CN115613002A

CN115613002A - Vapor deposition apparatus

Info

Publication number: CN115613002A
Application number: CN202211601478.0A
Authority: CN
Inventors: 马保群; 陈涛
Original assignee: Bitong Semiconductor Equipment Suzhou Co ltd
Current assignee: Bitong Semiconductor Equipment Suzhou Co ltd
Priority date: 2022-12-14
Filing date: 2022-12-14
Publication date: 2023-01-17
Anticipated expiration: 2042-12-14
Also published as: CN115613002B

Abstract

The invention relates to a vapor deposition apparatus comprising: the base station comprises a table top and a base shaft, the table top is positioned in the cavity, the base shaft is connected with the lower surface of the table top, and the base shaft penetrates through the cavity and is connected with an adjusting plate; the planet assembly comprises a rotating frame, an inner gear ring is arranged on the inner periphery of the rotating frame, the center of the bottom surface of the rotating frame is rotatably connected with a rotating shaft center, the rotating shaft center is installed on a supporting plate, one end of the rotating shaft center, which is positioned in the rotating frame, is connected with a planet carrier, the center of the planet carrier is rotatably connected with a central gear, a plurality of end parts of the planet carrier are respectively rotatably connected with planet wheels, and the planet wheels are respectively meshed with the inner gear ring and the central gear; the rotary lifting assemblies are connected through the fixing plate and connected with the adjusting plate, and are driven to lift through the rotation of the planet wheels; the supporting plate and the fixing plate are fixedly connected below the cavity through the mounting plate. The invention has simple and convenient operation, realizes multi-point synchronous adjustment and improves the lifting convenience of the base station.

Description

Vapor deposition apparatus

Technical Field

The invention relates to the technical field of semiconductor manufacturing equipment, in particular to vapor deposition equipment.

Background

The method for plating the film on the surface of the substrate by utilizing the vapor deposition technology under the vacuum condition is an important way for obtaining film materials with excellent mechanical property and special physical/chemical property, and is a research hotspot in the fields of material science, physical science and the like at present. The core problem of vapor deposition technology is to use the selected deposition method (such as magnetron sputtering, pulsed laser deposition, etc.) to obtain the film material with the required properties on the surface of the substrate to be plated.

The vapor deposition process needs to be realized through vapor deposition equipment, along with the continuous development of scientific research and actual film production processes, the requirements on the function diversification of a vapor deposition coating device are more strict, the wafer base platform needs to meet various functions, and when different processes are carried out, the height of the wafer base platform needs to be repeatedly adjusted according to specific process requirements.

The existing wafer base adjusting mechanism adjusts the height between a connecting mounting plate arranged on a cavity and the cavity, so that the height of the wafer base connected with the connecting mounting plate is adjusted. The specific adjusting method is to adjust three screws on the connecting mounting plate to achieve the purpose of adjusting the height. However, the three mounting screws are directly adjusted and are respectively and sequentially adjusted, so that absolute height errors exist in the three-point height adjustment, and therefore the parallelism of the wafer base station and the cavity is affected, namely the flatness of the process height of the wafer base station is affected, the wafer is displaced or slides relative to the base station, and the film coating rate, the film coating thickness and the film coating uniformity are affected.

Disclosure of Invention

Therefore, the technical problem to be solved by the invention is to overcome the defects in the prior art, and provide a vapor deposition device, which realizes multipoint synchronous adjustment of a wafer base station, is simple and convenient to operate, and ensures the uniformity of the flatness of the wafer base station.

In order to solve the above technical problems, the present invention provides a vapor deposition apparatus, comprising:

a cavity;

the base platform comprises a platform surface and a base shaft, the platform surface is positioned in the cavity, the base shaft is connected with the lower surface of the platform surface, and the base shaft penetrates through the cavity and is connected with an adjusting plate;

the planet assembly comprises a rotating frame, an inner gear ring is arranged on the inner periphery of the rotating frame, the center of the bottom surface of the rotating frame is rotationally connected with a rotating axis, the rotating axis is arranged on a supporting plate, one end of the rotating axis, which is positioned in the rotating frame, is connected with a planet carrier, the center of the planet carrier is rotationally connected with a central gear, a plurality of end parts of the planet carrier are respectively rotationally connected with planet gears, and the planet gears are respectively meshed with the inner gear ring and the central gear;

the plurality of rotary lifting assemblies are connected through a fixing plate, the rotary lifting assemblies are connected with the adjusting plate, and the rotary lifting assemblies are driven to lift through the rotation of the planet wheels;

the supporting plate and the fixing plate are fixedly connected below the cavity through a mounting plate.

In one embodiment of the invention, the rotary lifting assembly is a differential screw assembly comprising:

the lower end of the screw is connected to the center of the planet wheel, and a first spiral pair and a second spiral pair with the same thread turning direction are respectively arranged at the two ends of the screw;

the fixed shells are connected through the fixed plates, and first internal threads corresponding to the first screw pairs are arranged in the fixed shells;

the differential displacement head translates in the fixed shell, and second internal threads corresponding to the second screw pair are arranged in the differential displacement head;

the lead of the first internal thread is greater than that of the second internal thread, so that a lead difference is formed, a differential screw mechanism is formed, and accurate fine adjustment of the height is achieved.

In one embodiment of the invention, a spring is sleeved outside the screw rod between the first screw pair and the second screw pair, one end of the spring is abutted against the first screw pair, and the other end of the spring is abutted against the fixed shell or the differential displacement head.

In one embodiment of the present invention, the upper end of the fixing shell is provided with an inner hexagonal guide groove, and the differential displacement head is provided with an outer hexagonal guide post inserted into the inner hexagonal guide groove.

In one embodiment of the invention, the top of the differential displacement head is provided with a hemisphere shape, and the surface of the differential displacement head is provided with a scale.

In one embodiment of the present invention, the rotary lifting assembly is a lead screw assembly, the lead screw assembly comprising:

one ends of the plurality of screw bodies are respectively connected to the centers of the planet wheels, and the other ends of the plurality of screw bodies are rotationally connected with the fixing plate;

the screw nut is rotationally connected to the screw body and is connected with an adjusting rod, and the adjusting rod penetrates through the fixing plate;

the adjusting head is connected with the adjusting rod, and the adjusting head is connected with the adjusting plate.

In one embodiment of the invention, a plurality of fixing studs are arranged between the adjusting plate and the cavity, one ends of the fixing studs are locked with the cavity, the other ends of the fixing studs penetrate through the adjusting plate, and fixing nuts are in threaded connection with the fixing studs on two sides of the adjusting plate.

In one embodiment of the invention, the planet carrier is provided with a wheel shaft for connecting all the central gears and the planet wheels, the lower end of the wheel shaft is sleeved with a limiting sleeve, the upper end of the wheel shaft is provided with a limiting groove, equal-height isolating rings are clamped in the limiting groove, and the central gears and the planet wheels are clamped between the equal-height isolating rings and the limiting sleeve.

In one embodiment of the invention, the table top is connected with a heater, the base shaft is rotatably connected with the adjusting plate through a driving mechanism, a corrugated pipe is arranged outside the base shaft between the cavity and the adjusting plate, and two ends of the corrugated pipe are respectively connected with the bottom of the cavity and the adjusting plate.

In one embodiment of the invention, the periphery of the rotating frame is provided with anti-skid lines.

Compared with the prior art, the technical scheme of the invention has the following advantages:

the vapor deposition equipment is simple and convenient to operate, and the lifting convenience of the base platform is improved;

the planet assembly is adopted, the defect that multiple points are respectively and sequentially adjusted is overcome, and the multipoint synchronous adjustment is realized, so that the requirement on the processing planeness of the wafer can be met;

by adopting the differential screw assembly, the adjusting displacement is small, the adjustment can be accurate, and the height of the base platform can be effectively controlled.

Drawings

In order that the present disclosure may be more readily understood, a more particular description of the disclosure will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a cross-sectional view of the overall construction of the present invention;

FIG. 3 is a schematic view of the structure of the rotating frame of the present invention;

FIG. 4 is a schematic view of the differential screw assembly of the present invention in cooperation with a planetary assembly;

FIG. 5 is a cross-sectional view of the differential screw assembly of the present invention;

FIG. 6 is a schematic view of a support member of the present invention;

FIG. 7 is a schematic view of a positioning hub of the present invention;

FIG. 8 is a schematic view of the screw of the present invention;

FIG. 9 is a bottom view of the present invention;

fig. 10 is a schematic view of the planet carrier of the present invention.

The specification reference numbers indicate:

100. a cavity; 110. mounting a plate; 120. fixing the stud; 130. fixing a nut;

200. a base station; 210. a table top; 220. a base shaft; 230. an adjusting plate; 240. a bellows;

300. a planetary assembly; 310. a rotating frame; 311. an inner gear ring; 320. rotating the axis; 330. a support plate; 340. a planet carrier; 341. a wheel axle; 342. a limiting sleeve; 343. equal-height isolation rings; 350. a sun gear; 360. a planet wheel; 361. a support member; 362. a slot; 363. positioning the axis;

400. a rotary lifting assembly; 410. a fixing plate; 420. a differential screw assembly; 421. a screw; 422. a first screw pair; 423. a second screw pair; 424. a stationary case; 425. a first internal thread; 426. a differential displacement head; 427. a second internal thread; 428. a spring; 429. an outer hexagonal guide post.

Detailed Description

The present invention is further described below in conjunction with the following figures and specific examples so that those skilled in the art may better understand the present invention and practice it, but the examples are not intended to limit the present invention.

Referring to fig. 1, the overall structure of the vapor deposition apparatus of the present invention is schematically shown. The vapor deposition apparatus of the present invention includes:

a chamber 100; the vacuum chamber is used for executing vapor deposition operation, ensuring that the wafer is in a sealed environment and providing certain vacuum degree.

The base platform 200 comprises a table board 210 and a base shaft 220, the table board 210 is positioned in the chamber 100, and a wafer is placed on the table board 210 for film coating. The base shaft 220 is connected to the lower surface of the table 210, and the adjusting plate 230 is connected to the base shaft 220 through the cavity 100, so as to support the base table 200. With the current requirements for the function diversification of the vapor deposition coating device being more severe, in the embodiment, the base 200 is configured to heat the base 200, and specifically, the table 210 is connected with a heater. The effect of degassing and dewatering the surface of the wafer on the table board 210 is realized by heating the table board 210, so that the film-substrate binding force is improved, the coating stress is eliminated, and the aggregation degree of film layer particles is improved. Further, the base 200 is configured to rotate the base 200, and specifically, the base shaft 220 is rotatably connected to the adjusting plate 230 through a driving mechanism. By rotating the base 200, the influence on the sputtering coating caused by the possible non-uniform magnetic field is eliminated, and the uniformity and the stability of the coating are improved. Meanwhile, a corrugated pipe 240 is arranged outside the base shaft 220 between the chamber 100 and the adjusting plate 230, and both ends of the corrugated pipe 240 are respectively connected to the bottom of the chamber 100 and the adjusting plate 230, so as to seal a through hole at the bottom of the chamber 100 for the base 200 to pass through.

The planetary assembly 300, as shown in fig. 1, fig. 2 and fig. 3, the planetary assembly 300 includes a rotating frame 310, an inner ring gear 311 is disposed on an inner circumference of the rotating frame 310, a center of a bottom surface of the rotating frame 310 is rotatably connected with a rotating shaft center 320, the rotating shaft center 320 is mounted on a support plate 330, one end of the rotating shaft center 320 located in the rotating frame 310 is connected with a planetary carrier 340, the center of the planetary carrier 340 is rotatably connected with a sun gear 350, a plurality of ends of the planetary carrier 340 are respectively rotatably connected with planetary gears 360, and the planetary gears 360 are respectively engaged with the inner ring gear 311 and the sun gear 350. When the rotating frame 310 rotates, the planetary gears 360 are matched with the inner gear ring 311 and the central gear 350, so that the synchronous rotation of the plurality of planetary gears 360 is realized, the rotating speeds are the same, and a foundation is provided for realizing multipoint synchronous regulation.

A plurality of rotary lifting assemblies 400 are also included, and a plurality of the rotary lifting assemblies 400 are connected by a fixing plate 410 to maintain the consistency of the rotary lifting assemblies 400. The rotary lifting assembly 400 is connected with the adjusting plate 230, and the rotary lifting assembly 400 is driven to lift through the rotation of the planet wheel 360. That is, the rotary lifting assembly 400 forms a support for the adjusting plate 230 and the base 200, and in view of three points defining a plane, in the present embodiment, at least three rotary lifting assemblies 400 are provided to ensure that the flatness requirement of the base 200 is satisfied. The planet wheels 360 are therefore also provided in three. The planetary gears 360 rotate synchronously at the same speed, so that the rotary lifting assembly 400 can be driven by the planetary gears 360 to lift synchronously, and the adjusting plates 230 are lifted or lowered at the same height at different positions. On the one hand, the operation is simple, the lifting convenience is improved, and on the other hand, the flatness of the adjusting plate 230 and the base 200 connected with the adjusting plate 230 is always unchanged, so that the flatness requirement of the wafer during processing is met.

Further, in order to ensure the stability of the relative positions among the base 200, the planetary assembly 300 and the rotary elevating assembly 400, the supporting plate 330 and the fixing plate 410 are fixedly coupled to the lower side of the chamber 100 by the mounting plate 110.

The working principle of the invention is as follows:

the base 200 is connected to the adjusting plate 230 so that the flatness of the adjusting plate 230 affects the flatness of the base 200, and the three rotary elevating assemblies 400 support the base 200 while defining a plane, i.e., the rotary elevating assemblies 400 control the flatness of the adjusting plate 230. Before the operation, the three rotary elevating components 400 are used to adjust the height and the flatness of the base 200. After the operation, the height of the base 200 needs to be adjusted corresponding to different wafers and different processes, and at this time, the rotating frame 310 is rotated; in order to facilitate the rotation of the rotating frame 310, the rotating frame 310 is provided with anti-slip lines on the periphery. The rotation of the rotating frame 310 drives three planetary gears 360 and a sun gear 350 to rotate synchronously. Because the three rotary lifting assemblies 400 are respectively connected with the three planetary wheels 360, the rotary lifting assemblies 400 synchronously adjust the same height corresponding to the synchronous rotation of the planetary wheels 360, and the adjusting plate 230 and the base 200 lift accordingly. And because each point of the adjusting plate 230 is lifted to the same height along with the three rotary lifting assemblies 400, the flatness of the adjusting plate 230 and the base 200 is not changed in the lifting adjustment process, thereby ensuring that the process requirements are met.

Referring to fig. 4 and 5, since the height of the base 200 needs to be finely adjusted, the adjustment displacement is small, and the precision is high, the rotary lifting assembly 400 in this embodiment is a differential screw assembly 420. Differential screw assembly 420 can utilize great helical pitch to produce little displacement to reduce the processing degree of difficulty of screw thread, improved the precision of adjusting, and the screw thread wearability of big helical pitch is good, longe-lived.

Specifically, the differential screw assembly 420 includes:

the lower end of the screw 421 is connected to the center of the planetary gear 360, specifically, a supporting member 361 is fixedly mounted at the center of the planetary gear 360, referring to fig. 6, an inner hexagonal slot 362 is arranged at the center of the supporting member 361, the end of the screw 421 is arranged to be an outer hexagon, and the end of the screw 421 is inserted into the inner hexagonal slot 362. Of course, in other embodiments of the present invention, the screw 421 can also be a square or other non-circular shape, so that the screw can rotate with the supporting member 361, and can also move up and down relative to the supporting member 361. Further, referring to fig. 7, a positioning axis 363 is disposed in the supporting member 361, the positioning axis 363 is inserted into the screw 421, and when the screw 421 axially moves along the slot 362, the positioning axis 363 can guide the screw 421. Referring to fig. 8, a first screw pair 422 and a second screw pair 423 having the same thread turning direction are respectively disposed at two ends of the screw 421 along the length direction;

a plurality of fixing cases 424 connected to each other through the fixing plate 410, wherein a first internal thread 425 corresponding to the first screw pair 422 is formed in each fixing case 424;

a differential displacement head 426, wherein the differential displacement head 426 translates in the fixed shell 424, and a second internal thread 427 corresponding to the second screw pair 423 is arranged in the differential displacement head 426;

the lead of the first internal thread 425 is greater than the lead of the second internal thread 427.

Since the fixed housing 424 is fixed in position, when the planetary gear 360 rotates, the supporting member 361 and the screw 421 rotate synchronously with the planetary gear 360, the first screw pair 422 is engaged with the first internal thread 425, the screw 421 moves upward or downward relative to the fixed housing 424 and the supporting member, since the differential displacement head 426 can only translate relative to the fixed housing 424 and cannot rotate, the second screw pair 423 is engaged with the second internal thread 427, and the differential displacement head 426 moves in the opposite direction relative to the screw 421. In this manner, differential displacement head 426 effects differential movement relative to stationary housing 424. For every 1 rotation of the screw 421, the actual distance moved by the differential displacement head 426 is the difference between the thread leads at the two ends. Since the first screw pair 422 and the second screw pair 423 on the screw 421 have the same screw thread direction, the moving distance of the differential displacement head 426 is reduced, the lead of the first internal thread 425 is greater than that of the second internal thread 427, and the moving direction of the differential displacement head 426 is the same as that of the screw 421.

Further, since the screw pair has a lead clearance when engaging with the internal thread, in order to eliminate the lead clearance, a spring 428 is externally sleeved on the screw 421 between the first screw pair 422 and the second screw pair 423, as shown in fig. 4, one end of the spring 428 abuts against the first screw pair 422, and the other end of the spring 428 abuts against an inwardly protruding portion inside the fixing housing 424. Because the position of the fixed shell 424 is fixed, if there is a gap between the first screw pair 422 and the first internal thread 425, the first screw pair 422 fits the first internal thread 425 under the thrust action of the spring 428, so as to ensure that the screw 421 does not displace in the axial direction due to the gap. Referring to fig. 5, in another embodiment of the present invention, one end of the spring 428 abuts against the first screw pair 422, the other end abuts against the differential displacement head 426, the spring 428 pushes the screw 421 and the differential displacement head 426 out towards the two ends, and both screw pairs are tightly matched with the two internal threads by the reaction force of the spring 428, so that the influence of lead clearance is eliminated, and the precision of the differential screw assembly 420 is improved. Meanwhile, in order to realize that the differential displacement head 426 can only translate in the fixed shell 424 and cannot rotate, the upper end of the fixed shell 424 is provided with an inner hexagonal guide groove, the differential displacement head 426 is provided with an outer hexagonal guide post 429, and the outer hexagonal guide post 429 is inserted into the inner hexagonal guide groove. Of course, in other embodiments of the present invention, the guiding slot on the fixed shell 424 may be configured as a square or other polygon to limit the rotation of the differential displacement head 426. The external hexagonal guide post 429 may be disposed at the end of the differential displacement head 426, so that the differential displacement head 426 may be engaged with the fixed housing 424 even when the displacement of the differential displacement head 426 relative to the fixed housing 424 is relatively large, and the second internal thread 427 is disposed in the internal hexagonal guide post, and the second screw pair 423 is engaged with the second internal thread 427. Furthermore, when the contact area between the differential displacement head 426 and the adjustment plate 230 is large, if the differential displacement head 426 is slightly shifted, the flatness of the adjustment plate 230 will be affected, so the top of the differential displacement head 426 is configured as a hemisphere. At this time, the differential displacement head 426 maintains point contact with the adjustment plate 230 at all times, improving the accuracy of support of the differential screw assembly 420. The surface of the differential displacement head 426 is also provided with scales, so that the precise reading can be realized, and the distance can be finely adjusted conveniently.

In other embodiments of the present invention, the rotary lifting assembly 400 may also be a lead screw assembly.

Specifically, the lead screw subassembly includes:

one end of each of the screw bodies is connected to the center of each of the planet wheels 360, and the other end of each of the screw bodies is rotatably connected to the fixing plate 410;

the screw nut is rotationally connected to the screw body, and is connected with an adjusting rod which penetrates through the fixing plate 410;

and the adjusting head is connected with the adjusting rod, and the adjusting head is connected with the adjusting plate 230.

When the rotating frame 310 is rotated, the planetary gears 360 and the central gear 350 rotate synchronously, and the lead screw bodies connected with the planetary gears 360 respectively rotate synchronously, and due to the limitation of the fixing plate 410, the lead screw nuts connected with the adjusting rods cannot rotate together with the lead screw bodies, so that the lead screw nuts drive the adjusting rods and the adjusting heads to move axially along the lead screw bodies, and the synchronous lifting of the adjusting heads realizes the stable lifting of the adjusting plates 230 and the base 200. And the ball screw has high precision and can meet the process requirements.

Referring to fig. 6, in the case that the rotary elevating assembly 400 supports only the adjustment plate 230, the base 200 is not fixed, and a plurality of fixing studs 120 are disposed between the adjustment plate 230 and the chamber 100 in order to prevent the base 200 from being deviated due to vibration generated when the base 200 rotates or performs other processes. Specifically, one end of the fixing stud 120 is locked with the cavity 100, the other end of the fixing stud 120 penetrates through the adjusting plate 230, and fixing nuts 130 are connected to the fixing studs 120 on two sides of the adjusting plate 230 through threads. When the height of the base 200 is adjusted, the planetary assembly 300 adjusts the rotary elevating assembly 400 to abut against the adjusting plate 230 and then unscrews the fixing nuts 130, at which time the adjusting plate 230 is completely supported by the rotary elevating assembly 400. The planetary assembly 300 is adjusted, the lifting assembly 400 is rotated to be lifted, the adjusting plate 230 is adjusted to a desired height, and then the two fixing nuts 130 are tightened, and the adjusting plate 230 is fixed. At this time, even if the rotary elevating assembly 400 no longer supports the adjusting plate 230, the position of the adjusting plate 230 does not change.

Referring to fig. 7, the planet carrier 340 is provided with a wheel shaft 341 connecting all the sun gears 350 and the planet gears 360, so as to facilitate the matching of the planet gears 360 with the inner gear ring 311 and the sun gears 350. The lower end of the wheel shaft 341 is sleeved with a limiting sleeve 342, the upper end of the wheel shaft 341 is provided with a limiting groove, an equal-height isolating ring 343 is clamped in the limiting groove, and the sun gear 350 and the planet gear 360 are clamped between the equal-height isolating ring 343 and the limiting sleeve 342. Therefore, the planet wheels 360 can reach the same height when being installed, and the assembling precision of the equipment is improved.

During assembly, the plurality of rotary lifting assemblies 400 are adjusted to be equal in height. The fixing nuts 130 at the lower ends of the fixing studs 120 are loosened, so that the adjusting plate 230 and the base 200 are supported by the plurality of rotary lifting assemblies 400, and the flatness of the table 210 meets the process requirements. Then the rotating frame 310 is twisted, the rotating frame 310 rotates relative to the rotating shaft center 320, the planet carrier 340 is fixed with the rotating shaft center 320, but the planet wheel 360 connected with the wheel shaft 341 on the planet carrier 340 in a rotating mode is meshed with the inner gear ring 311, so that the planet wheel 360 rotates, and the planet wheel 360 rotates synchronously because the planet wheel 360 is meshed with the central gear 350. The screw 421 connected to the planetary gear 360 rotates with the planetary gear 360 under the limitation of the supporting member 361, and since the differential displacement head 426 can only translate relative to the fixed casing 424 and cannot rotate, the screw 421 rotates relative to the fixed casing 424 and the differential displacement head 426, and the differential displacement head 426 performs differential movement relative to the fixed casing 424. The plurality of differential displacement heads 426 move synchronously, the adjusting plate 230 supported by the differential displacement heads 426 realizes integral lifting, and the flatness of the adjusting plate is kept unchanged in the lifting process, so that whether the flatness of the table top 210 meets the process requirement does not need to be detected again after each adjustment. After the height adjustment is completed, the fixing nuts 130 at both sides of the adjustment plate 230 are rotated to clamp the adjustment plate 230 at the position, and the position of the base 200 is fixed, and at this time, the position of the base 200 is not changed even though the adjustment plate 230 is no longer supported by the rotary elevating assembly 400. When the fixing nut 130 is tightened, the fixing nut 130 above the adjusting plate 230 may be tightened, at this time, the upper surface of the adjusting plate 230 abuts against the fixing nut 130, the lower surface abuts against the rotary lifting assembly 400, the adjusting plate 230 is ensured to be at the adjusted position, and then the fixing nut 130 below the adjusting plate 230 is tightened, so that the adjusting plate 230 is clamped between the two fixing nuts 130, thereby completing the height adjustment of the base 200.

It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.

Claims

1. Vapor deposition apparatus, comprising:

a cavity;

2. The vapor deposition apparatus of claim 1, wherein the rotating lift assembly is a differential screw assembly comprising:

the lower end of the screw is connected to the center of the planet wheel through a support piece, and a first spiral pair and a second spiral pair with the same thread turning direction are respectively arranged at the two ends of the screw;

the differential displacement head translates in the fixed shell, and a second internal thread corresponding to the second screw pair is arranged in the differential displacement head;

the lead of the first internal thread is greater than the lead of the second internal thread.

3. The vapor deposition apparatus of claim 2, wherein a spring is sleeved around the screw between the first screw pair and the second screw pair, one end of the spring abuts against the first screw pair, and the other end of the spring abuts against the fixed shell or the differential displacement head.

4. The vapor deposition apparatus according to claim 2, wherein the stationary housing is provided at an upper end thereof with an inner hexagonal guide groove, and the differential displacement head is provided with an outer hexagonal guide post inserted into the inner hexagonal guide groove.

5. The vapor deposition apparatus of claim 2, wherein the differential displacement head top is configured as a hemisphere, and a scale is provided on a surface of the differential displacement head.

6. The vapor deposition apparatus of claim 1, wherein the rotary lift assembly is a lead screw assembly comprising:

7. The vapor deposition apparatus according to claim 1, wherein a plurality of fixing studs are disposed between the adjusting plate and the chamber, one end of each fixing stud is locked with the chamber, the other end of each fixing stud penetrates through the adjusting plate, and fixing nuts are screwed on the fixing studs on two sides of the adjusting plate.

8. The vapor deposition equipment as claimed in claim 1, wherein the planet carrier is provided with a wheel shaft for connecting all the central gears and the planet wheels, a limiting sleeve is sleeved at the lower end of the wheel shaft, a limiting groove is formed at the upper end of the wheel shaft, equal-height isolating rings are clamped in the limiting groove, and the central gears and the planet wheels are clamped between the equal-height isolating rings and the limiting sleeve.

9. The vapor deposition apparatus of claim 1, wherein the table top is connected to a heater, the base shaft is rotatably connected to the adjusting plate through a driving mechanism, a bellows is disposed outside the base shaft between the chamber and the adjusting plate, and two ends of the bellows are respectively connected to the bottom of the chamber and the adjusting plate.

10. The vapor deposition apparatus of claim 1, wherein the spin stand is peripherally provided with anti-slip threads.