CN115674671A - Laser lamination manufacturing equipment and laser lamination manufacturing method - Google Patents
Laser lamination manufacturing equipment and laser lamination manufacturing method Download PDFInfo
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- CN115674671A CN115674671A CN202111037007.7A CN202111037007A CN115674671A CN 115674671 A CN115674671 A CN 115674671A CN 202111037007 A CN202111037007 A CN 202111037007A CN 115674671 A CN115674671 A CN 115674671A
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- laser
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- precursor solution
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Abstract
The invention discloses a laser lamination manufacturing device and a laser lamination manufacturing method, wherein the laser lamination manufacturing device comprises: the laser component emits laser towards the carrier plate, the moving component is connected with the carrier plate, the control component is in signal connection with the laser component and the moving component, the control component controls the moving component to adjust the height position of the carrier plate in the precursor solution, and the relative position of the laser component and the carrier plate on the horizontal plane is adjusted according to the height position. The invention also provides a laser lamination manufacturing method. The invention solves the dilemma that the existing typical liquid phase-based laser direct lamination manufacturing method can only be used for plastic materials.
Description
Technical Field
The present invention relates to an apparatus and a method for manufacturing an build-up layer, and more particularly, to an apparatus and a method for manufacturing a laser build-up layer with high precision, high speed, and low power consumption.
Background
The conventional liquid-phase-based laser Direct lamination manufacturing method can be applied only to plastics, and generally employs a photo-curing adhesive sensitive to Light to perform photo-curing in a Stereolithography (SLA) or a Direct Light Processing (DLP) manner, so that a precise lamination product can be manufactured. However, in the case of metals or other materials, only metal (or corresponding material) powder can be used to produce a laminate by high energy layer-by-layer sintering. The design using powders, in addition to limiting the precision of the laminate, the high power laser leads to high electricity costs and also limits the speed of the laminate manufacturing.
Disclosure of Invention
The invention aims to solve various problems of the conventional laser lamination technology and provides laser lamination manufacturing equipment and a laser lamination manufacturing method which have high precision, high speed and low energy consumption.
To achieve the above and other objects, the present invention provides a laser build-up manufacturing apparatus, comprising: a carrier plate; a laser component, wherein the laser emitted by the laser component faces the carrier plate; a moving member connected to the carrier plate; and the control component is in signal connection with the laser component and the moving component, controls the moving component to adjust the height position of the carrier plate in the precursor solution, and selectively adjusts the relative position of the laser and the carrier plate on a horizontal plane according to the height position.
Optionally, the carrier is transparent to the wavelength of the laser.
Optionally, the laser member is a laser direct writing device.
Optionally, the laser member is a laser array device.
Optionally, the laser means initially focuses the laser on the upper surface of the carrier plate, and the control means moves the carrier plate from a surface position of the precursor solution towards a bottom position of the precursor solution.
Optionally, the laser means initially focuses the laser on a lower surface of the carrier plate, and the control means moves the carrier plate from a bottom position of the precursor solution towards a surface position of the precursor solution.
The invention also provides a laser lamination manufacturing method for manufacturing a lamination object of a specified material, which comprises the following steps: providing a precursor solution that forms the specified material upon heating; providing and distributing nanoparticles of the specified material in the precursor solution; arranging a carrier plate in the precursor solution; emitting laser towards the carrier plate by a laser component, so that the nanoparticles firstly positioned on the surface of the carrier plate convert the light energy of the laser into heat energy, wherein the wavelength of the laser is at least one of the following wavelengths: the absorption wavelength of the metal surface plasmon of the nanoparticle, the absorption wavelength of the light absorption of the semiconductor, and the absorption wavelength of the nanoparticle material; the heat energy generated by the nanoparticles causes the localized precursor solution to react to produce a deposit of the specified material; adjusting the height position of the carrier plate in the precursor solution so as to enable enough nanoparticles to be positioned at the focusing depth of the laser component; and selectively adjusting the relative positions of the laser and the carrier plate on the horizontal plane.
Optionally, the carrier plate is adjusted to move from the surface position of the precursor solution towards the bottom position of the precursor solution when the laser means initially focuses the laser on the upper surface of the carrier plate.
Optionally, the carrier plate is adjusted to move from a bottom position of the precursor solution towards a surface position of the precursor solution when the laser means initially focuses the laser on the lower surface of the carrier plate.
Therefore, the laser lamination manufacturing equipment and the laser lamination manufacturing method of the invention utilize the precursor solution to match with the nano particles of the specified material, irradiate the laser to generate the laser lamination, enable the laser lamination technology containing materials such as metal, ceramic and the like to be possible, and simultaneously achieve the practical requirements of low energy consumption, rapidness, low cost, high precision and high resolution.
To further clarify the features and technical content of the present invention, reference is made to the following detailed description of the invention and the accompanying drawings, which are provided for illustration purposes only and are not intended to limit the scope of the invention in any way.
Drawings
FIG. 1 is a schematic view of a laser build-up manufacturing apparatus according to a first embodiment of the present invention;
FIG. 2 is a schematic diagram of a laser direct writing apparatus according to a first embodiment of the present invention;
FIG. 3 is a schematic diagram showing the movement of a laser build-up manufacturing apparatus according to a first embodiment of the present invention;
FIG. 4 is a schematic diagram illustrating the operation of a laser build-up layer according to a first embodiment of the present invention;
FIG. 5 is a schematic view of a laser build-up manufacturing apparatus according to a second embodiment of the present invention;
FIG. 6 is a schematic view of a laser build-up manufacturing apparatus according to a third embodiment of the present invention;
FIG. 7 is an absorption spectrum of silver nanoparticles;
FIG. 8 is a flowchart of a laser build-up manufacturing method according to an embodiment of the invention.
Description of reference numerals:
100. laser lamination manufacturing equipment
100a laser lamination manufacturing equipment
100b laser lamination manufacturing equipment
1. Container with a lid
2. Laser member
21. Lens and lens assembly
22. Laser generating assembly
2a laser member
3. Support plate
31. Upper surface of
32. Lower surface
4. Moving member
5. Control member
L precursor solution
N nanoparticles
P pattern
S laminated object
Detailed Description
In order that the invention may be fully understood, a more particular description of the invention will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings. The purpose, characteristics and function of the present invention will be understood by those skilled in the art from the disclosure of the present specification. It is to be noted that the invention may be practiced or carried out in various embodiments and that various modifications and changes may be made in the details within the description without departing from the spirit of the invention. The drawings attached to the present invention are for illustrative purposes only and are not drawn to scale. The following embodiments are further detailed to explain the technical matters related to the present invention, but the disclosure is not intended to limit the claims of the present invention. The description is as follows:
the laser lamination manufacturing method adopts precursor solution which can locally react to form required materials (metal, ceramic and dyed plastics) after laser irradiation, thereby manufacturing the laser lamination. At present, the biggest problem of this method is that if the precursor solution is to be heated locally by laser, it is difficult to achieve the purpose of local reaction unless the laser reaches extremely high energy due to the heat dissipation and convection speed of the solution itself; however, too high temperature reactions tend to generate bubbles and often require increased viscosity of the precursor solution to reduce convection problems. The viscous precursor solution is likely to cause the problem of uneven distribution of reactive ions in laser deposition manufacturing, i.e., loss of precision (resolution) and practicality.
Therefore, in order to solve the above-mentioned various problems of laser build-up manufacturing using precursor solution, the present invention provides a laser build-up manufacturing apparatus and a laser build-up manufacturing method with high precision, high speed and low energy consumption.
As shown in fig. 1 to 4, a laser build-up manufacturing apparatus 100 according to a first embodiment of the present invention includes: laser member 2, carrier plate 3, moving member 4 and control member 5.
With reference to fig. 8, how the laser build-up manufacturing method of the present invention is performed using the laser build-up manufacturing apparatus 100 of the first embodiment of the present invention to manufacture a build-up S of a specified material will be described below.
In step S101, a precursor solution L capable of forming the above-mentioned specified material after being heated is first provided in the container 1. The precursor solution L may be varied in composition as desired. For example, a copper metal laminate is required, and a precursor solution capable of precipitating copper metal after being heated is used. The precipitation is not limited to a chemical reaction or a physical reaction. In this example, the designated material was silver metal, and silver nitrate powder (AgNO) 3 ) And polyvinylpyrrolidone ((C) 6 H 9 NO) n ) Ethylene glycol (HOCH) 2 ─CH 2 OH) solution as precursor solution L. However, the present invention is not limited thereto.
Next, in step S102, nanoparticles N of a given material are provided and distributed in the precursor solution. In this embodiment, the silver nanoparticles N may be processed by silver nitrate powder contained in the precursor solution L. For example, the precursor solution L is heated and stirred for several hours to form the silver nanoparticles N. However, in other embodiments, the silver nanoparticles N may be added to the precursor solution L externally. And the present invention is not limited thereto, the nanoparticles N of a specified material may be contained in the precursor solution L through other physical or chemical means.
Next, in step S103, the carrier plate 3 is disposed in the precursor solution L. As shown in fig. 1, if the laser emitted by the laser member 2 is directed to the upper surface 31 of the carrier plate 3, the carrier plate 3 is preferably disposed at a shallow layer in the precursor solution L, i.e. close to the surface of the precursor solution L. The precursor solution L is required to at least flood the upper surface 31.
Next, in step S104, the laser component 2 emits laser toward the carrier 3, so that the nanoparticles N on the surface (in this embodiment, the upper surface 31) of the carrier 3 convert the light energy of the laser into heat energy. Wherein the wavelength of the laser is at least one of the following: the absorption wavelength of the metal surface plasmon of the nanoparticle N; if the designated material is a semiconductor, it may be the absorption wavelength of light absorption by the semiconductor (e.g., intrinsic absorption, exciton absorption, lattice vibration absorption, impurity absorption, and free-reflow absorption); or the absorption wavelength corresponding to each nano-particle material, wherein the absorption wavelength can be the wavelength of a peak in the absorption spectrum, or can be a certain range of relatively-better-absorption wavelengths near the peak. As shown in fig. 7, several absorption peaks of nanoparticles N of silver metal are shown. The energy of short wavelength is large, the energy consumption is high, and equipment is easy to damage; there is a peak at 300nm, and the carrier 3 (glass material in this embodiment) will absorb the wavelength of 300nm, so the laser component 2 in this embodiment selects the blue laser with 450 nm. However, the invention is not limited thereto, and other advantageous wavelength bands may be selected, and when the specified material is not silver metal, the wavelength of the laser may be suitably selected accordingly.
The specified materials are, for example: gold, silver, copper, lead, tin, etc. having surface plasma absorption wavelength, and the corresponding laser wavelength is selected to match. But also semiconductors, ceramics (e.g. group 6A oxides) and even dyed plastics. Any nanoparticles that can efficiently convert light energy into heat energy are suitable for use in the laser build-up fabrication method of the present invention.
In the present embodiment, as shown in fig. 1 and fig. 2, the laser member 2 is a laser direct writing device, and includes a lens 21 and a laser generating assembly 22. The laser emitted from the laser generating assembly 22 is focused on the upper surface 31 of the carrier plate 3 through the lens 21.
In step S104, the nanoparticles N on the upper surface 31 of the carrier plate 3 are excited by the laser to convert the light energy into heat energy, and the generated heat energy causes the precursor solution L to react locally (i.e. near the irradiation point near the upper surface 31) to generate deposition of the designated material in the next step S105. As shown in fig. 2, since the laser member 2 is a laser direct writing device, and the light beams thereof converge into a point, the laser member 2 can move along the pattern P preset on the carrier 3 to form a first layer of lamination. Wherein the movement is a relative movement between the laser component 2 and the carrier plate 3, which can be achieved by moving at least one of the laser component 2 or the carrier plate 3.
Next, in step S106, since the carrier plate 3 is initially close to the shallow layer of the precursor solution L, a silver metal layer with a considerable mass near the depleted layer is formed, and it is obviously not time to wait for the silver metal to diffuse slowly. If the silver metal to be deposited near the upper surface 31 is to be rapidly replenished, the height position of the carrier plate 3 in the precursor solution L is adjusted (in the present embodiment, moved from the surface position of the precursor solution L toward the bottom position thereof in order to lower it) so that a sufficient amount of nanoparticles N are located at the focal depth of the laser member 2. As shown in fig. 3 and 4, the moving member 4 is connected to the carrier plate 3, the control member 5 is connected to the laser member 2 and the moving member 4 by signals, and the control member 5 adjusts the height position of the carrier plate 3 in the precursor solution L to replenish the silver metal to be deposited. In this embodiment, if the moving member 4 moves the carrier plate 3 at the same speed as the silver metal deposition, the laser member 2 continues to project laser on the previous laser deposit layer as the carrier plate 3 moves down without changing the focusing position, so as to form a new laser deposit layer. The moving means 4 may be a stepper motor, a servo motor or the like which may provide power. The control means 5 is, for example, a control chip or a control circuit.
As shown in fig. 4, in step S107, the control means 5 selectively adjusts the relative positions of the laser member 2 and the carrier plate 3 in the horizontal plane (relative height direction) according to the height position of the carrier plate 3, so that the newly generated build-up layer is connected to the previous build-up layer but partially displaced, thereby forming a non-pure cylindrical three-dimensional build-up layer object S. If the relative positions of the laser member 2 and the carrier plate 3 on the horizontal plane are not moved and each layer of the laminate is simply repeated by the same pattern P as shown in fig. 2, pillars with uniform cross-sections are formed. However, there are many ways to produce pillars with uniform cross-section, which can be achieved at low cost and fast speed, so the method has the advantage of producing a laminate S other than a pillar.
In summary, the laser lamination manufacturing apparatus 100 and the laser lamination manufacturing method according to the present invention utilize the precursor solution L to cooperate with the nanoparticles N of the designated material to irradiate the laser to generate the laser-laminated laminate S, so that the laser lamination technology including materials such as metal and ceramic becomes possible, and simultaneously, the practical requirements of low energy consumption, rapidness, low cost, high precision and high resolution are achieved.
Further, in the present embodiment, the carrier plate 3 is transparent with respect to the wavelength of the laser. That is, the carrier 3 does not absorb the laser light to generate heat energy. If the carrier 3 generates heat energy, the silver metal may be undesirably deposited at an unintended position, and thus the precision and resolution of the formed laminate S are not good.
Further, the present invention proposes a second embodiment. The laser build-up manufacturing apparatus 100a of the second embodiment differs from the laser build-up manufacturing apparatus 100 of the first embodiment in that the laser member 2a is a laser array device. The laser array device comprises a plurality of lenses and a plurality of laser generating components, and can project laser patterns of the array on the carrier plate 3 at the same time. Compared with the laser direct writing device of the first embodiment, the laser array device of the present embodiment has better efficiency of generating the layered product S, and only the laser array device is expensive.
Further, as shown in fig. 6, in a third embodiment of the present invention, a laser build-up manufacturing apparatus 100b of the third embodiment differs from the laser build-up manufacturing apparatus 100 of the first embodiment in that the laser member 2 projects laser light from below the carrier plate 3 and focuses on the lower surface 32 of the carrier plate 3. The optical path can be changed and adjusted by various ways such as reflection, refraction, etc., the laser component 2 is not necessarily below the carrier plate 3, but the final optical path is the laser focused on the lower surface 32 of the carrier plate 3. At this time, the carrier plate 3 is preferably at the bottom position of the precursor solution L, and the control member 5 controls the moving member 4 to move the carrier plate 3, so that the carrier plate 3 moves from the bottom position of the precursor solution L toward the surface position. The principle and manner of movement are the same as in the first embodiment, and the laminate S grows from the lower surface 32 of the carrier plate 3 downward. This embodiment is more suitable for a laminate S having a low height, and prevents the laminate S from being broken due to the influence of gravity when the laminate S is produced.
The present invention has been disclosed in terms of preferred embodiments, however, it will be understood by those skilled in the art that the embodiments are illustrative only and should not be construed as limiting the scope of the invention. It should be noted that all changes and substitutions equivalent to the described embodiments are intended to be included within the scope of the present invention. Therefore, the protection scope of the present invention is subject to the content defined by the claims.
Claims (9)
1. A laser additive manufacturing apparatus, comprising:
a carrier plate;
a laser member, the laser emitted by the laser member facing the carrier plate;
the moving component is connected with the carrier plate; and
the control component is in signal connection with the laser component and the moving component, and controls the moving component to adjust the height position of the carrier plate in the precursor solution and selectively adjust the relative position of the laser component and the carrier plate on the horizontal plane according to the height position.
2. The laser additive manufacturing apparatus of claim 1 wherein said carrier plate is transparent to a wavelength of said laser.
3. The laser additive manufacturing apparatus of claim 1 wherein said laser member is a laser direct write device.
4. The laser additive manufacturing apparatus of claim 1 wherein the laser member is a laser array device.
5. The laser additive manufacturing apparatus of claim 1 wherein the laser means initially focuses the laser on an upper surface of the carrier plate, and the control means moves the carrier plate from a surface position of the precursor solution toward a bottom position of the precursor solution.
6. The laser additive manufacturing apparatus of claim 1 wherein a laser member initially focuses the laser on a lower surface of the carrier plate, and the control member moves the carrier plate from a bottom position of the precursor solution toward a surface position of the precursor solution.
7. A laser build-up manufacturing method for manufacturing a build-up of a specified material, comprising the steps of:
providing a precursor solution which can form the specified material after being heated;
providing and distributing nanoparticles of the specified material in the precursor solution;
arranging a carrier plate in the precursor solution;
emitting laser light towards the carrier plate by a laser component, so that the nanoparticles firstly positioned on the surface of the carrier plate convert the light energy of the laser light into heat energy, wherein the wavelength of the laser light is at least one of the following: the absorption wavelength of metal surface plasmon of the nano particles, the absorption wavelength of light absorption of a semiconductor and the absorption wavelength of nano particle materials;
the thermal energy generated by the nanoparticles causes localized reaction of the precursor solution to produce deposition of the specified material;
adjusting the height position of the carrier plate in the precursor solution so as to enable enough nanoparticles to be positioned at the focusing depth of the laser component; and
and selectively adjusting the relative position of the laser and the carrier plate on the horizontal plane.
8. The laser build-up manufacturing method of claim 7, wherein the carrier plate is adjusted to move from a surface position of the precursor solution toward a bottom position of the precursor solution when the laser component initially focuses the laser on the upper surface of the carrier plate.
9. The method of claim 7, wherein the carrier plate is adjusted to move from a bottom position of the precursor solution toward a surface position of the precursor solution when the laser component initially focuses the laser on the lower surface of the carrier plate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW110127851 | 2021-07-29 | ||
| TW110127851A TWI836246B (en) | 2021-07-29 | Laser additive manufacturing equipment and laser additive manufacturing method |
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| Publication Number | Publication Date |
|---|---|
| CN115674671A true CN115674671A (en) | 2023-02-03 |
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| CN202111037007.7A Pending CN115674671A (en) | 2021-07-29 | 2021-09-06 | Laser lamination manufacturing equipment and laser lamination manufacturing method |
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| CN (1) | CN115674671A (en) |
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2021
- 2021-09-06 CN CN202111037007.7A patent/CN115674671A/en active Pending
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| TW202304613A (en) | 2023-02-01 |
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