CN115612419A - Thermosetting resin sheet and dicing die-bonding film - Google Patents

Thermosetting resin sheet and dicing die-bonding film Download PDF

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Publication number
CN115612419A
CN115612419A CN202210793685.4A CN202210793685A CN115612419A CN 115612419 A CN115612419 A CN 115612419A CN 202210793685 A CN202210793685 A CN 202210793685A CN 115612419 A CN115612419 A CN 115612419A
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die
mass
acrylic polymer
sheet
resin sheet
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大西谦司
木村雄大
高本尚英
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Nitto Denko Corp
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Nitto Denko Corp
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/32—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/068—Copolymers with monomers not covered by C09J133/06 containing glycidyl groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/006—Additives being defined by their surface area
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Dicing (AREA)

Abstract

A thermosetting resin sheet and a dicing die-bonding film are provided. Provided are a thermosetting resin sheet and a dicing die-bonding film and the like provided with the thermosetting resin sheet, wherein the thermosetting resin sheet contains a crosslinkable acrylic polymer having a crosslinkable group in a molecule that causes a crosslinking reaction by a thermosetting treatment, and the thermosetting resin sheet has a shear loss modulus G' at 140 ℃ before the thermosetting treatment of 1kPa or more and 20kPa or less and a tensile modulus at 150 ℃ after the thermosetting treatment at 150 ℃ for 1 hour of 0.5MPa or more and 7.0MPa or less.

Description

Thermosetting resin sheet and dicing die-bonding film
Technical Field
The present invention relates to a dicing die-bonding film used for manufacturing, for example, a semiconductor device, and a thermosetting resin sheet provided in the dicing die-bonding film.
Background
Conventionally, dicing die-bonding films used for manufacturing semiconductor devices have been known. Such a dicing die-bonding film includes, for example: the dicing tape and the die bonding sheet are laminated on the dicing tape and bonded to the wafer. The die bonding sheet is composed of a thermosetting resin sheet. The dicing tape has: a substrate layer, and an adhesive layer in contact with the die-bonding sheet. Such a dicing die-bonding film is used in the manufacture of a semiconductor device, for example, as follows.
A method of manufacturing a semiconductor device generally includes: the method includes a pre-process of forming a circuit surface on one surface of a wafer from a highly integrated electronic circuit, and a post-process of cutting out chips from the wafer on which the circuit surface is formed and assembling the chips.
The post-process includes, for example: a dicing step of forming a fragile portion for cutting the wafer into small chips (die) on the wafer; a mounting step of attaching a surface of the wafer opposite to the circuit surface to a die bonding sheet to fix the wafer to a dicing tape; an expanding step of cutting the wafer on which the fragile portion is formed together with the chip bonding sheet to expand the interval between the chips; a pick-up step of taking out the chip (die) with the chip bonding sheet attached thereon by peeling the chip bonding sheet and the adhesive layer; a die bonding step of bonding a die (die) having a die bonding sheet attached thereto to an adherend via the die bonding sheet; and a curing step of performing thermosetting treatment on the die bonding sheet bonded to the adherend. The semiconductor device is manufactured through these steps, for example.
In the above-described method for manufacturing a semiconductor device, for example, in the above-described pickup step, in order to improve the peelability when peeling the die bond sheet together with the chip, a dicing die bond film including a die bond sheet containing an epoxy resin and an adhesive layer containing a specific component is known (for example, patent document 1).
In detail, in the dicing die-bonding film described in patent document 1, the adhesive layer of the dicing tape contains the following polymer composed of the following compounds: an acrylic ester as a main monomer; a hydroxyl group-containing monomer in an amount of 10 to 30mol% relative to the acrylate; and an isocyanate compound having a radically reactive carbon-carbon double bond in an amount of 70 to 90mol% relative to the hydroxyl group-containing monomer, wherein the die-bonding film contains an epoxy resin.
With the dicing die-bonding film described in patent document 1, the die-bonding film can be easily peeled from the adhesive layer cured by ultraviolet irradiation, and the die can be satisfactorily picked up together with the die-bonding film.
Documents of the prior art
Patent literature
Patent document 1: japanese laid-open patent publication No. 2009-135377
Disclosure of Invention
Problems to be solved by the invention
However, for example, in the above-described die bonding step, when a die is bonded to an adherend via a die bonding sheet, there are cases where irregularities are present on the surface of the adherend. Therefore, the die bonding sheet is deformed to fit into the concave portion following the unevenness, and the surface of the adherend needs to be covered with the die bonding sheet so as not to form a gap.
In addition, for example, in the above-described curing step, the die bond sheet may warp by the thermosetting treatment, and the chip may warp. This is considered to be caused by the reason that the coefficients of linear expansion of the chip, the die bonding sheet (thermosetting resin sheet), and the adherend are different from each other. In particular, when the thickness of the adherend is relatively thin, the chip is likely to warp.
In order to prevent such a problem, it is considered to design a die bonding sheet so as to have good embeddability by following the irregularities of the surface of an adherend at the time of die bonding and to reduce warpage due to thermosetting treatment.
However, no sufficient studies have been made on a thermosetting resin sheet for a die bonding sheet which has good embeddability in die bonding and in which warpage accompanying a thermosetting process is suppressed, and a dicing die bonding film provided with the thermosetting resin sheet (die bonding sheet).
Accordingly, an object of the present invention is to provide a thermosetting resin sheet for a die bonding sheet which has good embedding properties at the time of die bonding and in which warpage accompanying thermosetting treatment is suppressed, and a dicing die bonding film provided with the thermosetting resin sheet.
Means for solving the problems
In order to solve the above problems, a thermosetting resin sheet according to the present invention is used as a die bonding sheet for bonding a die to an adherend by being disposed between the die obtained by cutting a wafer having a circuit surface formed thereon and the adherend in a method for manufacturing a semiconductor device,
the thermosetting resin sheet contains a crosslinkable acrylic polymer having a crosslinkable group in a molecule which causes a crosslinking reaction by a thermosetting treatment,
the shear loss modulus G' at 140 ℃ before the thermosetting treatment of the thermosetting resin sheet is 1kPa to 20kPa, and the tensile modulus at 150 ℃ after the thermosetting treatment at 150 ℃ for 1 hour is 0.5MPa to 7.0 MPa.
The dicing die-bonding film of the present invention comprises: the thermosetting resin sheet and the dicing tape bonded to the thermosetting resin sheet.
Drawings
Fig. 1 is a sectional view of the dicing die-bonding film according to the present embodiment cut in the thickness direction.
Fig. 2A is a sectional view schematically showing a state of a stealth dicing step in a method for manufacturing a semiconductor device.
Fig. 2B is a sectional view schematically showing a state of a stealth dicing step in the method for manufacturing a semiconductor device.
Fig. 2C is a sectional view schematically showing a state of an stealth dicing step in the method for manufacturing a semiconductor device.
Fig. 2D is a sectional view schematically showing a state of a back grinding step in the method for manufacturing a semiconductor device.
Fig. 3A is a sectional view schematically showing a state of a mounting process in a method of manufacturing a semiconductor device.
Fig. 3B is a sectional view schematically showing a state of a mounting process in the method for manufacturing a semiconductor device.
Fig. 4A is a sectional view schematically showing a state of an expanding process at a low temperature in the method for manufacturing a semiconductor device.
Fig. 4B is a sectional view schematically showing a state of an expanding process at a low temperature in the method for manufacturing a semiconductor device.
Fig. 4C is a sectional view schematically showing a state of an expanding process at a low temperature in the method for manufacturing a semiconductor device.
Fig. 5A is a sectional view schematically showing a state of an expanding process at normal temperature in the method for manufacturing a semiconductor device.
Fig. 5B is a sectional view schematically showing a state of an expanding process at normal temperature in the method for manufacturing a semiconductor device.
Fig. 6 is a sectional view schematically showing a state of a pickup step in the method of manufacturing a semiconductor device.
Fig. 7 is a sectional view schematically showing a state of a die bonding step in the method for manufacturing a semiconductor device.
Fig. 8 is a schematic view showing an example of a state of a void that can be generated when the die bonding sheet is bonded to an adherend.
Fig. 9 is a sectional view schematically showing a state of a wire bonding step in the method for manufacturing a semiconductor device.
Fig. 10 is a sectional view schematically showing a state of a sealing step in a method for manufacturing a semiconductor device.
Fig. 11 is a schematic cross-sectional view showing an example of a state in which a semiconductor chip and a die bond sheet are warped.
Description of the reference numerals
1: cutting the chip bonding film,
10: a thermosetting resin sheet (die-bonding sheet),
20: a cutting belt,
21: substrate layer, 22: an adhesive layer.
Detailed Description
Hereinafter, an embodiment of a thermosetting resin sheet (die bonding sheet) and a dicing die bonding film provided with the thermosetting resin sheet (die bonding sheet) according to the present invention will be described with reference to the drawings.
As shown in fig. 1, the dicing die-bonding film 1 of the present embodiment includes: a dicing tape 20, and a thermosetting resin sheet (die bonding sheet 10) laminated on the adhesive layer 22 of the dicing tape 20 and bonded to the semiconductor wafer. The thermosetting resin sheet (die bonding sheet 10) is bonded to an adherend such as a circuit board or a semiconductor chip in the manufacture of a semiconductor device.
It should be noted that the drawings in the drawings are schematic views and are not necessarily the same as the aspect ratio in the real object.
In the present embodiment, the thermosetting resin sheet is used for dicing the die-bonding sheet 10 of the die-bonding film 1. Therefore, the thermosetting resin sheet will be described in detail below with reference to the die bonding sheet 10.
< die bonding sheet (thermosetting resin sheet) for dicing die bonding film >
The die-bonding sheet 10 contains a crosslinkable acrylic polymer having a crosslinkable group in a molecule, which causes a crosslinking reaction by a heat curing treatment.
The shear loss modulus G 'of the die bonding sheet 10 is 1kPa or more and 20kPa or less under the temperature condition of 140 ℃ before the thermosetting treatment, and the tensile modulus G' of the die bonding sheet 10 is 0.5MPa or more and 7.0MPa or less under the temperature condition of 150 ℃ after the thermosetting treatment is performed for 1 hour at 150 ℃.
With the die bonding sheet 10 having the above configuration, the shear loss modulus G ″ at 140 ℃ before the heat curing treatment is 1kPa or more and 20kPa or less, and therefore, it can follow the unevenness of the adherend surface at the time of die bonding and can exhibit good embeddability. Further, the tensile modulus at 150 ℃ after the thermosetting treatment at 150 ℃ for 1 hour is 0.5MPa or more and 7.0MPa or less, and therefore warpage of the die bonding sheet 10 due to internal stress of the die bonding sheet 10 generated by the thermosetting treatment can be suppressed. Further, since the die-bonding sheet 10 contains a crosslinkable acrylic polymer having a low elastic modulus as a crosslinkable polymer, the cured die-bonding sheet 10 has a suitably low elastic modulus and can have flexibility. Therefore, it is considered that the above-described internal stress of the die bonding sheet 10 is relaxed, and the warpage of the die bonding sheet 10 that would be caused by the heat curing process can be suppressed.
As described above, the thermosetting resin sheet (die bonding sheet 10) and the dicing die bonding film 1 including the thermosetting resin sheet according to the present embodiment exhibit good embedding properties at the time of die bonding, and warpage due to thermosetting treatment is suppressed.
The crosslinkable acrylic polymer is a polymer compound obtained by polymerizing at least a (meth) acrylate monomer.
In the present specification, the expression "(meth) acrylic acid" represents at least one of methacrylic acid and acrylic acid, and the expression "(meth) acrylate" represents at least one of methacrylate (methacrylate) and acrylate (acrylate). The same applies to the term "(meth) acryl".
The crosslinkable acrylic polymer generally has the crosslinkable group in a side chain. The crosslinkable acrylic polymer may have the crosslinkable group at the end of the side chain. The crosslinkable acrylic polymer may have the crosslinkable group at least one of both ends of the main chain.
The crosslinkable group of the crosslinkable acrylic polymer in the molecule is not particularly limited as long as it is a functional group which causes a crosslinking reaction by a heat curing treatment.
Examples of the crosslinkable group include a low-active crosslinkable group having active hydrogen and a high-active crosslinkable group capable of reacting with active hydrogen.
Examples of the low-active crosslinkable group include a hydroxyl group and a carboxyl group. These crosslinkable groups can undergo a crosslinking reaction with an epoxy group or an isocyanate group. For example, the crosslinkable acrylic polymer having at least one of a hydroxyl group and a carboxyl group in a molecule can cause a crosslinking reaction with a compound having an epoxy group or an isocyanate group in a molecule (for example, an epoxy resin described later).
Examples of the highly reactive crosslinkable group include an epoxy group and an isocyanate group. These crosslinkable groups can undergo a crosslinking reaction with a hydroxyl group or a carboxyl group. For example, the crosslinkable acrylic polymer having at least one of an epoxy group and an isocyanate group in a molecule can cause a crosslinking reaction with a compound having at least one of a hydroxyl group and a carboxyl group in a molecule (for example, a phenol resin described later).
The content of the structural unit of the crosslinkable group-containing monomer in the crosslinkable acrylic polymer may be 0.5 mass% or more and 50.0 mass% or less, or 1 mass% or more and 40 mass% or less.
By setting the above ratio to 0.5 mass% or more, the crosslinking reaction at the time of heat curing of the die bonding sheet 10 can be more sufficiently advanced. On the other hand, by setting the above ratio to 50.0 mass% or less, the elastic modulus of the die bonding sheet 10 after the heat curing treatment can be further reduced, and thus the warpage of the die bonding sheet 10 accompanying the heat curing treatment can be further suppressed.
When the crosslinkable acrylic polymer has a hydroxyl group or a carboxyl group as a crosslinkable group in the molecule, the proportion of the crosslinkable group-containing structural unit in the crosslinkable acrylic polymer may be 1 mass% or more and 50 mass% or less.
When the crosslinkable acrylic polymer has an epoxy group as a crosslinkable group in a molecule, the proportion of the structural unit containing an epoxy group in the crosslinkable acrylic polymer may be 5% by mass or more and 50% by mass or less, or may be 7% by mass or more and 40% by mass or less.
The structural unit is a structure derived from each monomer after polymerization of a monomer (for example, 2-ethylhexyl acrylate, hydroxyethyl acrylate, or the like) used in obtaining a crosslinkable acrylic polymer. The same applies to the following.
When the crosslinkable acrylic polymer has an epoxy group as a crosslinkable group in a molecule, the crosslinkable acrylic polymer may have an epoxy equivalent of 1,300[ g/eq ] or more and 4,200[ g/eq ] or less, or may have an epoxy equivalent of 1,500[ g/eq ] or more and 2,500[ g/eq ] or less.
By making the epoxy equivalent of the crosslinkable acrylic polymer 1,300[ g/eq ] or more, the chip bonding sheet 10 after the heat curing treatment can have more excellent heat resistance. Further, by setting the epoxy equivalent of the crosslinkable acrylic polymer to 4,200[ g/eq ] or less, the warpage of the die bond sheet 10 accompanying the heat curing treatment can be further suppressed.
The epoxy equivalent of the above-mentioned crosslinkable acrylic polymer is determined by polymerization in accordance with JIS K7236:2001 (indicator titration/potentiometric titration).
The die-bonding sheet 10 of the present embodiment may contain 1 or more kinds of crosslinkable acrylic polymers.
At least 2 of the plurality of crosslinkable acrylic polymers undergo a crosslinking reaction with each other. That is, the crosslinkable group of one crosslinkable acrylic polymer and the crosslinkable group of the other crosslinkable acrylic polymer can be subjected to a crosslinking reaction with each other.
The different types of crosslinkable acrylic polymers each have, for example, a crosslinkable group that causes a crosslinking reaction with each other in the molecule. Specifically, the crosslinkable acrylic polymer having at least one of a hydroxyl group and a carboxyl group as a crosslinkable group in a molecule is different from the crosslinkable acrylic polymer having at least one of an epoxy group and an isocyanate group as a crosslinkable group in a molecule.
Alternatively, the crosslinkable acrylic polymers different in kind, for example, are different in kind of structural units of monomers contained in the molecule from each other. Specifically, the crosslinkable acrylic polymer having a hydroxyl group-containing (meth) acrylic monomer and an alkyl (meth) acrylate monomer as structural units in the molecule is different from the crosslinkable acrylic polymer having a carboxyl group-containing (meth) acrylic monomer and an alkyl (meth) acrylate monomer as structural units in the molecule.
The mass average molecular weight of at least 1 of the crosslinkable acrylic polymers may be 1 ten thousand or more and 40 ten thousand or less. The mass average molecular weight of at least 1 crosslinkable acrylic polymer may be 2 to 35 ten thousand, or 3 to 30 ten thousand. The mass average molecular weight is a value measured by GPC of the crosslinkable acrylic polymer.
By making the mass average molecular weight of the crosslinkable acrylic polymer 1 ten thousand or more, there is an advantage that the sheet shape of the die bonding sheet 10 can be more easily maintained. Further, by setting the mass average molecular weight of the crosslinkable acrylic polymer to 40 ten thousand or less, the die bonding sheet 10 can exhibit more excellent embeddability.
The above-mentioned mass average molecular weight is measured by Gel Permeation Chromatography (GPC). The measurement conditions were as follows.
Measurement apparatus name (apparatus example): product name '1200' made by Agilent "
A detector: differential Refractive Index (RI) detector
Column: connecting 3 columns in series
The product name "TSKgel SuperAWM-H/hyperAW 4000/hyperAW 2 500" (column diameter =6mm, column length =15 cm), manufactured by Tosoh corporation
Column temperature: 40 deg.C
Flow rate: 0.4mL/min
Injection amount: 40 μ L (eluent preparation solution with a sample concentration of 0.1% by mass)
Standard curve preparation standard substance: polystyrene
Data processing software: product name "Empower 3" manufactured by Waters corporation "
Eluent: addition of tetrahydrofuran (DMF) salt
Measurement of number average molecular weight (Mn), mass average molecular weight (Mw), molecular weight distribution (Mw/Mn), etc
The crosslinkable acrylic polymer can be synthesized, for example, by a usual polymerization method using a radical polymerization initiator.
As described above, the die bond sheet 10 of the present embodiment has a shear loss modulus G ″ of 1kPa or more and 20kPa or less at 140 ℃.
The shear loss modulus G' may be 1.2kPa or more, or may be 2.1kPa or more. The shear loss modulus G' may be 19.0kPa or less, or 18.0kPa or less.
By setting the shear loss modulus G ″ to 1kPa or more and 20kPa or less, the die-bonding sheet 10 can exhibit good embeddability (unevenness follow-up property on the surface of an adherend) at the time of die bonding as described above.
The shear loss modulus G ″ of the die-bonding sheet 10 before the heat curing treatment can be increased, for example, by further increasing the molecular weight of the crosslinkable acrylic polymer. On the other hand, the shear loss modulus G ″ can be reduced by further reducing the molecular weight of the crosslinkable acrylic polymer.
The shear loss modulus G ″ described above was measured under the following measurement conditions. Details of the measurement method are described in examples.
Measurement device: rheometer "Thermo SCIENTIFIC HAAKE MARS III"
Size of test sample: cylindrical with diameter of 8mm x thickness of 300 μm
Test temperature: 80-160 DEG C
Frequency: 1Hz
Temperature rise rate: 5 ℃/min
The number of measurements: 3 times (mean value)
As described above, the die bond sheet 10 of the present embodiment has a tensile modulus (tensile storage modulus E') at 150 ℃ of 0.5MPa to 7.0MPa after a heat curing treatment at 150 ℃ for 1 hour.
The tensile modulus may be 0.7MPa or more, or 1.1MPa or more. The tensile modulus may be 6.5MPa or less, or may be 4.2MPa or less.
Since the tensile modulus is 0.5MPa or more and 7.0MPa or less, warpage of the die bonding sheet 10 after the heat curing treatment can be suppressed.
The tensile modulus of the die-bonding sheet 10 can be increased by increasing the content ratio of the structural unit of the crosslinkable group-containing monomer constituting the crosslinkable acrylic polymer, for example. On the other hand, for example, the tensile modulus can be reduced by decreasing the content of the structural unit of the crosslinkable group-containing monomer constituting the crosslinkable acrylic polymer.
The tensile modulus was measured under the following measurement conditions. Details of the measurement method are described in examples.
A measuring device: solid viscoelasticity measuring apparatus
Size: initial length of 40mm and width of 10mm
Temperature rise rate: 10 ℃/min,
Measuring temperature: 150 ℃ in the temperature range of-30 to 280 DEG C
Distance between chucks: 22.5mm
Frequency: 1Hz,
The tensile storage modulus E' is defined as the tensile modulus.
The glass transition temperature Tg of the die bonding sheet 10 of the present embodiment may be 20 ℃ or higher and 100 ℃ or lower after heat curing treatment at 150 ℃ for 1 hour.
The glass transition temperature Tg may be 25 ℃ or higher or may be 31 ℃ or higher. The glass transition temperature Tg may be 95 ℃ or lower or may be 90 ℃ or lower.
When the glass transition temperature Tg is 20 ℃ or higher, there is an advantage that the adhesive strength of the chip bonding sheet 10 to an adherend is higher. Further, by setting the glass transition temperature Tg to 100 ℃ or lower, the occurrence of internal stress in the die bond sheet 10 by the thermosetting treatment can be further suppressed, and thus the warpage of the die bond sheet 10 accompanying the thermosetting treatment can be further suppressed.
The glass transition temperature Tg of the die-bonding sheet 10 can be increased by, for example, increasing the content ratio of the structural unit of the crosslinkable group-containing monomer constituting the crosslinkable acrylic polymer, or increasing the amount of the curing agent or the like to be compounded into the die-bonding sheet 10. On the other hand, for example, the glass transition temperature Tg can be lowered by reducing the content ratio of the structural unit of the crosslinkable group-containing monomer constituting the crosslinkable acrylic polymer, or reducing the amount of the curing agent or the like to be compounded to the die bonding sheet 10.
In the die bond sheet 10 of the present embodiment, tan δ at the glass transition temperature Tg measured as described above may be 0.7 or more and 1.5 or less.
Tan δ at the glass transition temperature Tg may be 0.75 or more, or may be 0.80 or more. Further, tan δ at the glass transition temperature Tg may be 1.40 or less, or may be 1.35 or less.
By setting Tan δ at 0.7 or more at the glass transition temperature Tg, the internal stress of the die bond sheet 10 that can be generated by the heat curing process can be further relaxed. Further, the heat resistance of the chip bonding sheet 10 is further improved by setting Tan δ at 1.5 or less at the glass transition temperature Tg.
The Tan δ at the glass transition temperature Tg of the die bond sheet 10 can be increased by, for example, increasing the content ratio of the structural unit of the crosslinkable group-containing monomer constituting the crosslinkable acrylic polymer, or increasing the amount of the curing agent or the like to be compounded into the die bond sheet 10. On the other hand, tan δ at the glass transition temperature Tg can be reduced by reducing the content ratio of the structural unit of the crosslinkable group-containing monomer constituting the crosslinkable acrylic polymer, or reducing the amount of the curing agent or the like to be compounded into the die bonding sheet 10.
The glass transition temperature Tg and Tan δ at the glass transition temperature Tg are calculated based on the storage modulus E' and loss modulus E ″ obtained when the tensile modulus is measured.
The storage modulus E 'and the loss modulus E ″ were measured while increasing the temperature, and Tan δ was calculated for each temperature by the calculation formula of Tan δ = E ″/E'. The higher Tan δ is, the higher the property indicating tackiness is.
The temperature at which Tan δ is maximum (the peak of a portion where Tan δ shows a peak shape) is set as the glass transition temperature Tg described above. Further, tan δ at the glass transition temperature Tg was read.
In the die bond sheet 10 of the present embodiment, the elongation at break at 0 ℃ may be 50% or less. The elongation at break may be 45% or less, or may be 40% or less. The elongation at break may be 2% or more.
The above elongation at break was measured under the following measurement conditions.
A measuring device: tensile testing machine
Size of test piece: width 10mm x length 40mm
Initial inter-chuck distance: 10mm
Temperature: 0 deg.C
Drawing speed: 300 mm/min
The crosslinkable acrylic polymer preferably contains a structural unit of the alkyl (meth) acrylate monomer at the largest mass ratio among the structural units in the molecule. Examples of the alkyl (meth) acrylate monomer include C2 to C18 alkyl (meth) acrylate monomers in which the number of carbon atoms in the alkyl (hydrocarbon) group is 2 to 18.
Examples of the alkyl (meth) acrylate monomer include a saturated linear alkyl (meth) acrylate monomer, a saturated branched alkyl (meth) acrylate monomer, and a saturated cyclic alkyl (meth) acrylate monomer.
Examples of the saturated linear alkyl (meth) acrylate monomer include ethyl (meth) acrylate, n-propyl (meth) acrylate, n-butyl (meth) acrylate, n-heptyl (meth) acrylate, n-octyl (meth) acrylate, n-nonyl (meth) acrylate, n-decyl (meth) acrylate, tridecyl (meth) acrylate, lauryl (meth) acrylate, myristyl (meth) acrylate, palmityl (meth) acrylate, and stearyl (meth) acrylate. The number of carbon atoms in the linear alkyl moiety is preferably 2 or more and 8 or less.
Examples of the saturated branched alkyl (meth) acrylate monomer include isoheptyl (meth) acrylate, isooctyl (meth) acrylate, isononyl (meth) acrylate, isodecyl (meth) acrylate, and 2-ethylhexyl (meth) acrylate. The alkyl moiety may have any of an iso (iso) structure, a secondary (sec) structure, a novel (neo) structure, or a tertiary (tert) structure.
The crosslinkable acrylic polymer contains a structural unit derived from a crosslinkable group-containing monomer copolymerizable with the alkyl (meth) acrylate monomer.
In the present embodiment, the crosslinkable acrylic polymer is an acrylic polymer obtained by copolymerizing at least an alkyl (meth) acrylate monomer and a crosslinkable group-containing monomer. In other words, the crosslinkable acrylic polymer has a structure in which a structural unit of an alkyl (meth) acrylate monomer and a structural unit of a crosslinkable group-containing monomer are randomly connected in this order.
Examples of the crosslinkable group-containing monomer include a carboxyl group-containing (meth) acrylic monomer, an acid anhydride (meth) acrylic monomer, a hydroxyl group-containing (hydroxy) (meth) acrylic monomer, an epoxy group-containing (glycidyl) (meth) acrylic monomer, an isocyanate group-containing (meth) acrylic monomer, a sulfonic acid group-containing (meth) acrylic monomer, a phosphoric acid group-containing (meth) acrylic monomer, and a functional group-containing monomer such as acrylamide and acrylonitrile. The crosslinkable group-containing monomer may have an ether group, an ester group or the like in a molecule.
The crosslinkable acrylic polymer is preferably:
a copolymer of at least 1 crosslinkable group-containing monomer selected from the group consisting of a carboxyl group-containing (meth) acrylic monomer, a hydroxyl group-containing (meth) acrylic monomer, an epoxy group-containing (meth) acrylic monomer, and an isocyanate group-containing (meth) acrylic monomer, and an alkyl (meth) acrylate (particularly, an alkyl (meth) acrylate having 8 or less carbon atoms in the alkyl moiety).
Examples of the carboxyl group-containing (meth) acrylic monomer include (meth) acrylic acid and a mono (2- (meth) acryloyloxyethyl) succinate monomer. The carboxyl group may be disposed at a terminal portion of the monomer structure, or may be bonded to a hydrocarbon other than the terminal portion.
Examples of the hydroxyl group-containing (meth) acrylic monomer include a hydroxyethyl (meth) acrylate monomer, a hydroxypropyl (meth) acrylate monomer, and a hydroxybutyl (meth) acrylate monomer. The hydroxyl group may be disposed at a terminal portion of the monomer structure, or may be bonded to a hydrocarbon other than the terminal portion.
Examples of the epoxy group-containing (meth) acrylic monomer include glycidyl (meth) acrylate monomers, 4-hydroxybutyl (meth) acrylate glycidyl ether, and the like. The epoxy group may be disposed at a terminal portion of the monomer structure, or may be bonded to a hydrocarbon other than the terminal portion.
Examples of the isocyanate group-containing (meth) acrylic monomer include 2-methacryloyloxyethyl isocyanate and the like.
In the present embodiment, the crosslinkable acrylic polymer contains an epoxy group as a crosslinkable group, and has a structural unit of glycidyl (meth) acrylate containing the epoxy group in a molecule, and the content ratio of the structural unit of glycidyl (meth) acrylate in the crosslinkable acrylic polymer is preferably 5% by mass or more and 50% by mass or less, and more preferably 7% by mass or more and 40% by mass or less.
The die-bonding sheet 10 may contain components other than the crosslinkable acrylic polymer described above. For example, the die-bonding sheet 10 may contain at least one of a thermosetting resin and a thermoplastic resin other than the crosslinkable acrylic polymer.
Examples of the thermosetting resin include epoxy resins, phenol resins, amino resins, unsaturated polyester resins, polyurethane resins, silicone resins, thermosetting polyimide resins, and the like. The thermosetting resin may be used alone in 1 kind or in 2 or more kinds.
Examples of the epoxy resin include bisphenol a type, bisphenol F type, bisphenol S type, brominated bisphenol a type, hydrogenated bisphenol a type, bisphenol AF type, biphenyl type, naphthalene type, fluorene type, phenol novolac type, o-cresol novolac type, trishydroxyphenylmethane type, tetraphenylethane type, hydantoin type, triglycidyl isocyanurate type, and glycidylamine type epoxy resins.
Phenolic resins can be used as curing agents for epoxy resins. Examples of the phenol resin include a novolak phenol resin, a resol phenol resin, and polyoxyethylene such as polyoxyethylene.
Examples of the novolak type phenol resin include a phenol novolak resin, a phenol aralkyl resin (biphenyl aralkyl type phenol resin, etc.), a cresol novolak resin, a tert-butylphenol novolak resin, a nonylphenol novolak resin, a phenol xylylene resin, and the like.
The phenolic resin may have a hydroxyl group equivalent [ g/eq ] of 90 to 220, for example.
The phenol resin is preferably a biphenyl aralkyl type phenol resin having a large hydroxyl group equivalent, because the elastic modulus of the die bond sheet 10 can be suitably lowered.
As the above phenol resin, only 1 kind or 2 or more kinds may be used.
In the present embodiment, the die-bonding sheet 10 may contain the above-described crosslinkable acrylic polymer and thermosetting resin which are crosslinked with each other. In addition, the die-bonding sheet 10 may contain a plurality of crosslinkable acrylic polymers that undergo a crosslinking reaction with each other.
Preferably, the die-bonding sheet 10 contains an epoxy group-containing acrylic polymer or an isocyanate group-containing acrylic polymer as a crosslinkable acrylic polymer and a phenol resin as a thermosetting resin. Thereby, the epoxy group or isocyanate group of the crosslinkable acrylic polymer and the hydroxyl group of the phenol resin are subjected to a crosslinking reaction, and the die bonding sheet 10 can be sufficiently cured.
More preferably, the die-bonding sheet 10 contains an epoxy group-containing acrylic polymer as a crosslinkable acrylic polymer and a phenol resin as a thermosetting resin. Thereby, the epoxy group of the crosslinkable acrylic polymer and the hydroxyl group of the phenol resin are subjected to a crosslinking reaction, and the die bonding sheet 10 can be sufficiently cured. In this case, the phenolic resin may have a hydroxyl equivalent weight of 160 or more and 250 or less.
In the die-bonding sheet 10, the hydroxyl group of the phenolic resin is preferably 0.5 equivalent or more and 2.0 equivalents or less, more preferably 0.7 equivalent or more and 1.5 equivalents or less, with respect to 1 equivalent of the epoxy group-containing acrylic polymer. This enables the crosslinking reaction between the epoxy group-containing acrylic polymer and the phenol resin to sufficiently proceed.
The die-bonding sheet 10 may contain a carboxyl group-containing acrylic polymer or a hydroxyl group-containing acrylic polymer as a crosslinkable acrylic polymer and an epoxy resin as a thermosetting resin. Thus, the carboxyl group or hydroxyl group of the crosslinkable acrylic polymer and the epoxy group of the epoxy resin are subjected to a crosslinking reaction, and the die bonding sheet 10 can be sufficiently cured.
When the die-bonding sheet 10 contains a thermosetting resin such as an epoxy resin or a phenol resin, the content of the thermosetting resin in the die-bonding sheet 10 is preferably 35% by mass or less, and more preferably less than 32% by mass. Thereby, the die-bonding sheet 10 after the heat curing process can have a lower elastic modulus. Therefore, the warpage of the die bond sheet 10 accompanying the thermosetting process can be further suppressed.
Examples of the thermoplastic resin other than the acrylic polymer having a crosslinkable functional group which can be contained in the die-bonding sheet 10 include polyamide resins such as natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, an ethylene-vinyl acetate copolymer, an ethylene-acrylic acid ester copolymer, a polybutadiene resin, a polycarbonate resin, a thermoplastic polyimide resin, a 6-polyamide resin, and a 6, 6-polyamide resin, phenoxy resins, acrylic resins having no crosslinkable functional group in the molecule, saturated polyester resins such as PET and PBT, polyamideimide resins, and fluororesins.
As the thermoplastic resin, only 1 kind or 2 or more kinds may be used.
The content ratio of the crosslinkable acrylic polymer is preferably 50 parts by mass or more and 100 parts by mass or less, more preferably 55 parts by mass or more, and still more preferably 60 parts by mass or more, in 100 parts by mass of the total mass of the die-bonding sheet 10.
In the die-bonding sheet 10, the content ratio of the crosslinkable acrylic polymer is preferably 50 parts by mass or more and 100 parts by mass or less, more preferably 60 parts by mass or more and 95 parts by mass or less, and still more preferably 64 parts by mass or more, with respect to 100 parts by mass of the organic components other than the filler (for example, the crosslinkable acrylic polymer, the thermosetting resin, the curing catalyst, and the like, the silane coupling agent, and the dye). The organic component is a component other than the filler. The elasticity and viscosity of the die bond sheet 10 can be adjusted by changing the content of the thermosetting resin in the die bond sheet 10.
On the other hand, the content of the thermosetting resin may be 40 parts by mass or less with respect to 100 parts by mass of the organic component.
The die bond sheet 10 may or may not contain a filler. By changing the amount of the filler in the die bond sheet 10, the elasticity and viscosity of the die bond sheet 10 can be more easily adjusted. Further, physical properties of the die bonding sheet 10 such as electrical conductivity, thermal conductivity, and elastic modulus can be adjusted.
Examples of the filler include inorganic fillers and organic fillers. As the filler, an inorganic filler is preferable.
Examples of the inorganic filler include fillers containing silica such as aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum nitride, boron nitride, crystalline silica, amorphous silica and the like. Examples of the material of the inorganic filler include simple metals such as aluminum, gold, silver, copper, and nickel, and alloys thereof. The filler may be aluminum borate whisker, amorphous carbon black, graphite, or the like. The filler may be in the form of a sphere, needle, or sheet. As the filler, can use the above-mentioned only 1 or more than 2.
The average particle diameter of the filler may be, for example, 5nm or more and 10 μm or less. The average particle diameter of the filler is preferably 5nm or more and 500nm or less, more preferably 5nm or more and 100nm or less. By setting the average particle diameter to 5nm or more, wettability and adhesiveness to an adherend such as a semiconductor wafer are further improved. By setting the average particle diameter to 500nm or less, the properties of the added filler can be more sufficiently exhibited, and the heat resistance of the die-bonding sheet 10 can be further exhibited. The average particle diameter of the filler can be determined, for example, by using a photometric particle size distribution meter (for example, product name "LA-910", HORIBA, ltd.).
The specific surface area of the filler may be 35m, for example 2 More than 400 m/g 2 The ratio of the carbon atoms to the carbon atoms is less than g. By setting the above specific surface area to 35m 2 At a ratio of/g or more, the number of-OH groups on the surface of the inorganic filler becomes large, and the crosslinking reaction by the thermal curing reaction is more likely to proceed. In addition, highly active crosslinkable groups such as epoxy groups are easily bonded to the surface of the inorganic filler. On the other hand, the specific surface area is set to 400m 2 And/g or less, whereby excessive bonding of a highly active crosslinkable group such as an epoxy group to the surface of the inorganic filler can be suppressed. Specific surface area of filler in accordance with JIS Z8830: 2013. calculated by the BET method. Specifically, the sample was placed in a measuring cell, and after 30 minutes of heating treatment at 200 ℃, cooling treatment with liquid nitrogen was performed. Further according to the accompanyingThe specific surface area was calculated from the amount of gas generated during nitrogen desorption in the heat treatment.
When the die-bonding sheet 10 contains a filler, the content of the filler may be 50 mass% or less, 40 mass% or less, or 30 mass% or less of the total mass of the die-bonding sheet 10. The content of the filler may be, for example, 10 mass% or more.
Preferably, the content of the silica filler as the inorganic filler in the die-bonding sheet 10 of the present embodiment is 40 mass% or less (may be 0 mass%), and the specific surface area of the silica filler is 35m 2 More than 400 m/g 2 The ratio of the carbon atoms to the carbon atoms is less than g.
The die bond sheet 10 may contain other components as desired. Examples of the other components include a curing catalyst, a flame retardant, a silane coupling agent, an ion scavenger, and a dye.
Examples of the flame retardant include antimony trioxide, antimony pentoxide, and brominated epoxy resins.
Examples of the silane coupling agent include β - (3, 4-epoxycyclohexyl) ethyltrimethoxysilane, γ -glycidoxypropyltrimethoxysilane, and γ -glycidoxypropylmethyldiethoxysilane.
Examples of the ion scavenger include hydrotalcites, bismuth hydroxide, and benzotriazole.
As the other additives, only 1 or 2 or more may be used.
The die-bonding sheet 10 preferably contains the crosslinkable acrylic polymer, the thermosetting resin, and the filler, in order to easily adjust elasticity and viscosity.
The thickness of the die bond sheet 10 is not particularly limited, and is, for example, 1 μm or more and 200 μm or less. The thickness may be 3 μm or more and 150 μm or less, or 5 μm or more and 100 μm or less. When the die bond sheet 10 is a laminate, the thickness is the total thickness of the laminate.
The chip bonding sheet 10 may have a single-layer structure, as shown in fig. 1, for example. In the present specification, a single layer means a layer having only the same composition. The state in which a plurality of layers formed of the same composition are stacked is also a single layer.
On the other hand, the die-bonding sheet 10 may have a multilayer structure in which layers of 2 or more different compositions are stacked, for example. When the die bonding sheet 10 has a multilayer structure, at least 1 layer constituting the die bonding sheet 10 contains the crosslinkable acrylic polymer described above, and may contain a thermosetting resin as necessary.
Next, an embodiment of dicing the die-bonding film according to the present invention will be described.
The dicing die-bonding film 1 of the present embodiment includes the die-bonding sheet 10 described above and a dicing tape 20 bonded to the die-bonding sheet 10.
In the dicing die-bonding film 1 of the present embodiment, the adhesive layer 22 is cured by irradiation with active energy rays (for example, ultraviolet rays) at the time of use. Specifically, in a state where a die bond sheet 10 having a semiconductor wafer bonded to one surface thereof and a pressure-sensitive adhesive layer 22 bonded to the other surface of the die bond sheet 10 are laminated, at least the pressure-sensitive adhesive layer 22 is irradiated with ultraviolet rays or the like. For example, ultraviolet rays or the like are irradiated from the side where the base material layer 21 is disposed, and the ultraviolet rays or the like passing through the base material layer 21 reach the pressure-sensitive adhesive layer 22. The adhesive layer 22 is cured by irradiation with ultraviolet rays or the like.
Since the adhesive force of adhesive layer 22 can be reduced by curing adhesive layer 22 after irradiation, die bond sheet 10 (in a state where a semiconductor wafer is bonded) can be relatively easily peeled off from adhesive layer 22 after irradiation.
< dicing tape for dicing die-bonding film >
The dicing tape 20 is usually a long sheet, and is stored in a wound state until use. The dicing die-bonding film 1 of the present embodiment is used by being bonded to an annular frame having an inner diameter one turn larger than that of a silicon wafer to be subjected to dicing.
The dicing tape 20 includes: a base material layer 21, and an adhesive layer 22 superposed on the base material layer 21.
The base layer 21 may have a single-layer structure or a laminated structure.
Each layer of the base layer 21 is, for example, a fibrous sheet such as a metal foil, paper, or cloth, a rubber sheet, or a resin film.
Examples of the fiber sheet constituting the base material layer 21 include paper, woven fabric, and nonwoven fabric.
Examples of the material of the resin film include polyolefins such as Polyethylene (PE), polypropylene (PP), and ethylene-propylene copolymers; ethylene copolymers such as ethylene-vinyl acetate copolymers (EVA), ionomer resins, ethylene- (meth) acrylic acid copolymers, and ethylene- (meth) acrylate (random, alternating) copolymers; polyesters such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polybutylene terephthalate (PBT); a polyacrylate; polyvinyl chloride (PVC); a polyurethane; a polycarbonate; polyphenylene Sulfide (PPS); polyamides such as aliphatic polyamides and wholly aromatic polyamides (aramid); polyetheretherketone (PEEK); a polyimide; a polyetherimide; polyvinylidene chloride; ABS (acrylonitrile-butadiene-styrene copolymer); cellulose or a cellulose derivative; a silicone-containing polymer; fluorine-containing polymers, and the like. These may be used alone in 1 kind or in combination of 2 or more kinds.
The base layer 21 is preferably made of a polymer material such as a resin film.
When the base layer 21 is a resin film, the resin film may be subjected to a stretching treatment or the like to control the deformability such as elongation.
The surface of the base material layer 21 may be subjected to a surface treatment in order to improve adhesion to the pressure-sensitive adhesive layer 22. As the surface treatment, for example, oxidation treatment based on a chemical method or a physical method such as chromic acid treatment, ozone exposure, flame exposure, high-voltage electric shock exposure, ionizing radiation treatment, or the like can be used. Further, coating treatment with a coating agent such as an anchor coating agent, a primer, or an adhesive may be performed.
The base layer 21 may be a single layer or may be composed of a plurality of layers (e.g., 3 layers). The thickness (total thickness) of the base material layer 21 may be 80 μm or more and 150 μm or less.
In order to impart releasability, the back side (side not overlapping the pressure-sensitive adhesive layer 22) of the base layer 21 may be subjected to a releasing treatment with a releasing agent (releasing agent) such as a silicone resin or a fluorine resin.
The base layer 21 is preferably a light-transmitting (ultraviolet-transmitting) resin film or the like, in view of being able to apply active energy rays such as ultraviolet rays to the pressure-sensitive adhesive layer 22 from the back side.
The dicing tape 20 may be provided with a release liner covering one surface of the pressure-sensitive adhesive layer 22 (the surface of the pressure-sensitive adhesive layer 22 that does not overlap with the base material layer 21) in a state before use. The release liner serves to protect the adhesive layer 22 and is peeled off before attaching the die-bonding sheet 10 to the adhesive layer 22.
As the release liner, for example, a plastic film or paper surface-treated with a release agent such as a silicone release agent, a long chain alkyl release agent, a fluorine release agent, or molybdenum sulfide can be used.
Note that a release liner may be used as a support material for supporting the adhesive layer 22. In particular, a release liner is suitably used when the pressure-sensitive adhesive layer 22 is superposed on the base layer 21. Specifically, the pressure-sensitive adhesive layer 22 can be superposed on the base material layer 21 by superposing the pressure-sensitive adhesive layer 22 on the base material layer 21 in a state in which the release liner and the pressure-sensitive adhesive layer 22 are laminated, and then releasing (transferring) the release liner.
In the present embodiment, the pressure-sensitive adhesive layer 22 contains, for example, an acrylic polymer compound, an isocyanate compound, and a polymerization initiator.
The adhesive layer 22 may have a thickness of 5 μm or more and 40 μm or less. The shape and size of the pressure-sensitive adhesive layer 22 are generally the same as those of the base material layer 21.
The acrylic polymer compound has at least: a structural unit of an alkyl (meth) acrylate, a structural unit of a hydroxyl group-containing (meth) acrylate, and a structural unit of a polymerizable group-containing (meth) acrylate. The structural unit is a unit constituting the main chain of the acrylic polymer compound. Each side chain in the above-mentioned acrylic polymer compound is contained in each structural unit constituting the main chain.
In the acrylic polymer compound contained in the pressure-sensitive adhesive layer 22, the above-mentioned structural unit may pass through 1 H-NMR、 13 NMR analysis such as C-NMR, thermal decomposition GC/MS analysis, infrared spectroscopy, and the like. The molar ratio of the above-mentioned structural unit in the acrylic polymer compound is usually calculated from the amount of the compound (charged amount) when the acrylic polymer compound is obtained by polymerization.
The structural unit of the above-mentioned alkyl (meth) acrylate is derived from an alkyl (meth) acrylate monomer. In other words, the molecular structure of the alkyl (meth) acrylate monomer after the polymerization reaction is the structural unit of the alkyl (meth) acrylate. The expression "alkyl group" means the carbon number of the hydrocarbon moiety ester-bonded to (meth) acrylic acid.
The hydrocarbon moiety of the alkyl moiety in the structural unit of the alkyl (meth) acrylate may be a saturated hydrocarbon or an unsaturated hydrocarbon. The carbon number of the hydrocarbon moiety may be 6 or more and 10 or less.
Examples of the structural unit of the alkyl (meth) acrylate include various structural units such as hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, n-nonyl (meth) acrylate, isononyl (meth) acrylate, and decyl (meth) acrylate.
The acrylic polymer compound has a structural unit containing a hydroxyl group (meth) acrylate, and the hydroxyl group of the structural unit is easily reacted with an isocyanate group.
By allowing the acrylic polymer compound having a structural unit containing a hydroxyl group-containing (meth) acrylate and the isocyanate compound to coexist in advance in the pressure-sensitive adhesive layer 22, the pressure-sensitive adhesive layer 22 can be appropriately cured. Therefore, the acrylic polymer compound can be sufficiently gelled. Therefore, the adhesive layer 22 can maintain the shape and exert the adhesive property.
The structural unit of the hydroxyl group-containing (meth) acrylate is preferably a structural unit of a hydroxyl group-containing C2-C4 alkyl (meth) acrylate. The expression "C2 to C4 alkyl group" indicates the number of carbons of a hydrocarbon moiety ester-bonded to (meth) acrylic acid. In other words, the hydroxyl group-containing C2 to C4 alkyl (meth) acrylic monomer is a monomer obtained by ester-bonding (meth) acrylic acid and an alcohol having 2 to 4 carbon atoms (usually 2-membered alcohol).
The hydrocarbon portion of the C2-C4 alkyl group is typically a saturated hydrocarbon. For example, the hydrocarbon moiety of the C2-C4 alkyl group is a straight-chain saturated hydrocarbon or a branched-chain saturated hydrocarbon. The hydrocarbon moiety of the C2 to C4 alkyl group preferably does not contain a polar group having oxygen (O), nitrogen (N), or the like.
Examples of the structural unit of the hydroxyl group-containing C2-C4 alkyl (meth) acrylate include structural units of hydroxybutyl (meth) acrylate such as hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, hydroxy-n-butyl (meth) acrylate, and hydroxyisobutyl (meth) acrylate. In the structural unit of hydroxybutyl (meth) acrylate, a hydroxyl group (-OH group) may be bonded to a carbon (C) at the end of the hydrocarbon moiety or to a carbon (C) other than the end of the hydrocarbon moiety.
The acrylic polymer compound contains a structural unit of a polymerizable group-containing (meth) acrylate having a polymerizable unsaturated double bond in a side chain.
The acrylic polymer compound contains a structural unit of a polymerizable group-containing (meth) acrylate, and the pressure-sensitive adhesive layer 22 can be cured by irradiation with an active energy ray (ultraviolet ray or the like) before the pickup step. Specifically, the photopolymerization initiator generates radicals by irradiation with active energy rays such as ultraviolet rays, and the acrylic polymer compounds can be crosslinked by the action of the radicals. This reduces the adhesive strength of the pressure-sensitive adhesive layer 22 before irradiation with radiation. Further, the die bond sheet 10 can be favorably peeled from the adhesive layer 22.
As the active energy ray, ultraviolet rays, radiation rays, and electron beams can be used.
The structural unit of the polymerizable group-containing (meth) acrylate may specifically have the following molecular structure: a molecular structure in which an isocyanate group of an isocyanate group-containing (meth) acrylic monomer is urethane-bonded to a hydroxyl group in the structural unit of the above-mentioned hydroxyl group-containing (meth) acrylate.
The structural unit of the polymerizable group-containing (meth) acrylate having a polymerizable group can be prepared after polymerization of the acrylic polymer compound. For example, the structural unit of the polymerizable group-containing (meth) acrylate may be obtained by copolymerizing an alkyl (meth) acrylate monomer and a hydroxyl group-containing (meth) acrylic monomer, and then subjecting a hydroxyl group in a part of the structural unit of the hydroxyl group-containing (meth) acrylate and an isocyanate group of an isocyanate group-containing polymerizable monomer to a urethanation reaction.
The isocyanate group-containing (meth) acrylic monomer described above preferably has 1 isocyanate group and 1 (meth) acryloyl group in the molecule. Examples of the monomer include 2-methacryloyloxyethyl isocyanate.
The adhesive layer 22 of the dicing tape 20 in this embodiment further contains an isocyanate compound. A part of the isocyanate compound may be in a state after reaction by a urethanization reaction or the like.
The isocyanate compound has a plurality of isocyanate groups in a molecule. By having a plurality of isocyanate groups in a molecule of the isocyanate compound, a crosslinking reaction between the acrylic polymer compounds in the pressure-sensitive adhesive layer 22 can be performed. Specifically, the crosslinking reaction by the isocyanate compound can be performed by reacting one isocyanate group of the isocyanate compound with a hydroxyl group of the acrylic polymer compound and reacting the other isocyanate group with a hydroxyl group of the other acrylic polymer compound.
Examples of the isocyanate compound include diisocyanates such as aliphatic diisocyanate, alicyclic diisocyanate, and araliphatic diisocyanate.
Further, examples of the isocyanate compound include polymeric polyisocyanates such as dimers and trimers of diisocyanates, and polymethylene polyphenylene polyisocyanates.
Examples of the isocyanate compound include polyisocyanates obtained by reacting an excess amount of the above isocyanate compound with an active hydrogen-containing compound. Examples of the active hydrogen-containing compound include an active hydrogen-containing low molecular weight compound and an active hydrogen-containing high molecular weight compound.
As the isocyanate compound, allophanate polyisocyanate, biuret polyisocyanate, or the like can be used.
The isocyanate compounds can be used alone in 1 or a combination of 2 or more.
As the above-mentioned isocyanate compound, a reaction product of an aromatic diisocyanate and an active hydrogen-containing low molecular weight compound is preferable. Since the reaction rate of the reaction product of the aromatic diisocyanate is relatively slow, the adhesive layer 22 containing the reaction product is suppressed from being excessively cured. The isocyanate compound preferably has 3 or more isocyanate groups in the molecule.
The polymerization initiator contained in the adhesive layer 22 is a compound capable of initiating a polymerization reaction by energy of applied heat or light. When the polymerization initiator is contained in the pressure-sensitive adhesive layer 22, the crosslinking reaction between the acrylic polymer compounds can be advanced when thermal energy or optical energy is applied to the pressure-sensitive adhesive layer 22. Specifically, the pressure-sensitive adhesive layer 22 can be cured by initiating a polymerization reaction between polymerizable groups of the acrylic polymer compounds having a structural unit of a polymerizable group-containing (meth) acrylate. This reduces the adhesive force of the adhesive layer 22, and the die bonding sheet 10 can be easily peeled from the cured adhesive layer 22 in the pickup step.
As the polymerization initiator, for example, a photopolymerization initiator, a thermal polymerization initiator, or the like can be used. As the polymerization initiator, a commercially available product can be used.
The adhesive layer 22 may contain other components than the above components. Examples of the other components include a tackifier, a plasticizer, a filler, an antioxidant, an ultraviolet absorber, a light stabilizer, a heat stabilizer, an antistatic agent, a surfactant, and a light releasing agent. The kind and amount of the other components may be appropriately selected depending on the purpose.
The dicing die-bonding film 1 of the present embodiment may have a release liner covering one surface of the die-bonding sheet 10 (the surface of the die-bonding sheet 10 not overlapping with the adhesive layer 22) in a state before use. The release liner is used to protect the die-bonding sheet 10 and is peeled off before an adherend (e.g., a semiconductor wafer) is attached to the die-bonding sheet 10.
The release liner may be used as a support material for supporting the die bond sheet 10. A release liner is suitably used in overlapping the die-bonding sheet 10 to the adhesive layer 22. Specifically, the die bond sheet 10 can be superimposed on the adhesive layer 22 by superimposing the die bond sheet 10 on the adhesive layer 22 with the release liner and the die bond sheet 10 stacked, and then peeling (transferring) the release liner after superimposing the release liner.
Next, a method for manufacturing the die-bonding sheet 10 and the dicing die-bonding film 1 according to the present embodiment will be described.
< method for producing dicing die-bonding film >
The method for manufacturing the dicing die-bonding film 1 of the present embodiment includes:
a step of manufacturing a chip bonding sheet 10;
a step of manufacturing a dicing tape 20; and
and a step of overlapping the manufactured die bond sheet 10 with the dicing tape 20.
< Process for producing die-bonding sheet (thermosetting resin sheet) >
The step of producing the die bond sheet 10 includes:
a resin composition preparation step of preparing a resin composition for forming the die bonding sheet 10; and
and a die bonding sheet forming step of forming the die bonding sheet 10 from the resin composition.
In the resin composition preparation step, for example, the crosslinkable acrylic polymer and any of the epoxy resin, the curing catalyst for the epoxy resin, the phenol resin, or the solvent are mixed and each resin is dissolved in the solvent to prepare the resin composition. The viscosity of the composition can be adjusted by changing the amount of the solvent. As these resins, commercially available products can be used.
In the die bond sheet forming step, for example, the resin composition prepared as described above is applied to a release liner. The coating method is not particularly limited, and for example, a general coating method such as roll coating, screen coating, gravure coating, or the like is used. Next, the applied composition is solidified by desolvation treatment, curing treatment, or the like as necessary, to form the die bonding sheet 10.
< Process for producing dicing tape >
The step of manufacturing the dicing tape includes:
a synthesis step for synthesizing an acrylic polymer compound;
a pressure-sensitive adhesive layer production step of producing a pressure-sensitive adhesive layer 22 by evaporating a solvent from a pressure-sensitive adhesive composition containing the acrylic polymer compound, the isocyanate compound, the polymerization initiator, the solvent, and other components added as appropriate according to the purpose;
a substrate layer manufacturing step of manufacturing the substrate layer 21; and
and a laminating step of laminating the adhesive layer 22 and the base layer 21 to laminate the base layer 21 and the adhesive layer 22.
In the synthesis step, for example, an acrylic polymer compound intermediate is synthesized by radical polymerization of a hydroxyl group-containing (meth) acrylic monomer and a C9 to C11 alkyl (meth) acrylate monomer having a hydrocarbon moiety with 9 to 11 carbon atoms.
The radical polymerization can be carried out by a conventional method. For example, the above-mentioned monomers can be dissolved in a solvent, stirred while being heated, and a polymerization initiator can be added to synthesize an intermediate of the acrylic polymer compound. In order to adjust the molecular weight of the acrylic polymer compound, the polymerization may be carried out in the presence of a chain transfer agent.
Next, a part of the hydroxyl groups of the structural unit of the hydroxyl group-containing (meth) acrylate contained in the acrylic polymer compound intermediate and the isocyanate groups of the isocyanate group-containing polymerizable monomer are bonded by a urethanization reaction. Thus, a part of the structural unit of the hydroxyl group-containing (meth) acrylate becomes the structural unit of the polymerizable group-containing (meth) acrylate.
The carbamation reaction can be carried out by a conventional method. For example, the acrylic polymer compound intermediate and the isocyanate group-containing polymerizable monomer are stirred in the presence of a solvent and a urethane-forming catalyst while heating. This allows urethane bonding between the isocyanate group of the isocyanate group-containing polymerizable monomer and a part of the hydroxyl group of the intermediate acrylic polymer compound.
In the pressure-sensitive adhesive layer producing step, for example, an acrylic polymer compound, an isocyanate compound, and a polymerization initiator are dissolved in a solvent to prepare a pressure-sensitive adhesive composition. The viscosity of the composition can be adjusted by changing the amount of the solvent. Next, the adhesive composition is applied to a release liner. As the coating method, for example, a general coating method such as roll coating, screen coating, gravure coating, or the like is used. The applied adhesive composition is solidified by subjecting the applied composition to a desolvation treatment, a solidification treatment, or the like, thereby producing the adhesive layer 22.
In the substrate layer production step, the substrate layer can be produced by forming a film by a usual method. Examples of the method for forming the film include a rolling film forming method, a casting method in an organic solvent, a inflation extrusion method in a closed system, a T-die extrusion method, and a dry lamination method. Coextrusion may also be used. As the base layer 21, a commercially available film or the like can be used.
In the laminating step, the pressure-sensitive adhesive layer 22 in a state of being superimposed on the release liner is superimposed on the base material layer 21 and laminated. The release liner may be in a state of being overlapped with the adhesive layer 22 until the time of use.
In order to promote the reaction between the crosslinking agent and the acrylic polymer compound and to promote the reaction between the crosslinking agent and the surface portion of the base material layer 21, a curing step may be performed at 50 ℃ for 48 hours after the laminating step.
Through these steps, the dicing tape 20 can be manufactured.
< step of superposing die bond sheet 10 and dicing tape 20 >
In the step of overlapping the die bond sheet 10 and the dicing tape 20, the die bond sheet 10 is attached to the adhesive layer 22 of the dicing tape 20 manufactured as described above.
In the above attachment, the release liner is peeled off from the pressure-sensitive adhesive layer 22 of the dicing tape 20 and the die-bonding sheet 10, respectively, and the die-bonding sheet 10 and the pressure-sensitive adhesive layer 22 are attached to each other so as to be in direct contact with each other. For example, the bonding may be performed by crimping. The temperature at the time of bonding is not particularly limited, and is, for example, 30 ℃ to 50 ℃, preferably 35 ℃ to 45 ℃. The linear pressure at the time of bonding is not particularly limited, but is preferably 0.1kgf/cm or more and 20kgf/cm or less, more preferably 1kgf/cm or more and 10kgf/cm or less.
Before the above-described attachment, the pressure-sensitive adhesive layer 22 of the dicing tape 20 may be irradiated with ultraviolet rays or the like to cure the pressure-sensitive adhesive layer 22 to some extent. This can suitably reduce the adhesive force of the adhesive layer 22 to improve the storage stability of the adhesive layer 22, and thus can improve the pickup property when the semiconductor chip is picked up.
The dicing die-bonding film 1 produced through the above-described steps is used as an auxiliary tool for manufacturing a semiconductor device (semiconductor integrated circuit), for example. The thermosetting resin sheet of the present embodiment is used as a die bonding sheet for bonding a die to an adherend by being disposed between the die obtained by cutting a wafer having a circuit surface formed thereon and the adherend in a method for manufacturing a semiconductor device. A specific example of the use of the dicing die-bonding film 1 will be described below.
< method of using dicing die-bonding film in manufacturing semiconductor device >
A method of manufacturing a semiconductor device generally includes a step of cutting out chips from a semiconductor wafer on which a circuit surface is formed and assembling the chips.
This step includes, for example: a stealth dicing step of forming a fragile portion in the semiconductor wafer to which the back grinding tape is attached by laser light and preparing the semiconductor wafer to be processed into chips (die) by a dicing process; a back grinding step of grinding the semiconductor wafer to which the back grinding tape is attached to reduce the thickness; a mounting step of attaching one surface (for example, a surface on the opposite side of the circuit surface) of the semiconductor wafer having a reduced thickness to the die bonding sheet 10, and fixing the semiconductor wafer to the dicing tape 20; and a spreading step of stretching the dicing tape 20 to cut the semiconductor wafer to produce chips (die) and to widen the intervals between the chips; a pickup step of peeling the die bond sheet 10 and the adhesive layer 22 to take out the semiconductor chip (die) in a state where the die bond sheet 10 is attached; a die bonding step of bonding a die bonding sheet 10 attached to a semiconductor chip (die) to an adherend; a curing step of curing the die bonding sheet 10 bonded to the adherend; a wire bonding step of electrically connecting an electrode of an electronic circuit in the semiconductor chip (die) to an adherend with a wire; and a sealing step of sealing the semiconductor chip (die) and the lead on the adherend with a thermosetting resin. In performing these steps, the dicing tape (dicing die-bonding film) of the present embodiment can be used as a manufacturing aid.
The Stealth Dicing step is a step in the so-called SDBG (Stealth Dicing Before polishing) process. In the stealth dicing step, as shown in fig. 2A to 2C, a fragile portion for cutting the semiconductor device into small pieces (die) is formed inside the semiconductor wafer W. Specifically, the back grinding tape G is attached to the circuit surface of the semiconductor wafer W (see fig. 2A). The grinding process (pre-back grinding process) by the grinding pad K is performed in a state where the back grinding tape G is attached until the semiconductor wafer W becomes a predetermined thickness (see fig. 2B). The semiconductor wafer W having a reduced thickness is irradiated with laser light, whereby a fragile portion is formed inside the semiconductor wafer W (see fig. 2C).
A half-dicing process may be performed instead of the stealth dicing process. The half-cut step is a step in a so-called DBG (Dicing Before Grinding) process.
In the half-cut step, in order to process a semiconductor wafer into chips (die) by a cleaving process, grooves are formed in the semiconductor wafer, and then the semiconductor wafer is ground to reduce its thickness.
Specifically, in the half-cut step, a half-cut process for cutting the semiconductor device into small pieces (die) is performed. More specifically, a wafer processing tape is attached to a surface of the semiconductor wafer opposite to the circuit surface. Further, the dicing ring is attached to the wafer processing tape. The dividing grooves are formed in a state where the wafer processing tape is attached. The back-grinding tape is attached to the surface having the grooves, and the wafer processing tape that has started to be attached is separated.
As described above, the die bond sheet and the Dicing die bond film according to the present embodiment are preferably used in the SDBG (straight Dicing form cutting) process or the DBG (straight Dicing form cutting) process for manufacturing a semiconductor chip by Dicing a semiconductor wafer.
In the back-grinding step, as shown in fig. 2D, the semiconductor wafer W with the back-grinding tape G attached thereto is further subjected to grinding processing to reduce the thickness of the semiconductor wafer W to the thickness of the chips (die) produced by subsequent cleaving.
In the mounting step, as shown in fig. 3A to 3B, the semiconductor wafer W is fixed to the dicing tape 20. Specifically, the dicing ring R is attached to the adhesive layer 22 of the dicing tape 20, and the semiconductor wafer W reduced in thickness by the cutting process as described above is attached to the exposed surface of the die bond sheet 10 (see fig. 3A). Next, the back-grinding tape G is peeled off from the semiconductor wafer W (see fig. 3B).
In the expanding step, as shown in fig. 4A to 4C, the interval between the semiconductor chips (die) X produced by the cleaving is expanded. Specifically, the dicing ring R is attached to the adhesive layer 22 of the dicing tape 20, and then fixed to the holder H of the expanding device (see fig. 4A). The cut die-bonding film 1 is stretched to be spread in the planar direction by lifting up a lifting member U provided in the spreading device from the lower side of the cut die-bonding film 1 (see fig. 4B). Thereby, the semiconductor wafer W and the die bond sheet 10 are cut under a specific temperature condition. The temperature condition is, for example, -20 ℃ or higher and 0 ℃ or lower, preferably, -15 ℃ or higher and 0 ℃ or lower, and more preferably, -10 ℃ or higher and-5 ℃ or lower. The expansion state is released by lowering the jack-up member U (refer to fig. 4C, which is a low-temperature expansion process up to now).
Further, in the expanding step, as shown in fig. 5A to 5B, the dicing tape 20 is stretched under a higher temperature condition (for example, 10 to 25 ℃) to expand the area. Thereby, the adjacent semiconductor chips X after the dicing are separated in the surface direction of the film surface, and the cuts (gaps) are further enlarged (normal temperature expanding step).
In the pickup step, as shown in fig. 6, the semiconductor chip X with the die 10' of the die bond sheet attached thereto is peeled from the adhesive layer 22 of the dicing tape 20. Specifically, the pin member P is raised to lift the semiconductor chip X to be picked up via the dicing tape 20. The semiconductor chip X and the small chip 10' of the chip bonding sheet lifted up are held by the suction jig J.
In the die bonding step, as shown in fig. 7, the semiconductor chip X in a state in which the chip bonding sheet-attached small piece 10' is attached is bonded to the adherend Z. In the die bonding step, as shown in fig. 9, for example, a semiconductor chip X in a state where a chip bonding sheet-attached small piece 10' is attached may be stacked plural times. In the case of manufacturing a chip-embedded semiconductor device (FOD semiconductor device), the Die bonding pad 10 may be used to embed a semiconductor chip.
In this case, the small piece 10' of the chip bonding sheet used for embedding the semiconductor chip is bonded to the uneven adherend surface. When the small piece 10 'of the chip bonding sheet is bonded to the concave-convex surface, the small piece 10' of the chip bonding sheet needs to be deformed in order to fill the concave portion. That is, the chip 10' of the chip bonding sheet needs to follow the uneven shape. If the following ability is low, a gap (clearance) V is generated as shown in fig. 8, for example.
Since the chip bonding sheet 10 of the present embodiment has good embeddability, the occurrence of such a gap V can be suppressed.
In the curing step, in order to increase the reactivity of the crosslinkable group (for example, epoxy group) in the crosslinkable acrylic polymer contained in the chip bonding sheet piece 10', and to cure the chip bonding sheet piece 10', for example, heat treatment is performed at a temperature of 80 ℃ to 175 ℃.
In the wire bonding step, as shown in fig. 9, the semiconductor chip X (die) and the adherend Z are heated and connected by the wire L. Therefore, the crosslinkable group in the crosslinkable acrylic polymer contained in the small piece 10 'of the die bond sheet is reactively reacted by heating, and the curing reaction of the small piece 10' of the die bond sheet can proceed.
In the wire bonding step, a compressive force may be applied to die bonding sheet 10 in the thickness direction.
In the sealing step, as shown in fig. 10, the semiconductor chip X (die) and the die 10' of the die bonding sheet are sealed with a thermosetting resin M such as an epoxy resin. In the sealing step, the thermosetting resin M is subjected to a heat treatment at a temperature of, for example, 150 to 200 ℃.
In recent years, in the semiconductor industry, with further progress in integration technology, there are strong demands for thinner semiconductor chips (for example, a thickness of 20 μm or more and 50 μm or less) and thinner die bonding sheets (for example, a thickness of 1 μm or more and 40 μm or less, preferably 7 μm or less, and more preferably 5 μm or less). In addition, a thinner adherend is strongly desired.
An electronic circuit is formed on one surface of such a thin semiconductor chip. When an electronic circuit is formed on one surface of a thin semiconductor chip, the semiconductor chip is not resistant to internal stress, and as shown in fig. 11, the semiconductor chip is slightly deformed (warped, etc.), and the small piece 10 ″ of the die bonding sheet is also deformed (warped, etc.) in accordance with the deformation.
If the die bond sheet is stacked in a plurality of times as described above in a state where the die bond sheet is attached to such a semiconductor chip, so-called floating may occur due to poor attachment of the die bond sheet to the chip (die).
As described above, the die bond sheet is also warped due to the internal stress of the die bond sheet caused by the heat curing process. Therefore, the thinner the adherend and the semiconductor chip bonded to the die bonding sheet, the more likely the adherend and the semiconductor chip are warped.
The die bonding sheet 10 of the present embodiment has specific physical properties, and therefore can suppress the floating as described above, and can suppress the phenomenon of warping of the adherend and the semiconductor chip.
The thermosetting resin sheet (die bonding sheet) and the dicing die bonding film according to the present embodiment are exemplified as above, but the present invention is not limited to the die bonding sheet and the dicing die bonding film exemplified above.
That is, various forms used in a general die bonding sheet or a dicing die bonding film can be adopted within a range not to impair the effects of the present invention.
The matters disclosed in the present specification include the following.
(1)
A chip bonding sheet (heat-curable resin sheet) comprising a crosslinkable acrylic polymer having in the molecule thereof a crosslinkable group that causes a crosslinking reaction by a heat-curing treatment,
the chip bonding sheet has a shear loss modulus G' of 1kPa or more and 20kPa or less at 140 ℃ before a thermosetting treatment, and a tensile modulus of 0.5MPa or more and 7.0MPa or less at 150 ℃ after a thermosetting treatment is performed for 1 hour at 150 ℃.
(2)
The die-bonding sheet (thermosetting resin sheet) according to the item (1), wherein the content ratio of the crosslinkable acrylic polymer is 50 parts by mass or more and 100 parts by mass or less with respect to 100 parts by mass of the organic component contained in the die-bonding sheet.
(3)
The die-bonding sheet (thermosetting resin sheet) according to the above (1) or (2), which has a glass transition temperature Tg of 20 ℃ or more and 100 ℃ or less after a heat curing treatment at 150 ℃ for 1 hour, and has a Tan δ of 0.7 or more and 1.5 or less at the glass transition temperature Tg.
(4)
The die-bonding sheet (thermosetting resin sheet) according to any one of the above (1) to (3), wherein the crosslinkable group comprises an epoxy group,
the crosslinkable acrylic polymer has a structural unit of glycidyl (meth) acrylate containing the epoxy group in the molecule,
the content of the structural unit in the crosslinkable acrylic polymer is 5% by mass or more and 50% by mass or less.
(5)
The die-bonding sheet (thermosetting resin sheet) according to any one of the above (1) to (4), wherein the content of the silica filler as the inorganic filler is 40% by mass or less,
the specific surface area of the silica filler is 35m 2 More than g and 400m 2 The ratio of the carbon atoms to the carbon atoms is less than g.
(6)
The die-bonding sheet (thermosetting resin sheet) according to any one of the above (1) to (5), comprising a phenolic resin that undergoes a crosslinking reaction with the crosslinkable group by the thermosetting treatment,
the phenolic resin has a hydroxyl equivalent weight of 160 or more.
(7)
The die-bonding sheet (thermosetting resin sheet) according to any one of the above (1) to (6), which comprises 1 or more kinds of crosslinkable acrylic polymers, wherein at least 1 kind of crosslinkable acrylic polymer has a mass average molecular weight of 1 to 40 ten thousand.
(8)
The die-bonding sheet (thermosetting resin sheet) according to any one of the above (1) to (7), which is used by being bonded to a dicing tape.
(9)
The die-bonding sheet (thermosetting resin sheet) according to any one of the above (1) to (8), wherein the elongation at break at 0 ℃ is 50% or less.
(10)
The die-bonding sheet (thermosetting resin sheet) according to any one of the above (1) to (9), which is used in an SDBG (step Dicing Before Grinding) process or a DBG (Dicing Before Grinding) process for manufacturing a semiconductor chip by cutting a semiconductor wafer.
(11)
The die-bonding sheet (heat-curable resin sheet) according to any one of the above (1) to (10), which comprises at least one of an epoxy group-containing acrylic polymer and an isocyanate group-containing acrylic polymer as the crosslinkable acrylic polymer.
(12)
The die-bonding sheet (thermosetting resin sheet) according to item (11) above, further comprising at least one of a phenol resin as a thermosetting resin and a silica filler as an inorganic filler.
(13)
The die-bonding sheet (heat-curable resin sheet) according to any one of the above (1) to (11), wherein at least one of an epoxy group-containing acrylic polymer and an isocyanate group-containing acrylic polymer and at least one of a hydroxyl group-containing acrylic polymer and a carboxyl group-containing acrylic polymer are contained as the crosslinkable acrylic polymer.
(14)
A dicing die-bonding film comprising: the die bond sheet according to any one of (1) to (13) above, and a dicing tape attached to the die bond sheet.
[ examples ]
The present invention will be described in more detail with reference to the following examples, but the present invention is not limited thereto.
The die bond pad is manufactured as follows. Further, the die bond sheet is bonded to a dicing tape to produce a dicing die bond film.
< preparation of dicing tape >
The following raw materials were put into a reaction vessel equipped with a cooling tube, a nitrogen gas inlet tube, a thermometer, and a stirring device. The polymerization was carried out at 60 ℃ for 10 hours in a nitrogen stream to obtain an acrylic polymer compound A.
2-ethylhexyl acrylate (2 EHA): 100 parts by mass,
26 parts by mass of 2-hydroxyethyl acrylate (HEA),
Benzoyl peroxide: 0.4 part by mass,
Toluene: 80 parts by mass,
To the liquid containing the acrylic polymer compound a obtained by polymerization as described above, 1.2 parts by mass of 2-methacryloyloxyethyl isocyanate (hereinafter also referred to as MOI) was added. Thereafter, the resulting mixture was subjected to an addition reaction treatment at 50 ℃ for 60 hours in an air stream to obtain an acrylic polymer compound A'.
Next, the following compounding ingredients were added to 100 parts of the acrylic polymer compound a' to prepare a pressure-sensitive adhesive solution.
Polyisocyanate compound: 1.6 parts by mass
(product name "CORONATE L", nippon Polyurethane Industry Co., ltd.)
Photopolymerization initiator: 3 parts by mass
(product name "Irgacure 184", manufactured by Ciba Specialty Chemicals Inc.)
The adhesive solution prepared as described above was applied to the treated surface of the silicone-treated PET release liner, and heat-dried at 120 ℃ for 2 minutes to form an adhesive layer having a thickness of 10 μm.
Subsequently, the adhesive layer was bonded to a substrate layer (EVA film (115 μm thick) manufactured by Gunze Limited) and stored at 23 ℃ for 72 hours to produce a dicing tape.
< production of die-bonding sheet (thermosetting resin sheet) >
(example 1)
The epoxy group-containing acrylic polymer (mass average molecular weight Mw =13 ten thousand) was obtained by polymerization in the following monomer composition.
Glycidyl Methacrylate (GMA): 32% by mass
Ethyl Acrylate (EA): 32% by mass
Butyl Methacrylate (BMA): 36% by mass
The following were mixed with 100 parts by mass of an epoxy group-containing acrylic polymer obtained by polymerization in the above composition:
phenol resin: 11 parts by mass (hydroxyl equivalent 203, [ g/eq ])
(product name "MEHC-7851H" Minghe Kaisha Biphenyl aralkyl type phenol resin),
Silica filler: 23 parts by mass (specific surface area 200. Sup., [ m ] 2 /g])
(product name "MEK-ST-40" daily chemical)
And methyl ethyl ketone, and an adhesive composition solution was prepared so that the solid content concentration became 20 mass%.
The prepared adhesive composition solution was applied to a release-treated film made of a polyethylene terephthalate film having a thickness of 50 μm subjected to a silicone release treatment as a release liner (separator). Thereafter, a drying treatment was performed at 130 ℃ for 2 minutes to prepare a die bonding sheet having a thickness (average thickness) of 20 μm.
(example 2)
The epoxy group-containing acrylic polymer (mass average molecular weight Mw =4 ten thousand) was obtained by polymerization in the following monomer composition.
Glycidyl Methacrylate (GMA): 40% by mass
Ethyl Acrylate (EA): 28% by mass
Butyl Methacrylate (BMA): 32% by mass
The following are mixed with respect to 100 parts by mass of an epoxy group-containing acrylic polymer obtained by polymerization in the above composition:
silica filler: 42 parts by mass (specific surface area of 200[ m ]) 2 /g])
(product name "MEK-ST-40" manufactured by Nissan chemical Co., ltd.)
And methyl ethyl ketone, and an adhesive composition solution was prepared so that the solid content concentration became 20 mass%.
Further, a die bond sheet having a thickness (average thickness) of 20 μm was prepared from the adhesive composition solution by the same method as described above.
(example 3)
The epoxy group-containing acrylic polymer (mass average molecular weight Mw =32 ten thousand) was obtained by polymerization with the following monomer composition.
Glycidyl Methacrylate (GMA): 7% by mass
Ethyl Acrylate (EA): 48% by mass
Butyl Methacrylate (BMA): 45% by mass
The following are mixed with respect to 100 parts by mass of an epoxy group-containing acrylic polymer obtained by polymerization in the above composition:
phenol resin: 55 parts by mass (hydroxyl equivalent 173[ 2 ], [ g/eq ])
(product name "MEHC-7800H" phenol xylylene resin manufactured by Michelson chemical Co., ltd.)
Silica filler: 42 parts by mass (specific surface area 60[ m ]) 2 /g])
(product name "MEK-AC-4130Y" manufactured by Nissan chemical Co., ltd.)
And methyl ethyl ketone, and an adhesive composition solution was prepared so that the solid content concentration became 20 mass%.
Further, a die bond sheet having a thickness (average thickness) of 20 μm was prepared from the adhesive composition solution by the same method as described above.
(example 4)
The epoxy group-containing acrylic polymer (mass average molecular weight Mw =32 ten thousand) was obtained by polymerization with the following monomer composition.
Glycidyl Methacrylate (GMA): 7% by mass
Ethyl Acrylate (EA): 48% by mass
Butyl Methacrylate (BMA): 45% by mass
The carboxyl group-containing acrylic polymer (mass average molecular weight Mw =3 ten thousand) was obtained by polymerization in the following monomer composition.
Acrylic Acid (AA): 1% by mass
Butyl Acrylate (BA): 32% by mass
Ethyl Acrylate (EA): 23% by mass
Methyl Methacrylate (MMA): 44% by mass
The following were mixed with 100 parts by mass of an epoxy group-containing acrylic polymer obtained by polymerization in the above composition:
carboxyl group-containing acrylic polymer obtained by polymerization with the above composition: 64 parts by mass,
And methyl ethyl ketone, and an adhesive composition solution was prepared so that the solid content concentration became 20 mass%.
Further, a die bond sheet having a thickness (average thickness) of 20 μm was prepared from the adhesive composition solution by the same method as described above.
Comparative example 1
The following were mixed with methyl ethyl ketone:
acrylic resin: 100 parts by mass (OH group-containing, mass-average molecular weight Mw =45 ten thousand)
(product name "W248" manufactured by Utility Co., ltd.)
Phenol resin: 77 parts by mass (hydroxyl equivalent 105[ 2 ], [ g/eq ])
(product name "MEHC-7500" manufactured by MINGHE CHEMIZATION CHEMICAL CO., LTD.)
Epoxy resin: 83 parts by mass
(product name "EPPN501HY" manufactured by Nippon Kagaku Co., ltd.)
Silica filler: 222 parts by mass (in terms of solid content) (specific surface area of 34[ m ] 2 /g])
(product name "MEK-AC-5140Z" manufactured by Nissan chemical Co., ltd.),
an adhesive composition solution was prepared so that the solid content concentration became 20 mass%.
Further, a die bond sheet having a thickness (average thickness) of 20 μm was prepared from the adhesive composition solution by the same method as described above.
Comparative example 2
The following were mixed with methyl ethyl ketone:
acrylic resin: 100 parts by mass (OH group-containing, mass-average molecular weight Mw =45 ten thousand)
(product name "W248" manufactured by Utility Co., ltd.)
Phenol resin: 279 parts by mass (hydroxyl equivalent 105[ g/eq ])
(product name "MEHC-7500" manufactured by MINGHE CHEMICAL CO., LTD.)
Epoxy resin: 287 parts by mass
(product name "EPPN501HY" manufactured by Nippon Kagaku Co., ltd.)
Silica filler: 470 parts by mass (in terms of solid content) (specific surface area 5[ m ] 2 /g])
(product name "SO-25R" ADMATECHS CO., manufactured by LTD.),
an adhesive composition solution was prepared so that the solid content concentration became 20 mass%.
Further, a die bond sheet having a thickness (average thickness) of 20 μm was prepared from the adhesive composition solution by the same method as described above.
< production of dicing die-bonding film >
The die-bonding sheets of each example and each comparative example were bonded to the adhesive layer of the dicing tape using a hand pressure roller, and a dicing die-bonding film was produced.
< measurement of physical Properties of die-bonding sheet >
The properties of the die-bonding sheets of examples and comparative examples were measured as follows.
(shear loss modulus G')
The details of the method for measuring the shear loss modulus G' are as follows. A viscoelasticity measuring apparatus (model ARES, manufactured by Rheometric Scientific Co., ltd.) was used as the measuring apparatus. The resulting material was punched into a cylindrical shape having a diameter of 7.5mm × a thickness of 1mm to prepare a test piece of a die bond. The shear vibration transmitted to one circular surface of the test piece at a temperature of 140 ℃ to the other circular surface when the shear vibration having a frequency of 1Hz was applied was measured. The measured value was analyzed to determine the shear loss modulus G ″. The measurement results are shown in table 1.
(measurement of tensile modulus at 150 ℃, glass transition temperature Tg, tan. Delta. At Tg)
After the die bond sheet was subjected to a curing treatment at 150 ℃ for 1 hour, the tensile storage modulus at 150 ℃ of the die bond sheet was measured. As the measuring apparatus, a solid viscoelasticity measuring apparatus (model RSAIII, manufactured by Rheometric Scientific Co., ltd.) was used.
A test piece having a length of 40mm (measurement length) and a width of 10mm was cut out, and the tensile storage modulus E 'and the tensile loss modulus E' of the test piece were measured in a temperature range of-30 to 280 ℃ under the conditions of a frequency of 1Hz, a temperature rise rate of 10 ℃/min and a distance between chucks of 22.5 mm. Further, tan.delta. (E "/E') based on these elastic moduli was measured. Further, the temperature at which Tan δ reaches a peak is read.
(elongation at Break)
A test piece (width 10 mm. Times. Length 40 mm) of the chip bonding piece was cut out. A tensile test was carried out using a tensile tester (trade name "Autograph AGS-50NX", manufactured by Shimadzu corporation), and the elongation at break of the test piece stretched at a predetermined tensile rate was measured. The initial distance between chucks was 10mm, the temperature condition was 0 ℃, and the stretching speed was set to 300 mm/min. The measurement results are shown in table 1.
Table 1 shows the composition and physical properties of the die bond sheets in each example and each comparative example.
[ Table 1]
Figure BDA0003731333280000421
The properties of the die-bonding sheet (dicing die-bonding film) manufactured as described above were evaluated as follows.
(embeddability of die-bonding sheet into concave portion of adherend surface)
A10 mm by 10mm mirror-surface Die-bonded piece-attached BGA substrate having a surface with 10 μm irregularities was bonded by a Die Bonder (Die Bonder) (product name "Die Bonder SPA-300", manufactured by Kagaku K.K.) under conditions of a table temperature of 140 ℃, a Die bonding load of 0.2MPa, and a Die bonding time of 2 seconds.
The gap between the chip bonding sheet and the substrate (adherend) was observed using an ultrasonic tomography apparatus (Hitachi Power Solutions co., ltd. System, "FS200 II"). The area occupied by the voids in the observed image was calculated using binarization software (winrofof ver.5.6). When the area occupied by the voids was less than 10% of the surface area of the die-bonding film, the film was evaluated as "good" (and when the area occupied by the voids was 10% or more, the film was evaluated as "poor").
(amount of warpage of die bonding sheet after thermal curing treatment)
A10 mm × 10mm mirror-surface Die with a Die bonding sheet (9 dies) was bonded to a BGA substrate having a size of 50mm × 50mm and a thickness of 160 μm at a stage temperature of 140 ℃ under a Die bonding load of 0.2MPa and a Die bonding time of 2 seconds, so that the interval between the adjacent dies was uniform, using a Die Bonder (product name "Die Bonder SPA-300" manufactured by Kaisha, N.K.).
The substrate (adherend) after heat treatment at 150 ℃ for 1 hour was placed on a flat plate, and the longest distance of the substrate (adherend) from the flat plate was measured. A case with a very good evaluation result was judged as "excellent", a case with good evaluation was judged as "good", and a case with poor evaluation was judged as "poor".
From the above evaluation results, it can be grasped that: the dicing die-bonding film including the die-bonding sheet of the embodiment is more excellent in the embedding property of the die-bonding sheet at the time of die bonding than the dicing die-bonding film of the comparative example. In addition, the amount of warpage of the die bond sheet accompanying the heat curing process can be suppressed.
The die-bonding sheets of the examples contain a crosslinkable acrylic polymer, and have a shear loss modulus G' at 140 ℃ before heat curing of 1kPa to 20kPa, and a tensile modulus at 150 ℃ after heat curing of 1 hour at 150 ℃ of 0.5MPa to 7.0 MPa.
By using the die bond sheet (dicing die bond film) of the embodiment having such physical properties in the manufacture of a semiconductor device, for example, a so-called NAND flash memory or the like can be manufactured efficiently.
Specifically, in each of the examples used for embedding the semiconductor chip, the shear loss modulus G ″ of the die bond sheet is within a specific range, and therefore, when the die bond sheet is adhered to an adherend surface having irregularities, the die bond sheet can be appropriately deformed so as to be embedded in the recesses and follow the irregularities. This can suppress the occurrence of a gap between the adherend and the die bonding sheet.
In addition, in a thin semiconductor chip having an electronic circuit formed on one surface thereof, deformation (warpage or the like) occurs due to internal stress in accordance with the curing process of the die bond sheet. In contrast, the tensile modulus after the heat curing treatment of the die bonding sheet of the example is within a specific range, and therefore, such deformation of the semiconductor chip can be suppressed.
Industrial applicability
The thermosetting resin sheet (die bonding sheet) and the dicing die bonding film of the present invention are suitably used as an auxiliary tool in manufacturing a semiconductor device, for example.

Claims (11)

1. A thermosetting resin sheet used as a die-bonding sheet for bonding a die to an adherend by being disposed between the die obtained by cutting a wafer having a circuit surface formed thereon and the adherend in a method for manufacturing a semiconductor device,
the heat-curable resin sheet contains a crosslinkable acrylic polymer having a crosslinkable group in a molecule thereof, which causes a crosslinking reaction by a heat-curing treatment,
the shear loss modulus G' at 140 ℃ before the thermosetting treatment of the thermosetting resin sheet is 1kPa to 20kPa, and the tensile modulus at 150 ℃ after the thermosetting treatment at 150 ℃ for 1 hour is 0.5MPa to 7.0 MPa.
2. The thermosetting resin sheet according to claim 1, wherein the content ratio of the crosslinkable acrylic polymer is 50 parts by mass or more and 100 parts by mass or less with respect to 100 parts by mass of the organic component contained in the die-bonding sheet.
3. The thermosetting resin sheet according to claim 1 or 2, wherein the glass transition temperature Tg after the thermosetting treatment at 150 ℃ for 1 hour is 20 ℃ or more and 100 ℃ or less, and Tan δ at the glass transition temperature Tg is 0.7 or more and 1.5 or less.
4. The thermosetting resin sheet according to claim 1 or 2, wherein the crosslinkable group comprises an epoxy group,
the crosslinkable acrylic polymer has a structural unit of glycidyl (meth) acrylate containing the epoxy group in a molecule,
the content of the structural unit in the crosslinkable acrylic polymer is 5% by mass or more and 50% by mass or less.
5. The thermosetting resin sheet according to claim 1 or 2, wherein the content of the silica filler as the inorganic filler is 40% by mass or less,
the silica filler has a specific surface area of 35m 2 More than 400 m/g 2 The ratio of the carbon atoms to the carbon atoms is less than g.
6. The thermally curable resin sheet according to claim 1 or 2, wherein the thermally curable resin sheet comprises a phenolic resin that undergoes a crosslinking reaction with the crosslinkable group by the thermal curing treatment,
the phenolic resin has a hydroxyl equivalent weight of 160 or more.
7. The heat-curable resin sheet according to claim 1 or 2, comprising 1 or more of the crosslinkable acrylic polymers, at least 1 of the crosslinkable acrylic polymers having a mass average molecular weight of 1 ten thousand or more and 40 ten thousand or less.
8. The thermosetting resin sheet according to claim 1 or 2, which is used in combination with a dicing tape.
9. The thermosetting resin sheet according to claim 1 or 2, wherein the elongation at break at 0 ℃ is 50% or less.
10. The thermosetting resin sheet according to claim 1 or 2, which is used in an SDBG (stealth dicing before grinding) process or a DBG (dicing before grinding) process for manufacturing a semiconductor chip by cleaving a semiconductor wafer.
11. A dicing die-bonding film comprising: a die-bonding sheet comprising the thermosetting resin sheet according to any one of claims 1 to 10, and a dicing tape attached to the die-bonding sheet.
CN202210793685.4A 2021-07-13 2022-07-05 Thermosetting resin sheet and dicing die-bonding film Pending CN115612419A (en)

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