CN115642474A - High-speed Mach-Zehnder driver chip controlled by integrated silicon optical integrated circuit - Google Patents
High-speed Mach-Zehnder driver chip controlled by integrated silicon optical integrated circuit Download PDFInfo
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- CN115642474A CN115642474A CN202211209711.0A CN202211209711A CN115642474A CN 115642474 A CN115642474 A CN 115642474A CN 202211209711 A CN202211209711 A CN 202211209711A CN 115642474 A CN115642474 A CN 115642474A
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- mach
- zehnder
- control circuit
- driver chip
- mpd
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4287—Optical modules with tapping or launching means through the surface of the waveguide
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4296—Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/0014—Measuring characteristics or properties thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02453—Heating, e.g. the laser is heated for stabilisation against temperature fluctuations of the environment
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Semiconductor Lasers (AREA)
- Optical Communication System (AREA)
Abstract
The invention relates to the technical field of chip integration, and discloses a high-speed Mach-Zehnder driver chip controlled by an integrated silicon optical integrated circuit. The control circuit is integrated on the high-speed Mach-Zehnder driver chip, so that the space and the cost of the optical module are saved.
Description
Technical Field
The invention relates to the technical field of chip integration, in particular to a high-speed Mach-Zehnder driver chip controlled by an integrated silicon optical integrated circuit.
Background
At present, the high-speed laser driver optical module widely adopts an independent driver chip, and a control circuit, such as a heater controller, a manual or automatic laser power controller, an MPD monitor with digital diagnosis and the like, is connected around the chip through a wire bonding. The control circuit occupies a large amount of space inside the optical module, and the cost of the optical module is increased. The control circuitry around the driver chip and its wire bonding increase the difficulty of Common Package Optics (CPO).
Disclosure of Invention
The invention aims to provide an integrated Mach-Zehnder driver core, which is used for integrating a control circuit on a high-speed Mach-Zehnder driver core, can reduce routing inside an optical module and reduce the difficulty of a CPO packaging technology.
The invention is realized by the following technical scheme: a high-speed Mach-Zehnder driver chip controlled by an integrated silicon optical integrated circuit comprises: integrating a control circuit of a silicon optical integrated circuit on a Mach-Zehnder driver chip, wherein the control circuit comprises a heater controller, a manual or automatic power controller, an MPD monitor and a digital control circuit, the Mach-Zehnder driver chip is connected with a Mach-Zehnder modulator, and the Mach-Zehnder modulator comprises a heater of the Mach-Zehnder modulator; and the radio frequency output end of the Mach-Zehnder driver chip is connected with the differential radio frequency signal input end of the Mach-Zehnder modulator.
The MPD monitor includes a power supply output and an ADC output.
The MPD monitor includes a power supply output and an ADC output.
In order to further realize the present invention, when the control circuit is constituted by a heater controller, an output terminal of the heater controller is connected to a control input terminal of the heater of the mach-zehnder modulator.
In order to better implement the present invention, when the control circuit is formed by a manual or automatic power controller, an output terminal of the manual or automatic power controller is connected to a laser.
In order to further realize the present invention, when the control circuit is configured by an MPD monitor and a digital control circuit, the current source output terminal of the MPD monitor is connected to the MPD of the mach-zehnder modulator, and the ADC output terminal of the MPD monitor is connected to the input terminal of the digital control circuit.
In this solution, the MPD monitor and the digital control circuit need to be integrated.
In order to better implement the present invention, when the control circuit is composed of a heater controller and a manual or automatic power controller, an output terminal of the heater controller is connected to a control input terminal of the heater of the mach-zehnder modulator, and an output terminal of the manual or automatic optical power controller is connected to a laser.
In order to further achieve the present invention, when the control circuit is configured by a heater controller, an MPD monitor, and a digital control circuit, the current source output terminal of the MPD monitor is connected to the MPD of the mach-zehnder modulator, the ADC output terminal of the MPD monitor is connected to the input terminal of the digital control circuit, the output terminal of the digital control circuit is connected to the input terminal of the heater controller, and the output terminal of the heater controller is connected to the control input terminal of the heater of the mach-zehnder modulator.
In order to further realize the present invention, when the control circuit is composed of a manual or automatic power controller, an MPD monitor, and a digital control circuit, the current source output terminal of the MPD monitor is connected to the MPD of the mach-zehnder modulator, the ADC output terminal of the MPD monitor is connected to the input terminal of the digital control circuit, the output terminal of the digital control circuit is connected to the input terminal of the manual or automatic optical power controller, and the output terminal of the manual or automatic optical power controller is connected to the laser.
In order to further achieve the present invention, when the control circuit includes a heater controller, a manual or automatic power controller, an MPD monitor, and a digital control circuit, an output terminal of the heater controller is connected to a control input terminal of the heater of the mach-zehnder modulator, a current source output terminal of the MPD monitor is connected to the MPD of the mach-zehnder modulator, an ADC output terminal of the MPD monitor is connected to an input terminal of the digital control circuit, an output terminal of the digital control circuit is connected to input terminals of the manual or automatic optical power controller and the heater controller, and an output terminal of the manual or automatic optical power controller is connected to a laser.
In order to realize the present invention, the mach-zehnder driver chip is a high-speed mach-zehnder driver chip having a chip size of 25Gbps or more.
Compared with the prior art, the invention has the following advantages and beneficial effects:
(1) According to the invention, the control circuit is integrated on the driver chip, so that the space and the cost of the optical module are saved;
(2) The control circuit is integrated on the high-speed Mach-Zehnder driver chip, so that routing inside the optical module can be reduced, and the difficulty of the CPO packaging technology is reduced.
Drawings
The invention is further described with reference to the following figures and examples, all of which are intended to be covered by the present disclosure and the scope of the invention.
Fig. 1 is a schematic diagram showing a comparison between a conventional package and a CPO package in a high-speed mach-zehnder driver chip controlled by an integrated silicon optical integrated circuit according to the present invention.
Fig. 2 is a schematic diagram of a prior art control circuit connected around a chip by wire bonding.
The structure schematic diagram of the main integration in the high-speed Mach-Zehnder driver chip designed on the chip as the integrated silicon optical integrated circuit provided by the invention is shown in FIG. 3.
Fig. 4 (a), (b), and (c) are respectively schematic structural diagrams of a heater controller, an MPD monitor, and an automatic or manual optical power controller in the high-speed mach-zehnder driver chip controlled by the integrated silicon optical integrated circuit according to the present invention.
FIG. 5 is a schematic diagram of a Texas instruments OPA858 operational amplifier that is widely used according to an embodiment of the present invention.
Detailed Description
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and therefore should not be considered as a limitation to the scope of protection. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1:
in the embodiment, as shown in fig. 3-4, in addition to the drivers on the mach-zehnder driver chip, a control circuit, a heater controller, an automatic or manual laser power control, and an MPD monitor with a digital diagnostic function are integrated. As shown in fig. 3, we need to cover 1 channel and multiple channels, with N =1,2,3.
The design difficulty of the invention is that a designer needs to know the working principle of circuits such as a heater, manual and automatic laser power control, an MPD monitor (monitoring photodiode monitor) and the like in the high-speed Mach-Zehnder driver optical module and the stable and reliable cooperative work among the circuits.
In the invention, the heater controller can provide current up to tens of milliamperes through the MOS field effect transistor current source, the automatic or manual laser power control circuit is provided with a large-current operational amplifier to meet the requirement of power control, the laser current source can provide current of more than hundreds of milliamperes, stable large-current bias can be provided for a laser, an MPD monitor with digital diagnosis can monitor the related voltage of the MPD of the photodiode in real time, and feedback is provided for laser power control and the heater controller. In the integrated silicon optical integrated circuit controlled high-speed mach-zehnder driver chip provided by the invention, the heater controller, the manual or automatic power controller, the MPD monitor and the digital control circuit included in the control circuit can be any one or a combination of a plurality of circuits.
Example 2:
the embodiment is further optimized on the basis of embodiment 1, and as shown in fig. 1, the design integrates a control circuit on a driver chip, so that the space and the cost of an optical module are saved. For example, as shown in fig. 2, in the conventional design, both the heater controller and the gain control circuit use a large current operational amplifier, and currently, a wide range of operational amplifiers are used in the optical module, such as a texas instruments OPA858 operational amplifier, as shown in fig. 4, the package size is 2mm × 2mm, and the internal space of the optical module is occupied relatively large. The laser current source integrated on the chip can provide stable large current for the laser. MPD monitoring with digital diagnostics can provide voltage information needed for power control in time.
With the increasing signal rate, the disadvantages of the currently widely used pluggable optical modules begin to emerge. Since the conventional technology is to place an electrical chip (e.g., a driver) and an optical transceiver separately and connect them together through a PCB, power consumption and delay are increasing when processing ultra-high speed data. And the CPO technology can be used for packaging the electric chip and the optical transceiver together, so that the loss between the electric chip and the optical transceiver is reduced, the delay is reduced, and the space consumption and the cost are reduced. Because the design integrates the control circuit, the integration level of the driver chip is greatly improved, and the design is more suitable for the CPO technology.
Other parts of this embodiment are the same as embodiment 1, and thus are not described again.
Example 3:
the embodiment is further optimized on the basis of the embodiment 1 or 2, and the performance requirements of the 400Gbps DR4 and 800Gbps DR8 silicon optical modules on high-speed MZ drivers can be met. Meanwhile, due to the high integration level, the design has great advantages in the co-packaged optics technology, particularly the CPO technology, and the cost of the optical module is increased because the control circuit occupies a large amount of space inside the optical module. The difficulty of the CPO packaging technology is increased by the control circuit around the driver chip and the wire bonding thereof, which is different from the current packaging technology, for example, patent CN 113759477A, the problem solving method is not integration, but the means of packaging the chip is used.
The rest of this embodiment is the same as embodiment 1 or 2, and therefore, the description thereof is omitted.
Example 4:
in this embodiment, a control circuit is integrated on a driver chip, which is further optimized based on any one of embodiments 1 to 3, so that the space and cost of an optical module are saved. For example, in the conventional design, both the heater controller and the gain control circuit use a large-current operational amplifier, and the current operational amplifier used in the optical module has a large area and occupies a large internal space of the optical module. As shown in fig. 5, the package size of the widely used texas instrument OPA858 operational amplifier is 2mm × 2mm, which occupies more space inside the optical module. The laser current source integrated on the chip can provide stable large current for the laser. The MPD monitor with digital diagnostics can provide power control and voltage information needed by the heater controller in time. With the increasing signal rate, the disadvantages of the pluggable optical modules that are widely used at present begin to emerge. Since the conventional technology is to place an electrical chip (e.g., a driver) and an optical transceiver separately and connect them together through a PCB, power consumption and delay are increasing when processing ultra-high speed data. And the CPO technology can be used for packaging the electric chip and the optical transceiver together, so that the loss between the electric chip and the optical transceiver is reduced, the delay is reduced, and the space consumption and the cost are reduced.
The invention can be used in 400Gbps DR4 and 800Gbps DR8 silicon optical modules in Ethernet data centers, wherein 400Gbps and 800Gbps represent data transmission rates, D represents transmission distance covering 500 meters, R represents a specific transmission protocol, and numbers 4 and 8 represent the total number of electrical chip channels. Meanwhile, due to the high integration level of the design, the design has great advantages in Common Package Optics (CPO). Because the design integrates the control circuit, the integration level of the driver chip is greatly improved, and the design is more suitable for the CPO technology.
Other parts of this embodiment are the same as any of embodiments 1 to 3, and thus are not described again.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way, and any simple modifications and equivalent variations of the above embodiment according to the technical spirit of the present invention are within the scope of the present invention.
Claims (2)
1. A high-speed Mach-Zehnder driver chip controlled by an integrated silicon optical integrated circuit is characterized by comprising:
integrating a control circuit of a silicon optical integrated circuit on a Mach-Zehnder driver chip, wherein the control circuit comprises a heater controller, a manual or automatic power controller, an MPD monitor and a digital control circuit, the Mach-Zehnder driver chip is connected with a Mach-Zehnder modulator, and the Mach-Zehnder modulator comprises a heater of the Mach-Zehnder modulator; the radio frequency output end of the Mach-Zehnder driver chip is connected with the differential radio frequency signal input end of the Mach-Zehnder modulator;
the MPD monitor comprises a power supply output terminal and an ADC output terminal;
when the control circuit is composed of a heater controller, a manual or automatic power controller, an MPD monitor and a digital control circuit, the output end of the heater controller is connected with the control input end of the heater of the Mach-Zehnder modulator, the current source output end of the MPD monitor is connected with the MPD of the Mach-Zehnder modulator, the ADC output end of the MPD monitor is connected with the input end of the digital control circuit, the output end of the digital control circuit is connected with the input ends of the manual or automatic optical power controller and the heater controller, and the output end of the manual or automatic optical power controller is connected with a laser.
2. The integrated silicon optical integrated circuit controlled high-speed Mach-Zehnder driver chip as claimed in claim 1, wherein the Mach-Zehnder driver chip is a high-speed Mach-Zehnder driver chip of 25Gbps or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211209711.0A CN115642474A (en) | 2022-07-19 | 2022-07-19 | High-speed Mach-Zehnder driver chip controlled by integrated silicon optical integrated circuit |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211209711.0A CN115642474A (en) | 2022-07-19 | 2022-07-19 | High-speed Mach-Zehnder driver chip controlled by integrated silicon optical integrated circuit |
| CN202210847807.3A CN115085001B (en) | 2022-07-19 | 2022-07-19 | High-speed Mach-Zehnder driver chip controlled by integrated silicon optical integrated circuit |
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| CN202210847807.3A Division CN115085001B (en) | 2022-07-19 | 2022-07-19 | High-speed Mach-Zehnder driver chip controlled by integrated silicon optical integrated circuit |
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| CN202211209711.0A Pending CN115642474A (en) | 2022-07-19 | 2022-07-19 | High-speed Mach-Zehnder driver chip controlled by integrated silicon optical integrated circuit |
| CN202210847807.3A Active CN115085001B (en) | 2022-07-19 | 2022-07-19 | High-speed Mach-Zehnder driver chip controlled by integrated silicon optical integrated circuit |
| CN202211212249.XA Pending CN115528534A (en) | 2022-07-19 | 2022-07-19 | High-speed Mach-Zehnder driver chip controlled by integrated silicon optical integrated circuit |
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| CN202210847807.3A Active CN115085001B (en) | 2022-07-19 | 2022-07-19 | High-speed Mach-Zehnder driver chip controlled by integrated silicon optical integrated circuit |
| CN202211212249.XA Pending CN115528534A (en) | 2022-07-19 | 2022-07-19 | High-speed Mach-Zehnder driver chip controlled by integrated silicon optical integrated circuit |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117650848A (en) * | 2024-01-29 | 2024-03-05 | 深圳市迅特通信技术股份有限公司 | 800G LR8 optical module |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP4146211B2 (en) * | 2002-11-06 | 2008-09-10 | 日本電信電話株式会社 | Optical module, optical switch constituting the same, and optical matrix switch |
| US7848369B1 (en) * | 2008-12-23 | 2010-12-07 | Infinera Corporation | Optical modulator drive circuit with integrated low power output bias voltage control |
| CN101599698A (en) * | 2009-05-19 | 2009-12-09 | 广州金升阳科技有限公司 | A kind of micro-power DC-DC power supply and manufacture method thereof |
| US9166704B1 (en) * | 2013-07-17 | 2015-10-20 | Inphi Corporation | Integrated control for silicon photonics |
| CN103916193B (en) * | 2014-03-19 | 2016-10-05 | 绍兴中科通信设备有限公司 | The optical transceiver module that a kind of manipulator both arms can independently be modulated |
| US10700492B2 (en) * | 2018-01-05 | 2020-06-30 | The Trustees Of The University Of Pennsylvania | Integrated pound-drever-hall laser stabilization system |
| US10754091B1 (en) * | 2019-03-18 | 2020-08-25 | Inphi Corporation | Integrated coherent optical transceiver, light engine |
| KR20220028083A (en) * | 2019-07-02 | 2022-03-08 | 라이트매터, 인크. | photonics stabilization circuit |
| US11178473B1 (en) * | 2020-06-05 | 2021-11-16 | Marvell Asia Pte, Ltd. | Co-packaged light engine chiplets on switch substrate |
| WO2022037227A1 (en) * | 2020-08-18 | 2022-02-24 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| US20220003948A1 (en) * | 2021-07-08 | 2022-01-06 | Intel Corporation | Integrated Silicon Photonics Transceivers Enabling Ultra-High-Speed High Dense Input/Output And Interconnect For Terabyte Per Second Optical Interconnect |
| CN113991418B (en) * | 2021-12-27 | 2022-03-15 | 成都英思嘉半导体技术有限公司 | Socket for characteristic impedance matching of signal transmission line and high-frequency light emitting device |
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- 2022-07-19 CN CN202211209711.0A patent/CN115642474A/en active Pending
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117650848A (en) * | 2024-01-29 | 2024-03-05 | 深圳市迅特通信技术股份有限公司 | 800G LR8 optical module |
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| Publication number | Publication date |
|---|---|
| CN115528534A (en) | 2022-12-27 |
| CN115085001B (en) | 2022-10-28 |
| CN115085001A (en) | 2022-09-20 |
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