CN115621165B - Wafer sorting machine - Google Patents
Wafer sorting machine Download PDFInfo
- Publication number
- CN115621165B CN115621165B CN202211288113.7A CN202211288113A CN115621165B CN 115621165 B CN115621165 B CN 115621165B CN 202211288113 A CN202211288113 A CN 202211288113A CN 115621165 B CN115621165 B CN 115621165B
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- Prior art keywords
- wafer
- module
- bearing
- sorting
- material preparation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a wafer sorting machine, comprising: sorting module, material preparation module, carrying manipulator and centrifugal display; the sorting module is arranged on one side of the material preparation module and used for sorting wafers of different types stored in the material preparation module; the centrifugal display device is arranged on the other side of the material preparation module and is used for adjusting the placing direction of the wafer; the carrying manipulator is arranged between the material preparation module and the centrifugal display and is used for carrying the wafer. The sorting module, the material preparation module, the carrying manipulator and the centrifugal display device are matched to realize sorting operation on wafers of different types, overcome the defect of low working efficiency in the prior art, and have the characteristics of high processing yield and high processing precision, and save the production cost of the wafers.
Description
Technical Field
The invention relates to the technical field of wafer processing, in particular to a wafer sorting machine.
Background
In the wafer sorting work, wafers with different specifications and different processes are stored by using different wafer cassettes due to different wafer specifications. The pods are classified into horizontally open pods (e.g., wafer FOUP, wafer POSB, wafer Open cassette) and vertically open pods (e.g., wafer cake pods). Because the difference of wafer box, among the prior art, many times all use the suction pen to take, discern, deposit the wafer in the different kind wafer box through the manual work, the cost of labor is higher, and has the defect that work efficiency is low, the wafer is polluted easily.
Disclosure of Invention
According to an embodiment of the present invention, there is provided a wafer sorter including: sorting module, material preparation module, carrying manipulator and centrifugal display;
the sorting module is arranged on one side of the material preparation module and used for sorting wafers of different types stored in the material preparation module;
the centrifugal display device is arranged on the other side of the material preparation module and is used for adjusting the placing direction of the wafer;
the carrying manipulator is arranged between the material preparation module and the centrifugal display and is used for carrying the wafer.
Further, the stock preparation module comprises: the wafer cassette comprises a first bearing bracket, a wafer sorting box, a first wafer display box, a second wafer display box and a wafer containing platform;
the wafer sorting box is arranged at the top of the first bearing bracket;
the first wafer display box is arranged on the top of the first bearing bracket;
the second wafer display box is arranged at the top of the first bearing bracket, and is arranged in a straight line with the first wafer display box and the wafer sorting box;
the wafer holds the platform setting and holds one side of support at first, and the wafer holds the platform and links up with the transport manipulator for hold the wafer.
Further, the wafer holding platform comprises: the device comprises a second bearing bracket, a mounting plate, a pair of guide parts, a motor, a bidirectional screw, a pair of mounting brackets, a pair of sliding blocks, a bearing plate and two pairs of bearing columns;
the bearing plate is arranged at the top of the second bearing bracket;
the mounting plate is arranged on the second bearing bracket and is positioned on one side of the bearing plate;
a pair of guide members arranged in parallel on the top of the mounting plate;
the mounting brackets are arranged at the top of the mounting plate in parallel, and the central shafts of the mounting brackets are the same;
two ends of the bidirectional screw are rotationally connected with a pair of guide pieces;
the pair of sliding blocks are arranged on the pair of guide pieces in a sliding manner, and the pair of sliding blocks are respectively meshed with threads at two ends of the bidirectional screw rod;
the motor is arranged on the mounting plate, and the execution end of the motor is connected with one end of the bidirectional screw rod and used for driving the bidirectional screw rod to rotate;
the two pairs of bearing columns are respectively arranged at the top parts of the pair of sliding blocks, penetrate through the bearing plate and protrude out of the outer surface of the bearing plate respectively and are used for bearing wafers.
Further, the wafer holding platform further comprises: the shaft coupling, the shaft coupling sets up the execution end at the motor, and the shaft coupling links to each other with two-way screw rod.
Further, the sorting module comprises: the third bearing bracket, the first linear module, the connecting piece, the second linear module and the clamping jaw
The third bearing bracket is arranged at one side of the material preparation module;
the first linear module is arranged at the top of the third bearing bracket;
the connecting piece is arranged at the execution end of the first linear module;
the second linear module is arranged on the connecting piece;
the clamping jaw is arranged at the execution end of the second linear module and used for carrying wafers.
Further, the clamping jaw is a sucking disc clamping jaw.
Further, the method further comprises the following steps: and the ranging sensor is arranged on the clamping jaw and used for detecting the distance between the clamping jaw and the wafer.
According to the wafer sorting machine provided by the embodiment of the invention, the sorting operation of different types of wafers is realized by matching the sorting module, the material preparation module, the carrying manipulator and the centrifugal display, the defect of low working efficiency in the prior art is overcome, the wafer sorting machine has the characteristics of high processing yield and high processing precision, and the production cost of the wafers is saved.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and are intended to provide further explanation of the technology claimed.
Drawings
Fig. 1 is a perspective view of a wafer sorter according to an embodiment of the present invention;
fig. 2 is a partial enlarged view at a in fig. 1.
Detailed Description
The preferred embodiments of the present invention will be described in detail below with reference to the attached drawings, which further illustrate the present invention.
First, a wafer sorter according to an embodiment of the present invention will be described with reference to fig. 1 to 2, for sorting wafers 5, which has a wide application range.
As shown in fig. 1, a wafer sorter according to an embodiment of the present invention includes: the device comprises a sorting module, a material preparation module, a carrying manipulator 1 and a centrifugal display device 2;
specifically, as shown in fig. 1, the stock module is used for storing wafers 5 of different types; the centrifugal display device 2 is arranged at the other side of the material preparation module and is used for adjusting the placement direction of the wafers 5 so as to keep the placement direction of the randomly placed wafers 5 consistent; the handling robot 1 is arranged between the stock module and the centrifugal display 2 for handling wafers 5.
Further, as shown in fig. 1, the stock preparation module includes: the wafer cassette comprises a first bearing bracket 31, a wafer sorting box 32, a first wafer display box 33, a second wafer display box 34 and a wafer containing platform; the wafer sorting box 32 is arranged at the top of the first bearing bracket 31 and is used for storing a plurality of wafers 5 with different placing directions and different types; the first wafer display box 33 is disposed on top of the first carrying bracket 31 and is used for storing wafers 5 of the same type; the second wafer display box 34 is arranged on the top of the first bearing bracket 31, and the second wafer display box 34, the first wafer display box 33 and the wafer sorting box 32 are arranged in a straight line and are used for storing wafers 5 with the same model; the wafer holds the platform setting in one side of first bearing bracket 31, and the wafer holds the platform and links up with transport manipulator 1 for hold the wafer 5 of arbitrary model.
Further, as shown in fig. 1-2, the wafer holding platform includes: a second carriage 351, a mounting plate 352, a pair of guides 353, a motor 354, a bi-directional screw 355, a pair of mounting brackets 356, a pair of sliders 357, a carriage plate 358, and two pairs of carriage posts 359; the bearing plate 358 is arranged on top of the second bearing bracket 351; the mounting plate 352 is arranged on the second bearing bracket 351, and the mounting plate 352 is positioned on one side of the bearing plate 358; a pair of guide members 353 are provided in parallel at the top of the mounting plate 352 for guiding the pair of sliders 357; a pair of mounting brackets 356 are disposed in parallel on top of the mounting plate 352, the center axes of the pair of mounting brackets 356 being the same for carrying the bi-directional screw 355; both ends of the bidirectional screw 355 are rotatably connected to a pair of guide members 353; the pair of sliding blocks 357 are slidably arranged on the pair of guide members 353, the pair of sliding blocks 357 are respectively meshed with threads at two ends of the bidirectional screw 355, and the reverse screw drives the pair of sliding blocks 357 to move oppositely or reversely at the same time, so that the distance between the two pairs of bearing columns 359 can be conveniently adjusted, and the two pairs of bearing columns 359 are suitable for bearing wafers 5 with different types; the motor 354 is arranged on the mounting plate 352, and the execution end of the motor 354 is connected with one end of the bidirectional screw 355 and is used for driving the bidirectional screw 355 to rotate; the two pairs of bearing columns 359 are respectively arranged at the top of the pair of sliding blocks 357, and the two pairs of bearing columns 359 respectively penetrate through the bearing plate 358 and protrude out of the outer surface of the bearing plate 358 for bearing the wafer 5.
Further, as shown in fig. 2, the wafer holding platform further includes: the shaft coupling 360, the shaft coupling 360 sets up the execution end at the motor 354, and the shaft coupling 360 links to each other with the bi-directional screw 355 for the execution end to the motor 354 is buffered, has prolonged the life of motor 354.
Specifically, as shown in fig. 1, the sorting module is disposed at one side of the stock module, and is used for sorting wafers 5 of different types stored in the stock module.
Further, as shown in fig. 1, the sorting module includes: the third bearing bracket 41, the first linear module 42, the connecting piece 43, the second linear module 44 and the clamping jaw 45; the third bearing bracket 41 is arranged at one side of the material preparation module; the first linear module 42 is disposed at the top of the third bearing bracket 41 and is used for driving the clamping jaw 45 to move transversely, so that the working efficiency of the embodiment is improved, and the occupied space of the embodiment is saved; the connecting piece 43 is arranged at the execution end of the first linear module 42; the second linear module 44 is disposed on the connecting piece 43 and is used for driving the clamping jaw 45 to move longitudinally, so that the working efficiency of the embodiment is improved, and the occupied space of the embodiment is saved; the clamping jaw 45 is disposed at the actuating end of the second linear module 44 for carrying the wafer 5.
Further, as shown in fig. 1, the clamping jaw 45 is a chuck clamping jaw, so that damage to the wafer 5 caused by the clamping jaw 45 can be effectively avoided, the processing yield of the embodiment is improved, and the production cost is saved.
Further, as shown in fig. 1, the wafer sorter further includes: the distance measuring sensor 46, the distance measuring sensor 46 sets up on the clamping jaw 45 for detect the distance between clamping jaw 45 and the wafer 5, avoid taking place to hit the piece, improved machining precision and the processing yield of this embodiment, practiced thrift manufacturing cost.
Before the equipment operates, the driving clamping jaw 45 drives the ranging sensor 46 to measure the heights of the wafers 5 in the wafer sorting box 32, the first wafer display box 33 and the second wafer display box 34, when the equipment operates, the ranging sensor 46 measures the distance between the clamping jaw 45 and the wafers 5, the second linear module 44 drives the clamping jaw 45 to extend into the wafer sorting box 32, the clamping jaw 45 clamps the wafers 5 of any model and then drives the clamping jaw 45 to return to the initial position, the first linear module 42 drives the second linear module 44 to move to the upper part of the bearing plate 358 through the connecting piece 43, the motor 354 drives the bidirectional screw 355 to rotate according to the model of the wafers 5, the bidirectional screw 355 drives the pair of sliding blocks 357 to displace to adjust the distance between the two pairs of bearing columns 359, the two pairs of bearing columns 359 are suitable for bearing the wafers 5 clamped on the clamping jaw 45, the second linear module 44 drives the clamping jaw 45 to descend to the preset height, the wafers 5 are placed on the two pairs of bearing columns 359, and then the second linear module 44 drives the clamping jaw 45 to return to the initial position; the handling robot 1 grabs the wafer 5 placed on the two pairs of carrying columns 359 and carries the wafer 5 onto the centrifugal display 2, the centrifugal display 2 adjusts the placement direction of the wafer 5, after the centrifugal display 2 is adjusted, the handling robot 1 grabs the wafer 5 on the centrifugal display 2 and returns the wafer 5 to the two pairs of carrying columns 359, the second linear module 44 drives the clamping jaw 45 to descend to grab the wafer 5 on the two pairs of carrying columns 359, after the clamping jaw 45 grabs the wafer 5, the second linear module 44 drives the clamping jaw 45 to ascend, the first linear module 42 drives the second linear module 44 to move above the first wafer display box 33 or the second wafer display box 34 corresponding to the type of the wafer 5 according to the type of the wafer 5, the second linear module 44 drives the clamping jaw 45 to descend, and the wafer 5 is placed in the first wafer display box 33 or the second wafer display box 34.
In the above, the wafer sorter according to the embodiment of the invention is described with reference to fig. 1-2, and the sorting operation of the wafers 5 of different types is realized by matching the sorting module, the material preparation module, the carrying manipulator 1 and the centrifugal display 2, so that the defect of low working efficiency in the prior art is overcome, and the wafer sorter has the characteristics of high processing yield and high processing precision, and saves the production cost of the wafers 5.
It should be noted that in this specification the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other like elements in a process, method, article or apparatus that comprises the element.
While the present invention has been described in detail through the foregoing description of the preferred embodiment, it should be understood that the foregoing description is not to be considered as limiting the invention. Many modifications and substitutions of the present invention will become apparent to those of ordinary skill in the art upon reading the foregoing. Accordingly, the scope of the invention should be limited only by the attached claims.
Claims (5)
1. A wafer sorter, comprising: sorting module, material preparation module, carrying manipulator and centrifugal display;
the sorting module is arranged on one side of the material preparation module and is used for sorting wafers of different types stored in the material preparation module;
the centrifugal display device is arranged on the other side of the material preparation module and is used for adjusting the placing direction of the wafer;
the conveying manipulator is arranged between the material preparation module and the centrifugal display device and is used for conveying wafers;
the material preparation module comprises: the wafer cassette comprises a first bearing bracket, a wafer sorting box, a first wafer display box, a second wafer display box and a wafer containing platform;
the wafer sorting box is arranged at the top of the first bearing bracket;
the first wafer display box is arranged on the top of the first bearing bracket;
the second wafer display box is arranged at the top of the first bearing bracket, and the second wafer display box, the first wafer display box and the wafer sorting box are arranged in a straight line;
the wafer containing platform is arranged on one side of the first bearing bracket and is connected with the carrying manipulator for containing the wafer;
the wafer holding platform comprises: the device comprises a second bearing bracket, a mounting plate, a pair of guide parts, a motor, a bidirectional screw, a pair of mounting brackets, a pair of sliding blocks, a bearing plate and two pairs of bearing columns;
the bearing plate is arranged at the top of the second bearing bracket;
the mounting plate is arranged on the second bearing bracket and is positioned on one side of the bearing plate;
the pair of guide pieces are arranged at the top of the mounting plate in parallel;
the mounting brackets are arranged at the top of the mounting plate in parallel, and the central axes of the mounting brackets are the same;
the two ends of the bidirectional screw are rotationally connected with the pair of guide pieces;
the pair of sliding blocks are arranged on the pair of guide pieces in a sliding manner, and are respectively meshed with threads at two ends of the bidirectional screw rod;
the motor is arranged on the mounting plate, and the execution end of the motor is connected with one end of the bidirectional screw rod and used for driving the bidirectional screw rod to rotate;
the two pairs of bearing columns are respectively arranged at the tops of the pair of sliding blocks, penetrate through the bearing plate respectively and protrude out of the outer surface of the bearing plate, and are used for bearing the wafer.
2. The wafer sorter of claim 1, wherein the wafer containment platform further comprises: the coupler is arranged at the executing end of the motor and is connected with the bidirectional screw rod.
3. The wafer sorter of claim 1, wherein the sorting module comprises: the clamping jaw comprises a third bearing bracket, a first linear module, a connecting piece, a second linear module and a clamping jaw;
the third bearing bracket is arranged at one side of the material preparation module;
the first linear module is arranged at the top of the third bearing bracket;
the connecting piece is arranged at the execution end of the first linear module;
the second linear module is arranged on the connecting piece;
the clamping jaw is arranged at the execution end of the second linear module and used for carrying the wafer.
4. The wafer separator of claim 3 wherein the clamping jaw is a chuck clamping jaw.
5. The wafer sorter as in claim 3 further comprising: and the ranging sensor is arranged on the clamping jaw and used for detecting the distance between the clamping jaw and the wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211288113.7A CN115621165B (en) | 2022-10-20 | 2022-10-20 | Wafer sorting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211288113.7A CN115621165B (en) | 2022-10-20 | 2022-10-20 | Wafer sorting machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115621165A CN115621165A (en) | 2023-01-17 |
| CN115621165B true CN115621165B (en) | 2023-09-01 |
Family
ID=84864815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211288113.7A Active CN115621165B (en) | 2022-10-20 | 2022-10-20 | Wafer sorting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115621165B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106783701A (en) * | 2015-11-19 | 2017-05-31 | 亿力鑫***科技股份有限公司 | Wafer bearing device |
| CN113921438A (en) * | 2021-10-18 | 2022-01-11 | 麦斯克电子材料股份有限公司 | Multi-size wafer centering device |
| CN216094907U (en) * | 2021-11-01 | 2022-03-22 | 中电科风华信息装备股份有限公司 | Sorting device for front-end integrated wafers of semiconductor equipment |
| WO2022116514A1 (en) * | 2020-12-04 | 2022-06-09 | 苏州天准科技股份有限公司 | Intelligent silicon wafer sorting machine |
| CN217375054U (en) * | 2022-02-21 | 2022-09-06 | 上海世禹精密机械有限公司 | Wafer transporter |
-
2022
- 2022-10-20 CN CN202211288113.7A patent/CN115621165B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106783701A (en) * | 2015-11-19 | 2017-05-31 | 亿力鑫***科技股份有限公司 | Wafer bearing device |
| WO2022116514A1 (en) * | 2020-12-04 | 2022-06-09 | 苏州天准科技股份有限公司 | Intelligent silicon wafer sorting machine |
| CN113921438A (en) * | 2021-10-18 | 2022-01-11 | 麦斯克电子材料股份有限公司 | Multi-size wafer centering device |
| CN216094907U (en) * | 2021-11-01 | 2022-03-22 | 中电科风华信息装备股份有限公司 | Sorting device for front-end integrated wafers of semiconductor equipment |
| CN217375054U (en) * | 2022-02-21 | 2022-09-06 | 上海世禹精密机械有限公司 | Wafer transporter |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115621165A (en) | 2023-01-17 |
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Address after: 201615 Room 101, building 3, no.1589, Lianfu Road, Jiuting Town, Songjiang District, Shanghai Applicant after: Shanghai Shiyu Precision Equipment Co.,Ltd. Address before: 201615 Room 101, building 3, no.1589, Lianfu Road, Jiuting Town, Songjiang District, Shanghai Applicant before: SHANGHAI SHIYU PRECISION MACHINERY Co.,Ltd. |
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