CN115565896A - Packaging method of lead frame type packaging product and product thereof - Google Patents
Packaging method of lead frame type packaging product and product thereof Download PDFInfo
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- CN115565896A CN115565896A CN202211180521.0A CN202211180521A CN115565896A CN 115565896 A CN115565896 A CN 115565896A CN 202211180521 A CN202211180521 A CN 202211180521A CN 115565896 A CN115565896 A CN 115565896A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 56
- 239000000463 material Substances 0.000 claims abstract description 51
- 238000003466 welding Methods 0.000 claims abstract description 48
- 238000009713 electroplating Methods 0.000 claims abstract description 45
- 239000000126 substance Substances 0.000 claims abstract description 16
- 238000007747 plating Methods 0.000 claims description 31
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 27
- 229910052802 copper Inorganic materials 0.000 claims description 23
- 239000010949 copper Substances 0.000 claims description 23
- 238000004140 cleaning Methods 0.000 claims description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 9
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- 239000007788 liquid Substances 0.000 claims description 9
- 239000011135 tin Substances 0.000 claims description 9
- 229910052718 tin Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 7
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims 1
- 238000011179 visual inspection Methods 0.000 abstract description 8
- 238000012858 packaging process Methods 0.000 abstract description 2
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- 238000000926 separation method Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 description 2
- 239000003814 drug Substances 0.000 description 2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention discloses a packaging method of lead frame type packaging products and a product thereof, wherein the method comprises the following steps: firstly, selecting a proper lead frame, communicating and conducting the matched chip and the lead frame, then encapsulating the chip and the lead frame, carrying out pre-electroplating, half-cutting, chemical deburring, deplating, secondary electroplating and secondary cutting on the encapsulated device, and then carrying out local welding to complete the packaging operation of the product. According to the invention, only two times of cutting and two times of electroplating are needed in the packaging process, so that the process flow and the cost are saved, the welding reliability is high, when the device welded on the circuit board is subjected to visual inspection, whether the connection between the device and the circuit board is reliable can be judged directly according to the quantity of the welding material formed on the end surface of the pin terminal, the convenience of the visual inspection is improved, the lead frame type product packaging method is more suitable for packaging lead frame type products, and the lead frame type product packaging method has a wider application prospect.
Description
Technical Field
The invention belongs to the technical field of semiconductor packaging, and particularly relates to a packaging method of a lead frame type packaging product and a lead frame type packaging product.
Background
At present, for lead frame type packaged products, only the bottom surface is in contact with a circuit board to form welding during SMT, the contact area of a pin terminal and the circuit board is small, the welding fastness is insufficient, and the board-level reliability of the products is easy to lose efficacy. In addition, the side pins of the frame type packaging product are all bare copper and are not electroplated, the side surfaces of the pins are easily oxidized, and the problems of difficult tin coating, product insufficient soldering and the like in SMT are easily caused.
At present, as semiconductor devices are increasingly applied to industries such as automobiles, it is necessary to improve the welding reliability of packaged products, and the welding quality needs to be evaluated through visual inspection to ensure that the reliability requirement is met. Therefore, the invention provides a packaging method of a lead frame type packaging product and a product thereof.
Disclosure of Invention
In order to solve the technical problems in the prior art, the present invention provides a method for packaging a lead frame type package product and a product thereof.
In order to achieve the purpose and achieve the technical effect, the invention adopts the technical scheme that:
a packaging method of a lead frame type packaging product comprises the following steps:
firstly, selecting a proper lead frame, communicating and conducting the matched chip and the lead frame, then encapsulating the chip and the lead frame, carrying out pre-electroplating, half-cutting, chemical deburring, deplating, secondary electroplating and secondary cutting on the encapsulated device, and then carrying out local welding to complete the packaging operation of the product.
Further, the method specifically comprises the following steps:
the method comprises the following steps: selecting a lead frame, wherein the lead frame comprises a base island and a pin terminal;
step two: bonding the back surface of the chip and the base island of the lead frame together, electrically connecting a bonding pad of the chip and a pin terminal of the lead frame, and encapsulating the chip and the lead frame;
step three: pre-electroplating the packaged device, protecting the bottom of the lead frame, the pin terminals and all metal positions, and protecting the copper surface;
step four: performing half-cutting on the bottom surface of the device after pre-electroplating to form a groove structure;
step five: carrying out chemical deburring on the semi-cut and separated product, and removing copper burrs caused by cutting; deplating the bottom of the lead frame and the position of the lead terminal which is plated for the first time to remove pre-plating materials, and cleaning;
step six: carrying out secondary electroplating: electroplating the bottom of the lead frame, the lead terminal and the side surface of the lead terminal exposed by half cutting;
step seven: performing secondary cutting from the bottom surface of the lead frame, and cutting and molding a product;
step eight: after the seven steps, steps are formed on the side surfaces of the pin terminals of the lead frame, electroplating is carried out on the steps on the side surfaces of the pin terminals, welding materials can be soaked on the side surfaces of the pin terminals in the welding process, and after welding, welding materials are formed on at least partial areas of the end surfaces of the pin terminals, so that the connection reliability of the pin terminals and a circuit board is improved; and then visually checking the device welded on the circuit board to judge whether the connection between the device and the circuit board is reliable.
Further, in the second step, the back surface of the chip and the base island are bonded together through a polymer bonding material, and the polymer bonding material is a semiconductor bonding material.
Further, in the second step, the bonding pad of the chip and the lead terminal are connected by a wire bonding method, and the bonding material includes a gold wire, an alloy wire or a palladium-plated copper wire.
Further, in the third step, the electroplating material used in the pre-electroplating includes tin, nickel or gold.
The invention also discloses a packaging method of the lead frame type packaging product, which comprises the following steps:
the method comprises the following steps: selecting a lead frame, wherein the lead frame only comprises a pin terminal;
step two: arranging a salient point on the chip, connecting and conducting the salient point and the lead frame, and encapsulating the chip and the lead frame;
step three: pre-electroplating the packaged device, protecting the bottom of the lead frame, the pin terminals and all metal positions, and protecting the copper surface;
step four: performing half-cutting on the bottom surface of the device after pre-electroplating to form a groove structure;
step five: chemical deburring is carried out on the products separated by the half cutting, and copper burrs caused by cutting are removed; deplating the bottom of the lead frame and the position, plated for the first time, on the lead terminal to remove pre-plating materials, and cleaning;
step six: carrying out secondary electroplating: electroplating the bottom of the lead frame, the lead terminal and the side surface of the lead terminal exposed by half cutting;
step seven: performing secondary cutting from the bottom surface of the lead frame, and cutting and molding a product;
step eight: after the seven steps, steps are formed on the side surfaces of the pin terminals of the lead frame, electroplating is carried out on the steps on the side surfaces of the pin terminals, welding materials can be soaked on the side surfaces of the pin terminals in the welding process, and after welding, welding materials are formed on at least partial areas of the end surfaces of the pin terminals, so that the connection reliability of the pin terminals and a circuit board is improved; and then visually checking the device welded on the circuit board to judge whether the connection between the device and the circuit board is reliable.
Further, in the fifth step, chemical liquid is adopted to carry out chemical deburring on the half-cut separated product, wherein the chemical liquid is copper burr cleaning liquid Cu-151A or Cu-151B.
Further, the Cu-151A comprises the following components: the Cu-151B comprises the following components: sodium persulfate and deionized water.
Furthermore, in the sixth step, the thickness of the secondary electroplating is larger than that of the pre-electroplating, and the electroplating material adopted by the secondary electroplating is consistent with the type and the component of the welding material of the whole device on the circuit board.
Further, in the seventh step, the width of the secondary cutting is smaller than that of the half cutting.
The invention also discloses a lead frame type packaging product prepared by the packaging method of the lead frame type packaging product.
Compared with the prior art, the invention has the beneficial effects that:
the invention discloses a packaging method of lead frame type packaging products and a product thereof, wherein the method comprises the following steps: firstly, selecting a proper lead frame, communicating and conducting the matched chip and the lead frame, then encapsulating the chip and the lead frame, carrying out pre-electroplating, half-cutting, chemical deburring, deplating, secondary electroplating and secondary cutting on the encapsulated device, and then carrying out local welding to complete the packaging operation of the product. According to the invention, only two times of cutting and two times of electroplating are needed in the packaging process, so that the process flow and the cost are saved, the welding reliability is high, when the device welded on the circuit board is subjected to visual inspection, whether the connection between the device and the circuit board is reliable can be judged directly according to the quantity of the welding materials formed on the end surfaces of the pin terminals, the convenience of the visual inspection is improved, the packaging method is more suitable for packaging lead frame products, and the packaging method has a wider application prospect.
Drawings
FIG. 1 is a schematic structural diagram of a lead frame according to the present invention; fig. 1a is a schematic structural view of a lead frame according to embodiment 1 of the present invention; fig. 1b is a schematic structural view of a lead frame according to embodiment 2 of the present invention;
fig. 2 is a schematic structural diagram of a packaging method of a lead frame type packaged product in step two according to the present invention; fig. 2a is a schematic structural diagram of a packaging method of a lead frame type packaged product in step two according to embodiment 1 of the present invention; fig. 2b is a schematic structural diagram of a packaging method of a lead frame type packaged product in step two according to embodiment 2 of the present invention;
fig. 3 is a schematic structural diagram of a method for packaging a lead frame type packaged product in step three according to the present invention; fig. 3a is a schematic structural diagram of a method for packaging a lead frame type packaged product according to embodiment 1 in step three; fig. 3b is a schematic structural diagram of a method for packaging a lead frame-like packaged product in step three according to embodiment 2 of the present invention;
fig. 4 is a schematic structural diagram of a method for packaging a lead frame type packaged product in step four according to the present invention;
fig. 5 is a schematic structural diagram of a method for packaging a lead frame type packaged product in step five according to the present invention;
fig. 6 is a schematic structural diagram of a method for packaging a lead frame type packaged product in step six according to the present invention;
fig. 7 is a schematic structural diagram of a method for packaging a lead frame type packaged product in step seven according to the present invention; FIG. 7a is a schematic structural view before the second cutting; FIG. 7b is a schematic diagram of the structure after the second cutting;
fig. 8 is a schematic structural diagram of a method for packaging a lead frame type packaged product in step eight according to the present invention.
Detailed Description
The present invention is described in detail below so that the advantages and features of the present invention can be more easily understood by those skilled in the art, and thus the scope of the present invention can be clearly and clearly defined.
The following presents a simplified summary of one or more aspects in order to provide a basic understanding of such aspects. This summary is not an extensive overview of all contemplated aspects, and is intended to neither identify key or critical elements of all aspects nor delineate the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description that is presented later.
As shown in fig. 1-8, a method for packaging a lead frame type packaged product comprises the following steps:
the method comprises the following steps: selecting a lead frame 10, where the lead frame 10 may include a base island 101 and a pin terminal 102, as shown in fig. 1a, and the lead frame 10 may also include only the pin terminal 102, as shown in fig. 1 b;
step two: for the lead frame 10 comprising the base island 101 and the pin terminal 102, firstly, the back surface of the chip 202 is adhered to the base island 101 of the lead frame 10 by a high molecular adhesive material 201; then, the bonding pad of the chip 202 is connected with the lead terminal 102 of the lead frame 10 by the lead 203 in a lead bonding manner, so as to realize electrical connection, wherein the used bonding material can be a gold wire, an alloy wire or a palladium-plated copper wire and the like; then, encapsulating the chip and the bonding wire by adopting a plastic package process, namely forming a plastic package layer 204 on the surfaces of the chip and the bonding wire, as shown in fig. 2 a;
or, a PAD of the chip is provided with a bump 211, the chip is turned over to connect and conduct the bump 211 and the lead frame 10, and then the chip is encapsulated by adopting a plastic encapsulation process to form a plastic encapsulation layer 204, as shown in fig. 2 b;
step three: pre-plating the encapsulated device to obtain a pre-plating layer 31, wherein the plating material is tin or nickel, gold or the like, the bottom of the lead frame 10, the pin terminal 102 and all metal positions are protected, and the copper surface is protected to prevent corrosion and oxidation, as shown in fig. 3;
step four: for a pre-plated device, the bottom surface of the device faces upward, a cutting jig such as a blade 20 is used for first cutting (mainly adopting UV cutting or automatic cutting), and a cutting path on the bottom surface of the device is subjected to half cutting to form a groove structure 103, wherein the cutting depth is smaller than the thickness of the lead frame 10, as shown in fig. 4;
step five: placing the product subjected to cutting and separation for the first time in a special chemical liquid medicine for treatment, and removing copper burrs caused by cutting for the first time; after removing the copper burrs, deplating (removing pre-plating material) and cleaning the bottom of the leadframe 10 and the first plated position on the lead terminal 102; as shown in fig. 5; wherein the chemical liquid medicine is copper burr cleaning liquid Cu-151A or Cu-151B, and the Cu-151A comprises the following components: methanesulfonic acid, urea and deionized water, wherein the Cu-151B comprises the following components: sodium persulfate and deionized water;
step six: a second plating step of plating (typically tin plating) the bottom of the leadframe 10, the lead terminals 102, and the exposed sides of the lead terminals 102 from the first cutting step to form a protective layer 32 to prevent oxidation of the product, as shown in fig. 6; the thickness of the second electroplating is larger than that of the first electroplating, and the type, the components and the like of the second electroplating material are consistent with those of the welding material of the whole device on the circuit board;
step seven: performing a second cutting (UV cutting or automatic cutting) from the back of the lead frame 10 by using a cutting jig such as a blade 20, and cutting and molding the product, as shown in fig. 7; the width of the second cutting is smaller than that of the first cutting;
step eight: through the seven steps, a step 30 is formed on the side surface of the pin terminal 102 of the lead frame 10, as shown in fig. 8, the step on the side surface of the pin terminal 102 is electroplated with the same material as that for circuit board welding, so that the welding material can be soaked on the side surface of the pin terminal 102 in the welding process, and after welding, the welding material 33 is formed on at least part of the area of the end surface of the pin terminal 102, so that the connection reliability of the pin terminal 102 and the circuit board is improved; on the other hand, when the device soldered on the circuit board is visually inspected, whether the connection between the electronic device and the circuit board is reliable or not can be judged by the amount of the solder formed on the end surface of the pin terminal 102, and the convenience of the visual inspection is improved.
The invention also discloses a lead frame type packaging product packaged by adopting the packaging method of the lead frame type packaging product.
Example 1
As shown in fig. 1a, 2a, 3a and fig. 4-8, a method for packaging a lead frame type package product includes the following steps:
the method comprises the following steps: selecting a lead frame 10, wherein the lead frame 10 comprises a base island 101 and a pin terminal 102, as shown in fig. 1 a;
step two: for the lead frame 10 comprising the base island 101 and the pin terminal 102, firstly, the back surface of the chip 202 is adhered to the base island 101 of the lead frame 10 by a high molecular adhesive material 201; then, the bonding pad of the chip 202 is connected with the lead terminal 102 of the lead frame 10 by the lead 203 in a lead bonding manner to realize electrical connection, wherein the used bonding material can be gold wire, alloy wire or palladium-plated copper wire and the like; then, encapsulating the chip and the bonding wire by adopting a plastic package process, namely forming a plastic package layer 204 on the surfaces of the chip and the bonding wire, as shown in fig. 2 a;
step three: pre-plating the encapsulated device to obtain a pre-plating layer 31, wherein the plating material is tin or nickel, gold, etc., the bottom of the lead frame 10, the pin terminal 102 and all metal positions are protected, and the copper surface is protected to prevent corrosion and oxidation, as shown in fig. 3 a;
step four: for a pre-electroplated device, the bottom surface of the device faces upwards, a cutting jig such as a blade 20 is used for first cutting (UV cutting or automatic cutting), and half cutting is performed on a cutting path on the bottom surface of the device to form a groove structure 103, wherein the cutting depth is smaller than the thickness of the lead frame 10, as shown in fig. 4;
step five: placing a product subjected to cutting and separation for the first time in a copper burr cleaning solution Cu-151A for treatment, and removing copper burrs caused by cutting for the first time, wherein the Cu-151A comprises the following components: methanesulfonic acid, urea and deionized water; after removing the copper burrs, deplating (removing pre-plating material) and cleaning the bottom of the leadframe 10 and the first plated position on the lead terminal 102; as shown in fig. 5;
step six: a second plating step of plating (typically tin plating) the bottom of the leadframe 10, the lead terminals 102, and the first cut exposed sides of the lead terminals 102 to form a protective layer 32 that prevents oxidation of the product, as shown in fig. 6; the thickness of the second electroplating is larger than that of the first electroplating, and the type, the components and the like of the second electroplating material are consistent with those of the welding material of the whole device on the circuit board;
step seven: performing a second cutting (UV cutting or automatic cutting) with a cutting jig such as a blade 20 from the back of the lead frame 10, and cutting and molding the product, as shown in fig. 7; the width of the second cutting is smaller than that of the first cutting;
step eight: through the seven steps, a step 30 is formed on the side surface of the pin terminal 102 of the lead frame 10, as shown in fig. 8, the step on the side surface of the pin terminal 102 is electroplated with the same material as that for circuit board welding, so that the welding material can be soaked on the side surface of the pin terminal 102 in the welding process, and after welding, the welding material 33 is formed on at least part of the area of the end surface of the pin terminal 102, so that the connection reliability of the pin terminal 102 and the circuit board is improved; on the other hand, when the device soldered on the circuit board is visually inspected, whether the connection between the electronic device and the circuit board is reliable or not can be judged by the amount of the solder formed on the end surface of the pin terminal 102, and the convenience of the visual inspection is improved.
Example 2
As shown in fig. 1b, 2b, 3b and fig. 4-8, a method for packaging a lead frame type package product comprises the following steps:
the method comprises the following steps: selecting a lead frame 10, wherein the lead frame 10 only comprises the pin terminals 102, as shown in fig. 1 b;
step two: arranging a bump 211 on a PAD of the chip, turning over the chip 202 to connect and conduct the bump 211 and the lead frame 10, and encapsulating the chip by adopting a plastic encapsulation process to form a plastic encapsulation layer 204, as shown in fig. 2 b;
step three: pre-plating the encapsulated device to obtain a pre-plating layer 31, wherein the plating material is tin or nickel, gold or the like, the bottom of the lead frame 10, the pin terminal 102 and all metal positions are protected, and the copper surface is protected to prevent corrosion and oxidation, as shown in fig. 3 b;
step four: for a pre-plated device, the bottom surface of the device faces upwards, a cutting jig such as a blade 20 is used for first cutting (UV cutting or automatic cutting), and half cutting is performed on a cutting path on the bottom surface of the device to form a groove structure 103, wherein the cutting depth is smaller than the thickness of the lead frame 10, as shown in fig. 4;
step five: placing a product subjected to cutting and separation for the first time in a copper burr cleaning solution Cu-151A for treatment, and removing copper burrs caused by cutting for the first time, wherein the Cu-151A comprises the following components: methanesulfonic acid, urea and deionized water; after removing the copper burrs, deplating (removing pre-plating material) and cleaning the bottom of the leadframe 10 and the first plated position on the lead terminal 102; as shown in fig. 5;
step six: a second plating step of plating (typically tin plating) the bottom of the leadframe 10, the lead terminals 102, and the first cut exposed sides of the lead terminals 102 to form a protective layer 32 that prevents oxidation of the product, as shown in fig. 6; the thickness of the second electroplating is larger than that of the first electroplating, and the type, the components and the like of the second electroplating material are consistent with those of the welding material of the whole device on the circuit board;
step seven: performing a second cutting (UV cutting or automatic cutting) with a cutting jig such as a blade 20 from the back of the lead frame 10, and cutting and molding the product, as shown in fig. 7; the width of the second cutting is smaller than that of the first cutting;
step eight: through the seven steps, a step 30 is formed on the side surface of the pin terminal 102 of the lead frame 10, as shown in fig. 8, the step on the side surface of the pin terminal 102 is plated with the same material as the material for circuit board welding, so that the welding material can be wetted on the side surface of the pin terminal 102 in the welding process, and after welding, the welding material 33 is formed on at least part of the end surface of the pin terminal 102, so that the connection reliability of the pin terminal 102 and the circuit board is improved; on the other hand, when the device soldered on the circuit board is visually inspected, whether the connection between the electronic device and the circuit board is reliable or not can be judged by the amount of the solder formed on the end surface of the pin terminal 102, and the convenience of the visual inspection is improved.
The same as in example 1.
The parts or structures of the invention which are not described in detail can be the same as those in the prior art or the existing products, and are not described in detail herein.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by the present specification, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A packaging method of a lead frame type packaging product is characterized by comprising the following steps:
firstly, selecting a proper lead frame, communicating and conducting the matched chip and the lead frame, then encapsulating the chip and the lead frame, carrying out pre-electroplating, half-cutting, chemical deburring, deplating, secondary electroplating and secondary cutting on the encapsulated device, and then carrying out local welding to complete the packaging operation of the product.
2. The method of claim 1, comprising the steps of:
the method comprises the following steps: selecting a lead frame, wherein the lead frame comprises a base island and a pin terminal;
step two: bonding the back surface of the chip and the base island of the lead frame together, electrically connecting a bonding pad of the chip and a pin terminal of the lead frame, and encapsulating the chip and the lead frame;
step three: pre-electroplating the packaged device, protecting the bottom of the lead frame, the pin terminals and all metal positions, and protecting the copper surface;
step four: performing half-cutting on the bottom surface of the device after pre-electroplating to form a groove structure;
step five: carrying out chemical deburring on the semi-cut and separated product, and removing copper burrs caused by cutting; deplating the bottom of the lead frame and the position, plated for the first time, on the lead terminal to remove pre-plating materials, and cleaning;
step six: carrying out secondary electroplating: electroplating the bottom of the lead frame, the lead terminal and the side surface of the lead terminal exposed by half cutting;
step seven: performing secondary cutting from the bottom surface of the lead frame, and cutting and molding a product;
step eight: after the seven steps, steps are formed on the side surfaces of the pin terminals of the lead frame, electroplating is carried out on the steps on the side surfaces of the pin terminals, welding materials can be soaked on the side surfaces of the pin terminals in the welding process, and after welding, welding materials are formed on at least partial areas of the end surfaces of the pin terminals, so that the connection reliability of the pin terminals and a circuit board is improved; and then visually checking the device welded on the circuit board to judge whether the connection between the device and the circuit board is reliable or not.
3. The method as claimed in claim 2, wherein in the second step, the back surface of the chip is bonded to the base island by a polymer adhesive.
4. The method as claimed in claim 2, wherein in the second step, the bonding pads of the chip and the lead terminals are connected by wire bonding, and the bonding material includes gold wire, alloy wire or palladium-plated copper wire.
5. The method as claimed in claim 2, wherein in the third step, the plating material used in the pre-plating process comprises tin, nickel or gold.
6. The method of claim 1, comprising the steps of:
the method comprises the following steps: selecting a lead frame, wherein the lead frame only comprises a pin terminal;
step two: arranging salient points on the chip, connecting and conducting the salient points and the lead frame, and then encapsulating the chip and the lead frame;
step three: pre-electroplating the packaged device, protecting the bottom of the lead frame, the pin terminals and all metal positions, and protecting the copper surface;
step four: performing half-cutting on the bottom surface of the device subjected to pre-electroplating to form a groove structure;
step five: chemical deburring is carried out on the products separated by the half cutting, and copper burrs caused by cutting are removed; deplating the bottom of the lead frame and the position of the lead terminal which is plated for the first time to remove pre-plating materials, and cleaning;
step six: carrying out secondary electroplating: electroplating the bottom of the lead frame, the lead terminal and the side surface of the lead terminal exposed by half cutting;
step seven: performing secondary cutting from the bottom surface of the lead frame, and cutting and molding a product;
step eight: after the seven steps, steps are formed on the side surfaces of the pin terminals of the lead frame, electroplating is carried out on the steps on the side surfaces of the pin terminals, welding materials can be soaked on the side surfaces of the pin terminals in the welding process, and after welding, welding materials are formed on at least partial areas of the end surfaces of the pin terminals, so that the connection reliability of the pin terminals and a circuit board is improved; and then visually checking the device welded on the circuit board to judge whether the connection between the device and the circuit board is reliable.
7. The method for packaging lead frame type packaged products according to claim 2 or 6, wherein in the fifth step, chemical deburring is performed on the half-cut separated products by using chemical liquid, wherein the chemical liquid is copper burr cleaning liquid Cu-151A or Cu-151B.
8. The method for packaging lead frame type packaging products according to claim 2 or 6, wherein in the sixth step, the thickness of the secondary plating is larger than that of the pre-plating, and the plating material adopted by the secondary plating is consistent with the type and composition of the welding material of the whole device on the circuit board.
9. The method as claimed in claim 2 or 6, wherein in step seven, the width of the secondary cutting is smaller than the width of the half-cutting.
10. A lead frame type packaged product prepared by the method for packaging a lead frame type packaged product according to any one of claims 1 to 9.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211180521.0A CN115565896A (en) | 2022-09-27 | 2022-09-27 | Packaging method of lead frame type packaging product and product thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211180521.0A CN115565896A (en) | 2022-09-27 | 2022-09-27 | Packaging method of lead frame type packaging product and product thereof |
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| CN115565896A true CN115565896A (en) | 2023-01-03 |
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| CN202211180521.0A Pending CN115565896A (en) | 2022-09-27 | 2022-09-27 | Packaging method of lead frame type packaging product and product thereof |
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