CN115707183A - Flexible circuit board and manufacturing method thereof - Google Patents
Flexible circuit board and manufacturing method thereof Download PDFInfo
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- CN115707183A CN115707183A CN202110897296.1A CN202110897296A CN115707183A CN 115707183 A CN115707183 A CN 115707183A CN 202110897296 A CN202110897296 A CN 202110897296A CN 115707183 A CN115707183 A CN 115707183A
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Abstract
The utility model provides a flexible circuit board, includes flexible circuit base plate, conductive adhesive layer and the flexible components and parts that stack gradually, the flexible circuit base plate include first dielectric layer and set up respectively in the first circuit layer and the second circuit layer of the relative both sides of first dielectric layer, first circuit layer includes a plurality of pad, each the pad certainly one side embedding of first dielectric layer, conductive adhesive layer set up in first dielectric layer deviates from one side on second circuit layer and the pad, flexible components and parts with conductive adhesive layer bonds, just flexible components and parts orientation one side of conductive adhesive layer is equipped with a plurality of embedding conductive adhesive layer's connection pad, each the connection pad passes through along the above-mentioned direction that stacks electrically conductive adhesive layer electricity is connected one the pad. The application also relates to a manufacturing method of the flexible circuit board. The flexible circuit board and the manufacturing method thereof are beneficial to the leveling of the whole structure and the stability of electric connection.
Description
Technical Field
The present disclosure relates to circuit boards, and particularly to a flexible circuit board and a method for manufacturing the same.
Background
With the increasing demand for lighter and thinner application products, especially for supporting portable and mobile applications (5G electronic products), highly integrated packaging becomes more and more critical. The flexible circuit substrate is used as a main connecting member in an electronic product, and occupies a large space of the electronic product. The thinning of the flexible substrate is beneficial to the development trend of light, thin, short and small electronic products. Therefore, how to make the flexible circuit substrate have both planarization and electrical connection stability is a problem to be solved in the art.
Disclosure of Invention
In view of the above, it is desirable to provide a flexible circuit board that solves the above problems.
There is also a need to provide a method for manufacturing a flexible circuit board that solves the above problems.
The utility model provides a flexible circuit board, includes flexible circuit base plate, conductive adhesive layer and the flexible components and parts that stack gradually, the flexible circuit base plate include first dielectric layer and set up respectively in the first circuit layer and the second circuit layer of the relative both sides of first dielectric layer, first circuit layer includes a plurality of pad, each the pad certainly one side embedding of first dielectric layer, conductive adhesive layer set up in first dielectric layer deviates from one side on second circuit layer and the pad, flexible components and parts with conductive adhesive layer bonds, just flexible components and parts orientation one side of conductive adhesive layer is equipped with a plurality of embedding conductive adhesive layer's connection pad, each the connection pad passes through along the above-mentioned direction that stacks electrically conductive adhesive layer electricity is connected one the pad.
A manufacturing method of a flexible circuit board comprises the following steps:
providing a flexible double-sided metal substrate, which comprises a first metal foil, a first dielectric layer and a second metal foil which are sequentially laminated;
carrying out circuit manufacturing on the double-sided metal substrate to form an intermediate structure, wherein the first metal foil correspondingly forms a first circuit layer which comprises a plurality of bonding pads;
hot-pressing the intermediate structure in the stacking direction so that the first circuit layer is embedded in the first dielectric layer;
carrying out circuit manufacturing on the hot-pressed intermediate structure, wherein a second circuit layer is correspondingly formed on the second metal foil;
arranging a conductive adhesive layer on one side of the first dielectric layer, which is far away from the second circuit layer, and the bonding pad; and
the conductive adhesive layer deviates from one side of the first dielectric layer is provided with a flexible component, the flexible component faces one side of the conductive adhesive layer and is provided with a plurality of connecting pads which are embedded into the conductive adhesive layer, and each connecting pad passes through the conductive adhesive layer and one pad electric connection.
A manufacturing method of a flexible circuit board comprises the following steps:
providing a flexible double-sided metal substrate, which comprises a first metal foil, a first dielectric layer and a second metal foil which are sequentially stacked;
the double-sided metal substrate is subjected to circuit manufacturing to form an intermediate structure, wherein the first metal foil correspondingly forms a first circuit layer, the second metal foil correspondingly forms a second circuit layer, and the first circuit layer comprises a plurality of bonding pads;
hot-pressing the intermediate structure along the stacking direction so that the first circuit layer and the second circuit layer are respectively embedded into the first dielectric layer;
arranging a conductive adhesive layer on one side of the first dielectric layer, which is far away from the second circuit layer, and the bonding pad; and
the conductive adhesive layer deviates from one side of the first dielectric layer is provided with a flexible component, the flexible component faces one side of the conductive adhesive layer is provided with a plurality of connecting pads and is embedded into the conductive adhesive layer, and each connecting pad passes through the conductive adhesive layer and one pad is electrically connected.
According to the flexible circuit board and the manufacturing method thereof, the bonding pad is embedded into the first dielectric layer, so that the situation that the surface of the flexible component is fluctuated and uneven can be reduced and even avoided when the flexible component is electrically connected in the follow-up process. And secondly, the flexible component is vertically and electrically connected with the flexible circuit substrate, so that the path of a signal input/output (I/O) channel can be maximally limited, the size of the connecting pad can be increased, the manufacturing difficulty is reduced, and the stability of electrical connection is facilitated.
Drawings
Fig. 1 is a schematic cross-sectional view of a flexible circuit board according to an embodiment of the present application.
Fig. 2 is a schematic cross-sectional view of a flexible circuit board according to another embodiment of the present application.
Fig. 3 is a schematic cross-sectional view of a flexible double-sided metal substrate according to an embodiment of the present application.
FIG. 4 is a schematic cross-sectional view of an intermediate structure according to an embodiment of the present application.
Fig. 5 is a schematic cross-sectional view of the intermediate structure shown in fig. 4 after hot pressing.
Fig. 6 is a schematic cross-sectional view of the intermediate structure shown in fig. 5 after wiring.
Fig. 7 is a schematic cross-sectional view of the first dielectric layer of fig. 6 after a build-up layer is formed thereon.
Fig. 8 is a schematic cross-sectional view of a conductive glue layer disposed on the first dielectric layer shown in fig. 7.
Fig. 9 is a schematic cross-sectional view of a flexible component disposed on the conductive paste layer shown in fig. 8.
Fig. 10 is a schematic cross-sectional view of the flexible component shown in fig. 9 with a first protective layer disposed thereon.
FIG. 11 is a schematic cross-sectional view of an intermediate structure of another embodiment of the present application.
Fig. 12 is a schematic cross-sectional view of the intermediate structure shown in fig. 11 after hot pressing.
Fig. 13 is a schematic cross-sectional view of electrically connecting the first and second circuit layers of the intermediate structure shown in fig. 12.
Description of the main elements
The following detailed description will further illustrate the present application in conjunction with the above-described figures.
Detailed Description
The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. The embodiments and features of the embodiments described below can be combined with each other without conflict.
Referring to fig. 1, the present application provides a flexible circuit board 100 according to an embodiment, where the flexible circuit board 100 includes a flexible circuit substrate 10, a conductive adhesive layer 30, and a flexible component 50, which are sequentially stacked. The flexible circuit substrate 10 includes a first dielectric layer 11, a first circuit layer 13, and a second circuit layer 15. The first circuit layer 13 and the second circuit layer 15 are respectively disposed on two opposite sides of the first dielectric layer 11. The first circuit layer 13 includes a plurality of pads 131, and each pad 131 is embedded in the first dielectric layer 11 from one side of the first dielectric layer 11. The conductive adhesive layer 30 is disposed on a side of the first dielectric layer 11 away from the second circuit layer 15 and the pad 131. The flexible component 50 with the conductive adhesive layer 30 bonds, just flexible component 50 orientation one side of conductive adhesive layer 30 is equipped with a plurality of connecting pad 51, each connecting pad 51 embedding conductive adhesive layer 30 just passes through conductive adhesive layer 30 is along the above-mentioned range upon range of direction electricity connection one pad 131.
In the flexible circuit board 100, the pads 131 are embedded in the first dielectric layer 11, so as to reduce or even avoid the uneven surface of the flexible component 50 when electrically connecting with the flexible component 50 in the following. Secondly, the flexible component 50 is electrically connected to the flexible circuit board 10 vertically, so that the path of a signal input/output (I/O) channel can be minimized, and the size of the connection pad 51 can be increased, thereby reducing the difficulty of the manufacturing process and facilitating the stability of the electrical connection.
In some embodiments, it is preferable that a height difference between a surface of each pad 131 facing away from the second circuit layer 15 and a surface of the first dielectric layer 11 facing away from the second circuit layer 15 in the stacking direction is less than 2 μm.
The shape of each pad 131 is not limited, and may be a regular shape such as a square shape, a circular shape, or other irregular shapes.
The first circuit layer 13 and the second circuit layer 15 may be electrically connected through a conductive via 16.
In some embodiments, referring to fig. 2, the second circuit layer 15 may be further embedded into the first dielectric layer 11 from a side of the first dielectric layer 11 away from the first circuit layer 13, so as to further facilitate the overall flatness of the flexible circuit board 100 and facilitate the thinning of the flexible circuit board 100.
The first dielectric layer 11 may include, but is not limited to, a thermoplastic dielectric material. The thermoplastic dielectric material may include, but is not limited to, at least one of Liquid Crystal Polymer (LCP), ajinomoto Build-up Film (ABF), polypropylene (PP), polytetrafluoroethylene (PTFE), polyetheretherketone (PEEK), polyphenylene oxide (PPO), and the like. The thermoplastic dielectric material exhibits enhanced flow under hot pressing to facilitate embedding of the traces therein. In the present embodiment, the first dielectric layer 11 is made of a liquid crystal polymer.
As shown in fig. 1, the flexible circuit substrate 10 may also be a multilayer circuit substrate, i.e., the flexible circuit substrate 10 may further include a second dielectric layer 17 and at least one third circuit layer 18 bonded to the first dielectric layer 11 on a side facing away from the first circuit layer 13.
The conductive adhesive layer 30 may be anisotropic conductive Adhesive (ACF).
The flexible component 50 may be, but is not limited to, a flexible display device, a flexible touch device, a flexible antenna, etc. The thickness of the connection pad 51 in the direction of the stack may typically be on the order of nanometers.
In some embodiments, the flexible circuit board 100 may further include an electronic component 55 disposed on a side of the flexible circuit substrate 10 facing away from the flexible component 50. The electronic component 55 is electrically connected to the flexible circuit board 10.
In some embodiments, the flexible circuit board 100 may further include a first protection layer 61, where the first protection layer 61 covers a side of the flexible circuit board 50 facing away from the flexible circuit board 10, and may be used to prevent the flexible circuit board 50 from being scratched. In some embodiments, the material of the first protection layer 61 may be set according to needs, for example, the first protection layer 61 may be a transparent film layer or may be a scratch-proof film layer.
The flexible circuit board 100 may further include a second protective layer 63, where the second protective layer 63 is disposed on a side of the flexible circuit substrate 10 facing away from the flexible component 50.
Referring to fig. 3 to 10, the present application provides a method for manufacturing a flexible circuit board according to an embodiment, which includes the following steps:
step S1, please refer to fig. 3, a flexible double-sided metal substrate 10a is provided, which includes a first metal foil 13a, a first dielectric layer 11 and a second metal foil 15a stacked in sequence.
The first dielectric layer 11 may include, but is not limited to, a thermoplastic dielectric material. The thermoplastic dielectric material may include, but is not limited to, at least one of Liquid Crystal Polymer (LCP), ABF, polypropylene (PP), polytetrafluoroethylene (PTFE), polyetheretherketone (PEEK), polyphenylene oxide (PPO), and the like. The thermoplastic dielectric material has increased flow under hot pressing, thereby facilitating embedding of the circuitry therein. In the present embodiment, the first dielectric layer 11 is made of a liquid crystal polymer.
Step S2, referring to fig. 4, a circuit is fabricated on the flexible double-sided metal substrate 10a to form an intermediate structure 10b, wherein the first metal foil 13a correspondingly forms a first circuit layer 13. The first circuit layer 13 includes a plurality of pads 131.
Step S3, referring to fig. 5, the intermediate structure 10b is hot pressed along the stacking direction, so that the first circuit layer 13 is embedded in the first dielectric layer 11.
In some embodiments, it is preferable that a height difference between a surface of each of the pads 131 facing away from the second metal foil 15a and a surface of the first dielectric layer 11 facing away from the second metal foil 15a in the stacking direction is less than 2 μm.
The shape of each pad 131 is not limited, and may be a regular shape such as a square shape, a circular shape, or other irregular shapes.
Step S4, referring to fig. 6, a circuit is formed on the intermediate structure 10b after hot pressing, wherein a second circuit layer 15 is correspondingly formed on the second metal foil 15a, and the second circuit layer 15 is electrically connected to the first circuit layer 13.
The second circuit layer 15 and the first circuit layer 13 can be electrically connected through a conductive via 16.
In step S5, referring to fig. 7, a second dielectric layer 17 and at least one third circuit layer 18 are additionally disposed on a side of the second circuit layer 15 away from the first circuit layer 13.
In step S6, referring to fig. 8, a conductive adhesive layer 30 is disposed on a side of the first dielectric layer 11 away from the second circuit layer 15 and on the pad 131.
The conductive adhesive layer 30 may be anisotropic conductive Adhesive (ACF).
Step S7, referring to fig. 9, a flexible component 50 is disposed on a side of the conductive adhesive layer 30 away from the first dielectric layer 11, a plurality of connection pads 51 are disposed on a side of the flexible component 50 facing the conductive adhesive layer 30 and embedded in the conductive adhesive layer 30, and each connection pad 51 is electrically connected to one of the pads 131 through the conductive adhesive layer 30.
The flexible component 50 may be, but is not limited to, a flexible display device, a flexible touch device, a flexible antenna, etc. The thickness of the connection pad 51 in the direction of the stack may typically be on the order of nanometers.
Step S8, referring to fig. 10, covering a first protective layer 61 on a side of the flexible component 50 away from the first dielectric layer 11 to prevent the flexible component 50 from being scratched.
In some embodiments, the material of the first protection layer 61 may be set according to needs, for example, the first protection layer 61 may be a transparent film layer or may be a scratch-proof film layer.
In some embodiments, steps S2 to S4 of the method for manufacturing a flexible circuit board may be replaced by steps S2 'and S4', which are as follows:
in step S2', referring to fig. 11, a circuit is formed on the flexible double-sided metal substrate 10a to form an intermediate structure 10c, wherein the first metal foil 13a correspondingly forms a first circuit layer 13, and the second metal foil 15a correspondingly forms a second circuit layer 15. The first circuit layer 13 includes a plurality of pads 131.
In step S3', referring to fig. 12, the intermediate structure 10c is hot pressed along the stacking direction, so that the first circuit layer 13 and the second circuit layer 15 are respectively embedded in the first dielectric layer 11.
In some embodiments, it is preferable that a height difference between a surface of each of the pads 131 facing away from the second metal foil 15a and a surface of the first dielectric layer 11 facing away from the second metal foil 15a in the stacking direction is less than 2 μm.
The shape of each of the pads 131 is not limited, and may be a regular shape such as a square shape, a circular shape, or other irregular shapes.
In step S4', referring to fig. 13, the first circuit layer 13 and the second circuit layer 15 are electrically connected.
In this embodiment, the second circuit layer 15 and the first circuit layer 13 may be electrically connected through a conductive via 16.
In some embodiments, step S5 may be omitted.
In some embodiments, step S8 may be omitted.
According to the flexible circuit board and the manufacturing method thereof, the welding disc 131 is embedded into the first dielectric layer 11, so that the situation that the surface of the flexible component 50 is fluctuated and uneven can be reduced and even avoided when the flexible circuit board is electrically connected with the flexible component 50 in the following process. Secondly, the flexible component 50 is electrically connected to the flexible circuit board 10 vertically, so that the path of a signal input/output (I/O) channel can be minimized, and the size of the connection pad 51 can be increased, thereby reducing the difficulty of the manufacturing process and facilitating the stability of the electrical connection.
Although the present application has been described with reference to a preferred embodiment, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. The utility model provides a flexible circuit board, includes flexible circuit base plate, conductive adhesive layer and the flexible components and parts that stack gradually, the flexible circuit base plate include first dielectric layer and set up respectively in the first circuit layer and the second circuit layer of the relative both sides of first dielectric layer, first circuit layer includes a plurality of pad, its characterized in that, each the pad certainly one side embedding of first dielectric layer, conductive adhesive layer set up in first dielectric layer deviates from one side on second circuit layer and the pad, flexible components and parts with conductive adhesive layer bonds, just flexible components and parts orientation one side of conductive adhesive layer is equipped with a plurality of embedding conductive adhesive layer's joint gasket, each the joint gasket passes through along above-mentioned range upon range of direction conductive adhesive layer electricity is connected one the pad.
2. The flexible circuit board of claim 1, wherein a height difference between a surface of each of the pads facing away from the second circuit layer and a surface of the first dielectric layer facing away from the second circuit layer in the stacking direction is less than 2 μm.
3. The flexible circuit board of claim 1, wherein the second circuit layer is further embedded in the first dielectric layer from a side of the first dielectric layer facing away from the first circuit layer.
4. The flexible circuit board of claim 1, wherein the first dielectric layer comprises a thermoplastic dielectric material comprising at least one of liquid crystal high polymer, ABF, polypropylene, polytetrafluoroethylene, polyetheretherketone, polyphenylene oxide.
5. The flexible circuit board of claim 1, further comprising a first protective layer covering a side of the flexible component facing away from the flexible circuit substrate.
6. A manufacturing method of a flexible circuit board comprises the following steps:
providing a flexible double-sided metal substrate, which comprises a first metal foil, a first dielectric layer and a second metal foil which are sequentially stacked;
carrying out circuit manufacturing on the double-sided metal substrate to form an intermediate structure, wherein the first metal foil correspondingly forms a first circuit layer which comprises a plurality of bonding pads;
hot-pressing the intermediate structure in the stacking direction so that the first circuit layer is embedded in the first dielectric layer;
carrying out circuit manufacturing on the hot-pressed intermediate structure, wherein a second circuit layer is correspondingly formed on the second metal foil;
arranging a conductive adhesive layer on one side of the first dielectric layer, which is far away from the second circuit layer, and the bonding pad; and
the conductive adhesive layer deviates from one side of the first dielectric layer is provided with a flexible component, the flexible component faces one side of the conductive adhesive layer is provided with a plurality of connecting pads and is embedded into the conductive adhesive layer, and each connecting pad passes through the conductive adhesive layer and one pad is electrically connected.
7. The method of manufacturing a flexible circuit board according to claim 6, wherein in the intermediate structure after the thermal pressing, a height difference between a surface of each of the pads facing away from the second circuit layer and a surface of the first dielectric layer facing away from the second circuit layer in the stacking direction is less than 2 μm.
8. The method of claim 6, wherein the first dielectric layer comprises a thermoplastic dielectric material, and the thermoplastic dielectric material comprises at least one of liquid crystal polymer, ABF, polypropylene, polytetrafluoroethylene, polyetheretherketone, and polyphenylene oxide.
9. A manufacturing method of a flexible circuit board comprises the following steps:
providing a flexible double-sided metal substrate, which comprises a first metal foil, a first dielectric layer and a second metal foil which are sequentially laminated;
carrying out circuit manufacturing on the double-sided metal substrate to form an intermediate structure, wherein the first metal foil correspondingly forms a first circuit layer, the second metal foil correspondingly forms a second circuit layer, and the first circuit layer comprises a plurality of bonding pads;
hot-pressing the intermediate structure along the stacking direction so that the first circuit layer and the second circuit layer are respectively embedded into the first dielectric layer;
arranging a conductive adhesive layer on one side of the first dielectric layer, which is far away from the second circuit layer, and the bonding pad; and
the conductive adhesive layer deviates from one side of the first dielectric layer is provided with a flexible component, the flexible component faces one side of the conductive adhesive layer is provided with a plurality of connecting pads and is embedded into the conductive adhesive layer, and each connecting pad passes through the conductive adhesive layer and one pad is electrically connected.
10. The method of manufacturing a flexible circuit board according to claim 9, wherein in the intermediate structure after the thermal pressing, a height difference between a surface of each of the pads facing away from the second circuit layer and a surface of the first dielectric layer facing away from the second circuit layer in the stacking direction is less than 2 μm.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110897296.1A CN115707183A (en) | 2021-08-05 | 2021-08-05 | Flexible circuit board and manufacturing method thereof |
| TW110133113A TWI807407B (en) | 2021-08-05 | 2021-09-06 | Flexible circuit board and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110897296.1A CN115707183A (en) | 2021-08-05 | 2021-08-05 | Flexible circuit board and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN115707183A true CN115707183A (en) | 2023-02-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110897296.1A Pending CN115707183A (en) | 2021-08-05 | 2021-08-05 | Flexible circuit board and manufacturing method thereof |
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| CN (1) | CN115707183A (en) |
| TW (1) | TWI807407B (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI305479B (en) * | 2006-02-13 | 2009-01-11 | Advanced Semiconductor Eng | Method of fabricating substrate with embedded component therein |
| TWI322494B (en) * | 2006-10-20 | 2010-03-21 | Ind Tech Res Inst | Electrical package, and contact structure and fabricating method thereof |
| CN102427679B (en) * | 2011-11-11 | 2013-12-04 | 欣兴同泰科技（昆山）有限公司 | Flexible printed circuit board with embedded lug interconnection structure and manufacturing method of flexible printed circuit board |
| TWI586237B (en) * | 2014-12-18 | 2017-06-01 | 欣興電子股份有限公司 | Circuit board and method of manufacturing the same |
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- 2021-08-05 CN CN202110897296.1A patent/CN115707183A/en active Pending
- 2021-09-06 TW TW110133113A patent/TWI807407B/en active
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| TW202308487A (en) | 2023-02-16 |
| TWI807407B (en) | 2023-07-01 |
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