CN1156898A - 用于半导体芯片的成批处理装置的工件供给方法和装置 - Google Patents
用于半导体芯片的成批处理装置的工件供给方法和装置 Download PDFInfo
- Publication number
- CN1156898A CN1156898A CN96117259A CN96117259A CN1156898A CN 1156898 A CN1156898 A CN 1156898A CN 96117259 A CN96117259 A CN 96117259A CN 96117259 A CN96117259 A CN 96117259A CN 1156898 A CN1156898 A CN 1156898A
- Authority
- CN
- China
- Prior art keywords
- processing device
- workpiece
- batch processing
- batch
- time
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 45
- 239000004065 semiconductor Substances 0.000 title claims abstract description 25
- 238000010923 batch production Methods 0.000 title abstract 5
- 238000012545 processing Methods 0.000 claims abstract description 169
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 16
- 238000012806 monitoring device Methods 0.000 claims description 4
- 238000003860 storage Methods 0.000 claims description 2
- 230000001052 transient effect Effects 0.000 claims 1
- 230000032258 transport Effects 0.000 abstract description 5
- 238000000605 extraction Methods 0.000 abstract 1
- 238000007726 management method Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 abstract 1
- 239000000872 buffer Substances 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/4189—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the transport system
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/41835—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by programme execution
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32077—Batch control system
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32078—Calculate process end time, form batch of workpieces and transport to process
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45027—Masking, project image on wafer semiconductor, photo tracer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Quality & Reliability (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- General Factory Administration (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Control By Computers (AREA)
- Management, Administration, Business Operations System, And Electronic Commerce (AREA)
- Multi-Process Working Machines And Systems (AREA)
Abstract
Description
Claims (6)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP305357/95 | 1995-11-24 | ||
JP305357/1995 | 1995-11-24 | ||
JP7305357A JP2702466B2 (ja) | 1995-11-24 | 1995-11-24 | 半導体ウェーハの生産方法及びその生産装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1156898A true CN1156898A (zh) | 1997-08-13 |
CN1117388C CN1117388C (zh) | 2003-08-06 |
Family
ID=17944148
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN96117259A Expired - Fee Related CN1117388C (zh) | 1995-11-24 | 1996-11-22 | 用于半导体芯片的成批处理装置的工件供给方法和装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5930137A (zh) |
EP (1) | EP0775952B1 (zh) |
JP (1) | JP2702466B2 (zh) |
CN (1) | CN1117388C (zh) |
DE (1) | DE69618433T2 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100426452C (zh) * | 2004-02-28 | 2008-10-15 | 应用材料有限公司 | 用于材料控制***接口的方法和设备 |
CN113608105A (zh) * | 2021-08-04 | 2021-11-05 | 杭州芯云半导体技术有限公司 | 芯片cp测试中探针台驱动配置方法及*** |
CN113731907A (zh) * | 2021-08-13 | 2021-12-03 | 江苏吉星新材料有限公司 | 蓝宝石产品清洗方法及清洗装置 |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2326522B (en) * | 1997-05-29 | 1999-07-14 | Nec Corp | Semiconductor device manufacturing system |
JP2000223386A (ja) | 1999-02-02 | 2000-08-11 | Mitsubishi Electric Corp | 半導体製造システムおよび当該システムで用いられる半導体製造システム制御装置 |
US7249356B1 (en) * | 1999-04-29 | 2007-07-24 | Fisher-Rosemount Systems, Inc. | Methods and structure for batch processing event history processing and viewing |
KR100303321B1 (ko) * | 1999-05-20 | 2001-09-26 | 박종섭 | 반도체 라인 자동화 시스템에서의 오류발생 로트 제어 장치 및그 방법 |
JP2001189363A (ja) | 2000-01-04 | 2001-07-10 | Mitsubishi Electric Corp | 半導体装置製造設備およびその制御方法 |
JP3515724B2 (ja) | 2000-01-13 | 2004-04-05 | Necエレクトロニクス株式会社 | 製品の製造管理方法及び製造管理システム |
US6491451B1 (en) | 2000-11-03 | 2002-12-10 | Motorola, Inc. | Wafer processing equipment and method for processing wafers |
JP2003022945A (ja) * | 2001-07-06 | 2003-01-24 | Mitsubishi Electric Corp | 工程管理装置、工程管理方法および工程を管理するためのプログラム |
US6615093B1 (en) * | 2002-01-04 | 2003-09-02 | Taiwan Semiconductor Manufacturing Company | Adaptive control algorithm for improving AMHS push lot accuracy |
US6594536B1 (en) | 2002-02-13 | 2003-07-15 | Taiwan Semiconductor Manufacturing Company | Method and computer program for using tool performance data for dynamic dispatch of wafer processing to increase quantity of output |
CN100397562C (zh) * | 2004-11-02 | 2008-06-25 | 力晶半导体股份有限公司 | 制造过程中实时批次发送***及其方法 |
US20060095153A1 (en) * | 2004-11-04 | 2006-05-04 | Chang Yung C | Wafer carrier transport management method and system thereof |
JP4693464B2 (ja) * | 2005-04-05 | 2011-06-01 | 株式会社東芝 | 品質管理システム、品質管理方法及びロット単位のウェハ処理方法 |
US20070005170A1 (en) * | 2005-06-29 | 2007-01-04 | Thorsten Schedel | Method for the preferred processing of workpieces of highest priority |
DE102006025406A1 (de) * | 2006-05-31 | 2007-12-06 | Advanced Micro Devices, Inc., Sunnyvale | Verfahren und System zum Steuern von Prozessanlagen durch Unterbrechen von Prozessaufgaben in Abhängigkeit von der Aufgabenpriorität |
US7793292B2 (en) | 2006-09-13 | 2010-09-07 | Fisher-Rosemount Systems, Inc. | Compact batch viewing techniques for use in batch processes |
DE102006056597B4 (de) * | 2006-11-30 | 2009-03-12 | Advanced Micro Devices, Inc., Sunnyvale | Verfahren und System zum Steuern der Substrathandhabung in Substratpuffern von Prozessanlagensystemen durch Unterbrechen von Prozessaufgaben in Abhängigkeit von der Aufgabenpriorität |
GB0803967D0 (en) * | 2008-03-03 | 2008-04-09 | Colt Telecom Group Plc | Queing System |
US9927788B2 (en) | 2011-05-19 | 2018-03-27 | Fisher-Rosemount Systems, Inc. | Software lockout coordination between a process control system and an asset management system |
JP5817476B2 (ja) * | 2011-11-29 | 2015-11-18 | 株式会社デンソー | バッチ処理制御方法およびバッチ処理制御システム |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6359524B1 (en) * | 1981-12-07 | 2002-03-19 | Itt Manufacturing Enterprises, Inc. | Modulation pulse-top ripple compensation for a travelling wave tube pulser |
US5148370A (en) * | 1987-06-17 | 1992-09-15 | The Standard Oil Company | Expert system and method for batch production scheduling and planning |
US5351195A (en) * | 1989-07-24 | 1994-09-27 | The George Group | Method for improving manufacturing processes |
CA2038939C (en) * | 1989-08-10 | 1997-06-17 | Satomi Furukawa | Production control system |
JPH03236213A (ja) | 1990-02-13 | 1991-10-22 | Mitsubishi Electric Corp | バッチ投入方法及び装置 |
JP3189326B2 (ja) * | 1990-11-21 | 2001-07-16 | セイコーエプソン株式会社 | 生産管理装置および該装置を用いた生産管理方法 |
JPH04318122A (ja) * | 1991-04-17 | 1992-11-09 | Sumitomo Metal Ind Ltd | バッチ式焼鈍炉の操業管理方法 |
JPH05265775A (ja) * | 1992-03-19 | 1993-10-15 | Hitachi Ltd | ジョブ実行予測制御方法およびジョブ実行状況表示方法 |
US5359524A (en) * | 1992-06-29 | 1994-10-25 | Darius Rohan | Method and system for determining an average batch size |
US5465534A (en) * | 1994-05-26 | 1995-11-14 | Equipto | Flooring substructure |
US5696689A (en) * | 1994-11-25 | 1997-12-09 | Nippondenso Co., Ltd. | Dispatch and conveyer control system for a production control system of a semiconductor substrate |
US5745364A (en) * | 1994-12-28 | 1998-04-28 | Nec Corporation | Method of producing semiconductor wafer |
JPH0973313A (ja) * | 1995-02-09 | 1997-03-18 | Matsushita Electric Ind Co Ltd | 製造計画立案方法および製造計画立案装置 |
-
1995
- 1995-11-24 JP JP7305357A patent/JP2702466B2/ja not_active Expired - Fee Related
-
1996
- 1996-11-15 EP EP96118364A patent/EP0775952B1/en not_active Expired - Lifetime
- 1996-11-15 DE DE69618433T patent/DE69618433T2/de not_active Expired - Fee Related
- 1996-11-19 US US08/752,305 patent/US5930137A/en not_active Expired - Fee Related
- 1996-11-22 CN CN96117259A patent/CN1117388C/zh not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100426452C (zh) * | 2004-02-28 | 2008-10-15 | 应用材料有限公司 | 用于材料控制***接口的方法和设备 |
CN113608105A (zh) * | 2021-08-04 | 2021-11-05 | 杭州芯云半导体技术有限公司 | 芯片cp测试中探针台驱动配置方法及*** |
CN113731907A (zh) * | 2021-08-13 | 2021-12-03 | 江苏吉星新材料有限公司 | 蓝宝石产品清洗方法及清洗装置 |
CN113731907B (zh) * | 2021-08-13 | 2022-05-31 | 江苏吉星新材料有限公司 | 蓝宝石产品清洗方法及清洗装置 |
Also Published As
Publication number | Publication date |
---|---|
EP0775952A2 (en) | 1997-05-28 |
EP0775952B1 (en) | 2002-01-09 |
DE69618433D1 (de) | 2002-02-14 |
US5930137A (en) | 1999-07-27 |
JPH09148210A (ja) | 1997-06-06 |
JP2702466B2 (ja) | 1998-01-21 |
CN1117388C (zh) | 2003-08-06 |
DE69618433T2 (de) | 2002-11-07 |
EP0775952A3 (en) | 1998-09-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1117388C (zh) | 用于半导体芯片的成批处理装置的工件供给方法和装置 | |
US6748282B2 (en) | Flexible dispatching system and method for coordinating between a manual automated dispatching mode | |
CN100351723C (zh) | 用于自动化制造环境的代理人反应式调度 | |
US7860602B2 (en) | Mail processing system | |
CN1552037A (zh) | 用于安排重复性送货和取货的***和方法 | |
CN101595438B (zh) | 生产线上空余时间减少的设备和方法 | |
US8452438B2 (en) | Method for minimizing productivity loss while using a manufacturing scheduler | |
Ou et al. | Gantry scheduling for multi-gantry production system by online task allocation method | |
US20100232914A1 (en) | Method and apparatus for routing wafer pods to allow parallel processing | |
US6259961B1 (en) | Continuous processing conveying system and control method for the same | |
JPH0573574A (ja) | 生産制御装置 | |
JPH03221359A (ja) | 工程管理方法および装置 | |
JPH0744614A (ja) | 生産管理装置および生産管理方法 | |
US20080086232A1 (en) | Mail sorter system and method for productivity optimization through precision scheduling | |
TW440988B (en) | Device and method for dispatching chips | |
JPH03236213A (ja) | バッチ投入方法及び装置 | |
DE10225419A1 (de) | Substratträgerhandhabungssystem, Programm, computerlesbares Medium und Verfahren zum Herstellen einer Halbleitervorrichtung | |
JPH0738370B2 (ja) | 半導体装置の製造方法 | |
JPH05218177A (ja) | 半導体製造管理システム | |
JPH04270459A (ja) | 生産制御装置 | |
JP3527172B2 (ja) | ロットの搬送装置および方法 | |
JP3356109B2 (ja) | ロット自動搬送システムおよびロット搬送制御方法 | |
JPH04176544A (ja) | 生産スケジューリング装置 | |
JPH096409A (ja) | 生産ライン制御システム | |
JP3534894B2 (ja) | 連続検査精整ラインにおける間ピッチ制御方法および装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: NEC ELECTRONICS TAIWAN LTD. Free format text: FORMER OWNER: NIPPON ELECTRIC CO., LTD. Effective date: 20031110 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20031110 Address after: Kawasaki, Kanagawa, Japan Patentee after: NEC Corp. Address before: Tokyo, Japan Patentee before: NEC Corp. |
|
C56 | Change in the name or address of the patentee |
Owner name: RENESAS KANSAI CO., LTD. Free format text: FORMER NAME: NEC CORP. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Kawasaki, Kanagawa, Japan Patentee after: Renesas Electronics Corporation Address before: Kawasaki, Kanagawa, Japan Patentee before: NEC Corp. |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20030806 Termination date: 20131122 |