CN115651544A - Mixed abrasive polishing solution and preparation method thereof - Google Patents
Mixed abrasive polishing solution and preparation method thereof Download PDFInfo
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- CN115651544A CN115651544A CN202211229966.3A CN202211229966A CN115651544A CN 115651544 A CN115651544 A CN 115651544A CN 202211229966 A CN202211229966 A CN 202211229966A CN 115651544 A CN115651544 A CN 115651544A
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- abrasive
- dispersant
- abrasive polishing
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- 238000005498 polishing Methods 0.000 title claims abstract description 76
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- 239000002270 dispersing agent Substances 0.000 claims abstract description 43
- 238000000498 ball milling Methods 0.000 claims abstract description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 9
- 238000002156 mixing Methods 0.000 claims abstract description 6
- 125000003275 alpha amino acid group Chemical group 0.000 claims abstract description 3
- 239000000243 solution Substances 0.000 claims description 55
- 239000000463 material Substances 0.000 claims description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 10
- 239000011259 mixed solution Substances 0.000 claims description 10
- 159000000000 sodium salts Chemical class 0.000 claims description 10
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 claims description 9
- 229920002125 Sokalan® Polymers 0.000 claims description 8
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 claims description 8
- 229920001577 copolymer Polymers 0.000 claims description 8
- 239000004584 polyacrylic acid Substances 0.000 claims description 8
- 235000001014 amino acid Nutrition 0.000 claims description 6
- VRPQIIJGEJVXBK-UHFFFAOYSA-N fluoro hypofluorite lanthanum Chemical compound [La].FOF VRPQIIJGEJVXBK-UHFFFAOYSA-N 0.000 claims description 6
- 238000000227 grinding Methods 0.000 claims description 6
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 2
- QNAYBMKLOCPYGJ-REOHCLBHSA-N L-alanine Chemical compound C[C@H](N)C(O)=O QNAYBMKLOCPYGJ-REOHCLBHSA-N 0.000 claims description 2
- 229920002845 Poly(methacrylic acid) Polymers 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- 235000004279 alanine Nutrition 0.000 claims description 2
- 229960003767 alanine Drugs 0.000 claims description 2
- 229910003460 diamond Inorganic materials 0.000 claims description 2
- 239000010432 diamond Substances 0.000 claims description 2
- LPUQAYUQRXPFSQ-DFWYDOINSA-M monosodium L-glutamate Chemical compound [Na+].[O-]C(=O)[C@@H](N)CCC(O)=O LPUQAYUQRXPFSQ-DFWYDOINSA-M 0.000 claims description 2
- 108700004121 sarkosyl Proteins 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 229910052708 sodium Inorganic materials 0.000 claims description 2
- 239000011734 sodium Substances 0.000 claims description 2
- 229940079781 sodium cocoyl glutamate Drugs 0.000 claims description 2
- 229940065859 sodium cocoyl glycinate Drugs 0.000 claims description 2
- 229940045944 sodium lauroyl glutamate Drugs 0.000 claims description 2
- KSAVQLQVUXSOCR-UHFFFAOYSA-M sodium lauroyl sarcosinate Chemical compound [Na+].CCCCCCCCCCCC(=O)N(C)CC([O-])=O KSAVQLQVUXSOCR-UHFFFAOYSA-M 0.000 claims description 2
- 229940045885 sodium lauroyl sarcosinate Drugs 0.000 claims description 2
- IWIUXJGIDSGWDN-UQKRIMTDSA-M sodium;(2s)-2-(dodecanoylamino)pentanedioate;hydron Chemical compound [Na+].CCCCCCCCCCCC(=O)N[C@H](C([O-])=O)CCC(O)=O IWIUXJGIDSGWDN-UQKRIMTDSA-M 0.000 claims description 2
- IKGKWKGYFJBGQJ-UHFFFAOYSA-M sodium;2-(dodecanoylamino)acetate Chemical compound [Na+].CCCCCCCCCCCC(=O)NCC([O-])=O IKGKWKGYFJBGQJ-UHFFFAOYSA-M 0.000 claims description 2
- LOBXNKKFDKXXQW-UHFFFAOYSA-M sodium;3-[dodecanoyl(methyl)amino]propanoate Chemical compound [Na+].CCCCCCCCCCCC(=O)N(C)CCC([O-])=O LOBXNKKFDKXXQW-UHFFFAOYSA-M 0.000 claims description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- HWCHICTXVOMIIF-UHFFFAOYSA-M sodium;3-(dodecylamino)propanoate Chemical compound [Na+].CCCCCCCCCCCCNCCC([O-])=O HWCHICTXVOMIIF-UHFFFAOYSA-M 0.000 claims 1
- 239000002245 particle Substances 0.000 abstract description 21
- 230000000052 comparative effect Effects 0.000 description 22
- 230000003746 surface roughness Effects 0.000 description 9
- 238000003801 milling Methods 0.000 description 8
- 239000004576 sand Substances 0.000 description 8
- 239000005304 optical glass Substances 0.000 description 7
- 150000001413 amino acids Chemical class 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 229920001495 poly(sodium acrylate) polymer Polymers 0.000 description 3
- 238000001878 scanning electron micrograph Methods 0.000 description 3
- NNMHYFLPFNGQFZ-UHFFFAOYSA-M sodium polyacrylate Chemical compound [Na+].[O-]C(=O)C=C NNMHYFLPFNGQFZ-UHFFFAOYSA-M 0.000 description 3
- 239000003082 abrasive agent Substances 0.000 description 2
- 238000001000 micrograph Methods 0.000 description 2
- RWZXIUKKMTXBQY-UHFFFAOYSA-M sodium dodecanoylazanide Chemical compound C(CCCCCCCCCCC)(=O)[NH-].[Na+] RWZXIUKKMTXBQY-UHFFFAOYSA-M 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- FBCHMEOPUKIZJN-UHFFFAOYSA-N dodecyl 2-aminopropanoate;sodium Chemical compound [Na].CCCCCCCCCCCCOC(=O)C(C)N FBCHMEOPUKIZJN-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Provides a mixed abrasive polishing solution and a preparation method thereof. The preparation method comprises the following steps: mixing a first abrasive, a second abrasive, and water; then adding the first dispersing agent and the second dispersing agent; then adjusting the pH value to 8-12; and finally, performing ball milling and sanding to obtain the mixed abrasive polishing solution. Wherein the first dispersant is a polyacrylic dispersant and the second dispersant is an amino acid dispersant. The obtained mixed abrasive polishing solution has good dispersibility, small and uniform particles.
Description
Technical Field
The invention belongs to the technical field of preparation of inorganic powder materials, and particularly relates to a mixed abrasive polishing solution and a preparation method thereof.
Background
With the development of the communication technology industry, the requirements for the surface roughness of integrated circuit components are higher and higher. Damage-free, flatness and smoothness of high-precision surfaces such as silicon substrates, hard disk substrates, optical glass, precision ceramics and the like in integrated circuits become key factors determining product performance and quality. In order to realize ultra-precise polishing of products, polishing solutions using ceria as an abrasive are mostly adopted at present, and the polishing solutions have a chemical action with the surface of a material to be polished and can realize Chemical Mechanical Polishing (CMP) under the action of mechanical grinding. However, ceria is easily agglomerated in water, and the agglomerated particles have a large and uneven particle size, and when used as an abrasive, it causes scratches on the surface to be polished, and thus cannot satisfy the requirement of high-precision polishing. Therefore, it is difficult to develop a method for preparing a ceria-based polishing solution having a good dispersibility and a small particle size to achieve high-efficiency polishing.
Disclosure of Invention
The invention provides a preparation method of mixed abrasive polishing solution, which comprises the following steps:
(1) Mixing a certain amount of first grinding material, second grinding material and water to obtain a first mixed solution;
(2) Adding a certain amount of first dispersant and second dispersant into the first mixed solution obtained in the step (1) to obtain a second mixed solution;
(3) Adjusting the pH value of the second mixed solution obtained in the step (2) to 8-12 (preferably 10); and then ball milling is carried out, and sanding is carried out after ball milling to obtain the mixed abrasive polishing solution.
Wherein the first abrasive is a ceria abrasive.
Wherein the second abrasive is at least one of lanthanum oxyfluoride, silicon dioxide, aluminum oxide, zirconium oxide, iron oxide and diamond powder.
Wherein the first dispersant is a polyacrylic dispersant and the second dispersant is an amino acid dispersant.
The first dispersing agent is at least one selected from polyacrylic acid sodium salt, polymethacrylic acid sodium salt, acrylic acid-maleic acid copolymer sodium salt, acrylic acid-maleic anhydride copolymer sodium salt, acrylic acid-acrylate-sulfonate copolymer and acrylic acid-styrene copolymer sodium salt.
Wherein the second dispersing agent is at least one selected from sodium lauroyl sarcosinate, sodium lauroyl glutamate, sodium lauroyl methyl aminopropionate, sodium cocoyl alanine, sodium cocoyl glycinate, sodium cocoyl glutamate and sodium dodecyl aminopropionate.
Wherein the mass ratio of the first abrasive to the second abrasive is 1.2-5.
Wherein the total adding amount of the first dispersing agent and the second dispersing agent is 0.1-5% of the total mass of the first mixed solution.
Wherein the ball milling time of the ball milling is 100-720min, and the ball milling rotating speed is 100-500r/min.
Wherein the sanding time of sanding is 100-720min, and the sanding rotating speed is 1000-3000r/min.
Wherein the total adding amount of the first abrasive and the second abrasive is 5-50% of the mass of the polishing solution.
The invention also provides a mixed abrasive polishing solution, which is prepared by the preparation method of the mixed abrasive polishing solution.
The invention has the beneficial effects that:
(1) According to the preparation method of the mixed abrasive polishing solution, two types of anionic dispersants are selected for dispersing the mixed abrasive, namely the polyacrylic acid dispersant and the amino acid dispersant, so that electrostatic repulsion exists between the abrasives, a steric hindrance effect can be provided by a longer organic hydrophobic chain, and the dispersibility of the abrasives is improved through the synergistic effect of the polyacrylic acid dispersant and the amino acid dispersant.
The polyacrylic acid dispersing agent has higher viscosity, so that the polyacrylic acid dispersing agent can avoid particle agglomeration by coating the surface of the abrasive and reducing the relative motion of the abrasive in a solvent, thereby further improving the dispersibility. The disadvantages are that the dispersant is difficult to be fully dissolved in water, and the removal rate of the prepared polishing solution to the object to be polished is low.
Therefore, the amino acid dispersant and the polyacrylic acid dispersant are compounded, and the amino acid dispersant can reduce the viscosity of a system, and the two dispersants have the same charge and cannot generate interference, so that the polishing solution with small particle size, good dispersibility and high removal rate is finally obtained.
(2) In order to make the dispersant with higher viscosity fully contact with the abrasive in the system, the main function of the first ball milling process of the invention is to fully dissolve the dispersant with higher viscosity in water by more powerful ball milling, and then the second sand milling process is to further grind the particles with larger particle size into small and uniform particles.
Brief description of the drawings
FIG. 1 is a laser particle size plot of a mixed abrasive polishing solution prepared in example 1;
FIG. 2 is a scanning electron micrograph of the mixed abrasive polishing solution prepared in example 1;
FIG. 3 is a photograph of the mixed abrasive polishing solution prepared in example 1 after being left for 1 hour;
FIG. 4 is a photograph of a mixed abrasive polishing solution prepared in example 1, which was left for 120 hours;
FIG. 5 is a surface roughness image of the K9 optical glass surface polished by the mixed abrasive polishing solution prepared in example 1;
FIG. 6 is a graph of laser particle size for comparative polishing solution 1 prepared in comparative example 1;
FIG. 7 is a surface roughness image of the surface of K9 optical glass polished by comparative polishing solution 1 prepared in comparative example 1;
FIG. 8 is a graph of laser particle size for comparative polishing solution 2 prepared in comparative example 2;
FIG. 9 is a scanning electron micrograph of comparative polishing solution 2 prepared in comparative example 2;
FIG. 10 is a surface roughness picture of the surface of K9 optical glass polished by comparative polishing solution 2 prepared in comparative example 2;
fig. 11 is a laser particle size diagram of mixed nano-ceria, lanthanum oxyfluoride feedstock.
Detailed Description
The present invention will be described in further detail with reference to specific examples. It is to be understood that these examples are for illustration only and are not intended to limit the scope of the present invention. Furthermore, it should be understood that various changes and modifications can be made by those skilled in the art after reading the teaching of the present invention, and these equivalents also fall within the scope of the claims of the present application.
Example 1
Mixing 2.00kg of cerium dioxide and 1.00kg of lanthanum oxyfluoride with 26L of water, taking 0.1kg of sodium polyacrylate (molecular weight is about 400-500 ten thousand) (total material is 0.34%) and 0.30kg of sodium lauroyl amide (total material is 1%), adjusting the pH value to 10, then carrying out ball milling for 180min, carrying out ball milling at a rotation speed of 400r/min, carrying out sand milling after the ball milling is finished, carrying out sand milling for 180min, carrying out sand milling at a rotation speed of 2000r/min, and obtaining the mixed abrasive polishing solution after the sand milling is finished, wherein the viscosity of the mixed abrasive polishing solution is 18.1mPa.s, and the average particle size of the polishing solution is 269.9nm.
FIG. 1 is a laser particle size diagram of a mixed abrasive polishing solution, and FIG. 2 is a scanning electron microscope image of an abrasive after the mixed abrasive polishing solution is dried. Fig. 3 is a picture of the mixed abrasive polishing solution after being left for 1h, and fig. 4 is a picture of the mixed abrasive polishing solution after being left for 120 h.
The K9 optical glass surface was polished with the prepared mixed abrasive polishing solution with a concentration of 10%, a polishing pressure of 40kPa, a polishing pad rotation speed of 80r/min, a Material Removal Rate (MRR) after 20min of polishing was 608.725nm/min, and FIG. 5 shows that a surface roughness (Ra) after polishing was 0.73nm.
Comparative example 1-Using only the first dispersant, no second dispersant
Mixing 2.00kg of cerium dioxide and 1.00kg of lanthanum oxyfluoride with 26L of water, taking 0.1kg of sodium polyacrylate (with the molecular weight of about 400-500 ten thousand) (0.34% of total materials), adjusting the pH value to 10, then carrying out ball milling for 180min at the ball milling rotation speed of 400r/min, carrying out sand milling for 180min after the ball milling is finished and 2000r/min at the sand milling rotation speed, and obtaining a comparative polishing solution 1 after the sand milling is finished, wherein the viscosity of the comparative polishing solution is 40mPa.s, and the average particle size of the polishing solution is 280.7nm.
FIG. 6 is a graph of laser particle size for comparative polishing solution 1.
The surface of the K9 optical glass was polished with a comparative polishing solution 1 having a concentration of 10%, a polishing pressure of 40kPa, a rotational speed of the polishing pad of 80r/min, and a Material Removal Rate (MRR) of 236.72nm/min after 20min of polishing, and FIG. 7 shows a surface roughness (Ra) of 2.41nm after polishing.
As can be seen from the comparative example 1, only the polyacrylic acid dispersant is adopted, and the relative movement rate of the grinding material on the surface of the object to be polished is reduced due to the higher system viscosity, so that the removal rate of the prepared polishing solution to the object to be polished is lower.
Comparative example 2-ball milling only, no sanding
Mixing 2.00kg of cerium dioxide, 1.00kg of lanthanum oxyfluoride and 26L of water, taking 0.1kg of sodium polyacrylate (with the molecular weight of about 400-500 ten thousand) (0.34 percent of total materials) and 0.30kg of sodium lauroyl amide (1 percent of total materials), adjusting the pH value to 10, and then carrying out ball milling for 180min at the ball milling rotation speed of 400r/min to obtain a comparative polishing solution 2, wherein the average particle size of the polishing solution is 740.4nm.
Fig. 8 is a laser particle size diagram of comparative polishing solution 2, and fig. 9 is a scanning electron micrograph of the abrasive after comparative polishing solution 2 was dried.
The K9 optical glass surface was polished with comparative polishing solution 2 having a concentration of 10%, a polishing pressure of 40kPa, a rotation speed of the polishing pad of 80r/min, and a Material Removal Rate (MRR) of 362.42nm/min after 20min of polishing, and fig. 10 shows that a surface roughness (Ra) after polishing was 4.9nm.
As can be seen from the particle size distribution diagram, the scanning electron microscope image, and the polished surface roughness data of comparative example 2, the average particle diameter of the polishing liquid, which was only ball-milled and not sanded, was large, so that the surface roughness after being parabolic-polished was large.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. This need not be, nor should it be exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.
Claims (10)
1. The preparation method of the mixed abrasive polishing solution is characterized by comprising the following steps of:
(1) Mixing a certain amount of first grinding material, second grinding material and water to obtain a first mixed solution;
(2) Adding a certain amount of first dispersing agent and second dispersing agent into the first mixed solution obtained in the step (1) to obtain a second mixed solution;
(3) Adjusting the pH value of the second mixed solution obtained in the step (2) to 8-12; then ball milling is carried out, and sanding is carried out after ball milling to obtain the mixed abrasive polishing solution;
wherein the first dispersant is a polyacrylic dispersant and the second dispersant is an amino acid dispersant.
2. The method of preparing a mixed abrasive polishing solution according to claim 1, wherein the first abrasive is a ceria abrasive.
3. The method of preparing the mixed abrasive polishing solution according to claim 1, wherein the second abrasive is at least one of lanthanum oxyfluoride, silica, alumina, zirconia, iron oxide, and diamond powder.
4. The method of preparing the mixed abrasive polishing solution according to claim 1, wherein the first dispersant is at least one selected from the group consisting of a polyacrylic acid sodium salt, a polymethacrylic acid sodium salt, an acrylic acid-maleic acid copolymer sodium salt, an acrylic acid-maleic anhydride copolymer sodium salt, an acrylic acid-acrylate-sulfonate copolymer, and an acrylic acid-styrene copolymer sodium salt.
5. The method of preparing a mixed abrasive polishing solution according to claim 1, wherein the second dispersant is at least one selected from the group consisting of sodium lauroyl sarcosinate, sodium lauroyl glutamate, sodium lauroyl methylaminopropionate, sodium cocoyl alanine, sodium cocoyl glycinate, sodium cocoyl glutamate, and sodium lauryl aminopropionate.
6. The method for preparing the mixed abrasive polishing solution according to claim 1, wherein the mass ratio of the first abrasive to the second abrasive is 1.
7. The method for producing a mixed abrasive polishing solution according to claim 1, wherein the total amount of the first dispersant and the second dispersant added is 0.1 to 5% by mass of the total mass of the first mixed solution.
8. The method for preparing the mixed abrasive polishing solution according to claim 1, wherein the ball milling time is 100-720min, and the ball milling rotation speed is 100-500r/min; wherein the sanding time of sanding is 100-720min, and the sanding rotating speed is 1000-3000r/min.
9. The method for preparing the mixed abrasive polishing solution according to claim 1, wherein the total amount of the first abrasive and the second abrasive is 5 to 50% by mass of the polishing solution.
10. A mixed abrasive polishing solution prepared by the method for preparing a mixed abrasive polishing solution according to any one of claims 1 to 9.
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| CN202211229966.3A CN115651544B (en) | 2022-10-09 | 2022-10-09 | Mixed abrasive polishing solution and preparation method thereof |
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| CN202211229966.3A CN115651544B (en) | 2022-10-09 | 2022-10-09 | Mixed abrasive polishing solution and preparation method thereof |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10176164A (en) * | 1996-10-17 | 1998-06-30 | Showa Denko Kk | Abrasive composition for polishing glass and its production |
| JP2001031951A (en) * | 1999-07-22 | 2001-02-06 | Hitachi Chem Co Ltd | Abrasive and method for polishing substrate |
| KR101470979B1 (en) * | 2013-07-05 | 2014-12-10 | 주식회사 케이씨텍 | Additive composition and slurry composition comprising the same |
| CN108251845A (en) * | 2016-12-28 | 2018-07-06 | 安集微电子科技（上海）股份有限公司 | A kind of chemical mechanical polishing liquid and its application |
| CN115058199A (en) * | 2022-08-18 | 2022-09-16 | 广东粤港澳大湾区黄埔材料研究院 | High-dispersion ball-like nano cerium oxide polishing solution and application thereof |
-
2022
- 2022-10-09 CN CN202211229966.3A patent/CN115651544B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10176164A (en) * | 1996-10-17 | 1998-06-30 | Showa Denko Kk | Abrasive composition for polishing glass and its production |
| JP2001031951A (en) * | 1999-07-22 | 2001-02-06 | Hitachi Chem Co Ltd | Abrasive and method for polishing substrate |
| KR101470979B1 (en) * | 2013-07-05 | 2014-12-10 | 주식회사 케이씨텍 | Additive composition and slurry composition comprising the same |
| CN108251845A (en) * | 2016-12-28 | 2018-07-06 | 安集微电子科技（上海）股份有限公司 | A kind of chemical mechanical polishing liquid and its application |
| CN115058199A (en) * | 2022-08-18 | 2022-09-16 | 广东粤港澳大湾区黄埔材料研究院 | High-dispersion ball-like nano cerium oxide polishing solution and application thereof |
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