CN115668482A - Method for manufacturing cover member - Google Patents
Method for manufacturing cover member Download PDFInfo
- Publication number
- CN115668482A CN115668482A CN202180037875.7A CN202180037875A CN115668482A CN 115668482 A CN115668482 A CN 115668482A CN 202180037875 A CN202180037875 A CN 202180037875A CN 115668482 A CN115668482 A CN 115668482A
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- metal
- bonding material
- metal layer
- cover member
- main body
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- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 229910052751 metal Inorganic materials 0.000 claims abstract description 96
- 239000002184 metal Substances 0.000 claims abstract description 96
- 239000000463 material Substances 0.000 claims abstract description 53
- 239000002245 particle Substances 0.000 claims abstract description 35
- 239000002923 metal particle Substances 0.000 claims abstract description 32
- 238000010438 heat treatment Methods 0.000 claims abstract description 21
- 238000000576 coating method Methods 0.000 claims abstract description 17
- 239000011248 coating agent Substances 0.000 claims abstract description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 18
- 239000010453 quartz Substances 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 229910015363 Au—Sn Inorganic materials 0.000 claims 1
- 239000010410 layer Substances 0.000 description 69
- 239000000758 substrate Substances 0.000 description 37
- 238000001816 cooling Methods 0.000 description 11
- 239000002344 surface layer Substances 0.000 description 9
- 229910001128 Sn alloy Inorganic materials 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 238000005520 cutting process Methods 0.000 description 8
- 238000005304 joining Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000007733 ion plating Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910000927 Ge alloy Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000005354 aluminosilicate glass Substances 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000010583 slow cooling Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
- H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Led Device Packages (AREA)
Abstract
The method for manufacturing a cover member includes: a coating step of coating a metal-based bonding material containing metal particles on the surface (7 a) of the main body (7) of the cover member (4); and a heat treatment step of performing heat treatment on the metal-based bonding material. The metal particles of the metal-based bonding material have a particle diameter D10 of 5 μm or more and a particle diameter D90 of 50 μm or less.
Description
Technical Field
The present invention relates to a method of manufacturing a cover member for a package.
Background
As a package for housing an electronic component, there is a package including: the electronic component mounting apparatus includes a base having a recess, and a cover member overlapping the base so as to cover the electronic component housed in the recess. As an example, patent document 1 discloses a package in which a base and a lid member (window member) are joined by a metal-based joining material, and a method for manufacturing the same.
To manufacture the package, first, a base body in which an electronic component is housed in a recess is prepared, and a lid member is superimposed on the base body. In this case, a metal-based bonding material (preform) is disposed between the base and the cover member. Then, the metallic bonding material is heated to be melted while applying a load between the base and the lid member. Then, the metal bonding material is cooled and solidified while applying a load between the base body and the lid member, thereby bonding the base body and the lid member (see paragraph 0039 of patent document 1).
In addition to the above-described manufacturing method, when the lid member is joined to the base by using the metal-based joining material, the joining step of the base and the lid member can be simplified by joining the metal-based joining material to the lid member in advance.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. 2018-37581
Disclosure of Invention
Problems to be solved by the invention
As described above, when the metallic bonding material is bonded to the lid member in advance, for example, the metallic bonding material in a paste form is applied to the lid member, and then the metallic bonding material is subjected to heat treatment. In this case, in the cooling step after the metal bonding material is heated and melted, stress is generated in the lid member due to a difference in thermal expansion coefficient between the metal bonding material and the lid member. If the stress is too large, the lid member may be damaged.
The present invention has been made in view of the above circumstances, and has a technical problem of reducing breakage of a cover member for a package.
Means for solving the problems
The present invention has been made to solve the above-described problems, and relates to a method for manufacturing a lid member that covers a base of a package, the lid member including a main body, the method including: a coating step of coating a metal bonding material containing metal particles on the surface of the main body; and a heat treatment step of heat-treating the metal-based bonding material, wherein the metal particles have a particle diameter D10 of 5 μm or more and a particle diameter D90 of 50 μm or less. The particle size is a value obtained by a laser diffraction particle size analyzer.
As a result of intensive studies, the present inventors have found that by setting the particle diameter of the metal particles contained in the metal-based bonding material to the above numerical range, stress generated in the main body in the heat treatment step can be reduced, and occurrence of breakage of the main body can be reduced.
In the method for manufacturing a lid member of the present invention, the metal particles may include Au — Sn alloy.
The method for manufacturing a lid member of the present invention preferably includes a metal layer forming step of forming a metal layer on the surface of the main body before the coating step, and the metal-based bonding material may be coated so as to overlap with the metal layer in the coating step. By forming the metal layer on the surface of the body, the wettability of the paste-like metallic bonding material is improved, and a good bonding portion is easily formed on the lid member.
In the method of manufacturing the lid member of the present invention, the main body may be formed of quartz or quartz glass.
Effects of the invention
According to the present invention, breakage of the cover member for the package can be reduced.
Drawings
Fig. 1 is a cross-sectional view of a package.
Fig. 2 is a top view of the substrate.
Fig. 3 is a cross-sectional view of the substrate taken along the line III-III of fig. 2.
Fig. 4 is a plan view of the cover member.
Fig. 5 is a sectional view of the cover member taken along the V-V arrow line of fig. 4.
Fig. 6 is an enlarged sectional view of a main portion of the cover member.
Fig. 7 is a flowchart illustrating a method of manufacturing the cover member.
Fig. 8 is a plan view showing one step in the method for manufacturing the cover member.
Fig. 9 is a plan view showing one step in the method of manufacturing the cover member.
Fig. 10 is a sectional view showing one step in the package manufacturing method.
Detailed Description
Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.
Fig. 1 shows an example of a package. The package 1 includes: a base body 2, an electronic component 3 housed in the base body 2, a lid member 4 covering the base body 2 and the electronic component 3, and a sealing portion 5 hermetically joining the base body 2 and the lid member 4.
Fig. 2 and 3 show the base body 2 before the lid member 4 is joined. The base body 2 has: a recess 2a for accommodating the electronic component 3, an end face 2b joined to the lid member 4 via a seal portion 5, and a metal layer 6 formed on the end face 2 b.
Examples of the material of the substrate 2 include: ceramics such as aluminum nitride, aluminum oxide, silicon carbide, and silicon nitride, glass ceramics obtained by mixing and sintering these ceramics with glass powder, alloys such as Fe — Ni — Co alloy, cu — W alloy, and Kovar (registered trademark), and the like.
As shown in fig. 2, the metal layer 6 has a frame shape surrounding the opening of the recess 2 a. The metal layer 6 is formed in a square shape, but is not limited to this shape. For example, when the opening of the recess 2a is circular, the metal layer 6 may be circular according to the shape of the recess 2 a.
The metal layer 6 includes three layers, i.e., a base layer, an intermediate layer, and a surface layer, in this order from the end face 2b side. Examples of the metal used for the underlayer include Cr, ta, W, ti, mo, ni, and Pt. Examples of the metal used for the intermediate layer include Ni, pt, pd, and the like. Examples of the metal used for the surface layer include: au, sn, ag, ni, pt, etc. The metal used for the metal layer 6 may be a simple substance or an alloy.
Examples of the method of forming the metal layer 6 on the end face 2b of the substrate 2 include: a film forming method such as a sputtering method, a vacuum deposition method using ion assist or ion plating, and a CVD method.
The electronic component 3 is fixed to the bottom surface of the recess 2a of the base 2. Examples of the electronic component 3 include optical devices such as a laser module, an LED light source, an optical sensor, an image pickup device, and an optical switch. The electronic component 3 may be a vibration sensor, an acceleration sensor, or the like. In the present embodiment, a case where the electronic component 3 is an ultraviolet irradiation LED will be described as an example.
Fig. 4 to 6 show the cover member 4 before being joined to the base body 2. The cover member 4 includes: a main body portion 7, a metal layer 8 formed on a part of the main body portion 7, and a joint portion 9.
The main body portion 7 is formed of a translucent substrate. Specifically, main body 7 is formed of a quartz substrate, a glass substrate made of quartz glass, borosilicate glass, aluminosilicate glass, or various other glasses, a sapphire substrate, a resin substrate, or the like. In the present embodiment, a case where a quartz substrate or a quartz glass substrate having high ultraviolet transmittance is used for the main body portion 7 will be described.
The thickness of the body portion 7 is preferably in the range of 0.1mm to 1mm, and more preferably in the range of 0.2mm to 0.5 mm. The main body portion 7 has a thermal expansion coefficient smaller than that of the joint portion 9. The main body portion 7 has a thermal expansion coefficient smaller than that of the base body 2.
As shown in fig. 1, 4, and 5, the surface of the body portion 7 includes a first main surface 7a and a second main surface 7b located on the opposite side of the first main surface 7a. The first main surface 7a and the second main surface 7b have an area larger than the opening area of the recess 2a of the substrate 2.
As shown in fig. 4 and 5, the metal layer 8 is formed on the first main surface 7a of the main body 7. The metal layer 8 has a square frame shape corresponding to the shape of the metal layer 6 of the base 2. The shape of the metal layer 8 is not limited to the present embodiment. The metal layer 8 may have a circular shape and other various frame shapes.
As shown in fig. 6, the metal layer 8 includes three layers, i.e., a base layer 10, an intermediate layer 11, and a surface layer 12, in this order from the first main surface 7a side of the body portion 7.
Examples of the metal used for the base layer 10 include: cr, ta, W, ti, mo, ni, pt, etc. Examples of the metal used for the intermediate layer 11 include: ni, pt, pd, etc. Examples of the metal used for the surface layer 12 include: au, sn, ag, ni, pt, etc. The metal used for the metal layer 8 may be a simple substance or an alloy.
The thickness of the base layer 10 is preferably 0.01 μm or more and 0.3 μm or less. The thickness of the intermediate layer 11 is preferably 0.3 μm or more and 3 μm or less. The thickness of the surface layer 12 is preferably 0.1 μm or more and 1 μm or less.
As shown in fig. 4, the joint 9 has a square frame shape corresponding to the shape of the metal layer 8. The shape of the joint 9 is not limited to the present embodiment, and may be circular or other various frame shapes. As shown in fig. 6, the joint 9 is formed in a layer shape so as to overlap the surface layer 12 of the metal layer 8.
The joint 9 is made of a metal-based joint material. As the metal-based bonding material, materials commercially available as solder and brazing filler metal can be used. Examples of the metal-based bonding material include: au-Sn alloys, pb-Sn alloys, au-Ge alloys, etc. In this embodiment, a case where an Au — Sn alloy is used as the metal-based bonding material will be described. The metal bonding material of Au — Sn alloy preferably contains Au in a range of 10% to 80% by mass and Sn in a range of 20% to 90% by mass.
The thickness of the bonding portion 9 is, for example, 5 μm or more and 50 μm or less, preferably 10 μm or more and 40 μm or less, and more preferably 15 μm or more and 25 μm or less.
The sealing portion 5 is formed by integrally bonding the metal layer 6 of the base body 2 and the metal layer 8 of the lid member 4 by a bonding portion 9.
Hereinafter, a method for manufacturing the cover member 4 will be described. As shown in fig. 7, the method for manufacturing the cover member 4 includes: the method includes a preparation step S1, a metal layer forming step S2, a joint portion forming step S3, and a cutting step S4.
As shown in fig. 8, in the preparation step S1, a large substrate 13 on which a plurality of cover members 4 can be formed is prepared. In the present embodiment, the substrate 13 capable of forming four cover members 4 (main body portion 7) is illustrated, but the size of the substrate 13 is not limited to the present embodiment. The substrate 13 is a base material of the main body portion 7 of the cover member 4, and is made of the same material as the main body portion 7. Therefore, the substrate 13 can be regarded as being integrally configured by the plurality of main bodies 7.
As shown in fig. 8, in the metal layer forming step S2, a plurality of metal layers 8 are formed on one surface 13a (corresponding to the first main surface 7a of the main body 7) of the substrate 13. The metal layers 8 are formed at predetermined intervals. Examples of the method for forming the metal layer 8 include: sputtering, vacuum deposition using ion assist or ion plating, and film formation by CVD.
As shown in fig. 9, in the joint forming step S3, the joint 9 is formed so as to overlap the metal layer 8. The joint forming step S3 includes: a coating step of coating the metal bonding material so as to overlap the metal layer 8; and a heat treatment step of performing heat treatment on the metal-based bonding material after the coating step.
The particle diameter D10 of the metal particles constituting the metal-based bonding material is 5 μm or more, preferably 8 μm or more, more preferably 10 μm or more, still more preferably 12 μm or more, and particularly preferably 16 μm or more. The particle diameter D90 is 50 μm or less, preferably 45 μm or less, more preferably 40 μm or less, still more preferably 35 μm or less, and particularly preferably 32 μm or less. Here, the particle diameter D10 means a particle diameter at which the proportion of particles having a particle diameter of 10% or less is 10%, and the particle diameter D90 means a particle diameter at which the proportion of particles having a particle diameter of 90% or less is 90%.
If the particle diameter D10 of the metal particles is defined as described above, the number of metal particles per unit area contacting the lid member can be reduced at the stage of the coating step. As a result, in the heat treatment step, the contact area between the joint formed by melting the metal particles and the lid member (in the case where the joint is in contact with the lid joint via the metal layer, the contact area between the joint and the metal layer) is reduced. As a result, the influence of the difference in thermal expansion coefficient between the joint and the lid member can be reduced, and the risk of damage to the lid member can be reduced. Further, if the particle diameter D90 of the metal particles is defined as described above, the metal particles are sufficiently melted in the heat treatment step, so that it is easy to avoid non-melting of the metal particles, and the strength of the joint itself after formation is improved.
In the coating step, for example, a metal-based bonding material in a paste form is coated in a rectangular frame shape so as to overlap the metal layer 8. The paste-like metallic bonding material preferably contains metal particles made of An-Sn alloy.
Specific examples of the coating step include a printing method (screen printing method) using a mask, a coating method using a dispenser, and the like.
The heat treatment step includes a heating step and a cooling step. In the heating step, the main body 7 is heated by using a heating device such as a reflow furnace, whereby the metallic bonding material can be melted. The heating step may be performed in a state where a furnace is filled with nitrogen gas, for example. In the heating step, the metallic bonding material of the body portion 7 is heated to a temperature of 300 ℃.
The metallic bonding material melted on the first main surface 7a of the body portion 7 is solidified by cooling in the cooling step. The cooling step preferably includes slow cooling in which the temperature is maintained in a temperature range of 150 ℃ to 300 ℃ for 2 minutes to 30 minutes.
In the cooling step, although stress is generated in the main body portion 7 due to the difference in thermal expansion coefficient between the main body portion 7 and the bonding portion 9, the stress can be relaxed by setting the particle diameter D10 of the metal particles (for example, particles of Au — Sn alloy) contained in the metallic bonding material of the bonding portion 9 to 5 μm or more as described above. Further, by setting the particle diameter D90 to 50 μm or less, the metal particles are sufficiently melted in the heat treatment step, and it is easy to avoid non-melting of the metal particles, and the strength of the joint itself after formation is improved.
By the above operation, the package substrate 13 in which the plurality of metal layers 8 and the plurality of bonding portions 9 are stacked is completed. In the cutting step S4, the substrate 13 is cut along the line to cut CL shown in fig. 9 by a known cutting method such as a cutting blade or a laser beam. Thereby manufacturing a plurality of cover members 4.
Next, a method for manufacturing the package 1 will be described. The method includes a joining step of joining the cover member 4 manufactured as described above to the end face 2b of the base 2.
As shown in fig. 10, in the bonding step, the lid member 4 is superimposed on the base body 2. Specifically, the first main surface 7a of the body portion 7 of the lid member 4 is opposed to the substrate 2, and the joint portion 9 is brought into contact with the metal layer 6 of the end surface 2b of the substrate 2. Then, the metal layer 6 and the joint 9 are heated in a pressure-bonded state (heating step). Thereby, the metallic bonding material of the bonding portion 9 is in a molten state. Then, the molten metallic bonding material is cooled and solidified (cooling step).
After the cooling step is completed, the sealing portion 5 is formed by integrally bonding the metal layer 6 of the base 2 and the metal layer 8 of the main body portion 7 at the bonding portion 9. By the above operation, the package 1 in which the airtightness of the concave portion 2a of the base body 2 is maintained is completed.
According to the method for manufacturing the lid member 4 of the present embodiment described above, by setting the particle diameter D10 of the metal particles in the paste-like metallic bonding material to 5 μm or more and setting the particle diameter D90 to 50 μm or less, the stress generated in the lid member 4 during the cooling step in the bonding portion forming step S3 can be relaxed. This can reduce breakage of the main body 7.
When the quartz substrate or the quartz glass substrate is used for the main body portion 7 of the cover member 4, the difference in thermal expansion coefficient between the joint portion 9 and the main body portion 7 is significantly increased. In this case as well, the stress generated in the body 7 can be reduced as much as possible, and the breakage of the body 7 can be reduced.
The present invention is not limited to the configuration of the above embodiment, and is not limited to the above operation and effect. The present invention can be variously modified within a range not departing from the gist of the present invention.
In the above-described embodiment, the step of forming the plurality of metal layers 8 and the joint portions 9 on the substrate 13 on which the plurality of lid members 4 can be manufactured is described, but the present invention is not limited to this configuration. The present invention may have a structure in which after a plurality of main bodies 7 are formed by cutting a substrate 13, a metal layer 8 and a joint 9 are formed on each main body 7.
In the above-described embodiment, the cutting step S4 of cutting the substrate 13 along the line to cut CL is illustrated, but the present invention is not limited to this configuration. For example, the substrate 13 on which the plurality of metal layers 8 and the joint 9 are formed may be used as the cover member 4 without cutting. In this case, the substrate 13 itself becomes the main body portion 7 of the cover member 4. By bonding the lid member 4 to the base body 2 having the plurality of recesses 2a, a package including the plurality of electronic components 3 can be manufactured. In this package, the plurality of electronic components may be individually divided and cut after the bonding step.
Examples
Hereinafter, examples of the present invention will be described, but the present invention is not limited to these examples.
The present inventors performed experiments for confirming the effects of the present invention. In the test, the lid members of the examples and the lid members of the comparative examples were produced, and it was confirmed whether or not the main body portion thereof was damaged by cracking or the like.
The lid member was a quartz glass substrate having a thickness of 0.5mm as the main body. A metal layer and a joint are laminated on one surface of a quartz glass substrate. Three metal layers and a joint are formed on a quartz glass substrate.
In the metal layer, the base layer is Cr, the intermediate layer is Ni, and the surface layer is Au. The metal layer and the joint portion are each formed in a quadrangular frame shape. One side of the metal layer had a length of 400 μm. One side of the joint was 320 μm in length. The thickness of the metal layer was 1.25 μm (base layer: 0.1 μm, intermediate layer: 0.85 μm, surface layer: 0.3 μm). The thickness of the joint was 30 μm.
The joint portions of the examples and comparative examples were formed by the following methods. First, a paste-like bonding material containing metal particles of an Au — Sn alloy is applied so as to overlap with the metal layer. The metal particles of the bonding material of example 1 had a particle diameter D10 of 11 μm and a particle diameter D90 of 42 μm. The metal particles of the bonding material of example 2 had a particle diameter D10 of 17 μm and a particle diameter D90 of 30 μm. The metal particles of the bonding material of comparative example 1 had a particle diameter D10 of 3 μm and a particle diameter D90 of 48 μm. The metal particles of the bonding material of comparative example 2 had a particle diameter D10 of 2 μm and a particle diameter D90 of 83 μm.
Next, 100 pieces of each of the quartz glass substrates coated with the paste containing the metal particles of examples 1 and 2 and comparative examples 1 and 2 were prepared, and heated to 300 ℃. After heating, the quartz glass substrate was cooled to room temperature. After cooling, it was confirmed by an optical microscope (100 times) from the quartz glass substrate side whether or not breakage such as cracking occurred at the portion of the quartz glass substrate where the bonding portion was formed.
As a result of this test, the occurrence rate of breakage of the lid member of example 1 was 1%. In addition, the occurrence rate of breakage of the cover member of example 2 was 0%. In contrast, the rate of occurrence of breakage of the lid member of comparative example 1 was 7%. In addition, the occurrence rate of breakage of the lid member of comparative example 2 was 9%, and it was confirmed that the metal particles were not melted in the metal bonding material.
The metal-based bonding materials of examples 1 and 2 contain metal particles having a larger particle diameter than those of comparative examples 1 and 2. Therefore, when the metal-based bonding material is applied to the metal layer, the contact area of the metal particles with respect to the metal layer (surface layer) can be reduced. In this case, the metal bonding material maintains a low contact area even after the metal particles are melted in the heating step. It is estimated that by reducing the contact area between the metal particles of the metal-based bonding material and the metal layer, the stress generated in the main body portion (quartz glass substrate) in the cooling step can be relaxed.
Description of the reference numerals
4. Cover member
7. Main body part
7a first main surface
8. Metal layer
9. Joint part
S2 Metal layer Forming Process
S3 Joint Forming step
Claims (4)
1. A method for manufacturing a lid member for covering a base of a package, wherein,
the cover member is provided with a main body part,
the method for manufacturing the cover member includes:
a coating step of coating a metal-based bonding material containing metal particles on a surface of the main body; and
a heat treatment step of performing heat treatment on the metal-based bonding material,
the metal particles have a particle diameter D10 of 5 μm or more and a particle diameter D90 of 50 μm or less.
2. The manufacturing method of a cover member according to claim 1,
the metal particles comprise an Au-Sn alloy.
3. The manufacturing method of a cover member according to claim 1 or 2,
a metal layer forming step of forming a metal layer on the surface of the main body part, prior to the coating step,
in the coating step, the metal-based bonding material is coated so as to overlap the metal layer.
4. The method for manufacturing a lid member according to any one of claims 1 to 3,
the body portion is formed of quartz or quartz glass.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020110321A JP7473877B2 (en) | 2020-06-26 | 2020-06-26 | Manufacturing method of the cover member |
| JP2020-110321 | 2020-06-26 | ||
| PCT/JP2021/022926 WO2021261356A1 (en) | 2020-06-26 | 2021-06-16 | Method for producing cover member |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115668482A true CN115668482A (en) | 2023-01-31 |
Family
ID=79281317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180037875.7A Pending CN115668482A (en) | 2020-06-26 | 2021-06-16 | Method for manufacturing cover member |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7473877B2 (en) |
| KR (1) | KR20230028210A (en) |
| CN (1) | CN115668482A (en) |
| TW (1) | TW202201662A (en) |
| WO (1) | WO2021261356A1 (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6683243B2 (en) | 2016-03-07 | 2020-04-15 | 株式会社村田製作所 | Method for manufacturing bonded body and bonding material |
| JP7022434B2 (en) | 2016-08-02 | 2022-02-18 | 株式会社弘輝 | Flux for solder paste and solder paste |
| JP6294417B2 (en) | 2016-09-01 | 2018-03-14 | 日機装株式会社 | Optical semiconductor device and method of manufacturing optical semiconductor device |
-
2020
- 2020-06-26 JP JP2020110321A patent/JP7473877B2/en active Active
-
2021
- 2021-06-16 WO PCT/JP2021/022926 patent/WO2021261356A1/en active Application Filing
- 2021-06-16 CN CN202180037875.7A patent/CN115668482A/en active Pending
- 2021-06-16 KR KR1020227033333A patent/KR20230028210A/en unknown
- 2021-06-23 TW TW110122927A patent/TW202201662A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202201662A (en) | 2022-01-01 |
| WO2021261356A1 (en) | 2021-12-30 |
| KR20230028210A (en) | 2023-02-28 |
| JP7473877B2 (en) | 2024-04-24 |
| JP2022007385A (en) | 2022-01-13 |
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