured by an integral forming process.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention and not to limit it; although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that: modifications to the specific embodiments of the invention or equivalent substitutions for parts of the technical features may be made; without departing from the spirit of the present invention, it is intended to cover all aspects of the invention as defined by the appended claims.
Claims (10)
1. The utility model provides a chip mounter that can be applied to optical device and optical module which characterized in that: the device comprises an operating platform, a negative pressure adsorption assembly, a transverse rotating shaft and an operating handle, wherein the negative pressure adsorption assembly is arranged above the operating platform and used for adsorbing a chip, the operating handle is used for driving the transverse rotating shaft to rotate, the transverse rotating shaft is provided with a transverse moving piece, the transverse moving piece is connected with the operating handle through a connecting rod mechanism, and the operating handle drives the transverse moving piece to move transversely; the lower end of the vertical moving member is in longitudinal sliding fit with the transverse moving member, and when the transverse rotating shaft rotates, the transverse moving member drives the vertical moving member to vertically move; the vertical moving member is provided with a vertical through slide, the negative pressure adsorption assembly comprises a negative pressure suction nozzle in sliding fit with the vertical slide, a detection assembly connected with the alarm module is arranged on the upper side of the negative pressure suction nozzle, and when the detection assembly detects the upper end of the negative pressure suction nozzle, the alarm module sends out an alarm instruction.
2. The mounter applicable to optical devices and optical modules according to claim 1, wherein: the transverse moving member is in sliding fit with a transverse sliding rail arranged at the bottom of the left end of the transverse rotating shaft; the connecting rod mechanism comprises a first connecting rod and a second connecting rod, the rear end of the first connecting rod is hinged with the right end of the transverse rotating shaft in the horizontal direction, the front end of the first connecting rod is hinged with the right end of the second connecting rod in the horizontal direction, and the left end of the second connecting rod is hinged with the transverse moving piece in the horizontal direction; the operating handle is fixedly connected with the front end of the first connecting rod.
3. The mounter applicable to optical devices and optical modules according to claim 1, wherein: the front end of the upper part of the transverse moving piece is provided with a pair of longitudinal sliding chutes which are distributed left and right; the vertical moving member is arranged between the pair of longitudinal sliding grooves and is in sliding fit with the vertical sliding rail positioned on the rear side of the vertical moving member, and sliding idler wheels are arranged on the left side face and the right side face of the lower portion of the vertical moving member and are contained in the longitudinal sliding grooves and are in sliding fit with the longitudinal sliding grooves.
4. The mounter applicable to optical devices and optical modules according to claim 1, wherein: the lower end of the vertical moving piece is fixedly connected with an installation block, and a vertical slideway is arranged on the installation block; the upper end of the negative pressure suction nozzle is connected with a suction nozzle clamping block movably arranged at the top of the mounting block, a connecting piece connected with the negative pressure suction nozzle is arranged above the suction nozzle clamping block, a rotating disc driven by a rotating mechanism to rotate in the horizontal direction is arranged above the connecting piece, and the lower end of the rotating disc is provided with a vertical slot for the connecting piece to extend into; the detection assembly is arranged at the upper end of one side of the vertical slot and used for detecting the connecting piece.
5. The mounter applied to optical devices and optical modules according to claim 4, wherein: the suction nozzle clamping block is characterized in that an elastic piece capable of deforming vertically is connected between the suction nozzle clamping block and the vertical moving piece, the elastic piece comprises a pair of tension springs arranged on the left side and the right side of the suction nozzle clamping block, the tension springs are vertically arranged, and the upper end and the lower end of each tension spring are connected with the suction nozzle clamping block and the vertical moving piece through connecting bolts respectively.
6. The mounter applied to optical devices and optical modules according to claim 4, wherein: the connecting piece comprises a connecting pipe, the side wall of the connecting pipe is connected with a negative pressure air pipe, the lower end of the connecting pipe is connected with a negative pressure suction nozzle, the outer wall of the upper end of the connecting pipe is provided with a rotating shifting block which is used for extending into a vertical slot, one opposite side of the rotating shifting block is provided with an induction block which is beneficial to a detection assembly to perform induction, and the induction block is fixed on the outer wall of the upper end of the connecting pipe; the detection assembly comprises a micro optical sensor, the micro optical sensor is fixedly installed at the bottom of the rotating disk, and the induction grooves of the micro optical sensor are distributed opposite to the vertical slots so as to facilitate the induction blocks to vertically extend into the induction grooves.
7. The mounter applied to optical devices and optical modules according to claim 6, wherein: the rotating mechanism comprises a belt pulley mechanism which is horizontally arranged on the vertical moving member, and a driving motor of the belt pulley mechanism is controlled by a foot switch; the middle of the rotating disc is connected with the left end of the belt pulley mechanism, the belt pulley mechanism drives the rotating disc to rotate in the horizontal direction, a positioning block is arranged in the middle of the bottom surface of the rotating disc, a vertical slot is formed in the middle of the positioning block, and the vertical slot penetrates through the rotating disc in the radial direction.
8. The mounter applied to optical devices and optical modules according to claim 4, wherein: the side of the vertical slideway is provided with a plurality of vertical guiding pieces which are uniformly distributed on the circumference, and each vertical guiding piece comprises a pair of guide wheels which are distributed up and down and are used for being contacted with the outer wall of the negative pressure suction nozzle.
9. The mounter applied to optical devices and optical modules according to claim 1, wherein: still including locating the manual lift slip table on the operation panel, manual lift slip table is located negative pressure adsorption component under, and manual lift slip table is used for placing the article of treating the paster and the magazine that is equipped with the chip.
10. The mounter applicable to optical devices and optical modules according to claim 1, wherein: a microscope is arranged on the front side of the negative pressure suction nozzle, a vertical support fixed on an operation table is arranged on the left side of the microscope, a longitudinal moving slide rail is mounted at the upper end of the vertical support, a vertical moving slide rail is mounted at a sliding part on the longitudinal moving slide rail, a transverse moving slide rail is mounted at a sliding part of the vertical moving slide rail, and a microscope mounting frame is mounted at a sliding part of the transverse moving slide rail and used for mounting the microscope; and locking screws used for locking the sliding parts are arranged on the longitudinal moving sliding rail, the vertical moving sliding rail and the transverse moving sliding rail.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211459130.2A CN115763623A (en) | 2022-11-18 | 2022-11-18 | Chip mounter applicable to optical device and optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211459130.2A CN115763623A (en) | 2022-11-18 | 2022-11-18 | Chip mounter applicable to optical device and optical module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115763623A true CN115763623A (en) | 2023-03-07 |
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ID=85334104
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211459130.2A Pending CN115763623A (en) | 2022-11-18 | 2022-11-18 | Chip mounter applicable to optical device and optical module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115763623A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116544132A (en) * | 2023-07-07 | 2023-08-04 | 广东芯乐光光电科技有限公司 | Mini-LED patch detection equipment and detection method |
-
2022
- 2022-11-18 CN CN202211459130.2A patent/CN115763623A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116544132A (en) * | 2023-07-07 | 2023-08-04 | 广东芯乐光光电科技有限公司 | Mini-LED patch detection equipment and detection method |
| CN116544132B (en) * | 2023-07-07 | 2023-12-15 | 广东芯乐光光电科技有限公司 | Mini-LED patch detection equipment and detection method |
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