CN115527908A

CN115527908A - Packaging auxiliary device

Info

Publication number: CN115527908A
Application number: CN202211121723.8A
Authority: CN
Inventors: 郑嘉瑞; 谭玄; 周宽林; 李虎; 曾胜林; 车二航; 韦文龙; 候本豪; 彭锦青; 周泽畅; 高杰; 苏豪滨
Original assignee: Shenzhen Liande Semiconductor Technology Co ltd
Current assignee: Shenzhen Liande Semiconductor Technology Co ltd
Priority date: 2022-09-15
Filing date: 2022-09-15
Publication date: 2022-12-27

Abstract

The application relates to an encapsulation auxiliary device, which comprises a detection mechanism, a first feeding mechanism and a second feeding mechanism. The detection mechanism is arranged at the detection station. The detection mechanism includes a moving stage configured to be capable of reciprocating in a first direction between a position to be measured, a current measurement position, and a measured position, and a detection component located at the current measurement position. The first feeding mechanism is configured to reciprocate among the feeding station, the assembling station and the position to be measured along a first direction. The second feed mechanism is configured to reciprocate in a first direction between the measured position and the blanking station. The packaging auxiliary device can realize the functions of expanding the crystal ring and loading and optically detecting the chip, realizes the transfer of the product between different stations through the first feeding mechanism and the second feeding mechanism, realizes the movement of the product between different positions of the detection stations through the movable carrying platform, avoids the interference between different mechanisms when realizing the circulation of the product, and is beneficial to the high-efficiency orderly implementation of each process.

Description

Packaging auxiliary device

Technical Field

The present application relates to the field of chip packaging technologies, and in particular, to a packaging assisting device.

Background

In the packaging process of an LED (Light Emitting Diode) chip, a crystal expander needs to be used to uniformly expand and fix a blue film in the crystal expander, so that the chips attached to the surface of the blue film and tightly arranged are pulled apart, which is convenient for the subsequent processes. In subsequent processes, it is often necessary to load the wafer spreader ring onto a custom fixture for loading and handling. In addition, chip optical detection is required to be performed on the wafer expanding ring, so that information such as the position and the angle of the chip can be acquired, and the chip can be screened. In the related art, a plurality of devices with dispersed and single functions are adopted for operation aiming at two auxiliary processes of wafer expanding ring loading and chip optical detection, so that the operation flow is complex and the operation efficiency is low.

Disclosure of Invention

Therefore, there is a need for a package auxiliary device, which can implement the functions of loading the wafer expanding ring and optically detecting the chip, and simplify the operation process and improve the operation efficiency.

The embodiment of the application provides an encapsulation auxiliary device, which is sequentially provided with a feeding station, an assembling station, a detecting station and a discharging station along a first direction; the detection station is divided into a position to be detected, a current detection position and a detected position along the first direction;

the packaging aid includes:

the detection mechanism is arranged at the detection station; the detection mechanism comprises a mobile stage and a detection component positioned at the current position, wherein the mobile stage is configured to reciprocate among the position to be measured, the current position and the measured position along the first direction;

a first feeding mechanism configured to be capable of reciprocating in the first direction between the loading station, the assembling station and the position to be measured; and

a second feed mechanism configured to reciprocate in the first direction between the measured position and the blanking station;

the first feeding mechanism is positioned at the feeding station and used for obtaining a wafer expanding ring; the first feeding mechanism is positioned at the assembling station and used for assembling the obtained wafer expanding ring and a clamp positioned on the assembling station into an assembly body; the first feeding mechanism is positioned at the position to be detected and used for placing the assembly body on the movable carrying platform positioned at the position to be detected;

the second feeding mechanism is located at the measured position, and the second feeding mechanism is used for acquiring the assembly body from the mobile carrier located at the measured position; the second feeding mechanism is located at the blanking station and used for placing the assembly body on the blanking station.

In one embodiment, the first feeding mechanism comprises a first transverse moving member, a first vertical moving member and a first clamping member;

the first transverse moving part is connected with the first vertical moving part, and the first vertical moving part is connected with the first clamping part; the first clamping piece, the wafer expanding ring and the clamp are aligned in a second direction;

the first transverse mover is configured to drive the first vertical mover and the first clamp to reciprocate in the first direction;

the first vertical moving part is configured to drive the first clamping part to reciprocate along a third direction;

the first direction, the second direction and the third direction are perpendicular to each other.

In one embodiment, the packaging assisting device further comprises a first feeding mechanism and a second feeding mechanism;

the first feeding mechanism is arranged at the feeding station and used for acquiring the wafer expanding ring from a first material box and aligning the wafer expanding ring with the first clamping piece in the second direction;

the second feeding mechanism is arranged at the assembling station and used for obtaining the clamp from a second material box and aligning the clamp with the first clamping piece in the second direction.

In one embodiment, the first feeding mechanism comprises two first guiding members, one second clamping member and one first lifting member;

the two first guide pieces are arranged at intervals along the first direction, and each first guide piece is provided with a first sliding groove extending along the second direction;

the second clamping piece is positioned between the two first guide pieces and is configured to clamp the wafer expanding ring in the first magazine and drive the wafer expanding ring to move along the second direction;

the first lifting piece is configured to be capable of driving the first magazine to move along the third direction, so that the wafer expanding rings in the first magazine are aligned with the second clamping piece in the third direction.

In one embodiment, the second feeding mechanism comprises two second guiding members, a third clamping member and a second lifting member;

the two second guide pieces are arranged at intervals along the first direction, and each second guide piece is provided with a second sliding groove extending along the second direction;

the third clamping part is positioned between the two second guide parts and is configured to clamp the clamp in the second magazine and drive the clamp to move along the second direction;

the second lifting piece is configured to be capable of driving the second magazine to move along the third direction, so that the clamp in the second magazine is aligned with the third clamping piece in the third direction.

In one embodiment, the second feeding mechanism comprises a second transverse moving member, a second vertical moving member and a fourth clamping member;

the second transverse moving part is connected with the second vertical moving part, and the second vertical moving part is connected with the fourth clamping part; the fourth clamping piece and the assembly body are aligned in the second direction;

the second transverse mover is configured to drive the second vertical mover and the fourth gripper to reciprocate in the first direction;

the second vertical moving member is configured to drive the fourth clamping member to reciprocate along the third direction;

In one embodiment, the packaging auxiliary device further comprises a blanking mechanism;

the blanking mechanism is arranged at the blanking station and used for moving the assembly body to a third material box along the second direction.

In one embodiment, the blanking mechanism comprises two third guide members, a material pushing member and a third lifting member;

the two third guide pieces are arranged at intervals along the first direction, and each third guide piece is provided with a third sliding groove extending along the second direction;

the material pushing part is positioned between the two third guide parts, and the material pushing part is configured to be capable of supporting the assembly body and pushing the assembly body to enter the vacant position of the third material box along the second direction;

the third lifting piece is configured to be capable of driving the third material box to move along the third direction, so that the vacant position of the third material box is aligned with the assembly body in the third direction.

In one embodiment, the detection assembly is fixed at the current measurement position, and the moving stage is configured to reciprocate along a second direction perpendicular to the first direction.

In one embodiment, the detection mechanism further comprises a vibration-proof table;

the detection assembly and the movable carrying platform are arranged on the shockproof platform.

The packaging auxiliary device at least comprises a detection mechanism, a first feeding mechanism and a second feeding mechanism, wherein the first feeding mechanism transfers a wafer expanding ring from a loading station to an assembling station to be assembled with a clamp, then transfers an assembled assembly body formed by assembling to a movable platform deck positioned at a position to be detected from the assembling station, the movable platform deck transfers the assembly body to the position to be detected and utilizes a detection component to carry out chip optical detection, the detected assembly body is transferred to the position to be detected from the position to be detected, and the second feeding mechanism transfers the assembly body to a blanking station from the movable platform deck positioned at the position to be detected. The packaging auxiliary device can realize the functions of expanding the crystal ring and loading and optically detecting the chip, each station is arranged compactly, the product is transferred between different stations through the first feeding mechanism and the second feeding mechanism, the product is moved between different positions of the detection station through the movable carrying platform, interference between different mechanisms is avoided while product circulation is realized, high-efficiency and orderly proceeding of each process is facilitated, and therefore the operation flow is simplified and the operation efficiency is improved.

Drawings

FIG. 1 is a schematic diagram of a package aid according to an embodiment of the present disclosure;

FIG. 2 is a product flow diagram of a package aid according to an embodiment of the present application;

FIG. 3 is a schematic structural diagram of a detecting mechanism according to an embodiment of the present disclosure;

FIG. 4 is a schematic structural diagram of a first feeding mechanism according to an embodiment of the present disclosure;

FIG. 5 is a schematic diagram of a portion of a first loading mechanism according to an embodiment of the present disclosure;

FIG. 6 is a schematic diagram of a portion of a second feeding mechanism in an embodiment of the present application;

FIG. 7 is a schematic structural diagram of a second feeding mechanism according to an embodiment of the present application;

FIG. 8 is a schematic view of a part of a blanking mechanism according to an embodiment of the present disclosure;

fig. 9 is a schematic structural diagram of another part of the blanking mechanism in an embodiment of the present application.

Description of reference numerals:

100. packaging the auxiliary device;

A. a feeding station; B. assembling stations; C. detecting a station; c1, a position to be detected; c2, current position measurement; c3, measured position; D. a blanking station;

110. a frame;

120. a detection mechanism; 121. a detection component; 122. moving the carrier; 123. a shockproof platform; 124. a compression member;

130. a first feeding mechanism; 131. a first lateral motion member; 132. a first vertically moving member; 133. a first clamping member;

140. a second feeding mechanism; 141. a second lateral motion member; 142. a second vertically moving member; 143. a fourth clamping member;

150. a first feeding mechanism; 151. a first guide member; 1511. a first chute; 152. a second clamping member; 153. a first lifting member; 154. a first longitudinally moving member; 155. a first connecting plate; 156. a first base plate;

160. a second feeding mechanism; 161. a second guide member; 1611. a second chute; 162. a third clamping member; 163. a second lifting member; 164. a second longitudinally moving member; 165. a second connecting plate; 166. a second base plate;

170. a blanking mechanism; 171. a third guide member; 1711. a third chute; 172. pushing the material piece; 173. a third lifting member; 174. a third longitudinally moving member; 175. a third connecting plate; 176. a third base plate; 177. a lifting drive member;

180. a positioning mechanism;

10. an assembly body; 11. expanding a wafer ring; 12. a clamp;

20. a third magazine.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of embodiments in many different forms than those described herein and that modifications may be made by one skilled in the art without departing from the spirit and scope of the application and it is therefore not intended to be limited to the specific embodiments disclosed below.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and encompass, for example, both fixed and removable connections or integral parts thereof; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be interconnected within two elements or in a relationship where two elements interact with each other unless otherwise specifically limited. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

FIG. 1 is a schematic diagram of a package aid according to an embodiment of the present disclosure; FIG. 2 shows a product flow diagram of a package aid in an embodiment of the present application; fig. 3 shows a schematic structural diagram of a detection mechanism in an embodiment of the present application.

In some embodiments, referring to fig. 1 to 3, the present application provides a packaging assisting device 100, where the packaging assisting device 100 is provided with a feeding station a, an assembling station B, a detecting station C, and a discharging station D in sequence along a first direction (x direction in the figure). The detection station C is divided into a position to be detected C1, a current position C2 and a measured position C3 along the first direction. Specifically, the auxiliary sealing device 100 includes a frame 110, and the above-mentioned stations and the mechanisms mentioned later are disposed on the frame 110.

The packaging aid 100 includes a detection mechanism 120, a first feeding mechanism 130, and a second feeding mechanism 140. The detection mechanism 120 is disposed at the detection station C. The detection mechanism 120 includes a moving stage 122 and a detection unit 121 located at the current position C2, and the moving stage 122 is configured to be capable of reciprocating in the first direction between the position to be measured C1, the current position C2, and the measured position C3. The first feeding mechanism 130 is configured to be capable of reciprocating in a first direction between the loading station a, the assembling station B, and the position-to-be-measured C1. The second feed mechanism 140 is configured to reciprocate in a first direction between the measured position C3 and the blanking station D.

The first feeding mechanism 130 is located at the feeding station a, and the first feeding mechanism 130 is used for obtaining the wafer expanding ring 11; the first feeding mechanism 130 is located at the assembling station B, and the first feeding mechanism 130 is used for assembling the obtained wafer expanding ring 11 and the clamp 12 located at the assembling station B into the assembly body 10; the first feeding mechanism 130 is located at the position to be measured C1, and the first feeding mechanism 130 is configured to place the assembly body 10 on the moving stage 122 located at the position to be measured C1. Second feeding mechanism 140 is located at measured position C3, and second feeding mechanism 140 is configured to obtain assembly body 10 from moving stage 122 located at measured position C3; the second feeding mechanism 140 is located at the blanking station D, and the second feeding mechanism 140 is used for placing the assembly 10 on the blanking station D.

The detection assembly 121 is used for performing optical detection on the chip, and comprises a vision camera and a light source module, so that the position and angle information of the chip can be acquired, the defect of the chip can be expanded and detected, and the chip can be conveniently screened. The first feed mechanism 130 and the second feed mechanism 140 are capable of taking products at a first direction forward sequence station and placing the products at a subsequent sequence station. Alternatively, the first feeding mechanism 130 and the second feeding mechanism 140 may employ a robot arm. Specifically, the fixture 12 is provided with a mounting hole for accommodating the wafer expanding ring 11, and the first feeding mechanism 130 places the wafer expanding ring 11 in the mounting hole of the fixture 12 to complete the assembly of the wafer expanding ring 11 and the fixture 12.

The workflow of the packaging aid 100 is as follows: the first feeding mechanism 130 transfers the die-expanding ring 11 from the loading station a to the assembling station B to be assembled with the clamp 12, and then transfers the assembled assembly 10 from the assembling station B to the moving stage 122 located at the position C1 to be measured, the moving stage 122 transfers the assembly 10 to the current measurement position C2 to perform chip optical detection by using the detection assembly 121, and transfers the detected assembly 10 from the current measurement position C2 to the measured position C3, and the second feeding mechanism 140 transfers the assembly 10 from the moving stage 122 located at the measured position C3 to the unloading station D. The packaging auxiliary device 100 can realize the functions of wafer ring expanding loading and chip optical detection, all stations are arranged compactly, the transfer of products among different stations is realized through the first feeding mechanism 130 and the second feeding mechanism 140, the movement of the products among different positions of the detection station C is realized through the movable carrying platform 122, the interference among different mechanisms is avoided while the product circulation is realized, the efficient and orderly proceeding of all processes is facilitated, the operation flow is simplified, and the operation efficiency is improved.

Fig. 4 shows a schematic structural diagram of the first feeding mechanism in an embodiment of the present application.

In some embodiments, referring to fig. 1, 2 and 4, the first feed mechanism 130 includes a first lateral motion member 131, a first vertical motion member 132, and a first clamping member 133. The first lateral motion member 131 is connected to the first vertical motion member 132, and the first vertical motion member 132 is connected to the first clamping member 133. The first clamping member 133, the wafer expanding ring 11 and the clamp 12 are aligned in the second direction (y direction in the figure). The first lateral moving member 131 is configured to drive the first vertical moving member 132 and the first clamping member 133 to reciprocate in a first direction (x direction in the drawing). The first vertical moving member 132 is configured to drive the first clamping member 133 to reciprocate in the third direction (z direction in the drawing). The first direction, the second direction and the third direction are perpendicular to each other.

The placing position of the wafer expanding ring 11 on the feeding station a and the placing position of the clamp 12 on the assembling station B are adjusted mechanically or manually, so that the wafer expanding ring 11 and the clamp 12 are aligned with the first clamping piece 133 in the second direction. Therefore, the first feeding mechanism 130 can accurately pick and place the wafer expanding ring 11, the clamp 12 and the assembly body 10 formed by assembling the wafer expanding ring and the clamp only by configuring the moving automation degrees in the first direction and the third direction, which is helpful for reducing the positioning difficulty and simplifying the mechanical structure. Alternatively, the first lateral moving member 131 and the first vertical moving member 132 may employ a linear transmission mechanism such as an electric push rod, an electric cylinder, a linear motor, a rack and pinion, and the first clamping member 133 may employ an electric clamping jaw or a pneumatic clamping jaw. Further, the first clamping member 133 may adopt a centering clamping structure to improve the precision of taking and placing.

In particular, the first direction, the second direction and the third direction in the present application may correspond to a transverse direction, a longitudinal direction and a vertical direction in sequence.

In some embodiments, with continued reference to fig. 1 and 2, the packaging aid 100 further comprises a first feed mechanism 150 and a second feed mechanism 160. The first feeding mechanism 150 is disposed at the feeding station a, and is configured to take the wafer expansion ring 11 from a first magazine (not shown) and align the wafer expansion ring 11 with the first clamping member 133 in the second direction. The second feeding mechanism 160 is disposed at the assembling station B, and is configured to take the jig 12 from a second magazine (not shown) and align the jig 12 with the first clamping member 133 in the second direction. It can be understood that a first magazine is located at the loading station a, and a plurality of wafer expansion rings 11 are mounted in the first magazine. The second magazine is located at assembly station B and contains a plurality of grippers 12. Like this, acquire the brilliant ring 11 that expands in the first magazine and will expand brilliant ring 11 and place in the position of counterpointing with first holder 133 in the second direction through first feed mechanism 150, acquire anchor clamps 12 in the second magazine and place anchor clamps 12 in the position of counterpointing with first holder 133 in the second direction through second feed mechanism 160, can reduce artifical participation, improve encapsulation auxiliary device 100's degree of automation to improve the operating efficiency.

FIG. 5 is a schematic view showing a partial structure of a first feed mechanism in an embodiment of the present application; fig. 6 is a schematic diagram showing a structure of a part of the second feed mechanism in an embodiment of the present application.

In some embodiments, referring to fig. 2 and 5, the first feeding mechanism 150 includes two first guides 151, one second clamping member 152, and one first lifting member 153. The two first guide members 151 are arranged at intervals along the first direction, and each first guide member 151 is provided with a first sliding groove 1511 extending along the second direction. The second clamping member 152 is located between the two first guiding members 151, and the second clamping member 152 is configured to clamp the wafer expanding rings 11 in the first magazine and drive the wafer expanding rings 11 to move along the second direction. The first lifting member 153 is configured to drive the first magazine to move along the third direction, so that the wafer expanding rings 11 in the first magazine are aligned with the second clamping member 152 in the third direction.

Two first guides 151 can support expand brilliant ring 11 in the third direction to expanding brilliant ring 11 and leading in the removal of second direction, under the support of lasting of first guide 151 and guide effect, second holder 152 only need apply traction force and less clamping-force to expanding brilliant ring 11, can realize expanding brilliant ring 11's stable transfer, avoid too big clamping-force to cause the damage to expanding brilliant ring 11. The plurality of wafer expansion rings 11 are stacked in the first magazine along the third direction, and the first lifter 153 is used for realizing the relative movement of the first magazine and the second clamping member 152 in the third direction, so that the positioning difficulty is reduced, and the mechanical structure is simplified. Alternatively, the first magazine may be a basket magazine and the second clamp 152 may be an electric or pneumatic clamp.

In the embodiment shown in fig. 5, the first feeding mechanism 150 further includes a first longitudinal moving member 154, the first longitudinal moving member 154 is connected to the second clamping member 152, and the first longitudinal moving member 154 is configured to drive the second clamping member 152 to reciprocate along the second direction, so that the second clamping member 152 drives the wafer expanding ring 11 to move along the second direction. Alternatively, the first longitudinal moving member 154 may employ a linear transmission mechanism such as an electric push rod, an electric cylinder, a linear motor, a rack and pinion, and the like.

In some embodiments, referring to fig. 2 and 6, the second feeding mechanism 160 includes two second guides 161, one third clamping member 162, and one second lifter 163. Two second guiding members 161 are arranged at intervals along the first direction, and each second guiding member 161 is provided with a second sliding slot 1611 extending along the second direction. The third clamping member 162 is located between the two second guiding members 161, and the third clamping member 162 is configured to clamp the clamp 12 in the second magazine and move the clamp 12 in the second direction. The second lifter 163 is configured to bring the second magazine to move along the third direction, so that the clamp 12 in the second magazine is aligned with the third clamping member 162 in the third direction.

Two second guide 161 can support anchor clamps 12 in the third direction to guide anchor clamps 12 in the removal of second direction, under the continuous support and the guide effect of second guide 161, third holder 162 only need exert traction force and less clamping-force to anchor clamps 12, can realize the stable transfer of anchor clamps 12, avoid too big clamping-force to cause the damage to anchor clamps 12. The plurality of clamps 12 are stacked in the second magazine along the third direction, and the second lifter 163 is used to realize the relative movement between the second magazine and the third clamping member 162 in the third direction, which helps to reduce the positioning difficulty and simplify the mechanical structure. Alternatively, the second magazine may be a basket magazine and the third clamp 162 may be an electric clamp or a pneumatic clamp.

In the embodiment shown in fig. 6, the second feeding mechanism 160 further includes a second longitudinal moving member 164, the second longitudinal moving member 164 is connected to the third clamping member 162, and the second longitudinal moving member 164 is configured to drive the third clamping member 162 to reciprocate along the second direction, so that the third clamping member 162 drives the clamp 12 to move along the second direction. Alternatively, the second longitudinal moving member 164 may employ a linear transmission mechanism such as an electric push rod, an electric cylinder, a linear motor, a rack and pinion, and the like.

It should be noted that, in some embodiments, the first feeding mechanism 150 and the second feeding mechanism 160 may adopt similar mechanical structures (the details may be different) as in the illustrated embodiment, so as to facilitate manufacturing and achieve synchronous control. Of course, in other embodiments, the first feeding mechanism 150 and the second feeding mechanism 160 may also adopt different mechanical mechanisms, which is not limited in this application.

In some embodiments, referring to fig. 5 and 6, the first feeding mechanism 150 further includes two first connecting plates 155 and a first base plate 156, each of the first guiding members 151 is connected to the first base plate 156 by one first connecting plate 155, and at least one first connecting plate 155 is slidably connected to the first base plate 156 in the first direction. The second feeding mechanism 160 further includes two second connection plates 165 and a second base plate 166, each of the second guide members 161 is connected to the second base plate 166 by one of the second connection plates 165, and at least one of the second connection plates 165 is slidably connected to the second base plate 166 in the first direction. In this way, the distance between the two first guiding elements 151 in the first direction can be adjusted by sliding the at least one first connecting plate 155 relative to the first base plate 156, and the distance between the two second guiding elements 161 in the first direction can be adjusted by sliding the at least one second connecting plate 165 relative to the second base plate 166, so as to adapt to the wafer expanding rings 11 and the jigs 12 with different dimensions, which helps to improve the applicability of the packaging assisting device 100.

Fig. 7 shows a schematic structural diagram of the second feeding mechanism in an embodiment of the present application.

In some embodiments, referring to fig. 1, 2 and 7, the second feed mechanism 140 includes a second lateral motion member 141, a second vertical motion member 142 and a fourth clamping member 143. The second lateral motion member 141 is connected to the second vertical motion member 142, and the second vertical motion member 142 is connected to the fourth clamping member 143. The fourth clamping member 143 is aligned with the assembly 10 (y direction in the figure) in the second direction. The second lateral moving member 141 is configured to be able to drive the second vertical moving member 142 and the fourth clamping member 143 to reciprocate in the first direction (x direction in the drawing). The second vertical mover 142 is configured to drive the fourth gripper 143 to reciprocate in the third direction (z direction in the drawing). The first direction, the second direction and the third direction are perpendicular to each other.

By adjusting the placement position of the assembly 10 on the moving stage 122 or by the movement of the moving stage 122 itself, the assembly 10 on the moving stage 122 is aligned with the fourth clamper 143 in the second direction. Thus, the second feeding mechanism 140 can realize accurate pick-and-place of the assembly body 10 only by configuring the moving automation degree in the first direction and the third direction, which is helpful to reduce the positioning difficulty and simplify the mechanical structure. Alternatively, the second lateral moving member 141 and the second vertical moving member 142 may employ a linear transmission mechanism such as an electric push rod, an electric cylinder, a linear motor, a rack and pinion, and the fourth clamping member 143 may employ an electric clamping jaw or a pneumatic clamping jaw. Further, the fourth clamping member 143 may adopt a centering clamping structure to improve the precision of taking and placing.

It should be noted that, in some embodiments, the first feeding mechanism 130 and the second feeding mechanism 140 may adopt similar mechanical structures (the detail parts may be different) as in the illustrated embodiment, so as to facilitate the manufacturing and realize synchronous control. Of course, in other embodiments, the first feeding mechanism 130 and the second feeding mechanism 140 may also adopt different mechanical mechanisms, which is not limited in this application.

In some embodiments, with continued reference to fig. 1 and 2, the packaging aid 100 further comprises a blanking mechanism 170. The blanking mechanism 170 is disposed at the blanking station D, and is configured to move the assemblies 10 into the third magazine 20 along the second direction. It will be appreciated that a third magazine 20 is located at the blanking station D, the third magazine 20 being provided with a plurality of empty spaces for placing the assemblies 10. In this way, the assembly 10 is transferred from the position aligned with the second feeding mechanism 140 in the second direction to the third magazine 20 by the blanking mechanism 170, so that the degree of manual involvement can be reduced, the degree of automation of the auxiliary sealing device 100 can be improved, and the work efficiency can be improved.

Fig. 8 shows a schematic view of a part of the structure of the blanking mechanism in an embodiment of the present application.

In some embodiments, referring to fig. 2 and 8, the blanking mechanism 170 includes two third guides 171, one pusher 172, and one third lifter 173. The two third guide members 171 are spaced apart from each other in the first direction, and each third guide member 171 is provided with a third sliding slot 1711 extending in the second direction. The pushing member 172 is located between the two third guiding members 171, and the pushing member 172 is configured to be capable of supporting the assembly 10 and pushing the assembly 10 into the empty position of the third magazine 20 along the second direction. Third lifter 173 is configured to be able to move third magazine 20 in a third direction so that the empty space of third magazine 20 is aligned with assembly 10 in the third direction.

Two third guiding parts 171 can support assembly body 10 in the third direction to the removal of assembly body 10 in the second direction leads, and under the support and the guide effect that last of third guiding part 171, the material returned piece only need exert thrust to assembly body 10, can realize the stable transfer of assembly body 10, need not to carry out the centre gripping to assembly body 10, and simple structure has just reduced the energy consumption. A plurality of empty spaces for accommodating assembly 10 are stacked in third magazine 20 along a third direction, and third lifter 173 is used to realize relative movement between third magazine 20 and assembly 10 in the third direction, which helps to reduce positioning difficulty and simplify mechanical structure. Alternatively, the third magazine 20 may employ a basket magazine.

In the embodiment shown in fig. 8, the blanking mechanism 170 further includes a third longitudinal moving member 174, the third longitudinal moving member 174 is connected to the pushing member 172, and the third longitudinal moving member 174 is configured to drive the pushing member 172 to reciprocate along the second direction, so that the pushing member 172 pushes the assembly body 10 to move along the second direction. Alternatively, the third longitudinal moving member 174 may employ a linear transmission mechanism such as an electric push rod, an electric cylinder, a linear motor, a rack and pinion, and the like.

In some embodiments, the blanking mechanism 170 further includes two third connecting plates 175 and a third bottom plate 176, each third guiding member 171 is connected to the third bottom plate 176 by a third connecting plate 175, and at least one third connecting plate 175 is slidably connected to the third bottom plate 176 along the first direction. In this way, by sliding the at least one third connecting plate 175 relative to the third base plate 176, the distance between the two third guiding members 171 in the first direction can be adjusted, so as to adapt to assemblies 10 with different sizes, which helps to improve the applicability of the auxiliary packaging device 100.

Fig. 9 shows a schematic structural diagram of another part of the blanking mechanism in an embodiment of the present application.

In some embodiments, referring to fig. 9, the blanking mechanism 170 further includes a lifting driving member 177, the lifting driving member 177 is connected to the third lifting member 173, and the lifting driving member 177 is configured to drive the third lifting member 173 to reciprocate along the third direction, so that the third lifting member 173 drives the third magazine 20 to move along the third direction. Alternatively, the lifting driving member 177 may employ a linear transmission mechanism such as an electric push rod, an electric cylinder, a linear motor, a rack and pinion, and the third lifting member 173 is configured as a supporting plate.

It can be understood that the first lifting member 153 of the first feeding mechanism 150, the second lifting member 163 of the second feeding mechanism 160, and the third lifting member 173 of the blanking mechanism 170 may adopt similar structures and driving manners, and will not be described herein.

In some embodiments, referring to fig. 2 and 3, the detecting component 121 is fixed at the position C2, and the moving stage 122 is configured to reciprocate along a second direction (y direction in the figure) perpendicular to the first direction (x direction in the figure). Thus, during optical inspection of the chip, the vision camera is not moved, and the movable stage 122 drives the assembly body 10 to move along the first direction and the second direction, so that the inspection area can cover the whole wafer chip area. The detection form avoids the visual system error caused by the movement of the camera, and has higher detection precision. In addition, by configuring the movable stage 122 to be capable of reciprocating along the second direction, the movable stage 122 can drive the assembly body 10 to align with the fourth clamping member 143 of the second feeding mechanism 140 in the second direction, which is helpful to reduce the positioning difficulty and simplify the mechanical structure.

In some embodiments, the detection mechanism 120 further includes an anti-vibration table 123, and the detection assembly 121 and the moving stage 122 are disposed on the anti-vibration table 123, so as to avoid the influence of vibration on the detection accuracy of the apparatus. Alternatively, the vibration prevention stage 123 may employ a marble platform.

In some embodiments, the detecting mechanism 120 further includes a pressing member 124, and the pressing member 124 is configured to clamp and fix the assembly 10 on the movable stage 122, so as to prevent the assembly 10 from sliding relative to the movable stage 122 when the movable stage 122 moves, thereby further ensuring the detection accuracy. It is understood that the clamping member 124 should not block the wafer chip area when clamping the assembly 10. Optionally, the pressing member 124 is provided with a clearance hole for exposing the wafer chip area.

In some embodiments, referring to fig. 1, the auxiliary packaging device 100 further comprises a positioning mechanism 180 disposed at the loading station a. The positioning mechanism 180 is used for acquiring the position information of the wafer expanding ring 11 in the first direction, and the first transverse moving member 131 in the first feeding mechanism 130 enables the first clamping member 133 to be aligned with the wafer expanding ring 11 in the first direction in response to the position information fed back by the positioning mechanism 180. Alternatively, the positioning mechanism 180 may employ a positioning camera.

Specifically, in the illustrated embodiment, when the dimensions of the wafer expansion ring 11 and the jig 12 are fixed, the first feeding mechanism 150 and the second feeding mechanism 160 can ensure that the placing positions of the wafer expansion ring 11 and the jig 12 on the feeding station a and the assembling station B are fixed, and after the first clamping member 133 is aligned with the wafer expansion ring 11 in the first direction by the positioning mechanism 180, the first transverse moving member 131 drives the first clamping member 133 to move a fixed distance in the first direction, so that the first clamping member 133 is aligned with the jig 12 in the first direction. Therefore, there is no need to provide a positioning mechanism at the assembly station B.

In summary, referring to fig. 1 and fig. 2, the auxiliary packaging device 100 according to the embodiment of the present application includes a frame 110, a detecting mechanism 120, a first feeding mechanism 130, a second feeding mechanism 140, a first loading mechanism 150, a second loading mechanism 160, a discharging mechanism 170, and a positioning mechanism 180. The workflow of the packaging aid 100 is as follows: the first feeding mechanism 150 obtains the wafer expansion ring 11 from the first magazine and aligns the wafer expansion ring 11 with the first clamping member 133 in the second direction, and the second feeding mechanism 160 obtains the jig 12 from the second magazine and aligns the jig 12 with the first clamping member 133 in the second direction. The first traverse member 131, in response to the position information fed back by the positioning mechanism 180, aligns the first clamping member 133 with the wafer expansion ring 11 in the first direction, the first feeding mechanism 130 transfers the wafer expansion ring 11 from the loading station a to the assembling station B to be assembled with the clamp 12, transfers the assembled assembly 10 from the assembling station B to the moving stage 122 located at the position to be measured C1, moves the moving stage 122 to transfer the assembly 10 to the position to be measured C2, performs chip optical detection by using the detection component 121, and transfers the detected assembly 10 from the position to be measured C2 to the position to be measured C3. Second feed mechanism 140 transfers assemblies 10 from moving stage 122 at measured position C3 to blanking station D. The blanking station D moves the assemblies 10 in the second direction into the third magazine 20.

The packaging auxiliary device 100 can realize the functions of wafer ring expanding loading and chip optical detection, all stations are arranged compactly, the transfer of products among different stations is realized through the first feeding mechanism 130 and the second feeding mechanism 140, the movement of the products among different positions of the detection station C is realized through the movable carrying platform 122, the interference among different mechanisms is avoided while the product circulation is realized, the efficient and orderly proceeding of all processes is facilitated, the operation flow is simplified, and the operation efficiency is improved.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of this patent shall be subject to the appended claims.

Claims

1. The packaging auxiliary device is characterized in that a loading station, an assembling station, a detecting station and a blanking station are sequentially arranged along a first direction; the detection station is divided into a position to be detected, a current detection position and a detected position along the first direction;

the packaging aid includes:

2. The packaging aid of claim 1, wherein the first feed mechanism comprises a first laterally moving member, a first vertically moving member, and a first clamping member;

3. The packaging aid of claim 2, further comprising a first feeding mechanism and a second feeding mechanism;

4. The packaging aid of claim 3, wherein the first feed mechanism comprises two first guides, a second clamp, and a first lifter;

5. The packaging aid of claim 3 wherein the second feed mechanism comprises two second guides, a third clamp, and a second lifter;

6. The packaging aid of any one of claims 1-5, wherein the second feed mechanism comprises a second laterally moving member, a second vertically moving member, and a fourth clamping member;

the first direction, the second direction, and the third direction are perpendicular to each other.

7. The packaging aid of claim 6, further comprising a blanking mechanism;

8. The packaging aid of claim 7, wherein the blanking mechanism comprises two third guides, a pusher and a third lifter;

9. The packaging aid of any one of claims 1-5, wherein the detection assembly is fixed in the current measurement position, and the mobile stage is configured to be capable of reciprocating in a second direction perpendicular to the first direction.

10. The packaging aid of any one of claims 1-5, wherein the detection mechanism further comprises a shock mount;